USE OF MEMS PACKAGES AS ANTENNA SUBSTRATE

Description

[0001] The invention relates to a MEMS package comprising a package substrate and at least one MEMS element. The at least one MEMS element comprises a MEMS interaction area and is embedded in the package substrate such that at least the MEMS interaction area remains unobstructed. The MEMS package is characterized in that one or more antennas for transmitting and / or receiving electromagnetic signals are located on or within the package substrate, the package substrate serving as the antenna substrate for the one or more antennas.

[0002] Furthermore, the invention relates to a method for manufacturing the MEMS package according to the invention. For this purpose, the package substrate and / or conductor tracks are first provided by an additive manufacturing process, preferably by a multi-material additive manufacturing process. Subsequently, the at least one MEMS element is at least partially embedded in the package substrate, such that at least the MEMS interaction area remains free. Furthermore, the one or more antennas are attached to or in the package substrate. Background and state of the art

[0003] Microsystems technology is now used in many application areas for the production of compact, mechanical-electronic devices. The microsystems (microelectromechanical systems, or MEMS for short, also called MEMS components or MEMS elements) that can be produced in this way are very compact (approximately in the micrometer range) while offering excellent functionality and ever-decreasing manufacturing costs.

[0004] Since many MEMS elements are highly sensitive to external influences, efforts are made to protect them effectively. The prior art includes the provision of so-called packaging for this purpose. Packaging for MEMS elements fulfills several functions. These include protecting the MEMS element from environmental factors such as humidity and / or liquids, as well as dust and / or electrostatic discharge (ESD). At the same time, however, the functional properties of the MEMS element, for example, the acoustic properties of an acoustic MEMS transducer, should be preserved. Thus, the MEMS element should be able to interact with its environment, for example, to receive or detect sound pressure waves, as in the case of an acoustic MEMS transducer. Therefore, the packaging preferably serves as a housing for the MEMS element. On the underside of the MEMS element, a substrate itself can fulfill this function.Additionally, protection may be required above the substrate for the components arranged on the substrate.

[0005] In Dehé et al. (2013), a MEMS transducer is disclosed that incorporates a metal cover as packaging. This cover encloses a volume significantly larger than theoretically required for the underlying components of the MEMS transducer. The primary reason for this is to maintain a distance between the cover and the electrically conductive components (e.g., wire bonds, electrodes, capacitive MEMS transducer, etc.) to prevent short circuits. Simultaneously, metal is a desirable material for these covers due to its mechanical stability and hermetically sealed nature, particularly against water and air. Furthermore, sensitive components can be electromagnetically shielded, thus preventing adverse influences and electrostatic discharges.

[0006] WO 2022 / 008338 A1 discloses a MEMS package comprising a substrate and a MEMS element arranged on the substrate, encompassing a MEMS interaction area. To protect the MEMS element, a dielectric layer is applied by means of a surface-conforming coating process using a dielectric. Advantageously, this provides a compact protective layer that offers electrical insulation and mechanical protection for the MEMS element.

[0007] Izadpanah et al. (2019) provide an overview of various packaging materials and designs. Packaging materials designed for high-performance applications often include ceramics and are typically impermeable. For high-performance applications, materials such as aluminum nitride and silicon carbide are used to achieve optimized thermal properties. Plastic packaging is particularly suitable when low manufacturing costs are desired. The type and design of the packaging therefore depend significantly on the specific application and, consequently, on the MEMS element itself.

[0008] A disadvantage of well-known MEMS packages is that different MEMS elements are usually packaged separately, which makes it difficult to integrate arrays of MEMS elements.

[0009] Furthermore, for many applications it would be desirable to provide MEMS elements in functional combination with antennas for receiving and / or transmitting electromagnetic signals, for example to enable wireless data exchange.

[0010] This is particularly important for those applications where electromagnetic signals interact with other signals that can be detected and / or triggered by MEMS elements.

[0011] In the prior art, antennas are generally provided on an antenna substrate, which preferably serves as a support for the antenna. For antenna substrates, a low dielectric constant is often desirable in order to reduce the concentration of field lines within the antenna substrate and thus facilitate the separation of electromagnetic signals.

[0012] Pozar (1996) provides an overview of substrate-mounted antennas, particularly microstrip antennas and aperture-coupled substrates. He also discusses the importance of the substrate's construction, which is relevant to the antenna's electrical and electromagnetic properties. For example, a lower relative permittivity leads to a wider impedance bandwidth and reduced surface acoustic wave excitation. The substrate thickness affects both the bandwidth and the coupling level. A thicker substrate results in a wider bandwidth but lower coupling for a given aperture in the substrate.

[0013] Kumar and Raghavan (2016) discuss the deployment of antennas and antenna arrays based on substrate-integrated waveguide (SIW) technology. SIW technology, which acts as a bridge between planar and non-planar technologies, is particularly suitable for the micro- and millimeter-wave range.

[0014] WO 2009 / 053460 A1 discloses a method for manufacturing a radar sensor. First, a ceramic support structure with a distribution network is provided, wherein cavities are formed on the ceramic support structure. The cavities are then filled with a material matrix consisting of a first material with inclusions of a second material. This allows for the formation of numerous regions within the material matrix with lower dielectric constants than those of the first material. Subsequently, planar patch antennas are deposited onto the material matrix.

[0015] The state of the art also includes approaches for providing devices that utilize a functional relationship between MEMS elements and antennas.

[0016] German patent application DE 102014214153 B4 discloses a microphone arrangement comprising a surface-mountable microphone package which is data-connected to an antenna in the context of a mobile phone. The antenna can be configured to transmit signals that are output by the microphone arrangement.

[0017] In German patent DE 10 2016 125 722 A1, antennas are combined with MEMS-based angular accelerometers, with the antennas being used as a wireless link for an I / O (input / output) interface. The antennas and / or suitable components of the wireless I / O interface can be arranged on a substrate, such as a flexible substrate.

[0018] US Patent 2011 / 0100123 A1 discloses an accelerometer whose operation is based on a thermal measurement principle. The accelerometer has a flexible substrate onto which a base layer is applied. A cavity is located on the surface of the base layer. MEMS elements, which can be formed by two temperature sensors and a heater, are mounted within the cavity. A cover, which is airtight and bonded with an adhesive, is located above the MEMS elements. The accelerometer also features an RFID antenna mounted on the flexible substrate. The RFID antenna enables the transmission and reception of radio signals to optimize the performance of the MEMS elements.

[0019] Although prior art concepts exist for utilizing the combined effect of MEMS elements and antennas, combining these components has drawbacks. High electromagnetic losses often result at the connections between MEMS elements and antennas, preventing efficient use of electromagnetic signals. The manufacturing process itself also presents disadvantages, as errors can occur during the joining process when inserting the components. Furthermore, flexibility in the geometric design of the substrates intended to support MEMS elements and antennas is limited.

[0020] Due to the different requirements of MEMS elements and antennas, only limited shapes are usually possible.

[0021] Therefore, in light of the state of the art, there is a need for alternative or improved devices and / or methods that incorporate antennas and MEMS elements and combine their modes of operation. Object of the invention

[0022] The object of the invention was to eliminate the disadvantages of the prior art. In particular, a MEMS package or a method for its production was to be provided which compactly combines MEMS elements with antennas, ensures efficient operation and protection of both components, and is preferably characterized by simple, cost-effective manufacturing. Summary of the invention

[0023] The problem solved by the features of the independent claims is achieved. Advantageous embodiments of the aspects of the invention are described in the dependent claims.

[0024] The invention therefore relates to a MEMS package comprising a. a package substrate, b. at least one MEMS element comprising a MEMS interaction area, wherein the at least one MEMS element is at least partially embedded in the package substrate, such that at least the MEMS interaction area remains free, wherein the package substrate has one or more antennas for transmitting and / or receiving electromagnetic signals, wherein the package substrate acts as an antenna substrate for the one or more antennas, wherein the package substrate in the MEMS package fulfills a housing and / or protective function for the at least one MEMS element and at the same time provides an operative connection with an environment, so that the at least one MEMS element can receive a signal from the environment and / or transmit it to the environment, and wherein the at least one MEMS element and / or the one or more antennas are located on a non-planar section.

[0025] In the context of the invention, it was recognized that the requirements for one or more antennas and for at least one MEMS element can be combined by a single package substrate. Prior art has avoided such a combined mounting of MEMS elements and antennas because package materials and antenna substrates must fulfill partially divergent properties. For example, packaging materials for MEMS elements often contain metal (see, e.g., Dehé et al. (2013)) and are therefore electrically conductive to provide sufficient protection for the MEMS element while simultaneously enabling suitable electrical and mechanical conditions for its functionality. Ceramics or plastics can also be used as packaging materials for MEMS elements. However, ceramics have proven to be expensive, and plastics exhibit a certain permeability to moisture (see Stanimirović, 2014).Therefore, in the current state of the art, there is a tendency to use metal, and thus electrically conductive material, as packaging material for MEMS elements.

[0026] However, antennas in the context of microsystems technology are typically mounted on substrates that fulfill a dielectric function, preferably having a low relative permittivity and thus a low permittivity (product of electric field constant ε 0 and relative permittivity ε r : ε = ε 0 ε r ) in order to ensure optimal functionality of the antennas with regard to the course of the electric and magnetic field lines.

[0027] The inventors realized that a package substrate for at least one MEMS element can simultaneously be used as an antenna substrate. In other words, it can also be said that the antenna substrate is used as a package substrate for a MEMS element.

[0028] The MEMS package according to the invention therefore represents a departure from the prior art in that it combines two requirement profiles that were previously considered to be different: the packaging of MEMS elements to fulfill a housing and / or protective function and the provision of an antenna substrate.

[0029] The MEMS package according to the invention has proven to be particularly advantageous in many aspects.

[0030] Firstly, the preferred MEMS package offers a particularly compact design. Advantageously, at least one MEMS element and one or more antennas are located on and / or within the same package substrate. In particular, it is therefore unnecessary to place the at least one MEMS element and the one or more antennas on different support structures, which would result in a greater spatial distance and thus larger dimensions for the entire component. Furthermore, monolithic integration of MEMS elements and antennas is advantageously enabled, eliminating the need for separate component joining.Overall, the preferred MEMS package results in a compact design that is suitable for a wide variety of applications, while simultaneously fulfilling both a protective and / or housing function for the at least one MEMS element and enabling optimal functionality of the one or more antennas.

