Operating device with heat conducting structure

Abstract

The present invention relates to a control device (1) for a lamp, in particular for an LED lamp, wherein the control device (1) comprises: a coil (2) with a coil core (3), and a heat conducting structure (4, 4') which is in planar contact with the coil core (3) in order to conduct the heat emitted by the coil core (3) during operation of the coil (2) away from the coil core (3).

Description

[0001] The invention relates to a control device for a lamp, in particular for an LED lamp.

[0002] Control devices of the type mentioned above are used to operate light sources, especially LEDs, for example, to supply the light with a specific voltage and / or current. Other examples of applications include pulse-width modulation, brightness control (especially dimming), and / or general control of the light source. For this purpose, coils are used, for example, in a transformer, to provide and / or store energy so that the light can be operated accordingly. Other applications of coils in such control devices include, for example, coils for power factor correction (PFC), coils in an LLC converter, coils for mains input throttling, coils in flyback converters, or coils generally for energy (intermediate) storage.

[0003] It is known that coils or coil combinations, such as transformers, or magnetic components generally do not operate without losses and therefore emit heat or waste heat in an undesirable manner. In particular, the windings and the core of the coil dissipate a significant amount of heat. This heat must be dissipated as efficiently as possible so that it does not affect other electrical and / or electronic components, as the undesirably high temperatures can shorten the service life of the respective electrical and / or electronic component and thus of the control gear. Capacitive components, in particular, are sensitive to such high temperatures. In the prior art, it is known to conduct the waste heat directly to the housing of the control gear or the luminaire using thermal paste, especially so-called TIM (thermal interface material) gap pads. However, this is not very effective and is also relatively expensive.

[0004] EP 1 528 577 A1 discloses a device which has a plastic housing, wherein the plastic housing is designed in such a way that, regardless of manufacturing tolerances, it always rests against the iron core of the coil element (transformer or choke) used, in order to enable good heat dissipation.

[0005] DE 10 2008 048977 A1 discloses an electronic compact assembly for mounting on a printed circuit board, with a housing in which a transformer is arranged and potted.

[0006] CN 104 240 926 A discloses a transformer structure comprising a shell having a space, an induction unit and a thermally conductive adhesive, wherein the adhesive fills the space to cover the induction unit.

[0007] DE 198 14 897 A1 discloses a high-power inductive component comprising a toroidal core, wherein the core provided with a winding is located in a metal housing, and the spaces within the metal housing are filled with a casting compound, wherein the self-contained core is cooled by at least one rod-shaped heat pipe.

[0008] EP 0 432 670 A2 discloses a ballast with an outer housing having high thermal conductivity, wherein a heat-radiating part is in planar contact with at least one inner surface of the housing.

[0009] EP 3 319 096 A1 discloses a magnetic core with at least one coil and a cooling structure comprising a non-metallic, thermally conductive element constructed as a heat pipe and arranged inside a hole or cavity of the core.

[0010] US patent 2002 / 135983 A1 discloses an energy-converting device comprising a thermally conductive base and a thermally conductive cover that can be joined to the base to form an enclosed space.

[0011] DE 203 17 641 U1 discloses a heat conduction bridge for toroidal core inductors.

[0012] WO 2017 / 154696 A1 discloses a circuit arrangement comprising a printed circuit board, a heat sink mounted on the printed circuit board, and an inductor.

[0013] WO 2017 / 154954 A1 discloses a circuit structure comprising a coil device and a heat sink to which the coil device is secured.

[0014] JP S61 105814 A discloses an electromagnetic device wherein three peripheral surfaces of a coil are covered with radiating surfaces, so that heat from the coil is transferred to the surfaces.

[0015] US 4,082,141 A discloses a ballast with a thermal path.

[0016] The JP H05 67043 U3 reveals a structure for holding, for example, a transformer.

[0017] DE 87 16 135 U1 discloses a transformer with a magnetic core, wherein base fastening elements are provided on which vertically rising lobes are molded, wherein partial areas of the edges of the lobes are welded together.

