Method for producing a sensor module, and sensor module

Abstract

The invention relates to a method for producing a sensor module (1) consisting at least of a sensor head (6), a metal cover (3), a plug module (4) and a plug element (2), the method comprising the following steps: - providing (S1) the plug element (2) and the metal cover (3); - placing (S2) the plug element (2) onto the metal cover (3), at least a portion of the plug element (2) comprising, on a side (2a) facing the metal cover (3), a meltable material (5), and at least a portion of the metal cover (3) comprising, on the side (3a) facing the plug element (2), a surface (F) onto which the meltable material (5) of the plug element (2) is applied; - heating the metal cover (3) on a side (3b) facing away from the plug element (2), the meltable material (5) melting as a result of the heating; - producing (S4) a connection between the plug element (2) and the metal cover (3) at least in the surface (F) provided on the metal cover (3) by means of the meltable material (5); - fastening (S5) the sensor head (6) to the metal cover (3).

Description

[0001] “Method for producing a sensor module and sensor module”

[0002] Description

[0003] The invention relates to a method for producing a sensor module and a sensor module produced by this method.

[0004] As development progresses from semi-autonomous to fully autonomous vehicles, the number of sensor modules required in vehicles is constantly increasing. Furthermore, the specifications and functions of the modules are constantly evolving. Many sensors are mounted on the exterior and therefore need to be waterproof and resistant to dirt / dust and chemicals. Furthermore, the performance required for autonomous driving is increasing.

[0005] For example, it is known from the prior art to seal the gap between the connector and the metal plate with an adhesive or potting material. It is also known to seal the gap with an O-ring or similar seal and to attach the connector to the metal plate by screwing or a similar fastening process. Another known variant would be to overmold the connector onto the metal plate using an injection molding process.

[0006] The problem with these approaches is that the potting process, for example, is a very complex one, and there are numerous influencing factors that must be considered to consistently achieve a good result, such as contamination on the material, etc. Furthermore, sealing with an O-ring or similar seal can amplify the sensor's pumping mechanism. Moisture in the sensor leads to a decrease in performance.

[0007] Therefore, it is an object of the invention to provide a method by means of which a sensor module can be produced cost-effectively which has a high degree of robustness and water resistance.

[0008] This object is achieved by the subject matter of claims 1 and 4. Further advantageous embodiments and embodiments are the subject matter of the subclaims.

[0009] Initial considerations were that the integration and sealing of the plastic connector into a sensor represent fundamental process steps. Therefore, these steps in particular needed to be improved and optimized, also with regard to cost.

[0010] According to the invention, a method for producing a sensor module comprising at least a sensor head, a metal cover, a connector module and a connector element is therefore proposed, comprising the following steps:

[0011] Providing the connector element and the metal cover;

[0012] - Applying the plug element to the metal cover, wherein the plug element has a meltable material on at least one partial area on a side facing the metal cover and wherein the metal cover has, on the side facing the plug element, at least in one partial area, a surface to which the meltable material of the plug element is applied;

[0013] Heating the metal cover on a side facing away from the plug element, whereby the heating melts the fusible material;

[0014] Creating a connection between the plug element and the metal cover at least in the area provided on the metal cover by the fusible material;

[0015] Attaching the sensor head to the metal cover.

[0016] The connector element is designed, for example, as a plastic housing for the connector module. The connector element is designed such that the connector module can be inserted into the connector element.

[0017] In the proposed method, the plug element is pressed onto the metal cover, whereby the meltable material is located directly above the surface of the metal cover and the material and the surface of the metal cover have an essentially identical geometry.

[0018] Meanwhile, the metal cover is heated on the side facing away from the connector element to melt the meltable material. After melting, the meltable material flows onto the designated area, thus creating a bond between the metal cover and the connector element.

[0019] The connector module can have all common connector interfaces that are relevant for the automotive sector.

[0020] In a preferred embodiment, a structure is provided on the surface of the metal cover to create the connection, into which the molten, fusible material flows. This structure is particularly advantageous because such a structure has, for example, grooves or generally recesses into which the liquid material can flow. This advantageously creates a more robust connection between the plug element and the metal cover.

[0021] Preferably, the metal cover is heated using a laser, hot plate, or induction heating. These methods represent a preferred option for enabling particularly uniform and rapid heating of the metal cover.