[0031] Furthermore, the compact design and communication capabilities of the MEMS package offer the advantage of efficient integration. The preferred MEMS package requires minimal storage space, can be flexibly integrated into a wide variety of geometric configurations, and also allows for simple wireless control and / or data exchange via the provided antennas. Moreover, the MEMS package according to the invention allows for the combined use and / or processing of different signal types. This advantageously results in expanded functional possibilities, as the functions of the at least one MEMS element and the one or more antennas can be used in conjunction. For example, transmitted and / or received electromagnetic signals can also be used for the at least one MEMS element, and vice versa.Combining and / or processing different signal types offers advantages, for example, in terms of desired amplification and / or directionality of signals, such as for beamforming.

[0032] Beamforming allows signals or radiation to be directed, enabling more precise reception and / or transmission. It is particularly applicable to electromagnetic waves. This involves focusing or directing electromagnetic waves from a transmitter and / or receiver using appropriate antenna arrangements. Such beamforming, for example in wireless communication, can increase range, improve transmission power, and enable more stable connections. Beamforming can also be used for acoustic signals (sound waves), allowing for targeted reception and / or transmission of sound waves.

[0033] Advantageously, the MEMS package according to the invention allows for the compact integration of both a multitude of antennas and MEMS elements, for example, acoustic MEMS transducers in the form of arrays. In preferred embodiments, the MEMS package can thus also be used for reciprocal and / or combined beamforming of electromagnetic and acoustic signals. As will be explained in more detail herein, reciprocal and / or combined processing of acoustic and electromagnetic signals can be particularly advantageous in this respect, enabling improved localization and more precise beamforming.

[0034] In addition to its flexible application possibilities, the MEMS package is advantageously characterized by a particularly cost-efficient and flexible manufacturing process, as additive manufacturing methods (3D printing) can be used to provide the package substrate along with integrated components.

[0035] Additive manufacturing processes, in particular, offer a high degree of flexibility regarding possible geometric shapes, enabling the optimization of MEMS element and / or antenna placement for specific applications. For example, for beamforming, it may be advantageous to arrange the antennas and / or MEMS elements on non-planar, e.g., concave, sections to allow for tighter focusing. Similarly, it may be advantageous to arrange the antennas and / or MEMS elements on a convex substrate surface to receive and / or transmit signals over a wider angular range. Furthermore, the number of MEMS elements and / or antennas in the MEMS package can be easily scaled without requiring increased integration effort.

[0036] The MEMS package, or its preferred manufacturing using additive manufacturing, thus allows for adaptation or optimization to a wide variety of applications.

[0037] A further advantage in this respect is the simple integration of conductive traces for electrical contact on and / or within the package substrate. These traces can be applied, for example, during multi-material additive manufacturing in a single process step along with the build-up of the package substrate. In preferred embodiments, the MEMS package can, for example, include a processing unit to process signals from the at least one MEMS element and / or the one or more antennas. Connecting the processing unit to the corresponding antennas and / or MEMS elements via conductive traces is advantageously particularly process-efficient.

[0038] Therefore, the MEMS package is characterized by a number of advantages in terms of design, manufacturing and functionality, resulting in significant improvements compared to the state of the art.

[0039] For the purposes of the invention, a MEMS package preferably refers to a device comprising at least one MEMS element embedded in a package substrate such that a MEMS interaction area preferably remains unobstructed. According to the invention, the package substrate within the MEMS package fulfills a housing and / or protective function for the MEMS element, while simultaneously providing an interaction with the environment, enabling the at least one MEMS element to receive and / or transmit a signal from the environment. The invention provides that the MEMS interaction area of ​​the MEMS element remains unobstructed. The preferred MEMS package therefore preferably has a design that ensures the MEMS element is at least partially packaged or enclosed (and protected) within the package substrate, while simultaneously leaving an interaction area unobstructed through which the MEMS element can interact with the environment.

[0040] The package substrate preferably refers to the component of the MEMS package that serves to embed the at least one MEMS element. Preferably, one or more antennas are located on or within the package substrate in addition to the at least one MEMS element. The package substrate preferably fulfills the actual package function, i.e., a housing and / or protective function for the at least one MEMS element. Advantageously, it is therefore not necessary to attach a separate component dedicated to protecting the at least one MEMS element, for example, in the form of a cover. In the prior art, such as US 2011 / 0100123 A1, such a cover is provided for the protection of MEMS elements. According to the invention, the package substrate itself can instead provide reliable protection for the at least one MEMS element.Preferably, the MEMS interaction area of ​​the at least one MEMS element in the context of the invention remains unobstructed, allowing for communication with the environment. This is not possible, or only partially possible, when a cover is placed over the MEMS elements in US 2011 / 0100123 A1, as the cover prevents communication with the environment. Advantageously, the package substrate can instead fulfill a housing or protective function for the MEMS element, while the MEMS element can receive and / or transmit a signal from the environment via the unobstructed interaction area.

[0041] Simultaneously, the package substrate preferably functions as an antenna substrate for one or more antennas. The antenna substrate preferably refers to a support for one or more antennas. Thus, one or more antennas can be mounted on or within the antenna substrate. Depending on the application, antenna substrates should fulfill certain dielectric properties, since, for example, the use of a material for the antenna substrate with a high relative permittivity generally reduces the radiation efficiency of the one or more antennas. According to the invention, it has been found that an antenna substrate can simultaneously be used as a package substrate for at least one MEMS element, or vice versa.

[0042] In preferred embodiments, the package substrate is monolithic, i.e., it is a single, continuous, and / or seamless structure. In the context of the invention, the package substrate serves, on the one hand, as a mounting surface for the at least one MEMS element. Furthermore, the package substrate simultaneously functions as an antenna substrate. In other words, the at least one MEMS element and the one or more antennas are preferably located within or on the same package substrate or antenna substrate. Preferably, both at least partial embedding of the MEMS element in the package substrate (or antenna substrate) and direct mounting of the one or more antennas directly onto the antenna substrate (or package substrate) are provided (without an intermediate layer).

[0043] In this respect, the MEMS package according to the invention differs structurally from known prior art arrangements, such as those taught in US 2011 / 0100123 A1. That patent discloses the placement of MEMS elements on a base layer located on a substrate. The RFID antennas used therein, however, are arranged on the substrate. Thus, the MEMS elements and the RFID antennas are located in or on different components: the MEMS elements in or on a base layer (which is located on a substrate), and the RFID antennas on the substrate. Contrary to the teaching of the invention, the antenna substrate of US 2011 / 0100123 A1 therefore does not function as a package substrate for the MEMS elements.

[0044] Preferably, the package substrate does not correspond to the support substrate of a MEMS element. The support substrate of a MEMS element—for example, a semiconductor substrate—preferably refers to a component of the MEMS element onto which functionally relevant components of the MEMS element, such as MEMS structures, electronic circuits, etc., are mounted. According to the invention, the at least one MEMS element, together with the support substrate, is at least partially embedded in the package substrate.

[0045] At least partial embedding of the MEMS element in the package substrate preferably means that at least a section of the MEMS element is enclosed by the package substrate. Preferably, a portion of the MEMS element, and more preferably the MEMS element substantially, can be enclosed by the package substrate, such that the MEMS element is at least partially integrated within the package substrate. A MEMS element substantially enclosed by the package substrate preferably has at least partial (especially in areas outside the interaction zone) positive material contact with the package substrate. This allows the package substrate to provide a protective function, preventing the ingress or passage of liquids or dirt through the material contact between the package substrate and the MEMS element.In preferred embodiments, the MEMS element has continuous material contact with the package substrate along a perimeter, which acts as a sealing edge and can provide a hermetic seal. Preferably, however, the MEMS element is at least partially embedded within the package substrate such that a MEMS interaction area remains free. Thus, the MEMS element is protected by the at least partial embedding of the package substrate, while simultaneously enabling communication with the environment, allowing signals to be received and / or transmitted from and / or to the environment by the MEMS element.

[0046] The phrase "the MEMS interaction area remains unobstructed" preferably means that interaction with the environment and / or a medium is possible. "Unobstructed" preferably refers to the interaction capability of the MEMS element and, in preferred forms, can mean the absence of the package substrate in the interaction area. It can also preferably mean that the package substrate in the interaction area has a sufficiently thin layer thickness so that the functionality of the MEMS element with respect to interaction is not significantly impaired. For example, for an acoustic MEMS transducer, "unobstructed" can be achieved by a recess in the package substrate above a vibrating diaphragm. Similarly, "unobstructed" can preferably be provided by a transparent area, for example, for an optical MEMS sensor or a MEMS gas sensor.

[0047] Preferably, the MEMS interaction area is an essential functional component of the MEMS element, which preferably interacts with a medium and / or the environment in the desired manner. Therefore, it is preferred that the MEMS interaction area remains unobstructed to allow interaction with a medium and / or the environment of the MEMS package. The specific design of the MEMS interaction area depends on the respective MEMS element.

[0048] In the case of an acoustic MEMS transducer, this could be, for example, a MEMS membrane. In the case of an optical MEMS transducer, this could be, for example, an optical emitter. In both cases, it is preferred that no package substrate directly within the interaction area of ​​the MEMS element reduces the interaction of the MEMS element with the environment (sound emission or absorption, transmission or reception of optical signals), while the protection of the sensitive electronic components is ensured by embedding the MEMS element in other areas.

[0049] According to the invention, one or more antennas are located on or within the package substrate. An antenna is a device for transmitting and / or receiving electromagnetic signals.

[0050] For the purposes of the invention, an electromagnetic signal preferably comprises an electromagnetic wave. The average person skilled in the art knows that, in the context of the invention, the terms "electromagnetic signal" and "electromagnetic wave" can be used synonymously.

[0051] In a preferred embodiment, the MEMS package is characterized in that the package substrate comprises a dielectric material, wherein the dielectric material is preferably selected from a group comprising low-temperature single-firing ceramic (LTCC) and / or high-temperature multilayer ceramic (HTCC).

[0052] In further preferred embodiments, the antenna substrate comprises a material selected from a group consisting of polyimide, epoxy, resin and / or epoxy resin.

[0053] The aforementioned materials have proven particularly advantageous for fulfilling the desired dielectric properties as antenna substrates. According to the invention, it has been found that these materials, especially LTCC, simultaneously provide optimal protection against environmental influences for the at least one MEMS element. Furthermore, the aforementioned materials are suitable for additive manufacturing processes. In particular, the aforementioned materials can be efficiently shaped during the provision of the package substrate to provide, for example, planar and / or non-planar sections, depending on the application.

