METHOD FOR MANUFACTURING A CHIP CARD BODY

Description

[0001] The present invention relates to a method for manufacturing a chip card body with a metallic core layer for a contactless or dual-interface chip card and to a method for manufacturing the chip card.

[0002] A contactless or dual-interface smart card comprises a card body, a chip, and an antenna coil coupled to the chip. The antenna coil is located either in a chip module that contains the chip or in the card body itself. A conventional card body is made of thermoplastic material such as PVC, PET, PETG, or ABS, which, however, are sometimes prone to cracking and breakage. For example, a smart card can break due to twisting while in a trouser pocket.

[0003] Compared to conventional card bodies, a card body with a metallic core layer has a longer lifespan due to its relatively greater resistance to torsion. Furthermore, the metallic chip card feels high-quality and robust in terms of its weight. However, integrating the metallic core layer into the card body significantly reduces the contactless functionality of the chip card, thus decreasing the switching distance between the chip card and a card reader. This is because the metal material generally shields electromagnetic waves. The energy transmitted from the card reader to the chip card via electromagnetic waves is partially absorbed and reflected by the metallic core layer.Especially when the chip card is in the changing magnetic field of the card reader, electrons in the metallic core layer move around the chip module in a flow direction, creating an eddy current. This eddy current results in the loss of the transferred energy as heat, a process also known as "absorption," and simultaneously generates an intrinsic magnetic field that opposes changes in the changing magnetic field it created, a process also known as "reflection." Since the eddy current more or less results in the loss of the transferred energy, the remaining energy that the chip module can actually use for contactless communication is correspondingly less than the transferred energy. This means that the switching distance must be reduced due to the eddy current.If the remaining energy is less than a threshold value, for example 2 V, which is crucial for the switching of the chip module, the chip card will not work.

[0004] To counteract the attenuation effect of the metallic core layer, various manufacturing processes are known. US 2016 / 0110639 A1 discloses a chip card comprising, on the one hand, a chip module with a chip and a module antenna, and on the other hand, a metallic card core layer with a cavity for receiving the chip module and a slot. The slot overlaps the module antenna and extends from the chip module to an outer edge of the metallic card core layer. It serves, in effect, to reduce the aforementioned attenuation effect and increase the reduced switching distance by interrupting the flow of electrons in the metallic card core layer. Since the originally closed eddy current circuit around the chip module is disrupted and no eddy current can be generated in the vicinity of the chip module, the energy available for the functionality of the chip module is correspondingly increased.On the one hand, the slot should be as wide as possible to effectively prevent eddy currents, and on the other hand, it should be as narrow as possible to ensure the mechanical stability of the chip card. The slot can be cut using a laser or chemically etched, for example. To further enhance the chip card's stability, the slot can be at least partially filled with a non-conductive polymer, epoxy resin, or reinforcing epoxy resin. It is crucial that no metal remains in the slot during manufacturing. Any remaining metal could cause a partial or even a complete short circuit in the slot's opening, thus reducing its effectiveness.

[0005] The metallic core layer of the card is regularly laminated with at least one additional cover layer. During lamination, impurities or a partial or even complete short circuit may occur in the slot. For example, due to the high pressure, a previously clean and thin slot can be compressed by distortion and create a contact. Such chip cards are then non-functional. However, because of the cover layer, the slot is no longer accessible for inspection.

[0006] Currently, a process for manufacturing chip card bodies with metallic core layers for contactless or dual-interface chip cards is carried out as follows, for example. First, a multi-layer metallic sheet is prepared for a large number of metallic core layers. A corresponding number of cavities for fixing a corresponding number of chip modules and a corresponding number of slots are created in the prepared multi-layer metallic sheet. The multi-layer metallic sheet can be laminated with at least one cover layer. Finally, the corresponding number of metallic core layers are cut out from the metallic and, if applicable, laminated multi-layer multi-layer sheet.

[0007] Other methods for manufacturing a chip card body are known by way of example from US 2019 / 384261 A1 or US 2017 / 308785 A1.

[0008] Punching out the chip card body from the multi-use sheet becomes difficult if the chip card body includes a metallic core layer thicker than 0.4 mm. This means that a hybrid chip card body, a multi-layer chip card body with a metallic core layer thicker than 0.4 mm, or a single-layer metallic chip card body must be milled from the metallic multi-use sheet. However, during milling, a partial or even complete short circuit can occur in the slot due to metal shavings. This can also lead to edge chipping, detachment of the metallic and possibly laminated multi-use sheet, burning of at least one cover layer, and so on. This can result in chip card bodies having to be discarded, which increases the production costs of such chip cards.

