Pump comprising a pressure chamber and a cooling system

EP4493820A1Pending Publication Date: 2025-01-22KNF NEUBERGER
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Patent Information

Application Number
EP2023713068
Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-03-16
Filing Date
2023-03-16
Publication Date
2025-01-22

AI Technical Summary

Technical Problem

Conventional pumps face inefficiencies in heat dissipation, particularly at high volume flows and pressures, leading to reduced performance and potential damage due to excessive heat generation, which limits compression and pressure output.

Method used

The implementation of a cooling system utilizing heat pipes with a heat transfer fluid and heat sinks to efficiently transfer heat away from the pump housing, allowing for effective cooling of both the housing and the fluid, thereby maintaining performance and exceeding temperature limits.

Benefits of technology

This configuration enables high heat flux densities and independent orientation, allowing for efficient cooling without the need for active return of the condensed fluid, resulting in increased power density and reliable operation at constant temperatures.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a pump (1) comprising a housing (3) which delimits a pressure chamber (2), the pressure chamber (2) having a pressure chamber feed line (4) and, arranged at a distance therefrom, a pressure chamber discharge line (5). By means of a displacement device arranged displaceably in the pressure chamber (2), a fluid flowing into the pressure chamber (2) via the pressure chamber feed line (4) can be exposed to a pressure and can be expelled from the pressure chamber (2) via the pressure chamber discharge line (5). Furthermore, the pump (1) has a cooling system for cooling the housing (2) of the pump (1). The cooling system has at least one heat pipe (12), containing a heat transfer fluid, and at least one heat sink (8), the at least one heat pipe (12) having a housing contact region (13) for providing heat-conducting contact between the heat pipe (12) and the housing (2), and, arranged at a distance therefrom, a heat sink contact region (14) for providing heat-conducting contact between the heat pipe (12) and the at least one heat sink (8). When the cooling system is used as intended, the heat of the housing (2) is transferred via the at least one heat pipe (12) from the housing (2) to the at least one heat sink (8).
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Description

[0001] Pump with a pressure chamber and a cooling system

[0002] The invention relates to a pump with a housing which delimits a pressure chamber, wherein the pump has a pressure chamber inlet line and a pressure chamber outlet line, which each open into the pressure chamber, wherein a fluid flowing into the pressure chamber via the pressure chamber inlet line can be subjected to pressure by means of a displacement device arranged displaceably in the pressure chamber and can be expelled from the pressure chamber via the pressure chamber outlet line, and with a cooling system for cooling the housing of the pump.

[0003] Pumps or compressors are regularly used to pump fluids. While the fluid being pumped is incompressible with pumps, the medium being pumped is compressible with compressors. Regardless of whether a pump or a compressor is used to pump the fluid, the term "pump" is used below to refer to and summarize both pumps and compressors according to the definition described above.

[0004] Most commercially available pumps have a housing defining a pressure chamber with an inlet opening and an outlet opening. The inlet opening is connected to a pressure chamber supply line, and the outlet opening is connected to a pressure chamber discharge line. The fluid to be pumped flows via the pressure chamber supply line through the inlet opening into the pressure chamber, where it is pressurized by a displacement device displaceably arranged in the pressure chamber, and then flows out through the outlet opening into the pressure chamber discharge line. Many designs of the displacement device are known from the prior art, and the displacement device can, among many other design possibilities, be designed as a piston in the form of a piston pump which applies pressure to the fluid, or as a diaphragm in the form of a diaphragm pump.

[0005] Particularly in the case of high volume flows, high pressures or a high pump delivery speed, the delivery of the fluid inevitably causes heat to build up in the pressure chamber. The heat generated must be dissipated by the pump in order to avoid damage to the pump and to maintain its performance. High delivery speeds have the disadvantage that the friction between the components displaced relative to one another and the fluid being pumped creates frictional heat, which heats up the medium and the pump itself. Additional heat can also be generated when fluids are compressed and in mechanically moving parts of the pump. All of this plays a major role, especially when a gas is subjected to a high compression pressure. As already mentioned, the heat generated must be dissipated by the pump itself or...be dissipated from the housing in order not to place excessive strain on the pump's mechanical components and to unnecessarily limit the pump's performance. If the fluid in the pressure chamber is already at a high temperature when it flows in or is heated by the pump, the fluid can only be compressed to a lower level and therefore pressure is lower than with a fluid at a lower temperature, as the temperature movement of the fluid particles counteracts compression. If sufficiently high heat dissipation cannot be guaranteed, the pump can only compress the fluid to a lower level, which limits the pump's performance.

[0006] To facilitate heat dissipation, simple pump designs have a housing made of a material with good thermal conductivity, such as a metal or a metal alloy, so that the heat generated by the mechanical work and compression can be transferred to the housing and ultimately via the housing to the environment. Other designs have an additional cooling system with which individual components or the housing itself can be cooled in order to counteract adverse heating of the housing. Such a cooling system can, for example, be designed as water cooling, wherein the heat of the housing is transferred to a carrier fluid in contact with the housing, such as water, which can lower the temperature of the housing by absorbing the heat of the housing.Water cooling typically requires a sufficiently tight connection of the housing to be cooled to a cooling water circuit and suitable control or regulation of the cooling performance achieved by the water cooling. The cooling effect is often considered insufficient considering the required effort. Therefore, the challenge is to provide a pump with a cooling system that can be cooled as efficiently as possible in a simple manner.

