Multi- circuit heat pump

Abstract

The present invention relative to a multi-circuit heat pump system (1). The system comprises a plurality of refrigerant loops (11, 12) each one for the circulation of a refrigerant fluid (R1, R2). Each refrigerant loops (11, 12) comprises a compressor (31, 32) and an expansion means (41, 42) respectively for the compression and expansion of the relative refrigerant fluid (R1, R2). each of said refrigerant loop (11, 12) exchanging thermal energy with a user side fluid (F1) and with an external side fluid (F2), wherein said heat pump system (1) comprises a control unit (5) provided with electronic components (510, 520, 610, 620) for controlling its operation. According to the invention, the heat pump system (1) comprises heat exchanger means (10) in thermal connection with said control unit (5) and with at least two of said loops (11, 12), wherein said heat exchanger means are configured to exchange heat between any control component (510, 520, 610, 620) of said control unit (5) and at least one refrigerant fluid (R1, R2) of a corresponding loop (11, 12).

Description

TECHNICAL FIELD

[0001] The present invention relates to a heat pump system capable of operating in both cooling and heating modes. More particularly, the present invention relates to a multi-circuit heat pump, i.e. a heat pump comprising a plurality of refrigerant loops each of which exchanges thermal energy with a user side fluid (water or air) and with an external fluid (water or air). The multi-circuit heat pump according to the invention has an improved capability of dissipating the heat generated by the electronic components of the control boards provided for controlling the operation of the refrigerant loops.STATE OF THE ART

[0002] The heat pump systems are largely required by the market mainly for their capacity to operate both in a cooling mode and in a heating mode. Among these systems there are the multi-circuit heat pumps. A multi-circuit heat pump system comprises a plurality of refrigerant circuits (or refrigerant loops) in each of which a refrigerant fluid circulates. Each refrigerant loop comprises a compressor and expansion means and it is configured so as the refrigerant fluid can exchange thermal energy with a user side fluid (typically by means of an supply heat exchanger) and to an external fluid (typically by means of an source heat exchanger). When a refrigerant loop operates in a cooling mode, the compressor increases the pressure of the refrigerant fluid and delivered it to the source heat exchanger at which heat is exchanged between the refrigerant fluid and the external fluid (e.g. external surrounding air, ground water). From the source heat exchanger, the refrigerant is expanded by the expansion means and subsequently delivered to the supply heat exchanger at which heat is exchanged between the refrigerant fluid and the user side fluid (e.g. indoor air, a water loop, a water buffer tank etc.). In the cooling mode, by the supply heat exchanger, the user side fluid is cooled. When a refrigerant loop operates in a heating mode the refrigerant fluid the flow of the refrigerant flow is reversed so that the source heat exchanger acts as an evaporator and the supply heat exchanger acts as a condenser. Therefore, in the heating mode, by the supply heat exchanger, the heat is transferred to the user side fluid.

[0003] In a known air-water heat pump system, the supply heat exchanger is provided for the heat exchange between the refrigerant circulating in each refrigerant loops and user side water that can circulate (e.g. by means of a water pump) in a line / circuit. Alternatively, the water could be accumulated in a buffer tank. A source heat exchanger is provided for the heat exchange between the refrigerant circulating in each refrigerant loops and surrounding air (external environment). On this purpose, to improve the heat exchange with the surrounding air, for each refrigerant loops, a fan can be provided.

[0004] In any case, a multi-circuit heat pump typically comprises a control unit that often includes, for each refrigerant loops, a control board or controller. Such a control unit typically comprises power electronic components and function control electronic components. The power electronic components are provided for controlling the compressor, other operative devices and other charging or conversion power devices depending on the configuration of the heat pump system. On this regard, the power electronic components can be also provided for activating / deactivating the cooling circuit fan and / or the water circulation pump of the water line circuit. Instead, the function control electronic components are provided for controlling the operation of a specific refrigerant loop. The function control electronic components, for example, set the operative mode (i.e. cooling or heating) of a relative refrigerant loop based on the user needs and / or the operative mode of other devices of the system (e.g. the water pump and / or the fan in the case of an air-water heat pump system as above indicated).

[0005] As known, the electronic components of the control unit (i.e. the components of the control modules provided for each refrigeration loop) generate heat when activated. Such a heat should be dissipated in order to ensure a correct operation of the control board.

[0006] According to a first known solution, forced air is used for cooling the control board. On this purpose, a cooling fan (or a functionally equivalent means) is provided to generate a forced air flow that hits the control unit components cooling them for convention.

[0007] While achieving its purpose, this solution disadvantageously increases the complexity and cost of the design of the heat pump system due to the need of installing the cooling fan. Further, specific electronic components for operating such a cooling fan are needed and the cooling with forced air is not very efficient, often requiring fins to help dissipate the heat, that in turn increases costs.

[0008] According to a second known solution, for heat pump systems provided with a control unit including separates controllers, typically one for each refrigerant loops, the electronic components of a controller are cooled by the refrigerant of the loop to which the controller refers. This means, the electronic components are actually cooled only when the refrigerant is running in the associated loop. However, it is known that some electronic components (i.e. function components or additional power control components, e.g. running the fan and / or the pump driver) generate heat, even when the associated refrigerant is not running (e.g. for running the fan and / or pump only or receiving signals from sensors or from a user interface device).