[0009] The object of the present invention is therefore to reduce the manufacturing costs of contactless or dual-interface chip cards.

[0010] This problem is solved by a method for manufacturing a chip card body with a metallic core layer and a corresponding method for manufacturing a chip card with the features of the independent claims. Embodiments and further developments of the invention are specified in the dependent claims.

[0011] A first aspect of the invention relates to the method for manufacturing a metallic chip card body. According to this first aspect of the invention, the method begins with providing the metallic multi-utility sheet for a plurality of metallic core layers. A corresponding plurality of cavities for fixing a corresponding plurality of chip modules therein is produced before or preferably simultaneously with the removal of the plurality of metallic core layers from the provided metallic multi-utility sheet. Subsequently, at least one slot is produced in one of the plurality of metallic core layers removed from the metallic multi-utility sheet.

[0012] A key aspect of the present invention is therefore to create the at least one slot not directly in the metallic multi-sheet, but only in the metallic core layer removed from the metallic multi-sheet. Even if the metallic core layer, with a thickness exceeding 0.4 mm, has to be milled out of the metallic multi-sheet, no metal chips form in the slot, since the slot is only created after milling, thus completely eliminating the possibility of metal chips remaining after milling. Consequently, there is less waste, and the manufacturing costs are reduced accordingly.

[0013] The procedure according to the first aspect has the further advantage over the current procedure mentioned above that a necessary control step to remove the metal shavings in the slot can be saved.

[0014] The cavities, the at least one slot, and the metallic core layers can each be produced by laser or waterjet cutting, preferably in a single laser operation, to reduce manufacturing time. Alternatively, the cavities and the metallic core layers can be punched out, preferably simultaneously in a single punching operation. This allows the use of existing punching machines, whose punching heads only need to be adapted so that the cavities and the metallic core layers can be punched out simultaneously. Alternatively, the at least one slot can also be chemically etched.

[0015] The at least one slot can extend from the cavity to an edge of the metallic core layer separated from the multi-utility metallic sheet. It should be produced with a width between 30 µm and 100 µm, preferably between 50 µm and 80 µm, to achieve an optimal compromise between effectively preventing eddy currents in the vicinity of the cavity and maintaining the mechanical stability of the chip card body. Subsequently, the at least one slot can be at least partially filled with an electrically non-conductive material, e.g., polymer, epoxy resin, or reinforcing epoxy resin, to enhance the mechanical stability of the metallic chip card body.

[0016] A second aspect of the invention relates to the method for manufacturing a hybrid chip card body comprising the metallic core layer and at least one cover layer. According to this second aspect of the invention, the method begins with providing the at least one cover layer, which can be, for example, a transparent cover layer and / or a layer with a printed pattern and / or any other layer. It can, in particular, incorporate security features. The at least one cover layer is then laminated to the separated metallic core layer. Before or, preferably, after lamination, at least one through-hole for the chip module can be created in the at least one cover layer for fixing the chip module.

[0017] The at least one cover layer can also be separated from a multi-sheet for multiple cover layers, e.g., by die-cutting. Prior to this, the multi-sheet for multiple cover layers is preferably pre-laminated at an appropriate temperature and pressure for a sufficient period of time to prevent shrinkage of the at least one cover layer separated from the multi-sheet during the subsequent step of laminating the at least one cover layer with the metallic core layer. In other words, the at least one cover layer, which is generally a polymer layer, is relaxed under pressure and temperature while still part of the multi-sheet for multiple cover layers, and the at least one relaxed or pre-laminated cover layer is then separated from the multi-sheet.Where necessary, an adhesive layer is applied either to one side of the at least one top layer or to one side of the metallic core layer, e.g. by sieving, squeegeeing or spraying, with which the corresponding other layer is laminated.

[0018] The metallic core layer and at least one cover layer can then be inserted into a holding frame to secure the chip card body, for example, one or two cover layers above and / or below the metallic core layer. The holding frame can comprise a single or multiple frame units, and a single chip card body can be inserted into each frame unit. Preferably, the holding frame has the same number of frame units as the number of metallic core layers of the multi-use metallic sheet and / or the number of cover layers of the multi-use sheet. Furthermore, the frame unit can be the same size as the chip card body and should not adhere to or bond with the chip card body. A silicone or Teflon frame, for example, is suitable for this purpose.

