Targeted temperature management thermal contact pad with data chip
Patent Information
- Application Number
- EP2022821787
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2022-11-18
- Publication Date
- 2025-09-03
AI Technical Summary
Targeted temperature management (TTM) systems face challenges in managing the volume of TTM fluid within the TTM control module, leading to issues of underfill and overfill conditions due to the large volume of fluid in thermal contact pads, which can result in fluid spillage and inefficient thermoregulation during medical procedures.
A TTM system with a thermal pad equipped with a memory chip that communicates with a console to monitor and manage the fluid compartment's state, automatically adjusting the fluid volume by supplying or draining TTM fluid to maintain optimal levels, preventing underfill and overfill conditions through notifications and valve activations.
Ensures accurate and efficient thermal energy transfer by maintaining the fluid compartment's state, preventing fluid spillage and ensuring continuous operation of TTM systems during medical procedures, thereby enhancing the effectiveness of temperature management therapies.
Smart Images
Figure 1.1
Abstract
Description
TARGETED TEMPERATURE MANAGEMENT THERMAL CONTACT PADWITH DATA CHIPBACKGROUND
[0001] The effect of temperature on the human body has been well documented and the use of targeted temperature management (TTM) systems for selectively cooling and / or heating bodily tissue is known. Elevated temperatures, or hyperthermia, may be harmful to the brain under normal conditions, and even more importantly, during periods of physical stress, such as illness or surgery. Conversely, lower body temperatures, or mild hypothermia, may offer some degree of neuroprotection. Moderate to severe hypothermia tends to be more detrimental to the body, particularly the cardiovascular system.
[0002] Targeted temperature management can be viewed in two different aspects. The first aspect of temperature management includes treating abnormal body temperatures, i.e., cooling the body under conditions of hyperthermia or warming the body under conditions of hypothermia. The second aspect of thermoregulation is an evolving treatment that employs techniques that physically control a patient’s temperature to provide a physiological benefit, such as cooling a stroke patient to gain some degree of neuroprotection. By way of example, TTM systems may be utilized in early stroke therapy to reduce neurological damage incurred by stroke and head trauma patients. Additional applications include selective patient heating / cooling during surgical procedures such as cardiopulmonary bypass operations.
[0003] TTM systems circulate a fluid (e.g. water) through one or more thermal contact pads coupled to a patient to affect surface-to-surface thermal energy exchange with the patient. In general, TTM systems comprise a TTM fluid control module coupled to at least one contact pad via a fluid deliver line. One such TTM system is disclosed in U.S. Pat. No. 6,645,232, titled “Patient Temperature Control System with Fluid Pressure Maintenance” filed October 11, 2001, and one such thermal contact pad and related system is disclosed in U.S. Pat. No. 6,197,045 titled “Cooling / heating Pad and System” filed January 4, 1999, both of which are incorporated herein by reference in their entireties. As noted in the ‘045 patent, the ability to establish and maintain intimate pad-to-patient contact is of importance to fully realizing medical efficacies with TTM systems.
[0004] Coupling and decoupling the contact pads to and from the TTM fluid control module can in some instances result in spilling of TTM fluid and a state of underfill of theTTM fluid within the TTM fluid control module because the contact pads may contain a relatively large volume of TTM fluid during use. In some instances, supplying TTM fluid to the contact pads from the TTM module may cause underfill condition of a TTM fluid container within the TTM control module. Similarly, in some instances, purging TTM fluid from the contact pads into the TTM module may cause overfill condition of a TTM fluid container within he TTM control module.
[0005] Disclosed herein are embodiments of system, devices, and methods for the managing the volume of TTM fluid within a TTM control module.SUMMARY OF THE INVENTION
[0006] Briefly summarized, disclosed herein is a targeted temperature management (TTM) system that, according to some embodiments, includes a TTM module configured to provide a TTM fluid to a thermal pad. The TTM module includes a console having a processor and memory, including a non-transitory computer-readable medium, having logic stored thereon that, when executed by the processor performs operations of the system. The system further includes the thermal pad having a fluid compartment configured to receive the TTM fluid from the TTM module to facilitate thermal energy transfer between the TTM fluid and a patient. The TTM module is configured to (i) deliver TTM fluid to the thermal pad to transition the fluid compartment from an empty state to a full state, and (ii) extract TTM fluid from the thermal pad to transition the fluid compartment from the full state to the empty state. The thermal pad includes a memory chip having stored thereon pad data including a status of the fluid compartment, where the memory chip is communicatively coupled with the console, and the operations include exchanging pad data with the memory chip.
[0007] In some embodiments, the status of the fluid compartment includes at least one of the empty state or the full state and in some embodiments, the operations include receiving the status of the fluid compartment from the memory chip.
[0008] In some embodiments, the operations include transmitting at least a portion of the pad data to the memory chip.
[0009] In some embodiments, the pad data include a fluid capacity of the fluid compartment.
[0010] In some embodiments, the operations further include (i) receiving an empty state status from the memory chip of the thermal pad, (ii) determining a volume of TTM fluidwithin a module container, and (iii) comparing the volume of TTM fluid within the module container with an initial module container volume stored in the memory. As a result of the comparison, the operations include at least one of (i) providing a notification to the clinician to add TTM fluid to the module container or (ii) activating a supply valve to TTM fluid to the module container when the volume of TTM fluid within the module container is less than the initial module container volume, and the operations include supplying TTM fluid to the thermal pad.
