Cooling method and production system

Abstract

The invention relates to a cooling method (10) for controlling the temperature of a cooling device (16) taking into account heating at least one machine component (12) of a process machine (14) during operation of the process machine (14), comprising the method steps of: a. ascertaining (24) an expected thermal energy acting on the machine component (12) within a temporal processing part (22a-h) of a control program (18) that controls operation of the process machine (14); wherein the expected thermal energy is ascertained on the basis of a processing power (26a-d) for the machine component (12) that is provided within the temporal processing part (22a-h); b. determining (28) a required heat dissipating ability (30) of the cooling device (16) for dissipating the expected thermal energy; c. preconditioning (32) the cooling device (16) in advance in order to provide the required heat dissipating ability (30) until the expected thermal energy acts on the machine component (12). The invention also relates to a production system (38).

Description

[0001] Cooling process and manufacturing system

[0002] Background of the invention

[0003] The invention relates to a cooling method. The invention also relates to a manufacturing system.

[0004] Such manufacturing systems typically comprise at least one processing machine with multiple machine components for processing a material. Typically, some of the machine components must be cooled to prevent overheating due to material processing. It may also be necessary to cool the material being processed or reacting materials. For this purpose, the aforementioned temperature-regulating cooling processes are performed on the manufacturing systems.

[0005] The importance of cooling processes is becoming increasingly important, particularly for processing machines where material is processed with a high input of heat. Classic examples of this type of processing machine are laser processing machines. The production system typically includes a cooling device that dissipates heat generated during material processing from the processing device. For this purpose, the processing device is usually connected to a cooling circuit with a circulating cooling fluid, e.g. cooling water. The heat absorbed by the cooling fluid from the processing device is released in the cooling device and then fed back into the processing device. Depending on the amount of heat generated in the processing device, the cooling capacity of the cooling device can be adjusted to ensure sufficient cooling of the processing device.For this purpose, modern manufacturing systems feature an interface between the processing device and the cooling device, through which information about the required cooling capacity can be exchanged. For example, the cooling water temperature, flow rate, or the performance of a cooling water pump can be specified via the interface.

[0006] Various types of cooling devices and cooling methods are known from the state of the art.

[0007] For example, it is known from CN 109332888 A to determine the flow rate of the cooling fluid required for cooling a laser processing unit or the pumping power of the cooler based on the laser power used during processing and to specify this to a cooling device.

[0008] It is also known to measure the temperature of the cooling water in the return line of the cooling circuit or the temperature of a machine component to be cooled or of a material to be cooled during a machining process in order to regulate the temperature and / or flow rate of the cooling fluid, as described, for example, in CN 110102895 A or WO 2020 / 096552 A2. DE 10 2017 206 074 A1 discloses a laser device that can dissipate the heat emitted by a laser oscillator by means of a relatively small cooler. The laser device has a calculation part that determines a maximum temperature of the individual components of the laser device during laser machining. If the maximum temperature exceeds a limit value, a warning can be issued before laser machining begins and the manufacturing parameters can be changed if necessary.

[0009] However, the devices known from the prior art are only designed to ensure adequate cooling of the processing machine with regard to relatively constant process conditions. Material processing on modern processing devices, however, usually takes place under dynamic process conditions. For example, in laser processing, as an example of a dynamic material processing process, the laser power is only required for a certain period of time depending on the processing task, is changed rapidly over time, or the laser is switched off during machine positioning processes. The same applies to the movement sequences of the mechanical components, e.g., the moving machine axes. The aforementioned processes are dynamic, and heat is generated discontinuously in the processing machine.

[0010] If a machining process is carried out with dynamically changing process conditions, the cooling device can only react with a time delay in the aforementioned examples from the prior art. As a result, the cooling fluid temperature in the supply line of the cooling circuit can fluctuate by several degrees Celsius, which means that the resulting heat can only be dissipated inadequately. By the time the cooling device is adjusted to the changed process conditions, the temperature of a machine component may have already risen to an undesirable level. This can initially impair the production quality of the machining center. In more serious cases, the temperature increase leads to overheating of the machine component and can cause production downtime and / or damage to the machining device. Conversely, changing process conditions can cause the set cooling capacity of the cooling device to be too high.This causes excessive heat to be drawn away from the processing machine, which can also impair production quality. In any case, excessive cooling of the laser processing device leads to increased operating costs.