[0054] With regard to its combined use as a packaging material for at least one MEMS element and as an antenna substrate, LTCC has proven particularly advantageous. Firstly, LTCC preferably exhibits a suitable, comparatively high relative permittivity, which is beneficial for integrating electronic components into high-frequency circuits. Furthermore, this high relative permittivity isolates high-frequency electromagnetic fields in conductor tracks, vias, and / or wire bonds, thus advantageously preventing crosstalk. Simultaneously, LTCC can be advantageously used for packaging MEMS elements, achieving a high level of protection against dust, moisture, liquids, and electrostatic discharges without compromising functional properties.

[0055] In a preferred embodiment, the MEMS package is characterized in that the package substrate comprises a dielectric material, wherein the material has a relative permittivity ε r of greater than 1, preferably between 1 - 10, particularly preferably between 2 - 8, most preferably between 5 - 10.

[0056] Preferably, the antenna substrate has a low relative permittivity, particularly in the areas where one or more antennas are located. A relatively low relative permittivity reduces the concentration of electromagnetic field lines in the package substrate or antenna substrate, which is advantageous for transmitting and / or receiving electromagnetic signals.

[0057] Preferably, electronic components such as electronic circuits, processing units, and distribution networks for controlling one or more antennas and / or regulating their operation are mounted on or within the package substrate. A relatively high relative permittivity is advantageous in the area of ​​electronic components, particularly for controlling one or more antennas, as this isolates high-frequency electromagnetic fields and thus reduces emissions from the electronic components.

[0058] In preferred embodiments, the package substrate has areas with different relative permittivities, wherein a section for antennas preferably has low relative permittivities and a section for mounting electronic circuits preferably has high relative permittivities.

[0059] For example, LTCC exhibits a comparatively high relative permittivity (approximately 7–8) and is advantageous in electronic circuits, particularly for antenna control. Polyimides, which have a relative permittivity between approximately 3 and 3.5, are an example of a material group with a relatively low relative permittivity. In the context of the invention, relatively low relative permittivities range from approximately 1 to 5, while relatively high permittivities are found in the range of approximately 5 and above.

[0060] The package substrate can preferably comprise several materials. It is also preferred that the package substrate is essentially formed from a single material. In preferred embodiments, the package substrate is monolithic, the term monolithic meaning in particular that no separate fabrication and subsequent assembly of components of the package substrate (for example, for packaging the MEMS elements and / or as a substrate for the antennas) is necessary.

[0061] To reduce the relative permittivity, it may also be advantageous to design the package substrate material to be porous. Pores reduce the material density, and thus also the dipole density, by providing free volume, thereby lowering the relative permittivity.

[0062] In a further preferred embodiment, the MEMS package is characterized in that the MEMS package has a computing unit, which is preferably located on or in the package substrate.

[0063] For the purposes of this invention, a computing unit preferably refers to a data processing unit, i.e., a device that is preferably capable of being configured to process data. The computing unit may preferably be selected from the group comprising an integrated circuit (IC), an application-specific integrated circuit (ASIC), a programmable logic device (PLD), a field-programmable gate array (FPGA), a processor, a microprocessor, a microcomputer, a programmable logic controller, and / or another electronic and / or programmable circuit. The computing unit may, in particular, itself be a processor or a processing unit, or be composed of several processors, preferably for processing data.

[0064] For data processing, it is preferred that software is installed on the computing unit which is configured for this purpose and includes commands to perform the corresponding processing steps.

[0065] The term "processing" is preferably to be interpreted broadly and preferably includes computational steps that are necessary to use, for example, transmitted and / or received signals of the MEMS element and / or electromagnetic signals of one or more antennas for application purposes, such as beamforming, localization, control, etc.

[0066] In preferred embodiments, the computing unit is combined with a communication unit. In further preferred embodiments, the computing unit is a communication unit. In further preferred embodiments, the communication unit can be provided by one or more antennas. Preferably, the communication unit can transmit the data in the form of electromagnetic signals, for example to another data processing unit.

[0067] In another preferred embodiment, the MEMS package is characterized in that one or more antennas are provided as patch antennas.

[0068] For the purposes of the invention, a patch antenna is defined as an antenna comprising an area of ​​conductive material. Preferably, the patch antenna is characterized in that the length and / or width of the area of ​​the patch antenna is many times greater than its thickness. In preferred embodiments, the length and / or width of the area of ​​the patch antenna is approximately 2 times, preferably approximately 5, 10, 20 times, or more times greater than its thickness. Preferably, the patch antenna is essentially flat, so that it can be advantageously mounted or embedded in the package substrate in a suitable manner.

[0069] In preferred embodiments, the preferred patch antenna is a strip comprising a conductive material, e.g., a metal (e.g., copper). A strip as a patch antenna is preferably characterized in that its length is many times greater than its width (for example, by a factor of approximately 2, preferably approximately 5, 10, or more).

[0070] In further preferred embodiments, the patch antenna has a polygonal, preferably rectangular, triangular and / or round shape. In a preferred embodiment, the patch antenna has a length that corresponds approximately to half the wavelength of an electromagnetic signal for which the patch antenna is designed to transmit or receive.

[0071] Patch antennas are particularly well-suited for the preferred MEMS package because they can be manufactured with high precision on and / or the package substrate. They can be applied using established etching and / or coating processes from semiconductor and microsystems technology, which have proven to be process-efficient, simple to implement, and suitable for mass production. This makes it advantageous for patch antennas to be easily integrated onto or into the package substrate. The typically small dimensions of patch antennas also facilitate their placement on or within the package substrate.

[0072] Furthermore, patch antennas are advantageously suited for mounting on or within the package substrate, such that a plurality of patch antennas, forming an antenna array, can achieve particularly good directivity. Advantageously, a complex antenna pattern (graphical representation of the radiation characteristics of one or more antennas or the antenna array) can be generated using a large number of patch antennas as an antenna array, which would otherwise be difficult to achieve with a single antenna. By preferably incorporating a phase shifter, for example, received and / or transmitted electromagnetic signals can be phase-shifted, thus enabling the simple and efficient use of effects such as directivity and / or intensity enhancement, e.g., for beamforming.

[0073] In other preferred embodiments, other types of antennas can also be used.

[0074] The average expert knows that the type and / or shape of one or more antennas can influence the wavelength or frequency of the electromagnetic signals. In preferred embodiments, one or more antennas can transmit and / or receive electromagnetic signals in frequency ranges between approximately 3–30 Hz, 30–300 Hz, 0.3–3 kHz, 3–30 kHz, 30–300 kHz, 0.3–3 MHz, 3–30 MHz, 30–300 MHz, 0.3–3 GHz, 3–30 GHz, 30–300 GHz, 0.3–385 THz, 0.3–20 THz, 20–37.5 THz, 37.5–100 THz, 100–214 THz, 100–385 THz and / or 385–750 THz. Thus, a large number of frequency bands can be used to transmit and / or receive electromagnetic signals by appropriately designing one or more antennas.

[0075] In a further preferred embodiment, the MEMS package is characterized in that the MEMS package has several antennas in the form of an antenna array, wherein the antenna array preferably comprises at least 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 50, 100 or 500 or more antennas.

[0076] Using an antenna array advantageously enables the amplification and / or intensification of the reception and / or transmission of electromagnetic signals through phase shifting and / or interference effects. Furthermore, effects such as beamforming of electromagnetic signals can be advantageously employed through the use of antenna arrays. Mounting an antenna array on or within the package substrate has proven particularly useful, as the package substrate allows for a compact design of the antenna array. The preferred patch antennas are advantageously well-suited for creating an antenna array on or within the package substrate.Furthermore, an array antenna design offers the advantage of redundancy in the reception and / or transmission of electromagnetic signals, ensuring continued reception and / or transmission even if one antenna fails. This results in both improved performance and exceptionally high reliability.

[0077] In preferred embodiments, the preferred MEMS package has dimensions between approximately 0.1 cm and 10 cm, preferably between approximately 0.5 cm and 2 cm. Preferably, the dimensions comprise a length, height, and / or width of the preferred MEMS package. Thus, the MEMS package may preferably have a length and / or width between approximately 0.1 cm and 10 cm, more preferably between approximately 0.1 cm and 5 cm, and particularly preferably between 0.1 cm and 2 cm. Preferably, the thickness of the MEMS package (dimension in the direction of receiving and / or transmitting signals) is less than its length and / or width and may, for example, be between approximately 0 cm and 2 cm, more preferably between approximately 0.1 cm and 1 cm, and particularly preferably between approximately 0.1 cm and 0.5 cm.

[0078] The English term "array" preferably means "arrangement, setup, field, matrix". In the context of the invention, an antenna array thus preferably refers to an arrangement of several, at least two, antennas. An antenna array can be used to determine the orientation of the received and / or transmitted electromagnetic signals.

[0079] The geometry of the antenna array preferably determines which orientations of the electromagnetic signals are enabled. Linear arrangements exist, in which all antennas are arranged along a straight line. This is also known as a Uniform Linear Array (ULA). Preferably, rectangular antenna arrays, also referred to as Uniform Rectangular Arrays (URAs), can also be used. The URA is arranged along a plane, e.g., along the xy-plane, the yz-plane, or the xz-plane. Three-dimensional antenna arrays can also be preferably used, preferably formed by several URAs, i.e., by several planes. It is also preferred that the antenna array is arranged along a circle, also known as a Uniform Circular Array (UCA). Hybrid forms of these antenna arrays are also preferred.

[0080] A one-dimensional array along a linear line preferably exhibits a cylindrically symmetric characteristic. Its sensitivity only distinguishes signal directions from different angles to the array axis. Such an array does not differentiate between signals arriving from directions rotating relative to each other around the array axis.

[0081] A two-dimensional array, that is, an array formed along a plane, can preferably be oriented in all directions within the half-space bounded by the array plane. However, two-dimensional arrays usually do not distinguish between directions that are mirror images of each other across the array plane. Thus, two-dimensional arrays are "front-back blind."

[0082] Three-dimensional arrays, in principle, allow orientation from any spatial direction. "Front-back blindness" and dependence on rotation are advantageously avoided in three-dimensional arrays.

[0083] Advantageously, the various array configurations can be easily implemented in the MEMS package according to the invention.