[0011] In some embodiments, the operations further include (i) receiving a full state status from the memory chip of the thermal pad, (ii) determining a volume of TTM fluid within the module container, and (iii) comparing the volume of TTM fluid within the module container with a module container high volume limit stored in the memory. As a result of the comparison, the operations further include at least one of (i) providing a notification to the clinician to remove TTM fluid from the module container or (ii) activating a drain valve to drain TTM fluid from the module container when the volume of TTM fluid within the module container exceeds the module container high volume limit, and the operations further include purging TTM fluid from the thermal pad.
[0012] In some embodiments, the pad data include a fluid capacity of the fluid compartment.
[0013] In some embodiments, the operations include (i) receiving an empty state status from the memory chip of the thermal pad, (ii) receiving the fluid compartment capacity from the memory chip of the thermal pad, (iii) determining a volume of TTM fluid within the module container, (iv) defining a minimum predicted volume of TTM fluid within the module container based on the fluid compartment capacity and the volume of TTM fluid within the module container, and (v) comparing the minimum predicted volume of TTM fluid volume with a module container low volume limit stored in the memory. As a result of the comparison, the operations include at least one of (i) providing a notification to the clinician to add water to the module container or (ii) activating a supply valve to supply TTM fluid to the module container when the minimum predicted volume is less than the module container low volume limit, and the operations include supplying TTM fluid to the thermal pad.
[0014] In some embodiments, the operations further include (i) receiving a full state status from the memory chip of the thermal pad, (ii) receiving the fluid compartment capacityfrom the memory chip of the thermal pad, (iii) determining a volume of TTM fluid within the module container, (iv) define a maximum predicted volume of TTM fluid within the module container based on the fluid compartment capacity and the volume of TTM fluid within the module container, and (v) comparing the maximum predicted volume with a module container high volume limit stored in the memory. As a result of the comparison, the operations further include at least one of (i) providing a notification to the clinician to remove TTM fluid from the module container or (ii) activating a drain valve to drain TTM fluid from the module container when the maximum predicted volume exceeds the module container high volume limit, and the operations further include purging TTM fluid from the thermal pad.
[0015] In some embodiments, the operations include transitioning the status of the fluid compartment from the empty state to the full state, and in some embodiments, the operations include transitioning the status of the fluid compartment from the full state and to the empty state.
[0016] In some embodiments, the pad data include identification information including one or more of a type of thermal pad, a model number, a size, or a serial number.
[0017] Also disclosed herein is a thermal pad configured for placement on a patient that, according to some embodiments, includes fluid compartment configured to receive a TTM fluid from a TTM module to facilitate thermal energy transfer between the TTM fluid and a patient and a memory chip attached to the thermal pad, where the memory chip is configured to wirelessly exchange pad data with a console of the TTM module.
[0018] In some embodiments of the pad, the pad data include a status of the fluid compartment, where the status includes one of an empty state or a full state.
[0019] In some embodiments of the pad, the status of the fluid compartment is changeable by logic of the console between the empty state and the full state.
[0020] In some embodiments of the pad, the pad data include a fluid capacity of the fluid compartment.
[0021] In some embodiments of the pad, the pad data include identification information including one or more of a type of thermal pad, a model number, a size, or a serial number.
[0022] Also disclosed herein is a targeted temperature management (TTM) system method that, according to some embodiments, includes (i) receiving by a module of a TTM system thermal pad data from a memory chip attached to a thermal pad of the TTM system and (ii) altering a volume of a TTM fluid disposed within a module container of the TTM system based on the pad data.
[0023] In some embodiments of the method, the thermal pad is fluidly coupled with the module.
[0024] In some embodiments of the method, the pad data include one of an empty state status or a full state status of a fluid compartment of the thermal pad.
[0025] In some embodiments, the method further includes (i) transporting the TTM fluid from the module container to the thermal pad and (ii) adding TTM fluid to the module container.
[0026] In some embodiments of the method, the adding TTM fluid to the module container occurs prior to and / or simultaneously with the transporting TTM fluid from the module container to the thermal pad.
[0027] In some embodiments of the method, the adding TTM fluid to the module container is based on receiving the thermal pad data, where the thermal pad data include the empty state status.
[0028] In some embodiments the method further includes transitioning the pad data stored on the memory chip from the empty state status to the full state status in accordance with transporting TTM fluid from the module container to the thermal pad.
[0029] In some embodiments of the method, the pad data include a fluid capacity of the fluid compartment and the adding TTM fluid to the module container includes adding an additional volume of TTM fluid based on the fluid capacity of the fluid compartment.
[0030] In some embodiments, the method further includes (i) purging TTM fluid from the thermal pad to the module container and (ii) removing TTM fluid from the module container.
[0031] In some embodiments, the method further includes transitioning the pad data stored on the memory chip from the full state status to the empty state status in accordance with the purging TTM fluid from the module container to the module container.
[0032] In some embodiments of the method, removing TTM fluid from the module container occurs prior to and / or simultaneously with the purging TTM fluid from the thermal pad to the module container.
[0033] In some embodiments of the method, the removing TTM fluid from the module container is based on receiving the thermal pad data, where the thermal pad data include the full state status.
[0034] In some embodiments of the method, the pad data include the fluid capacity of the fluid compartment and removing TTM fluid from the module container includes removing an excess volume of TTM fluid based on the fluid capacity of the fluid compartment.
