Driving power supply of patch packaging structure and manufacturing method of driving power supply

Abstract

The invention discloses a patch packaging manufacturing method of a driving power supply and the driving power supply manufactured by the patch packaging manufacturing method. The patch packaging manufacturing method comprises special-shaped surface-mounted pins, a carrier plate, a plastic packaging material and a device. The shapes of the special-shaped surface-mounted pins can be in various shapes (such as an I shape), the special-shaped surface-mounted pins can be made of materials such as a PCB or a resin plated metal structural part or a metal part, and the required number of metal bonding pads are manufactured on the two faces of the special-shaped surface-mounted pins according to application requirements and are communicated. The overall thickness of the special-shaped surface-mounted pins is required to be larger than that of the highest device; the metal bonding pad C 303 of the first surface 301 of the special-shaped surface-mounted pin is welded on the second surface 202 of the carrier plate, and the metal bonding pad D 304 of the second surface 302 of the special-shaped surface-mounted pin is exposed. According to the driving power supply manufactured through the patch packaging manufacturing method of the driving power supply, the flat and small design of the patch power supply is achieved, and the problem that the board arrangement space of high-density small-space equipment is insufficient is well solved.

Description

Technical Field

[0001] The invention belongs to the field of switching power supplies, and in particular relates to a driving power supply with a patch packaging structure. Background Art

[0002] With the development of science and technology, many modern electronic products and motor equipment are becoming more and more functional and smaller. As a result, the space for internal power supply devices is bound to decrease, further increasing the difficulty of manufacturing power supply devices and reducing reliability.

[0003] Existing power supply devices generally have the following shortcomings: (1) The whole machine has many assembled parts and the packaging structure is large in size; (2) The connection terminals are PIN pins and adopt the SMD mode. They cannot be SMT soldered together with the surface mount components, which leads to low customer installation efficiency; (3) The connection terminals are mounted using single copper pillar pins, which has problems such as difficulty in mounting, mounting offset, low strength, and low production efficiency. Summary of the invention

[0004] The disadvantages of the existing process are that the use of single copper pillar pin mounting leads to difficulties in mounting, mounting offset, low strength, and low production efficiency; the products on the market use buried magnetic technology, the packaging substrate is thicker, and there is a problem of poor reliability.

[0005] In order to solve the above problems, the present invention provides the following technical solutions:

[0006] A chip package manufacturing method for a driving power supply includes the following steps: material preparation, providing a transformer made by processing windings on a magnetic core, and a PCB carrier with surface-mount pins processed in two hollowed-out areas; plastic sealing on the upper surface of the circuit board, including welding and plastic sealing of the transformer, that is, the transformer is welded on the upper surface of the circuit board and then packaged on the upper surface of the circuit board through a plastic sealing process; mounting on the lower surface of the circuit board, mounting electronic devices on the lower surface of the circuit board; welding a PCB carrier with surface-mount pins on the lower surface of the circuit board, welding metal pads on the upper surface of the PCB carrier to metal pads correspondingly arranged on the lower surface of the circuit board, and exposing the metal pads on the lower surface of the PCB carrier as external pins of the driving power supply; cutting and molding, making a driving power supply with a chip package structure of a single finished product by cutting the entire circuit board.

[0007] Preferably, the step of plastic-sealing the upper surface of the circuit board is to wrap and seal the entire upper surface of the circuit board with a plastic sealing material.

[0008] The present invention also provides a driving power supply with a chip packaging structure that can be directly obtained by this method, including a circuit board and a transformer installed on the circuit board, and also including a pin carrier provided with surface-mounted pins, the pin carrier including two symmetrically arranged hollow areas for exposing the electronic components on the circuit board; the transformer is encapsulated on the upper surface of the circuit board through a plastic packaging process, the pin carrier is installed on the lower surface of the circuit board, and is used to form a circuit and pin board arrangement, and the circuit board and the pin carrier are assembled to form a chip packaging structure, and the height of the superimposed assembly surface formed by the pin carrier being welded to the lower surface of the circuit board is higher than the highest electronic component on the lower surface of the circuit board exposed by the hollow area of ​​the pin carrier.

[0009] Preferably, the hollowed-out area of ​​the pin carrier is a hollowed-out area of ​​a broken frame, and / or the thickness of the pin carrier is greater than the thickness of the circuit board.

[0010] Preferably, the pin carrier has an I-shaped structure, including a middle area for strengthening the isolation of the primary and secondary sides and four protruding arms for setting the surface-mounted pin pads; or a T-shaped structure, including a middle empty area for the isolation of the primary and secondary sides and two protruding arms for setting the surface-mounted pin pads.

