LIGHTING DEVICE

Description

Background of the Invention1. Field of the Invention

[0001] The present invention relates to a light emitting element, an illumination device, and a device frame thereof, and more particularly, to a light emitting element providing light in multi-directions, an illumination device including the light emitting element, and a device frame of the illumination device.2. Description of the Prior Art

[0002] A light beam emitted from a light emitting diode (LED) is a kind of directional light source, which is different from a dispersive light source of a conventional bulb. Accordingly, applications of LED are limited. For instance, the conventional LED cannot or may be hard to provide required lighting effect for indoor and outdoor illumination applications. Additionally, conventional LED illumination devices emit light beams from a single side and luminous efficiency of the conventional LED illumination device is relatively low accordingly. KR 2011 0099513 A discloses a light emitting device having a supporting part, and a plurality of LED chips disposed on a surface of the supporting part. Each LED chip is a monolithically integrated array of LED cells on a sapphire substrate, covered by a wavelength conversion layer at least at the top and bottom surfaces thereof, that is fixedly disposed on the supporting part at an inclination facing different directions. When the wavelength conversion layer covers the top surfaces of the LED cells and the bottom surface of the sapphire substrate, but not the side surface of the sapphire substrate, the wavelength conversion layer does not cover the lateral surfaces of the LED cells. US 2007 / 139949 A1 describes a transparent board attached to a metal plate via conductor members. A light emitting element is attached to the transparent board. The light emitting element is covered by a covering member. WO 2012 / 053134 A1 discloses a mounting board being provided which is translucent and has a surface on which an LED is mounted. The mounting board includes a sintered body film having a wavelength shifter which converts a wavelength of light and a sintering binder made of an inorganic material. The wavelength shifter converts a wavelength of light proceeding toward the surface on which the LED is mounted among light emitted by the LED and radiates wavelength-converted light. The sintering binder transmits the light emitted by the LED and the wavelength-converted light.Summary of the Invention

[0003] It is one of the objectives of the present invention to provide a light emitting element providing light in multi-directions, an illumination device including the light emitting element, and a device frame of the illumination device. The purposes of luminous efficiency enhancement, light shape improvement, and cost reduction may then be achieved.

[0004] The object is solved by the features of the independent claim. Preferred embodiments are given in the dependent claims.

[0005] An embodiment of the present invention provides an illumination device. The illumination device includes a first light emitting element and a second light emitting element and a supporting base. Each light emitting element includes a transparent substrate and a plurality of LED chips. The transparent substrate of the first light emitting element has a first support surface and a second main surface disposed opposite to each other. The LED chips of the first light emitting element are disposed on the first support surface and form a first main surface where light is emitted from together with a part of the first support surface without the LED chips. First and second wavelength conversion layers are disposed on the first main surface and the second main surface, respectively. Each of the LED chips includes a substrate, an N-type semiconductor layer, an active layer, and a P-type semiconductor layer. Light emitted from the LED chips of the first light emitting element passes through the transparent substrate of the first light emitting element and emerges from the second main surface. The first and second light emitting elements are disposed on the supporting base, facing different directions, and an angle exists between the light emitting elements and the supporting base, wherein the angle is adjustable according to a light shape requirement of the illumination device.

[0006] In the illumination device of the present invention, each LED chip is fixed on the transparent substrate, and the transparent substrate allows the light beam emitted by the LED chip to pass through. Accordingly, the illumination device in the present invention can emit light in at least multi-directions or all directions. The luminous efficiency of the illumination device may be accordingly enhanced, and the light shape of the illumination device may also be improved.

[0007] These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the embodiment of the present invention that is illustrated in the various figures and drawings.Brief Description of the Drawings

[0008] FIG. 1 and FIG. 2 are schematic structure diagrams illustrating a light emitting element not defining per se the invention as claimed, but illustrating the context of the present invention. FIGs. 3-5 are schematic diagrams illustrating different types of electrical coupling approaches between a light emitting diode chip and conductors not defining per se the invention as claimed, but illustrating the context of the present invention. FIG. 6 and FIG. 7 are schematic diagrams illustrating a disposition of a wavelength conversion layer not defining per se the invention as claimed, but illustrating the context of the present invention. FIG. 8 is a cross-sectional diagram illustrating a light emitting element not defining per se the invention as claimed, but illustrating the context of the present invention. FIG. 9 is a cross-sectional diagram illustrating another light emitting element not defining per se the invention as claimed, but illustrating the context of the present invention. FIG. 10 is a schematic diagram illustrating a light emitting element. FIG. 11 is a schematic diagram illustrating an illumination device including a supporting base not defining per se the invention as claimed, but illustrating the context of the present invention. FIG. 12 is a schematic diagram illustrating a circuit board. FIG. 13 is a schematic diagram illustrating a reflector . FIG. 14 is a schematic diagram illustrating a diamond-like carbon film. FIG. 15 is a schematic diagram illustrating an illumination device. FIG. 16 is a schematic diagram illustrating another illumination device. FIG. 17 is a schematic diagram illustrating an illumination device not defining per se the invention as claimed, but illustrating the context of the present invention. FIGs. 18-20 are schematic diagrams illustrating a transparent substrate inserted in or bonded to a supporting base. FIG. 21 and FIG. 22 are schematic diagrams illustrating an illumination device including transparent substrates bonded to a supporting base with supports not defining per se the invention as claimed, but illustrating the context of the present invention. FIG. 23 is a schematic diagram illustrating another illumination device not defining per se the invention as claimed, but illustrating the context of the present invention. FIG. 24 is a schematic diagram illustrating a device frame of yet another illumination device not defining per se the invention as claimed, but illustrating the context of the present invention. FIG. 25 is a schematic diagram illustrating an illumination device. FIGs. 26-29 are schematic diagrams illustrating transparent substrates point-symmetrically or line-symmetrically disposed on a supporting structure not defining per se the invention as claimed, but illustrating the context of the present invention. FIG. 30 is a schematic diagram illustrating an illumination device. FIG. 31 and FIG. 32 are schematic diagrams illustrating a lamp housing. FIG. 33 is a top-view diagram illustrating an advertisement lamp housing. FIGs. 34-37 are schematic diagrams illustrating a bulb lamp according to an embodiment of the present invention falling under the claimed invention. FIG. 38 is a schematic diagram illustrating a light bar. FIG. 39 is a schematic diagram illustrating an illumination device. FIG. 40 is a schematic diagram illustrating another illumination device. Detailed Description