[0019] If the at least one cover layer is to be placed on the side of the metallic core layer on which the cavity of the metallic core layer is located, an insert, e.g., a PVC or Teflon insert or a comparable filler, can be placed in the cavity of the metallic core layer, or a suitable filler material can be dispensed to prevent the at least one cover layer from sagging in the area of ​​the cavity during lamination. The filler can be introduced into the cavity simultaneously with the application of the adhesive layer. The insert or filler is preferably the same size as, or slightly smaller than, the cavity of the metallic core layer. Likewise, an electrically non-conductive material, e.g., polymer, epoxy resin, or reinforcing epoxy resin, can be at least partially filled into the at least one slot of the metallic core layer to increase the mechanical stability of the hybrid chip card body.Alternatively, an insert made of the electrically non-conductive material can be placed in at least one slot of the metallic core layer.

[0020] After inserting the metallic core layer and at least one cover layer into the frame unit, a suitable laminating sheet, which serves to compress the metallic core layer and the at least one cover layer together, can cover the holding frame in such a way that no air remains between the metallic core layer and the at least one cover layer. This is because air can cause unevenness during lamination. Furthermore, the laminating sheet, just like the holding frame, should not adhere to or bond with the chip card body.

[0021] The through-hole for the chip module can be created in at least one cover layer before lamination, for later fixing of the chip module. In this case, the laminating sheet can include an extension that, when the mounting frame is covered, extends into the through-hole for the chip module in at least one cover layer. This extension prevents the through-hole from warping during lamination. Alternatively, the through-hole for the chip module can be created after lamination and before fixing the chip module, e.g., by milling.

[0022] In the case of the hybrid chip card body with a metallic core layer and at least one laminated cover layer, the method according to the second aspect of the invention is particularly advantageous compared to manufacturing methods in which the slots are created in the metallic multi-use sheet and the entire metallic multi-use sheet is laminated with a large-area cover layer. This is because, in such methods, it is hardly possible to identify contact bridges formed within the slots during lamination due to the cover layer being laminated with the metallic multi-use sheet.

[0023] A third aspect of the invention relates to the manufacture of the contactless or dual-interface chip card using the manufacturing process according to either the first aspect or the second aspect of the invention. The process begins with providing a chip module comprising a chip, preferably an RFID or NFC chip, and an antenna coil coupled to the chip, preferably an inductively coupled antenna coil with at least one turn. The provided chip module is fixed in the cavity of the metallic core layer and, optionally, in the through-hole of the chip module in the at least one cover layer, for example, by means of an adhesive. If the cavity of the metallic core layer is still occupied by the aforementioned insert or filler, this can be removed before fixing the chip module.

[0024] The present invention is described below by way of example with reference to the accompanying drawings, which are purely schematic. The drawings show: Figure 1A a top view of a metallic multi-utility arc 10 for a plurality of metallic core layers 15; Figure 1B the top view of the metallic multi-utility arc 10 for the multitude of metallic core layers 15 according to Figure 1A , in which each metallic core layer 15 has a cavity 20; Figure 1C a top view of a metallic multi-purpose arc 10 according to Figure 1A or Figure 1B separated metallic core layer 15, which has the cavity 20 and a slot 25; Figure 1D a top view of the metallic core layer 15 according to Figure 1C , which has a second cavity 30; Figure 2 a top view of a prelaminated multi-purpose sheet 35 for a variety of cover layers 40; Figure 3an exploded view of the components for the manufacture of a chip card body 100 with the metallic core layer 15 according to Figure 1C and two from the multi-benefit sheet 35 according to Figure 2 removed top layers 40 and two inserts 45, 55; Figure 4 a cross-sectional view of the chip card body 100 positioned in a holding frame 70 according to Figure 3 as well as a laminating sheet 60; Figure 5 a perspective view of the mounting frame 70 according to Figure 4 with a multitude of frame units 80 for holding the corresponding multitude of chip card bodies 100 according to Figures 3 and 4 ; Figure 6 a cross-sectional view of an all-metallic dual-interface chip card 150; Figure 7 a cross-sectional view of a multi-layer contactless or dual-interface chip card 250 with the chip card body 100 according to Figures 3 and 4 and a chip module 90; and Figure 8a cross-sectional view of a multi-layer contactless or dual-interface chip card 350 with the metallic core layer 15 according to Figure 1C and four cover layers 40 according to Figure 2 .