[0084] In a further preferred embodiment, the MEMS package is characterized in that the at least one MEMS element is selected from a group comprising a MEMS transducer, preferably a MEMS microphone or a MEMS loudspeaker, and / or a MEMS sensor, preferably a MEMS flow sensor or a MEMS gas sensor.

[0085] Advantageously, the package substrate can contain a variety of MEMS elements, making it suitable for a wide range of applications.

[0086] For the purposes of the invention, a MEMS element preferably refers to a MEMS component, i.e., a component that has been manufactured using MEMS technology methods and / or has dimensions that are approximately in the micrometer range.

[0087] The term MEMS transducer (also acoustic MEMS transducer) preferably refers to both a MEMS microphone and a MEMS loudspeaker. More generally, a MEMS transducer preferably refers to a transducer for interacting with a volumetric flow of a fluid, preferably in the vicinity of the MEMS package, which is based on MEMS technology and whose structures for interacting with the volumetric flow or for capturing or generating pressure waves of the fluid have dimensions in the micrometer range (1 pm to 1000 pm). The fluid can be either gaseous or liquid. The structures of the MEMS transducer, in particular the vibrating diaphragm, are designed for generating or capturing pressure waves of the fluid.

[0088] For example, as in the case of a MEMS loudspeaker or MEMS microphone, the pressure wave can be sound pressure waves. However, the MEMS transducer can also function as an actuator or sensor for other pressure waves. Thus, the MEMS transducer is preferably a device that converts pressure waves (e.g., acoustic signals as alternating sound pressures) into electrical signals or vice versa (conversion of electrical signals into pressure waves, for example, acoustic signals). The MEMS interaction area in the MEMS transducer is preferably a vibrating diaphragm.

[0089] MEMS transducers preferably comprise a MEMS component (e.g., MEMS chip) with a vibrating membrane, the vibrations of which are generated and / or read out, for example, by piezoelectric or piezoresistive components on or at the membrane.

[0090] In a preferred embodiment, the MEMS transducer is a piezoelectric MEMS transducer. Capacitive methods for generating and / or measuring membrane vibrations are also known. In a preferred embodiment, the MEMS transducer is a capacitive MEMS transducer.

[0091] In preferred embodiments, MEMS transducers can also be configured as MEMS ultrasound transducers, which are suitable for emitting and / or receiving ultrasound. These are, in particular, capacitive micromechanical ultrasound transducers (CMUTs), piezoelectric micromechanical ultrasound transducers (PMUTs), or combined ultrasound transducers (piecoelectric composite ultrasound transducers, PC-MUTs).

[0092] In another preferred embodiment, the MEMS element is a MEMS gas sensor, wherein the MEMS interaction area comprises a MEMS membrane and / or an electrochemical MEMS sensor area.

[0093] For example, it could be a photoacoustic spectroscope with a MEMS sensor. Photoacoustic spectroscopy preferably uses intensity-modulated infrared radiation with frequencies in the absorption spectrum of a molecule to be detected in a gas. If this molecule is present in the beam path, modulated absorption occurs, leading to heating and cooling processes whose timescales reflect the modulation frequency of the radiation. These heating and cooling processes cause expansion and contraction of the gas, generating sound waves at the modulation frequency. These sound waves can be measured by sensors such as acoustic detectors or flow sensors.

[0094] The power of the sound waves is preferably directly proportional to the concentration of the absorbing gas. A photoacoustic spectroscope therefore preferably comprises at least one emitter, one detector, and one cell. In a MEMS gas sensor, the detector is preferably implemented as a MEMS sensor.

[0095] A MEMS sensor can, for example, include a capacitively or optically readable, piezoelectric, piezoresistive and / or magnetic beam and / or a capacitive, piezoelectric, piezoresistive and / or optical microphone or diaphragm.

[0096] In further preferred embodiments, the MEMS sensor is a MEMS flow sensor. A MEMS flow sensor is a MEMS sensor for measuring the flow of a fluid. For example, the volumetric flow rate and / or the mass flow rate of the fluid can be measured by the MEMS flow sensor.

[0097] For the purposes of the invention, the area of ​​a MEMS sensor which interacts with the environment, for example a medium, is preferably to be understood as its MEMS interaction area.

[0098] In a further preferred embodiment, the MEMS element is a MEMS filter, preferably a MEMS frequency filter, in particular a SAW or BAW filter, wherein the MEMS interaction area comprises a MEMS filter structure, in particular MEMS electrodes and / or a MEMS bulk area.

[0099] A SAW filter is preferably an acoustic surface wave filter (also an AOW filter), which in particular represents a bandpass filter for electrical signals. These are preferably based on the interference of signals with different propagation times and preferably utilize the piezoelectric effect. Preferably, a pair of comb-like interlocking electrodes is mounted on a piezoelectric single crystal, which preferably form the interaction area.

[0100] BAW filters (bulk acoustic wave) are preferably similar electronic filters with bandpass characteristics. However, unlike SAW filters, they preferably have a substrate (bulk) in which the acoustic waves propagate. This substrate or bulk region preferably forms the MEMS interaction region.

[0101] In a further preferred embodiment, the MEMS package is characterized in that at least partially a MEMS element array comprising several MEMS elements is embedded in the package substrate, wherein preferably the MEMS element array comprises at least 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 50, 100 or 500 or more MEMS elements and / or wherein preferably the MEMS element array comprises a MEMS microphone array and / or a MEMS loudspeaker array.

[0102] Analogous to an antenna array, a MEMS element array, preferably at least partially embedded in the package substrate, can advantageously contribute to amplifying the signal that can be received and / or transmitted by means of a MEMS element. Furthermore, a particularly reliable functionality of the MEMS elements is ensured by an array arrangement, since in the event of a failure of one MEMS element, other MEMS elements in a MEMS element array will also remain functional.

[0103] The average person skilled in the art recognizes that technical effects and advantages applicable to geometric designs of an antenna array, particularly with regard to beamforming of signals, can also be transferred in an analogous manner to MEMS element arrays, for example, to acoustic signals when using a MEMS converter array.

[0104] In preferred embodiments, the MEMS element array is a MEMS microphone and / or a MEMS loudspeaker array. Acoustic signals can be advantageously amplified and / or received with directional characteristics using a MEMS microphone array. Similarly, acoustic signals can be amplified and / or emitted with directional characteristics using a MEMS loudspeaker array. For the purposes of the invention, an acoustic signal preferably denotes a sound wave. Advantageously, a MEMS microphone array and / or a MEMS loudspeaker is suitable for a variety of advantageous applications in combination with an antenna array on the package substrate and a processing unit, for example, for beamforming optimization, improved localization, and / or noise compensation. Preferably, the reception and / or transmission of signals can be optimized by shaping the package substrate.

[0105] In a further preferred embodiment, the MEMS package is characterized in that the package substrate comprises a package substrate surface, wherein the package substrate surface has at least partially a planar and / or non-planar section, wherein the non-planar section preferably comprises a concave or convex shape.

[0106] Advantageously, the at least one MEMS element and / or the one or more antennas can be applied to a planar and / or a non-planar section, depending on the application, preferably to optimize the reception and / or transmission of signals.

[0107] For the purposes of the invention, a planar section preferably refers to a section of the package substrate that is essentially planar, i.e., flat. The at least one MEMS element and / or the one or more antennas are therefore preferably located in a single plane. High sensitivity with regard to transmitting and / or receiving signals is achieved, in particular, in a preferred direction orthogonal to the plane. For the purposes of the invention, a non-planar section preferably refers to a section of the package substrate that is not planar, i.e., not flat. Preferably, a non-planar section of the package substrate is characterized by one or more bulges.

[0108] Advantageous possibilities also arise for mounting the at least one MEMS element and / or the one or more antennas on a non-planar section of the package substrate. Preferably, the non-planar section comprises a concave or a convex shape. In the context of the invention, this can be described analogously as a concave or a convex section.

[0109] In a preferred embodiment, a non-planar section is in the form of a convex section. Preferably, a convex section or a convex configuration of the package substrate is characterized by an inward curvature or a curvature opposite to the receive or transmit direction of the antennas and / or MEMS elements. In the preferred embodiment, the at least one MEMS element or the one or more antennas are thus located in a depression on the surface of the package substrate.

[0110] An arrangement of one or more antennas, preferably in the form of an antenna array, on a convex section can advantageously support the focusing of transmitted and / or received electromagnetic signals, thereby increasing directivity. This also applies analogously to transmitted and / or received signals for the at least one MEMS element. For example, an arrangement of acoustic MEMS transducers can support the focusing of received or transmitted acoustic signals.

[0111] In a preferred embodiment, a non-planar section is in the form of a concave section. Preferably, a concave section or a concave configuration of the package substrate is characterized by an outward curvature or a curvature in the receive or transmit direction of the antennas and / or MEMS elements. In the preferred embodiment, the at least one MEMS element or the one or more antennas are thus located on a raised area of ​​the surface of the package substrate.

[0112] For example, if one or more antennas are located on a concave section, preferably in the form of an antenna array, a maximum possible transmission or reception angle can be achieved. This allows for the advantageous reception and / or transmission of electromagnetic signals with particularly wide angles. A similar effect occurs when, for example, at least one MEMS element is mounted on a concave section, such as a MEMS transducer, MEMS microphone, or MEMS loudspeaker. Advantageously, optimal geometric shapes and / or sections of the package substrate can be easily formed using preferred methods for providing the package substrate, in particular an additive manufacturing process (3D printing), preferably a multi-material additive manufacturing process.

[0113] In another preferred embodiment, the MEMS package is characterized in that the at least one MEMS element and the one or more antennas are located on the same non-planar section.

[0114] In certain embodiments, it may be preferred to provide the at least one MEMS element and / or the one or more antennas on different non-planar sections. Advantageously, the shape of the non-planar sections can be adapted separately to the desired receiving or transmitting characteristics of the antennas or MEMS elements.

[0115] In other embodiments, a particularly compact MEMS package can be provided by attaching at least one MEMS element and one or more antennas along the same non-planar section. This package is characterized by a simple design and excellent integration possibilities. For example, the device can have a plurality of MEMS elements as a MEMS element array, with these arranged intercalating with an array of antennas (see, among others, [reference]). Fig. 3 ).

[0116] In a further preferred embodiment, the MEMS package is characterized in that the package substrate has one or more recesses, wherein the at least one MEMS element is located within the one or more recesses.