[0011] Object of the invention

[0012] The invention is based on the object of providing a device and a method for dynamic and energy-efficient cooling of a processing machine during a material processing process.

[0013] Description of the invention

[0014] This object is achieved according to the invention by a cooling method having the features of patent claim 1. The object is also achieved by a manufacturing system having the features of claim 11. The subclaims relate to preferred embodiments.

[0015] According to the invention, a cooling method, in particular a computer-assisted one, is provided. In other words, the cooling method can be carried out at least partially using computers.

[0016] The cooling method is suitable, in particular designed, for the temperature control of a cooling device, in particular unidirectionally. The temperature control takes place taking into account the heating of at least one machine component of a process machine during operation of the process machine. The process machine can have several, in particular a large number of, machine components. The cooling method can be carried out taking into account the heating of several machine components. Preferably, the temperature control can give priority to the heating of temperature-critical machine components. The cooling method is preferably applicable in conjunction with dynamic material processing processes using high-energy processing tools. The cooling method is particularly preferably designed for use on a laser processing machine.

[0017] The cooling process is carried out using a cooling device. The cooling device is designed to absorb thermal energy from the process machine. Typically, the cooling device is fluidly coupled to the process machine via at least one cooling circuit. Typically, the process machine is cooled during material processing.

[0018] The operation of the processing machine is typically controlled or predetermined by a control program. For example, the control program can provide for the production of a workpiece by laser beam cutting of a workpiece blank. During material processing, the process parameters specified in the control program can change, especially multiple times, over time. For example, laser power, feed rate, thermal power, actuator power, etc., can change during material processing. The change in process parameters during material processing can be understood as dynamic material processing.

[0019] The change in process parameters is predetermined in the control program. Typically, the processing machine performs the material processing according to the control program. In other words, the material processing sequence or the temporal change in the process parameters is known before the material processing to be performed.

[0020] The cooling process comprises at least the following process steps.

[0021] A method step involves determining the expected heat energy or heat quantity acting on the machine component within a temporal processing section of the control program. A processing section is understood as a subsection of the control program. The control program can comprise multiple processing sections. A processing section typically comprises material processing with constant process parameters. Different processing sections can last for different lengths of time.

[0022] According to the invention, the heat energy is determined based on the processing power of the processing machine within the processing period. The processing power typically represents the largest portion of the energy input. The processing power can therefore represent the significant portion of the heat input into the processing machine or an individual machine component. Furthermore, it can be provided that additional energy inputs from various machine components, such as the drive power of actuators, are taken into account when determining the expected heat energy. Typically, for a laser processing machine, the heat energy is determined based on the laser power.

[0023] In order to be able to make an accurate prediction of the expected heat energy, it can be provided that a processing data set is stored, comprising a correlation between the processing power of the process machine, in particular the laser power of the laser processing machine, and the resulting heat input into the process machine, in particular the laser processing machine. The resulting heat input can have been determined by simulation and / or measurement. Preferably, the processing data set contains a plurality of resulting heat inputs for a plurality of different processing powers, in particular laser powers. Particularly preferably, a heat input for a specific processing power is based on a plurality of different simulations and / or measurements. This can increase the accuracy of the prediction.In addition, the processing data set can take into account other processing parameters of the process machine in their correlation with the resulting heat energy in the machine components. Additional processing parameters can have a decisive influence on the expected heat energy. In a laser processing machine, for example, the heat energy generated in the laser unit can be determined from the pump power of the pump diodes less the output laser power and plus a constant for cooling the control cabinet components. Furthermore, for example, in the drives for the axis movement in the laser processing machine, the heat energy generated can be determined from the power loss of the drives. Furthermore, for example, the heat energy generated at a processing head of the laser processing machine can depend on the absorption or scattering of laser radiation by optical and mechanical components of the processing head.Furthermore, for example, during laser cutting or welding, the heat energy generated in the active components (laser diodes, optics, drives, power electronics) depends on the length of the contour to be machined and the processing speed as well as the technology parameters (laser power, gas pressure, focus position, etc.) for the respective material to be machined.