[0009] With reference to FIG. 1 and FIG. 2. FIG. 1 and FIG. 2 are schematic structure diagrams illustrating a light emitting element. As shown in FIG. 1 and FIG. 2, a light emitting element 1 includes a transparent substrate 2, a support surface 210, a first main surface 21A, a second main surface 21B and at least one light emitting diode (LED) chip 3 providing light in multi-directions. The transparent substrate 2, which is a sheet type substrate, has two main surfaces, and one of the surfaces is the support surface 210. The LED chip 3 capable of emitting light is disposed on the support surface 210. A light emitting surface 34 of the LED chip 3 uncovered by the transparent substrate 2 and at least a part of the support surface 210 without the LED chip form the first main surface 21A where light is emitted from. The second main surface 21B is another main surface of the transparent substrate 2 without the LED chips 3. The disposition described above may also be reversed, or the LED chip 3 may be disposed on the two surfaces of the transparent substrate 2. In one embodiment not defining per se the invention as claimed, but illustrating its context, LED chips 3 may be disposed on the support surface 210 of the transparent substrate 2 interlacedly corresponding to other LED chips 3 disposed on the second main surface 21B, such that light beams emitted from LED chips 3 on one surface of the transparent substrate 2 would not be blocked by other LED chips 3 on another surface of the transparent substrate 2. The luminance of the light emitting element 1 may be increased accordingly. A material of the transparent substrate 2 may comprise one selected from aluminum oxide (Al 2 O 3 ), sapphire containing aluminum oxide, silicon carbide (SiC), glass, plastic or rubber. Preferably, the transparent substrate may be a sapphire substrate in a preferred embodiment of the present invention. The structure of the sapphire substrate is substantially single crystal. The sapphire substrate has properties of higher light transmittance and better heat dissipation capability. The sapphire substrate may be used to increase the life time of the light emitting element 1. However, the conventional sapphire substrate used for growing a conventional light emitting diode may be fragile when applied in the present invention. According to experiment results of the present invention, the transparent substrate 2 of the present invention is preferably a sapphire substrate having a thickness thicker than or equal to 200 micrometers so as to perform better reliability, supporting performance and transparency. For effectively emitting light in multi-directions, including dual-directions or full directions, from the light emitting element 1, the LED chip 3 in this invention preferably has a beam angle greater than 180 degrees. Accordingly, the LED chip 3 disposed on the transparent substrate 2 may emit light beams from the light emitting surface 34 toward a direction away from the transparent substrate 2, and the LED chip 3 may also emit light beams at least partially entering the transparent substrate 2. The light beams entering the transparent substrate 2 may emerge from the second main surface 21B opposite to the first main surface 21A, and the light beams entering the transparent substrate 2 may also be emitted from a part of the support surface 210 without LED chips 3 or emitted from other surfaces of the transparent substrate 2. The light emitting element 1 may then be capable of emitting light in multi-directions including dual-directions or full directions. In this example, an area of the first main surface 21A or an area of the second main surface 21B is larger than 5 times of a total area formed from at least one of the light emitting surfaces 34 of each LED chip, and this is a preferred proportion according to the consideration of both the luminous efficiency and the heat dissipation performance.

[0010] Additionally, in another example, a difference in color temperatures of light beams emitted from the first main surface 21A and the second main surface 21B is smaller than or equal to 1500K so as to uniform light emitting effects of the light emitting element 1. In addition, under the thickness condition of the transparent substrate 2 mentioned above, a light transmittance of the transparent substrate 2 is larger than or equal to 70% for light beams having a wavelength range larger than or equal to 420 nanometers, or light beams having a wavelength range smaller than or equal to 470 nanometers.

[0011] The present invention is not limited to the embodiment described above. The following description will detail the different embodiments of the present invention. To simplify the description, similar components in each of the following embodiments are marked with identical symbols. For making it easier to understand the differences between the embodiments, the following description will detail the dissimilarities among different embodiments and the identical features will not be redundantly described.

[0012] Please refer to FIGs. 3-5. In the present invention, the LED chip 3 includes a first electrode 31A and a second electrode 31B for receiving electricity. The first electrode 31A and the second electrode 31B are respectively and electrically connected to a first connecting conductor 23A and a second connecting conductor 23B on the transparent substrate 2. FIGs. 3-5 are schematic diagrams illustrating different types of electrical coupling approaches between the light emitting diode chip 3 and the conductors. FIG. 3 illustrates a horizontal type LED chip, the LED chip 3 is formed on the support surface 210 of the transparent substrate 2, and the electrodes 31A, 31B are coupled to the connecting conductors 23A, 23B by wire bonding. FIG. 4 illustrates a flip chip type LED chip 3, and the LED chip 3 is disposed reversely and electrically coupled to the transparent substrate 2 by the first electrode 31A and the second electrode 31B. The first electrode 31A and the second electrode 31B may be directly coupled to the first connecting conductor 23A and the second connecting conductor 23B by welding or adhering. As shown in FIG. 5, the first electrode 31A and the second electrode 31B are disposed on different surfaces of the LED chip 3, and the LED chip 3 is vertically disposed so as to respectively connect the electrodes 31A, 31B to the connecting conductors 23A, 23B.