[0117] By placing the at least one MEMS element within a recess of a package substrate, optimal protection is advantageously provided. This prevents foreign substances from entering the MEMS component and / or damaging it. By placing the MEMS element in a recess, it is effectively encased or at least partially embedded within the package substrate, thus fulfilling a protective or housing function. Furthermore, a robust and vibration-resistant arrangement can be achieved. This ensures the reliable functionality of the at least one MEMS element or a MEMS element array even in dynamic applications.Furthermore, the insertion of the at least one MEMS element within a recess has proven to be manufacturing-efficient, as electrical and / or mechanical contacts for the at least one MEMS element can be easily applied.

[0118] Furthermore, mounting the at least one MEMS element in a recess is advantageous in that it can achieve beneficial effects for the functionality of the MEMS element itself. For example, a suitable design of the recess can create the necessary rear volume for a MEMS transducer (especially a MEMS loudspeaker) in order to achieve optimal acoustic properties.

[0119] Advantageously, sections such as recesses can also be efficiently obtained by providing the package substrate, for example during the provisioning process using additive manufacturing.

[0120] Preferably, the at least one MEMS element is located within a recess such that the package substrate is at least partially surface-conforming to the at least one MEMS element. A surface-conforming application is, in particular, an application that is essentially directly and tightly in contact with the structures of the MEMS element while maintaining its shape.

[0121] Essentially direct and close-fitting preferably means that the package substrate is mostly directly in contact with the surface, but includes volumes not filled by components in some areas, for example in corner areas or below a wire bond.

[0122] The surface-conforming application of the package substrate is preferably fully surface-conforming. This means, in particular, that the layer is almost perfectly close-fitting and surface-conforming, allowing even the smallest structures to be coated with a close fit. The smallest structures are preferably those with dimensions of a maximum of 10 nanometers (nm), 100 nm, 1 micrometer (µm), 10 µm, or 100 µm.

[0123] In a further preferred embodiment, the MEMS package is characterized in that the at least one MEMS element and / or the one or more antennas and optionally a computing unit are connected to each other via conductor tracks and / or vias, wherein preferably at least partially the conductor tracks and / or the vias are located within the package substrate.

[0124] Preferably, the conductive traces and / or vias serve for the electrical contacting of the components of the preferred MEMS package. Electrical contacting preferably refers to an electrical connection between components of the MEMS package. Thus, conductive traces and / or vias can establish a data connection between the at least one MEMS element, the one or more antennas, and / or the processing unit. In particular, measurement results regarding received and / or transmitted signals, for example, electromagnetic signals from the one or more antennas and / or signals of the at least one MEMS element, can be transmitted to the processing unit so that they can be processed by the processing unit and appropriate software.

[0125] Advantageously, the conductive traces and / or vias can be provided during the manufacturing process of the package substrate, preferably by an additive manufacturing process, and particularly preferably by multi-material additive manufacturing. Thus, electrical contacts via conductive traces and / or vias and the provision of the package substrate can advantageously be carried out in a single, preferably one, process step.

[0126] According to the invention, conductive traces are preferably strips made of a conductive material, which preferably have a greater length than width and are used for electrical connection or contacting. In further preferred embodiments, conductive traces can also have a substantially two-dimensional orientation to provide a conductive plane or metallization plane.

[0127] In the context of the invention, a via preferably refers to a substantially vertical electrical connection for conducting current. The via can preferably be created during the preparation of the package substrate. It is also preferred to create the via after the preparation of the package substrate, for example, by an etching process followed by filling the etched area with an electrically conductive material. A via can preferably extend substantially between a front and back face of the package substrate. It is also preferred that the via does not extend through substantially the entire package substrate, but only to an intermediate layer. Furthermore, it is preferred that the via extends substantially only within the package substrate.

[0128] In a further preferred embodiment, the conductor track and / or the via comprises a material selected from a group of precious metals, i.e. selected from a group comprising gold, platinum, iridium, palladium, osmium, silver, polonium, rhodium, ruthenium, copper, bismuth, technetium, rhenium and / or antimony.

[0129] The aforementioned materials have proven to be particularly reliable for providing electrical connections in the form of conductor tracks and / or vias, as they are easy to process during manufacturing and have high durability, enabling a long-lasting stable electrical connection.

[0130] In a further preferred embodiment, the MEMS package is characterized in that the package substrate comprises a MEMS transducer array, preferably a MEMS microphone array and / or a MEMS loudspeaker array, and an antenna array is located on the package substrate, and the computing unit is configured to allow the antenna array to transmit and / or receive electromagnetic signals and / or the MEMS transducer array to transmit acoustic signals by means of beamforming.

[0131] It is known to the average person skilled in the art that beamforming generally gives signals a directional effect, allowing them to be received and / or transmitted more precisely. This is preferably achieved by utilizing interference effects resulting from a phase shift between received and / or transmitted signals. Accordingly, it is preferred to use an array for beamforming, in particular an antenna array for electromagnetic signals and / or a MEMS converter array for acoustic signals.

[0132] Therefore, it can be advantageous to use beamforming of electromagnetic signals. This involves focusing or aligning electromagnetic waves through the antenna array when receiving and / or transmitting electromagnetic signals. Beamforming of electromagnetic signals results in an extended range and a more stable connection. Furthermore, signal transmission becomes less susceptible to interference, and improved transmission performance with a higher data rate is achieved.

[0133] It is also preferred to use acoustic beamforming to receive and / or transmit targeted acoustic signals via a MEMS transducer array, preferably a MEMS microphone array and / or a MEMS loudspeaker array. Acoustic beamforming also offers a wide range of applications. For example, beamforming during the reception of acoustic signals can be used to create spatially resolved two- and / or three-dimensional acoustic sound recordings (photos or videos), which represent a powerful tool for sound analysis and / or noise reduction. Multiple sound sources can be localized and separated from one another. Furthermore, acoustic beamforming offers significant potential for optimizing sound transmission in both enclosed and open spaces.

[0134] For beamforming itself, it is preferred that appropriate software is installed on the processing unit. Thus, the processing unit is configured to perform the necessary calculations for beamforming. Preferably, filters such as analog and / or digital filters, as well as phase shifters, can be used for beamforming.

[0135] Consequently, the preferred MEMS package comprising a MEMS loudspeaker array and / or MEMS microphone array is advantageously suited for use in both acoustic and electromagnetic beamforming.

[0136] In another preferred embodiment, the MEMS package is characterized in that the MEMS package includes a computing unit which is configured to perform reciprocal processing of the electromagnetic signals and the acoustic signals for beamforming.

[0137] Particularly preferably, the MEMS package can be designed for transmitting, receiving, and processing electromagnetic and acoustic signals and comprise a first antenna array for transmitting electromagnetic signals, a second antenna array for receiving electromagnetic signals, a MEMS microphone array for receiving acoustic signals, a MEMS loudspeaker array for transmitting acoustic signals, and a computing unit, wherein the computing unit is configured such that the electromagnetic and / or acoustic signals are transmitted and received by the device by means of beamforming, wherein combined and / or reciprocal processing of electromagnetic and acoustic signals is performed for the beamforming.

[0138] Mutual processing for beamforming acoustic and electromagnetic signals has proven to be particularly advantageous in many aspects.

[0139] By using a combination of electromagnetic and acoustic signals, it is advantageously possible to achieve a significant improvement in localization accuracy. This higher accuracy is primarily due to the fact that both types of signals can be used for position determination.

[0140] In contrast, prior art techniques were always limited to beamforming for only one type of signal, for example, beamforming of acoustic signals or electromagnetic signals. Acoustic signals generally allow for a good rough estimation of position, while electromagnetic signals are particularly suitable for fine estimation.

[0141] Acoustic signals in acoustic channels can also be subject to noise. This can have many different causes and is associated with various types of noise. With electromagnetic signals, the problem of multipath propagation is particularly prevalent.

[0142] Further problems with the transmission of electromagnetic signals include noisy radio channels over ISM bands (Industrial, Scientific and Medical bands) used for WLAN or Bluetooth. Many systems use these frequency bands, which can lead to limitations in signal quality.

[0143] In a preferred embodiment, it is preferred that, for example, acoustic signals are used for a rough estimate of the position and electromagnetic signals for a fine estimate. For example, by means of a rough estimate of the acoustic signals, the antenna arrays for the electromagnetic signals can be directed towards the source, whereby the processing by the acoustic signals, due to the rough estimate, exhibits a high error tolerance with regard to position determination. The antenna arrays responsible for beamforming the electromagnetic signals can then be directed towards an area that was initially (roughly) determined by the acoustic signals.

[0144] Processing high-resolution electromagnetic signals further reduces error tolerance and allows for more precise position determination. This represents a departure from the prior art, as both signal types—electromagnetic and acoustic—are used in combination for position determination. By utilizing both signal types, it is possible to determine the position with greater accuracy, employing both a coarse estimate from the acoustic signals and a fine estimate from the electromagnetic signals.

[0145] Another advantage of the preferred reciprocal processing using the preferred MEMS package is that the computing power can be significantly reduced, especially in the case of position determination and / or optimization of the beam alignment.

[0146] For example, the MEMS loudspeaker array can be automatically aligned to the position calculated by the antenna arrays. This eliminates the need for the MEMS microphone array to capture and / or process additional acoustic signals. Instead, the MEMS loudspeaker array can be directly aligned with the source of the electromagnetic signals. Conversely, the microphone array can also serve as the basis for beamforming the electromagnetic signals. Suitable algorithms can thus leverage synergies to optimize the computing power required for beamforming.

[0147] An additional advantage of the preferred MEMS package is its suitability for transmitting stereo effects. A stereo effect creates a spatial sound impression when listening to two or more sound sources. The preferred MEMS package is particularly advantageous for transmitting highly precise stereo effects, utilizing both electromagnetic antenna arrays and MEMS loudspeakers or MEMS microphone arrays.

[0148] Beamforming acoustic signals during transmission using the loudspeaker array allows for targeted transmission to the parallax of both ears. Simultaneously, reception (via the microphone arrays) remains focused on the mouth. This is particularly advantageous because it enables precise separation between the simultaneous transmission and reception of acoustic signals. At the same time, electromagnetic arrays can be used to more accurately determine the speaker's position—for example, using a mobile device or reflectors—or to optimize data exchange with a mobile device through beamforming.