[0024] A further method step involves determining the required heat dissipation capacity of the cooling device for the machining section. The cooling device is typically configured with a cooling medium to dissipate or store the expected heat energy during the machining section. Heat dissipation capacity is understood to be the general ability of the cooling device or cooling medium to absorb heat energy. In other words, the required thermal counterbalance to the expected heat input is determined. The heat absorption capacity can be suitable for rapid or continuous absorption of heat energy.The heat dissipation capacity typically consists of a heat absorption capacity for absorbing heat energy from the machine component through the cooling medium, a heat conduction capacity within the cooling device, a heat storage capacity of the cooling device, and a heat dissipation capacity of the cooling device for dissipating the heat energy to the surroundings of the cooling device. Determining the required heat dissipation capacity can be understood as determining the heat absorption capacity, the heat conduction capacity, the heat storage capacity, and / or the heat dissipation capacity.

[0025] For example, the cooling medium can comprise a cooling liquid circulating in the cooling circuit between the cooling device and the process machine, and a heat sink arranged or formed on the cooling device. In this case, the heat absorption capacity can be determined by the temperature and / or the circulation rate of the cooling liquid. Furthermore, the thermal conductivity of the cooling medium can be determined by the temperature difference between the cooling liquid and the heat sink, as well as the circulation rate of the cooling liquid. The thermal mass of the heat sink can further determine, for example, the heat storage capacity. The ambient temperature and / or switchable heat sinks can further determine, for example, the heat dissipation capacity.

[0026] The required heat dissipation capacity of the cooling medium can be derived from the fact that the temperature of the machine component is not increased, in particular a maximum temperature is not exceeded, despite heat input.

[0027] A further method step provides for the preconditioning of the cooling device with a time lead in order to provide the required heat dissipation capacity until the expected heat energy acts on the machine component. In other words, the cooling device or the cooling medium is prepared for the expected heat input. The time lead is preferably long in order to support energy-efficient operation of the cooling device. In this case, the time lead can be several minutes, for example, to allow for slow cooling of the cooling medium. In other cases, the control program may require the cooling device to be preconditioned as quickly as possible. In this case, the time lead can be less than one minute.

[0028] To enable precise preconditioning of the cooling device depending on the expected thermal energy, it can be provided that a control data set is stored with a correlation between a heat dissipation capacity of the cooling device and possible control parameters of the cooling device. The control parameters of the cooling device that effect a specific heat dissipation capacity of the cooling device have preferably been determined by simulation and / or testing. Preferably, the control data set contains several combinations of control parameters that effect a specific heat dissipation capacity of the cooling device. Preferably, the various combinations of control parameters can be evaluated for a specific heat dissipation capacity of the cooling device with regard to energy efficiency and / or delivery speed.The control data set preferably comprises a plurality of resulting heat dissipation capacities for a plurality of different combinations of control parameters. Particularly preferably, a resulting heat dissipation capacity for a specific combination of control parameters is based on a plurality of different simulations and / or tests. This can increase the accuracy of the prediction.

[0029] Typical control parameters of the cooling device include, for example, cooling capacity, number of active compressor stages, cooling medium temperature, cooling medium circulation rate, ambient temperature of the cooling device and / or the process machine, etc. This list is not exhaustive. The control parameters can affect one or more components of the cooling device's heat dissipation capacity. Depending on the determined thermal energy, optimal preconditioning of the cooling device or the cooling medium can be achieved.

[0030] Preferably, the cooling device is controlled in such a way that the cooling device always operates in the lowest energy-efficient mode in terms of electrical power consumption. This increases the energy efficiency of the cooling device.