[0022] Furthermore, the invention proposes a sensor module comprising at least one sensor head, a metal cover, a plug module and a plug element, wherein the plug element has a meltable material on a side facing the metal cover, at least in a partial area, wherein the metal cover has a surface on a side facing the plug element, at least in a partial area, to which the meltable material is applied, wherein the plug element and the metal plate each have a central recess into which the plug module can be inserted, wherein by heating the metal cover, a connection is created between the plug element and the metal plate by melting the meltable material on the surface of the metal cover. The plug element is designed, for example, as a plastic housing for the plug module.The plug element is designed in such a way that the plug module can be inserted into the plug element.

[0023] In the proposed method, the connector element is pressed onto the metal cover, with the meltable material positioned directly above the surface of the metal cover, and the material and the surface of the metal cover having essentially the same geometry. Meanwhile, the metal cover is heated on the side facing away from the connector element to melt the meltable material. After melting, the meltable material flows onto the designated surface, thus creating a connection between the metal cover and the connector element.

[0024] The metal cover is made of the aluminum alloy AL99.5, for example. However, other materials are also conceivable.

[0025] The connector module can have all common connector interfaces that are relevant for the automotive sector.

[0026] In a particularly preferred embodiment, the surface of the metal cover has a structure designed such that the meltable material flows into this structure to create a connection between the metal cover and the plug element. This structure is particularly advantageous because such a structure has, for example, grooves or generally recesses into which the liquid material can flow. This advantageously creates a more robust connection between the plug element and the metal cover.

[0027] Particularly preferably, the structure of the surface of the metal cover is created by laser, punching, or milling. These methods are preferred material processing techniques, by which the structure of the metal cover can be particularly easily created in a predefined area. Other metal processing methods by which a structure can be created are also conceivable.

[0028] In a further preferred embodiment, the surface is arranged in a ring around the recess for the connector module. This is advantageous because it allows the size of the required sealing surface to be reduced to the bare minimum, which in turn influences the required amount of meltable material.

[0029] Furthermore, the meltable material is particularly preferably arranged in a ring around the recess for the plug module on the plug element. An annular arrangement is advantageous because it allows the amount of meltable material to be reduced while still ensuring adequate sealing.

[0030] Other geometries of the surface and the meltable material would also be conceivable, but when changing the geometries it must be ensured that the two geometries essentially match.

[0031] When connecting the metal plate to the connector element, the connector module is preferably arranged on the metal plate or in the connector element. Accordingly, the connector module can already be integrated into the connector element prior to the connection step or can be arranged in the recess of the metal plate. There are no differences in the creation of the connection, which is why these variants are possible alternatively without further adaptation.

[0032] The meltable material is preferably a plastic. In principle, any plastic with a lower melting point than the connector element itself can be used.

[0033] Further advantageous embodiments are the subject of the drawings. # Therein: Fig. 1: a schematic flow diagram of a method according to an embodiment of the invention;

[0034] Fig. 2a: a schematic representation of a plug element according to an embodiment of the invention;

[0035] Fig. 2b: a further schematic representation of a plug element according to a further embodiment of the invention;

[0036] Fig. 3a: a schematic representation of a metal cover according to an embodiment of the invention;

[0037] Fig. 3b: a further schematic representation of a metal cover according to a further embodiment of the invention;

[0038] Fig. 4: a schematic representation of a plug element in connection with a metal cover according to an embodiment of the invention;

[0039] Fig. 5: a schematic representation of a sensor module according to an embodiment of the invention.

[0040] Figure 1 shows a schematic flow diagram of a method according to an embodiment of the invention. In step S1, the plug element 2 and the metal cover 3 are provided. In step S2, the plug element 2 is applied to the metal cover 3, wherein the plug element 2 has a meltable material 5 on at least one partial area of ​​a side 2a facing the metal cover 3, and wherein the metal cover 3 has, on the side 3a facing the plug element 2, at least in one partial area, a surface F to which the meltable material 5 of the plug element 2 is applied. In step S3, the metal cover 3 is heated on a side 3b facing away from the plug element, wherein the meltable material 5 melts as a result of the heating. In step S4, a connection between the plug element 2 and the metal cover 3 is created by the meltable material 5, at least in the surface F provided on the metal cover.In step S5, the sensor head 6 is attached to the metal cover 3.

[0041] Figures 2a and 2b each show a schematic representation of a plug element according to an embodiment of the invention. The plug element 2 of Figure 2a has a meltable material 5 on the side 2a facing the metal cover. Furthermore, in the embodiment according to Figure 2a, the plug module 4 is already integrated into the plug element 2. The representation of Figure 2b essentially corresponds to Figure 2a, although in Figure 2b the plug module 4 is not arranged in the plug element 2, but rather only the recess A2 is present.