[0149] Particularly in open-plan offices or other locations where several people are present and communicating simultaneously, preferred configurations of the MEMS package can be highly advantageous for use as a hands-free system. For example, it can allow a user to move freely around an open-plan office while conducting a telephone conversation with excellent sound quality, supported by the MEMS package. The audio signals for listening and speaking are transmitted directly to the user via beamforming. Cumbersome handling of headsets or the mobile device is unnecessary.

[0150] Furthermore, the MEMS package can be used to emit highly precise acoustic signals via beamforming to compensate for unwanted noise. This can be used, for example, in the workplace in an open-plan office or in a vehicle. The MEMS package can determine the direction from which the unwanted sound originates by beamforming received acoustic signals using a MEMS microphone array and / or antenna arrays. For noise compensation, an acoustic signal is emitted that is configured to cancel out the interfering sound using destructive interference. For example, the MEMS package can generate a counter-signal that corresponds to the interfering sound but has the opposite polarity. Such a signal is also known as anti-noise.

[0151] The preferred embodiment of a MEMS package with a MEMS loudspeaker array, MEMS microphone array and one (or two) antenna arrays thus offers particular advantages where hands-free operation is used and / or targeted noise compensation is desired, for example in open-plan offices, vehicles, exhibition halls, concert halls, etc.

[0152] Mutual processing of electromagnetic and acoustic signals preferably means that the acoustic signals can be a basis for beamforming the electromagnetic signals or that the electromagnetic signals can be a basis for beamforming the acoustic signals.

[0153] Combined processing preferably means that electromagnetic and acoustic signals in combination form a basis for beamforming of one of the two signal types or for both signal types in combination.

[0154] In a preferred embodiment, the sending and / or receiving of electromagnetic signals includes processing of received acoustic signals.

[0155] In particular, acoustic signals can preferably be received from the MEMS package and used for beamforming the electromagnetic signals. The received acoustic signals, transmitted by a microphone array, allow for a rough estimation of the position, especially for localization purposes. Specifically, this rough estimation is preferably performed by software, at least partially installed on a computing unit. Based on this rough estimation, an antenna array can initially transmit electromagnetic signals to a determined position, with fine-tuning possible based on the received electromagnetic signals.

[0156] In a preferred embodiment, the sending and / or receiving of acoustic signals includes processing of received electromagnetic signals.

[0157] It can also be advantageous to selectively transmit and / or receive acoustic signals based on the received electromagnetic signals (via an antenna array). Using the received electromagnetic signals, acoustic signals can be transmitted via beamforming through the loudspeaker array or selectively received by the microphone array. This allows sound to be advantageously emitted precisely to or received from a desired area. As explained earlier, this allows, for example, sound to be transmitted more precisely to a user's hearing or received by a speech organ, so that telephone calls, listening to music, etc., can continue with undiminished quality even while a user moves around the room. The improved localization resulting from the analysis of electromagnetic signals allows for an improvement in the quality and beamforming of the acoustic signals.

[0158] In a preferred embodiment, the sending and / or receiving of electromagnetic and / or acoustic signals includes processing of received acoustic and electromagnetic signals.

[0159] This has the advantage that a constant exchange of electromagnetic and acoustic signals takes place through the sending and / or receiving of these signals, allowing the position to be determined with high precision by a processing unit. This also means that, for example, during a telephone call, the signal quality of neither the acoustic nor the electromagnetic signals suffers, as a combined processing method optimizes beamforming for both signal types.

[0160] The targeted exchange of electromagnetic signals via beamforming can be supported, for example, by wearing a WiFi tag. In particular, one or more antenna arrays, a MEMS speaker array, and / or a MEMS microphone array can connect to the WiFi tag. It may also be preferred that the continuous exchange of electromagnetic signals takes place between the device according to the invention and another device, for example, a smartphone carried by the user. Any device that can emit suitable electromagnetic signals can be used for improved positioning of the user. Advantageously, with regard to hands-free systems, this largely eliminates the need for peripheral devices such as headphones or headsets.

[0161] The possibilities for using combined and / or reciprocal processing of acoustic or electromagnetic signals are manifold. In the prior art, beamforming was performed in isolation for only one type of signal. It therefore represents a significant departure from the prior art to transmit electromagnetic signals while processing received acoustic signals (or vice versa) and / or to receive / transmit acoustic / electromagnetic signals based on combined processing of both signal types.

[0162] In preferred embodiments, the transmission and / or reception of electromagnetic signals can be carried out using a first and a second antenna array. In further preferred embodiments, the transmission and / or reception of electromagnetic signals can be carried out using a single antenna array. The first and second antenna arrays can thus be combined in one antenna array, for example in the form of an antenna array operating in half-duplex mode.

[0163] In another preferred embodiment, the MEMS package is characterized in that the MEMS package includes a computing unit which is configured to perform localization of objects and / or users via received and / or transmitted electromagnetic signals and acoustic signals.

[0164] The device according to the invention can preferably use various localization methods to locate objects and / or users. The preferred methods are named according to the information they use for position determination: connection information (CoO, Cell of Origin), reception angle of the signals (AoA, Angle of Arrival), reception times of the signals (ToA, Time of Arrival), bidirectional round-trip time of the signal (RToF, Round-trip Time of Flight), time differences of the incoming signals (TDoA, Time Difference of Arrival), and signal strengths of the incoming signals (RSSI, Received Signal Strength Indicator).

[0165] It is known that connection information is present in almost every wireless network. The accuracy of this method depends on the granularity and size of the cells in the network. This method, also called "Cell of Origin" (CoO), determines the position based on the fixed nodes associated with the mobile node. Each fixed node, and therefore each cell, is assigned a unique identifier (Cell ID). The positions of the fixed nodes must be known.

[0166] The angle-of-arrival (AoA) method uses the angles of incidence of the received signals. This requires at least two fixed nodes with directional antennas. The angle of incidence of the signal received from a mobile node can be determined. The distance to the known positions of the fixed stations is calculated using triangulation. This involves utilizing the angular relationships within a triangle. The position of the mobile node can then be calculated from the known distance between the fixed nodes and the two measured angles of incidence.

[0167] The Time-of-Arrival (ToA) method determines the distance between two nodes based on the signal propagation time. The transmitted frame contains the transmission time t0, allowing the distance d to be calculated at the receiver from the reception time t1 and the signal propagation speed c. The ToA method typically requires highly precise synchronization of clocks located at both nodes to accurately determine the propagation time.

[0168] In the Return-to-Flight (RToF) method, the transit time of a signal is measured. The receiver acknowledges receipt of the signal with an acknowledgement frame, which also includes the processing time at the receiver (tp). Synchronization of the nodes' clocks is unnecessary, as no absolute times between sender and receiver are required. Generating the acknowledgement frame at the receiver takes a relatively long time compared to the signal transit time. This leads to a measurement error if the clocks of both nodes drift apart during the measurement (clock drift). This error can be compensated for if RToF is initiated from both sides. Once the distances to at least three fixed nodes are determined, a position in two-dimensional space can be calculated using trilateration.In contrast to triangulation, trilateration only requires the distances to the fixed nodes, making this method significantly easier to implement, as the hardware requirements for distance measurement are much lower than those for determining the angle of incidence of a received signal.

[0169] The term TDoA refers to two different methods. In one TDoA method, a node simultaneously transmits two signals with different propagation speeds. The distance to the transmitter can be determined at the receiver from the different reception times, t0 and t1. Typically, an ultrasonic signal is used in addition to a radio signal. Since the speed of light is significantly greater than the speed of sound, the travel time of the radio signal can be neglected when calculating the distance d. In the other TDoA method, stationary receivers calculate the position of a mobile transmitter from the difference in the signal reception times. This method is also known in mobile communications as Observed Time Difference of Arrival (OTDoA). The advantage over the ToA method is that no synchronization between the mobile and stationary nodes is required.Therefore, a high-precision clock is not needed in the mobile nodes.

[0170] RSSI methods are techniques that use received signal strengths for position determination. When calculating the distance to a stationary node, free-space path loss is taken into account, which states that signal strength decreases quadratically with distance from the transmitter. The position of the mobile node in two-dimensional space can then be calculated using trilateration. Most RSSI methods use fingerprinting for localization within buildings. A fingerprinting method uses a radio map in which signal strengths are stored along with their corresponding positions. The process is divided into two phases. In the calibration phase, the received signal strengths at predefined positions are stored in the radio map. In the localization phase, the mobile node moves within the same environment. During this time, the currently measured signal strength values ​​are compared with those in the radio map.Metrics for comparing signal strength values ​​include the Euclidean distance, the Bayes algorithm, or the Delaunay triangulation with constant signal strength characteristics.

[0171] In particular, a preferred MEMS package can utilize these capabilities and / or several of these capabilities in combination for position determination. Both acoustic and / or electromagnetic signals can be used for localization. For example, it may be preferred that localization is achieved via a superposition of triangulation systems, e.g., the AoA method with acoustic signals and the AoA method for electromagnetic signals. However, it may also be preferred that different and multiple superpositions of localization methods are used.

[0172] For the purposes of the invention, a radio network preferably refers to a communication network in which information is transmitted by means of electromagnetic signals. Preferably, a radio network is a wireless telecommunications network in which radio technology methods, in particular the aforementioned methods for determining position, can be used. Preferably, a radio network comprises several network nodes, which also represent connection points for data transmission. A network node can, in particular, be an intermediate node or an end node in the data transmission.

[0173] Wireless networks can be classified in various ways. Classification is based in particular on the coordination of network nodes in the infrastructure network or ad-hoc network. Furthermore, the wireless technology used can be considered, especially Bluetooth (IEEE 802.15, WPAN), WLAN (IEEE 802.11), WiMAX (IEEE 802.16), GSM, UMTS, and / or 5G. The communication relationship of the systems is also important, since, for example, a transmitter can send to one receiver (unicast), to all possible receivers (broadcast), to a defined group of all receivers (multicast), or to (at least) one receiver from a group (anycast). Advantageously, the device according to the invention can connect to various wireless networks, including those mentioned above, and / or perform beamforming with these devices.

[0174] In a further preferred embodiment, the transmitted and / or received acoustic signals are used for a rough estimate and the transmitted and / or received acoustic signals are used for a fine estimate of the localization.

[0175] A rough estimate preferably refers to a localization with an angular accuracy of approximately 1° to approximately 20° and a spatial accuracy of approximately 5 m to approximately 50 m, while a fine estimate preferably refers to an angular accuracy of approximately 0.5° to approximately 5° and a spatial accuracy of approximately 0.1 m to approximately 5 m.