[0007] The object is achieved in that the cooling system has at least one heat pipe containing a heat transfer fluid and at least one heat sink, wherein the at least one heat pipe has a housing contact area for a heat-conducting contact of the heat pipe with the housing and a heat sink contact area arranged at a distance therefrom for a heat-conducting contact of the heat pipe with the at least one heat sink, wherein the heat of the housing is transferred from the housing to the at least one heat sink via the at least one heat pipe when the cooling system is used as intended.

[0008] By means of such a design, effective cooling performance can be achieved, wherein the heat from the heat-stressed pump components and / or the housing itself can be transferred to the heat sink via the at least one heat pipe. By cooling the housing, the fluid of the pump which is in contact with the housing and is to be pumped can also be cooled, whereby a higher volume flow can be pumped with the same pump design. For example, a pump designed in this way can reliably fall below and comply with temperature limits specified by standards, whereby a higher power density of the pump can be achieved at a constant temperature. For this purpose, the design according to the invention has at least one heat pipe and at least one heat sink to dissipate the heat from the housing.The at least one heat pipe can be designed as a straight or partially curved pipe, with the heat transfer fluid being located in an interior space enclosed by a pipe wall. The at least one heat pipe is connected to the pump housing in a heat-conducting manner via the housing contact region of the heat pipe and to the at least one heat sink via the heat sink contact region opposite the housing contact region. As a result of the heating of the housing, the housing contact region of the heat pipe and also the initially liquid heat transfer fluid in the heat pipe are heated to their boiling point, during which time it partially changes from its liquid phase into the gas phase.Due to the resulting local pressure changes, the now gaseous medium spreads throughout the entire interior and condenses on the colder heat sink contact area, giving off its heat and thus returning to its liquid state, where it can be heated up again and returned to the circuit. The at least one heat pipe can be designed as a tube with a round, oval, rectangular or some other polygonal cross-section and is therefore adaptable to the respective location of use and the conditions prevailing there. Furthermore, the at least one heat pipe can also have a different or alternating shape in sections.

[0009] The at least one heat pipe is preferably designed as a passively acting heat pipe, in that the interior of the at least one heat pipe is divided into a plurality of capillaries. As a result, the heat transfer fluid condensed at the heat sink contact area can be guided back to the housing contact area by capillary action. A separate active return of the condensed heat transfer fluid to the housing contact area is not required, which considerably simplifies the design and operation of the cooling system. The use of a heat pipe designed as a heat pipe enables high heat flux densities in any orientation and also a use which is independent of the return of the condensed heat transfer fluid by gravity. However, other designs of the heat pipe and, if required, actively controlled operation of the heat pipe are also possible.

[0010] The at least one heat sink itself can be designed as a passively cooled or as an actively cooled component, which releases the heat transferred via the at least one heat pipe from the housing to the at least one heat sink to the ambient air. The at least one heat sink has the highest possible thermal conductivity in order to enable rapid removal of the heat from the pump housing. The at least one heat sink can itself be arranged with a heat sink contact surface on the housing or in contact with a housing wall or can also be formed integrally therewith in order to enable, in addition to the heat transfer via the at least one heat pipe from the housing to the at least one heat sink, heat transfer directly from the housing to the at least one heat sink. In this way, the heat transfer and thus also the cooling performance can be increased. In an alternative embodiment, the

[0011] The heat sink can also be arranged spatially separately from the housing, with the heat transfer to it taking place via the at least one heat pipe.

[0012] In addition to a pump design with a single heat pipe and a single heat sink, the invention also provides design variants in which multiple heat pipes connect the housing to a shared heat sink, or one heat pipe connects the housing to multiple heat sinks, or multiple heat pipes connect the housing to multiple heat sinks. Thus, the pump cooling and the required cooling performance can be adapted to the pump's requirements.

[0013] It is further optionally provided that the at least one heat sink has a heat sink block and a cooling fin arrangement which is connected to the heat sink block in a heat-conducting manner and has a plurality of cooling fins arranged at a distance from one another, wherein the heat absorbed by the heat sink block is dissipated to the ambient air via the cooling fins. The heat sink block and / or the cooling fins can be made from a material with particularly good heat conduction, such as a metal or a metal alloy, and in particular from aluminum and / or copper. Alternatively, the heat sink block and / or the cooling fins can also be made from another material or composite material with good heat conduction, or can be coated therewith.The heat sink block is preferably designed such that the heat transferred via the at least one heat pipe to the heat sink block or directly via the housing to the heat sink block can be quickly absorbed, so that heat can again flow away from the housing towards the heat sink block. For this purpose, the heat sink contact area of ​​the at least one heat pipe can be directly connected to the heat sink block via a direct contact, or a particularly thermally conductive thermal paste can be arranged between the two components in order to make the heat transfer as efficient as possible and to further increase it.