[0035] These and other features of the concepts provided herein will become more apparent to those of skill in the art in view of the accompanying drawings and the following description, which describe particular embodiments of such concepts in greater detail.BRIEF DESCRIPTION OF DRAWINGS
[0036] A more particular description of the present disclosure will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. Example embodiments of the invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:
[0037] FIG. 1A illustrates a patient and a targeted temperature management (TTM) system for cooling or warming the patient, in accordance with some embodiments;
[0038] FIG. IB illustrates a plan view of a thermal pad of TTM system of FIG 1A, in accordance with some embodiments;
[0039] FIG. 2 illustrates a hydraulic schematic of the TTM system of FIG. 1A, in accordance with some embodiments;
[0040] FIG. 3 illustrates a block diagram depicting various elements of a console of theTTM module of FIG. 1A, in accordance with some embodiments; and
[0041] FIG. 4 illustrates a flow chart of a method of the system of FIG.1A, in accordance with some embodiments.DETAILED DESCRIPTION
[0042] Before some particular embodiments are disclosed in greater detail, it should be understood that the particular embodiments disclosed herein do not limit the scope of the concepts provided herein. It should also be understood that a particular embodiment disclosed herein can have features that can be readily separated from the particular embodiment and optionally combined with or substituted for features of any of a number of other embodiments disclosed herein.
[0043] Regarding terms used herein, it should also be understood the terms are for the purpose of describing some particular embodiments, and the terms do not limit the scope of the concepts provided herein. Ordinal numbers (e.g., first, second, third, etc.) are generally used to distinguish or identify different features or steps in a group of features or steps, and do not supply a serial or numerical limitation. For example, “first,” “second,” and “third” features or steps need not necessarily appear in that order, and the particular embodiments including such features or steps need not necessarily be limited to the three features or steps. Labels such as “left,” “right,” “top,” “bottom,” “front,” “back,” and the like are used for convenience and are not intended to imply, for example, any particular fixed location, orientation, or direction. Instead, such labels are used to reflect, for example, relative location, orientation, or directions. Singular forms of “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise. The words “including,” “has,” and “having,” as used herein, including the claims, shall have the same meaning as the word “comprising.” Furthermore, the terms “or” and “and / or” as used herein are to be interpreted as inclusive or meaning any one or any combination. As an example, “A, B or C” or “A, B and / or C” mean “any of the following: A; B; C; A and B; A and C; B and C; A, B and C.” An exception to this definition will occur only when a combination of elements, components, functions, steps or acts are in some way inherently mutually exclusive.
[0044] The phrases “connected to” and “coupled to” refer to any form of interaction between two or more entities, including mechanical, electrical, magnetic, electromagnetic,fluid, signal, communicative (including wireless), and thermal interaction. Two components may be connected or coupled to each other even though they are not in direct contact with each other. For example, two components may be coupled to each other through an intermediate component.
[0045] Any methods disclosed herein comprise one or more steps or actions for performing the described method. The method steps and / or actions may be interchanged with one another. In other words, unless a specific order of steps or actions is required for proper operation of the embodiment, the order and / or use of specific steps and / or actions may be modified.
[0046] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art.
[0047] FIG. 1A illustrates a targeted temperature management (TTM) system 100 connected to a patient 50 for administering targeted temperature management therapy to the patient 50 which may include a cooling and / or warming of the patient 50, in accordance with some embodiments. The TTM system 100 comprises a TTM module 110 including a graphical user interface (GUI) 115 enclosed within a module housing 111. The TTM system 100 includes a fluid deliver line (FDL) 130 extending from the TTM module 110 to a thermal contact pad (pad) 120 to provide for flow of TTM fluid 112 between the TTM module 110 and the pad 120.
[0048] The TTM system 100 may include 1, 2, 3, 4 or more pads 120 and the TTM system 100 may include 1, 2, 3, 4 or more fluid delivery lines 130. In use, the TTM module 110 prepares the TTM fluid 112 for delivery to the pad 120 by heating or cooling the TTM fluid 112 to a defined temperature in accordance with a prescribed TTM therapy. The TTM module 110 circulates the TTM fluid 112 within a fluid compartment 121 of the pad 120 to facilitate thermal energy exchange with the patient 50. During the TTM therapy, the TTM module 110 may continually control the temperature of the TTM fluid 112 toward a target TTM temperature. In some instances, the target TTM temperature may change during the TTM therapy.
[0049] In some instances, the pad 120 may be empty of TTM fluid 112, such as when the pad 120 is initially connected to the TTM module 110, for example. As such, the TTM module 110 may supply TTM fluid to the pad 120 to the fluid compartment 121 to transition the fluid compartment from an empty state to a full state. In a similar fashion, the TTM module110 may extract TTM fluid 112 from the fluid compartment 121 to transition the fluid compartment from the full state to the empty state, such as at the conclusion of the TTM therapy so that the pad 120 may be disconnected from the TTM module 110 with the fluid compartment 121 in the empty state.
[0050] FIG. IB illustrates a detailed top view of the thermal pad 120, in accordance with some embodiments. Shown are the fluid compartment 121 disposed within and extending across the pad 120. The FDL 130 is also shown fluidly coupled with the fluid compartment 121. As discussed above, the thermal pad 120 may be one of plurality of the thermal pads 120, where each pad 120 may in some respects resemble the components and functionalities of the pad 120. The pad 120 may be provided as a component or a product separate from the TTM module 110. The thermal pad(s) 120 may include pads of different sizes and shapes in accordance with different placement locations on the patient and / or different patient sizes. As such, the thermal pads 120 may include fluid compartments 121 of different sizes, including different fluid capacities. In some embodiments, the pad 120 is provided in an empty state, i.e., where the fluid compartment 121 is empty of TTM fluid 112. In other embodiments, the pad 120 may be provided having TTM fluid 112 disposed within the fluid compartment 121.