[0013] With reference to FIG. 6 and FIG. 7. The light emitting element 1 in the present invention may further include a wavelength conversion layer 4. The wavelength conversion layer 4 may be selectively disposed on the first main surface 21A or / and the second main surface 21B, or directly on the LED chips 3. The wavelength conversion layer 4 may directly contact the LED chips 3, or the wavelength conversion layer 4 may be separated from the LED chips 3 by a distance without directly contact. The wavelength conversion layer 4 contains at least one kind of fluorescent powders such as organic fluorescent powder or inorganic fluorescent powder of garnet series, sulfate series or silicate series. The wavelength conversion layer 4 may then be able to at least partially absorb a light beam emitted from the LED chip 3 and convert the light beam into another light beam having a different wavelength range. For example, when blue light beams are emitted from the LED chip 3, a part of the blue light beams may be converted into yellow light beams by the wavelength conversion layer 4, and the blue light beams and the yellow light beams may be mixed for presenting white light beams emitted from the light emitting element 1. Additionally, a luminance of the first main surface 21A is different from a luminance of the second main surface 21B because a light source of the first main surface 21A mainly comes from light beams directly emitted from the LED chip 3, and a light source of the second main surface 21B comes from light beams passing through the transparent substrate 2. Therefore, in a light emitting element 1 concentrations of the fluorescent powders in the wavelength conversion layer 4 disposed on the first main surface 21A and the wavelength conversion layer 4 disposed on the second main surface 21B are arranged correspondingly. Preferably, a ratio of a fluorescent powder concentration in the wavelength conversion layer 4 disposed on the first main surface 21A to a fluorescent powder concentration in the wavelength conversion layer 4 disposed on the second main surface 21B may range from 1:0.5 to 1:3, or a ratio of the fluorescent powder concentration in the wavelength conversion layer 4 disposed on the second main surface 21B to the fluorescent powders in the wavelength conversion layer 4 disposed on the first main surface 21A may range from 1:0.5 to 1:3. The luminance and the lighting effect of the light emitting element 1 may become more appropriate for different applications accordingly. A difference in color temperatures of light beams emitted from the first main surface 21A and the second main surface 21B may then be controlled to be smaller than or equal to 1500K. A wavelength converting efficiency and light emitting performance of the light emitting element 1 may then be enhanced.

[0014] With reference to FIG. 8. FIG. 8 is a cross-sectional diagram illustrating a light emitting element 1. As shown in FIG. 8, the light emitting element 1 includes a transparent substrate 2 and at least one LED chip 14 providing light in multi-directions. The transparent substrate 2 has a support surface 210 and a second main surface 21B disposed opposite to each other. The LED chip 14 is disposed on the support surface 210 of the transparent substrate 2. The LED chip 14 includes a first electrode 16 and a second electrode 18. The first electrode 16 and the second electrode 18 are configured to be electrically connected to other devices. A light emitting surface 34 of the LED chip 14 uncovered by the transparent substrate 2 and at least a part of the support surface 210 without the LED chip 14 form a first main surface 21A where light is emitted from.

[0015] The LED chip 14 includes a substrate 141, an N-type semiconductor layer 142, an active layer 143 and a P-type semiconductor layer 144. In this embodiment not defining per se the invention as claimed, but illustrating its context, the substrate 141 of the LED chip 14 may be attached on the transparent substrate 2 by such as a chip bonding layer 28. Apart from being used to attach the LED chip 14, a light intensity may also be increased by optimizing the material property of the chip bonding layer 28. For example, a refractive index of the chip bonding layer 28 is preferably between a refractive index of the substrate 141 and a refractive index of the transparent substrate 2 so as to increase the intensity of light emitted from the LED chip 14. In addition, the chip bonding layer 28 may be a transparent adhesive or other appropriate bonding material. The first electrode 16 and the second electrode 18 are disposed on the side of the LED chip 14 opposite to the chip bonding layer 28. The first electrode 16 and the second electrode 18 are electrically connected to the P-type semiconductor layer 144 and the N-type semiconductor layer 142 respectively (FIG. 8 does not show the connecting relation between the second electrode 18 and the N-type semiconductor layer 142). Horizontal levels of an upper surface of the first electrode 16 and an upper surface of the second electrode 18 are substantially the same. The first electrode 16 and the second electrode 18 may be metal electrodes, but are not limited thereto. In addition, the light emitting element 1 further includes a first connecting conductor 20, a second connecting conductor 22 and a wavelength conversion layer 4. The first connecting conductor 20 and the second connecting conductor 22 are disposed on the transparent substrate 2. The first connecting conductor 20 and the second connecting conductor 22 may be metal wires or other conductive patterns, but are not limited thereto. The first electrode 16 and the second electrode 18 are respectively connected to the first connecting conductor 20 and the second connecting conductor 22 electrically by wire bonding or welding, but are not limited thereto. The wavelength conversion layer 4 is disposed on the transparent substrate 2, and the wavelength conversion layer 4 may cover the LED chip 14. Additionally, the wavelength conversion layer 4 may further cover the second main surface 21B of the transparent substrate 2.

[0016] In addition, a non-planar structure 12M may be selectively disposed on the surfaces of the transparent substrate 2 for increasing the intensity of light emitted from the transparent substrate 2 and unifying the distribution of the emitted light. The non-planar structure 12M may be a convex geometric structure or a concave geometric structure, such as a pyramid, a cone, a hemispheroid, a triangular prism and so forth. The non-planar structures 12M may be arranged regularly or randomly. Furthermore, a diamond-like carbon (DLC) film 25 may be selectively disposed on the surfaces of the transparent substrate 2 so as to enhance the thermal conductive ability and the heat dissipating performance.