[0031] In summary, the cooling method according to the invention provides predictive control of the cooling device. The control of the cooling device can be determined using the control program of the processing machine, from which necessary changes in the cooling behavior can be derived from predetermined changes in the processing parameters. By predetermining the material processing sequence in the control program, the cooling behavior of the cooling device can be adjusted in advance of the corresponding processing parameters being changed. The necessary change in the cooling behavior is thus completed when the processing parameters are changed, allowing any resulting heat energy to be dissipated by the cooling device or the cooling medium. Temperature fluctuations in the cooling circuit, which could cause overheating of the machine components, can consequently be effectively prevented.

[0032] A preferred embodiment is one in which the processing machine is a laser processing machine, a processing machine for forming a material, a processing machine for tempering a medium, a processing machine for electron beam processing, or a process machine for a process whose expected thermal energy is predictable within a time-based processing segment of the control program. For example, the cooling method is suitable for cooling a soldering system. The soldering system is typically designed to create solder joints. In this case, the number of solder joints, the time interval during which the solder joints are created, and / or the amount of solder to be used can be known in advance from the control program—here, the soldering plan. This allows the expected amount of heat to be determined at a given time and the required heat dissipation capacity to be determined.

[0033] The cooling process is also suitable, for example, for cooling an injection molding machine used to produce plastic parts. The control program can determine the amount of plastic material to be injected and the timing of the injection process. The expected heat energy and the required heat dissipation capacity can then be determined.

[0034] For example, the cooling process may be suitable for cooling a roll used for extruding film. The control program typically includes the thickness, length, and material of the film, from which the expected heat energy and the required heat dissipation capacity can be determined.

[0035] In a preferred embodiment of the cooling method, aging of at least one machine component is taken into account when determining the expected thermal energy. Aging machine components can, for example, lead to increased heat input, which requires an increased heat dissipation capacity of the cooling medium. For example, it can be provided that the machine component is monitored with sensors to detect a change, particularly a slow change, in the aging-related thermal energy.

[0036] An embodiment of the cooling method is preferred in which an expected temperature of the machine component is taken into account when determining the required heat dissipation capacity. In other words, the initial temperature of the machine component before heating by the expected thermal energy is taken into account. This can be done by comparing a target temperature of the machine component with an actual temperature of the machine component. For example, a possible warm-up of the machine component to an operating temperature can be provided. In this case, for example, the existing cooling behavior can be maintained or reduced by the cooling device.

[0037] Further preferred is an embodiment of the cooling method in which a maximum temperature of the machine component is taken into account when determining the required heat dissipation capacity. In other words, the actual temperature of the machine component can be compared with a maximum temperature. From this, a temperature tolerance can be derived. For example, a small temperature tolerance can prioritize heat absorption capacity, while a large temperature tolerance can prioritize energy-efficient operation of the cooling device.

[0038] In a preferred embodiment of the cooling method, the ambient temperature of the laser processing machine and / or the cooling device is taken into account when determining the required heat dissipation capacity. For example, the ambient temperature can be influenced depending on the installation location of the processing machine and / or the cooling device and / or the time of day or year, and can have different effects on the operating mode of the cooling device. For example, the heat dissipation capacity of the cooling medium can be increased at low ambient temperatures, which can reduce the heat storage capacity. By taking the ambient temperature into account, the determination of the heat dissipation capacity can be improved under an energetically optimal operating mode of the cooling device.Further preferred is an embodiment of the cooling method in which a processing period of the processing section is taken into account when determining the required heat dissipation capacity and / or preconditioning. In other words, the temporal duration of the processing section is taken into account. For example, expected heat energy within a short processing period can lead to high heat intensity, wherein the heat energy in this case must be dissipated over a short period of time. In this case, the heat dissipation capacity can be preconditioned with regard to the heat absorption capacity. Furthermore, for example, expected heat energy within a long processing period can lead to continuous heat loading, wherein the heat energy must be dissipated over a longer period of time. In this case, the heat dissipation capacity can be preconditioned with regard to the heat conduction capacity.By knowing the processing time, the preconditioning can be adjusted to the expected heat energy, or the cooling device can be controlled accordingly. For example, a setting of the control parameters can provide for high heat intensity to be dissipated by briefly switching on an additional compressor stage and increasing the circulation rate of the coolant, while keeping the other control parameters of the cooling device constant. Furthermore, for example, in the case of continuous heat load, the cooling capacity of the cooling device can be permanently increased.