[0051] The pad 120 includes a memory chip 160 (e.g., an RFID tag) attached to the pad 120. The memory chip 160 may be attached to a top side of the pad 120, inserted between layers of the pad 120, or placed at any other suitable location. The memory chip 160 includes memory 161 which may include a non-transitory computer-readable medium. The memory chip 160 is configured for exchanging data via a wireless protocol. In the illustrated embodiment, the memory chip 160 is configured to exchange data at least with a console of the system 100 where exchanging data includes writing data to the memory 161 as well as reading data from the memory 161.
[0052] The memory 161 includes pad data stored thereon. The pad data may include information pertaining to the pad 120, such as a type of the pad, a model number, a size, or a serial number, for example. In some embodiments, the pad data may include a fluid capacity of the fluid compartment 121, i.e., the volume of a TTM fluid 112 contained within the fluid compartment 121 when the pad 120 is in the full state. The pad data may also include the status of the pad 120, where the status includes one of the empty state or the full state. In some embodiments, initial pad data may be written to the memory 161 during manufacturing of thepad 120. During use, the logic of the console may obtain and alter the status of the pad 120 as further described below.
[0053] FIG. 2 illustrates a hydraulic schematic of the TTM system 100. The FDL 130 and the pad 120 are disposed external to the housing 111 of the TTM module 110. The TTM module 110 includes various fluid sensors and fluid control devices to prepare and circulate the TTM fluid 112. The fluid subsystems of the TTM module may include a temperature control subsystem 210 and a circulation subsystem 230.
[0054] The temperature control subsystem 210 may include a chiller pump 211 to pump (recirculate) TTM fluid 112 through a chiller circuit chiller 212 that includes a chiller 213 and a chiller tank 214. A temperature sensor 215 within the chiller tank 214 is configured to measure a temperature of the TTM fluid 112 within the chiller tank 214. The chiller 213 may be controlled by a temperature control logic (see FIG. 3) as further described below to establish a desired temperature of the TTM fluid 112 within chiller tank 214. In some instances, the temperature of the TTM fluid 112 within the chiller tank 214 may be less than the target temperature for the TTM therapy.
[0055] The temperature control subsystem 210 may include may further include a mixing pump 221 to pump TTM fluid 112 through a mixing circuit 222 that includes the chiller tank 214, a circulation tank 224, and a dam 228 disposed between the chiller tank 214 and circulation tank 224. The TTM fluid 112, when pumped by the mixing pump 221, enters the chiller tank 214 and mixes with the TTM fluid 112 within the chiller tank 214. The mixed TTM fluid 112 within the chiller tank 214 flows over the dam 228 and into the circulation tank 224. In other words, the mixing circuit 222 mixes the TTM fluid 112 within chiller tank 214 with the TTM fluid 112 within circulation tank 224 to cool the TTM fluid 112 within the circulation tank 224. A temperature sensor 225 within the circulation tank 224 measures the temperature of the TTM fluid 112 within the circulation tank 224. The temperature control logic may control the mixing pump 221 in accordance with temperature data from the temperature sensor 225 within the circulation tank 224.
[0056] The circulation tank 224 includes a heater 227 to increase to the temperature of the TTM fluid 112 within the circulation tank 224, and the heater 227 may be controlled by the temperature control logic. In summary, the temperature control logic when executed by the processor (see FIG. 3) may 1) receive temperature data from the temperature sensor 215 withinthe chiller tank and the temperature sensor 225 within the circulation tank 224 and 2) control the operation of the chiller 213, the chiller pump 211, the heater 227, and mixing pump 222 to establish and maintain the temperature of the TTM fluid 112 within the circulation tank 224 at the target temperature for the TTM therapy.
[0057] The circulation subsystem 230 comprises a circulation pump 213 to pull TTM fluid 112 from the circulation tank 224 and through a circulating circuit 232 that includes the fluid delivery line 120 and the pad 120 located upstream of the circulation pump 213. The circulating circuit 232 also includes a pressure sensor 237 to represent a pressure of the TTM fluid 112 within the pad 120. The circulating circuit 232 also includes a temperature sensor 235 within the circulation tank 224 to represent the temperature of the TTM fluid 112 entering the pad 120 and a temperature sensor 236 to represent the temperature of the TTM fluid 112 exiting the pad 120. A flow meter 238 is disposed downstream of the circulation pump 213 to measure the flow rate of TTM fluid 112 through the circulating circuit 232 before the TTM fluid 112 re-enters the circulation tank 224.
[0058] In use, the circulation tank 224, which may be vented to atmosphere, is located below (i.e., at a lower elevation) the pad 120 so that a pressure within the pad 120 is less than atmospheric pressure (i.e., negative) when fluid flow through the circulating circuit 232 is stopped. The pad 120 is also placed upstream of the circulation pump 231 to further establish a negative pressure within the pad 120 when the circulation pump 213 is operating. The fluid flow control logic (see FIG. 3) may control the operation of the circulation pump 213 to establish and maintain a desired negative pressure within the pad 120.
