SMT (Surface Mount Technology) positioning patch device for circuit board processing

Abstract

The utility model discloses an SMT positioning and mounting device for circuit board processing. The SMT positioning and mounting device comprises a rack, a tray feeding mechanism, a variable-pitch conveying mechanism, a double-shaft moving mechanism, a moving seat, a lifting module, a mounting head, a CCD module and a discharging and collecting mechanism, the tray feeding mechanism is used for feeding and conveying a loading tray loaded with electronic elements, and the variable-pitch conveying mechanism is used for conveying a circuit board to be subjected to surface mounting; the chip mounting head is used for mounting the electronic elements on the material carrying disc onto a circuit board, the CCD module is arranged at the side end of the chip mounting head, and the discharging and collecting mechanism is used for collecting the circuit board subjected to chip mounting. According to the utility model, continuous supply of electronic components can be realized through the charging tray feeding mechanism, the variable-pitch conveying mechanism can adapt to circuit boards of different specifications, the double-shaft moving mechanism is matched with the lifting module, the mounting precision of the chip mounting head can be improved, the CCD module can improve the identification precision of the chip mounting head, the blanking collecting mechanism can rapidly collect finished circuit boards, and the whole structure is convenient to assemble and disassemble. And the chip mounting production efficiency of the circuit board is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of surface mount technology (SMT) devices, and more particularly to an SMT positioning and placement device for circuit board processing. Background Technology

[0002] In the manufacturing process of modern electronic products, surface mount technology (SMT) is widely used for the installation of integrated circuits and other electronic components. As electronic products become increasingly complex and miniaturized, the requirements for the precision, speed and automation of SMT equipment are also increasing.

[0003] In existing technologies, traditional SMT placement equipment cannot flexibly adapt to circuit boards of different specifications. When the size and type of the circuit board vary greatly, the positioning and placement accuracy is difficult to guarantee, thus affecting the adaptability of the production line. In addition, after the circuit board is placed, it is difficult to collect and process it quickly, causing the production line to stop and affecting the overall production efficiency.

[0004] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide an SMT positioning and placement device for circuit board processing that improves production efficiency and can adapt to circuit boards of different specifications.

[0006] To achieve this objective, the present invention adopts the following technical solution: an SMT positioning and placement device for circuit board processing, comprising a frame, a tray loading mechanism, a variable pitch conveying mechanism, a dual-axis moving mechanism, a moving base, a lifting module, a placement head, a CCD module, and a material unloading and collection mechanism;

[0007] The tray feeding mechanism is located on the side of the frame and is used to feed and transport a tray loaded with electronic components. The variable pitch conveying mechanism is located on the frame and is used to transport circuit boards to be mounted.

[0008] The dual-axis moving mechanism is located above the variable-pitch conveying mechanism. The movable end of the dual-axis moving mechanism is connected to the moving base. Multiple lifting modules are respectively located on the moving base. The lifting modules are connected to the placement head. The placement head is used to mount electronic components on the material tray onto the circuit board.

[0009] The CCD module is located on the side of the mounting head to identify the mounting position on the circuit board. The unloading and collecting mechanism is located on the side of the variable pitch conveying mechanism and is used to collect the circuit board after mounting.

[0010] Using the above technical solution, in the SMT positioning and placement device for circuit board processing, the material tray loading mechanism includes a base, a limiting angle bracket, a side clamping cylinder, a lifting cylinder, a lateral moving module, and a support plate.

[0011] The four limiting angle brackets are respectively arranged around the base. The limiting angle brackets are used to limit the placement of the material tray. The lifting cylinder is located on both sides of the base, with the movable end of the lifting cylinder facing upward, so as to support the material tray.

[0012] The side clamping cylinders are located on both sides of the base and are used to laterally clamp the bottom layer of the material tray. The lateral moving module is located below the base and its movable end is connected to the support plate. The support plate is used to support the bottom layer of the material tray inside the limiting angle bracket.