[0039] In a preferred embodiment of the cooling method, the expected thermal energy and / or the thermal dissipation capacity of at least one processing section preceding the processing section, in particular immediately preceding it, and / or following the processing section, in particular immediately following it, is taken into account when determining the required heat dissipation capacity and / or during preconditioning. This allows the cooling device to be controlled depending on the preceding and / or subsequent processing section. For example, preconditioning of the cooling device for a processing section may be less intensive if the expected thermal energy in the subsequent processing section is lower, resulting in a reduction in the thermal dissipation capacity.

[0040] Further preferred is an embodiment of the cooling method in which the expected heat energy is determined for several temporal processing sections of the control program. The processing sections, in particular, follow one another directly. This allows for energy-efficient and predictive operation across a large part of the control program, in particular the entire control program.

[0041] A preferred embodiment of the cooling method provides that, for preconditioning the cooling device, at least one cooling circuit and / or one compressor stage of the cooling device is switched on or off. This can, in particular, increase the thermal conductivity and heat storage capacity, thereby significantly increasing the thermal energy dissipated by the cooling medium.

[0042] The underlying problem is also solved by a manufacturing system. The manufacturing system comprises a processing machine, preferably a laser processing machine, and a temperature-controllable cooling device. The processing machine comprises at least one machine component described above and below.

[0043] The manufacturing system is designed to carry out the cooling process described above and below.

[0044] For this purpose, the manufacturing system has a machine control system. The machine control system is designed to control and / or regulate individual machine components of the process machine and / or the cooling device. The machine control system can be arranged, in particular designed, on the process machine. The machine control system is also configured to execute, i.e., read and execute, the control program.

[0045] The machine control is preferably configured to determine the thermal energy acting on the machine component. This eliminates the need to transfer the control program to another processing unit. To determine the thermal energy, the machine control can be configured to read a storage medium and a processing data set stored thereon. In particular, the machine control can be configured to determine the thermal energy by interpolating between the data in the processing data set.

[0046] The machine control preferably has a data interface to the cooling device. Instructions and / or data can be exchanged between the machine control and the cooling device via the data interface. For example, it can be provided that the machine control transmits a determined expected heat energy to the cooling device.

[0047] In a preferred embodiment of the manufacturing system, the machine control system is configured to determine the required heat dissipation capacity of the cooling medium. This allows essential process steps to be performed by the machine control system, thereby accelerating the cooling process.

[0048] Furthermore, an embodiment of the production system is preferred in which the machine control is configured and / or designed to control or precondition the cooling device. In other words, the machine control can be designed to implement control parameters on the cooling device. This allows the cooling method to be applied particularly easily to different cooling devices. In a preferred embodiment of the production system, the cooling device is designed for continuously controlling a cooling capacity between zero and one hundred percent. This allows the cooling device to be preconditioned particularly precisely to the required heat dissipation capacity.

[0049] A preferred embodiment is also one in which the production system has at least one controllable proportional valve for fluidically separating and / or combining at least two refrigeration circuits. In other words, in addition to controlling an internal refrigeration unit of the cooling device, the cooling device can also have controllable components in the cooling circuit. By separating and / or combining refrigeration circuits, for example, a flow temperature of the cooling circuit can be preconditioned. In other words, refrigeration circuits with different temperatures can be mixed.

[0050] Further preferred is an embodiment of the manufacturing system in which the cooling device has at least two controllable cooling stages, at least two operating modes, at least two compressors, and / or at least one free cooler. The use of one or more additional components of the cooling device increases the possibilities for preconditioning the cooling device depending on the expected thermal energy. This ensures energy-efficient operation.

