Metal layer-containing multi-layer body for diffuse transillumination

Abstract

The invention relates to a multi-layer body, comprising (I) a carrier layer made of a special thermoplastic polycarbonate molding compound and (II) a metal layer which has one or more recesses. The invention also relates to a lighting or display unit, comprising the multi-layer body and a light source, to a method for producing the multi-layer body, and to the use of the special thermoplastic polycarbonate molding compound as a carrier layer of such a multi-layer body.

Description

[0001] Multilayer body containing a metal layer for diffuse fluoroscopy

[0002] The present invention relates to a multilayer body comprising a carrier layer made of a thermoplastic polycarbonate molding compound and a metal layer, a lighting or display unit comprising the multilayer body and a light source, a method for producing the multilayer body and the use of a thermoplastic polycarbonate molding compound as a carrier layer of such a multilayer body.

[0003] Decorative ambient lighting elements or backlit function display elements are increasingly being used in automotive interiors and bodywork applications. One market trend is to switch on / display the lighting or the display of functions only when needed, e.g., to create a day-night differentiation of the appearance of such elements or to intensify the spatial perception in the automotive interior through such dynamic ambient lighting or to enable the display of information according to needs and situation.

[0004] These lighting or functional elements include, for example, (partially) translucent trim strips, decorative panels, trim panels, steering wheel covers, consoles, handles and instrument panel supports or control elements with which various functions of the vehicle can be operated, such as start / stop buttons and controls for the vehicle lighting or climate control or display elements with which information can be displayed when required.

[0005] Such components or components are generally made of engineering thermoplastics, as these allow a high degree of component individuality and functional integration in large-scale, simple and cost-effective forming processes, especially injection molding.

[0006] There is often a desire to coat the visible surface of such components or elements made of engineering thermoplastics with a decorative layer. This allows for the purpose of adapting their appearance, feel, and / or resistance to environmental influences—for example, the light, UV, or heat resistance of the surface appearance, chemical resistance, or scratch resistance—to the technical requirements of such components or to meet customer demands for a high-quality and differentiated component appearance. Metallic surfaces are in high demand in this context. They can be applied to the thermoplastic base body using a variety of processes, such as metal vapor deposition, back-injection of metal foils, or electroplating.In particular, galvanization has proven itself in industry as a method for applying metal layers to plastic substrates when a component that is mechanically resistant to abrasion or corrosion with good adhesion of the metal layer to the plastic base substrate is desired, as is the case, for example, in automotive applications both indoors and outdoors.

[0007] To achieve translucency, perforations are applied in the metal layer. This means that in certain areas of the component or element, either no metal layer is applied at all, or the metal layer is removed in a subsequent step down to the plastic base. These perforations are also referred to below as cutouts or apertures. The cutouts can, for example, take the form of symbols, patterns, holes, lines, or characters. It is also possible for them to be point-shaped cutouts arranged in the form of symbols, patterns, holes, lines, or characters.

[0008] However, to achieve a translucent component or element, the plastic substrate must also be translucent in its typical thickness for the respective component, i.e., exhibit good light transmission. Typically, the goal is for the substrate layer to be translucent using a visible light source (i.e., light in the wavelength range of 380 to 780 nm).

[0009] To create an appealing visual impression, it is often desirable for the plastic base carrier to scatter the light from a point light source, such as an LED, to at least a certain extent, thereby creating a diffuse illumination image of the illuminated component. Otherwise, the light source would be visible to the viewer and / or the desired visual effect would be limited to a small area of ​​the multilayer body when the light source is switched on. To achieve such a diffuse light impression on a surface of the multilayer body traversed by a point light source, it is necessary for the carrier layer to have, on the one hand, the highest possible transmission of the incident visible light and, on the other hand, the highest possible light diffuseness due to light scattering, i.e. the highest possible half-angle of the light cone resulting from a point light source after it has passed through the carrier layer.The higher this half-angle, the more spatially homogeneous the perceived illumination intensity of the light emanating from a point light source after passing through the carrier layer. With a higher half-angle of the carrier layer, even larger areas can be illuminated by point light sources with largely spatially homogeneous light intensity. In general, the transmittance and light diffusivity (half-angle) of a material cannot be adjusted independently of one another and usually oppose one another. Optimizing light diffusivity by modifying the material, for example by changing its composition, therefore usually results in decreasing transmittance. Both variables are particularly dependent on the thickness of the material layer being illuminated, with transmittance decreasing and the light diffusivity of a translucent material increasing with increasing layer thickness.

[0010] Translucent multilayer bodies with a metal layer are known. DE202013009793 U1 discloses a galvanically decorated component with a translucent symbol or structure incorporated into the surface. The component is manufactured from a galvanizable plastic using an injection molding process, and the symbol is applied using a non-galvanizable, electroplating-stable paint system, or the symbol is printed onto the component. After the galvanization process, the component can be illuminated through the uncoated, metal-free back of the component using a suitable light source, making the symbol visible.

[0011] A similar approach is described in DE102010053165 A1. A method for producing, in particular, galvanized plastic components with haptic and optical interruption structures is disclosed. In this method, island structures made of galvano-stable lacquer are applied to a galvanizable plastic component, and the components are subsequently galvanized in the uncoated areas, so that only the islands in the surrounding structures remain uncoated, and the structures around the islands are coated.

[0012] DE10208674A1 discloses a method for producing electroplated elements with backlit symbols, in which the initially formed first metal layer is partially removed, thus exposing a symbol. In a final step, the electroplated coating on the first metal layer is completed, and the exposed symbol is left out of the electroplating process. The application discloses that particularly good results are achieved when the base body is made of ABS (acrylonitrile butadiene styrene) or ABS / PC (acrylonitrile butadiene styrene / polycarbonate). The first metal layer can be removed by etching, particularly when copper is used. When nickel is used with a thinner layer, the removal can also be achieved by laser ablation.WO2017063768A1 discloses a metallized plastic component with a translucent structure in a day and night design, as well as a method for producing the plastic component. The metallized plastic component comprises a base body made of at least one translucent plastic, to which a metal layer is applied, into which at least one translucent structure in the form of a dot matrix is ​​introduced. It is disclosed that the plastic blank preferably consists at least partially of polyamide, ABS, or ABS / polycarbonate blend.

[0013] DE10320237A1 discloses a method for producing translucent, electroplated thermoplastic parts and translucent thermoplastic parts with an electroplated surface, comprising the following process steps: a thermoplastic part made of a transparent, amorphous plastic is coated with an opaque layer of an electroplated plastic; the electroplated plastic is removed in the area of ​​the symbols by a burning laser beam; and a galvanic layer is applied to the electroplated plastic. It is disclosed that particularly effective electroplating is achieved using acrylonitrile-butadiene-styrene copolymer (ABS) as the electroplated plastic.

[0014] Such components or elements for use in automotive interiors and exteriors are subject to further application-related requirements, such as good thermoplastic processability (melt flowability), high material ductility, especially at low temperatures, and high heat resistance.Thermoplastics that are suitable for such applications and are therefore established in such fields of application, such as polycarbonate, acrylonitrile-butadiene-styrene terpolymers (ABS) and blends of these two thermoplastics either have poor electroplating behavior and sometimes also poor light diffusivity and / or they only achieve insufficient metal-plastic bonding in established electroplating processes, which applies to transparent polycarbonate or polycarbonate compounds containing scattering additives, or they do show good electroplating behavior but insufficient light transmission, which applies to ABS plastics and ABS / PC or PC / ABS blends that have been used to date in this field of application.

[0015] It was therefore desirable to provide a diffusely translucent multilayer body with improved light output, comprising a base carrier made of a thermoplastically processable material and a decorative metal layer provided with recesses. The thermoplastically processable material meets the general application requirements placed by the automotive industry on materials for the production of components for indoor and outdoor use. Furthermore, it was desirable to provide a method for producing such a multilayer body in which the decorative metal layer is applied to the base carrier made of a thermoplastically processable material using an electrochemical deposition process industrially established in plastic electroplating, thereby achieving stable bonding.

[0016] For this purpose, the carrier material had to have a combination of improved transmission for light in the visible wavelength range and high light diffusivity, i.e. a large half-angle and good behavior in an industrially established plastic electroplating process, as well as good thermoplastic processability (melt flowability), high material ductility, especially at low temperatures, and high heat resistance.

[0017] Surprisingly, it was found that a multilayer body comprising

[0018] (I) a carrier layer made of a thermoplastic molding compound containing

[0019] A) at least one member selected from the group consisting of aromatic polycarbonate and aromatic polyestercarbonate,

[0020] B) rubber-modified vinyl (co)polymer from

[0021] B. l) 80 to 95 wt.%, based on the rubber-modified

[0022] Vinyl (co)polymer B, structural units derived from at least one vinyl monomer and

[0023] B.2) 5 to 20 wt.%, based on the rubber-modified

[0024] Vinyl (co)polymer B, one or more rubber-elastic graft bases with glass transition temperatures < -50°C containing at least 50% by weight, based on B.2, of structural units derived from 1,3-butadiene, wherein the rubber-modified vinyl (co)polymer B

[0025] (i) a disperse phase consisting of (1.1) rubber particles grafted with vinyl (co)polymer of structural units according to Bl and

[0026] (1.2) vinyl (co)polymer enclosed in the rubber particles as a separated disperse phase, also consisting of structural units according to Bl and

[0027] (ii) a rubber-free vinyl (co)polymer matrix consisting of structural units according to Bl which is not bound to the rubber particles and not enclosed in these rubber particles, wherein the disperse phase according to (i) has an average diameter D50 measured by ultracentrifugation of 0.7 to 2.0 pm,

[0028] C) optionally at least one further component selected from polymer additives and polymeric blend partners, wherein the thermoplastic molding composition contains less than 2% by weight of rubber-based graft polymers different from component B) and wherein the thermoplastic molding composition has a rubber content of at least 2.0% by weight and

[0029] (II) a metal layer, preferably a multi-layer metal layer, which has at least one recess and wherein the at least one recess has the shape of at least one symbol, a pattern, a hole, a line or a character or it is a point-shaped recess arranged in the shape of at least one symbol, a pattern, a hole, a line or a character, solves the stated problem.

[0030] In the context of this application, the carrier layer (I) is also referred to synonymously as plastic carrier or plastic carrier layer.