[0013] Using the above technical solution, in the SMT positioning and placement device for circuit board processing, the variable pitch conveying mechanism includes a pitch adjustment component, a first conveyor belt, and a second conveyor belt;

[0014] The first conveyor belt and the second conveyor belt are disposed on both sides of the frame. The first conveyor belt and the second conveyor belt respectively abut against both sides of the circuit board. The spacing adjustment component is connected to the second conveyor belt and is used to adjust the spacing between the second conveyor belt and the first conveyor belt.

[0015] Using the above technical solution, in the SMT positioning and placement device for circuit board processing, the spacing adjustment component includes an adjustment handwheel, a first lead screw, a pulley transmission component, and a second lead screw;

[0016] The second conveyor belt is provided with a first threaded seat and a second threaded seat at both ends, the first threaded seat is connected to the first lead screw by a thread, and the second threaded seat is connected to the second lead screw by a thread;

[0017] The adjusting handwheel is connected to the end of the first lead screw, and the adjusting handwheel is used to drive the first lead screw to rotate. The other end of the first lead screw is connected to the second lead screw through the pulley transmission assembly, and the pulley transmission assembly is used to drive the second lead screw to rotate as the first lead screw rotates.

[0018] The bottom of the first threaded seat is connected to the frame via a first slide rail assembly, and the bottom of the second threaded seat is connected to the frame via a second slide rail assembly.

[0019] The SMT positioning and placement device for circuit board processing, which adopts the above technical solution, further includes a lifting mechanism. The lifting mechanism is located between the first conveyor belt and the second conveyor belt and is used to lift the circuit board to be placed.

[0020] The lifting mechanism includes a lifting cylinder and a support plate. The movable end of the lifting cylinder is arranged facing upward and connected to the support plate. The lifting cylinder is used to drive the support plate to move in the vertical direction.

[0021] In the SMT positioning and placement device for circuit board processing described above, a baffle limiting component is provided at the side end of the second conveyor belt, which is used to restrict the movement of the circuit board on the second conveyor belt.

[0022] Using the above technical solution, in the SMT positioning and placement device for circuit board processing, the material collection mechanism includes a lifting adjustment component and a material receiving bin;

[0023] The movable end of the lifting adjustment component is connected to the receiving bin. The receiving bin has vertically spaced sliding grooves on both sides. The sliding grooves are used to position and receive the board after it has been mounted. The lifting adjustment component is used to adjust the height of the receiving bin.

[0024] Using the above technical solution, in the SMT positioning and placement device for circuit board processing, the material collection mechanism further includes a material collection conveyor belt, which is located at the bottom of the receiving bin and is used to remove the receiving bin after material collection is completed.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The material tray feeding mechanism of this utility model can realize the continuous supply of electronic components, thereby improving the feeding efficiency; the variable pitch conveying mechanism can adjust the conveying distance to adapt to different specifications of circuit boards, improving the versatility of the chip mounting device; the dual-axis moving mechanism, together with the lifting module, can improve the mounting accuracy and flexibility of the chip mounting head; the setting of the CCD module can realize the efficient identification and alignment of the chip mounting head, improving the mounting accuracy of electronic components; the unloading and collecting mechanism can quickly receive and transfer finished circuit boards. The overall structure is compact and efficient, effectively improving the production efficiency of circuit boards. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0029] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0030] Figure 2 This is a schematic diagram of the material tray feeding mechanism of this utility model;

[0031] Figure 3 This is a schematic diagram of the material tray feeding mechanism of this utility model from another perspective.

[0032] Figure 4 This is a schematic diagram of the variable pitch conveying mechanism of this utility model;

[0033] Figure 5 This is a schematic diagram of the lifting mechanism structure of this utility model;

[0034] Figure 6 This is a schematic diagram of the material collection mechanism of this utility model. Detailed Implementation