[0059] A supply tank 240 exchanges TTM fluid 112 with the circulation tank 224 via a port 241 to assist in maintaining a defined volume of TTM fluid 112 within the circulation tank 224. The supply tank 240 includes a volume sensor 242 where the volume sensor 242 is configured to determine a volume of TTM fluid 112 with the supply tank 240. The volume sensor 242 may be any type of sensor from which the volume of the TTM fluid 112 within supply tank 240 may be derived from a signal from the sensor, such as a pressure sensor, a capacitive sensor, an inductive sensor, a force sensor, or an optical sensor, for example. During use, the volume of TTM fluid 112 within the supply tank 240 may increase and or decrease. For example, the volume of TTM fluid 112 within the supply tank 240 may decrease when the TTM fluid 112 is supplied to the pad 120. Similarly, the volume of TTM fluid 112 within the supply tank 240 may increase when the TTM fluid 112 is purged from the pad 120.-li
[0060] In some embodiments, the supply tank 240 may be fluidly coupled with a TTM fluid source 250 (e.g., a facility water supply) via a supply line 252. An electro-mechanical supply line valve 253 is disposed in line with the supply line 252. The supply line valve 253 is configured to allow TTM fluid 112 from the TTM fluid source 250 to flow into the supply tank 240 when the supply line valve 253 is activated, i.e., transitioned to an opened state.
[0061] In some embodiments, the TTM module 110 may include a drain line 262 fluidly coupled with the supply tank 240. An electro-mechanical drain line valve 263 is disposed in line with the drain line 262. The drain line valve 263 is configured to allow TTM fluid 112 to drain from the supply tank 240 when the drain line valve 263 is activated, i.e., transitioned to an opened state. In some embodiments, the TTM module 110 may include an overflow container 260, where the overflow container 260 is configured to receive TTM fluid 112 from the drain line 262.
[0062] A module container 216 may include the supply tank 240 and the circulation tank 224 where a volume TTM fluid 112 within the module container 216 includes a sum of the individual volumes of TTM fluid 112 within the supply tank 240 and circulation tank 224. In some embodiments, the volume sensor 242 may be configured to indicate the volume TTM fluid 112 within the module container 216.
[0063] FIG. 3 illustrates a block diagram depicting various elements of the TTM module 110 of FIG. 1 A, in accordance with some embodiments. The TTM module 110 includes a console 300 including a processor (or number of processors) 310 and memory 340 including non-transitory, computer-readable medium. Logic modules stored in the memory 340 include patient therapy logic 341, fluid temperature control logic 342, fluid flow control logic 343 and fluid volume control logic 344. The logic modules when executed by the processor 310 define the operations and functionality of the TTM Module 110.
[0064] Illustrated in the block diagram of FIG. 3 are fluid sensors 320 as described above in relation to FIG. 2. Each of the fluid sensors 320 are coupled to the console 300 so that data from the fluid sensors 320 may be utilized in the performance of TTM module operations. Fluid control devices 330 are also illustrated in FIG. 3 as coupled to the console 300. As such, the logic modules may control the operation of the fluid control devices 330 as further described below.
[0065] The console 300 may include wireless communication capability 350 to facilitate wireless communication with the memory chip 160 of the pad 120 and / or other external computing devices. A power source 360 provides electrical power to the console 300.
[0066] The patient therapy logic 341 may receive input from the clinician via the GUI 115 to establish operating parameters in accordance with a prescribed TTM therapy. Operating parameters may include a target temperature for the TTM fluid 112 which may comprise a time-based target temperature profile. In some embodiments, the fluid temperature control logic 342 may define other fluid temperatures of the TTM fluid 112 within the TTM module 110, such a target temperature for the TTM fluid 112 within the chiller tank 214, for example.
[0067] The fluid temperature control logic 342 may perform operations to establish and maintain a temperature of the TTM fluid 112 delivered to the pad 120 in accordance with a predefined target temperature profile. One temperature control operation may include chilling the TTM fluid 112 within the chiller tank 214. The fluid temperature control logic 342 may utilize temperature data from the chiller tank temperature sensor 215 to control the operation of the chiller 213 to establish and maintain a temperature of the TTM fluid 112 within the chiller tank 214.
[0068] Another temperature control operation may include cooling the TTM fluid 112 within the circulation tank 224. The fluid temperature control logic 342 may utilize temperature data from the circulation tank temperature sensor 225 to control the operation of the mixing pump 221 to decrease the temperature of the TTM fluid 112 within the circulation tank 224.
[0069] Still another temperature control operation may include warming the TTM fluid 112 within the circulation tank 224. The fluid temperature control logic 342 may utilize temperature data from the circulation tank temperature sensor 225 to control the operation of the heater 227 to increase the temperature of the TTM fluid 112 within the circulation tank 224.
[0070] The fluid flow control logic 343 may control the operation of the circulation pump 231. As a thermal energy exchange rate is at least partially defined by the flow rate of the TTM fluid 112 through the pad 120, the fluid flow control logic 343 may, in some embodiments, control the operation of the circulation pump 231 in accordance with a defined thermal energy exchange rate for the TTM therapy. The fluid flow control logic 343 may further control the circulation pump 231 to initially supply TTM fluid 112 to one or more pads 120 to transition each pad 120 from the empty state to the full state. Similarly, the fluid flowcontrol logic 343 may control the circulation pump 231 to purge the TTM fluid 112 from the one or more pads 120 to transition each pad 120 from the full state to the empty state, such as at the end of the TTM therapy, for example.