[0031] In a preferred embodiment, the thermoplastic molding compound of the carrier layer (I) contains

[0032] 30 to 85% by weight, more preferably 50 to 82% by weight, even more preferably 58 to 82% by weight, most preferably 65 to 75% by weight of component A, 14 to 69% by weight, more preferably 17 to 49% by weight, even more preferably 17 to 41% by weight, most preferably 24 to 34% by weight of component B,

[0033] 0.05 to 20 wt%, more preferably 0.1 to 10 wt%, even more preferably 0.2 to 5 wt%, most preferably 0.3 to 2 wt% of component C.

[0034] In a preferred embodiment, the molding compound of the carrier layer (I) contains less than 1 wt. %, more preferably less than 0.5 wt. %, even more preferably less than 0.2 wt. % of rubber-based graft polymers other than component B). Most preferably, the molding compound contains no rubber-based graft polymers other than component B).

[0035] In a preferred embodiment, the molding compound of the carrier layer (I) has a rubber content in the range of 2.0 to 6 wt.%, more preferably in the range of 2.5 to 5 wt.%, even more preferably in the range of 2.6 to 4.1 wt.%, most preferably in the range of 2.7 to 3.3 wt.%.

[0036] The previously mentioned preferred ranges of components A and B as well as component C can be combined as desired.

[0037] In a preferred embodiment, the carrier layer (I) consists of a thermoplastic molding composition which consists of at least 80% by weight, more preferably at least 95% by weight, more preferably at least 99% by weight, most preferably 100% by weight of components A, B and C.

[0038] The multilayer body is suitable for being illuminated with visible light using a light source, i.e., the multilayer body is transilluminable. The light source is arranged so that the light first strikes the carrier layer (I) and exits through the recesses in the metal layer (II). The light source is preferably an LED.

[0039] Transilluminable means that when the light source is switched on, the visual impression on the side facing away from the light source, i.e. the visible side of the component or element in the installed state, changes.

[0040] In a preferred embodiment, the multi-layer body has, at least in partial areas, ie at the recesses, in its actual thickness there at at least one wavelength in the wavelength range of the spectrum from 380 to 780 nm, a transmittance of at least 10%, more preferably at least 25%, even more preferably at least 40% and most preferably at least 45%, wherein the transmittance is determined from the transmission spectrum which is measured in accordance with the specifications in DIN / ISO 13468-2 in the 2006 version.

[0041] A further object of the invention is the use of a molding composition comprising the above-mentioned components A, B and C and the further specified features as a carrier layer (I) in a multilayer body as described above.

[0042] A further subject matter of the invention is a lighting or display unit comprising the multi-layer body as stated above and a light source which emits light with at least one wavelength in the wavelength range of the spectrum from 380 to 780 nm, wherein the light source is arranged such that the carrier layer is irradiated by the light emitted by the light source.

[0043] Another object of the invention is a method for producing a transilluminable multilayer body, comprising the steps

[0044] (1) Forming a plastic carrier from a thermoplastic molding compound as described above,

[0045] (2) optionally covering at least part of the surface of the plastic carrier facing away from the visible side of the multi-layer body and optionally part of the visible side surface of the plastic carrier with a galvano-stable layer, preferably a lacquer, which locally prevents the chemical, electrochemical or physical metal deposition in process step (3a) and thus the galvanization in this area of ​​the plastic carrier in process step (3c),

[0046] (3) electrochemical deposition of a preferably multilayer metal layer on the part of the surfaces of the plastic carrier not covered with a galvano-stable layer in step (2), wherein process step (iii) comprises the following sub-steps:

[0047] (3a) producing a thin metal layer, preferably a layer of palladium, copper or nickel, on the plastic carrier in a chemical, electrochemical or physical process, preferably selected from deposition from a colloidal solution, direct metallization or vapor deposition, (3b) optionally partially removing the thin metal layer produced in process step (3a) to produce areas on the plastic carrier not covered with the thin metal layer, preferably by a process selected from etching or laser ablation,

[0048] (3c) galvanic completion of a preferably multi-layer metallic surface coating comprising at least one electrochemical metal deposition step, wherein the areas on the plastic carrier produced in process step (3b) which are not covered with the metal thin layer are not galvanized, and

[0049] (4) optionally local removal of the preferably multi-layer metal layer applied to the plastic carrier surface by mechanical, chemical and / or physical methods with the formation of perforations in the metal layer and local exposure of the plastic carrier surface, characterized in that at least one of the optional method steps (2), (3b) and (4) is used in the method and thereby at least one recess results in the preferably multi-layer metal layer on the visible side of the multi-layer body and, if the side of the multi-layer body facing away from the visible side is also exposed to a metal layer in method step (3), at least one recess results in the metal layer on this side of the multi-layer body facing away from the visible side.

[0050] In the event that both the visible side and the side of the multilayer body facing away from the visible side are electrochemically coated with a metal layer in process step (3), the at least one recess introduced into both sides of the multilayer body by at least one of the optional process steps (2), (3b) and (4) are preferably realized in directly opposite regions of the carrier layer (I).

[0051] The "visible side" of the multilayer body is understood to be the side that is visible in the final application of the multilayer body, i.e., in its installed state, in the intended function of the multilayer body. If the multilayer body is part of a lighting or display unit in which the multilayer body is illuminated by a light source, the visible side is the side of the multilayer body facing away from the light source in the lighting or display unit.

[0052] Preferably, only the visible side of the multilayer body is provided with a metal layer. Preferred embodiments of the process are described below.

[0053] Composition of the carrier layer

[0054] Component A

[0055] Aromatic polycarbonates and / or aromatic polyestercarbonates according to component A suitable for the invention are known from the literature or can be prepared by processes known from the literature (for the preparation of aromatic polycarbonates, see, for example, Schnell, "Chemistry and Physics of Polycarbonates", Interscience Publishers, 1964, as well as DE-AS 1 495 626, DE-A 2 232 877, DE-A 2 703 376, DE-A 2 714 544, DE-A 3 000 610, DE-A 3 832 396; for the preparation of aromatic polyestercarbonates, e.g., DE-A 3 007 934). Aromatic polycarbonates are prepared, for example,by reacting diphenols with carbonic acid halides, preferably phosgene, and / or with aromatic dicarboxylic acid dihalides, preferably benzenedicarboxylic acid dihalides, by the interfacial process, optionally using chain terminators, for example monophenols, and optionally using trifunctional or more than trifunctional branching agents, for example triphenols or tetraphenols. Production via a melt polymerization process by reacting diphenols with, for example, diphenyl carbonate is also possible.

[0056] Diphenols for the preparation of the aromatic polycarbonates and / or aromatic polyester carbonates are preferably those of the formula (I)

[0057] (I), where

[0058] A is a single bond, C1 to C5 alkylene, C2 to C5 alkylidene, C5 to C8 cycloalkylidene, -O-, -SO-, -CO-, -S-, -SO2-, C1 to Cn arylene, to which further aromatic rings optionally containing heteroatoms may be condensed, or a radical of the formula (II) or (III)

[0059] B is each Ci to Cn-alkyl, preferably methyl, halogen, preferably chlorine and / or bromine, x is each independently 0, 1 or 2, p is 1 or 0, and

[0060] R 5 and R 6 for each X 1 individually selectable, independently of one another, are hydrogen or Ci to Ce-alkyl, preferably hydrogen, methyl or ethyl, XI is carbon and m is an integer from 4 to 7, preferably 4 or 5, with the proviso that at least one atom X 1 , R 5 and R 6 are simultaneously alkyl.

[0061] Preferred diphenols are hydroquinone, resorcinol, dihydroxydiphenols, bis-(hydroxyphenyl)-Ci-Cs-alkanes, bis-(hydroxyphenyl)-Cs-C6-cycloalkanes, bis-(hydroxyphenyl) ethers, bis-(hydroxyphenyl) sulfoxides, bis-(hydroxyphenyl) ketones, bis-(hydroxyphenyl) sulfones and a,a-bis-(hydroxyphenyl)-diisopropylbenzenes and their nuclear-brominated and / or nuclear-chlorinated derivatives.

[0062] Particularly preferred diphenols are 4,4'-dihydroxydiphenyl, bisphenol A, 2,4-bis(4-hydroxyphenyl)-2-methylbutane, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl sulfone and their di- and tetrabrominated or chlorinated derivatives such as, for example, 2,2-bis(3-chloro-4-hydroxyphenyl)propane, 2,2-bis(3,5-dichloro-4-hydroxyphenyl)propane or 2,2-bis(3,5-dibromo-4-hydroxyphenyl)propane. 2,2-bis(4-hydroxyphenyl)propane is particularly preferred. (Bisphenol A).

[0063] The diphenols can be used individually or as any mixture. The diphenols are known from the literature or are available by known methods.

[0064] Chain terminators suitable for the production of thermoplastic, aromatic polycarbonates are, for example, phenol, p-chlorophenol, p-tert-butylphenol or 2,4,6-tribromophenol, but also long-chain alkylphenols, such as 4-[2-(2,4,4-trimethylpentyl)]phenol, 4-(1,3-tetramethylbutyl)phenol according to DE-A 2 842 005 or monoalkylphenol or dialkylphenols with a total of 8 to 20 carbon atoms in the alkyl substituents, such as 3,5-di-tert-butylphenol, p-iso-octylphenol, p-tert. -Octylphenol, p-dodecylphenol and 2-(3,5-dimethylheptyl)-phenol and 4-(3,5-dimethylheptyl)-phenol. The amount of ketene terminators to be used is generally between 0.5 mol% and 10 mol%, based on the molar sum of the diphenols used.

[0065] The thermoplastic, aromatic polycarbonates have average molecular weights (weight average M w) of preferably 20,000 to 40,000 g / mol, more preferably 24,000 to 32,000 g / mol, particularly preferably 26,000 to 30,000 g / mol, measured by GPC (gel permeation chromatography) calibrated against bisphenol A polycarbonate standards using dichloromethane as eluent, calibration with linear polycarbonates (from bisphenol A and phosgene) of known molar mass distribution from PSS Polymer Standards Service GmbH, Germany, calibration according to method 2301-0257502-09D (from 2009 in German) from Currenta GmbH & Co. OHG, Leverkusen. The eluent is dichloromethane. Column combination of cross-linked styrene-divinylbenzene resins. Diameter of the analytical columns: 7.5 mm; length: 300 mm. Particle sizes of the column material: 3 pm to 20 pm. Solution concentration: 0.2 wt.%. Flow rate: 1.0 ml / min. Solution temperature: 30°C. Use of UV and / or RI detection.