[0014] For improved heat dissipation from the heat sink to the ambient air, the cooling fin arrangement can be arranged on the heat sink block. The cooling fin arrangement preferably has a plurality of cooling fins arranged at a distance from one another, which can be implemented, for example, as plates arranged at a distance from one another. These cooling fins or these plates particularly preferably have the largest possible surface area with the smallest possible volume in order to be able to dissipate the heat transferred from the heat sink block to the cooling fins quickly to the ambient air through the large contact area between the cooling fins and the ambient air. The cooling fins can also have partially or fully penetrating recesses or shapes that differ from a plate.

[0015] The heat transfer from the heat sink block to the cooling fins can be improved by a one-piece design of the heat sink block with the cooling fins in order to make the heat transfer particularly effective. Alternatively, the cooling fins can also be connected to the heat sink block in a heat-conducting manner via another suitable connection. In a non-one-piece design, a suitable thermal paste with a high thermal conductivity can also be arranged between the heat sink block and the cooling fins in order to improve the heat-conducting connection of the cooling fins to the heat sink block. In an alternative design option, the at least one heat pipe can also be arranged directly with its heat sink contact area on the cooling fins in order to be able to transfer the heat directly to the cooling fins, bypassing the heat sink block.In such an embodiment, it may be advantageous for the at least one heat pipe to be arranged along a longitudinal direction on the cooling fins in order to enable the largest possible contact area between the at least one heat pipe and the cooling fins.

[0016] This cooling system design is based on purely passive elements. This allows for cost-effective, highly efficient, and quiet cooling of the pump, as the cooling system eliminates the need for moving parts.

[0017] Furthermore, the invention provides that an air flow generating device is arranged on the at least one heat sink, wherein the air flow generating device can generate an air flow for additional cooling of the cooling fins. In addition to the already mentioned purely passive cooling of the cooling fins of the at least one heat sink, wherein the heat absorbed by the cooling fins is released into the ambient air and transported away by convection, it can also be provided to actively cool the cooling fins. For this purpose, the air flow generated by the air flow generating device can be guided over the cooling fins, whereby these are additionally cooled and the air flow likewise promotes the transport of the warm ambient air in addition to the pure convection currents.For this purpose, the airflow generation device can be designed as a fan arranged on the cooling fins, which blows the generated airflow directly onto or through the cooling fins arranged at a distance from one another. This enables a compact arrangement of the cooling system in the smallest possible space, since the additional active cooling allows a smaller number of cooling fins to be used. In an alternative embodiment, the airflow generation device can also be arranged at a distance from the heat sink, wherein the airflow can be blown onto the cooling fins via one or more suitable air ducts.

[0018] An advantageous embodiment of the inventive concept provides that the cooling system has a water cooling device for cooling the heat sink contact area of ​​the at least one heat pipe. In addition to the additional cooling of the cooling fins by the air flow generation device, the cooling system can alternatively also have a water cooling device. The heat of the heat sink contact area of ​​the at least one heat pipe can be transferred by water or another fluid with a high thermal conductivity that is in contact with the heat sink contact area or flows past it. The fluid heated in this way can be circulated, wherein it is subject to alternating heating and cooling.

[0019] The water cooling device can enclose the at least one heat pipe at the heat sink contact area in sections or completely, for example in the form of a pipe that encloses the heat pipe in sections or is coiled around the heat pipe. The water flowing in the pipe can absorb the heat from the at least one heat pipe along the contact area and dissipate it from the at least one heat pipe. The pipe is preferably designed as a closed system in which the heated water is in a circulating system. The heated water is transported away, cools down if necessary using further passive or active cooling, and can then be used again to cool the heat sink contact area of ​​the at least one heat pipe.

[0020] Furthermore, it is optionally provided that the at least one heat pipe with the heat sink contact area is arranged in heat sink recesses of the heat sink block and is connected to the heat sink block in a heat-conducting manner. By arranging the at least one heat pipe or its heat sink contact area in heat sink recesses of the heat sink block, the most effective heat transfer can be achieved by making the contact area between the at least one heat pipe and the heat sink block as large as possible. The larger this contact area, the more heat can be transferred between the two components per unit of time. The at least one heat pipe can preferably also have one or more bends in order to be able to enlarge this contact area even further.Alternatively, or additionally, for effective heat transfer, multiple heat pipes can be used, arranged in multiple heat sink recesses of the heat sink block. It is also possible for the at least one heat pipe to be arranged in cooling fin recesses of the cooling fins, whereby the absorbed heat can be transferred directly to one or more cooling fins.

