ELECTRONIC POWER SYSTEM

Description

DOMAINE TECHNIQUE

[0001] The invention relates to power electronic systems. It finds at least one particularly advantageous application in the field of static power converters. ETAT DE LA TECHNIQUE

[0002] A power electronic system such as a power electronic converter generally comprises elementary power modules connected together.

[0003] Each elementary power module comprises power components, such as transistors (e.g., Insulated Gate Bipolar Transistors (IGBTs)) and diodes, assembled in the form of a chip to perform an elementary function, for example, an electronic switch function.

[0004] The heat produced by the power components of the elementary power modules must be dissipated. Cooling these elementary power modules is a major issue for the proper functioning of the power electronic system.

[0005] The size and mass of the power electronics system are also a major issue.

[0006] One solution is to interpose the power component between a first electrically conductive heat sink and a second electrically conductive heat sink, as disclosed by patent document FR3088137 A1.

[0007] This solution advantageously makes it possible to functionalize the heat sinks of the power module. It is therefore possible to assemble several power modules in a compact manner, in the form of a stack of said power modules, in order to produce electronic cells comprising at least two power modules interconnected via their heat sinks.

[0008] The principle of assembling the modules together disclosed by patent document FR3088137 A1 makes it possible to envisage different types of electronic cells, including for example power modules in series or in parallel.

[0009] Document US5164624 A1 discloses another type of modular assembly of power semiconductors, of the "press-pack" type, in which the modules are mounted vertically.

[0010] The external connections of the electronic cells must, however, be adapted to such an assembly of elementary power modules.

[0011] An object of the present invention is to provide a power electronic system comprising parallel power modules and optimized external connections.

[0012] Another object of the present invention is to propose an optimized power electronic system, making it possible in particular to reduce the mass and / or size compared to existing solutions.

[0013] Other objects, features, and advantages of the present invention will become apparent from the following description and accompanying drawings. It is understood that other advantages may be incorporated. RESUME

[0014] The invention is defined by independent claim 1. Preferred embodiments are defined by the dependent claims.

[0015] Such an electronic system comprising electronic modules (each formed by a power component arranged between two electrically conductive heat sinks) connected to each other according to different configurations and having external +DC, -DC and phase connections, advantageously makes it possible to produce different structures in the field of power electronics, such as switching cells, choppers, or inverters, possibly with multilevel or interleaved configurations.

[0016] Such a power electronic system can advantageously be implemented for on-board applications requiring low mass and / or small size, typically in the field of transport (air or land). BREVE DESCRIPTION DES FIGURES

[0017] The aims, objects, as well as the characteristics and advantages of the invention will emerge more clearly from the detailed description of an embodiment thereof which is illustrated by the following accompanying drawings in which: There figure 1 schematically illustrates a switching cell according to an embodiment of the present invention. The figure 2 represents the electrical diagram of the switching cell illustrated in figure 1 . There figure 3 represents an electrical diagram of four switching cells in parallel, according to an embodiment of the present invention. The figure 4 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to an embodiment of the present invention. The figures 5A à 5D schematically illustrate different elements (housing, electromagnetic compatibility screens, control cards, etc.) assembled to the electronic system illustrated in figure 4 , according to an embodiment of the present invention. The figure 6 illustrates in section the electronic system illustrated in the figure 4 . There figure 7 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 8 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 9 schematically illustrates different elements (housing, electromagnetic compatibility screens, control cards, etc.) assembled into the electronic system illustrated in figure 8 , according to an embodiment of the present invention. The figure 10 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 11 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 12 schematically illustrates different elements (housing, electromagnetic compatibility screens, control cards, etc.) assembled into the electronic system illustrated in figure 11 , according to an embodiment of the present invention. The figure 13 illustrates in section the electronic system illustrated in the figure 12 . THE figures 14A et 14B schematically illustrate an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 15 schematically illustrates different elements (housing, electromagnetic compatibility screens, control cards, etc.) assembled into the electronic system illustrated in figures 14A et 14B , according to an embodiment of the present invention. The figure 16 illustrates in section the electronic system illustrated in the figure 15 . There figure 17 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 18 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 19 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 20 schematically illustrates different elements (housing, electromagnetic compatibility screens, control cards, etc.) assembled into the electronic system illustrated in figure 19 , according to an embodiment of the present invention. The figure 21 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 22 schematically illustrates different elements (housing, electromagnetic compatibility screens, control cards, etc.) assembled into the electronic system illustrated in figure 21 , according to an embodiment of the present invention. The figure 23 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 24 schematically illustrates an electronic system comprising an assembly of four switching cells in parallel, according to another embodiment of the present invention. figure 25 schematically illustrates different elements (housing, electromagnetic compatibility screens, control cards, etc.) assembled into the electronic system illustrated in figure 24 , according to an embodiment of the present invention. The figure 26 represents the electrical diagram of a single-phase inverter comprising two times two switching cells in parallel, according to an embodiment of the present invention. The figure 27 schematically illustrates a single-phase inverter, according to an embodiment of the present invention. The figure 28 schematically illustrates a single-phase inverter, according to another embodiment of the present invention. The figure 29 represents the electrical diagram of a three-phase inverter comprising three times eight switching cells in parallel, according to an embodiment of the present invention. The figures 30A à 30C schematically illustrate a three-phase inverter, according to an embodiment of the present invention. The figure 31 illustrates in section the three-phase inverter illustrated in figures 30A à 30C . There figure 32 represents an electrical diagram of a switching cell comprising two times four power components in series. The figure 33 schematically illustrates a switching cell corresponding to the electrical diagram of the figure 32 , according to an embodiment of the present invention. The figure 34 schematically illustrates a switching cell corresponding to the electrical diagram of the figure 32 , according to another embodiment of the present invention. The figure 35 schematically illustrates a switching cell corresponding to the electrical diagram of the figure 32 , according to another embodiment of the present invention. The figure 36 schematically illustrates a switching cell corresponding to the electrical diagram of the figure 32 , according to another embodiment of the present invention. The figure 37 schematically illustrates a switching cell corresponding to the electrical diagram of the figure 32 , according to another embodiment of the present invention. The figure 38 schematically illustrates a switching cell corresponding to the electrical diagram of the figure 32 , according to another embodiment of the present invention. The figure 39 schematically illustrates different elements (housing, electromagnetic compatibility screens, control cards, etc.) assembled to the switching cell illustrated in figure 37 , according to an embodiment of the present invention.

[0018] The drawings are given by way of example and are not limiting of the invention. They constitute schematic representations of principle intended to facilitate the understanding of the invention and are not necessarily to the scale of practical applications.

[0019] In particular, the thicknesses and dimensions of the various layers and portions of the printed circuits, heat sinks and electrical connections illustrated are not representative of reality.