[0066] The preferred ranges achieve a particularly advantageous balance of mechanical and rheological properties in the compositions according to the invention.

[0067] The thermoplastic, aromatic polycarbonates can be branched in a known manner, preferably by incorporating 0.05 to 2.0 mol%, based on the total of the diphenols used, of trifunctional or more than trifunctional compounds, for example those with three or more phenolic groups. Linear polycarbonates, more preferably based on bisphenol A, are preferred.

[0068] Both homopolycarbonates and copolycarbonates are suitable. For the preparation of inventive copolycarbonates according to component A, 1 to 25 wt. %, preferably 2.5 to 25 wt. %, based on the total amount of diphenols to be used, of polydiorganosiloxanes with hydroxyaryloxy end groups can also be used. These are known (US Pat. No. 3,419,634) and can be prepared by processes known from the literature. Polydiorganosiloxane-containing copolycarbonates are also suitable; the preparation of polydiorganosiloxane-containing copolycarbonates is described, for example, in DE-A 3,334,782.

[0069] Aromatic dicarboxylic acid dihalides for the preparation of aromatic polyester carbonates are preferably the diacid dichlorides of isophthalic acid, terephthalic acid, diphenyl ether-4,4'-dicarboxylic acid, and naphthalene-2,6-dicarboxylic acid. Particularly preferred are mixtures of the diacid dichlorides of isophthalic acid and terephthalic acid in a ratio of between 1:20 and 20:1.

[0070] In the production of polyester carbonates, a carbonic acid halide, preferably phosgene, is also used as a bifunctional acid derivative.

[0071] In addition to the monophenols already mentioned, suitable chain terminators for the production of aromatic polyester carbonates are their chlorocarbonic acid esters and the acid chlorides of aromatic monocarboxylic acids, which may optionally be substituted by C1 to C22 alkyl groups or by halogen atoms, as well as aliphatic C2 to C22 monocarboxylic acid chlorides.

[0072] The amount of chain terminators is 0.1 to 10 mol%, based in the case of phenolic chain terminators on moles of diphenol and in the case of monocarboxylic acid chloride chain terminators on moles of dicarboxylic acid dichloride.

[0073] In the production of aromatic polyester carbonates, one or more aromatic hydroxycarboxylic acids can additionally be used.

[0074] The aromatic polyester carbonates can be either linear or branched in a known manner (see DE-A 2 940 024 and DE-A 3 007 934), with linear polyester carbonates being preferred.

[0075] As branching agents, for example, tri- or polyfunctional carboxylic acid chlorides, such as trimesic acid trichloride, cyanuric acid trichloride, 3,3'-,4,4'-benzophenonetetracarboxylic acid tetrachloride, 1,4,5,8-naphthalenetetracarboxylic acid tetrachloride or pyromellitic acid tetrachloride, in amounts of 0.01 to 1.0 mol% (based on dicarboxylic acid dichlorides used) or tri- or polyfunctional phenols, such as phloroglucinol, 4,6-dimethyl-2,4,6-tri-(4-hydroxyphenyl)-hept-2-ene, 4,6-dimethyl-2,4-6-tri-(4-hydroxyphenyl)-heptane, l,3,5-tri-(4-hydroxyphenyl)-benzene, l,l,l-tri-(4-hydroxyphenyl)-ethane, tri-(4-hydroxyphenyl)-phenylmethane, 2,2-bis [4, 4-bis(4-hydroxyphenyl)-cyclohexyl]-propane, 2,4-bis(4-hydroxyphenyl-isopropyl)-phenol, tetra-(4-hydroxyphenyl)-methane, 2,6-bis(2-hydroxy-5-methyl-benzyl)-4-methyl-phenol, 2-(4-hydroxyphenyl)-2-(2,4-dihydroxyphenyl)-propane, Tetra-(4-[4-hydroxyphenyl-isopropyl]-phenoxy)-methane, 1,4-bis[4,4'-dihydroxytri-phenyl)-methyl]-benzene, in amounts of 0,0.1 to 1.0 mol%, based on the diphenols used. Phenolic branching agents can be initially introduced with the diphenols; acid chloride branching agents can be introduced together with the acid dichlorides. The proportion of carbonate structural units in the thermoplastic, aromatic polyester carbonates can vary as desired. The proportion of carbonate groups is preferably up to 100 mol%, in particular up to 80 mol%, and particularly preferably up to 50 mol%, based on the sum of ester groups and carbonate groups. Both the ester and the carbonate portion of the aromatic polyester carbonates can be present in the form of blocks or randomly distributed in the polycondensate.

[0076] The thermoplastic, aromatic polycarbonates and polyester carbonates can be used alone or in any mixture.

[0077] Linear polycarbonate based exclusively on bisphenol A is preferably used as component A.

[0078] Component B

[0079] Component B consists of rubber-modified vinyl (co)polymers made from

[0080] B. l) 80 to 95% by weight, preferably 83 to 93% by weight, more preferably 85 to 92% by weight, based on the rubber-modified vinyl (co)polymer B, of structural units derived from at least one vinyl monomer and

[0081] B.2) 5 to 20 wt.%, preferably 7 to 17 wt.%, more preferably 8 to 15 wt.%

[0082] %, based on the rubber-modified vinyl (co)polymer B, of one or more rubber-elastic graft bases with glass transition temperatures T g < -50°C, preferably < -60°C, particularly preferably < -70°C containing at least 50% by weight, preferably at least 70% by weight, particularly preferably 100% by weight, based on B.2, of structural units derived from 1,3-butadiene, wherein the rubber-modified vinyl (co)polymer B

[0083] (i) a disperse phase consisting of

[0084] (1.1) rubber particles grafted with vinyl (co)polymer of structural units according to Bl and

[0085] (1.2) vinyl (co)polymer enclosed in the rubber particles as a separate disperse phase, also comprising structural units according to B1 and (ii) a rubber-free vinyl (co)polymer matrix consisting of structural units according to B1 which is not bound to the rubber particles and not enclosed in these rubber particles, and wherein the disperse phase according to (i) has an average diameter D50 measured by ultracentrifugation of 0.7 to 2.0 pm, preferably 0.7 to 1.5 pm, in particular 0.7 to 1.2.

[0086] The glass transition temperature T gUnless expressly described otherwise in the present invention, is determined for all components by means of dynamic differential scanning calorimetry (DSC) according to DIN EN 61006 (version of 1994) at a heating rate of 10 K / min with determination of the Tg as the center temperature (tangent method).

[0087] The rubber-modified vinyl (co)polymers according to component B have a melt flow rate (MVR), measured according to ISO 1133 (2012 version) at 220°C with a ram load of 10 kg, of preferably 2 to 20 ml / 10 min, particularly preferably 3 to 15 ml / 10 min, and especially 4 to 8 ml / 10 min. If mixtures of several rubber-modified vinyl (co)polymers are used as component B, the preferred MVR ranges apply to the average of the MVR of the individual components weighted by the mass fractions of the components in the mixture.

[0088] Such rubber-modified vinyl (co)polymers B are prepared, for example, by radical polymerization, preferably in the mass polymerization process, of

[0089] B. l 80 to 95 wt.%, preferably 83 to 93 wt.%, particularly preferably 85 to 92 wt.%, based on the rubber-modified vinyl (co)polymer B, of at least one vinyl monomer in the presence of

[0090] B. 2 5 to 20 wt.%, preferably 7 to 17 wt.%, particularly preferably 8 to 15 wt.%, based on the rubber-modified vinyl (co)polymer B, of one or more rubber-elastic graft bases with glass transition temperatures < -50°C, preferably < -60°C, particularly preferably < -70°C, containing at least 50 wt.%, preferably at least 70 wt.%, particularly preferably 100 wt.%, based on B.2, of structural units derived from 1,3-butadiene.

[0091] In the mass polymerization process preferably used to produce the rubber-modified vinyl (co)polymer B, both the polymerization of the vinyl monomers according to B.1 and grafting of the resulting vinyl (co)polymer onto the rubber-elastic graft base according to B.2 take place. Furthermore, in this reaction procedure, self-organization (phase separation) leads to the formation of a disperse phase (i) consisting of

[0092] (1.1) rubber particles grafted with vinyl (co)polymers of structural units according to B. l and

[0093] (1.2) vinyl (co)polymer enclosed in the rubber particles as a separate disperse phase, also comprising structural units according to B1, wherein this rubber-containing phase (i) is dispersed in a rubber-free vinyl (co)polymer matrix (ii) consisting of structural units according to B1 which is not bound to the rubber particles and is not enclosed in these rubber particles.

[0094] In contrast to the other vinyl (co)polymer components in component B, the rubber-free vinyl (co)polymer (ii) can be dissolved out using suitable solvents such as acetone.

[0095] The size of the disperse phase (i) in the rubber-modified vinyl (co)polymers B thus prepared is adjusted via the reaction conditions such as temperature and resulting viscosity of the polymer as well as shear by, for example, stirring.

[0096] The average particle size D50 is the diameter above and below which 50% by weight of the particles lie. Unless expressly stated otherwise in the present invention, it is determined for all components by ultracentrifuge measurement (W. Scholtan, H. Lange, Kolloid, Z. und Z. Polymere 250 (1972), 782-796).

[0097] The monomers Bl are preferably mixtures consisting of

[0098] B.1.1 60 to 85 parts by weight, particularly preferably 65 to 80 parts by weight, further preferably 70 to 78 parts by weight, in each case based on the sum of B.1.1 and B.1.2, styrene and

[0099] B.1.2 15 to 40 parts by weight, particularly preferably 20 to 35 parts by weight, more preferably 22 to 30 parts by weight, in each case based on the sum of B.1.1 and B.1.2, of acrylonitrile and optionally B.1.3 0-10 parts by weight, preferably 0-7 parts by weight, more preferably 0-5 parts by weight of methyl methacrylate or n-butyl acrylate, in each case based on 100 parts by weight as the sum of B.1.1 and B.1.2.