[0071] The fluid volume control logic 344 is generally configured to manage the volume of TTM fluid 112 within the system 100 such as within the TTM module 110 and / or the fluid compartment of the pad 120. During use, TTM fluid 112 is supplied to the pad(s) 120 from the fluid container 216 at the initiation of the TTM therapy. Further during use, the TTM fluid 112 may be purged from the pad(s) 120 back to the fluid container 216. As such, in various instances, a total circulation volume of TTM fluid 112 may be (i) contained within a combination of the fluid container 216 and the pads 120 or (ii) contained solely within the fluid container 216. In some instances of use, supplying TTM fluid 112 to the pad(s) 120 from the fluid container 216 may cause an underfill condition of the fluid container 216. Similarly, purging the TTM fluid 112 from the pad(s) 120 back to the fluid container 216 may cause an overfill condition of the fluid container 216. Hence, the fluid volume control logic 344 may be configured to avoid the underfill and / or overfill conditions of the fluid container 216. As the console 300 is coupled with the supply line valve 252 and the drain line valve 262, the fluid volume control logic 344 may appropriately (i) activate the supply line valve 252 to avoid the underfill condition and / or (ii) activate the drain line valve 262 to avoid the overfill condition.
[0072] In some embodiments, the fluid volume control logic 344 may (i) receive an empty state status from the memory chip(s) 160 of the thermal pad(s) 120 and (ii) determine a volume of TTM fluid 112 within the module container 216 via the volume sensor 242. The fluid volume control logic 344 may compare the determined volume of TTM fluid 112 within the module container 216 with an initial module container volume stored in the memory 340. As a result of the comparison, the fluid volume control logic 344 may in some embodiments provide a notification to the clinician indicating that TTM fluid 112 should be added to the module container 216 prior to or simultaneously with supplying TTM fluid 112 to the pad(s) 120 to avoid the underfill condition. Alternatively or in addition to providing the notification, the fluid volume control logic 344 may activate the supply line valve 253 to add TTM fluid 112 to the module container 216 prior to or simultaneously with supplying TTM fluid 112 to the pad(s) 120 to avoid the underfill condition.
[0073] In some embodiments, the fluid volume control logic 344 may (i) receive a full state status from the memory chip 160(s) of the thermal pad(s) 120, and (ii) determine thevolume of TTM fluid 112 within the module container 216 via the volume sensor 242. The fluid volume control logic 344 may compare the determined volume of TTM fluid 112 within the module container 216 with a module container high volume limit stored in the memory 340. As a result of the comparison, the fluid volume control logic 344 may provide a notification to the clinician indicating that TTM fluid 112 should be removed from the module container 216 prior to or simultaneously with purging TTM fluid 112 from the pad(s) 120 to avoid the overfill condition. Alternatively or in addition to providing the notification, the fluid volume control logic 344 may activate the drain line valve 263 to remove TTM fluid from the module container 216 prior to or simultaneously with purging TTM fluid 112 from the pad(s) 120 to avoid the overfill condition.
[0074] In some embodiments, fluid volume control logic 344 may (i) receive an empty state status from the memory chip(s) 160 of the thermal pad(s) 120 and further receive the fluid compartment capacity from the memory chip(s) 160 of the thermal pad(s) 120. The fluid volume control logic 344 may determine the volume of TTM fluid 112 within the module container 216 via the volume sensor 242 and define a minimum predicted volume of TTM fluid 112 within the module container 216 based on the fluid compartment capacity / capacities of the pad(s) 120 and the determined volume of TTM fluid 112 within the module container 216. The fluid volume control logic 344 may compare the minimum predicted volume of TTM fluid 112 within the module container 216 with a module container low volume limit stored in the memory 340. As a result of the comparison, the fluid volume control logic 344 may provide the notification to the clinician indicating that TTM fluid 112 should be added to the module container 216 prior to or simultaneously with supplying TTM fluid 112 to the pad(s) 120 to avoid the underfill condition when the minimum predicted volume is less than the module container low volume limit. Alternatively or in addition to providing the notification, the fluid volume control logic 344 may activate the supply valve 253 to add TTM fluid 112 to the module container 216 prior to or simultaneously with supplying TTM fluid 112 to the pad(s) 120 to avoid the underfill condition when the minimum predicted volume is less than the module container low volume limit.
[0075] In some embodiments, the fluid volume control logic 344 may receive a full state status from the memory chip 160(s) of the thermal pad(s) 120, including receiving the fluid compartment capacity / capacities from the memory chip(s) 160 of the pad(s) 120. The fluid volume control logic 344 may determine the volume of TTM fluid 112 within the modulecontainer 216 via the volume sensor 242 and define a maximum predicted volume of TTM fluid 112 within the module container216 based on the fluid compartment capacity / capacities and the determined volume of TTM fluid 112 within the module container 216. The fluid volume control logic 344 may comparing the maximum predicted volume with a module container high volume limit stored in the memory 340. As a result of the comparison, the fluid volume control logic 344 may provide a notification to the clinician to remove TTM fluid 112 from the module container 216 prior to or simultaneously with purging TTM fluid 112 from the pad(s) 120 to avoid the overfill condition. Alternatively or in addition to providing the notification, the fluid volume control logic 344 may activate the drain line valve 263 to remove TTM fluid 112 from the module container 216 prior to or simultaneously with purging TTM fluid 112 from the pad(s) 120 to avoid the overfill condition when the maximum predicted volume exceeds the module container high volume limit.