[0017] With reference to FIG. 9. FIG. 9 is a cross-sectional diagram illustrating another light emitting element. Compared with the example shown in FIG. 8, in the light emitting element 1 of FIG. 9, the first electrode 16, the second electrode 18 and a first chip bonding layer 28A are disposed on the same surface of the LED chip 14. That is the first electrode 16 and the second electrode 18 are electrically connected to the first connecting conductor 20 and the second connecting conductor 22 by flip chip. And the first connecting conductor 20 and the second connecting conductor 22 may respectively extend corresponding to the positions of the electrodes 16, 18. And the first electrode 16 and the second electrode 18 may be respectively connected to the first connecting conductor 20 and the second connecting conductor 22 electrically through a second chip bonding layer 28B. The second chip bonding layer 28B may be a conductive bump such as a gold bump or a solder bump, a conductive glue such as a silver glue, or a eutectic layer such as an Au-Sn alloy eutectic layer or an In-Bi-Sn alloy eutectic layer, but is not limited to this. By employing the second chip bonding layer 28B, the first chip bonding layer 28A under the LED chip 14 may not be required or may be replaced by the wavelength conversion layer 4.

[0018] With reference to FIG. 10. FIG. 10 is a schematic diagram illustrating a light emitting element not falling under the claimed invention. As shown in FIG. 10, a light emitting element 310 includes the transparent substrate 2, at least one LED chip 3, a first connecting electrode 311A, a second connecting electrode 311B and at least one wavelength conversion layer 4. The LED chip 3 is disposed on the support surface 210 of the transparent substrate 2 and forms a first main surface 21A where light is emitted from. In the example of FIG. 10, the LED chip 3 has a beam angle greater than 180 degrees, and at least a part of light beams emitted from the LED chip 3 penetrate into the transparent substrate 2. At least a part of the penetrating light beams may be emitted from a second main surface 21B which is opposite to the first main surface 21A, and the other penetrating light beams may be emitted from other surfaces of the transparent substrate 2, so as to form the light emitting element 310 providing light in multi-directions. The first connecting electrode 311A and the second connecting electrode 311B are respectively disposed on different sides of the transparent substrate 2 or on the same side of the transparent substrate 2 (not shown in FIG. 10). The first connecting electrode 311A and the second connecting electrode 311B may be electrodes of the light emitting element 310 respectively formed by extension parts of a first connecting conductor and a second connecting conductor on the transparent substrate 2, and the first connecting electrode 311A and the second connecting electrode 311B are electrically connected to the LED chip 3 accordingly. The wavelength conversion layer 4 at least covers the LED chip 3 and exposes at least a part of the first connecting electrode 311A and the second connecting electrode 311B. The wavelength conversion layer 4 at least partially absorbs a light beam emitted from the LED chip 3 or / and the transparent substrate 2, and converts the light beam into a light beam having another wavelength range. The converted light and the light which are not absorbed by the wavelength conversion layer 4 are mixed to extend the total wavelength range of the light beams emitted from the light emitting element 310 and improve the light emitting performance of the light emitting element 310. Because the light emitting element 310 includes the first connecting electrode 311A and the second connecting electrode 311B respectively disposed on the transparent substrate 2, traditional LED packaging process may be omitted and the light emitting element 310 may be independently manufactured and then combined with an appropriate supporting base. Accordingly, the total manufacturing yield may be improved, the structure may be simplified and applications of the corresponding supporting base may also be increased.

[0019] With reference to FIG. 11. An illumination device 11 is provided in this embodiment not defining per se the invention as claimed, but illustrating its context. The illumination device 11 includes a supporting base 5 and the light emitting element described above. The transparent substrate 2 of the light emitting element may stand on (or lie on) and be electrically coupled to the supporting base 5. A first angle θ1 exists between the transparent substrate 2 and the supporting base 5. The first angle θ1 may be fixed or be adjusted according to the light shape requirement of the illumination device. Preferably, the first angle θ1 ranges from 30 degrees to 150 degrees.

[0020] With reference to FIG. 12. The supporting base 5 of the illumination device 11 may further include a circuit board 6 electrically coupled to a power supply. The circuit board 6 is electrically coupled to a first connecting conductor and a second connecting conductor (not shown in FIG. 12) so as to be electrically connected to the LED chip 3. The power supply may then provide electricity to the LED chip 3 for emitting light via the circuit board 6. The LED chip 3 may also be electrically connected to the supporting base directly via the first connecting conductor and the second connecting conductor (not shown in FIG. 12) without the circuit board 6, and the power supply may provide electricity to the LED chip 3 via the supporting base 5.

[0021] With reference to FIG. 13. The illumination device 11 may further include a reflector or filter 8 disposed on the second main surface 21B or the support surface 210. The reflector or filter 8 may be used to reflect at least a part of light beams emitted from the LED chip 3 and passing through the transparent substrate 2. At least a part of the reflected light beams may be changed to be emitted from the first main surface 21A. The reflector or filter 8 may include at least one metal layer or a Bragg reflector, but is not limited thereto. The Bragg reflector may be composed of a plurality of insulating thin films with different refractive indexes disposed in a stack configuration, or the Bragg reflector may be composed of a plurality of insulating thin films with different refractive indexes and a plurality of metal oxide layers disposed in a stack configuration.

[0022] With reference to FIG. 14. The illumination device 11 may further include a diamond-like carbon (DLC) film 9 disposed on the support surface 210 or / and the second main surface 21B of the transparent substrate 2 so as to enhance the thermal conductive ability and the heat dissipating performance.