[0100] In a further preferred embodiment, the monomers B.l are a mixture of 22 to 26 parts by weight of acrylonitrile and 74 to 78 parts by weight of styrene, which may optionally contain up to 10 parts by weight, particularly preferably up to 5 parts by weight, of n-butyl acrylate or methyl methacrylate, the sum of the parts by weight of styrene and acrylonitrile being 100 parts by weight.

[0101] Particularly preferably, B1 is free from B.1.3, whereby the above-mentioned preferred ranges apply with regard to B.1.1 and B.1.2.

[0102] Preferred grafting bases B.2 are diene rubbers containing butadiene, or mixtures of diene rubbers containing butadiene or copolymers of diene rubbers containing butadiene or mixtures thereof with other copolymerizable monomers (e.g. according to B.1.1 and B.1.2).

[0103] Particularly preferred as graft base B.2 is pure polybutadiene rubber. In another preferred embodiment, B.2 is styrene-butadiene block copolymer rubber.

[0104] Component B preferably has a polybutadiene content of 5 to 18 wt.%, more preferably 7 to 15 wt.%, in particular 8 to 13 wt.%.

[0105] Particularly preferred rubber-modified vinyl (co)polymers according to component B are bulk ABS polymers as described, for example, in DE-OS 2 035 390 (=US-PS 3 644 574) or in DE-OS 2 248 242 (=GB-PS 1 409 275) or in Ullmanns, Enzyklopädie der Technischen Chemie, Vol. 19 (1980), p. 280 ff.

[0106] The vinyl (co)polymer (ii) which is not chemically bonded to the rubber base(s) B.2 and not enclosed in the rubber particles can, as previously described, be formed as a result of the production process during the polymerization of the graft polymers B. It is also possible that a portion of this vinyl (co)polymer (ii) which is not chemically bonded to the rubber base(s) B.2 and not enclosed in the rubber particles is formed in the rubber-modified vinyl (co)polymer according to component B as a result of its production in the mass polymerization process, and another portion is polymerized separately and added to component B as a constituent of component B. The proportion of the vinyl (co)polymer (ii), regardless of its origin, measured as the acetone-soluble fraction, in component B, based on component B, is preferably at least 50% by weight, particularly preferably at least 60% by weight, further preferably at least 70% by weight.

[0107] This vinyl (co)polymer (ii) has in the rubber-modified vinyl (co)polymers according to component B a weight-average molecular weight M w from 70 to 250 kg / mol, preferably from 130 to 200 kg / mol, in particular from 150 to 180 kg / mol.

[0108] The weight-average molecular weight M w of the vinyl (co)polymer (ii) in component B is measured in the present invention by gel permeation chromatography (GPC) in tetrahydrofuran against polystyrene as standard.

[0109] Component B is preferably free from alkali, alkaline earth, ammonium or phosphonium salts of saturated fatty acids with 8 to 22 carbon atoms, resin acids, alkyl and alkylarylsulfonic acids and fatty alcohol sulfates.

[0110] Component B preferably contains less than 100 ppm, more preferably less than 50 ppm, most preferably less than 20 ppm of ions of alkali metals and alkaline earth metals.

[0111] Rubber-modified vinyl (co)polymers suitable as component B include Magnum™ 3404, Magnum™ 3504 and Magnum™ 3904 from Trinseo SA (Luxembourg).

[0112] Component C

[0113] Component C may optionally contain one or more representatives selected from the group consisting of polymer additives and polymeric blend partners.

[0114] The polymer additives or polymeric blend partners are preferably selected from the group consisting of lubricants and mold-release agents, stabilizers, colorants, compatibilizers, other impact modifiers different from component B, other polymeric components different from components A and B (for example functional blend partners or graft polymers with core-shell structure produced by the emulsion polymerization process) as well as fillers and reinforcing materials.

[0115] In a preferred embodiment, component C contains no fillers or reinforcing agents. More preferably, it contains no colorants. More preferably, it contains no polymeric blend partners. More preferably, it contains no polymeric components. In a particularly preferred embodiment, it contains neither fillers or reinforcing agents, colorants, nor polymeric blend partners. Most preferably, it contains neither fillers or reinforcing agents, colorants, nor polymeric components.

[0116] In a preferred embodiment, at least one polymer additive selected from the group consisting of lubricants and mold release agents and stabilizers is used as component C.

[0117] In a preferred embodiment, at least one representative selected from the group consisting of sterically hindered phenols, organic phosphites, and organic or inorganic Brönsted acids is used as stabilizer.

[0118] In a preferred embodiment, at least one representative selected from the group consisting of sterically hindered phenols, organic phosphites, and organic or inorganic Brönsted acids is used as stabilizer.

[0119] In a preferred embodiment, fatty acid esters, particularly preferably fatty acid esters of pentaerythritol or glycerol, are used as lubricants and mold release agents.

[0120] In a particularly preferred embodiment, at least one polymer additive selected from the group consisting of C8-C22 fatty acid esters of pentaerythritol, C8-C22 fatty acid esters of glycerol, tris(2,4-di-tert-butylphenyl) phosphite, 2,6-di-tert-butyl-4-(octadecanoxycarbonylethyl)phenol, tetrakis(2,4-di-tert-butylphenyl)-4,4-biphenyl diphosphonite, bis(2,4-di-tert-butylphenyl)-pentaerythritol diphosphite and triethylene glycol bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate] is used as component C.

[0121] In a further embodiment, component C does not contain a rubber-modified vinyl (co)polymer prepared by emulsion polymerization.

[0122] Production of the molding compounds of the carrier layer

[0123] Thermoplastic molding compositions are produced from the components A, B and C according to the invention.

[0124] The thermoplastic molding compositions according to the invention can be prepared, for example, by mixing the respective components of the compositions in a known manner and melt compounding and melt extruding them at temperatures of preferably 200°C to 320°C, particularly preferably at 240 to 300°C, very particularly preferably at 260°C to 290°C in conventional units such as, for example, internal kneaders, extruders and twin-screw extruders.

[0125] This process is generally referred to as compounding in this application.

[0126] The term molding compound is therefore understood to mean the product that is obtained when the components of the composition are melt compounded and melt extruded.

[0127] The mixing of the individual components of the compositions can be carried out in a known manner both successively and simultaneously, both at approximately 20°C (room temperature) and at higher temperatures. This means that, for example, some of the components can be metered via the main feed of an extruder, and the remaining components can be added later in the compounding process via a side extruder.

[0128] metal layer

[0129] The metal layer (II) is preferably a multi-layer metal layer, which is preferably applied in a galvanization process.

[0130] The metal layer has at least one recess. The at least one recess can, for example, be in the form of a symbol, a pattern, a hole, a line, or a character. It is also possible for the recesses to be point-shaped and arranged in the form of at least one symbol, a pattern, a hole, a line, or a character.

[0131] Preferably, the multilayer metal layer consists of at least three, more preferably at least four microscopically and / or chemically analytically differentiable metal layers.

[0132] The thickness of the preferably multilayer metal layer is 5 to 200 pm, preferably 10 to 60 pm, particularly preferably 30 to 50 pm.

[0133] In a first embodiment, the multilayer metal layer consists of three preferably microscopically and chemically-analytically differentiable metal layers, namely, starting from the carrier layer (I),

[0134] (i) a first layer of copper,

[0135] (ii) a second layer of nickel,

[0136] (iii) and a third layer of a metal with high resistance to environmental influences, for example and preferably chromium. In a second, preferred embodiment, the multilayer metal layer consists of four preferably microscopically and chemically analytically differentiable metal layers, namely, starting from the carrier layer (I),

[0137] (i) a first layer of nickel,

[0138] (ii) a second layer of copper,

[0139] (iii) a third layer of nickel,

[0140] (iv) and a fourth layer of a metal with a high resistance to environmental influences, for example and preferably chromium.

[0141] The necessary thicknesses of the individual metal layers and thus the thickness of the entire metal layer in the multi-layer body according to the invention result from the requirements for the mechanical properties, resistance to environmental influences, heat resistance and other necessary properties of the component.

[0142] The copper metal layer preferably has a thickness of 10 to 50 pm, particularly preferably 15 to 30 pm, most preferably 20 to 30 pm.

[0143] In a preferred embodiment, the nickel metal layer following from the carrier layer (I) of the copper layer is at most half as thick as the underlying copper metal layer.

[0144] The uppermost metal layer made of a metal with a high resistance to environmental influences, preferably chromium, preferably has a thickness of 100 nm to 3 pm, particularly preferably of 200 nm to 1.5 pm.

[0145] For those components in which a nickel metal layer directly borders the carrier layer (I), this usually and preferably has a thickness of 500 nm to 5 pm, particularly preferably of 1 pm to 2 pm.

[0146] The metal layer can be coated with a coating agent on the side facing away from the carrier layer. A coating is typically intended to provide mechanical protection against abrasion and scratching and / or protection against weathering, i.e., rainfall, temperature, and UV radiation. A coating can also achieve a specific surface feel or appearance, - TI -

[0147] Suitable coatings include, for example, thermally curing coating systems based on a polysiloxane varnish, which can be single-layer or multi-layer (with only an adhesion-promoting primer layer between the substrate and the polysiloxane topcoat).

[0148] UV-curing coating systems, e.g. based on acrylate, urethane acrylate or acrylosilane, which may contain fillers to improve scratch resistance, can also be used.

[0149] Production of the multilayer bodies

[0150] A preferred process for producing the multilayer bodies according to the invention is described below:

[0151] In a first step (1), the carrier layer (I) is formed from a thermoplastic composition as described above, preferably an extrusion, blow molding, thermoforming or injection molding process, particularly preferably an injection molding process, being used for shaping in the production of this carrier.

[0152] In a subsequent process step, the carrier layer (I) is electroplated in a electroplating process established for acrylonitrile-butadiene-styrene (ABS) copolymers and their blends with polycarbonate.

[0153] The process parameters in process step (1) should preferably be selected so that the support component used in the electroplating process is as stress-free as possible. When using injection molding processes for shaping, it is advantageous to select the injection speed as well as the injection and holding pressure as low as possible, and the mold temperature as high as possible. The specific conditions arise from the mold geometry and the mold gate. Specific injection pressures of no more than 600 bar are advantageous. The specific holding pressure preferably starts at the value of the specific injection pressure and is then preferably adjusted to decrease.