[0035] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0036] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0037] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0038] like Figures 1 to 6 As shown, this utility model embodiment provides an SMT positioning and placement device for circuit board processing, including a frame 1, a tray loading mechanism 2, a variable-pitch conveying mechanism 3, a dual-axis moving mechanism 4, a moving base 5, a lifting module 6, a placement head 7, a CCD module 8, and a material unloading and collecting mechanism 9. The tray loading mechanism 2 is located on the side of the frame 1 and is used to load and convey a tray 20 loaded with electronic components. The variable-pitch conveying mechanism 3 is located on the frame 1 and is used to convey circuit boards to be placed. The dual-axis moving mechanism 9... The moving mechanism 4 is located above the variable-pitch conveying mechanism 3. The movable end of the dual-axis moving mechanism 4 is connected to the moving base 5. Multiple lifting modules 6 are respectively located on the moving base 5. The lifting modules 6 are connected to the placement head 7. The placement head 7 is used to place electronic components on the material tray 20 onto the circuit board. The CCD module 8 is located on the side of the placement head 7 to identify the placement position on the circuit board. The unloading and collecting mechanism 9 is located on the side of the variable-pitch conveying mechanism 3 and is used to collect the circuit board after placement. The tray loading mechanism 2 can orderly transport the tray 20 loaded with electronic components to the side of the frame 1, realizing the continuity of electronic component supply. The circuit board to be mounted is transported by the variable pitch conveyor mechanism 3. By adjusting the pitch, it can flexibly adapt to circuit boards of different specifications and sizes, thereby improving the versatility of the equipment. The dual-axis moving mechanism 4 is located above the variable pitch conveyor mechanism 3. Its movable end is connected to the moving base 5, which can move accurately in two horizontal directions, providing multi-degree-of-freedom positioning capability for the mounting operation. Multiple lifting modules 6 are set on the moving base 5, which can drive the mounting head 7 to move up and down, thereby realizing the picking and mounting of electronic components. During the picking and mounting process, the mounting head 7 uses the CCD module 8 for accurate identification and positioning, so that each electronic component can be accurately installed in the corresponding position on the circuit board, thereby improving the mounting accuracy. The mounted circuit boards are collected in time by the unloading and collection mechanism 9 to avoid finished product backlog and ensure continuous operation and efficient operation of the production line. The overall structure is compact and the connection between each link is natural, effectively improving the processing accuracy and production efficiency of the circuit board.

[0039] like Figure 2 and Figure 3As shown, the material tray loading mechanism 2 further includes a base 21, limiting angle brackets 22, side clamping cylinders 23, lifting cylinders 24, a lateral movement module 25, and a support plate 26. The four limiting angle brackets 22 are respectively arranged around the base 21. The limiting angle brackets 22 are used to limit the placement of the material tray 20. The lifting cylinders 24 are located on both sides of the base 21, with the movable end of the lifting cylinders 24 facing upwards to support the material tray 20. The side clamping cylinders 23 are located on both sides of the base 21 and are used to laterally clamp the next lower layer of the material tray 20. The lateral movement module 25 is located below the base 21, and the movable end of the lateral movement module 25 is connected to the support plate 26. The support plate 26 is used to support the lowest layer of the material tray 20 within the limiting angle brackets 22. When loading is required, the lateral moving module 25 moves the support plate 26 to below the loading tray 20. Then, the lifting cylinder 24 is activated and drives the loading tray 20 to descend, so that the bottom loading tray 20 descends to the support plate 26 for docking. At the same time, the side clamping cylinder 23 clamps the next bottom loading tray 20. Then, the lateral moving module 25 moves the support plate 26 with the loading tray 20 to the loading position, so that the loading tray 20 moves to the processing position to complete the loading. This setting can improve the loading efficiency of the loading tray 20.

[0040] like Figure 4 As shown, the variable-pitch conveying mechanism 3 further includes a pitch adjustment component 31, a first conveyor belt 32, and a second conveyor belt 33. The first conveyor belt 32 and the second conveyor belt 33 are disposed on both sides of the frame 1. The first conveyor belt 32 and the second conveyor belt 33 respectively abut against both sides of the circuit board. The pitch adjustment component 31 is connected to the second conveyor belt 33. The pitch adjustment component 31 is used to adjust the pitch between the second conveyor belt 33 and the first conveyor belt 32. When it is necessary to mount electronic components on circuit boards of different widths, the operator can operate the pitch adjustment component 31 to move the second conveyor belt 33 on the frame 1, thereby adjusting the pitch between it and the first conveyor belt 32, so that the circuit board is always in a stable clamping state and prevents displacement or tilting.