[0018] The invention is based on the objective of eliminating the aforementioned disadvantages of the prior art, in particular to conduct the heat from coils more efficiently or, more generally, to optimize the heat generation of such operating devices.

[0019] The problem is solved according to the invention for the operating device by the features of the independent claim. Advantageous further developments are the subject of the dependent claims relating thereto.

[0020] An operating device according to the invention for a lamp, in particular for an LED lamp, comprises: a coil with a coil core, and a heat conduction structure which is in planar contact with the coil core in order to conduct the heat emitted by the coil core during operation of the coil away from the coil core.

[0021] In other words, the coil core generates waste energy in the form of heat during operation. This heat is efficiently transferred to the heat-conducting structure, which is in contact with the coil core over a large area, thus cooling the core effectively. This means that the heat-conducting structure's contact with the coil core allows the heat to be efficiently conducted along a desired path defined by the heat-conducting structure – specifically, to a heat-dissipating and / or heat-distributing element of the luminaire, such as a heat sink. This cools the coil core and removes the heat, while simultaneously preventing other electrical and / or electronic components, or components of the control gear in general, from being affected by this heat. Consequently, the cooling efficiency of the coil core is improved. Furthermore, this also extends the service life of the coil core.The reliability of the control gear is increased because waste heat from the coil core has less of an impact on the control gear components, especially those located near the coil. Consequently, the control gear can also be used in higher ambient temperatures.

[0022] The control gear also includes a printed circuit board (PCB). The coil with its heat-conducting structure is positioned on one side of the PCB in such a way that the heat-conducting structure directs the heat emitted by the coil core away from the core and the first side to the opposite side of the PCB. Since sensitive electrical and / or electronic components, such as capacitive components, are typically located on the coil side or the first (front) side of the PCB, these components are no longer affected by the heat dissipation to the second (back) side of the PCB via the heat-conducting structure. Thus, the components of the control gear, in particular, are protected from the coil's heat. And because the coil is also less exposed to its heat, its size can be reduced.

[0023] It is preferred that the coil core is arranged between walls of the heat-conducting structure that are in full contact with the coil core. This allows the heat-conducting structure to be easily placed onto the coil core, automatically ensuring full contact. Furthermore, the full contact area of ​​the heat-conducting structure's walls increases the heat-dissipating surface, thus improving the efficiency of heat dissipation and cooling.

[0024] The heat conduction structure can be a wall that completely surrounds at least the coil core. On the one hand, this allows the heat conduction structure to be easily, and especially automatically, brought into full contact with the coil core when it is installed. On the other hand, the surface area of ​​the heat conduction structure is increased, which in turn benefits cooling. Because of the closed wall, good thermal insulation of the components located outside the wall can also be achieved. Furthermore, air can reach the coil or coil core through the opening defined by the wall, thus improving convective heat transfer between the air and the coil core and consequently the cooling efficiency.

[0025] The heat-conducting structure can be a hood or cap covering at least the coil core, preferably having a substantially U-shaped cross-section. Air can flow through the openings defined by the hood or the preferably U-shaped cross-section, thereby improving convective heat transfer within the hood. Furthermore, the coil core is covered above it, thus protecting components of the operating device, particularly in this direction, from heat generated by the coil core. The heat-dissipating surface is also increased, which in turn benefits more efficient cooling of the coil core. Finally, the heat-conducting structure can be easily placed or plugged, preferably clamped, onto the coil or coil core.

[0026] Preferably, the heat-conducting structure has a mounting section for attaching it to the operating device, particularly to the circuit board, and / or to the coil. By preferably providing the mounting section as an integral part of the design, the heat-conducting structure can be easily connected to or mounted on the operating device and / or the coil, for example, via a material-locking, force-locking, and / or form-locking connection. It is preferred that the free ends of the housing or the base of the wall incorporate the mounting section, thus enabling particularly easy installation of the heat-conducting structure.