[0154] The tool temperature is preferably in the range 80°C to 140°C, particularly preferably in the range 100 to 130°C.

[0155] In process step (1), it has also proven particularly advantageous and is therefore preferred to use a variothermal injection molding process in which the injection molding tool is first heated to a temperature above the glass transition temperature of the polycarbonate component A), preferably at least 150°C, particularly preferably at least 160°C, this temperature is maintained for the duration of the holding pressure after the polycarbonate composition has been injected into the tool, and only then is the tool cooled to a temperature below the glass transition temperature of the polycarbonate component A), preferably in the range 80°C to 140°C, particularly preferably in the range 100 to 130°C, thereby solidifying it and finally demolding it. Such processes can achieve a further improvement in the practical heat resistance of the galvanized components compared to standard injection molding processes.

[0156] The carrier layer (I) produced in process step (1) can, in principle, be a plate, a profile, or a three-dimensional component of any shape. Furthermore, the carrier layer (I) produced in process step (1) can also be a film. Such films suitable as carrier layers (I) are preferably produced in an extrusion process.

[0157] In the specific case that the carrier layer (I) is produced in an extrusion or blow molding process, in particular in the specific case that the carrier layer (I) is an extruded film or an optionally thermoformed extrusion sheet, a thermoplastic molding composition containing a branched polycarbonate as component A is preferably used to produce the carrier layer (I).

[0158] After production in process step (1), the carrier layer (I) is preferably stored temporarily until the post-shrinkage process is complete. This typically requires 10 to 48 hours. This temporary storage further reduces any remaining stresses in the plastic part.

[0159] In a second optional process step (2), at least a part of the surface of the plastic carrier facing away from the visible side of the multilayer body and optionally a part of the visible side surface of the plastic carrier is coated with a galvano-stable layer, preferably a lacquer, which locally prevents the chemical, electrochemical or physical metal deposition in the later process step (3a) and thus the galvanization in this area of ​​the plastic carrier in the later process step (3c).

[0160] The third process step (3) of electrochemical deposition of a multilayer metal layer on the part of the surface of the plastic carrier not covered with a galvanostable layer in step (2) (electroplating process) comprises the following individual steps: (3a) Production of a thin metal layer, preferably a layer of palladium, copper or nickel, on the plastic carrier in a chemical, electrochemical or physical process, preferably selected from deposition from colloidal solution, direct metallization or vapor deposition,

[0161] (3b) optionally partially removing the thin metal layer produced in process step (3a) to produce areas on the plastic carrier not covered with the thin metal layer, preferably by a method selected from etching or laser ablation,

[0162] (3c) galvanically completing the multi-layer metallic surface coating comprising at least one electrochemical metal deposition step, wherein the areas on the plastic carrier produced in process step (3b) which are not covered with the metal thin film are not galvanized.

[0163] In an optional fourth process step (4), the metal layer applied to the plastic carrier surface is partially removed again by mechanical, chemical and / or physical processes, forming perforations in the metal layer and locally exposing the plastic carrier surface.

[0164] In the process according to the invention for producing the multilayer bodies according to the invention, at least one of the optional process steps (2), (3b), and (4) is used. This results in at least one recess in the preferably multilayer metal layer on the visible side of the multilayer body. If the side of the multilayer body facing away from the visible side is also coated with a metal layer in process step (3), at least one recess also results on this side facing away from the visible side.

[0165] In the event that both the visible side and the side of the multilayer body facing away from the visible side are electrochemically coated with a metal layer in process step (3), the at least one recess introduced into both sides of the multilayer body by at least one of the optional process steps (2), (3b) and (4) are preferably realized in directly opposite areas of the plastic carrier I.

[0166] Preferably, only the visible side of the multilayer body is provided with a metal layer. A preferred method is one in which process step 3a) comprises the following individual steps:

[0167] (3a-l) pickling the plastic carrier produced in process step (1), for example and preferably with chromic sulphuric acid, wherein in a preferred embodiment in this process step a wetting agent (e.g. Udique® Wetting Agent BL2030 from the manufacturer Entone) is used as a processing aid, which reduces the surface tension between the plastic carrier and the pickling agent, followed by a chemical reduction of the chromic sulphuric acid by a reducing agent such as iron(II) chloride and subsequent thorough rinsing with water for the effective removal of chromium residues,

[0168] (3a-2) the activation of the thus pretreated plastic support by adsorption of a palladium colloid, preferably a palladium colloid with a tin chloride shell, on the support surface and

[0169] (3a-3) the generation of palladium nuclei for the subsequent deposition of chemical nickel or chemical copper on the plastic support surface by destroying the shell of the adsorbed palladium colloid by treatment with a dilute Brönsted acid.

[0170] Further preferred is such a process in which process step 3c) comprises the following individual steps:

[0171] (3c-l) Deposition of chemical nickel or chemical copper from a nickel(II) or a copper(II) salt solution using a chemical reducing agent such as a dihydrogen phosphite salt,

[0172] (3c-2) electrochemical deposition of a copper metal layer,

[0173] (3c-3) electrochemical deposition of a nickel metal layer and

[0174] (3c-4) electrochemical deposition of a further metal layer with a high resistance to environmental influences, for example and preferably a chromium metal layer.

[0175] In a further preferred embodiment of the electroplating process, the plastic support from process step (3a-1) is treated with a so-called "conditioner" before process step (3a-2), which acts as a processing aid to improve the adsorption of the palladium colloid in process step (3a-2). These are substances preferably selected from the group of amines, preferably cyclohexanediamine. The "conditioner" is preferably used as an aqueous solution. Before or after treatment with the "conditioner," the plastic support can optionally be additionally treated with an aqueous solution of a Brönsted acid, preferably a hydrochloric acid solution.

[0176] The extent of palladium adsorption is determined, among other things, by the nature of the palladium colloid and the conditions in the activation step (3a-2), in particular the activation time, the temperature and the concentration of the palladium colloid used.

[0177] The conditions in the activation step (3a-2) and, if applicable, in the upstream conditioning steps as described above are preferably selected so that a coverage of the plastic carrier surface after process step (3a-3) of at least 4 mg palladium / m 2 , preferably at least 5 mg palladium / m 2 The palladium coating deposited after process step (3a-3) is preferably at most 50 mg palladium / m 2 , particularly preferably with a maximum of 30 mg palladium / m 2 .

[0178] In process step (3c-l), a closed chemical nickel or chemical copper layer is applied, preferably with a thickness of 500 nm to 5 pm, particularly preferably 1 pm to 2 pm.

[0179] In a preferred embodiment of the electroplating process, in process step (3c-2), a thin reinforcing layer of nickel or copper is first electrochemically applied in a first step (3c-2-1), and then, in a second step (3c-2-2), a thicker high-gloss layer of copper metal is electrochemically applied. In process step (3c-2-2), a higher current density is used than in process step (3c-2-1). In a particularly preferred embodiment, the current density in process step (3c-2-2) is at least 30%, particularly preferably at least 50% higher than the current density in process step (3c-2-1). This preferred embodiment allows the time required to apply the high-gloss copper metal layer to be reduced.

[0180] By selecting the process parameters in step (3c-3), the surface appearance of the components according to the invention can be varied in terms of gloss from high-gloss to matte. The components according to the invention are preferably high-gloss, i.e., they have a gloss level of greater than 90, preferably greater than 95, and particularly preferably greater than 98 at a viewing angle of 60°. For the purposes of the present application, the gloss level is understood to mean the value determined according to ISO 2813, version 2015.

[0181] If the carrier layer (I) is an injection-molded plastic carrier, an optionally thermoformed extrusion sheet, or an extrusion profile, this carrier layer (I) preferably has a thickness of 0.5 to 5 mm, particularly preferably of 1.5 to 3.5 mm, particularly preferably of 1.7 to 3.0 mm. This information is to be understood to mean that the carrier layer (I) has a thickness in these regions at every point of its extent, with carrier layer thicknesses of a maximum of 3.0 mm, more preferably a maximum of 2.5 mm, particularly preferably a maximum of 2.2 mm being used in the regions to be illuminated. The layer does not necessarily have the same thickness over the entire surface, but can also have different thicknesses, for example due to the formation of reinforcing ribs, due to the component shape, due to fastening structures, etc.

[0182] In a special embodiment in which the carrier layer (I) in the multilayer body according to the invention is an extruded film, this film preferably has a thickness of 0.1 to 1 mm, more preferably 0.2 to 0.7 mm, particularly preferably 0.3 to 0.6 mm.

[0183] Such films are suitable for back-injection molding of the side of the carrier layer (I) facing away from the visible side of the multilayer body with a thermoplastic molding compound with high light transmission. The application of the metal layer to the side of the carrier layer (I) facing the visible side of the multilayer body in a galvanization process as described above can be carried out both before and after back-injection molding of the carrier layer film (I), preferably after back-injection molding with the thermoplastic molding compound with high light transmission.

[0184] In this case, a multilayer body with at least three layers results, comprising, in this order, a preferably multilayer metal layer (II), the carrier layer (I), and the back-injection layer (III) made of the thermoplastic molding compound with high light transmission. The back-injection layer (III) made of the thermoplastic molding compound with high light transmission preferably has a thickness of 0.5 to 5 mm, particularly preferably of 1.5 to 3.5 mm, particularly preferably of 1.7 to 3.0 mm, whereby these specifications are to be understood in the same way as previously described.

[0185] As thermoplastic molding compounds with high light transmission, which are suitable for forming the back-injection layer (III), molding compounds produced from a composition containing aromatic polycarbonate are preferably used. The thermoplastic molding compounds suitable for forming the back-injection layer (III) are particularly preferably produced from compositions containing at least one aromatic polycarbonate and at least one representative selected from the group consisting of mold-release agents, stabilizers, flow aids, dyes, pigments, and additives which increase the light scattering of the polycarbonate. The total content of mold-release agents, stabilizers, flow aids, dyes, pigments, and additives which increase the light scattering of the polycarbonate in these compositions is preferably 0.05 to 10 wt. %, particularly preferably 0.1 to 5 wt. %, most preferably 0.2 to 3 wt. %.

