THERMAL MANAGEMENT WITH VARIATION IN THE THERMAL RESISTANCE OF A THERMAL INTERFACE
DE602020045669T2Active Publication Date: 2025-01-29ADVANCED MICRO DEVICES INC
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Patent Information
- Application Number
- DE602020045669
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2019-12-30
- Filing Date
- 2020-12-23
- Publication Date
- 2025-01-29
- Estimated Expiration
- 2040-12-23
AI Technical Summary
Technical Problem
Conventional thermal management techniques for integrated circuits often result in unnecessary over-cooling, as they cool the entire circuit rather than targeting localized hot spots.
Method used
A thermal management system that uses a thermal interface material with thermally conductive particles suspended in a fluid, and applies an electric field to align these particles, creating a high thermal conductivity path specifically between hot spots and a heat exchanger.
Benefits of technology
This approach reduces thermal resistance in localized areas, effectively cooling hot spots without over-cooling the rest of the integrated circuit, thereby improving thermal management efficiency.
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