Metal-ceramic mixed package substrate plated with non-magnetic layer stack
DE602024001766T2Active Publication Date: 2025-12-24ADVANCED TECHNICAL CERAMICS CO
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Patent Information
- Application Number
- DE602024001766
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-03-10
- Filing Date
- 2024-03-11
- Publication Date
- 2025-12-24
- Estimated Expiration
- 2044-03-11
AI Technical Summary
Technical Problem
Existing IC device packaging technologies include magnetic materials like nickel, which can interfere with circuit performance, are not biocompatible, and fail to meet high electrical and thermal performance requirements, especially in medical applications.
Method used
A ceramic package with a non-magnetic metallization stack comprising a base metal layer, a palladium-based layer, and a gold-based layer, formed through a high temperature co-firing process, eliminating magnetic metals and ensuring biocompatibility and high performance.
Benefits of technology
The solution provides improved adhesion, planarity, and hermetic sealing while maintaining high electrical and thermal performance, suitable for biocompatible applications without electrical shorts or toxicity issues.
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