[0076] In some embodiments, the fluid volume control logic 344 may transition the status of the fluid compartment(s) 121 of the pad(s) 120 as stored in the memory chip 160 from the empty state to the full state in accordance with supplying the TTM fluid 112 to the pad(s) 120. Similarly, the fluid volume control logic 344 may transition the status of the fluid compartment(s) 121 of the pad(s) 120 as stored in the memory chip 160 from the full state to the empty state in accordance with purging the TTM fluid 112 from the pad(s) 120. In some embodiments, the fluid volume control logic 344 may transmit pad data to the memory chip 160, such as an indication that the pad 120 has been fluidly coupled with the TTM module, for example.
[0077] FIG. 4 illustrates a flow chart of a method of the TTM system 100. The method 400 may include all or any subset of the following steps, actions, or processes as performed by the system 100. The method 400 may include receiving the thermal pad data from the memory chip (block 410). The method 400 further includes altering the volume the TTM fluid disposed within the module container based on the pad data (block 420). In some embodiments of the method 400, the thermal pad is fluidly coupled with the TTM module during performance of the method 400.
[0078] The method 400 may further include transporting the TTM fluid from the module container to the thermal pad (block 430).
[0079] The method 400 may further adding TTM fluid to the module container (block 440). In some embodiments of the method 400, the adding TTM fluid to the module container occurs prior to and / or simultaneously with the transporting TTM fluid from the module container to the thermal pad. In some embodiments of the method 400, the adding TTM fluid to the module container is based on receiving the thermal pad data, where the thermal pad data include the empty state status. In some embodiments of the method, the pad data include a fluid capacity of the fluid compartment and the adding TTM fluid to the module container includes adding an additional volume of TTM fluid based on the fluid capacity of the fluid compartment.
[0080] The method 400 may further include transitioning the pad data stored on the memory chip from the empty state status to the full state status (block 450) in accordance with transporting TTM fluid from the module container to the thermal pad.
[0081] The method 400 further includes purging TTM fluid from the thermal pad to the module container (block 460).
[0082] The method 400 may further include removing TTM fluid from the module container (block 470). In some embodiments of the method 400, removing TTM fluid from the module container occurs prior to and / or simultaneously with the purging TTM fluid from the thermal pad to the module container. In some embodiments of the method 400, the removing TTM fluid from the module container is based on receiving the thermal pad data, where the thermal pad data include the full state status. In some embodiments of the method, the pad data include the fluid capacity of the fluid compartment and removing TTM fluid from the module container includes removing an excess volume of TTM fluid based on the fluid capacity of the fluid compartment.
[0083] The method 400 may further include transitioning the pad data stored on the memory chip from the full state status to the empty state status (block 480) in accordance with the purging TTM fluid from the module container to the module container.
[0084] Without further elaboration, it is believed that one skilled in the art can use the preceding description to utilize the invention to its fullest extent. The claims and embodiments disclosed herein are to be construed as merely illustrative and exemplary, and not a limitation of the scope of the present disclosure in any way. It will be apparent to those having ordinary skill in the art, with the aid of the present disclosure, that changes may be made to the details of the above-described embodiments without departing from the underlying principles of thedisclosure herein. In other words, various modifications and improvements of the embodiments specifically disclosed in the description above are within the scope of the appended claims. Moreover, the order of the steps or actions of the methods disclosed herein may be changed by those skilled in the art without departing from the scope of the present disclosure. In other words, unless a specific order of steps or actions is required for proper operation of the embodiment, the order or use of specific steps or actions may be modified. The scope of the invention is therefore defined by the following claims and their equivalents.
Claims
CLAIMSWhat is claimed is:
1. A targeted temperature management (TTM) system, comprising: a TTM module configured to provide a TTM fluid, the TTM module including a console having a processor and memory, including a non-transitory computer-readable medium, having logic stored thereon that, when executed by the processor performs operations of the system; and a thermal pad having a fluid compartment configured to receive the TTM fluid from the TTM module to facilitate thermal energy transfer between the TTM fluid and a patient, wherein: the TTM module is configured to: deliver TTM fluid to the thermal pad to transition the fluid compartment from an empty state to a full state, and extract TTM fluid from the thermal pad to transition the fluid compartment from the full state to the empty state, the thermal pad includes a memory chip having stored thereon pad data including a status of the fluid compartment, the memory chip communicatively coupled with the console, and the operations include exchanging pad data with the memory chip.
2. The system according to claim 1, wherein the status of the fluid compartment includes at least one of the empty state or the full state.
3. The system according to claim 1 or claim 2, wherein the operations further include receiving the status of the fluid compartment from the memory chip.
4. The system according to any of the preceding claims, wherein the operations further include transmitting at least a portion of the pad data to the memory chip.
5. The system according to any of the preceding claims, wherein the pad data include a fluid capacity of the fluid compartment.
6. The system according to any of claims 2-5, wherein the operations further include: receiving an empty state status from the memory chip;determining a volume of TTM fluid within a module container via a volume sensor; comparing the volume of TTM fluid within the module container with an initial module container volume stored in the memory; as a result of the comparison, at least one of (i) providing a notification to the clinician to add TTM fluid to the module container or (ii) activating a supply line valve to add TTM fluid to the module container when the volume of TTM fluid within the module container is less than the initial module container volume; and supplying TTM fluid to the thermal pad.