[0051] In a preferred development of the production system, the cooling device is designed for multi-stage compression, evaporation, and liquefaction of the coolant. This can significantly increase the heat dissipation capacity of the cooling medium. The production system preferably uses water as the coolant. The inventors have found that the cooling process can be carried out particularly energy-efficiently when using water. More preferably, the cooling device is designed to carry out a refrigeration cycle in a rough vacuum. This allows various operating modes to be carried out on the cooling device. Further features and advantages of the invention emerge from the description, the claims, and the drawings. According to the invention, the features mentioned above and those further detailed can each be used individually or in groups in any expedient combination.The embodiments shown and described are not to be understood as an exhaustive list, but rather have an exemplary character for the description of the invention.

[0052] Detailed description of the invention and drawing

[0053] Fig. 1 shows a schematic representation of a cooling method according to the invention.

[0054] Fig. 2 shows a control program or a control plan for machining a workpiece in conjunction with a heat dissipation plan.

[0055] Fig. 3 shows a schematic representation of a manufacturing system with a process machine, a cooling device and a machine control system.

[0056] Fig. 1 shows a schematic representation of a cooling method 10 according to the invention. The cooling method 10 is explained below with reference to Figs. 2 and 3.

[0057] The cooling method 10 is designed for temperature control of a cooling device 16 (see Fig. 3). The temperature control takes into account the heating of at least one machine component 12 (see Fig. 3) of a processing machine 14 (see Fig. 3)—here in the form of a laser processing machine.

[0058] The cooling or heat dissipation occurs during the operation of the process machine 14, typically during the processing of at least one material (not shown) by the process machine 14. The operation of the process machine 14, in particular the processing operation of the process machine 14 for processing the material, is predetermined in a control program 18 (see Fig. 2). The control program 18 is provided, for example, before a material processing operation in a machine control system 20 (see Fig. 3). The control program 18 can, as shown, have a plurality of processing sections 22a-h (see Fig. 2).

[0059] The cooling method 10 comprises at least the following method steps.

[0060] In a first method step 24, an expected thermal energy or heat quantity acting on the machine component 12 within a temporal processing period 22a-h of the control program 18 is determined. The expected thermal energy is determined based on a processing power 26a-d (see Fig. 2)—here, a laser power—provided within the corresponding processing period 22a-h. In other words, the control program 18 can provide material processing with a different processing power 26a-d in each processing period 22a-h. Depending on the respective processing period 22a-h, the thermal energy resulting from the processing power 26a-d acting on the machine component 12 can change dynamically.

[0061] A further method step 28 involves determining a required heat dissipation capacity 30 (see Fig. 2) of a cooling medium (not shown) for dissipating the expected thermal energy. Typically, the heat dissipation capacity 30 is adapted to the thermal energy to be dissipated. If the heat dissipation capacity 30 of the cooling medium is too high, the machine component 12 may be cooled too much and / or the operation of the cooling device 16 may become uneconomical. If, on the other hand, the heat dissipation capacity 30 is too low, the machine component 12 may overheat and result in production downtime. A further method step 32 involves preconditioning the cooling device 16 in advance in order to provide the required heat dissipation capacity until the expected thermal energy acts on the machine component 12.In other words, the heat dissipation capacity 30 is proactively adjusted to an expected heat input. For example, the heat dissipation capacity 30 is increased or decreased. This can prevent an adjustment of the heat dissipation capacity 30 in response to incoming heat energy, thus avoiding temperature fluctuations.

[0062] Fig. 2 shows the control program 18 for processing a material in conjunction with a heat dissipation plan 34.

[0063] The control program 18 has the processing sections 22a-h. The processing sections 22a-h can be configured chronologically in the control program 18. The processing sections 22a-h can have different durations. Adjacent processing sections 22a-h typically have different processing powers 26a-d, with the processing power 26a representing a minimum processing power 26a and the processing power 26d representing a maximum processing power 26d. The minimum processing power 26a can be zero watts.