[0186] In a preferred embodiment, the thermoplastic molding compound from which the back-injection layer (III) is produced has such a high light transmission that the back-injection layer (III) in its actual thickness has a transmittance of at least 40%, more preferably at least 50%, particularly preferably at least 60% and most preferably at least 70% at least at least one wavelength in the wavelength range of the spectrum from 380 to 780 nm, wherein the transmittance is determined from the transmission spectrum, which is measured according to the specifications in DIN / ISO 13468-2 in the 2006 version.

[0187] Further embodiments of the present invention are described below:

[0188] 1. Multilayer body, comprising

[0189] (I) a carrier layer made of a thermoplastic molding compound containing

[0190] A) at least one member selected from the group consisting of aromatic polycarbonate and aromatic polyestercarbonate,

[0191] B) rubber-modified vinyl (co)polymer of B. l) 80 to 95 wt.%, based on the rubber-modified

[0192] Vinyl (co)polymer B, structural units derived from at least one vinyl monomer and

[0193] B.2) 5 to 20 wt.%, based on the rubber-modified

[0194] Vinyl (co)polymer B, one or more rubber-elastic graft bases with glass transition temperatures < -50°C containing at least 50% by weight, based on B.2, of structural units derived from 1,3-butadiene, wherein the rubber-modified vinyl (co)polymer B

[0195] (i) a disperse phase consisting of

[0196] (1.1) rubber particles grafted with vinyl (co)polymer of structural units according to Bl and

[0197] (1.2) vinyl (co)polymer enclosed in the rubber particles as a separated disperse phase, also consisting of structural units according to Bl and

[0198] (ii) a rubber-free vinyl (co)polymer matrix consisting of structural units according to Bl which is not bound to the rubber particles and not enclosed in these rubber particles, wherein the disperse phase according to (i) has an average diameter D50 measured by ultracentrifugation of 0.7 to 2.0 pm,

[0199] C) optionally at least one further component selected from polymer additives and polymeric blend partners, wherein the thermoplastic molding composition contains less than 2 wt.% of rubber-based graft polymers different from component B) and wherein the thermoplastic molding composition has a rubber content of at least 2.0 wt.%,

[0200] (II) a metal layer, preferably a multi-layer metal layer, which has at least one recess, and wherein the at least one recess has the shape of at least one symbol, a pattern, a hole, a line or a character or are point-shaped recesses arranged in the shape of at least one symbol, a pattern, a hole, a line or a character.

[0201] 2. Multilayer body according to embodiment 1, wherein the thickness of the metal layer is 5 to 200 pm

[0202] 3. Multilayer body according to one of the preceding embodiments, wherein the thickness of the metal layer is 10 to 60 pm.

[0203] 4. Multilayer body according to one of the preceding embodiments, wherein the thickness of the metal layer is 30 to 50 pm.

[0204] 5. Multi-layer body according to one of the preceding embodiments, wherein the metal layer is a multi-layer metal layer consisting of at least three layers.

[0205] 6. Multi-layer body according to one of the preceding embodiments, wherein the metal layer consists of three metal layers, starting from the carrier layer (I),

[0206] (i) a first layer of copper,

[0207] (ii) a second layer of nickel,

[0208] (iii) and a third layer of a metal with a high resistance to environmental influences.

[0209] 7. Multi-layer body according to one of the preceding embodiments, wherein the metal layer consists of four metal layers, starting from the carrier layer (I),

[0210] (i) a first layer of nickel,

[0211] (ii) a second layer of copper,

[0212] (iii) a third layer of nickel,

[0213] (iv) and a fourth layer of a metal with high resistance to environmental influences.

[0214] 8. The multilayer body according to any of the preceding embodiments 5 or 6, wherein the metal with high resistance to environmental influences is chromium. 9. The multilayer body according to embodiment 8, wherein the chromium layer has a thickness of 100 nm to 3 pm.

[0215] 10. Multilayer body according to one of the preceding embodiments 6 to 9, wherein the copper metal layer has a thickness of 10 to 50 pm.

[0216] 11. Multi-layer body according to one of embodiments 6 to 10, wherein the nickel metal layer following the carrier layer (I) of the copper layer is at most half as thick as the underlying copper metal layer.

[0217] 12. Multi-layer body according to one of the preceding embodiments, wherein the carrier layer (I) is an injection-molded body, an optionally thermoformed extrusion sheet or an extrusion profile and the thickness of the carrier layer (I) is in the range 0.5 to 5 mm.

[0218] 13. Multi-layer body according to one of the preceding embodiments, wherein the carrier layer (I) has a thickness of 1.5 to 3.7 mm in the area to be illuminated.

[0219] 14. Multilayer body according to one of embodiments 1 to 11, wherein the carrier layer (I) is a film with a thickness of 0.1 to 1 mm.

[0220] 15. Multilayer body according to embodiment 14, wherein the carrier layer (I) is a film with a thickness of 0.3 to 0.6 mm.

[0221] 16. Multilayer body according to one of the preceding embodiments, wherein the multilayer body consists of at least three layers, comprising in this order

[0222] - a preferably multilayer metal layer (II),

[0223] - the carrier layer (I) and

[0224] - a back-injection layer (III) made of a thermoplastic molding compound which is produced from a composition containing aromatic polycarbonate.

[0225] 17. Multilayer body according to embodiment 16, wherein the back-injection layer (III) is formed from a thermoplastic molding compound produced from a composition containing at least one aromatic polycarbonate and at least one member selected from the group consisting of mold release agents, stabilizers, flow aids, dyes, pigments, and additives that increase the light scattering of the polycarbonate. 18. Multilayer body according to embodiment 17, wherein the content of mold release agents, stabilizers, flow aids, dyes, pigments, and additives that increase the light scattering of the polycarbonate in the molding compound for producing the back-injection layer (III) is 0.1 to 5 wt. %.

[0226] 19. Multi-layer body according to one of the preceding embodiments, wherein the carrier layer (I) is produced in an extrusion or blow molding process and the carrier layer (I) consists of a thermoplastic molding compound which contains a branched polycarbonate as component A.

[0227] 20. Multilayer body according to one of the preceding embodiments, wherein the carrier layer

[0228] 30 to 85 wt.% of component A, 14 to 69 wt.% of component B and 0.05 to 20 wt.% of component C.

[0229] 21. Multilayer body according to one of the preceding embodiments, wherein the carrier layer contains 50 to 82 wt.% of component A, 17 to 49 wt.% of component B and 0.1 to 10 wt.% of component C.

[0230] 22. Multilayer body according to one of the preceding embodiments, wherein the carrier layer contains 58 to 82 wt.% of component A, 17 to 41 wt.% of component B and 0.2 to 5 wt.% of component C.

[0231] 23. Multilayer body according to one of the preceding embodiments, wherein the carrier layer contains 65 to 75 wt.% of component A, 24 to 34 wt.% of component B and 0.3 to 2 wt.% of component C.

[0232] 24. Multilayer body according to one of the preceding embodiments, wherein the carrier layer contains less than 1 wt.% of rubber-based graft polymers different from component B).

[0233] 25. Multilayer body according to one of the preceding embodiments, wherein the carrier layer does not contain any rubber-based graft polymers other than component B).

[0234] 26. Multilayer body according to one of the preceding embodiments, wherein the carrier layer has a rubber content in the range of 2.0 to 6 wt.%. 27. Multilayer body according to one of the preceding embodiments, wherein the carrier layer has a rubber content in the range of 2.5 to 5 wt.%.

[0235] 28. Multilayer body according to one of the preceding embodiments, wherein the carrier layer has a rubber content in the range of 2.6 to 4.1 wt.%.

[0236] 29. Multilayer body according to one of the preceding embodiments, wherein the carrier layer has a rubber content in the range of 2.7 to 3.3 wt.%.

[0237] 30. Multilayer body according to one of the preceding embodiments, wherein component A of the carrier layer is an aromatic polycarbonate based on bisphenol A.

[0238] 31. Multilayer body according to one of the preceding embodiments, wherein component B) of the carrier layer is produced by a mass polymerization process.

[0239] 32. Multilayer body according to one of the preceding embodiments, wherein component B) contains less than 100 ppm in total of ions of alkali metals and alkaline earth metals.

[0240] 33. Multilayer body according to one of the preceding embodiments, wherein component B) contains less than a total of 20 ppm of ions of alkali metals and alkaline earth metals.

[0241] 34. Multilayer body according to one of the preceding embodiments, wherein the carrier layer consists of at least 80 wt.% of components A, B and C.

[0242] 35. Multilayer body according to one of the preceding embodiments, wherein the carrier layer consists of at least 95 wt.% of components A, B and C.

[0243] 36. Multilayer body according to one of the preceding embodiments, wherein the carrier layer consists of components A, B and C.

[0244] 37. Use of a thermoplastic molding composition containing components A, B and C as described in any of the preceding embodiments 1 and 20 to 36 as a carrier layer in a multilayer body, wherein the multilayer body comprises the following components:

[0245] (I) the carrier layer,

[0246] (II) a metal layer, preferably a multilayer metal layer, which has at least one recess.

[0247] 38. Lighting or display unit, comprising a) a multilayer body according to one of embodiments 1 to 36, b) a light source which emits light with at least one wavelength in the wavelength range of the spectrum from 380 to 780 nm, wherein the light source b) is arranged such that the carrier layer (I) of the multilayer body a) is irradiated by the light emitted by the light source b).

[0248] 39. The lighting or display unit according to embodiment 38, wherein the light source is an LED light source.

[0249] 40. A method for producing a multilayer body, comprising the steps

[0250] (1) Forming a plastic carrier from a thermoplastic molding compound containing

[0251] A) at least one member selected from the group consisting of aromatic polycarbonate and aromatic polyestercarbonate,

[0252] B) rubber-modified vinyl (co)polymer from

[0253] B. l) 80 to 95 wt. %, based on the rubber-modified vinyl (co)polymer B, of structural units derived from at least one vinyl monomer and

[0254] B.2) 5 to 20 wt.%, based on the rubber-modified

[0255] Vinyl (co)polymer B, one or more rubber-elastic graft bases with glass transition temperatures < -50°C containing at least 50% by weight, based on B.2, of structural units derived from 1,3-butadiene, wherein the rubber-modified vinyl (co)polymer B

[0256] (i) a disperse phase consisting of

[0257] (1.1) rubber particles grafted with vinyl (co)polymers of structural units according to Bl and

[0258] (1.2) vinyl (co)polymer enclosed in the rubber particles as a separated disperse phase, also consisting of structural units according to Bl and

[0259] (ii) a rubber-free vinyl (co)polymer matrix consisting of structural units according to Bl which is not bound to the rubber particles and not enclosed in these rubber particles, wherein the disperse phase according to (i) has an average diameter D50 measured by ultracentrifugation of 0.7 to 2.0 pm,

[0260] C) optionally at least one further component selected from polymer additives and polymeric blend partners. The thermoplastic molding composition contains less than 2 wt.% of rubber-based graft polymers other than component B), and the thermoplastic molding composition has a rubber content of at least 2.0 wt.%.