[0021] The heat sink recess and / or the cooling fin recess can be adapted to the shape of the at least one heat pipe in order to make the contact area between the at least one heat pipe and the heat sink block or between the at least one heat pipe and the cooling fins as large as possible. Alternatively, the heat sink recess and / or the cooling fin recess can have a shape that differs from that of the at least one heat pipe, wherein in both cases the heat sink recesses and / or the cooling fin recess can be lined with a particularly well-conducting thermal paste for optimum heat transfer. A thermal paste of this type makes it possible to compensate for manufacturing tolerances such as minor unevenness of surfaces and thus a smaller contact area if the at least one heat pipe and the heat sink block are not formed as a single piece.

[0022] According to one embodiment of the inventive concept, it is provided that the heat sink contact region of the at least one heat pipe is connected in a heat-conducting manner to a contact plate, wherein the contact plate has a high thermal conductivity of greater than 200 W / m-K and in particular of greater than 300 W / m-K, and wherein the contact plate can be cooled by the air flow generation device or is connected to the at least one heat sink. In order to make the contact region and thus the heat transfer as effective as possible, the heat sink contact region of the at least one heat pipe can be connected to the contact plate or can be extended to form the contact plate.The contact plate is preferably made of a particularly good heat-conducting material, such as aluminum, and particularly preferably of a material such as copper and / or silver and / or gold and / or their alloys, in order to enable optimal heat transfer from the at least one heat pipe to the contact plate and ultimately optimal heat transfer away from the contact plate. For a particularly effective connection, the at least one heat pipe can also be made of the same material as the contact plate.

[0023] For this purpose, the contact plate can preferably be designed as a flat plate which has a larger surface area either to the heat sink or to the air flow generation device than the heat sink contact area of ​​the at least one heat pipe, in order to make the further heat transfer as efficient as possible. Here, too, the connection between the components can be increased through the use and suitable arrangement of a thermal paste. In keeping with the design of the heat sink block, wherein the at least one heat pipe has at least one curve in its heat sink contact area, the heat sink contact area of ​​the at least one heat pipe in the design with a contact plate can also have at least one curve in order to increase the contact area between the two components and thus the heat transfer.

[0024] Optionally, the cooling fins are arranged parallel to a surface of the housing. The cooling fins of the cooling fin arrangement can be arranged at a distance from one another on the heat sink block and parallel to the surface. In addition to the arrangement of the individual cooling fins on the cooling fin block, the individual cooling fins can be spaced apart and arranged parallel to one another, wherein they are only connected to one another via the at least one heat pipe, so that a layered arrangement supported by the at least one heat pipe is created in one direction.

[0025] According to one embodiment of the invention, the cooling fins are arranged at an angle to the surface of the housing. Such cooling fins arranged at an angle to the surface can be adapted particularly effectively to the available installation space or to the spatial requirements of the intended operating location of the pump.

[0026] Optionally, it is provided that the pressure chamber supply line and / or the pressure chamber discharge line run parallel to the heat sink block over as large an area as possible and / or are partially embedded in it. A parallel arrangement of the pressure chamber supply line and / or the pressure chamber discharge line to the heat sink block enables a large contact area in which optimal heat exchange between the two components and thus cooling of the pump itself can take place due to the constant and smallest possible distance between the lines and the heat sink. This enables cooling of the pressure chamber supply line and in particular of the pressure chamber discharge line, whereby the pressure chamber discharge line regularly has a higher temperature than the pressure chamber supply line due to the heat generated during compression of the fluid.Therefore, it can be advantageous that the pressure chamber discharge line in particular has a smaller distance to the heat sink block for effective cooling and runs parallel to it for as long as possible.

[0027] The two lines can be embedded in the pump housing, arranged in a recess on a side of the housing facing the heat sink block, or arranged directly in the heat sink block. A smaller distance between the lines and the heat sink block can enable more effective heat transfer and thus more effective cooling. This heat transfer can be made more effective the greater the temperature difference between the lines and the housing or the heat sink block.

[0028] According to an embodiment of the invention, it can be provided that the pressure chamber supply line and / or the pressure chamber discharge line runs parallel to the pressure chamber. Such an arrangement can enable effective heat transfer due to the proximity of the components and the associated large contact area. For effective heat transfer, it can therefore be advantageous if the pressure chamber supply line and / or the pressure chamber discharge line are arranged parallel to the pressure chamber on the one hand and parallel to the heat sink block on the other.

[0029] Optionally, it is provided that a course of the at least one heat pipe has at least one change of direction, so that the at least one heat pipe has the longest possible contact area between the at least one heat pipe and the heat sink block and / or between the at least one heat pipe and the housing. The larger the

[0030] The larger the contact area between the at least one heat pipe and the heat sink block on the one hand or the housing on the other hand, the more effectively the heat from the housing can be transferred to the at least one heat pipe and ultimately to the heat sink block. A design of the at least one heat pipe with at least one and preferably several changes of direction enables the contact area to be enlarged in such a way that the housing contact area and / or the heat sink contact area have a contact area with the heat sink and / or the housing that is as maximized as possible. For this purpose, the at least one heat pipe can have a meandering course in both sections with areas that are optionally aligned parallel to one another.Furthermore, spiral, zigzag, meander and other configurations of the course of the at least one heat pipe are also conceivable, which have the largest possible surface and thus the largest possible contact area.