[0176] Terms such as "essentially", "approximately", "about", "about", etc. preferably describe a tolerance range of less than ± 40%, preferably less than ± 20%, particularly preferably less than ± 10%, even more preferably less than ± 5%, and particularly less than ± 1%, and always include the exact value. "Similarly" preferably describes quantities that are approximately equal. "Partially" preferably describes at least 5%, particularly preferably at least 10%, and particularly at least 20%, and in some cases at least 40%.

[0177] The MEMS package according to the invention has proven to be particularly advantageous for providing such combined beamforming of both acoustic and electromagnetic signals, since the integration of the required arrays of MEMS microphones, MEMS loudspeakers and / or antennas is possible in a particularly simple way.

[0178] A MEMS loudspeaker or MEMS microphone preferably refers to a loudspeaker or microphone based on MEMS technology, the sound-generating or sound-receiving structures of which have at least partial dimensions in the micrometer range (1 µm to 1000 µm). Preferably, a vibrating diaphragm may have dimensions of less than 1000 µm in width, height, and / or thickness.

[0179] The vibrating membrane is preferably configured to generate or receive pressure waves from the fluid. The fluid can be either gaseous or liquid, preferably sound pressure waves. A MEMS microphone or MEMS loudspeaker thus preferably converts pressure waves (e.g., acoustic signals as alternating sound pressures) into electrical signals or vice versa (conversion of electrical signals into pressure waves, for example, acoustic signals). The processing unit can preferably control and / or read the vibrating membrane, whose vibrations are generated, for example, by piezoelectric, piezoresistive, or capacitive components on the membrane.

[0180] For example, capacitive MEMS microphones can preferably be manufactured in highly automated processes, ideally using semiconductor technologies. In this process, layers of different materials are first deposited on a wafer. Unneeded material is then removed by etching. This allows for the creation of a movable, vibrating diaphragm and, optionally, a back wall over a cavity in the wafer. The back wall can be designed as a rigid structure that, thanks to perforations / openings, also allows air to flow through it. The diaphragm is preferably a sufficiently thin, vibrating structure that deflects under the influence of the air pressure changes caused by the sound waves. While the diaphragm vibrates, the thicker back wall remains stationary, as air can flow through its openings.The movement of the diaphragm causes a change in the capacitance between it and the back panel. This change in capacitance can be converted into an electrical signal by an electrical circuit built into the MEMS microphone, such as an ASIC, or by the central processing unit. The electrical circuit measures voltage changes that occur when the capacitance between the diaphragm and the rigid back panel changes because the flexible diaphragm moves under the influence of sound waves. A sound inlet can be located, for example, either in the top (top-port design) or on the bottom near the solder pads (bottom-port design).

[0181] A MEMS loudspeaker can be constructed like a MEMS microphone, but work in reverse, i.e., an electrical signal generated by the electrical circuit causes the vibrating diaphragm to move, thus emitting sound.

[0182] MEMS microphones and / or MEMS loudspeakers are characterized by their compact design, making them easy to arrange in arrays in the package substrate according to the invention and making them particularly suitable for applying beamforming to acoustic signals.

[0183] Preferably, the microphones and loudspeakers in their array configuration, in particular the MEMS microphones and the MEMS loudspeakers, have a distance between them that is less than half the wavelength of the acoustic signal, in particular to satisfy the Nyquist-Shannon sampling theorem.

[0184] MEMS technology preferably allows a large number of MEMS loudspeakers and / or MEMS microphones, for example 5, 10, 20, 50, 100 or 500 or more, to be arranged in any formation as an array and to advantageously use the described localization methods such as AOA, TOA, TDOA etc. for beamforming.

[0185] By providing the package substrate, separate encapsulation of the numerous MEMS elements is not necessary; instead, they can be easily and compactly integrated into a single MEMS package.

[0186] In a preferred embodiment, the one or more antennas for receiving and / or transmitting electromagnetic signals comprise phased-array antennas.

[0187] A phased-array antenna is typically a grouped antenna whose individual radiators can be fed with different phases. As a result, the overall antenna pattern can be electronically steered. Electronic steering is advantageously much more flexible and requires less maintenance than mechanical steering of the antenna. The key principle of phased-array antennas is that of interference, i.e., a phase-dependent superposition of two or (usually) more radiators. This means that signals in phase reinforce each other, and signals out of phase cancel each other out. Therefore, if two radiators transmit a signal at the same time, superposition occurs – the signal is amplified in the main direction and attenuated in the secondary directions. If the signal to be transmitted is then routed through a phase-controlling module, the radiation direction can be electronically controlled.This is generally not possible indefinitely because the effectiveness of this antenna arrangement is greatest in a main direction perpendicular to the antenna array. With an extreme shift of the main direction, the number and size of unwanted sidelobes increase, while simultaneously reducing the effective antenna area. The necessary phase shift can be calculated using the law of sines. Any antenna design can be used as a radiator in an antenna array. For a phased-array antenna, it is important that the individual radiators are driven with a controlled phase shift, thus changing the main direction of radiation. To achieve focusing both horizontally and vertically, a large number of radiators are preferably used in an antenna array.

[0188] The use of phased-array antennas for electromagnetic signals offers several advantages. Among other things, phased-array antennas provide high antenna gain combined with high sidelobe attenuation. Antenna gain encompasses both the directivity and efficiency of an antenna. Furthermore, the ability to change the beam direction rapidly, within microseconds, is a significant advantage. Another major benefit is the very fast beamforming, particularly beam transformation, also known as beam agility. In addition, phased-array antennas can cover any desired area or region within a room. They also feature freely selectable target illumination durations, enabling continuous and reliable transmission of electromagnetic signals.It is also worth noting that the simultaneous generation of multiple beams enables multifunctional operation. A significant advantage here is that the failure of a single component does not necessarily lead to a complete system failure.

[0189] Phased array antennas can be designed as linear and / or planar arrays.

[0190] Linear phased-array antennas comprise rows that are jointly controlled by a phase shifter. Therefore, only one phase shifter is required per antenna row. A large number of vertically stacked linear arrays form a planar antenna. This advantageously results in a particularly simple arrangement. However, beam steering is usually only possible in one plane.

[0191] Planar phased-array antennas are preferably composed entirely of individual elements, each with its own phase shifter. Each individual radiator requires its own phase shifter. The elements are arranged as if in a matrix; the planar arrangement of all elements forms the entire antenna. Advantageously, this design incorporates beam steering in two planes.

[0192] In another aspect, the invention relates to a method for manufacturing a MEMS package according to one or more of the attached claims, comprising the following steps: a) Provision of a package substrate and / or conductor tracks by an additive manufacturing process, preferably a multi-material additive manufacturing process, b) at least partial embedding of at least one MEMS element comprising a MEMS interaction area, such that at least the MEMS interaction area remains free, c) attachment of one or more antennas to the package substrate, d) optional attachment of a computing unit to or in the package substrate.

[0193] The average person skilled in the art recognizes that the technical features, definitions, and advantages of preferred embodiments disclosed for the MEMS package according to the invention apply equally to a method for its manufacture, and vice versa. Advantageously, the package substrate can be provided particularly easily and efficiently by using an additive manufacturing process, preferably a multi-material additive manufacturing process. A particularly advantageous aspect is that components such as conductive traces and / or vias can be applied during the creation of the package substrate to provide electrical connections. Thus, the components do not need to be applied to the package substrate subsequently. Instead, the package substrate with components such as conductive traces already present on it can be manufactured with exceptional process efficiency.

[0194] Furthermore, it is a significant advantage that additive manufacturing allows for particularly simple shaping of the package substrate. This enables the creation of fine structures on the package substrate with high precision, such as planar sections, non-planar sections (e.g., concave and / or convex sections), and / or recesses for the subsequent placement of MEMS elements.

[0195] Furthermore, the preferred method is also well-suited for mass production, enabling the manufacture of a high number of MEMS packages within a relatively short time and at low production costs. Thus, the preferred method advantageously achieves considerable economic efficiency. It is particularly advantageous that the individual MEMS packages exhibit essentially identical properties with respect to their dielectric characteristics, especially with respect to their relative permittivity, when mass-produced. For example, the individual MEMS packages have essentially the same relative permittivities, which ensures both particularly reliable manufacturing and optimal suitability for high-frequency applications.

[0196] Preferably, the package substrate and / or conductor tracks are first provided by an additive manufacturing process, preferably by a multi-material additive manufacturing process. Preferably, the package substrate model is first placed in a suitable system for carrying out the additive manufacturing process. In particular, it is preferred that the package substrate is designed such that it has planar and / or non-planar sections. Furthermore, it is preferred that the package substrate has recesses for MEMS elements.

[0197] After the package substrate has been provided, it is preferred that at least one MEMS element comprising a MEMS interaction area be embedded in the package substrate such that the MEMS interaction area remains free. The preferred cutouts in the package substrate make the at least partial embedding of the at least one MEMS element within the package substrate particularly easy.

[0198] Preferably, one or more antennas are attached to the package substrate, with which electromagnetic signals can be received and / or transmitted.

[0199] Furthermore, it is preferred that a computing unit is optionally mounted on or within the package substrate. Preferably, the computing unit is configured to perform computational operations for applications involving the processing of electromagnetic signals and / or signals that can be received or transmitted using the at least one MEMS element. Advantageously, components of the preferred MEMS package, such as the at least one MEMS element, the one or more antennas, and / or the computing unit, are interconnected by electrical contact via conductor tracks and / or vias.

[0200] The aspects of the invention, in particular the preferred MEMS package, will be explained in more detail below using examples, without being limited to these examples. FIGURES Brief description of the characters

[0201] Fig. 1Schematic representation of a preferred MEMS package Fig. 2 Schematic representation of a functional principle of a preferred MEMS package Fig. 3 Further schematic representation of a preferred MEMS package Detailed description of the figures

[0202] Fig. 1 shows a schematic representation of a preferred MEMS package 1. The MEMS package 1 includes a package substrate 3 and several MEMS elements 11 in the form of a MEMS element array 15, where the MEMS elements shown here 11 acoustic MEMS transducers (MEMS microphones and / or MEMS loudspeakers) are formed. The MEMS elements 11 lie at least partially in the package substrate 3 embedded so that the interaction area of ​​each MEMS element 11 (especially the vibrating diaphragm of the MEMS microphones) remains unobstructed. On the package substrate 3 Are the antennas located?7 for transmitting and / or receiving electromagnetic signals. The antennas 7 lie as an antenna array 9 before. Here, the package substrate acts. 3 as an antenna substrate for the antennas 7.