[0020] In this patent application, the following notations are used: For an elementary power electronic module X, we will note: X0 the printed circuit board of this module (including a power component), X1, X2 the first and second heat sinks of this module, X00A the power electronic component of this module. In the present patent application, a conductive electrical connection between a heat sink Xi (i = 1, 2) of a first module X and a heat sink Yj (j = 1, 2) of a second module Y, is denoted: XiYjC In the present patent application, a capacitive electrical connection between a heat sink Xi (i = 1, 2) of a first module X and a heat sink Yj (j = 1, 2) of a second module Y, is denoted: XiYjCP In the present patent application, an insulating electrical connection between a heat sink Xi (i = 1, 2) of a first module X and a heat sink Yj (j = 1, 2) of a second module Y, is denoted: XiYjl An electronic cell is denoted C0n (n = 1-4).

[0021] All references of each elementary power electronic module and / or each electronic cell are not necessarily shown on the drawings for the sake of clarity.

[0022] The references of elements not explicitly referenced on the drawings can nevertheless be easily deduced from the notations explained above and from the detailed description which follows. DESCRIPTION DÉTAILLÉE

[0023] According to the invention, the power components and the electrically conductive heat sinks are assembled so as to form elementary switching cells connected in parallel, each elementary switching cell comprising: A first elementary power electronic module, called the first elementary module, A second elementary power electronic module, called the second elementary module, the first elementary module comprising: an electrically conductive heat sink configured to be polarized according to a -DC potential, called anode heat sink, and an electrically conductive heat sink configured to be polarized according to a phase potential, called first phase heat sink, a first power component, preferably integrated on or in a printed circuit, arranged between the anode heat sink and the first phase heat sink, the second elementary module comprising: an electrically conductive heat sink configured to be polarized according to a +DC potential, called cathode heat sink, an electrically conductive heat sink configured to be polarized according to the phase potential, called second phase heat sink, a second power component, preferably integrated on or in a printed circuit, arranged between the cathode heat sink and the second phase heat sink.

[0024] The first and second elementary modules are adjacent along a lateral connection direction y, and connected to each other by a conductive lateral electrical connection between the first and second phase dissipators, and by a capacitive lateral electrical connection between the anode and cathode dissipators. Thus, a switching cell can be easily formed by connecting the elementary modules to each other.

[0025] The anode and cathode heat sinks and the phase heat sinks of the elementary switching cells are configured to allow a cooling fluid to pass in an axial x direction to the lateral connection y direction. This allows the switching cell to be cooled efficiently, minimizing pressure losses.

[0026] The elementary switching cells are assembled one behind the other in the axial x direction, so that the anode dissipators of said cells are aligned one behind the other in the axial x direction, and the cathode dissipators of said cells are aligned one behind the other in the axial x direction, and the first phase dissipators of said cells are aligned one behind the other in the axial x direction, and the second phase dissipators of said cells are aligned one behind the other in the axial x direction. This makes it possible to simply produce an electronic system comprising several switching cells in parallel. This makes it possible to simplify the design of the external connections.

[0027] According to one example, the external phase connection is made on a first side of the cells formed by the first and second phase dissipators, and the external +DC and -DC connections are made on a second side of the cells formed by the anode and cathode dissipators, said second side being opposite the first side in the axial x direction. This allows for better distribution of the current between the elementary modules.

[0028] According to one example, the electronic system comprises at least a first block and a second block of elementary switching cells assembled one behind the other in the axial direction x, said at least first and second blocks being adjacent and connected in a central connection direction z so that the first and second phase dissipators of the first block are connected to the first and second phase dissipators of the second block.

[0029] According to one example, the external +DC and -DC connections respectively comprise +DC and -DC connectors configured to respectively connect the cathode heat sinks of the second block with the cathode heat sinks of the first block, and the anode heat sinks of the second block with the anode heat sinks of the first block.

[0030] According to one example, the electronic system comprises at least a first block and a second block of elementary switching cells assembled one behind the other in the axial direction x, said at least first and second blocks being adjacent and separated in the lateral connection direction y by a separation space. The cooling fluid flowing in the direction x thus passes through fewer consecutive heat sinks. The pressure losses are thus reduced.

[0031] According to one example, the separation space comprises at least one control board configured to control the power components of the elementary switching cells of each of the first and second blocks, and a caulking configured to block a passage of the cooling fluid. The caulking makes it possible to electrically isolate the cathode heat sinks of the first block from the anode heat sinks of the second block (or vice versa). The caulking also makes it possible to force the circulation of the cooling fluid in the heat sinks. The cooling efficiency is thus improved.

[0032] According to one example, the cathode heat sinks of the first and second blocks border the separation space. This makes it easier to connect all of the cathode heat sinks on the one hand, and all of the anode heat sinks on the other hand. This also makes it easier to add an electromagnetic compatibility screen opposite the phase heat sinks and / or opposite the cathode heat sinks and / or opposite the anode heat sinks. This screen can also be connected to the cathode heat sinks or to the anode heat sinks.

[0033] According to one example, the anode heat sinks of the first and second blocks border the separation space. This makes it easier to connect all of the cathode heat sinks on the one hand, and all of the anode heat sinks on the other hand. This also makes it easier to add an electromagnetic compatibility screen opposite the cathode heat sinks and / or opposite the anode heat sinks.

[0034] In one example, the cathode and anode heat sinks of the first and second blocks border the separation space.

[0035] In one example, the first and second phase dissipators of the first block are located on a side of the cells of the first block opposite the separation space.

[0036] In one example, the first and second phase dissipators of the second block are located on a side of the cells of the second block opposite the separation space.

[0037] In one example, the separation space includes the external +DC and -DC connections. This helps reduce the system inductance.

[0038] In one example, the external phase connection includes a phase connector configured to connect the first and second phase sinks of the second block with the first and second phase sinks of the first block.

[0039] According to one example, the elementary switching cells of each of the first and second blocks are assembled one behind the other in the axial x direction, such that the anode dissipator of a given cell is aligned with one of the first and second phase dissipators of an immediately adjacent cell in the axial x direction, and the cathode dissipator of said given cell is aligned with the other of the first and second phase dissipators of the immediately adjacent cell in the axial x direction, said anode and cathode dissipators being electrically isolated from said first and second phase dissipators. Such an assembly makes it possible to reduce the magnetic field generated by the cells during switching. The parasitic inductance within the electronic system is thus reduced.

[0040] For example, the external +DC and -DC connections are connected to a busbar. A busbar can be a PCB or several conductive / insulating layers assembled on top of each other (laminated busbar).

[0041] In one example, the busbar is arranged transversely to the axial x-direction, the busbar being configured to allow the coolant to pass through. The busbar may, in particular, include passages for the flow of the coolant. In this case, it may act as an electromagnetic compatibility (EMC) shield. It is therefore not necessary to add such an additional EMC shield.

[0042] In one example, the busbar is in the form of a perforated grid.

[0043] According to one example, the electronic system further comprises at least one control board surrounding the elementary switching cells, such that said at least one control board forms a housing configured to channel the coolant in the axial x direction. Channeling the coolant directly through the control boards (PCBs) reduces the overall mass of the system. A separate channeling housing is no longer required. The PCBs are functionalized to channel the coolant, in addition to controlling the power components.

[0044] According to an example, a first part of the elementary switching cells has first and second phase dissipators configured to be polarized according to a first phase potential and a second part of the elementary switching cells has first and second phase dissipators electrically isolated from the first and second phase dissipators of the first part of the cells, and configured to be polarized according to a second phase potential different from the first phase potential.