[0031] It is preferably provided that the cooling system has at least two heat pipes, wherein the at least two heat pipes are each arranged with their heat sink contact area on two opposite sides of the at least one heat sink. The use of two or more heat pipes promotes cooling by separately transporting the heat away from the housing, in that an amount of heat can flow away from the housing via each heat pipe without the heat pipes being subjected to excessive strain. Because several heat pipes are arranged on or in the cooling block from different sides, the heat can be distributed evenly over the cooling block, whereby the cooling block only has a few areas with different temperatures and therefore even absorption and release of heat. This enables cooling to be as effective and rapid as possible.

[0032] It is also possible, and optionally provided according to the invention, for the housing contact region of the at least one heat pipe to be arranged parallel to the pressure chamber supply line and / or the pressure chamber discharge line. Such a parallel arrangement with the smallest possible distance between the lines and the at least one heat pipe can contribute significantly to more effective heat dissipation. The heat dissipated, in particular, by the pressure chamber discharge line to the surrounding housing can then be dissipated to the at least one heat pipe over the shortest possible distance. The smaller the distance and the greater the common parallel course, the more heat can be transferred.The at least one heat pipe can be arranged with its housing contact area completely or partially parallel to the lines, wherein the at least one heat pipe can also be arranged, for example, in a spiral shape around both or around one of the lines.

[0033] It is preferably provided that the housing contact region of the at least one heat pipe is arranged between the pressure chamber supply line and / or the pressure chamber discharge line and the pressure chamber. Most of the heat during operation of a pump is generated in or on the pressure chamber, which, together with the pressure chamber discharge line, regularly has the greatest amount of heat and thus the greatest loads. It can therefore be regarded as particularly advantageous if the housing contact region of the at least one heat pipe is as close as possible to these regions with a large contact surface. In one embodiment of the cooling system, the housing contact region of the at least one heat pipe can be arranged between the pressure chamber and the pressure chamber supply line and / or pressure chamber discharge line, wherein the heat sink contact region of the at least one heat pipe is arranged in the heat sink recesses of the heat sink.

[0034] In an advantageous embodiment of the invention, the pump is a diaphragm pump. The cooling system according to the invention can be used particularly advantageously with a diaphragm pump, thereby enabling the aforementioned advantages.

[0035] Further advantageous embodiments of the pump with a cooling system are explained using exemplary embodiments shown in the drawing. It shows:

[0036] Figure 1 shows an embodiment of a pump according to the invention with a cooling system for cooling a housing of the pump and with a horizontally arranged heat pipe,

[0037] Figure 2 shows an embodiment of the pump according to the invention with a vertical arrangement of the heat pipes,

[0038] Figure 3 shows an embodiment of the pump according to the invention with a radially formed heat pipe, Figure 4 shows an embodiment of the pump according to the invention with an arc-shaped housing contact area of ​​the heat pipe,

[0039] Figure 5 shows a design of a meandering housing contact area of ​​the heat pipe,

[0040] Figure 6 shows an embodiment of the pump, wherein several heat pipes are arranged on the heat sink from opposite sides,

[0041] Figure 7 shows a design variant of the housing contact area of ​​the heat pipe in a round recess,

[0042] Figure 8 shows a design variant of the housing contact area of ​​the heat pipe in a semicircular recess,

[0043] Figure 9 shows a design variant of the housing contact area of ​​the heat pipe in a rectangular recess,

[0044] Figure 10 shows an alternative design variant of the housing contact area of ​​the heat pipe in the rectangular recess,

[0045] Figure 11 shows an arrangement of the housing contact area in a

[0046] Pressure chamber housing area, Figure 12 shows an arrangement of the housing contact area in the pressure chamber housing area at a contact surface to a pressure chamber line area,

[0047] Figure 13 shows an arrangement of the housing contact area between the pressure chamber housing area and the pressure chamber line area,

[0048] Figure 14 shows an arrangement of the housing contact area in the pressure chamber line area at a contact surface to the pressure chamber housing area,

[0049] Figure 15 shows an embodiment of the housing contact area and a heat sink contact area of ​​the heat pipe, each with a contact plate arranged thereon,

[0050] Figure 16 shows an arrangement of the heat sink contact area in the pressure chamber line area at the contact surface to a heat sink,

[0051] Figure 17 shows an arrangement of the heat sink contact area between the pressure chamber line area and the heat sink,

[0052] Figure 18 shows an arrangement of the heat sink contact area in the heat sink at the contact surface of the pressure chamber line area,

[0053] Figure 19 shows an arrangement of the heat sink contact area in the pressure chamber line area, which is formed integrally with the heat sink, Figure 20 shows an arrangement of the heat sink contact area in the heat sink,

[0054] Figure 21 shows an embodiment of the heat sink contact area with a contact plate,

[0055] Figure 22 shows a further embodiment variant from Figure 20 with a heat sink,

[0056] Figure 23 shows a variant of Figure 20 with an air flow generating device,

[0057] Figure 24 shows a variant of the pump with the heat sink and the air flow generation device arranged thereon, and

[0058] Figure 25 shows a design variant of the heat sink contact area with a water cooling device.