[0203] The inventors have recognized that this will improve the package substrate. 3 for MEMS elements 11 simultaneously as an antenna substrate 3 can function. However, an antenna substrate can also 3 as a package substrate 3 This represents a departure from the prior art, according to which antennas are applied to an antenna substrate comprising a dielectric material, while the package substrate 3 for MEMS elements 11 It is used solely to fulfill a housing or protective function. However, according to the invention, it was recognized that the package substrate 3 Requirements for MEMS elements 11 and for antennas7 equally fulfilled.

[0204] The MEMS package 1 can be achieved by installing antennas 7 and MEMS converters 11 It can be advantageously used in a variety of applications where the exchange and / or processing of acoustic and / or electromagnetic signals is required. The MEMS package advantageously features 1 a particularly compact design, preferably with a monolithic integration of MEMS converters 11 and antennas 7 on or in the same package substrate 3 This is done. Furthermore, the MEMS package is suitable 1 Advantageous for efficient integration into a wide variety of devices due to the compact geometric shape of the package substrate. 3, which can be adapted through manufacturing processes, for example through additive manufacturing.

[0205] The one in Fig. 1MEMS package shown 1 includes a package substrate 3 Comprehensive low-temperature single-firing ceramic (LTCC). LTCC has proven particularly well-suited to fulfill dielectric functions and to act as an antenna substrate. Simultaneously, the package substrate serves 3 to fulfill a protective function for the MEMS elements 11. Furthermore, LTCC is ideally suited for use in an additive manufacturing system to produce the package substrate. 3 to provide. Therefore, a desired and precise geometric design of the package substrate can be achieved. 3 can be achieved.

[0206] In particular, the package substrate exhibits 3 planar and non-planar sections, with the non-planar sections in Fig. 1 The MEMS elements are present as concave sections. 11are within a concave section of the package substrate 3 embedded and the antennas 7 They are also located on another concave section. The advantage of mounting them on a concave section is that the MEMS transducers can receive and / or transmit acoustic signals with particular precision and focus, and the antennas can receive and / or transmit electromagnetic signals with particular precision and focus.

[0207] The MEMS elements 11 are located within recesses of the package substrate 3, so that the MEMS elements 11 advantageously robust within the package substrate 3 are embedded. Furthermore, the recess also provides sufficient back volume for a MEMS converter. 11, so that the acoustic properties as such can be advantageously promoted by the recess.

[0208] In addition, a computing unit 5 on the package substrate 3 attached. The computing unit 5 is configured to receive data from the antennas 7 and / or the MEMS converter 11 to process, for example for beamforming to amplify and achieve a directional effect of received and / or transmitted electromagnetic and / or acoustic signals.

[0209] Through conductor tracks 13, those within the package substrate 3 Once installed, a data connection exists between the MEMS converters. 11, the computing unit 5 and / or the antennas 9 This allows data exchange between the named components via the conductor tracks. 13 take place.

[0210] Fig. 2 This is a schematic representation of how the MEMS package works. 1 The unit of calculation 5The terms "logic" and "distribution network" are to be used to explain the computing unit. 5 It is configured to perform computational operations for processing transmitted and / or received electromagnetic and / or acoustic signals. In particular, the distribution network is intended to emphasize the control of the antennas. 7 This allows, for example, adjustments to the positioning and / or direction for transmitting and / or receiving electromagnetic signals. For instance, a rough estimate can be made using received acoustic signals during localization, while the antennas... 7 They can be aligned accordingly and used for fine-tuning. Therefore, the MEMS package allows... 1Suitable applications are fulfilled that rely on the processing of electromagnetic and acoustic signals. Consequently, improvements in localization can be achieved, for example, through the mutual processing of electromagnetic and acoustic signals.

[0211] Fig. 3 This is another schematic representation of an embodiment of the MEMS package. 1 This is shown in this embodiment of the MEMS package. 1 MEMS converters are located 11 as well as the antennas 7 on the same non-planar section of the package substrate 3. The non-planar section has a concave shape. MEMS microphones are attached. 11 and antennas 7 On or within the same concave section, a particularly compact arrangement of components results, which can also be advantageously manufactured in an efficient manner. REFERENCE MARK LIST

[0212] 1MEMS-Package 3Packagesubstrat 5Recheneinheit 7Antenne 9Antennenarray 11MEMS-Element 13Leiterbahn 15MEMS-Element-Array BIBLIOGRAPHY

[0213] Izadpanah Toos, Saber & Moradi, Ghazal & Ebrahimi, Amir. (2019). MEMS packaging review. 10.13140 / RG.2.2.17074.35522. Dehé, A., Wurzer, M., Füldner, M., & Krumbein, U. (2013). A4. 3-The infineon silicon MEMS microphone. Proceedings Sensor 2013, 95-99. Stanimirović, Ivanka, and Zdravko Stanimirović (2014). "MEMS Packaging: Material Requirements and Reliability." Pozar, David M. "A review of aperture coupled microstrip antennas: History, operation, development, and applications." University of Massachusetts at Amherst (1996): 1-9. Kumar, Arvind, and S. Raghavan. "A review: substrate integrated waveguide antennas and arrays." Journal of Telecommunication, Electronic and Computer Engineering (JTEC) 8.5 (2016): 95-104. Bozzi, Maurizio, Anthimos Georgiadis, and Kaijie Wu. "Review of substrate-integrated waveguide circuits and antennas." IET Microwaves, Antennas & Propagation 5.8 (2011): 909-920.

Claims

1. MEMS package (1) comprising a. a package substrate (3), b. at least one MEMS element (11) comprising a MEMS interaction region, wherein the at least one MEMS element (11) is present at least partially embedded in the package substrate (3), such that at least the MEMS interaction region remains free, wherein one or more antennas (7) for transmitting and / or receiving electromagnetic signals are present on the package substrate (3), wherein the package substrate (3) functions as an antenna substrate for the one or more antennas (7), wherein the package substrate (3) in the MEMS package (1) fulfills a housing and / or protective function for the MEMS element (11) and at a same time an active connection with an environment is present, such that the at least one MEMS element (11) can receive a signal from the environment and / or transmit a signal to the environment characterized in that the at least one MEMS element (11) and / or the one or more antennas (7) are present on a non-planar section.

2. MEMS package (1) according to the previous claim characterized in that the package substrate (3) comprises a dielectric material, wherein preferably the dielectric material is selected from a group comprising low temperature cofired ceramics, LTCC, and / or high-temperature cofired ceramics, HTCC.

3. MEMS package (1) according to one or more of the preceding claims characterized in that the package substrate (3) comprises a dielectric material, wherein the material exhibits a relative permittivity εr of greater than 1, preferably between 1 - 10, particularly preferably between 2 - 8, very particularly preferably between 5 - 10.

4. MEMS package (1) according to one or more of the preceding claims characterized in that the MEMS package (1) exhibits a computing unit (5), which is preferably present on or in the package substrate (3).

5. MEMS package (1) according to one or more of the preceding claims characterized in that one or more antennas (7) are present as patch antennas.

6. MEMS package (1) according to one or more of the preceding claims characterized in that the MEMS package (1) comprises a plurality of antennas (7) in the form of an antenna array (9), wherein the antenna array (9) preferably comprises at least 2, 3, 4, 5, 6, 7, 8, 9, 10 or more antennas (7).

7. MEMS package (1) according to one or more of the preceding claims characterized in that the at least one MEMS element (11) is selected from a group comprising a MEMS transducer, preferably a MEMS microphone (11) or a MEMS loudspeaker, and / or a MEMS sensor, preferably a MEMS flow sensor or a MEMS gas sensor.

8. MEMS package (1) according to one or more of the preceding claims characterized in that a MEMS element array comprising a plurality of MEMS elements (11) is present at least partially embedded in the package substrate (3), wherein preferably the MEMS element array (15) comprises at least 2, 3, 4, 5, 6, 7, 8, 9, 10 or more MEMS elements (11) and / or wherein preferably the MEMS element array (15) comprises a MEMS microphone array and / or a MEMS loudspeaker array.

9. MEMS package (1) according to one or more of the preceding claims characterized in that the package substrate (3) comprises a package substrate surface, wherein the package substrate surface exhibits at least partially a planar and / or non-planar section, wherein preferably the non-planar section comprises a concave or convex configuration.

10. MEMS package (1) according to one or more of the preceding claims characterized in that the at least one MEMS element (11) and the one or more antennas (7) are present on the same non-planar section.

11. MEMS package (1) according to one or more of the preceding claims m characterized in that the package substrate (3) exhibits one or more recesses, wherein the at least one MEMS element (11) is present within the one or more recesses.

12. MEMS package (1) according to one or more of the preceding claims characterized in that the at least one MEMS element and / or the one or more antennas (7) and optionally a computing unit (5) are connected to one another by means of conductor tracks (13) and / or vias, wherein preferably the conductor tracks (13) and / or the vias are at least partially provided within the package substrate (3).

13. MEMS package (1) according to one or more of the preceding claims characterized in that the package substrate (3) exhibits a MEMS transducer array (15), preferably a MEMS microphone array and / or a MEMS loudspeaker array, and an antenna array (9) is present on the package substrate (3) and the computing unit (5) is configured such that the antenna array (9) transmits and / or receives electromagnetic signals and / or the MEMS transducer array (15) transmits and / or receives acoustic signals by means of beamforming.

14. MEMS package (1) according to the preceding claim characterized in that MEMS package (1) comprises a computing unit (5) which is configured to perform reciprocal processing of the electromagnetic signals and the acoustic signals for beamforming, wherein the computing unit (5) is preferably configured to perform a localization of objects and / or users via received and / or transmitted electromagnetic signals and acoustic signals.

15. A method for producing a MEMS package (1) according to one or more of the preceding claims, comprising the following steps: a) provision of a package substrate (3) and / or conductor tracks (13) by an additive manufacturing process, preferably a multi-material additive manufacturing process, b) at least partial embedding of at least one MEMS element (11) comprising a MEMS interaction region, such that at least the MEMS interaction region remains free, c) mounting of one or more antennas (7) on the package substrate (3), d) optional mounting of a computing unit (5) on or in the package substrate (3).