[0045] According to one example, at least one external phase connection includes a first external phase connection connected to the heat sinks biased according to the first phase potential, and a second external phase connection connected to the heat sinks biased according to the second phase potential.

[0046] According to one example, the elementary switching cells of the first part are connected via their first and second phase dissipators along a central connection direction z, and the elementary switching cells of the second part are connected via their first and second phase dissipators along the central connection direction z, such that the phase dissipators of the cells of the first part are aligned with the phase dissipators of the cells of the second part along the axial direction x.

[0047] According to one example, the elementary switching cells of the first part are connected via their first and second phase dissipators along the axial x direction, and the elementary switching cells of the second part are connected via their first and second phase dissipators along the axial x direction, such that the phase dissipators of the cells of the first part are aligned with the phase dissipators of the cells of the second part along a central connection direction z. Such an assembly configuration makes it possible to easily add other elementary switching cells to each of the parts (or arms of the inverter), by aligning them one behind the other along the x direction.

[0048] According to one example, a third portion of the elementary switching cells has first and second phase dissipators configured to be polarized according to a third phase potential, and wherein the at least one external phase connection comprises a third external phase connection connected to the dissipators polarized according to the third phase potential.

[0049] In one example, the system further includes a housing configured to surround the plurality of electrically conductive heat sinks so as to channel a passage of a cooling fluid into the plurality of electrically conductive heat sinks.

[0050] According to one example, the system further comprises at least one electromagnetic compatibility screen configured to be polarized according to the +DC or -DC potential, at least partially surrounding the at least one phase dissipator. This makes it possible to limit the electromagnetic radiation as well as the negative effects of common mode currents during switching of the components.

[0051] According to one example, the system further comprises at least one control board configured to control the plurality of power components and at least partially surrounding the plurality of electrically conductive heat sinks. This makes it possible to functionalize the control board, for example to provide a coolant channeling function, or to provide an electromagnetic compatibility (EMC) screen function. The control board can further control the power components of the elementary modules. A control board in the form of a PCB is relatively light. This makes it possible to reduce the overall weight of the system.

[0052] In the present invention, the first and second heat sinks are called anodic or cathodic for the sake of clarity. This name is not limiting of the invention. The anodic and cathodic heat sinks form electrodes. These electrodes can be an anode, a cathode, an emitter, a collector, a source, a drain, etc. These electrodes can be interchanged depending on the direction of flow of the electronic component for example.

[0053] In the present invention, MOSFETs are preferably used which include a diode in their structure. It is possible to use "IGBT" type transistors, i.e. insulated gate bipolar transistors (IGBT). In this case, the IGBT transistor is preferably associated with an antiparallel diode, for example located in the PCB.

[0054] Other transistor architectures can be used, for example but not limited to: a HEMT (High Electron Mobility Transistor) type transistor, which is a high electron mobility field effect transistor, sometimes also referred to as a heterostructure field effect transistor, an insulated gate field effect transistor more commonly called a MOSFET (Metal Oxide Semiconductor Field Effect Transistor).

[0055] Other components, such as thyristors, gate turn-off thyristors (GTO thyristor or more simply GTO, from the English "Gate Turn-Off" Thyristor), can also be used.

[0056] These transistors and components are well known and commonly used in the field of power electronics, in particular for static power converters. In the following, the terms "transistor" or "component" or "power component" can therefore be understood, in a non-limiting manner, to mean all of the transistor and component architectures mentioned above.

[0057] In the field of power electronics, an electronic system is understood to mean systems operating preferably with electric currents having intensities between 10 A and 1000 A, and / or electric voltages between 10 V and 10000 V, preferably between 10 V and 5000 V, and preferably between 10 V and 1000 V.

[0058] According to the invention, the electronic system consists of several elementary modules, each comprising power components providing in particular one or more electronic switch functions.

[0059] The system is therefore advantageously modular and allows the creation of numerous static converter structures, such as a switching cell, a multilevel converter, an interleaved chopper.

[0060] These modules can be connected along the three directions of space x, y and z. A lateral connection is made along the y direction. A central connection is made along z. An axial connection is made along x. An xyz reference frame, preferably orthonormal, is attached to the accompanying drawings. It helps to facilitate understanding of the various connections between the modules. The x direction defines in particular a direction of flow of a cooling fluid through the electronic system. In the examples presented, cooling is typically done by air in forced convection. Alternatively, cooling can be done by liquid cooling with or without phase change, provided that the liquid is electrically insulating. Cooling can alternatively be done by natural convection.

[0061] The principle of modularity of the electronic system according to the invention is illustrated through the following examples.

[0062] The reader will usefully refer to the content of documents FR3088137 A1 and WO2020094663 A1 for the production of elementary power modules and for the connection of these modules to each other so as to form an electronic power system. The characteristics of the heat sinks and the conductive, capacitive or insulating connections described in these documents are notably incorporated in the present application. Other embodiments are presented in the following. Part of the description relates to the “external” connections of the elementary modules, as opposed to the “internal” connections previously described in documents FR3088137 A1 and WO2020094663 A1.

[0063] Generally speaking and unless explicitly stated otherwise, the various heat sinks X2, Y2, U2, V2, A2, B2, I2, J2 are phase heat sinks polarized at a phase potential, the heat sinks X1, U1, A1, I1 are anode heat sinks polarized at a -DC potential, the heat sinks Y1, V1, B1, J1 are cathode heat sinks polarized at a +DC potential.

[0064] There figure 1 presents an elementary switching cell formed by two elementary power modules X, Y connected laterally to each other. En In particular, the first power module X comprises a printed circuit or PCB X0 interposed between a first heat sink X1 and a second heat sink X2. The second power module Y comprises a printed circuit or PCB Y0 interposed between a first heat sink Y1 and a second heat sink Y2. The first and second printed circuits X0, Y0 respectively comprise at least a first and a second power component X00A, Y00A, preferably a first and a second transistor. The choice of power components integrated in a PCB makes it possible to simplify the external electrical connections with a control card. Other alternative solutions to the PCB, in particular making it possible to interpose a power component between the heat sinks, are also conceivable.

[0065] For each of the elementary modules, there is no electrical insulating element between the PCB X0, respectively Y0, and the heat sinks X1, X2, respectively Y1, Y2. In order to limit thermal interfaces, the transistors X00A, Y00A are preferably bare chips. Alternatively, the transistors X00A, Y00A can be pre-assembled in individual packages.

[0066] Generally, heat sinks are configured to allow a cooling fluid to pass through at least in the x direction.

[0067] The first heat sink X1 can be configured to be biased to a -DC potential. It is referred to as the anode heat sink in the following.

[0068] The first heat sink Y1 can be configured to be biased to a +DC potential. It is referred to as the cathode heat sink in the following.

[0069] The second heat sinks X2, Y2 can be configured to be polarized at a phase potential. They are referred to as phase heat sinks in the following.

[0070] In this example, to form an elementary switching cell C0 as illustrated by the electrical diagram of the figure 2 , the anode and cathode heat sinks X1, Y1 are connected laterally to each other by a capacitive lateral connection X1Y1CP. The phase heat sinks X2, Y2 are connected laterally to each other by a conductive lateral connection X2Y2C.