[0027] The heat-conducting structure, preferably the mounting section, has legs for dissipating heat towards the other side of the printed circuit board (PCB). Providing these legs increases the heat-dissipating area, which in turn enhances the cooling effect of the heat-conducting structure. Furthermore, the legs are advantageously shaped for connection to other heat-dissipating elements. The legs extend through the PCB. Thus, the legs advantageously conduct heat directly from the front (first side) to the back (second side) of the PCB. Because the legs extend through the PCB, they can also simultaneously serve as fasteners for attaching the heat-conducting structure to the PCB.

[0028] Preferably, the legs are designed to be connected to a heat-dissipating and / or heat-distributing element of a luminaire and / or the control gear. This allows the legs to be used to directly conduct the waste heat from the coil core to these heat-dissipating and / or heat-distributing elements, and thus, in particular, to direct it away from heat-sensitive components of the control gear. The legs are preferably connected to a heat-dissipating and / or heat-distributing element of the control gear. This ensures that the heat emitted by the coil core and transferred to the heat-conducting structure is directed only to this heat-dissipating and / or heat-distributing element.

[0029] The heat-dissipating and / or heat-distributing element is preferably a heat sink or other large-area component for heat dissipation. This allows the waste heat to be transferred from the operating device, for example to the ambient air, in a particularly advantageous manner, thus achieving efficient cooling.

[0030] The thermal conductivity structure can be made of a material containing metal, preferably copper and / or aluminum. These materials have particularly high thermal conductivity, making them especially suitable for efficient cooling of the coil core or for heat conduction via the thermal conductivity structure. Alternatively or additionally, the material can consist (only) of plastic (designed for high thermal conductivity). The thermal conductivity structure can thus be designed not only to cool the coil core but also to electrically insulate the coil.

[0031] In a preferred embodiment, the coil core is a ferrite core. Ferrite is particularly well suited to conducting the magnetic flux of the coil.

[0032] It is preferred that the heat conduction structure has cooling fins. This gives the heat conduction structure a surface area optimized for heat dissipation and conduction, and thus, in particular, an increased surface area. The cooling fins are preferably integral to the heat conduction structure, or the heat conduction structure is preferably shaped in such a way that it forms the cooling fins. The cooling fins are preferably provided on at least one side of the heat conduction structure facing away from the coil core, so that the heat from the coil core can be efficiently dissipated. Preferably, the cooling fins are uniformly distributed across the surface of the heat conduction structure.It is further preferred if the cooling fins are provided on the entire surface of the heat conducting structure, wherein this surface preferably includes the surface of the heat conducting structure which faces away from the coil core, and / or the surface of the heat conducting structure which faces the coil core.

[0033] The coil is a transformer coil, with the coil core being designed as a transformer core. A transformer coil, and in particular its transformer core, is known to generate a significant amount of heat due to voltage conversion. The aforementioned heat-conducting structure is therefore particularly well-suited to efficiently dissipate this heat, thus preventing it from affecting the transformer or other components.

[0034] The transformer core comprises: a first section for electromagnetic interaction with a primary winding, a second section for electromagnetic interaction with a secondary winding, and a third section for connecting the first and second sections to conduct the magnetic flux between them. The heat-conducting structure then makes full contact with the third section. Since the third section is exposed to all windings and also has a large heat-dissipating surface, the heat-conducting structure can be brought into full contact with this entire surface, thus improving heat dissipation and cooling efficiency. Furthermore, the third section is easily accessible from outside the coil, allowing the heat-conducting structure to be easily brought into full contact with the transformer core.

[0035] The invention further relates to a lamp, in particular an LED lamp, comprising a light source, preferably an LED, and a control device as described above for operating the light source.

[0036] The invention is described below by way of example with reference to the figures, which illustrate advantageous embodiments of the invention. The figures show: Figure 1 is a schematic perspective view of a (section of) embodiment of a first embodiment of the operating device according to the invention; Figure 2 is a side view of the [device / unit] in [Figure 1]. Figure 1 The exemplary embodiment shown, Figure 3 a schematic perspective view of an (excerpt of) exemplary embodiment of a second embodiment of the operating device according to the invention, and Figure 4 the in Figure 3 Operating device shown in a perspective view from below.