[0064] According to the control program 18, it can be provided that, over the course of the control program 18, the processing power 26a in the processing section 22a is gradually increased to the processing power 26b, 26c, and 26d via the processing sections 22b, 22c, and 22d. The increase in the processing power 26a-d can be necessary, for example, in conjunction with a feed rate of the laser during material processing. Furthermore, it can subsequently be provided that the processing power 26a-d in the processing section 22e is reduced to the minimum processing power 26a. This can occur, for example, when the position of the switched-off laser changes. Subsequently, it can be provided that the processing power 26a-d in the processing section 22f is suddenly increased to the maximum processing power 26d and is gradually reduced again in the subsequent processing sections 22g and 22h.In other words, the control program 18 can provide a dynamic change in the processing power 26a-d during material processing.

[0065] The cooling method 10 according to the invention (see Fig. 1) is designed to determine the heat input dependent on the change in the machining power 26a-d, or the thermal energy acting on the machine component 12. Furthermore, the cooling method 10 can be designed to determine the required heat dissipation capacity 30 in the respective machining section 22a-h.

[0066] The heat dissipation capacity 30 determined for each processing section 22a-h can be illustrated by way of example in the heat dissipation plan 34 shown.

[0067] The heat dissipation plan 34 can comprise a profile of the heat dissipation capacity 30 relative to one, in particular all, processing sections 22a-h of the control program 18. The heat dissipation plan 34 can be created, for example, before the start of a material processing operation. The heat dissipation plan 34 can be provided to the process machine 14 and / or the cooling device 16, preferably by the machine control system 20. Particularly preferably, the heat dissipation plan 34 is created by the machine control system 20.

[0068] The heat dissipation capacity 30 can have different heat dissipation levels 36a-d. The heat dissipation levels 36a-d depend on the processing power 26a-d. The heat dissipation levels 36a-d can have an offset with respect to the processing power 26a-d. For example, the heat dissipation level 36a can enable the dissipation of heat energy even though a correlating processing power 26a has a value of zero watts. This can be due to machine components 12 that require cooling even when the laser is switched off. For example, in the case of power electronics of the process machine 14.

[0069] From the change in the heat dissipation capacity 30 according to the heat dissipation plan 34, it is clear that an adjustment of the heat dissipation capacity 30 can be initiated in advance in such a way that the required heat dissipation capacity 30 is provided when the heat energy caused by the respective processing power 26a-d occurs.

[0070] For example, the heat dissipation capacity 30 in the processing section 22a can be increased to provide the required heat dissipation level 36b when the laser power 26a changes to the processing power 26b. This can prevent overheating of the machine component 12 or keep the temperature of the machine component 12 constant despite additional heat input.

[0071] Furthermore, for example, the heat dissipation capacity 30 in the machining section 22d can be reduced before changing the machining power 26d to the machining power 26a, insofar as overheating of the machine component 12 can be ruled out in this case. This enables energy-efficient operation.

[0072] Fig. 3 shows a schematic representation of a manufacturing system 38 with a process machine 14, a cooling device 16 and a machine control 20.

[0073] The process machine 14 can be fluidly connected to the cooling device 16 by means of at least one first cooling circuit 40. The manufacturing system 38 preferably has a further cooling circuit 42, which is designed to further cool the machine component 12. The process machine 14 can have a data interface 44 for communication with the cooling device 16. Furthermore, the machine controller 20 has at least one data interface 46 to the process machine 14 and a data interface 48 to the cooling device 16.

[0074] List of reference symbols

[0075] Cooling process 10;

[0076] Machine component 12;

[0077] Process machine 14;

[0078] Cooling device 16;

[0079] Control program 18;

[0080] Machine control 20;

[0081] Processing section 22a-h;

[0082] Process step 24;

[0083] Processing performance 26a-d;

[0084] Process step 28;

[0085] Heat dissipation capacity 30;

[0086] Process step 32;

[0087] Heat dissipation plan 34;

[0088] Heat dissipation level 36a-d;

[0089] Manufacturing system 38;

[0090] Cooling circuit 40;

[0091] Cooling circuit 42;

[0092] Data interface 44;

[0093] Data interface 46;

[0094] Data interface 48.