[0071] The conductive side connection X2Y2C shown in the figure 1 is achieved by means of a single XY phase heatsink comprising the heatsinks X2, Y2. Alternatively, the heatsinks X2, Y2 are separate and connected to each other by soldering, sintering, or bonding with a conductive glue.

[0072] There figure 3 illustrates an electrical diagram of an electronic system in which four elementary switching cells C01, C02, C03, C04 are connected in parallel. In practice, in the following, cell C01 comprises the anode and cathode heat sinks X1, Y1 and the phase heat sinks X2, Y2. Cell C02 comprises the anode and cathode heat sinks U1, V1 and the phase heat sinks U2, V2. Cell C03 comprises the anode and cathode heat sinks A1, B1 and the phase heat sinks A2, B2. Cell C04 comprises the anode and cathode heat sinks I1, J1 and the phase heat sinks I2, J2. For the sake of clarity, the references are not necessarily reported on each of the accompanying figures. A person skilled in the art will nevertheless be able to reproduce without difficulty the different electronic system configurations on the basis of the description and the illustrations.

[0073] THE figures 4 à 25 illustrate different practical embodiments of the electronic system defined in figure 3 .

[0074] According to a first embodiment illustrated in the figure 4 , the four elementary cells C01, C02, C03, C04 are aligned one behind the other in the x direction.

[0075] The electrical connection between the different elementary cells C01, C02, C03, C04 is ensured by an external phase connection 200 between the different phase dissipators X2, Y2, U2, V2, A2, B2, I2, J2, and by an external -DC connection 101 between the different anode dissipators X1, U1, A1, I1, and by an external +DC connection 102 between the different cathode dissipators Y1, V1, B1, J1. The external phase connection 200 is typically in the form of a metal plate 200.

[0076] The external -DC and +DC connections 101, 102 are typically in the form of a busbar 100. The busbar 100 can be of several types, for example and in a known manner: plates, a laminated busbar or a PCB.

[0077] The metal plate 200 and the busbar 100 also provide mechanical support for the elementary cells C01, C02, C03, C04. The electrical connection between the metal plate 200 and the elementary cells on the one hand, and between the busbar 100 and the elementary cells on the other hand, can be made in different ways. For example, and in a known manner, this connection can be made by screws, or by welding, or by brazing, or by an electrically and thermally conductive adhesive, or by sintering, or by transient liquid phase sintering (TLPS). A screw connection allows for easy assembly and disassembly of the cells. Defective cells can thus be easily and advantageously replaced. Brazing or welding improves the electrical contact.

[0078] In this example, the elementary cells C01, C02, C03, C04 can be in contact with each other or spaced apart.

[0079] Preferably, the metal plate 200 and the busbar 100 are located on either side of the block of elementary cells C01, C02, C03, C04, on two opposite sides. This allows better distribution of the electric current between the elementary cells.

[0080] THE figures 5A à 5D present elements that can be added around the block of elementary switching cells illustrated in the figure 4 . As illustrated in the figure 5A , a housing 300 can be advantageously arranged around the block of elementary cells. This housing 300 typically makes it possible to channel the cooling fluid along x in the heat sinks of the elementary cells. This makes it possible to gain in cooling performance.

[0081] This case 300 is preferably electrically insulating. It can be made in different ways, for example by 3D printing, by machining, or by injection of plastic or resin. To perfect the sealing of the case 300 or to fill spaces allowing air to pass between the heat sinks, an insulating foam or any other material capable of ensuring sealing can be used. This case 300 can include fasteners 400 for one or more fans.

[0082] As shown in the figure 5B , electromagnetic compatibility (EMC) screens 501, 502 may advantageously be arranged around the block of elementary cells. These EMC screens 501, 502 are typically configured to limit electromagnetic radiation as well as common mode currents during switching of the power components of the switching cells. These screens 501, 502 are typically in the form of conductive plates polarized at fixed potentials. These EMC screens 501, 502 are preferably at least arranged opposite the phase dissipators, and preferably opposite the anode and cathode dissipators. The screen 501 is preferably located on one side of the cathode dissipators and polarized according to the +DC potential. The screen 502 is preferably located on one side of the anode dissipators and polarized according to the -DC potential. The EMC screens 501, 502 may be in the form of plates, films, metal mesh.It is also possible to use PCBs comprising one or more conductive tracks, for example in the form of a grid, polarized according to one or more potentials. The mass of such a screen 501, 502 based on a PCB is advantageously reduced compared to the mass of a metal plate. It is also possible to envisage producing the transistor control circuits directly on these “PCB” type screens 501, 502.

[0083] To further limit electromagnetic compatibility problems, it is possible to add a 600 screen in front of the air outlet and / or inlet, as shown in figure 5C . This screen 600 can be perforated or textured to allow the coolant to pass through. It is typically polarized according to a fixed potential +DC or -DC. It can alternatively be connected to ground. The EMC screens 501, 502, 600 can advantageously cover as much as possible the phase heat sinks connected to the phase potential. The phase potential is in fact the one that varies the most over time. The EMC screens are therefore more effective compared to the phase heat sinks. According to one possibility, the anode and cathode heat sinks are not covered by the EMC screens. This makes it possible to limit the mass or the size of the system.

[0084] As shown in the figure 5D , control cards 701, 702 can be connected to the switching cells, for example to control the power components of these cells. Decoupling capacitors 800 can also be added at the busbar 100. An air filter (not shown) can also be added to limit fouling on the heat sinks. This reduces the risk of dielectric breakdown. This filter is preferably chosen so as to impose the least possible load losses. This allows good efficiency to be maintained for the cooling of the electronic system.

[0085] There figure 6 presents a cross-sectional view of the electronic system presented in the figure 5D This view allows you to see more precisely certain electrical connections, such as the capacitive side connection X1Y1CP between the anode heat sinks X1 and cathode heat sinks Y1, the conductive side connection X2Y2C between the phase heat sinks X2, Y2, and the EMC shield connections between the shields 501, 502 and the anode and cathode heat sinks X1, Y1.

[0086] The sectional view of the figure 6 also shows the connection between control boards 701, 702 and PCBs X0, Y0 of the elementary modules.

[0087] Other arrangements of elementary cells are possible to form the electronic system illustrated in figure 3 .

[0088] Different principles for arranging these elementary cells are thus presented in the following. The additional elements of the system, such as plates 200, busbar 100, box 300, 400, screens 501, 502, 600, cards 701, 702, are not systematically included in the accompanying drawings. This does not exclude the possibility of adding these elements as described above.

[0089] There figure 7 illustrates a possible arrangement in which the arrangement of the anode and cathode heat sinks is modified from the previous example. In this example, the anode and cathode heat sinks are alternated along x. This allows the +DC and -DC potentials to alternate. Reverse magnetic fields are thus created. This reduces the parasitic inductance within the switching cells.