[0011] Preferably, each extending arm of the pin carrier is provided with the same number of pin pads.

[0012] Preferably, each extending arm of the pin carrier is provided with two pin pads.

[0013] Preferably, the transformer comprises a magnetic core and two windings, the magnetic core is a square structure, and is integrally formed with ferrite material to form four side columns, wherein the two windings are symmetrically wound on the magnetic core.

[0014] Preferably, the transformer includes a winding formed by three layers of insulated wire, so that the reinforced insulation of the driving power supply can reach 5000VAC.

[0015] Preferably, the entire upper surface of the circuit board is wrapped and packaged by a plastic packaging material.

[0016] Preferably, the pin pad of the pin carrier is a groove-shaped arc structure connecting the upper and lower surfaces thereof, or is a groove-shaped arc structure opened only on the side wall and penetrating the upper and lower surfaces thereof.

[0017] The manufacturing method of the driving power supply of the patch packaging structure of the present invention and the finished power supply thereof have the following beneficial effects:

[0018] 1. Use special-shaped surface mount pin carrier board,

[0019] ①Provide support and electrical connections while protecting bottom devices;

[0020] ②High pin placement accuracy and improved placement efficiency (increased by about 2 to 3 times);

[0021] ③The mechanical strength of the pins is increased, thereby improving reliability;

[0022] ④ Improve the processing stability when customers use driving power for SMT welding;

[0023] ⑤ The special-shaped pins span the primary and secondary sides, increasing the creepage distance and improving the overall performance;

[0024] 2. Use transformer packaging technology to reduce the thickness of the packaging substrate:

[0025] ①The transformer is spot welded on the PCB and then plastic sealed to improve the internal insulation capacity of the transformer;

[0026] ② Reducing the substrate thickness (from 4mm to less than 1mm) can improve reliability anomalies caused by PCB thickness issues. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional exploded structural diagram of the driving power supply of the patch packaging structure of the present invention before plastic packaging;

[0028] Figure 2 A three-dimensional view of the bottom surface of the drive power supply of the SMD packaging structure of the present invention after plastic packaging;

[0029] Figure 3 A three-dimensional view of the top surface of the drive power supply of the patch packaging structure of the present invention after plastic packaging;

[0030] Figure 4 A three-dimensional diagram of a surface mount pin carrier of a driving power supply of the surface mount packaging structure of the present invention.

[0031] Among them, the figure numbers in the above drawings are as follows: 10. Transformer, 11. Magnetic core, 13. Winding, 102. Electronic device, 20. Circuit board, 201. Upper surface of circuit board, 202. Lower surface of circuit board, 203. Metal pin pad A, 204, Metal pin B of electronic device, 30. Surface mount pin carrier, 301. Upper surface of surface mount pin carrier, 302. Lower surface of surface mount pin carrier, 303. Metal pin C, 304. Metal pin D, 305. Metal pin E, 31. Hollow area, 33. Middle area, 35. Extended arm, 40. Plastic encapsulation layer DETAILED DESCRIPTION

[0032] The present invention and its beneficial effects will be further described in detail below in conjunction with specific implementations and the accompanying drawings, but the specific implementations of the present invention are not limited thereto.

[0033] refer to Figure 1-2The present invention provides a method for manufacturing a chip package of a driving power supply, wherein the entire circuit board is cut into a single finished product of a chip package structure of the driving power supply, and the specific manufacturing method comprises the following steps:

[0034] Prepare materials, provide a transformer with windings processed on the magnetic core, and a PCB carrier with two hollowed-out areas and surface-mount pins.

[0035] The plastic sealing of the upper surface of the circuit board includes welding and plastic sealing of the transformer, that is, the transformer is welded to the upper surface 201 of the circuit board by spot welding and then encapsulated on the upper surface of the circuit board by a plastic sealing process, which can reduce the thickness of the substrate, improve reliability, and also improve the voltage resistance performance of the transformer.

[0036] The lower surface of the circuit board is mounted, and the electronic components on the lower surface of the circuit board are mounted.

[0037] A PCB carrier with surface mount pins is welded to the lower surface of the circuit board, and the surface mount pin carrier is welded on the lower surface of the circuit board, that is, the metal pad C 303 on the upper surface 301 of the surface mount pin carrier is welded to the metal pad correspondingly arranged on the lower surface 202 of the circuit board, and the metal pad D 304 on the lower surface 302 of the surface mount pin carrier is exposed as an external pin of the driving power supply; in this way, the surface mount pin carrier can provide support and electrical connection while protecting the electronic components that are not plastic-sealed on the bottom surface, and can also improve the mounting efficiency, reliability and welding stability, and can also increase the creepage distance through the shape, thickness and other structures of the surface mount pin carrier to improve the overall performance of the driving power supply.