[0059] Figure 1 shows an embodiment of a portion of a pump 1 according to the invention with a cooling system designed according to the invention. In the figure, to improve clarity, some components which are made of an opaque material such as metal are shown transparently. The pump 1 serves to convey a fluid through the pump 1, with only a small area of ​​a pressure chamber 2 through which the fluid is conveyed being shown. The cooling system carries the heat generated by the operation of the pump 1 away from the pump 1 and in this way cools the pump 1 and the fluid conveyed thereby. By cooling the pump 1 according to the invention and thus indirectly also the fluid conveyed thereby, a higher volume flow of the fluid can be conveyed at a constant operating temperature of the pump 1 with a comparable design of the pump 1.

[0060] The pump 1 has a housing 3 which delimits the pressure chamber 2 and has a pressure chamber inlet line 4 and a pressure chamber outlet line 5. In Figure 1 and in the following figures, only a part of the pressure chamber 2 is shown. The fluid to be pumped is introduced through an inlet opening into the pressure chamber 2 via the pressure chamber inlet line 4 which is connected to an inlet opening of the pressure chamber 2, where it is pressurized by a displacement device (not shown) and then flows out through an outlet opening into the pressure chamber outlet line 5. The housing 3 can be conceptually divided into two adjacent areas with different courses of the pressure chamber inlet line 4 and the pressure chamber outlet line 5.In a pressure chamber approach region 6, the pressure chamber supply line 4 and the pressure chamber outlet 5 run past the pressure chamber 2 in order to be able to be brought to the pressure chamber 2 in the most space-saving way possible and to enable free installation space as close as possible to the pressure chamber 2 for further components of the cooling system. In a pressure chamber opening region 7, the pressure chamber supply line 4 and the pressure chamber outlet 5 run essentially perpendicular to an adjacent surface of the pressure chamber 2 and open into the pressure chamber 2 at a distance from one another. Due to the essentially perpendicular course within the pressure chamber opening region 7, an undesirable

[0061] Heat absorption of the pressure chamber supply line 4 and the

[0062] Pressure chamber discharge 5 from the pressure chamber 2 heated during operation can be reduced.

[0063] Furthermore, a heat sink 8 is arranged on the housing 3 adjacent to the pressure chamber inlet area 6. The heat sink 8 has a heat sink block 9 in the form of a block with a high thermal conductivity that is connected to the housing 3 in a heat-transferring manner. On a side of the heat sink block 9 facing away from the housing 3, there is arranged a cooling fin arrangement 10 that is formed integrally with the heat sink block 9 and has a plurality of cooling fins 11 in the form of plates. The cooling fins 11 are arranged parallel to one another and at a right angle to the housing 3. When the pump 1 is in operation, most of the heat is often generated within the pressure chamber 2 and, due to the compression of the fluid to be pumped and the resulting heating, also in the pressure chamber discharge line 5. This heat is transferred via the housing 3 to the heat sink block 9 arranged on the housing 3 and finally to the individual cooling fins 11.By designing the cooling fins 11 as plates with the largest possible surface area and, at the same time, the smallest possible volume, an effective transfer of the heat from the cooling fins 11 to the ambient air surrounding the cooling fins can be achieved.

[0064] For more effective heat transfer between the housing 3 and the cooling fins 11, the cooling system has a plurality of heat pipes 12 with a housing contact region 13 and a heat sink contact region 14 arranged at a distance therefrom. The heat pipes 12 are designed as heat pipes 15. The heat pipes 15 are designed as tubes with a circular cross-sectional area, although other cross-sectional areas such as oval or flat shapes are also conceivable. A plurality of capillaries and a heat transfer fluid with a high thermal conductivity are arranged in the interior of the closed tubes. In the housing contact region 13, the heat transfer fluid, which is liquid there, is heated and partially changes into the gas phase.The gaseous heat transfer fluid spreads throughout the interior of the heat pipe 12 and condenses in the heat sink contact area 14, releasing its heat to the heat sink 8, and thus returns to its liquid state. The liquid heat transfer fluid is guided through the capillary from the heat sink contact area 14 back to the housing contact area 13.

[0065] The individual heat pipes 15 are arranged with the housing contact region 13 in recesses of the housing 3 in an area between the pressure chamber 2 and the pressure chamber supply line 4 or the pressure chamber outlet 5 and run parallel and at a right angle to the lines 4, 5. By arranging the housing contact region 13 near the pressure chamber supply and outlet lines 4, 5 and on the pressure chamber 2, the heat is absorbed by the heat pipes 15 directly at the point of generation and effectively dissipated. The heat sink contact region 14 of the heat pipes 15 is arranged in heat sink recesses of the heat sink 8 and runs parallel to a contact surface of the heat sink 8 with the housing 3 and parallel to the housing contact region 13 of the heat pipes 15. All four heat pipes 15 shown in Figure 1 continue to run parallel and spaced from one another and are identical in design.