[0041] like Figure 4As shown, the spacing adjustment assembly 31 further includes an adjusting handwheel 311, a first lead screw 312, a pulley drive assembly 313, and a second lead screw 314. The second conveyor belt 33 has a first threaded seat 315 and a second threaded seat 316 at both ends. The first threaded seat 315 is threadedly connected to the first lead screw 312, and the second threaded seat 316 is threadedly connected to the second lead screw 314. The adjusting handwheel 311 is connected to the end of the first lead screw 312 and is used to drive the first lead screw 312 to rotate. The other end of the first lead screw 312 is connected to the second lead screw 314 through the pulley drive assembly 313. The pulley drive assembly 313 is used to drive the second lead screw 314 to rotate as the first lead screw 312 rotates. The bottom of the first threaded seat 315 is connected to the frame 1 through a first slide rail assembly, and the bottom of the second threaded seat 316 is connected to the frame 1 through a second slide rail assembly. When it is necessary to adjust the distance between the first conveyor belt 32 and the second conveyor belt 33, the operator can rotate the adjusting handwheel 311. The adjusting handwheel 311 drives the first lead screw 312 to rotate. When the first lead screw 312 rotates, it can drive the first threaded seat 315 to move. At the same time, the pulley transmission assembly 313 can drive the second lead screw 314 to rotate synchronously, so that the second threaded seat 316 also moves synchronously, thereby realizing the overall translation of the second conveyor belt 33 to adjust the distance between the first conveyor belt 32 and the second conveyor belt 33 to adapt to circuit boards of different widths.

[0042] like Figure 4 and Figure 5 As shown, furthermore, it also includes a lifting mechanism 34, which is disposed between the first conveyor belt 32 and the second conveyor belt 33. The lifting mechanism 34 is used to lift the circuit board to be mounted. The lifting mechanism 34 includes a lifting cylinder 341 and a support plate 342. The movable end of the lifting cylinder 341 is arranged upward and connected to the support plate 342. The lifting cylinder 341 is used to drive the support plate 342 to move vertically. When the circuit board is conveyed to the mounting station, the lifting cylinder 341 is activated, driving the support plate 342 to rise vertically to lift the circuit board and keep it at a fixed height and position, preventing the circuit board from shifting due to shaking, thereby improving the mounting accuracy.

[0043] like Figure 4 As shown, the second conveyor belt 33 is further provided with a baffle limiting component 35 at its side end, which is used to restrict the movement of the circuit board on the second conveyor belt 33.

[0044] like Figure 6As shown, the material collection mechanism 9 further includes a lifting adjustment component 91 and a receiving bin 92. The movable end of the lifting adjustment component 91 is connected to the receiving bin 92. The receiving bin 92 has vertically spaced grooves 921 on both sides. The grooves 921 are used to position and receive the assembled circuit boards. The lifting adjustment component 91 is used to adjust the height of the receiving bin 92. When an assembled circuit board enters the receiving bin 92, the receiving bin 92 can automatically move downwards according to the current stacking height, allowing each circuit board to fall smoothly into the groove 921 in the receiving bin 92, thereby achieving neat stacking of the circuit boards.

[0045] like Figure 6 As shown, the material collection mechanism 9 further includes a material collection conveyor belt 93, which is located at the bottom of the receiving bin 92. The material collection conveyor belt 93 is used to remove the receiving bin 92 after material collection is completed. When the circuit boards stacked in the receiving bin 92 reach a preset capacity, the material collection conveyor belt 93 is activated to automatically transport the fully loaded receiving bin 92 to the subsequent process.