[0038] Cutting and forming: by cutting the whole circuit board, a single finished product of the SMD package structure driving power supply is made.

[0039] The driving circuit manufactured by the patch packaging manufacturing method of the present invention includes a circuit board and a transformer installed on the circuit board, and also includes a pin carrier provided with surface-mounted pins (i.e., a surface-mounted pin carrier). The transformer is packaged on the upper surface of the circuit board by a plastic packaging process, and the pin carrier is installed on the lower surface of the circuit board to form a circuit and pin sub-board arrangement, and the circuit board and the pin carrier are assembled to form a patch packaging structure; in this embodiment, the transformer preferably includes a magnetic core and two windings, the magnetic core is a square structure, and is integrally formed with ferrite material to form four side columns, wherein two windings are symmetrically wound on the magnetic core; the pin carrier includes two hollowed-out areas for exposing the electronic devices on the circuit board. Among them, one winding of the transformer uses a three-layer insulated wire, and the driving power supply manufactured can be suitable for applications where the bus voltage is several thousand V, the reinforced insulation can reach 5000VAC, and the long-term insulation can reach 1700VAC.

[0040] Preferably, the surface mount pin carrier 30 is an irregular-shaped structure, and can be formed into a variety of shapes by two hollowed-out areas, such as "I" shape, "T" shape, etc., and can be replaced by a carrier functional part similar to a PCB, such as a resin-plated metal structural part or a metal part, and the required number of metal pads can be made on both sides of the irregular surface mount pin according to the application requirements; the two hollowed-out areas can be symmetrically arranged to set a middle area that can strengthen the isolation of the primary and secondary sides and a plurality of protruding arms for setting the surface mount pin pads; the hollowed-out area can be a hollowed-out structure with a broken frame; the overall thickness of the surface mount pin carrier 30 is required to be greater than the highest device mounted on the lower surface of the circuit board 20. The surface mount pin carrier 30 is welded on the lower surface of the circuit board, and the metal pad C303 on the upper surface 301 of the surface mount pin carrier 30 is welded on the lower surface 202 of the carrier, and the metal pad D 304 on the lower surface 302 of the surface mount pin carrier 30 is exposed as an external pin of the driving power supply; in other embodiments, the pin pad of the surface mount pin carrier 30 can also be a groove-shaped arc structure that is only opened on the side wall and passes through its upper and lower surfaces; the surface mount pin carrier 30 is used for double-sided assembly. In this way, the surface mount pin carrier 30 can protect the electronic devices on the bottom of the circuit board while providing support and electrical connection, and can also improve mounting efficiency, reliability, welding stability, increase creepage distance, and improve the overall performance of the driving power supply.

[0041] The carrier is used for double-sided assembly and serves as an electrical connection carrier. The material may be PCB, frame, or MIS. Both the upper surface 201 and the lower surface 202 have metal pads.

[0042] Preferably, the entire upper surface of the circuit board is encapsulated by a plastic encapsulation compound.

[0043] Preferably, the circuit board is thinner than the pin carrier, and the circuit board is a double-sided board with metal pads on both the upper and lower surfaces, and is a PCB board, a lead frame or a MIS board. In this embodiment, the thickness of the circuit board is less than 1 mm.

[0044] Preferably, the circuit board is double-sided assembled, one side of which is provided with a metal pad corresponding to the surface mount pin, and the height of the metal pad is lower than the electronic device.

[0045] Preferably, the thickness of the pin carrier is greater than the height of the highest electronic component on the lower surface of the circuit board, or the height of the superimposed assembly surface formed by welding the pin carrier to the lower surface of the circuit board is higher than the highest electronic component on the lower surface of the circuit board exposed by the hollowed-out area of ​​the pin carrier. In this embodiment, the thickness of the pin carrier is greater than 0.5 mm.

[0046] Preferably, the number of pins provided on each lead-out arm of the pin carrier is the same. In this embodiment, the number of pins provided on each lead-out arm of the pin carrier is 2.

[0047] Preferably, the pin pad of the pin carrier is a groove-shaped arc structure connecting the upper and lower surfaces thereof, or is a groove-shaped arc structure opened only on the side wall and penetrating the upper and lower surfaces thereof.