Claims

Patent claims Cooling method (10) for temperature control of a cooling device (16) taking into account the heating of at least one machine component (12) of a process machine (14) during operation of the process machine (14), comprising the method steps: a. determining (24) an expected thermal energy acting on the machine component (12) within a temporal processing section (22a-h) of a control program (18) that controls the operation of the process machine (14); wherein the expected thermal energy is determined on the basis of a processing power (26a-d) provided for the machine component (12) within the temporal processing section (22a-h); b. determining (28) a required heat dissipation capacity (30) of the cooling device (16) for dissipating the expected thermal energy; c.Preconditioning (32) of the cooling device (16) with a time lead in order to provide the required heat dissipation capacity (30) until the expected thermal energy acts on the machine component (12). The cooling method (10) according to claim 1, wherein the process machine (14) is a laser processing machine or a processing machine for forming a material or a process machine for tempering a medium or a process machine for electron beam processing or a process machine for a process whose acting expected thermal energy is predictable within a temporal processing section (22a-h) of the control program (18). The cooling method (10) according to claim 1 or 2, wherein aging of the at least one machine component (12) is taken into account when determining the expected thermal energy. Cooling method (10) according to one of the preceding claims, wherein an expected temperature of the machine component (12) is taken into account when determining (28) the required heat dissipation capacity (30). Cooling method (10) according to one of the preceding claims, wherein a maximum temperature of the machine component (12) is taken into account when determining (28) the required heat dissipation capacity (30). Cooling method (10) according to one of the preceding claims, wherein the ambient temperature of the process machine (14) and / or the cooling device (16) is taken into account when determining (28) the required heat dissipation capacity (30). Cooling method (10) according to one of the preceding claims, wherein a processing period of the processing section (22a-h) is taken into account when determining (28) the required heat dissipation capacity (30) and / or during the preconditioning (32).Cooling method (10) according to one of the preceding claims, wherein the expected thermal energy and / or the required heat dissipation capacity (30) of at least one processing section (22a-h) preceding, in particular immediately preceding, the processing section (22a-h) and / or the processing section (22a-h) following, in particular immediately following, the processing section (22a-h) is / are taken into account when determining (28) the required heat dissipation capacity (30) and / or during the preconditioning (32). Cooling method (10) according to one of the preceding claims, wherein the determination (24) of the expected thermal energy takes place for a plurality of, in particular consecutive, temporal processing sections (22a-h) of the control program (18). Cooling method (10) according to one of the preceding claims, wherein for the preconditioning (32) of the cooling device (16) at least one. Cooling circuit (40, 42) and / or a compressor stage of the cooling device (16) is switched on or off. Manufacturing system (38) with a process machine (14) comprising at least one machine component (12), and with a temperature-controllable cooling device (16); wherein the manufacturing system (38) is configured to carry out the cooling method (10) according to one of the preceding claims; further comprising a machine control (20), in particular formed on the process machine (14); wherein the machine control (20) is configured to execute the control program (18) and to determine (24) the thermal energy acting on the machine component (12). Manufacturing system (38) according to claim 11, wherein the machine control (20) is configured to determine (28) the required heat dissipation capacity (30) of the cooling device (16).Manufacturing system (38) according to claim 11 or 12, wherein the machine control (20) is set up and / or designed to control the cooling device (16). Manufacturing system (38) according to one of claims 11 to 13, wherein the cooling device (16) is designed for the continuous control of a cooling capacity between zero and one hundred percent. Manufacturing system (38) according to one of claims 11 to 14, comprising at least one controllable proportional valve for the fluidic separation and / or merging of at least two cooling circuits. Manufacturing system (38) according to one of claims 11 to 15, wherein the cooling device (16) has at least two controllable cooling stages, at least two operating modes, at least two compressors and / or at least one free cooler. Manufacturing system (38) according to claim 16, wherein the cooling device (16) is designed for the multi-stage compression, evaporation and liquefaction of the refrigerant; wherein the manufacturing system uses water as the cooling medium. coolant; and wherein the cooling device (16) is designed to carry out a refrigeration cycle process in a rough vacuum.

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