[0037] The figures described below show two exemplary embodiments of a control gear 1 according to the invention. For the sake of simplicity, only a schematic section of the control gear is shown, not the entire control gear. The control gear 1 is used with a luminaire, in particular an LED luminaire. A luminaire (not shown in detail) can be operated by means of the control gear 1, in particular so that the luminaire emits light in a desired manner. Exemplary applications of the control gear 1 are the supply of voltage and / or current, pulse width modulation, the adjustment of brightness (in particular dimming), and / or the general control of the light source.

[0038] As can be seen in the figures, the operating device 1 has a transformer coil 2 with a transformer core 3, wherein a heat conducting structure 4, 4' is in planar contact with the transformer core 3 in order to cool the transformer core 3 or to conduct away the heat emitted by the transformer core 3 during the operation of the transformer or the transformer coil 2 from the transformer core 3.

[0039] The thermal conductivity structure 4, 4' is not limited to a transformer coil 2 with a transformer core 3. Rather, the thermal conductivity structure 4, 4' is suitable for any coil with a coil core used in an operating device. Examples include coils for power correction (PFC), coils in an LLC converter, coils for mains input throttling, coils in flyback converters, or coils generally for energy (intermediate) storage. The description therefore applies analogously to any coil with a coil core.

[0040] The figures show that the transformer coil 2 has a transformer core 3 and a transformer body 6. The transformer core 3 is made of ferrite, for example, but can be made of any other material suitable for conducting magnetic flux. The transformer core 2 has a first section for electromagnetic interaction with a primary winding and a second section for electromagnetic interaction with a secondary winding. These are preferably enclosed in the transformer body 6 and are therefore not visible. The windings interacting with the transformer core 3 cause voltage to be converted, in particular from a high voltage on the primary winding side to a lower voltage on the secondary winding side, the latter typically being used to operate the light source at the lower voltage.Furthermore, a third section 3a is discernible, which connects the first section to the second section in order to conduct the magnetic flux between the first and second sections. The third section 3a is not provided in the transformer body 6 and is therefore readily accessible to the heat conduction structure 4. This means that when the heat conduction structure 4 is placed on the transformer coil 2, the heat conduction structure 4 preferably (only) comes into planar contact with the third section 3a.

[0041] The operating device 1 can further comprise a printed circuit board (PCB) 5, wherein the transformer coil 2 with the heat conducting structure 4, 4' is provided on a first side or on the front side of the printed circuit board 5. As in Figure 4As can be clearly seen, the circuit board 5 may in particular have an opening through which a terminal 8 of the transformer coil 2 is accessible from the back of the circuit board 5 for connecting a light source and / or a voltage source to the transformer coil 2. In addition, in Figure 4 It is evident that the transformer coil 2 can have several pins 9, which preferably pass through the circuit board 9 and electrically connect the transformer coil 2 to electrical and / or electronic components of the circuit board.

[0042] In general, the heat conduction structure 4, 4' preferably has a configuration such that it conducts the heat emitted by the transformer core 3 away from the transformer core 3 and the first side (front side) of the printed circuit board 5 to a second side (rear side) of the printed circuit board 5 facing away from the first side. Thus, the waste heat emitted during operation of the transformer coil 2 is advantageously dissipated away from components located on the first side of the printed circuit board 5, in particular such that the heat emitted by the transformer core 3 does not affect these components.

[0043] In the Figures 1 and 2An exemplary thermal conductivity structure 4 according to a first embodiment is shown. It can be seen that the thermal conductivity structure 4 has two walls 11, 12, each of which is in planar contact with the transformer core 3, preferably with its third section 3a, wherein the transformer core 3 is arranged between the walls 11, 12. Furthermore, it can be seen that this arrangement is achieved, for example, by the thermal conductivity structure 4 being designed as a cover which, viewed from a top view and / or at least one side view, preferably two side views, covers at least the transformer core 3 and preferably the entire transformer coil 2. The thermal conductivity structure 4 can also have a further side wall 13, which covers at least the transformer core 3 and preferably the transformer coil 2 when viewed from a top view.The further side wall 13 is preferably designed to be in contact with the transformer body 6. Thus, the heat conduction structure 4, viewed in a section showing the side walls 11, 12, 13, can have a substantially U-shaped cross-section. The heat conduction structure 4 therefore forms a cover that can be easily placed on the transformer coil 2, so that the cover, in particular the side walls 11, 12, simultaneously come into planar contact with the transformer core 3, especially with its third section 3a.