[0090] Here it is necessary to electrically isolate the heat sinks that are not at the same potential. This can be done by spacing them and / or by placing an insulating material between them. For example, cathode heat sink Y1 is connected to anode heat sink U1 by an axial insulating connection Y1AU1I. Anode heat sink X1 is connected to cathode heat sink V1 by an axial insulating connection X1V1I.

[0091] Other possibilities, not illustrated, for arranging elementary cells aligned along x are also conceivable. The person skilled in the art will easily be able to choose which arrangement of cells is best suited to his needs, thanks to the modularity of the electronic system presented here.

[0092] THE figures 8 à 20 present different embodiments of this same electronic system (four switching cells in parallel) based on a transverse juxtaposition, in an axial direction to x, of two blocks of elementary cells10, 20.

[0093] So, as illustrated in the figure 8 , a first block 10 of two cells C01, C02 is arranged next to a second block 20 of two cells C03, C04.

[0094] The first block 10 comprises two elementary cells C01, C02 aligned one behind the other in the x direction, as before. The second block 20 comprises two elementary cells C03, C04 aligned one behind the other in the x direction, as before. This arrangement makes it possible to reduce the thickness of the heat sinks to be crossed along x for the cooling fluid. This makes it possible to reduce the pressure losses of the fluid flow in the system.

[0095] The first and second blocks 10, 20 may be separated by a separation space E. This makes it possible to electrically isolate the anode dissipators X1, V1 of the first block 10 from the cathode dissipators B1, J1 of the second block 20. This also makes it possible to reserve access for the connections of the blocks 10, 20.

[0096] As before, the busbar 100 electrically connects the anode heat sinks to each other, and the cathode heat sinks to each other. The phase heat sinks are connected by a metal plate 200.

[0097] As shown in the figure 9 , a 300, 400 box, CEM 501, 502, 600 screens (the CEM 600 screen opposite the cell blocks is not shown on the figure 9 in order to leave the interior of the system visible) and control cards 700, 700' can be added around the elementary cell blocks.

[0098] In this example, a control board 700' is arranged in the separation space E between the first and second blocks, in order to control the transistors located at the center of the system. This control board 700' can also be a simple connector connected to the external control board 700. According to a preferred possibility, the separation space E is sealed with an insulating material or other device making it possible to at least partially block the air flow. This makes it possible to force the flow of the cooling fluid into the heat sinks. The cooling efficiency is improved. The insulating material can be solid. Alternatively and advantageously, this material can be in the form of a deformable foam. This makes it possible to limit the mass of the system. This also makes it easy to obstruct certain areas, for example around the control board 700'.Alternatively, the separation space is sealed by resin injection, particularly around the 700' control board.

[0099] As before, other possibilities for arranging elementary cells are possible.

[0100] There figure 10 shows an example of an arrangement where all the cathode heat sinks are located on the sides of the blocks 10, 20, opposite the separation space E. This makes it possible to form a continuous EMC screen 501 around the phase heat sinks and the cathode heat sinks B1, J1, Y1, V1. The EMC screen 501 is thus formed by a single metal plate.

[0101] As before, other arrangement possibilities not shown are also possible. The cathode and anode heat sinks can be reversed. The cathode and anode heat sinks can be alternated in a staggered pattern.

[0102] There figure 11 presents another embodiment where all the anode and cathode dissipators of the two blocks 10, 20 border the separation space E. In this example, the separation space E comprises the external connections 101, 102 +DC and -DC. These external connections 101, 102 +DC and -DC are typically in the form of plates connected to the busbar 100. Such plates 101, 102 parallel to each other over their entire length and polarized according to +DC and -DC make it possible to reduce the parasitic inductance.

[0103] The control boards 701, 702 are simply arranged on either side of the blocks. The external phase connection 200 comprises a phase connector 200' configured to connect the phase dissipators located on opposite sides of the cell blocks.

[0104] There figure 12 illustrates the additional elements (box 300, 400, CEM screens 501, 502, 600) added to the electronic system illustrated in figure 11 .

[0105] There figure 13 is a sectional view of the system, showing in particular the electrical connections between the plate 101 and the cathode heat sinks Y1, B1 on the one hand, and between the plate 102 and the anode heat sinks X1, A1 on the other hand. These connections are here represented by screws but they could be made alternatively by soldering, by gluing, or by sintering for example.

[0106] According to another embodiment, the busbar 100 can be placed perpendicular to the air flow. The busbar 100 can then be solid if it is sufficiently far from the cells so as to leave at least one passage for the air circulation. According to one possibility illustrated in figure 14A , the busbar 100 includes perforations for the passage of air. In this case, it can advantageously act as an EMC screen. This limits the number of EMC screens to be added to the system. The total mass of the system is reduced. A plate 101 can connect the cathode heat sinks to the busbar 100. A plate 102 can connect the anode heat sinks to the busbar 100, as illustrated in figure 14B . As before, a 200' phase connection can be used to connect the phase dissipators together.

[0107] There figure 15 illustrates the additional elements (box 300, 400, CEM screens 501, 502, control cards 701, 702) added to the electronic system illustrated in figures 14A et 14B .

[0108] On the figure 15 , the perforated busbar 100 is located on the fan side. It can alternatively be placed on the side opposite the fan.

[0109] There figure 16 is a sectional view of the system, showing in particular the electrical connections between the plate 101 and the cathode heat sinks Y1, B1 on the one hand, and between the plate 102 and the anode heat sinks X1, A1 on the other hand. These connections are here represented by screws but they could be made alternatively by soldering, by gluing, or by sintering for example. The plates 101, 102 are parallel to each other over their entire length in order to reduce as much as possible the inductance with respect to the external capacitors 800. The design of the plates 101, 102 can be adapted according to the needs. For example, if the need is to reduce the mass of the system, shorter plates may be suitable (as illustrated in figure 17 ). If the need is to limit parasitic inductance as much as possible, parallel plates along their entire length are preferable, as shown in figure 16 .

[0110] According to a possibility illustrated in the figure 17 , PCBs 700 can be arranged around the cells to channel the air in the system. The PCBs 700 therefore replace the housing 300. This reduces the total mass of the system. The PCBs 700 can also provide the EMC shield function. They can further provide the control function for the transistors of the switching cells. The PCB-based housing is thus advantageously functionalized. An insulating material 70, such as a foam, can be used to seal the spaces between the housing and the elementary cell blocks.

[0111] There figure 18 illustrates another possibility of arranging the switching cells in parallel. The relative arrangement of the anode and cathode dissipators within each block 10, 20 here makes it possible to reduce the magnetic field generated by the cells during switching. The parasitic inductance is thus reduced. The connection between the different dissipators and the busbar 100 can be made by multilayer conductive plates 101, 102, 200. These multilayer conductive plates can be in the form of PCBs or laminated busbars. Alternatively, the connections can be made by simple plates separated by electrical insulators.

[0112] Electrical insulators 1010, 2020 may be provided between the phase dissipators of a given cell and the anode and cathode dissipators of an adjacent cell.

[0113] There figure 19presents an embodiment where the two cell blocks are adjacent by their phase dissipators. A phase plate 200 connects the phase dissipators together. In this case, the busbar can be split into several parts 100, 100'. Connectors 101, 102 can then make it possible to connect these two parts 100, 100' to the cathode and anode dissipators.