[0023] With reference to FIG. 15. FIG. 15 is a schematic diagram illustrating an illumination device not falling under the claimed invention. As shown in FIG. 15, an illumination device 10 includes a supporting base 26 and the light emitting element described in FIG. 10. The light emitting element includes a transparent substrate 2 and at least one LED chip 14. The light emitting element may be at least partially embedded into the supporting base 26. A first electrode 30 and a second electrode 32 of the supporting base 26 are electrically connected to the connecting conductors of the light emitting element. Driving voltage V+ and V- may be accordingly provided through the electrodes 30, 32 respectively to the LED chip 14 for emitting the light beam L. The LED chip 14 includes a first electrode 16 and a second electrode 18 respectively and electrically connected to the first connecting conductor 20 and the second connecting conductor 22 by wire bonding, but is not limited thereto. Additionally, the LED chip 14 has a beam angle greater than 180 degrees or has a plurality of light emitting surfaces, and then the illumination device 10 may emit light beams from the first main surface 21A and the second main surface 21B. Furthermore, because some of the light beams may be emitted directly from the LED chip 14 and / or the other four side surfaces of the transparent substrate 2, the illumination device 10 may accordingly emit light from multi sides or six sides or in full directions.

[0024] The light emitting element may further include a wavelength conversion layer 4 selectively disposed on the LED chip 14, the first main surface 21A or the second main surface 21B. The wavelength conversion layer 4 may at least partially absorb a light beam emitted from the LED chip 14 and convert the light beam into another light beam having a different wavelength range so as to emit light with specific color or light having a wider wavelength range from the illumination device 10. For example, when blue light beams are emitted from the LED chip 14, a part of the blue light beams may be converted into yellow light beams by the wavelength conversion layer 4, and the blue light beams and the yellow light beams may be mixed for presenting white light beams emitted from the illumination device 10. Additionally, the transparent substrate 2 may be directly or indirectly fixed on the supporting base 26 in a parallel state or a non-parallel state. For instance, the transparent substrate 2 may be vertically fixed on the supporting base 26 by mounting a side wall of the transparent substrate 2 with the supporting base 26 directly, or the transparent substrate 2 may be horizontally disposed on the supporting base 26, but is not limited thereto. The transparent substrate 2 preferably includes materials with high thermal conductivity, and heat generated from the LED chip 14 may be accordingly dissipated to the supporting base 26 through the transparent substrate 2, such that high power LED chips can be applied in the illumination device accordingly. However, at the same power consumption of the illumination device, more LED chips with relatively low power are dispersed on the transparent substrate 2 so as to fully utilize the thermal conductivity capability of the transparent substrate 2. For example, a power of the LED chip may be equal to or lower than 0.2 Watt, but not limited thereto.

[0025] With reference to FIG. 16. FIG. 16 is a schematic diagram illustrating another illumination device not falling under the claimed invention. Compared with the illumination device shown in FIG. 15, an illumination device 10' includes a plurality of LED chips 14, and at least some of the LED chips 14 are electrically connected to each other in series. Each of the LED chips 14 includes the first electrode 16 and the second electrode 18. The first electrode 16 of one LED chip 14 disposed on one end of the series is electrically connected to the first connecting conductor 20, and the second electrode 18 of another LED chip 14 disposed on another end of the series is electrically connected to the second connecting conductor 22, but are not limited thereto. The LED chips 14 may be electrically connected in series or in parallel. The LED chips 14 may be LED chips emitting identical color, such as blue LED chips, or LED chips emitting different colors may also be applied and combined according to different demands. The illumination device 10' may emit light in much more different colors by further employing the wavelength conversion layer 4.

[0026] With reference to FIG. 17. FIG. 17 is a schematic diagram illustrating yet another illumination device. Compared with the illumination devices shown in FIG. 15 and FIG. 16, an illumination device 50 further includes a support 51 configured to connect the light emitting element and the supporting base 26. The transparent substrate 2 of the light emitting element is fixed on a side of the support 51 by a unit bonding layer 52, and another side of the support 51 may be disposed on or inserted into the supporting base 26. Additionally, the support 51 is flexible so as to form an angle between the transparent substrate 2 and the supporting base 26, and the angle ranges from 30 degrees to 150 degrees. A material of the support 51 may include one selected from aluminum, composite metallic material, copper conductor, electric wire, ceramic substrate, printed circuit board, or other appropriate materials.

[0027] Please refer to FIGs. 18-20. When the transparent substrate 2 is disposed on a supporting base 5, the transparent substrate 2 may be inserted in or bonded to the supporting base 5.

[0028] As shown in FIG. 18. When the transparent substrate 2 is disposed on the supporting base 5, the transparent substrate 2 is inserted into a single socket 61 of the supporting base 5, and the light emitting element may be electrically coupled to the single socket 61 via connecting conductors. The LED chips (not shown in FIG. 18) on the transparent substrate 2 have to be electrically coupled to a power supply from or through the supporting base 5, and at least part of the conductive pattern or the connecting conductors are extended to an edge of the transparent substrate 2 and integrated into a connecting finger having a plurality of conductive contact sheets or an electrically connecting port such as the connecting electrodes 311A, 311B described above (not shown in FIG. 18). When the transparent substrate 2 is inserted into the single socket 61, the LED chip (not shown in FIG. 18) may then receive electricity from or through the supporting base 5, and the transparent substrate 2 may be fixed by the single socket 61 of the supporting base 5 accordingly.

[0029] With reference to FIG. 19. FIG. 19 is a schematic diagram illustrating the transparent substrate 2 inserted into multi sockets of the supporting base 5. The transparent substrate 2 has a dual-pin structure. One of the pins may be configured as a positive electrode of the device, and another one of the pins may be configured as a negative electrode of the device. Both of the pins have at least one conductive contact sheet respectively so as to act as connecting ports. Accordingly, there are at least two single sockets 61 having corresponding shape and size with the pins so as to smoothly insert the transparent substrate 2 into the supporting base 5 and provide electricity to the LED chip.