[0066] The following illustrations show comparable configurations of pump 1 with the cooling system, each in a different configuration. Only the essential differences between the individual variants shown in the illustrations will be discussed below.

[0067] Figures 2 and 3 each show a different embodiment of the inventive arrangement of the heat pipes 15. In Figure 2, the heat pipes 15 are arranged as straight tubes at a right angle to a surface of the housing 3, wherein they are arranged with the housing contact region 13 in the housing 3. The heat sink 8 furthermore does not have a heat sink block 9, but rather the individual cooling fins 11 are realized as plates arranged in a stack-like manner at a distance from one another, which are each arranged parallel to the housing 3 and are connected to one another and to the housing 3 only by the individual heat pipes 15.

[0068] Figure 3, however, shows a radially extending variant of the heat pipe 15, wherein the heat pipe 15 is arranged radially extending within the housing contact area 13 in the pressure chamber mouth area 7. In this way, the heat generated at the pressure chamber 2 and at the outlet opening can be dissipated particularly well. Furthermore, the cooling fins 11 are formed integrally on the housing 3. Figures 4 and 5 each show, in addition to the straight

[0069] Design of the housing contact area 13 from Figures 1 or 2 alternative designs of this housing contact area 13 or of the course of the heat pipes 15 in this housing contact area 13 in the form of an arc or with a meandering shape.

[0070] Figure 6 shows an alternative embodiment of the heat pipe 15 from Figure 1, wherein several heat pipes 15 are in contact with the cooling fins 8 from two opposite sides and penetrate them.

[0071] The following Figures 7 to 10 each show different design options for the arrangement of the heat pipes 15 in differently designed recesses in the housing 3. While the recess in Figure 7 and Figures 9 and 10 is adapted to the design of the heat pipes 15 with a round or a rectangular cross-section and the heat pipes 15 each lie flush in the recesses 16, Figure 8 shows a further design option, wherein the pressure chamber mouth region 7 and the adjacent pressure chamber introduction region 6 of the housing 3 are manufactured separately from one another and the heat pipe 15 designed with a round cross-section is arranged in a semicircular recess 16 within the pressure chamber mouth region 7.

[0072] Figures 11 to 15 each show different embodiments of the arrangement of the housing contact region 13 in the housing 3. Figure 11 shows an arrangement of the housing contact region 13 in the pressure chamber mouth region 7 parallel to the pressure chamber supply and discharge lines 4, 5, while Figure 12 shows an arrangement in the pressure chamber mouth region 7 at a contact surface to the pressure chamber introduction region 6. Figure 13 shows the arrangement of the housing contact region 13 between the pressure chamber introduction region 6 and the pressure chamber mouth region 7, and Figure 14 shows an arrangement in the pressure chamber introduction region 6 at the contact surface to the pressure chamber mouth region 7. Figure 15 shows a design variant in which the housing contact region 13 of the heat pipe 15 is connected to a contact plate 17. In addition, the heat sink contact region 14 also has a contact plate 17 connected thereto.The large surface of such a contact plate 17 enables effective heat transfer between the housing 3 and the heat pipe 15 or between the heat pipe 15 and the ambient air.

[0073] Figures 16 to 21 show different configurations of the arrangement of the heat sink contact area

[0074] 14 . The heat sink contact area 14 of the heat pipes

[0075] 15 is arranged completely within the pressure chamber introduction region 6 on a contact surface to the heat sink 8 in the variant according to Figure 16, while the heat sink contact region 14 is arranged between the pressure chamber introduction region 6 and the heat sink 8 in the variant shown in Figure 17. Figure 18 shows the arrangement of the heat sink contact region 14 in the heat sink 8 in a heat sink recess close to the contact surface to the pressure chamber introduction region 6. In Figure 19, the cooling fins 11 of the heat sink 8 are designed in one piece with the housing 3, the heat sink contact regions 14 being arranged in recesses in the cooling fins 11. Figure 20 also shows the arrangement of the heat sink contact areas 14 of the heat pipes 15 in the cooling fins 11, wherein in this embodiment the cooling fins 11 and the heat sink block 9 are arranged on the housing 3.Figure 21 shows a design variant in which the heat sink contact area 14 of the heat pipe 15 is connected to a contact plate 17.