[0025] Figure 1A Figure 1 shows a top view of a metallic multi-use sheet 10 for a plurality of metallic core layers 15 of the same size. The metallic multi-use sheet 10 has a plurality of cutting lines 11, 12, 13, 14 along which the metallic core layers 15 can be separated from the metallic multi-use sheet 10 in a further step. The cutting lines 11, 12, 13, 14 can be visible and / or virtual lines. The thickness of the metallic multi-use sheet 10 should not exceed the maximum thickness of a chip card body according to ISO 7810. Figure 1AThe total number of metallic core layers 15 and / or the number of metallic core layers 15 per row and column of the metallic multi-use sheet 10 can be changed as required.

[0026] Figure 1B shows the top view of the metallic multi-purpose arc 10 according to Figure 1A , wherein each of the metallic core layers 15 of the multi-use sheet 10 has a cavity 20 for fixing a chip module 90. The cavities 20 can be produced directly in the multi-use sheet 10 before or after, or preferably simultaneously with, the removal of the plurality of metallic core layers 15 from the multi-use sheet 10, e.g., by punching in a die-cutting operation, milling in a milling operation, waterjet cutting, or laser cutting.

[0027] Figure 1C shows the top view of a metal multi-purpose arc 10 according to Figure 1A or Figure 1Bthe separated metallic core layer 15, which has the cavity 20 for fixing the chip module 90 and a slot 25. The slot 25 is only created in the metallic core layer 15 separated from the metallic multi-utility sheet 10, such that it extends from the cavity 20 to an edge 16 of the metallic core layer 15. In particular, it has a continuous opening 28 along its entire length in which the two walls 26, 27 of the slot 25 do not contact each other. Alternatively, the slot 25 can extend from the cavity 20 to one of the other three edges 17, 18, 19 of the metallic core layer 15. In contrast to Figure 1C The length, depth, width, shape, direction of the slot 25 and angular position between the slot 25 and an edge 16, 17, 18, 19 of the metallic core layer 15 as well as the number of slots 25 can be changed as required.

[0028] Figure 1Dshows the top view of the metallic core layer 15 according to Figure 1C , which, in addition to the cavity 20 for fixing the chip module 90 and the slot 25, also has a second cavity 30, for example, for fixing a display for presenting information from the chip module 90 and / or a chip card reader. The second cavity 30 for fixing the display can be created before or after, or preferably simultaneously with, the creation of the cavity 20 for fixing the chip module 90. In contrast to Figure 1D The length, width, depth and position of the second cavity 30 can be changed as needed.

[0029] Figure 2 Figure 1 shows a top view of a pre-laminated multi-purpose sheet 35 for producing a plurality of cover layers 40 of the same size. Before prelamination, the multi-purpose sheet 35 can be the same size as, or preferably slightly larger than, the metallic multi-purpose sheet 10 according to Figure 1. Figures 1A and 1Bto compensate for shrinkage of edges 36, 37, 38, 39 of the multi-sheet 35 caused during prelamination under pressure and / or temperature. A plurality of cutting lines 41, 42, 43, 44 of the multi-sheet 35, along which the cover layers 40 are separated from the multi-sheet 35, can be formed by visible and / or virtual lines, and the separated cover layers 40 should be the same size as the metallic core layers 15 separated from the metallic multi-sheet 10 according to Figures 1C and 1D The multi-purpose cover sheet 35 can, for example, be a transparent multi-purpose sheet and / or a multi-purpose sheet with a printed pattern and / or any other multi-purpose sheet. It can, in particular, have security features.

[0030] Figure 3Figure 1C shows an exploded view of the components for manufacturing a chip card body 100 with the metallic core layer 15, and a cover layer 40 to be laminated to the metallic core layer from above and from below. Figure 2 It also shows Figure 3An insert 45, e.g., a PVC or Teflon insert, to be placed into the cavity 20 of the metallic core layer 15 before lamination of the metallic core layer 15 with the cover layers 40, and an insert 55 consisting of electrically non-conductive material, e.g., polymer, epoxy resin, or reinforcing epoxy resin, to be placed into the at least one slot 25 of the metallic core layer 15 before lamination of the metallic core layer 15 with the cover layers 40. The inserts 45, 55 for the cavity 20 and the slot 25 of the metallic core layer 15 are preferably the same size as the cavity 20 and the slot 25 of the metallic core layer 15 and serve to prevent the upper and lower cover layers 40 from sinking into the cavity 20 of the metallic core layer 15 during lamination. Figure 3The cavity 20 and the slot 25 of the metallic core layer 15 can be filled with filler material. At least one adhesive layer 50 can be applied, e.g., by screen printing, spraying, or squeegee application, to one or both sides of the metallic core layer 15 and / or to a lower side of the upper cover layer 40 and / or to an upper side of the lower cover layer 40. Alternatively, the at least one adhesive layer 50 can be applied directly to the metallic multi-purpose sheet 10 and / or the cover layer multi-purpose sheet 35.