[0044] The heat conduction structure 4 is preferably seen in a further side view, preferably in two further side views, of the transformer coil 2 (see, for example, the figure shown in ... Figure 2The opening(s) are open so that at least part of the transformer coil 2, preferably at least the transformer core 3 or the entire transformer coil 2, is not covered or visible through the heat conduction structure 4. Air can thus flow through these two openings, for example, to advantageously support the cooling effect, particularly through convective heat transfer. However, it can also be provided that the heat conduction structure 4 or the cover covers the transformer coil 2 in all side views and in the top view, thereby further increasing the surface area of ​​the heat conduction structure 4 for cooling.

[0045] As in Figure 2As can be seen, the transformer coil 2 can further have legs 7 which protrude through the circuit board 5. Preferably, the coil former 6 has the legs 7. In the embodiment shown here, several, preferably five, legs 7 are provided. Similarly, the circuit board 5 can have several, preferably five, openings through which one of the legs 7 protrudes. The legs 7 are provided to increase the overall heat-dissipating surface area, i.e., to serve as a heat sink, so that the transformer core 3 is cooled more effectively. The legs 7 can be connected to the coil former 6, in particular to a region of the coil former 6 that rests on the circuit board 5, by means of force-fit and / or form-fit connections, such as a clip connection.The legs 7 preferably have a design such that they can be connected to a heat-dissipating and / or heat-distributing element of the luminaire and / or the control gear 1. An example of such a heat-dissipating and / or heat-distributing element is a heat sink (not shown in detail). The heat-dissipating and / or heat-distributing element can also be a metallic core of the circuit board 5. However, the aforementioned element can also be any other large-area component for dissipating heat to the ambient air.

[0046] It is preferred that the free ends of the hood or the distal ends of the walls 11, 12 each have legs as described above in order to dissipate the waste heat from the transformer core 3. What has been said about the legs 7 therefore applies analogously to the legs of the free ends of the hood.

[0047] The thermal conductivity structure 4 can further comprise a mounting section 14 for mounting or fastening the thermal conductivity structure 4 in the operating device 1. For this purpose, the mounting section 14 can have any fastening means that can effect a material-locking, force-locking, and / or form-locking connection between the thermal conductivity structure 4 and the transformer core 3, for example, a clip connection. Preferably, the walls 11, 12 are designed such that the transformer core 3 is at least in force-locking contact with the walls 11, 12, i.e., the transformer core 3 is clamped, for example, between the walls 11, 12. Alternatively or additionally, the free or distal end of the side walls 11, 12, i.e., those sides of the side walls 11, 12 that face the circuit board 5, can also have the mounting section 14.

[0048] The Figures 3 and 4Figure 1 shows an exemplary heat conduction structure 4' according to a second embodiment. The heat conduction structure 4' has two walls 21, 22 which are in planar contact with the transformer core 3, the transformer core 3 being arranged between these walls 21, 22. The heat conduction structure 4' differs from the heat conduction structure 4 in particular in that the heat conduction structure 4' has a wall which completely surrounds at least the transformer core 3. That is, the heat conduction structure 4' has further, preferably two, side walls 23, 24 which connect the side walls 21, 22 to each other, resulting in the completely surrounding wall. The further side walls 23, 24 are preferably also in planar contact with the transformer core 3.The heat conducting structure 4' thus forms a closed wall which can be easily placed onto the transformer coil 2, so that the wall, in particular the side walls 21, 22 and / or the side walls 23, 24, simultaneously come into planar contact with the transformer core 3, especially with its third section 3a. Thus, viewed from above, the heat conducting structure 4' and the transformer coil 2 have a substantially rectangular cross-section. However, the heat conducting structure 4' is not limited to such a cross-section. In particular, other cross-sections are also suitable which can effect at least planar contact with the transformer core 3, i.e., polygonal and / or round cross-sections.