[0261] (2) optionally covering at least part of the surface of the plastic carrier facing away from the visible side of the multi-layer body and optionally part of the visible side surface of the plastic carrier with a galvano-stable layer, preferably a lacquer, which in process step (3a) locally prevents the chemical, electrochemical or physical metal deposition and thus in process step (3c) locally prevents the galvanization in this area of ​​the plastic carrier, (3) electrochemical deposition of a preferably multi-layer metal layer on the part of the surface of the plastic carrier not covered with a galvano-stable layer in step (2), wherein process step (3) comprises the following sub-steps:

[0262] (3a) producing a thin metal layer, preferably a layer of palladium, copper or nickel, on the plastic carrier in a chemical, electrochemical or physical process, preferably selected from deposition from colloidal solution, direct metallization or vapor deposition,

[0263] (3b) optionally partially removing the thin metal layer produced in process step (3a) to produce areas on the plastic carrier not covered with the thin metal layer, preferably by a method selected from etching or laser ablation,

[0264] (3c) galvanic completion of the preferably multi-layer metallic surface coating comprising at least one electrochemical metal deposition step, wherein the areas on the plastic carrier not covered with the metal thin layer produced in process step (3b) are not galvanized, and

[0265] (4) optionally local removal of the preferably multi-layer metal layer applied to the plastic carrier surface by mechanical, chemical and / or physical methods with the formation of perforations in the metal layer and local exposure of the plastic carrier surface, characterized in that at least one of the optional method steps (2), (3b) and (4) is used in the method and thereby at least one recess results in the preferably multi-layer metal layer on the visible side of the multi-layer body and, if the side of the multi-layer body facing away from the visible side is also exposed to a metal layer in method step (3), at least one recess results in the metal layer on this side of the multi-layer body facing away from the visible side.

[0266] Examples

[0267] Component Al:

[0268] Linear polycarbonate based on bisphenol A with a weight-average molecular weight Mw of 24,000 g / mol (determined by GPC at room temperature in methylene chloride against a BPA-PC standard). Component A-2:

[0269] Linear polycarbonate based on bisphenol A with a weight-average molecular weight Mw of 28,000 g / mol (determined by GPC at room temperature in methylene chloride against a BPA-PC standard).

[0270] Component Bl:

[0271] Acrylonitrile(A)-butadiene(B)-styrene(S) polymer, produced by a bulk polymerization process, which contains a disperse phase of rubber particles grafted with styrene-acrylonitrile copolymer based on a polybutadiene rubber as the graft base, containing styrene-acrylonitrile copolymer enclosed as a separate disperse phase, and a styrene-acrylonitrile copolymer matrix that is not chemically bonded to the rubber particles and not enclosed in the rubber particles. Component B1 has an A:B:S ratio of 23:10:67 wt.% and a gel content, determined as the acetone-insoluble portion, of 20 wt.%. The acetone-soluble portion of component B1 has a weight-average molecular weight M w(measured by GPC in tetrahydrofuran as solvent with polystyrene as standard) of 165 kg / mol. The mean particle size of the dispersed phase D50, measured by ultracentrifugation, is 0.85 pm. The melt flow rate (MVR) of component B1, measured according to ISO 1133 (2012 version) at 220°C with a ram load of 10 kg, is 6.7 ml / 10 min.

[0272] Component B-2:

[0273] An acrylonitrile(A)-butadiene(B)-styrene(S)-n-butylacrylate(BA) polymer produced by a bulk polymerization process, comprising a disperse phase of rubber particles grafted with styrene-acrylonitrile-n-butylacrylate terpolymer based on a polybutadiene rubber as the graft base, containing styrene-acrylonitrile-n-butylacrylate terpolymer enclosed as a separate disperse phase, and a styrene-acrylonitrile copolymer matrix that is not chemically bonded to the rubber particles and not enclosed within the rubber particles. Component B-2 has an A:B:S:BA ratio of 22.5:10:63:4.5 wt.% and a gel content, determined as the acetone-insoluble fraction, of 19 wt.%. The acetone-soluble portion of component B-2 has a weight-average molecular weight M w(measured by GPC in tetrahydrofuran as solvent with polystyrene as standard) of 115 kg / mol. The mean particle size of the dispersed phase D50, measured by ultracentrifugation, is 0.50 pm. The melt flow rate (MFR) of component Cl, measured according to ISO 1133 (2012 version) at 220°C with a punch load of 10 kg, is 28 g / 10 min. Component B-3

[0274] Acrylonitrile-butadiene-styrene graft polymer with a core-shell structure, produced by emulsion polymerization of 43 wt.%, based on the ABS polymer, of a mixture of 27 wt.% acrylonitrile and 73 wt.% styrene in the presence of 57 wt.%, based on the ABS polymer, of a particulately crosslinked polybutadiene rubber as the graft base. This polybutadiene rubber graft base exhibits a bimodal particle size distribution with maxima at 0.28 pm and 0.40 pm and an average particle size D50, measured by ultracentrifugation, of 0.35 pm.

[0275] Component B-3 does not contain any styrene-acrylonitrile copolymer enclosed in the rubber particles.

[0276] Component B-4

[0277] Acrylonitrile-butadiene-styrene graft polymer with a core-shell structure, produced by emulsion polymerization of 42 wt.%, based on the ABS polymer, of a mixture of 26 wt.% acrylonitrile and 74 wt.% styrene in the presence of 58 wt.%, based on the ABS polymer, of an agglomerated particulate polybutadiene rubber as the graft base. This polybutadiene rubber graft base exhibits a significantly broader and monomodal particle size distribution compared to the graft base used in component B-3. However, the mean particle size D50, measured by ultracentrifugation, is in a similar range to that of component B-3 at 0.38 pm.

[0278] Component B-4 does not contain any styrene-acrylonitrile copolymer enclosed in the rubber particles.

[0279] Component B-5

[0280] Styrene-acrylonitrile copolymer, prepared by mass polymerization, with an acrylonitrile content of 23 wt.% and with a weight-average molecular weight M w of 100,000 Da measured by GPC at room temperature in tetrahydrofuran with polystyrene as standard.

[0281] Component CI:

[0282] Pentaerythritol tetrastearate

[0283] Component C-2:

[0284] Irganox™ B900 (BASF, Ludwigshafen, Germany)

[0285] Mixture of 80 wt.% tris(2,4-di-tert.-butylphenyl) phosphite (Irgafos™ 168) and 20 wt.% 2,6-di-tert.-butyl-4-(octadecanoxycarbonylethyl)phenol (Irganox™ 1076) Component C3:

[0286] Irganox™ 1076 (BASF, Ludwigshafen, Germany) 2,6-Di-tert-butyl-4-(octadecanoxycarbonylethyl)phenol

[0287] Production and testing of the molding compositions according to the invention

[0288] The molding compounds were produced on a ZSK25 twin-screw extruder from Coperion, Werner & Pfleiderer (Stuttgart, Germany) at a melt temperature of 260°C and under a vacuum of 100 mbar (absolute).

[0289] The test specimens were manufactured at a melt temperature of 260°C and a mold temperature of 80°C on an Arburg 270 E injection molding machine.

[0290] The melt viscosity was determined at a temperature of 260°C and a shear rate of 1000 s 1 according to ISO 11443 (version of 2014).

[0291] The IZOD notched impact strength was determined at temperatures ranging from -50°C to 23°C on test specimens measuring 80 mm x 10 mm x 4 mm according to ISO 180 / 1A (2013 version). From the measurements at different temperatures, the tough-brittle transition temperature was determined as the temperature at which 50% of the test specimens fractured brittlely and 50% fractured ductilely.

[0292] To assess material ductility under multiaxial loading at low temperatures, a puncture test was conducted according to ISO 6603-2 (2002 version) at -20°C on ten test specimens measuring 60 mm x 60 mm x 2 mm. The percentage of brittle fractures serves as a measure of material ductility under multiaxial loading. A brittle fracture is defined as a failure in which parts of the test specimen are broken off in a splintering manner during the puncture test and / or the test specimens exhibit unstable crack propagation, causing the test specimen to completely break into two pieces along such a crack during the test.

[0293] The elastic modulus E and the elongation at break were determined on shoulder bars of dimensions 170 mm x 10 mm x 4 mm at 23°C according to ISO 527 (version of 1996) with a strain rate of 1 mm / min (elastic modulus) and 5 mm / min (elongation at break), respectively.

[0294] As a measure of heat distortion temperature, the Vicat B / 120 softening temperature is determined on test specimens measuring 80 mm x 10 mm x 4 mm according to ISO 180 / 1A (2014 version). As a measure of translucency, the total transmittance was determined according to ISO 13468-2 (2006 version) (light source: D65, observer: 10°) on test specimens measuring 60 mm x 40 mm x 2 mm (i.e., with a material thickness of 2 mm). The half-power angle (HPA) of the light intensity was used as a measure of light diffusivity. Larger half-power angles indicate greater light scattering. To determine the half-angle, the intensity of the light after illuminating a test specimen of dimensions 60 mm x 40 mm x 2 mm (i.e. with a material thickness of 2 mm) is measured as a function of the polar angle relative to the incident light beam in the range from 0° to 90°.The obtained values ​​are normalized to the intensity value measured at an angle of 0°, so that the normalized intensity varies between 0 and 1 depending on the polar angle 0, with 1(0°) = 1. The half-power angle (HPA) is defined as the angle at which the normalized intensity drops to 0.5, i.e., I(HPA) = 0.5. With this definition, the theoretically maximum possible half-power angle is 60°.