7. The system according to any of claims 2-6, wherein the operations further include: receiving a full state status from the memory chip of the thermal pad; determining a volume of TTM fluid within the module container; comparing the volume of TTM fluid within the module container with a module container high volume limit stored in the memory; as a result of the comparison, at least one of (i) providing a notification to the clinician to remove TTM fluid from the module container or (ii) activating a drain valve to drain TTM fluid from the module container when the volume of TTM fluid within the module container exceeds the module container high volume limit; and purging TTM fluid from the thermal pad.
8. The system according to any of the preceding claims, wherein the pad data include a fluid capacity of the fluid compartment.
9. The system according to any of claims 2-8, wherein the operations include: receiving an empty state status from the memory chip of the thermal pad; receiving the fluid compartment capacity from the memory chip of the thermal pad; determining a volume of TTM fluid within the module container; defining a minimum predicted volume of TTM fluid within the module container based on the fluid compartment capacity and the volume of TTM fluid within the module container;comparing the minimum predicted volume of TTM fluid volume with a module container low volume limit stored in the memory; as a result of the comparison, at least one of (i) providing a notification to the clinician to add water to the module container or (ii) activating a supply valve to supply water to the module container when the minimum predicted volume is less than the module container low volume limit; and supplying TTM fluid to the thermal pad.
10. The system according to any of claims 2-9, wherein the operations include: receiving a full state status from the memory chip of the thermal pad; receiving the fluid compartment capacity from the memory chip of the thermal pad; determining a volume of TTM fluid within the module container; define a maximum predicted volume of TTM fluid within the module container based on the fluid compartment capacity and the volume of TTM fluid within the module container; comparing the maximum predicted volume with a module container high volume limit stored in the memory; as a result of the comparison, at least one of (i) providing a notification to the clinician to remove TTM fluid from the module container or (ii) activating a drain valve to drain TTM fluid from the module container when the maximum predicted volume exceeds the module container high volume limit; and purging TTM fluid from the thermal pad.
11. The system according to any of claims 2-10, wherein the operations include transitioning the status of the fluid compartment from the empty state to the full state.
12. The system according to any of claims 2-10, wherein the operations include transitioning the status of the fluid compartment from the full state and to the empty state.
13. The system according to any of the preceding claims, wherein the pad data include identification information including one or more of a type of thermal pad, a model number, a size, or a serial number.
14. A thermal pad configured for placement on a patient, comprising: a fluid compartment configured to receive a TTM fluid from a TTM module to facilitate thermal energy transfer between the TTM fluid and the patient; and a memory chip attached to the thermal pad, the memory chip configured to wirelessly exchange pad data with a console of the TTM module.
15. The pad according to claim 14, wherein: the pad data include a status of the fluid compartment, and the status includes one of an empty state or a full state.
16. The pad according to claim 15, wherein the status of the fluid compartment is changeable by logic of the console between the empty state and the full state.
17. The pad according to any of claims 14-16, wherein the pad data include a fluid capacity of the fluid compartment.
18. The pad according to any of claims 14-17, wherein the pad data include identification information including one or more of a type of thermal pad, a model number, a size, or a serial number.
19. A targeted temperature management (TTM) system method, comprising: receiving by a TTM module of a TTM system thermal pad data from a memory chip attached to a thermal pad of the TTM system; and altering a volume of a TTM fluid disposed within a module container of the TTM system based on the pad data.
20. The system according to claim 19, wherein the thermal pad is physically coupled with the TTM module.
21. The system according to claim 19 or claim 20, wherein the pad data include one of an empty state status or a full state status of a fluid compartment of the thermal pad.
22. The system according to any of claims 19-21, further comprising: transporting the TTM fluid from the module container to the thermal pad; and adding TTM fluid to the module container.
23. The system according to claim 22, wherein the adding TTM fluid to the module container occurs at least one of prior to or simultaneously with the transporting TTM fluid from the module container to the thermal pad.
24. The system according to claim 22 or claim 23, wherein the adding TTM fluid to the module container is based on receiving the thermal pad data, the thermal pad data including the empty state status.
25. The system according to any of claims 22-24, further comprising: transitioning the pad data stored on the memory chip from the empty state status to the full state status in accordance with the transporting TTM fluid from the module container to the thermal pad.
26. The system according to any of claims 22-25, wherein: the pad data include a fluid capacity of the fluid compartment; and the adding TTM fluid to the module container includes adding an additional volume of TTM fluid based on the fluid capacity of the fluid compartment.
27. The system according to any of claims 19-26, further comprising: purging TTM fluid from the thermal pad to the module container; and removing TTM fluid from the module container.
28. The system according to claim 27, further comprising: transitioning the pad data stored on the memory chip from the full state status to the empty state status in accordance with the purging TTM fluid from the module container to the module container.
29. The system according to claim 27 or claim 28, wherein the removing TTM fluid from the module container occurs at least one of prior to or simultaneously with the purging TTM fluid from the thermal pad to the module container.
30. The system according to any of claims 27-29, wherein the removing TTM fluid from the module container is based on receiving the thermal pad data, the thermal pad data including the full state status.
31. The system according to any of claims 27-30, wherein: the pad data include the fluid capacity of the fluid compartment; andthe removing TTM fluid from the module container includes removing an excess volume of TTM fluid based on the fluid capacity of the fluid compartment.