[0114] There figure 20 illustrates the additional elements (housing 400, CEM screen 600, functionalized control cards 701, 702, decoupling capacitors 800) added to the electronic system illustrated in figure 19 .

[0115] THE figures 21 à 25 present different embodiments of this same electronic system (four switching cells in parallel) based on a transverse juxtaposition, in an axial direction to x, of all the elementary cells.

[0116] As shown in the figure 21 , the four switching cells can be juxtaposed along y and / or z. The heat sinks are arranged in a single row, parallel to the yz plane. This further reduces the pressure losses in the heat sinks during cooling.

[0117] As previously, a first block 10 of two cells C01, C02 is arranged next to a second block 20 of two cells C03, C04.

[0118] The first block 10 comprises two elementary cells C01, C02 connected by a central connection between the phase dissipators X2, Y2, U2, V2. The second block 20 comprises two elementary cells C03, C04 connected by a central connection between the phase dissipators A2, B2, I2, J2. This arrangement makes it possible to reduce the thickness of the dissipators to be crossed along x for the cooling fluid. This makes it possible to reduce the pressure losses of the fluid flow in the system.

[0119] The first and second blocks 10, 20 may be separated by a separation space E, as previously. This space may typically comprise one or more control cards 700'. An insulating foam 70 may seal the remaining space between the cards 700' and the cell blocks 10, 20.

[0120] In the embodiment illustrated in the figure 21 , the busbar 100 is placed perpendicular to the air flow. It is configured to deliver the +DC, -DC and phase potentials. It is connected to the heat sinks by metal plates 101, 102, 200. The control of the power components can be carried out from a motherboard 700" connected to the control cards 700, 700' which bring the control signals to the transistors of the elementary switching cells.

[0121] There figure 22 illustrates the additional elements (box 300, 400, CEM screen 600, decoupling capacitors 800) added to the electronic system illustrated in figure 21 .

[0122] In the embodiment illustrated in the figure 23 , the 700" motherboard is perforated and placed perpendicular to the airflow, like the 100 busbar. It can then act as an EMC screen. This board is preferably connected to all other 700, 700' control boards (on the side and between the heatsinks).

[0123] In the embodiment illustrated in figures 24 And 25 , the motherboard 700" is perforated and placed perpendicular to the airflow. The busbar 100 is solid and placed perpendicular to the airflow. In this case, the busbar 100 is sufficiently far from the cells so as to leave at least one passage 301 for the circulation of air, for example between the case 300 and the busbar 100.

[0124] The cell arrangements described above illustrate the modularity of the electronic system. Other electronic systems, typically multi-phase systems with potentially many components in parallel, can be easily derived from the arrangements described above. In the following, embodiments of single-phase and three-phase inverters are presented.

[0125] There figure 26 illustrates an electrical diagram of a single-phase two-level voltage inverter electronic system, in which each inverter arm comprises two switching cells in parallel.

[0126] THE figures 27 And 28 illustrate two examples of the implementation of such a single-phase inverter.

[0127] In the embodiment illustrated in the figure 27 , the two inverter arms are formed by two blocks of cells aligned along x. The first block comprises the two cells centrally connected by their phase dissipators A2, B2, X2, Y2. A phase plate 201, configured to be polarized according to a first phase potential, connects the dissipators A2, B2, X2, Y2 together. The second block comprises the two cells centrally connected by their phase dissipators V2, U2, I2, J2. A phase plate 202, configured to be polarized according to a second phase potential, connects the dissipators V2, U2, I2, J2 together. An insulator 2122 makes it possible to isolate the phase dissipators which are not at the same potential. This insulator extends here along a yz plane.

[0128] In the embodiment illustrated in the figure 28 , the two inverter arms are formed by two blocks of cells superimposed along z. The first block comprises the two cells connected axially by their phase dissipators A2, B2, I2, J2. A phase plate 201, configured to be polarized according to a first phase potential, connects the dissipators A2, B2, I2, J2 together. The second block comprises the two cells connected axially by their phase dissipators V2, U2, X2, Y2. A phase plate 202, configured to be polarized according to a second phase potential, connects the dissipators V2, U2, X2, Y2 together. As previously, an insulator 2122 makes it possible to isolate the phase dissipators which are not at the same potential. This insulator extends here along an xy plane. It is possible to easily add other elementary cells on each inverter arm by aligning them along x and connecting them axially with the already connected cells, and by lengthening along x the phase plates 201, 202.

[0129] There figure 29 illustrates an electrical diagram of a three-phase two-level voltage inverter electronic system, in which each inverter arm comprises eight switching cells in parallel.

[0130] There figure 30A illustrates an example of the implementation of a three-phase inverter derived from the electrical diagram of the figure 29 , in which each inverter arm comprises eight switching cells in parallel.

[0131] In this embodiment, the three inverter arms are formed by three blocks 10, 20, 30 of cells, said blocks being adjacent along y. Each block comprises two sub-blocks of cells, said sub-blocks being aligned and axially connected to each other. Each sub-block comprises four centrally connected cells. For example, the first sub-block of block 10 comprises cells C01, C02, C03, C04. Cells C01, C02 are centrally connected by their phase dissipators. Cells C02, C03 are centrally connected by their anode and cathode dissipators. Cells C03, C04 are centrally connected by their phase dissipators. The same type of connection can be made for the cells of the other sub-blocks of blocks 10, 20, 30.

[0132] The phase sinks of the first block are configured to be biased at a first phase potential. The phase sinks of the second block are configured to be biased at a second phase potential. The phase sinks of the third block are configured to be biased at a third phase potential. The blocks 10, 20, 30 may be separated from each other by separation spaces. This isolates phase sinks that are not at the same potential. The separation spaces may include control boards 700' and insulating foam, as previously illustrated in other embodiments.

[0133] Busbar 100 is here configured to deliver the first, second, third phase potentials and the +DC and -DC potentials.

[0134] There figure 30B illustrates an embodiment comprising a perforated 700" motherboard, connecting the control boards 700, 700'. The boards 700 and 700" can serve as an EMC shield. The figure 30C illustrates a box 300, 400 associated with the system illustrated in the figure 30B .

[0135] There figure 31 shows a cross-section of the three-phase inverter system of the figure 30A , where the connections 701, 702 between the control cards 700, 700' and the elementary cells are seen. The connection plates 101, 102 connecting the busbar 100 to the anode and cathode heat sinks, and the connection plates 201, 202, 203 connecting the busbar 100 to the phase heat sinks respectively polarized according to the first, second, third phase potentials, are also visible on the figure 31 .

[0136] Other arrangements of elementary cells and / or elementary modules can be envisaged to form other electronic systems.

[0137] There figure 32 illustrates an electrical diagram of a switching cell in which each arm comprises four power components in series. The potentials +DC, -DC, phase and intermediate potentials noted V1 to V6 are reported on this figure 32 , in order to clarify the internal connections to the elementary modules.