[0030] With reference to FIG. 20. The transparent substrate 2 is bonded to the supporting base 5 by a device bonding layer. In the bonding process, metal materials such as gold, tin, indium, bismuth or silver may be used in combining or welding the transparent substrate 2 and the supporting base 5. Additionally, conductive silica gel or epoxy material may also be used in fixing the transparent substrate 2 on the supporting base 5. The conductive pattern and the connecting conductors of the light emitting element may be electrically connected to the supporting base via the device bonding layer accordingly.

[0031] With reference to FIG. 21 and FIG. 22. The supporting base 5 of the illumination device 11 described in the present invention may be a substrate comprising one selected from metal such as aluminum, composite metallic material including aluminum, copper conductor, electric wire, ceramic substrate or printed circuit board. There is at least one support 62 on a surface or edge of the supporting base 5. The support 62 may be separated from the supporting base 5, or the support 62 and the supporting base 5 are monolithically integrated. The light emitting element may be electrically coupled to the support 62 by bonding, and a device bonding layer 63 is used to fix the transparent substrate 2 on the supporting base 5. The first angle θ1 is maintained between the transparent substrate 2 and a surface of the supporting base 5 without supports. The light emitting elements may also be disposed on the surface of the supporting base 5 without supports so as to enhance the light emitting performance of the illumination device 11. Additionally, the light emitting element may also be inserted in and connected to the support 62 (not shown in FIG. 21 and FIG. 22), wherein a connector may be used to connect the light emitting element and the support (and / or the support and the supporting base) so as to fix the transparent substrate 2 on the supporting base 5. Because the supporting base 5 and the support 62 are flexible, it is more convenient to apply the present invention to different applications. Moreover, the color variety of the illumination device 11 may be enhanced for different demands by combining using the light emitting elements having different light color.

[0032] With reference to FIG. 23. As shown in FIG. 23, an illumination device in this embodiment not defining per se the invention as claimed, but illustrating its context, includes at least one light emitting element 1 and a supporting base 5. The supporting base 5 includes at least one support 62 and at least one circuit pattern P. An end of the transparent substrate of the light emitting element 1 is electrically coupled to the support 62 so as to avoid or reduce the shielding influence caused by the support 62 for light emitting from the light emitting element 1. The supporting base 5 may be selected from metal such as aluminum, composite metallic material including aluminum, copper conductor, electric wire, ceramic substrate or printed circuit board. The support 62 may be formed by cutting and bending a part of the supporting base 5 to form an angle (as the first angle θ1 shown in FIG. 21 and FIG. 22). The circuit pattern P is disposed on supporting base 5, and the circuit pattern P has at least one set of electrical ports to be electrically connected to a power supply. Another part of the circuit pattern P extends on the support 62 so as to be electrically connected to the light emitting element 1, and the light emitting element 1 may than be electrically connected to the power supply via the circuit pattern P of the supporting base 5. In addition, the supporting base 5 may further include at least one hole H or at least one gap G, and fixing devices such as screws, nails or bolts may be used to combine the supporting base 5 with other device via the hole H or the gap G according to the application conditions of the illumination device. Meanwhile, the hole H or the gap G may also be used to increase the heat radiating area and enhance the heat dissipation capability of the illumination device.

[0033] With reference to FIG. 24. FIG. 24 is a schematic diagram illustrating a device frame of another illumination device according to an embodiment not defining per se the invention as claimed, but illustrating its context. As shown in FIG. 24, a device frame 322 in this embodiment includes a supporting base 5 and at least one support 62. Compared with FIG. 23, the support 62 in this embodiment includes at least one stripe part 342 and an opening 330. The first electrode 30 and the second electrode 32 are respectively disposed on two sides of the opening 330. The stripe part 342 forms at least one wall of the opening 330. One light emitting element described in the present invention is disposed correspondingly to the opening 330 and electrically coupled to the support 62. The connecting conductors of the light emitting element are electrically connected to the first electrode 30 and the second electrode 32 so as to drive the light emitting element by a power supply via the support 62 and the circuit pattern on the supporting base 5. A size of the opening 330 may not be smaller than a main light emitting surface of the light emitting element so as to prevent light beams emitted from the light emitting element from being blocked by the support 62. A connection part between the support 62 and the supporting base 5 may be adjustable so as to adjust the angle between the support 62 and the supporting base 5 as required.

[0034] With reference to FIG. 24 and FIG. 25. FIG. 25 is a schematic diagram illustrating an illumination device not falling under the claimed invention. Compared with the embodiment shown in FIG. 24, an illumination device 302 shown in FIG. 25 further includes at least one support 62 having a plurality of openings 330. The openings 330 are respectively disposed on two opposite sides of the support 62, and the stripe part 342 forms at least one wall of each opening 330. The light emitting element 310 is disposed correspondingly to the openings 330, and the conductive pattern or the connecting electrodes (not shown in FIG. 25) of each light emitting element 310 are respectively disposed correspondingly and electrically connected to the electrodes 30, 32. The illumination device 302 may include a plurality of the supports 62. Angles between the supporting base 5 and the supports 62 with the light emitting elements disposed thereon may be modified respectively. In other words, an angle between the supporting base 5 and at least one of the supports 62 may be different from an angle between the supporting base 5 and another one of the supports 62 so as to perform required light emitting effects, but is not limited thereto. Additionally, light emitting elements emitting light having different wavelength ranges may be disposed on an identical support or on different supports so as to enrich the color effect of the illumination device