[0049] The wall of the heat conduction structure 4' thus completely surrounds at least the transformer core 3, so that the wall covers the transformer core 3 in every side view of the transformer coil 2. The wall defines an opening through which the transformer coil 2 partially passes. In a top view, or when looking at the first side of the circuit board 5, at least a part of the transformer coil 2, preferably at least the transformer core 3 or the entire transformer coil 2, is therefore not covered or visible by the heat conduction structure 4'. Preferably, the heat conduction structure 4' or the side walls 21-24 have a height such that, in a side view of the transformer coil 2, the transformer core 3 is concealed, but a part of the transformer coil, preferably a part of the transformer body 6, protrudes beyond the heat conduction structure 4' and is thus visible.

[0050] For mounting the heat conducting structure 4' in the operating device 1 or to the transformer coil 2, the heat conducting structure 4' can have a mounting section 14' corresponding to the mounting section 14. The statements made regarding mounting section 14 apply analogously to mounting section 14' of the heat conducting structure 4'. In particular, the side walls 21, 22 and / or the side walls 23, 24 can be designed such that the transformer core 3 is at least frictionally connected to them, i.e., the transformer core 3 is preferably clamped between them. Alternatively or additionally, the base of the wall or the side walls 21-24, i.e., those sides of the wall opposite the circuit board 5, can also have the mounting section 14'. The mounting section 14' can have fastening means for material-locking, force-locking, and / or form-locking attachment to the circuit board 5, for example, a clip connection.

[0051] As particularly in Figure 4As can be clearly seen, the thermal conductivity structure 4', preferably the mounting section or base of the wall, can have several, preferably 10 to 40, particularly preferably 20 to 30, ideally 28 legs 25 for dissipating heat, preferably towards the second side of the printed circuit board 5. It is evident that the legs 25 can be provided on the thermal conductivity structure 4' or on the wall of the thermal conductivity structure 4' according to the (closed) cross-section of the wall. Similarly, the printed circuit board 5 can have several openings through which one of the legs 25 passes, so that the legs 25 protrude from the second side. This allows the legs 25 to also be used for mounting or fastening the thermal conductivity structure 4' to the printed circuit board 5, for example, by each leg 25 being positively engaged and / or frictionally connected to the respective opening of the printed circuit board 5.The legs 25 can each be configured to be connected to a heat-dissipating and / or heat-distributing element of a luminaire and / or the control gear 1. The heat-dissipating and / or heat-distributing element is, for example, a heat sink (not shown in detail). The heat-dissipating and / or heat-distributing element can also be a metallic core of the circuit board 5. However, the heat-dissipating and / or heat-distributing element can also be any other large-area component suitable for dissipating heat to the ambient air.

[0052] The legs 25 do not necessarily have to penetrate the circuit board 5. The legs 25 are specifically designed to conduct heat advantageously, particularly towards a heat sink. This prevents other components, such as those located on the first side of the circuit board 5, from being affected. The legs 25 also increase the overall heat-dissipating surface area. Therefore, the legs 25 also serve as an additional heat sink to improve cooling of the transformer core 3.

[0053] The thermal conductivity structure 4, 4' is preferably made of a material with good thermal conductivity. Metal, preferably copper and / or aluminum, is particularly suitable for this purpose. However, it is also conceivable that the material alternatively or additionally comprises plastic or consists (only) of plastic, for example, to also provide electrical insulation for the transformer coil 2. Preferably, the thermal conductivity structure 4, 4' is formed as a unit with the coil core or transformer core 3.

[0054] The heat conduction structure 4, 4' may further comprise cooling fins, which are not shown in detail. The cooling fins are preferably provided on at least one side of the heat conduction structure 4, 4' that faces away from the coil core or transformer core 3, i.e., for example, on the outside of one or more, preferably each, of the walls 11-13 or 21-24. Preferably, the cooling fins are provided (uniformly) distributed on the surface or of the walls 11-13 or 21-24 of the heat conduction structure 4, 4'. It is further preferred if the cooling fins are provided on the entire surface of the heat conduction structure 4, 4', wherein this surface preferably comprises the surface of the heat conduction structure 4, 4' that faces away from the coil core, i.e., in particular, the outside of one or more, preferably each, of the walls 11-13 or 21-24.21-24, and / or the surface of the heat conducting structure 4, 4' which faces the coil core, in particular the (inner) side facing the coil core of one or more, preferably each of the walls 11-13 or 21-24.