[0048] Preferably, the chip packaging structure composed of two boards, a circuit board and a pin carrier board, has an overall length greater than 5 mm, a width greater than 5 mm, and an overall thickness greater than 2 mm.

[0049] The driving power supply manufactured by the chip packaging manufacturing method of the driving power supply of the present invention realizes the flattened and miniaturized design of the chip power supply, which well solves the problem of insufficient layout space for high-density small-space equipment; at the same time, the connecting terminals adopt an "I"-shaped substrate design, which avoids the problems of difficulty in chip mounting, mounting offset, and low strength in copper column pin mounting, which is conducive to improving the production efficiency of the product.

[0050] The above are only preferred embodiments of the invention. It should be noted that the above preferred embodiments should not be regarded as limiting the present invention, and its protection scope should be based on the scope defined by the claims. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the spirit and scope of the application of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A method for manufacturing a chip package of a driving power supply, by cutting and forming the entire circuit board, specifically comprising the following steps: Prepare materials, provide transformers with windings processed on magnetic cores, and PCB carriers with surface-mount pins processed in two hollowed-out areas; Plastic sealing on the upper surface of the circuit board, including transformer welding and plastic sealing, that is, the transformer is welded on the upper surface of the circuit board and then encapsulated on the upper surface of the circuit board through a plastic sealing process; Mounting on the lower surface of the circuit board: mounting electronic components on the lower surface of the circuit board; A PCB carrier with surface-mount pins is welded on the lower surface of the circuit board, and the metal pads on the upper surface of the PCB carrier are welded to the corresponding metal pads on the lower surface of the circuit board. The metal pads on the lower surface of the PCB carrier are exposed as external pins of the driving power supply; Cutting and forming: by cutting the whole circuit board, a single finished product of the SMD package structure driving power supply is made.

2. The chip packaging manufacturing method of the driving power supply according to claim 1, characterized in that: The step of plastic sealing the upper surface of the circuit board is to wrap and seal the entire upper surface of the circuit board with a plastic sealing material.

3. A driving power supply of a patch packaging structure, comprising a circuit board and a transformer mounted on the circuit board, characterized in that: Also included is a pin carrier board provided with surface-mount pins, the pin carrier board including two symmetrically arranged hollow areas for exposing electronic components on the circuit board; The transformer is encapsulated on the upper surface of the circuit board through a plastic encapsulation process, and the pin carrier is installed on the lower surface of the circuit board to form a circuit and pin board arrangement, and the circuit board and the pin carrier are assembled to form a surface mount packaging structure, and the height of the superimposed assembly surface formed by the pin carrier being welded to the lower surface of the circuit board is higher than the highest electronic device exposed by the hollowed-out area of ​​the pin carrier on the lower surface of the circuit board.

4. The driving power supply of the SMD package structure according to claim 3, characterized in that: The hollowed-out area of ​​the pin carrier is a hollowed-out area of ​​a broken frame, and / or the thickness of the pin carrier is greater than the thickness of the circuit board.

5. The driving power supply of the SMD package structure according to claim 4, characterized in that: The pin carrier is in an I-shaped structure, including a middle area for strengthening the isolation of the primary and secondary sides and four protruding arms for setting the surface-mounted pin pads; or in a T-shaped structure, including a middle empty area for the isolation of the primary and secondary sides and two protruding arms for setting the surface-mounted pin pads.

6. The driving power supply of the SMD package structure according to claim 5, characterized in that: The number of pin pads arranged on each extending arm of the pin carrier is the same.

7. The driving power supply of the SMD package structure according to claim 5, characterized in that: Each extending arm of the pin carrier is provided with two pin pads.

8. The driving power supply of the SMD package structure according to claim 3 or 4, characterized in that: The transformer comprises a magnetic core and two windings. The magnetic core is a square structure and is integrally formed of ferrite material to form four side columns. The two windings are symmetrically wound on the magnetic core.

9. The driving power supply of the SMD package structure according to claim 8, characterized in that: The transformer comprises a winding formed by three layers of insulated wires, so that the reinforced insulation of the driving power supply can reach 5000VAC.

10. The driving power supply of the SMD package structure according to claim 3 or 4, characterized in that: The entire upper surface of the circuit board is wrapped and packaged by plastic packaging material.

11. The driving power supply of the SMD package structure according to claim 3, characterized in that: The pin pad of the pin carrier is a groove-shaped arc structure connecting the upper and lower surfaces thereof, or is a groove-shaped arc structure only opened on the side wall and penetrating the upper and lower surfaces thereof.

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