[0138] In this example arrangement, the switching cell comprises two elementary modules formed as follows: The first elementary module comprises, in the following connection order: a cathode dissipator, a first component, an intermediate dissipator polarized according to V1, a second component, an intermediate dissipator polarized according to V2, a third component, an intermediate dissipator polarized according to V3, a fourth component, a phase dissipator.

[0139] The second elementary module includes, in the following connection order: an anode dissipator, a fifth component, an intermediate dissipator polarized according to V6, a sixth component, an intermediate dissipator polarized according to V5, a seventh component, an intermediate dissipator polarized according to V4, an eighth component, a phase dissipator.

[0140] The anodic and cathodic heat sinks are connected by a capacitive electrical connection, for example axial or lateral. The phase heat sinks are connected by a conductive electrical connection. The intermediate heat sinks are insulated from each other.

[0141] THE figures 33 à 39 illustrate different practical embodiments of the electronic system defined in figure 32 .

[0142] According to an embodiment illustrated in the figure 33 , the elementary components are located along two superimposed xy planes, and the phase dissipators P1, P2 are aligned with the anode and cathode dissipators X1, Y1 along the x direction of flow of the cooling fluid. The capacitive electrical connection X1Y1CP between the anode and cathode dissipators is lateral, as described previously. The phase dissipators are insulated from the anode and cathode dissipators by an insulator 1111 allowing the cooling fluid to pass through, for example an insulating foam.

[0143] According to an embodiment illustrated in the figure 34 , the elementary components are located along two superimposed xy planes, and the phase dissipators P1, P2 are adjacent to the anode and cathode dissipators X1, Y1 along the lateral direction y. The capacitive electrical connection X1Y1CP between the anode and cathode dissipators is here axial. It extends parallel to the direction x of flow of the cooling fluid, in order to avoid blocking the flow. The phase dissipators are isolated from the anode and cathode dissipators by an insulator 2222, which is not necessarily permeable to the cooling fluid.

[0144] In both cases illustrated in figures 33 , 34, the adjacent heat sinks which are polarized according to different potentials must be electrically isolated from each other by electrical insulators 1111, 2222. Some insulators 1111 are configured to allow the cooling fluid to pass through. The intermediate heat sinks polarized at the potentials V1, V3, V4 and V6 can be made with heat sinks higher than the others, according to z, called XL heat sinks. This makes it possible to keep the same exchange surface on either side of each elementary component. According to one possibility, each of these intermediate XL heat sinks can be replaced by two “standard” heat sinks identical to the others and assembled according to a central conductive electrical connection.

[0145] According to an embodiment illustrated in the figure 35 , the elementary components are all located in the same xy plane, and the phase dissipators P1, P2 are aligned with the anode and cathode dissipators X1, Y1 along the x direction of flow of the coolant. The capacitive electrical connection X1Y1CP between the anode and cathode dissipators is lateral, as described previously. In this example, the intermediate dissipators at potentials V2, V3 are interposed between the phase dissipators P1, P2 and the anode and cathode dissipators X1, Y1 along the x direction.

[0146] According to an embodiment illustrated in the figure 36 , the elementary components are all located in the same xy plane, and the phase dissipators P1, P2 are adjacent to the intermediate dissipators at potentials V2, V3, in the lateral direction y. The anodic and cathodic dissipators X1, Y1 are also adjacent to the intermediate dissipators at potentials V2, V3, in the lateral direction y. The capacitive electrical connection X1Y1CP between the anodic and cathodic dissipators is axial. In this example, the intermediate dissipators at potentials V2, V3 are interposed between the phase dissipators P1, P2 and the anodic and cathodic dissipators X1, Y1 in the y direction. The flow pressure losses along x are reduced in this embodiment.

[0147] As previously, electrical insulators 1111, 2222, respectively permeable or possibly non-permeable, make it possible to electrically isolate the adjacent dissipators which are polarized according to different potentials.

[0148] According to an embodiment illustrated in the figure 37 , the elementary components are all located in the same xy plane, and the phase dissipators P1, P2 are aligned with the anode and cathode dissipators X1, Y1 along the x direction of flow of the coolant. The capacitive electrical connection X1Y1CP between the anode and cathode dissipators is lateral, as previously described. In this example, the phase dissipators P1, P2 and the anode and cathode dissipators X1, Y1 are adjacent. The pressure losses of the flow along x are reduced in this embodiment.

[0149] According to an embodiment illustrated in the figure 38 , the elementary components are all located in the same xy plane, and the phase dissipators P1, P2 are adjacent to the anode and cathode dissipators X1, Y1, in the lateral direction y. The capacitive electrical connection X1Y1CP between the anode and cathode dissipators is axial (not shown).

[0150] In both cases illustrated in figures 37 , 38 , this type of assembly allows to modify the parasitic capacities and inductances within the switching cell compared to previous examples. This allows to modify and adapt the behavior of the electronic system during switching, according to needs.

[0151] As previously, electrical insulators 1111, 2222, respectively permeable or possibly non-permeable, make it possible to electrically isolate the adjacent dissipators which are polarized according to different potentials.

[0152] There figure 39 illustrates the additional elements (housing 300, 400, perforated control card 700, EMC screens 501, 502, external connections -DC 101, +DC 102, phase 200) added to the electronic system illustrated in figure 37 .

[0153] Other embodiments of electronic systems are easily conceivable from the examples described and illustrated in this application.

Claims

1. Power electronic system comprising a plurality of power components (X00A, Y00A) and a plurality of electrically conductive heat dissipaters (X1, X2, Y1, Y2, U1, U2, V1, V2, A1, A2, B1, B2, I1, I2, J1, J2), each of said power components (X00A) being arranged between two electrically conductive heat dissipaters (X1, X2) of the plurality of electrically conductive heat dissipaters, at least one electrically conductive heat dissipater being configured to be polarised according to a phase potential, referred to as a phase dissipater (X2, Y2, U2, V2, A2, B2, I2, J2), at least one electrically conductive heat dissipater being configured to be polarised according to a +DC potential, referred to as a cathode dissipater (Y1, V1, B1, J1), and at least one electrically conductive heat dissipater configured to be polarised according to a -DC potential, referred to as an anode dissipater (X1, U1, A1, I1), the system further comprising at least one external phase connection (200, 201, 202), and at least one external +DC connection (100, 101), and at least one external -DC connection (100, 102) respectively connected to the phase dissipater, to the cathode dissipater and to the anode dissipater, wherein the power components and the electrically conductive heat dissipaters are assembled so as to form elementary switching cells (C0, C01, C02, C03, C04) connected in parallel, each elementary switching cell comprising: - a first elementary power electronics module (1), referred to as a first elementary module (1), - a second elementary power electronics module (2), referred to as a second elementary module (2), the first elementary module (1) comprising: - an electrically conductive heat dissipater (X1) configured to be polarised according to a -DC potential, referred to as an anode dissipater (X1), and - an electrically conductive heat dissipater (X2) configured to be polarised according to a phase potential, referred to as the first phase dissipater (X2), - a first power component (X00A) arranged between the anode dissipater (X1) and the first phase dissipater (X2), the second elementary module (2) comprising: - an electrically conductive heat dissipater (Y1) configured to be polarised according to a +DC potential, referred to as a cathode dissipater (Y1), - an electrically conductive heat dissipater (Y2) configured to be polarised according to the phase potential, referred to as a second phase dissipater (Y2), - a second power component (Y00A) arranged between the cathode dissipater (Y1) and the second phase dissipater (Y2), said first and second elementary modules (1, 2) being adjacent in a lateral connection direction (y) and connected together by a conductive lateral electrical connection (X2Y2C) between the first and second phase dissipaters, and by a capacitive lateral electrical connection (X1Y1CP) between the anode and cathode dissipaters, wherein the anode and cathode dissipaters (X1, Y1) and the phase dissipaters (X2, Y2) of the elementary switching cells (C01) are configured to let a cooling fluid pass in an axial direction (x) normal to the lateral connection direction (y), and in that the elementary switching cells (C01, C02, C03, C04) are assembled one behind the other in the axial direction (x), such that the anode dissipaters (X1, U1, A1, I1) of said cells are aligned one behind the other in the axial direction (x), and in that the cathode dissipaters (Y1, V1, B1, J1) of said cells are aligned one behind the other in the axial direction (x), and in that the first phase dissipaters (X2, U2, A2, I2) of said cells are aligned one behind the other in the axial direction (x), and in that the second phase dissipaters (Y2, V2, B2, J2) of said cells are aligned one behind the other in the axial direction (x).