[0035] For enhancing the luminance and improving the light emitting effect, in an illumination device of an embodiment not defining per se the invention as claimed, but illustrating its context, a plurality of the light emitting elements comprising the transparent substrates are disposed on the supporting bases detailed above or on other supporting structures. A point-symmetric distribution or a line-symmetric distribution may be applied. The light emitting elements comprising the transparent substrates may be point-symmetrically disposed on the supporting structure or line-symmetrically disposed on the supporting structure. Please refer to FIGs. 26-29. In the illumination devices of the embodiments shown in FIGs. 26-29, the light emitting elements are disposed on the supporting structures 60 having different shapes. The light beams emitted from the illumination devices 11 may be uniform because of the point-symmetric distribution or the line-symmetric distribution (the LED chips are not shown in FIGs. 26-29). The light emitting effects of the illumination devices 11 may be further improved by adjusting the first angle described above. As shown in FIG. 26, the light emitting elements are point-symmetrically arranged and form an angle between each other in 90 degrees. Therefore, at least two of the light emitting elements may face any one of the four sides of the illumination device 11. As shown in FIG. 27, the angle between the light emitting elements is smaller than 90 degrees. As shown in FIG. 29, the angle between the light emitting elements is larger than 90 degrees. In another embodiment not defining per se the invention as claimed, but illustrating its context (not shown), the light emitting elements may be asymmetrically disposed and at least a part of the light emitting elements may be disposed in a crowd or separately disposed so as to perform required light shaping according to different applications of the illumination device.

[0036] With reference to FIG. 30. FIG. 30 is a schematic diagram illustrating an illumination device not falling under the claimed invention. As shown in FIG. 30, an illumination device 301 includes a light emitting element 310 and a support 321. The support 321 includes an opening 330, and the light emitting element 310 is disposed correspondingly to the opening 330. In this embodiment, an external part of the support 321 may be worked as a pin or be bent to form a connecting pad required in surface mounting so as to be fixed and electrically connected to other electrical circuit units. A light emitting surface of the light emitting element 310 is disposed in the opening 330, and the illumination device 301 may still emit light from multi sides or six sides accordingly whether the support 321 is transparent or not

[0037] With reference to FIG. 31 another illumination device not falling under the claimed invention is provided. The illumination device includes a lamp housing 7 having a tube shape, at least one light emitting element 1 and a supporting structure 60. The light emitting element 1 is disposed on the supporting structure 60, and at least a part of the light emitting element 1 is disposed in a space formed by the lamp housing 7. With reference to FIG. 32. When more light emitting elements 1 are disposed in the lamp housing 7, the first main surfaces 21A of the light emitting elements 1 are arranged separately and not parallel to one another. Additionally, the light emitting elements 1 are at least partially disposed in the space formed by the lamp housing 7, and the light emitting elements 1 are not closely adjacent to an inner wall of the lamp housing 7. Preferably, a distance D between the light emitting elements 1 and the lamp housing 7 may be equal to or larger than 500 micrometers. However, the lamp housing 7 may also be formed by filling glue, and the lamp housing 7 may at least partially cover and directly contact the light emitting elements 1.

[0038] With reference to FIG. 33 yet another illumination device not falling under the claimed invention is provided. The lamp housing 7 of the illumination device has at least one covering layer 71. The covering layer 71 may be a billboard, signboard or other display devices requiring backlight sources. Light provided from the first main surface 21A and the second main surface 21B of each light emitting element 1 may be applied as a light source of a backlight for the covering layer 71. A second angle between the light emitting element 1 and the covering layer 71 ranges between 0 degree and 45 degrees (the second angle is 0 degree in FIG. 33 and not shown accordingly). In addition, the light emitting elements 1 are at least partially disposed in the space formed by the lamp housing 7 and basically not closely adjacent to the inner wall of the lamp housing 7, and then light beams generated by a light emitting plate / sheet or each light emitting element comprising the transparent substrate and the LED chip providing light in multi-directions can uniformly pass through the lamp housing. Preferably, a distance D between the light emitting elements 1 and the lamp housing 7 may be equal to or larger than 500 micrometers. However, the lamp housing 7 may also be formed by filling glue, and the lamp housing 7 may at least partially cover and directly contact the light emitting elements 1.

[0039] Please refer to FIGs. 34-37. In a series of embodiments of the present invention falling under the claimed invention, the illumination devices in this series of embodiments may further include a lamp housing 7 having a bulb shape and a base 64. As shown in FIG. 34, compared with the other embodiments described above, the illumination device in this embodiment further includes a lamp housing 7 having a bulb shape, and a supporting base 5 further disposed on a base 64. The base 64 may be a traditional lamp base. The lamp housing 7 may be coupled to the base 64 and cover the light emitting elements and the supporting base 5, or the lamp housing 7 may be directly coupled to the supporting base 5 and cover the light emitting elements. The base 64 may be a platform or include another supporting protrusion (as shown in FIG 35). As shown in FIG. 36, the wavelength conversion layer 4 is coated on an inner wall of the lamp housing 7 so as to convert at least a part of light beams generated from the LED chips 3 into other light beams having other wavelength ranges before leaving the lamp housing 7. As shown in FIG. 37, a dual layer design including the lamp housing 7 and another lamp housing 7' is disclosed. Space S exists between the lamp housing 7 and the another lamp housing 7'. The space S, the lamp housing 7 and the another lamp housing 7' may be further modified for performing different patterns and colors of light from the illumination device.