[0042] Figures 3a and 3b each show a schematic representation of a metal cover according to an embodiment of the invention. In the representation in Figure 3a, the metal cover 3 has a surface F on the side 3a facing the plug element, to which the fusible material 5 of the plug element 2 is applied. This surface F can have structures for improved durability of the connection. In the center of the metal cover 3, a recess A3 is shown, into which a plug module 4 can be inserted. The representation in Figure 3b essentially corresponds to Figure 3a, wherein in Figure 3b the sensor module 4 is arranged in the recess A3 of the metal cover 3.

[0043] Figure 4 shows a schematic representation of a connector element in conjunction with a metal cover according to one embodiment of the invention. Here, the connector element 2 is applied to the metal cover 3 with pressure P. In this illustration, the meltable material 5 is visible between the connector element 2 and the metal cover 3. The metal cover 3 is heated to a high temperature T on the side 3b facing away from the connector element 2 in order to melt the meltable material 5.

[0044] Figure 5 shows a schematic representation of a sensor module according to an embodiment of the invention. The sensor module 1 comprises a plug element 2 with meltable material 5, a metal cover 3, wherein the metal cover 3 has a surface F onto which the meltable

[0045] Material 5 is applied. Furthermore, in this embodiment, the

[0046] Connector module 4 is arranged in the metal cover 3. As previously shown, the connector module 4 can also be arranged in the connector element 2 before the connector element 2 is connected to the metal cover 3. Furthermore, a sensor head 6 is provided for the sensor module 1, which is connected to the metal cover 3.

[0047] List of reference symbols

[0048] 1 sensor module

[0049] 2 Plug element 2a side facing the metal cover

[0050] 3 metal cover

[0051] 3a side facing the plug element

[0052] 3b side facing away from the plug element

[0053] 4 connector module 5 meltable material

[0054] 6 Sensor head

[0055] A2 recess plug element

[0056] A3 cutout metal cover

[0057] F Area P Pressure

[0058] S1-S5 process steps

[0059] T Temperature

Claims

Patent claims Method for producing a sensor module (1) comprising at least a sensor head (6), a metal cover (3), a plug module (4) and a plug element (2) with the following steps: Providing (S1) the plug element (2) and the metal cover (3); - applying (S2) the plug element (2) to the metal cover (3), wherein the plug element (2) has a meltable material (5) on at least one partial area on a side (2a) facing the metal cover (3), and wherein the metal cover (3) has, on the side (3a) facing the plug element (2), at least in one partial area, a surface (F) to which the meltable material (5) of the plug element (2) is applied; Heating the metal cover (3) on a side (3b) facing away from the plug element (2), the meltable material (5) melting as a result of the heating; Creating (S4) a connection between the plug element (2) and the metal cover (3) at least in the area (F) provided on the metal cover (3) by means of the meltable material (5); Fastening (S5) the sensor head (6) to the metal cover (3). Method according to claim 1, characterized in that, to create the connection on the surface (F) of the metal cover (3), a structure is provided into which the molten fusible material (5) flows. Method according to claim 1, characterized in that the heating of the metal cover (3) is carried out by means of a laser, a heating plate, or inductively. Sensor module (1) comprising at least one sensor head (6), a metal cover (3), a plug module (4), and a plug element (2), wherein the plug element (2) has a fusible material (5) on a side (2a) facing the metal cover (3) at least in a partial area, wherein the metal cover (3) on a side (3a) facing the plug element (2) at least in a partial region has a surface (F) to which the meltable material (5) is applied, wherein the plug element (2) and the metal plate (3) each have a central recess (A2, A3) into which the plug module (4) can be inserted, wherein by heating the metal cover (3) a connection between the plug element (2) and the metal plate (3) is created by melting the meltable material (5) on the surface of the metal cover (3). Sensor module (1) according to claim 4, characterized in that the surface (F) of the metal cover (3) has a structure which is designed such that the meltable material (5) flows into this structure in order to create a connection between the metal cover (3) and the plug element (2). Sensor module (1) according to claim 5, characterized in that the structure of the surface (F) of the metal cover (3) is created by means of a laser, by punching or milling.Sensor module (1) according to claim 5 or 6, characterized in that the surface (F) is arranged in a ring shape around the recess (A3) for the plug module (4). Sensor module (1) according to claim 4, characterized in that the fusible material (5) is arranged in a ring shape around the recess (A2) for the plug module (4) on the plug element (2). Sensor module (1) according to one of claims 4 to 8, characterized in that the plug module (4) is arranged on the metal cover (3) or in the plug element (2) when the metal cover (3) is connected to the plug element (2). Sensor module (1) according to claim 4,. characterized in that the meltable material (5) is a plastic.

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