[0076] Figures 22 to 25 also show various further design options for the pump 1 with the cooling system in order to further increase the cooling performance. Figure 22 shows the design variant from Figure 21, wherein the heat sink 8 is arranged on the contact plate 17. Figure 23 shows a further design option from Figure 21, in which an air flow generation device 18 in the form of a fan is arranged on the contact plate 17. With the aid of the fan, an air flow can be generated which is directed onto the contact plate 17 for additional cooling. Figure 24 shows a design in which the air flow generation device 18 is arranged on the heat sink 8, wherein the cooling fins 11 are cooled via the generated air flow. Figure 25 shows a water cooling device 19 in the form of a water cooling system, which is designed to cool the heat sink contact area 14 of the heat pipe 15. LIST OF REFERENCE SYMBOLS

[0077] 1 pump

[0078] 2 pressure chambers

[0079] 3 housings

[0080] 4 Pressure chamber supply line

[0081] 5 Pressure chamber discharge

[0082] 6 Pressure chamber approach area

[0083] 7 Pressure chamber mouth area

[0084] 8 heat sinks

[0085] 9 Heatsink block

[0086] 10 cooling fin arrangement

[0087] 11 cooling fins

[0088] 12 heat pipes

[0089] 13 Housing contact area

[0090] 14 Heatsink contact area

[0091] 15 heat pipes

[0092] 16 Heatpipe recess

[0093] 17 Contact plate

[0094] 18 Air flow generation device

[0095] 19 Water cooling device

Claims

P A T E N T A N S P R Ü C H E 1. Pump (1) with a housing (3) which defines a pressure chamber (2), wherein the pump (1) has a pressure chamber inlet (4) and a pressure chamber outlet (5) which each open into the pressure chamber (2), wherein a fluid flowing into the pressure chamber (2) via the pressure chamber inlet (4) can be pressurized and expelled from the pressure chamber (2) via the pressure chamber outlet (5) by means of a displacement device arranged displaceably in the pressure chamber (2), and with a cooling system for cooling the housing (2) of the pump (1), characterized in that the cooling system has at least one heat pipe (12) containing a heat transfer fluid and at least one cooling element (8),wherein the at least one heat pipe (12) has a housing contact area (13) for thermally conductive contact of the heat pipe (12) with the housing (2) and a heat sink contact area (14) arranged at a distance therefrom for thermally conductive contact of the heat pipe (12) with the at least one heat sink (8), wherein the heat from the housing (2) is transferred from the housing (2) to the at least one heat sink (8) via the at least one heat pipe (12) during intended use of the cooling system.

2. Pump (1) according to claim 1, characterized in that the at least one heat sink (8) has a heat sink block (9) and a cooling fin arrangement (10) with several cooling fins (11) arranged at intervals from each other, which is thermally connected to the heat sink block (9), wherein the heat absorbed by the heat sink block (9) is transferred to the ambient air via the cooling fins (11).

3. Pump (1) according to claim 1 or 2, characterized in that an airflow generation device (18) is arranged on the at least one cooling element (8), wherein the airflow generation device (81) generates an airflow for additional cooling of the cooling fins. (11) can be produced.

4. Pump (1) according to one of the preceding claims, characterized in that the cooling system has a water cooling device (19) for cooling the heat sink contact area (13) of the at least one heat pipe (12).

5. Pump (1) according to one of the preceding claims, characterized in that the at least one heat pipe (12) is arranged with the heat sink contact area (14) in heat sink recesses of the heat sink block (9) and is thermally connected to the heat sink block (9).

6. Pump (1) according to one of the preceding claims, characterized in that the heat sink contact area (14) of the at least one heat pipe (12) is thermally connected to a contact plate (17), wherein the contact plate (7) has a high thermal conductivity of higher than 200 W / mK and in particular higher than 300 W / mK, and wherein the contact plate (17) can be cooled by the airflow generating device (18) or is connected to the at least one heat sink (8).

7. Pump (1) according to one of the preceding claims, characterized in that the cooling fins (11) are arranged parallel to a surface of the housing (3).

8. Pump (1) according to one of the preceding claims, characterized in that the cooling fins (11) are arranged at an angle to the surface of the housing (3).

9. Pump (1) according to one of the preceding claims, characterized in that the pressure chamber inlet (4) and / or the pressure chamber outlet (5) run parallel to the cooling block (9) as far as possible over a large area and / or are partially embedded in it.

10. Pump (1) according to one of the preceding claims, characterized in that the pressure chamber inlet (4) and / or the pressure chamber outlet (5) runs parallel to the pressure chamber (2).

11. Pump (1) according to one of the preceding claims, characterized in that the course of the at least one heat pipe (12) has at least one change of direction, so that the at least one heat pipe (12) has the longest possible contact area between the at least one heat pipe (12) and the heat sink block (9) and / or between the at least one heat pipe (12) and the housing (3).

12. Pump (1) according to one of the preceding claims, characterized in that the cooling system has at least two heat pipes (12), wherein the at least two heat pipes (12) each have their heat sink contact area (14) are arranged on at least one heat sink (8) on two opposite sides.

13. Pump (1) according to any one of the preceding claims, characterized in that the housing contact area (13) of the at least one heat pipe (12) is arranged parallel to the pressure chamber inlet (4) and / or the pressure chamber outlet (5).

14. Pump according to any one of the preceding claims, characterized in that the housing contact area (13) of the at least one heat pipe (12) is arranged between the pressure chamber inlet (4) and / or the pressure chamber outlet (5) and the pressure chamber (2).

15. Pump (1) according to one of the preceding claims, characterized in that the pump (1) is a diaphragm pump.

Citation Information

Patent Citations

  • Active reinforced cooling device suitable for air conditioner compressor shell

    CN105180305A