[0031] Figure 4 shows a cross-sectional view of the chip card body 100 placed in a frame unit 80 of a larger holding frame 70 (not shown here) according to Figure 3 The frame unit 80, e.g., a silicone frame or a Teflon frame, can hold the chip card body 100 during lamination and can be the same size as the chip card body 100. It also shows Figure 4The laminating sheet 60, which covers the holding frame 70 during lamination. First, one of the two cover layers 40 is placed on the base 71 of the frame unit 80, and then the metallic core layer 15 is placed on the cover layer 40. Subsequently, the two aforementioned inserts 45, 55 are placed according to Figure 3 The chip module 90 is inserted into the cavity 20 and the slot 25 of the metallic core layer 15, and finally, the other cover layer 40 is placed on the metallic core layer 15. The upper cover layer 40, which is located on the side of the cavity 20 of the metallic core layer 15, can have a continuous chip module opening 75 for subsequent fixation of the chip module 90. This continuous chip module opening 75 can be created directly in the upper cover layer 40 before lamination or preferably simultaneously with the separation of the plurality of cover layers 40 from the multi-layer cover sheet 35 according to Figure 2in a single die-cutting operation. The laminating sheet 60 can have an extension 65 which, when the retaining frame 70 is covered, extends into the continuous chip module opening 75 of the upper cover layer 40. Alternatively, when the retaining frame 70 is covered, the extension 65 of the laminating sheet 60 can extend not only into the continuous chip module opening 75 of the upper cover layer 40 but also into the cavity 20 of the metallic core layer 15. In this case, the insert 45 for the cavity 20 is designed according to Figure 3 not inserted into cavity 20. Contrary to Figure 4The continuous chip module opening 75 of the upper cover layer 40 can only be created after lamination and before fixing the chip module 90, and in this case the attachment 65 of the laminating sheet 60 is not required. After covering the mounting frame 70 with the laminating sheet 60, the metallic core layer 15 is laminated to the cover layers 40 by means of the adhesive layers 50 under pressure and / or temperature.

[0032] Figure 5 shows a perspective view of the holding frame 70 with a corresponding plurality of frame units 80 according to Figure 4 for holding the corresponding number of chip card bodies 100 according to Figures 3 and 4A single chip card body 100 is inserted into each frame unit 80 of the holding frame 70. The frame unit 80 is the same size as the chip card body 100 and does not adhere to or bind with the chip card body 100. The holding frame 70 and the chip card bodies 100 positioned in the frame units 80 of the holding frame 70, as well as the laminating sheet 60, according to Figure 4 can be inserted into a laminator as a whole. After lamination, the chip card bodies 100 are removed from the frame units 80 of the holding frame 70 after the laminating sheet 60 has been removed. (In contrast to...) Figure 5 The total number of frame units is 80, and the number of frame units per row and column of the holding frame is 80, can be changed as needed.

[0033] Figure 6 shows a cross-sectional view of a dual-interface chip card 150 comprising the metallic core layer 15 according to Figure 1Cand a chip module 90 fixed in the cavity 20 of the metallic core layer 15, e.g., by means of an adhesive 85. The chip module 90 comprises a chip, preferably an RFID or NFC chip, and an antenna coil coupled to the chip, preferably an inductively coupled antenna coil with at least one turn. The insert 55 or the filler can be placed in the slot 25 of the metallic core layer 15 according to Figure 3 Security features and / or patterns can be incorporated into or on the metallic multi-use sheet 10 according to Figures 1A and 1B or printed and / or lasered and / or glued and / or embossed in or on the metallic core layer 15.