2. System according to the preceding claim, wherein the external phase connection (200) is made on a first side of the cells formed by the first and second phase dissipaters (X2, Y2), and the external +DC and -DC connections are made on a second side of the cells formed by the anode and cathode dissipaters (X1, Y1), said second side being opposite the first side.

3. System according to any one of the preceding claims, comprising at least a first block (10) and a second block (20) of elementary switching cells assembled one behind the other in the axial direction (x), said at least first and second blocks (10, 20) being adjacent and connected in a central connection direction (z) so that the first and second phase dissipaters (U2, V2, X2, Y2) of the first block (10) are connected to the first and second phase dissipaters (A2, B2, I2, J2) of the second block (20).

4. System according to the preceding claim, wherein the external +DC and -DC connections (101, 102) respectively comprise +DC and -DC connectors configured to respectively connect the cathode dissipaters (B1, J1) of the second block with the cathode dissipaters of the first block (V1, Y1), and the anode dissipaters of the second block (I1, A1) with the anode dissipaters (U1, X1) of the first block.

5. System according to any one of the preceding claims, comprising at least a first block (10) and a second block (20) of elementary switching cells assembled one behind the other in the axial direction (x), said at least first and second blocks being adjacent and separated in the lateral connection direction (y) by a separation space (E).

6. System according to the preceding claim, wherein the separation space (E) comprises at least one control board (700') configured to control the power components of the elementary switching cells of each of the first and second blocks, and caulking (70) configured to block a passage of the cooling fluid.

7. System according to any one of the two preceding claims, wherein the cathode dissipaters (Y1, V1, J1, B1) of the first and second blocks border the separation space (E) or wherein the anode dissipaters (X1, U1, A1, I1) of the first and second blocks border the separation space (E).

8. System according to any one of claims 5 or 6, wherein the cathode and anode dissipaters (Y1, V1, J1, B1, X1, U1, A1, 11) of the first and second blocks border the separation space and wherein the first and second phase dissipaters (X2, Y2, U2, V2) of the first block (10) are located on a side of the cells of the first block opposite the separation space (E), and wherein the first and second phase dissipaters (A2, I2, J2, B2) of the second block (20) are located on a side of the cells of the second block opposite the separation space.

9. System according to the preceding claim, wherein the separation space (E) comprises the external +DC and -DC connections (101, 102) and wherein the external phase connection (200) comprises a phase connector (200') configured to connect the first and second phase dissipaters of the second block with the first and second phase dissipaters of the first block.

10. System according to claim 5 or 6, wherein the elementary switching cells of each of the first and second blocks are assembled one behind the other in the axial direction (x), so that the anode dissipater (U1) of a given cell is aligned with one of the first and second phase dissipaters (X2, Y2) of an immediately adjacent cell in the axial direction (x), and the cathode dissipater (V1) of said given cell is aligned with the other one of the first and second phase dissipaters (X2, Y2) of the immediately adjacent cell in the axial direction (x), said anode and cathode dissipaters (1010, 2020) being electrically insulated with respect to said first and second phase dissipaters.

11. System according to any one of the preceding claims, wherein the external +DC and -DC connections (101, 102) are connected to a busbar (10), and wherein the busbar is arranged transversely to the axial direction (x), the busbar (100) being configured to let the cooling fluid pass.

12. System according to the preceding claim, wherein the busbar (100) is in the form of a perforated grid.

13. System according to any one of the preceding claims, further comprising at least one control board (700, 701, 702) surrounding the elementary switching cells, such that said at least one control board forms a casing configured to channel the cooling fluid in the axial direction (x).

14. System according to any one of the preceding claims, wherein a first portion of the elementary switching cells has first and second phase dissipaters configured to be polarised according to a first phase potential and a second portion of the elementary switching cells has first and second phase dissipaters (2122) electrically insulated with respect to the first and second phase dissipaters of the first portion of cells, and configured to be polarised according to a second phase potential different from the first phase potential, and wherein the at least one external phase connection (200) comprises a first external phase connection (201) connected to the polarised dissipaters according to the first phase potential, and a second external phase connection (202) connected to the polarised dissipaters according to the second phase potential.

15. System according to the preceding claim, wherein the elementary switching cells of the first portion are connected via their first and second phase dissipaters (X2, Y2, A2, B2) in a central connection direction (z), and the elementary switching cells of the second portion are connected via their first and second phase dissipaters (U2, I2, J2, V2) in the central connection direction (z), such that the phase dissipaters of the cells of the first portion are aligned with the phase dissipaters of the cells of the second portion in the axial direction (x).

16. System according to claim 14, wherein the elementary switching cells of the first portion are connected via their first and second phase dissipaters (X2, Y2, U2, V2) in the axial direction (x), and the elementary switching cells of the second portion are connected via their first and second phase dissipaters (B2, A2, I2, J2) in the axial direction (x), such that the phase dissipaters of the cells of the first portion are aligned with the phase dissipaters of the cells of the second portion in a central connection direction (z).

17. System according to claim 14, wherein a third portion (30) of the elementary switching cells has first and second phase dissipaters configured to be polarised according to a third phase potential, and wherein the at least one external phase connection comprises a third external phase connection connected to the polarised dissipaters according to the third phase potential.

18. System according to any one of the preceding claims, further comprising a casing (300, 400) configured to surround the plurality of electrically conductive dissipaters, so as to channel a passage of a cooling fluid in said electrically conductive heat dissipaters.

19. System according to any one of the preceding claims, further comprising at least one electromagnetic compatibility shield (501, 502) configured to be polarised according to the +DC or -DC potential, at least partially surrounding the at least one phase dissipater.

20. System according to any one of the preceding claims, further comprising at least one control board (700, 701, 702, 700', 700") configured to control the plurality of power components and at least partially surrounding the plurality of electrically conductive heat dissipaters.