[0040] With reference to FIG. 38 and FIG. 39. FIG. 38 is a schematic diagram illustrating a light bar not falling under the claimed invention. FIG. 39 is a schematic diagram illustrating an illumination device not falling under the claimed invention. As shown in FIG. 38, a light bar 323 includes a plurality of openings 330. The light bar 323 has an extending direction X, and the openings 330 are disposed along the extending direction X. A plurality of the light emitting elements providing light in multi-directions are disposed correspondingly to the openings 330 of the light bar 323, and the light bar 323 can emit light accordingly, but is not limited thereto. Additionally, the light bar 323 may further include a plurality of electrodes 30, 32, a first external connecting electrode 350A and a second external connecting electrode 350B. The electrical polarity of the first electrode 30 is different from the second electrode 32. The first electrodes 30 and the second electrodes 32 are respectively disposed on two sides of each opening 330. The first external connecting electrode 350A and the second external connecting electrode 350B are electrically connected to the first electrodes 30 and the second electrodes 32 respectively. The first external connecting electrode 350A and the second external connecting electrode 350B are respectively disposed on two sides of the light bar 323. As shown in FIG. 38 and FIG. 39, an illumination device 303 may include the light bar 323 described above and a device frame 360, wherein the light bar 323 with light emitting elements 310 may be vertically disposed, horizontally disposed or inclinedly disposed on the device frame 360. The external connecting electrodes 350A, 350B of the light bar 323 may be electrically connected to a power supply via the device frame 360, but are not limited thereto. Additionally, other appropriate optical films such as diffusion films may also be applied in the illumination device 303 so as to modify the light emitting effect of the light emitting elements 310 disposed in the device frame 360.

[0041] With reference to FIG. 40. FIG. 40 is a schematic diagram illustrating another illumination device not falling under the claimed invention. As shown in FIG. 40, an illumination device 304 includes a plurality of the light emitting elements 310 and a supporting base 324. The supporting base 324 includes a plurality of openings 330, and the openings 330 are disposed as an array. The light emitting elements 310 are disposed correspondingly to the openings 330. The connecting approach of the light emitting elements 310 on the openings 330 is similar to that described above, and will not be redundantly described. It is worth noting that the supporting base 324 may further include a first external connecting electrode 350A and a second external connecting electrode 350B so as to be electrically connected to other electrical devices. Additionally, the illumination device 304 may be used as a billboard, signboard or a backlight module, and the supporting base 324 is preferably transparent, but is not limited thereto.

[0042] The invention has been described with reference to particular embodiments and the figures. Yet it is explicitly stated that any feature described with reference to a particular embodiment or figure only may well and separately from other features described in connection with this embodiment and / or figure be implemented in any of the other embodiments described or shown in the figures. The scope of the present invention is defined by the appended claims.

Claims

1. An illumination device (11), comprising: a supporting base (5); a first light emitting element disposed on the supporting base (5), and comprising a first transparent substrate with a first support surface and a first side surface; a plurality of first light-emitting diode, LED, chips disposed on the first support surface, each first LED chip having a substrate (141), an N-type semiconductor layer (142), an active layer (143), and a P-type semiconductor layer (144), a top surface, and a lateral surface; a first main surface (21A) including the top surfaces of the plurality of first LED chips and a part of the first support surface which is not covered by the plurality of first LED chips; a second main surface (21B) opposite to the first support surface; a first wavelength conversion layer covering the first main surface (21A) and the lateral surfaces of the plurality of first LED chips without covering the first side surface of the first transparent substrate; and a second wavelength conversion layer covering the second main surface (21B); and a second light emitting element disposed on the supporting base (5), and comprising a second transparent substrate with a second support surface and a second side surface; a plurality of second light-emitting diode, LED, chips disposed on the second support surface, each second LED chip having a substrate (141), an N-type semiconductor layer (142), an active layer (143), and a P-type semiconductor layer (144), a top surface, and a lateral surface; a third main surface including the top surfaces of the plurality of second LED chips and a part of the second support surface which is not covered by the plurality of second LED chips; a fourth main surface opposite to the second support surface; a third wavelength conversion layer covering the third main surface and the lateral surfaces of the plurality of second LED chips without covering the second side surface of the second transparent substrate; and a fourth wavelength conversion layer covering the fourth main surface, wherein the plurality of first LED chips is configured to emit light which leaves from the first main surface (21A) and passes through the first transparent substrate and emerges from the second main surface (21B) of the first transparent substrate, the plurality of second LED chips is configured to emit light which leaves from the third main surface and passes through the second transparent substrate and emerges from the fourth main surface of the second transparent substrate, the first support surface of the first light-emitting element and the second support surface of the second light emitting element are oriented toward different directions, and the first light emitting element and the second light emitting element are inclined with respect to the supporting base (5) by an angle, wherein the angles adjustable according to a light shape requirement of the illumination device (11).

2. The illumination device (11) of claim 1, wherein the first light emitting element comprises a connecting conductor formed on the first support surface and electrically connected to one of the plurality of first LED chips by a wire.

3. The illumination device (11) of claim 2, wherein the first light emitting element comprises another connecting conductor formed on the first support surface, wherein the connecting conductor and the another connecting conductor are disposed at opposite sides of the first transparent substrate.

4. The illumination device (11) of claim 3, wherein the supporting base (5) has sockets for receiving the first light emitting element and the second light emitting element.

5. The illumination device (11) of claim 4, wherein the connecting conductor and the another connecting conductor are extended to an edge of the first transparent substrate.

6. The illumination device (11) of claim 1, wherein the angle is ranged from 30° to150°.

7. The illumination device (11) of claim 1, wherein the first side surface of the first transparent substrate of the first light-emitting element and the second side surface of the second transparent substrate of the second light emitting element are arranged to point toward a central portion of the supporting base (5) in a top view.

8. The illumination device (11) of claim 1, wherein the first wavelength conversion layer and the second wavelength conversion layer have different areas.

9. The illumination device (11) of claim 1, wherein the first side surface of the first transparent substrate of the first light emitting element is not covered by the second wavelength conversion layer.