[0046] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A SMT positioning and placement device for circuit board processing, characterized in that, It includes a frame, a tray loading mechanism, a variable pitch conveying mechanism, a dual-axis moving mechanism, a moving base, a lifting module, a placement head, a CCD module, and a material unloading and collection mechanism; The tray feeding mechanism is located on the side of the frame and is used to feed and transport a tray loaded with electronic components. The variable pitch conveying mechanism is located on the frame and is used to transport circuit boards to be mounted. The dual-axis moving mechanism is located above the variable-pitch conveying mechanism. The movable end of the dual-axis moving mechanism is connected to the moving base. Multiple lifting modules are respectively located on the moving base. The lifting modules are connected to the placement head. The placement head is used to mount electronic components on the material tray onto the circuit board. The CCD module is located on the side of the mounting head to identify the mounting position on the circuit board. The unloading and collecting mechanism is located on the side of the variable pitch conveying mechanism and is used to collect the circuit board after mounting.

2. The SMT positioning and placement device for circuit board processing according to claim 1, characterized in that, The material tray feeding mechanism includes a base, a limiting angle bracket, a side clamping cylinder, a lifting cylinder, a lateral moving module, and a support plate; The four limiting angle brackets are respectively arranged around the base. The limiting angle brackets are used to limit the placement of the material tray. The lifting cylinder is located on both sides of the base, with the movable end of the lifting cylinder facing upward, so as to support the material tray. The side clamping cylinders are located on both sides of the base and are used to laterally clamp the bottom layer of the material tray. The lateral moving module is located below the base and its movable end is connected to the support plate. The support plate is used to support the bottom layer of the material tray inside the limiting angle bracket.

3. The SMT positioning and placement device for circuit board processing according to claim 1, characterized in that, The variable pitch conveying mechanism includes a pitch adjustment component, a first conveyor belt, and a second conveyor belt; The first conveyor belt and the second conveyor belt are disposed on both sides of the frame. The first conveyor belt and the second conveyor belt respectively abut against both sides of the circuit board. The spacing adjustment component is connected to the second conveyor belt and is used to adjust the spacing between the second conveyor belt and the first conveyor belt.

4. The SMT positioning and placement device for circuit board processing according to claim 3, characterized in that, The spacing adjustment assembly includes an adjustment handwheel, a first lead screw, a pulley transmission assembly, and a second lead screw; The second conveyor belt is provided with a first threaded seat and a second threaded seat at both ends, the first threaded seat is connected to the first lead screw by a thread, and the second threaded seat is connected to the second lead screw by a thread; The adjusting handwheel is connected to the end of the first lead screw, and the adjusting handwheel is used to drive the first lead screw to rotate. The other end of the first lead screw is connected to the second lead screw through the pulley transmission assembly, and the pulley transmission assembly is used to drive the second lead screw to rotate as the first lead screw rotates. The bottom of the first threaded seat is connected to the frame via a first slide rail assembly, and the bottom of the second threaded seat is connected to the frame via a second slide rail assembly.

5. The SMT positioning and placement device for circuit board processing according to claim 3, characterized in that, It also includes a lifting mechanism, which is located between the first conveyor belt and the second conveyor belt, and is used to lift the circuit board to be mounted; The lifting mechanism includes a lifting cylinder and a support plate. The movable end of the lifting cylinder is arranged facing upward and connected to the support plate. The lifting cylinder is used to drive the support plate to move in the vertical direction.

6. The SMT positioning and placement device for circuit board processing according to claim 3, characterized in that, The second conveyor belt is provided with a baffle limiting component at its side end, which is used to restrict the movement of the circuit board on the second conveyor belt.

7. The SMT positioning and placement device for circuit board processing according to claim 1, characterized in that, The material collection mechanism includes a lifting and adjusting component and a material receiving bin; The movable end of the lifting adjustment component is connected to the receiving bin. The receiving bin has vertically spaced sliding grooves on both sides. The sliding grooves are used to position and receive the board after it has been mounted. The lifting adjustment component is used to adjust the height of the receiving bin.

8. The SMT positioning and placement device for circuit board processing according to claim 7, characterized in that, The material collection mechanism also includes a material conveyor belt, which is located at the bottom of the receiving bin and is used to remove the receiving bin after the material collection is completed.

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