[0295] A shaped body was produced from the composition 11 according to the invention, onto which a metal layer could be applied using a galvanization process as described above.

[0296] Table 1: Compositions and their properties

[0297] The data in Table 1 show that the molding compositions according to the invention, which contain the inventive component B1 as component B and are within the inventive range with regard to the polybutadiene rubber content, exhibit a surprising, advantageous combination of improved light transmission and high light diffusivity (scattering power). Furthermore, the molding compositions according to the invention exhibit an advantageous combination of improved melt flowability (reduced melt viscosity), good mechanical properties, in particular good material toughness even at low temperatures, and high heat resistance. In contrast, the non-inventive molding compositions which contain the non-inventive emulsion ABS components B-3 or B-4 or a non-inventive bulk ABS component B-2 as component B do not fulfill this technical object of the invention.The same applies to the molding compositions of compositions V9 and V13, which lie outside the range according to the invention with regard to their polybutadiene rubber content.

Claims

AMENDED CLAIMS received by the International Bureau on 12 June 2023 (12.06.2023) multi-layer body, encompassing (I) containing a support layer made of a thermoplastic molding compound A) at least one representative selected from the group consisting of aromatic polycarbonate and aromatic polyester carbonate, B) rubber-modified vinyl(co)polymer made of Bl) 80 to 95 wt.%, based on the rubber-modified Vinyl(co)polymer B, structural units derived from at least one vinyl monomer and B.2) 5 to 20 wt.%, based on the rubber-modified Vinyl(co)polymer B, one or more rubber-elastic graft bases with glass transition temperatures -50°C, determined by differential scanning calorimetry according to DIN EN 61006 in the 1994 version at a heating rate of 10 K / min with determination of the glass transition temperature as the midpoint temperature, containing at least 50 wt.%, based on B.2, of structural units derived from 1,3-butadiene, wherein the rubber-modified vinyl(co)polymer B (i) a dispersed phase consisting of (1.1) with vinyl(co)polymer from structural units according to Bl grafted rubber particles and (1.2) Vinyl(co)polymer also composed of structural units according to Bl and in the rubber particles as a separated dispersed phase (ii) a rubber-free vinyl(co)polymer matrix consisting of structural units according to Bl, which is not bound to and not enclosed in the rubber particles, AMENDED SHEET (ARTICLE 19) wherein the dispersed phase according to (i) has a mean diameter D50 measured by ultracentrifugation of 0.7 to 2.0 pm, C) optionally at least one further component selected from polymer additives and polymer blend partners, wherein the thermoplastic molding compound contains less than 2 wt.% of rubber-based graft polymers other than component B) and wherein the thermoplastic molding compound has a rubber content of at least 2.0 wt.%, and (II) a metal layer having at least one recess, wherein the at least one recess is in the form of at least one symbol, pattern, hole, line or sign or consists of dot-shaped recesses arranged in the form of at least one symbol, pattern, hole, line or sign.

2. Multilayer body according to claim 1, wherein the thickness of the metal layer is 5 to 200 pm.

3. Multilayer body according to one of the preceding claims, wherein the metal layer is a multilayer metal layer consisting of at least three layers.

4. Multilayer body according to one of the preceding claims, wherein the metal layer consists of three metal layers, starting from the carrier layer (I), (i) from a first layer of copper, (ii) a second layer of nickel, (iii) and a third layer of chromium.

5. Multilayer body according to any one of the preceding claims 1 to 3, wherein the metal layer consists of four metal layers, starting from the carrier layer (I), (i) from a first layer of nickel, (ii) a second layer of copper, (iii) a third layer of nickel, (iv) and a fourth layer of chromium. AMENDED SHEET (ARTICLE 19) 6. Multilayer body according to one of claims 4 to 5, wherein the chromium layer has a thickness of 100 nm to 3 pm.

7. Multilayer body according to one of the preceding claims, wherein the thickness of the carrier layer (I) is in the range of 0.5 to 5 mm.

8. Multilayer body according to any one of claims 1 to 6, wherein the carrier layer (I) is a film with a thickness of 0.1 to 1 mm.

9. Multilayer body according to one of the preceding claims, characterized in that the multilayer body consists of at least three layers, comprising in this order - a preferably multilayer metal layer (II), - the carrier layer (I) and - a back-injection layer (III) made of a thermoplastic molding compound which is made from a composition containing aromatic polycarbonate.

10. Multilayer body according to one of the preceding claims, wherein the carrier layer (I) 30 to 85 wt.% of component A, Contains 14 to 69 wt% of component B, and 0.05 to 20 wt% of component C.

11. Multilayer body according to one of the preceding claims, wherein the carrier layer has a rubber content of 2.6 to 4.1 wt.%.

12. Multilayer body according to one of the preceding claims, wherein the support layer contains less than 1 wt.% of rubber-based graft polymers other than component B).

13. Use of a thermoplastic molding compound containing A) at least one representative selected from the group consisting of aromatic polycarbonate and aromatic polyester carbonate, B) rubber-modified vinyl(co)polymer made of AMENDED SHEET (ARTICLE 19) Bl) 80 to 95 wt.%, based on the rubber-modified vinyl(co)polymer B, structural units derived from at least one vinyl monomer and B.2) 5 to 20 wt.%, based on the rubber-modified Vinyl(co)polymer B, one or more rubber-elastic graft bases with glass transition temperatures < -50°C, determined by differential scanning calorimetry according to DIN EN 61006 in the 1994 version at a heating rate of 10 K / min with determination of the glass transition temperature as the midpoint temperature, containing at least 50 wt.%, based on B.2, of structural units derived from 1,3-butadiene, wherein the rubber-modified vinyl(co)polymer B (i) a dispersed phase consisting of (1.1) with vinyl(co)polymer from structural units according to B. l grafted rubber particles and (1.2) Vinyl(co)polymer also composed of structural units according to Bl and in the rubber particles as a separated dispersed phase (ii) a rubber-free vinyl(co)polymer matrix consisting of structural units according to Bl, which is not bound to or enclosed in the rubber particles, wherein the dispersed phase according to (i) has a mean diameter D50 measured by ultracentrifugation of 0.7 to 2.0 pm, C) optionally at least one further component selected from polymer additives and polymer blend partners wherein the thermoplastic molding compound contains less than 2 wt.% of rubber-based graft polymers other than component B) and AMENDED SHEET (ARTICLE 19) wherein the thermoplastic molding compound has a rubber content of at least 2.0 wt.%, as a carrier layer in a multi-layer body, wherein the multi-layer body comprises the following components: (I) the support layer, (II) a metal layer having one or more recesses.

14. Lighting or display unit comprising a) a multilayer body according to any one of claims 1 to 12 b) a light source which emits light with at least one wavelength in the wavelength range of the spectrum from 380 to 780 nm, wherein the light source b) is arranged such that the carrier layer (I) of the multilayer body a) is irradiated by the light emitted by the light source b).

15. Method for producing a multilayer body, comprising the steps (1) Molds of a plastic carrier containing a thermoplastic molding compound A) at least one representative selected from the group consisting of aromatic polycarbonate and aromatic polyester carbonate , B) rubber-modified vinyl(co)polymer made of Bl) 80 to 95 wt.%, based on the rubber-modified vinyl(co)polymer B, structural units derived from at least one vinyl monomer and B.2) 5 to 20 wt.%, based on the rubber-modified Vinyl(co)polymer B, one or more rubber-elastic graft bases with glass transition temperatures < -50°C, determined by differential scanning calorimetry according to DIN EN 61006 in the 1994 version at a heating rate of 10 K / min with determination of the AMENDED SHEET (ARTICLE 19) Glass transition temperature as midpoint temperature, containing at least 50 wt%, based on B.2, of structural units derived from 1,3-butadiene, wherein the rubber-modified vinyl(co)polymer B (i) a dispersed phase consisting of (1.1) with vinyl(co)polymer from structural units according to Bl grafted rubber particles and (1.2) Vinyl(co)polymer also composed of structural units according to Bl and in the rubber particles as a separated dispersed phase (ii) a rubber-free vinyl(co)polymer matrix consisting of structural units according to Bl, which is not bound to or enclosed in the rubber particles, wherein the dispersed phase according to (i) has a mean diameter D50 measured by ultracentrifugation of 0.7 to 2.0 µm, C) optionally at least one further component selected from polymer additives and polymer blending partners, wherein the thermoplastic molding compound contains less than 2 wt% of rubber-based graft polymers other than component B) and wherein the thermoplastic molding compound has a rubber content of at least 2.0 wt%, (2) optionally covering at least a part of the surface of the plastic carrier facing away from the visible side of the multilayer body, and optionally a part of the visible surface of the plastic carrier, with a galvanostable layer, preferably a lacquer, which in process step (3a) facilitates the chemical, electrochemical or physical deposition of metals and AMENDED SHEET (ARTICLE 19) Thus, in process step (3c), electroplating is locally prevented in this area of ​​the plastic carrier. (3) Electrochemical deposition of a preferably multilayer metal layer on the part of the surface of the plastic carrier not covered with a galvanostable layer in step (2), wherein process step (3) comprises the following sub-steps: (3a) Production of a thin metal layer, preferably a layer of palladium, copper or nickel, on the plastic substrate by a chemical, electrochemical or physical process, preferably selected from deposition from colloidal solution, direct metallization or vapor deposition, (3b) optional partial removal of the thin metal layer produced in process step (3a) to create areas on the plastic substrate not covered by the thin metal layer, preferably by a method selected from etching or laser ablation, (3 c) Electroplating to complete the preferably multilayer metallic surface coating comprising at least one electrochemical metal deposition step, wherein the areas on the plastic substrate produced in process step (3b) that are not covered with the metal thin film are not electroplated, and (4) Optionally, local removal of the preferably multilayer metal layer applied to the plastic carrier surface by mechanical, chemical and / or physical processes, forming perforations in the metal layer and locally exposing the plastic carrier surface, characterized in that at least one of the optional process steps (2), (3b) and (4) is used in the process and thereby results in at least one recess in the preferably multilayer metal layer on the visible side of the multilayer body and, if the side of the multilayer body facing away from the visible side is also coated with a metal layer in process step (3), at least one recess in the metal layer also results on this side of the multilayer body facing away from the visible side. AMENDED SHEET (ARTICLE 19)

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