[0034] Figure 7 shows a cross-sectional view of a contactless or dual-interface chip card 250 similar to Figure 6 , however, with the chip card body 100 according to Figures 3 and 4and the chip module 90 fixed in the cavity 20 of the metallic core layer 15 and in the continuous chip module opening 75 of the upper cover layer 40. Before fixing the chip module 90, the insert 45 or the filler placed in the cavity 20 of the metallic core layer 15 is removed according to Figures 3 and 4 removed.

[0035] Figure 8 shows a cross-sectional view of a contactless or dual-interface chip card 350 with the metallic core layer 15 according to Figure 1C and four cover layers 40 laminated with the metallic core layer 15 according to Figure 2 The chip card 350 according to Figure 8 differs from the chip card 250 according to Figure 7 by the fact that above and below the metallic core layer 15 according to Figure 8Each layer consists of two cover layers 40. For example, the outer cover layers 40 can be transparent layers with a magnetic stripe and / or a signature field and / or a hologram, and the middle cover layers 40 can have layers with printed patterns or other designs. Cover layers made of other materials such as ceramic or wood can also be used.

Claims

1. Method for producing a chip card body having a metallic core layer (15) for a contactless or dual-interface chip card (150, 250, 350), comprising the steps: - providing a metallic multiple-repeat sheet (10) for a multiplicity of metallic core layers (15); - generating a corresponding number of cavities (20) for fixing a corresponding number of chip modules (90); - detaching the multiplicity of metallic core layers (15) from the provided metallic multiple-repeat sheet (10); and later - generating at least one slot (25) in one of the multiplicity of metallic core layers (15) detached from the metallic multiple-repeat sheet (10).

2. Method according to Claim 1, wherein the step of generating the corresponding multiplicity of cavities (20) is carried out before or simultaneously with the step of detaching.

3. Method according to Claim 1 or 2, wherein the cavities (20) are punched out when generating the corresponding multiplicity of cavities (20).

4. Method according to Claim 1 or 2, wherein in the step of generating the corresponding plurality of cavities (20), the cavities (20) are cut by means of a laser.

5. Method according to one of Claims 1 to 4, wherein in the step of detaching, the multiplicity of metallic core layers (15) are punched out of the metallic multiple-repeat sheet (10).

6. Method according to one of Claims 1 to 4, wherein in the step of detaching, the multiplicity of metallic core layers (15) are cut out of the metallic multiple-repeat sheet (10) by means of a laser.

7. Method according to one of Claims 1 to 6, wherein in the step of generating the at least one slot (25), the at least one slot (25) is cut by means of a laser.

8. Method according to one of Claims 1 to 6, wherein in the step of generating the at least one slot (25), the at least one slot (25) is chemically etched.

9. Method according to one of Claims 1 to 8, wherein in the step of generating the at least one slot (25), the at least one slot (25) is generated in such a way that the latter extends from the cavity (20) up to a periphery (16, 17, 18, 19) of the metallic core layer (15) detached from the metallic multiple-repeat sheet (10).

10. Method according to one of Claims 1 to 9, wherein in the step of generating the at least one slot (25), the at least one slot (25) is generated in such a way that the latter has a width between 30 µm and 100 µm.

11. Method according to one of Claims 1 to 10, furthermore comprising the steps of: - providing at least one cover layer (40); - laminating the at least one covering layer (40) with the detached metallic core layer (15); and - generating at least one continuous chip module opening (75) in the at least one cover layer (40) for fixing the chip module (90) before or after the step of laminating.

12. Method according to Claim 11, wherein in the step of providing the at least one cover layer (40), the at least one cover layer (40) is detached from a multiple-repeat sheet (35) for a multiplicity of cover layers (40).

13. Method according to Claim 12, comprising the step: - pre-laminating the provided multiple-repeat sheet (35) for the multiplicity of cover layers (40).

14. Method for producing a contactless or dual-interface chip card (150) using the method for producing the chip card body (15) according to one of Claims 1 to 10, comprising the steps: - providing a chip module (90) with a chip and an antenna coil coupled to the chip; and - fixing the provided chip module (90) in the cavity (20) of the detached metallic core layer (15).

15. Method for producing a contactless or dual-interface chip card (250, 350) using the method for producing the chip card body according to one of Claims 11 to 13, comprising the steps: - providing a chip module (90) with a chip and an antenna coil coupled to the chip; and - fixing the provided chip module (90) in the at least one continuous chip module opening (75) of at least one cover layer (40) and in the cavity (20) of the detached metal core layer (15).