[0055] The invention is not limited to the embodiments described above. In particular, all features can be combined with one another in any advantageous manner. Specifically, the legs 25 provided according to the second embodiment can also be provided on the heat conducting structure 4 in a corresponding manner. Furthermore, it can be provided that the heat conducting structure 4 has the closed surrounding wall or the side walls 21-24 of the heat conducting structure 4' instead of the side walls 11, 12.

Claims

1. Operating device (1) for a luminaire, in particular for an LED luminaire, the operating device (1) having: a coil (2) having a coil core (3), a heat-conducting structure (4, 4') which is in surface contact with the coil core (3) in order to conduct the heat emitted by the coil core (3) during operation of the coil (2) away from the coil core (3), and a circuit board (5), the coil (2) and the heat-conducting structure (4, 4') being provided on a first side of the circuit board (5) such that the heat-conducting structure (4, 4') conducts the heat emitted by the coil core (3) away from the coil core (3) and the first side to a second side of the circuit board (5) which faces away from the first side, and the heat-conducting structure (4, 4') having legs (25) for dissipating heat in the direction of the second side of the circuit board (5), characterized in that the legs (25) pass through the circuit board, the coil (2) being a transformer coil, and the coil core (3) being designed as a transformer core, the transformer core (3) having: a first portion for electromagnetic interaction with a primary winding, a second portion for electromagnetic interaction with a secondary winding, and a third portion (3a) for connecting the first portion to the second portion in order to conduct the magnetic flux between the first and the second portion, the heat-conducting structure (4, 4') being in surface contact with the third portion (3a).

2. Operating device (1) according to claim 1, wherein the coil core (3) is arranged between walls (11, 12; 21, 22, 23, 24) of the heat-conducting structure (4, 4') which are in surface contact with the coil core (3).

3. Operating device (1) according to any of the preceding claims, wherein the heat-conducting structure (4') is a wall (21, 22, 23, 24) that surrounds at least the coil core (3) in a closed manner.

4. Operating device (1) according to any of the preceding claims, wherein the heat-conducting structure (4) is a hood covering at least the coil core (3), which hood preferably has a substantially U-shaped cross-section.

5. Operating device (1) according to any of the preceding claims, wherein the heat-conducting structure (4, 4') has a mounting portion for mounting the heat-conducting structure (4, 4') in the operating device (1), in particular on the circuit board (5), and / or on the coil (2), wherein preferably the free ends of the hood or the foot of the wall (21, 22, 23, 24) has the mounting portion.

6. Operating device (1) according to any of claims 1 to 5, wherein the legs (25) are designed to be connected to a heat-dissipating and / or heat-distributing element of a luminaire and / or of the operating device, wherein the legs (25) are preferably connected to a heat-dissipating and / or heat-distributing element of the operating device.

7. Operating device (1) according to claim 6, wherein the heat-dissipating and / or heat-distributing element is a heat sink or another large-area component for emitting heat.

8. Operating device (1) according to any of the preceding claims, wherein the heat-conducting structure (4, 4') is made of a material comprising metal, preferably copper and / or aluminum, and / or plastics.

9. Operating device (1) according to any of the preceding claims, wherein the coil core (3) is a ferrite core.

10. Operating device (1) according to any of the preceding claims, wherein the heat-conducting structure (4, 4') has cooling fins.

11. Luminaire, in particular an LED luminaire, having a lamp, preferably an LED, and an operating device (1) according to any of the preceding claims for operating the lamp, wherein the heat-conducting structure (4, 4') is preferably connected to a heat-dissipating and / or heat-distributing element of the luminaire such as a heat sink of the luminaire.

Images