[0009] Therefore, this solution cannot be satisfying and surely not reliable since there is an overheating risk of the electronic components when the refrigerant does not run.

[0010] According to a further known solution, the electronic components of the control unit (or of each of its controllers) are cooled by means of a separate cooling circuit for the circulation of water or water mixed with glycol. This solution is relatively effective, but it is not recommended substantially for the same reasons above listed for the use of forced air. The need to provide and to handle a separate cooling circuit increases the complexity and cost of the design as well as increase the number of components and consequently the risks of failure.SUMMARY

[0011] In view of the above, it is an object of the present invention to provide a multi-circuit heat pump system which allows to solve effectively the technical problem of dissipating the heat generated by the electric components of the control unit of the system.

[0012] Another object of the present invention is to provide a multi-circuit heat pump which allows to dissipate, for each of the refrigerant loops, the heat generated by the relative controller independently from the operative condition of the relative compressor and without requiring the installation of specific operative devices (e.g. a cooling fan or a separate cooling circuit). A further object of the present invention is to provide a multi-circuit heat pump system whose main features can be easily implemented.

[0013] Not the least object of the present invention is to provide a multi-circuit heat pump system easy to manufacture at industrial level, at competitive costs with respect to similar installation of the state of the art.

[0014] The heat pump system according to the invention comprises a plurality of refrigerant loops each of which for the circulation of a refrigerant fluid. Each refrigerant loop comprises a compressor and an expansion means respectively for compressing and expanding a relative refrigerant fluid. Further, each of said refrigerant loop exchanges thermal energy with a user side fluid and with an external side fluid. The heat pump system comprises a control unit provided with electronic components for controlling its operation.

[0015] The heat pump system according to the invention comprises heat exchanger means in thermal connection with said control unit and with at least two of said loops. Said heat exchanger means are configured to exchange heat between any control component of said control unit and at least one refrigerant fluid when it circulates in the corresponding loop.

[0016] According to a preferred embodiment, the control unit comprises a plurality of controllers, one for each of said refrigerant loops, and wherein, said exchange means comprise a heat sink for each of said controllers. Said heat sink is therefore in thermal connection with a relative controller and with at least two of said refrigerant loops. This condition allows to dissipate generated by the electronic components of a controller when at least one of the refrigerants is circulating in one the refrigerant loops.

[0017] According to a possible embodiment, for at least one of said refrigerant loop, said controller comprises a first control module and a second control module, wherein said first control module comprises at least a power electronic component and wherein said second control module comprises at least a control electronic component.

[0018] According to a possible embodiment, at least one of said refrigerant loops comprises a main line along which the refrigerant cycle is performed and a capillary branch in fluidic connection with said main line, wherein said capillary branch is not-functional for the refrigerant cycle. According to this embodiment, the heat exchanger means is in thermal connection with said capillary branch of at least one of said refrigerant loops.

[0019] Preferably, the capillary branch is in fluidic connection with said main line by means of a couple of fluidic connections that are arranged upstream said compressor or downstream said expansion means, considering the operative direction of the refrigerant in said main line.

[0020] According to an embodiment, at least one of said heat sink comprises a metal plate, in thermal connection with said controllers on a first face and in thermal connection with said at least two refrigerant loops on a second face different, preferably opposite, to said first face.

[0021] Preferably, said second face comprises first recesses each of which suitable for accommodating, at least partially, a section of pipe of one of said refrigerant loops so that each of said section of pipe is in thermal connection with said metal plate.

[0022] Preferably, said heat sink comprises at least one fixing plate that includes second recesses for accommodating, at least partially, one of said section of pipe, said fixing plate being connected to said second face of said metal plate so that each of said section of pipe is comprised between said metal and said fixing plate. Preferably, the fixing plate is connected to the first plate by means of removable connection means.

[0023] According to a possible embodiment, the heat pump system comprises at least one structural body comprising a plurality of structural walls that define one or more housings each for accommodating one or more components of the heat pump system; said heat sink is detachably connected to one wall of said structural body. Preferably, the heat sink is connected to a wall that parts two of said housings mutually adjacent.

[0024] According to a possible embodiment, for each of the refrigerant loops, at least two sections of pipe in thermal connection with said metal plate are provided. Said sections of pipe are preferably rectilinear and develop along parallel directions. Preferably, for each of the refrigerant loops, said section of pipe are mutually connected by a relative connection section. The latter can be or not in thermal contact with the metal plate.

[0025] According to a possible embodiment, for each of the refrigerant loops the relative sections of pipe (with the relative connection section when present) overall identify a piping, wherein each of said piping has inlet port and an outlet port and wherein, for each of said piping, said inlet port and said outlet port are arranged at different sides of said metal plate.

[0026] According to another possible embodiment, for each of the refrigerant loops the relative sections of pipe (with the relative connection section when present) overall identify a piping, wherein each of said piping has inlet port and an outlet port and wherein, for each of said piping, said inlet port and said outlet port are arranged near a same side of the metal plate.

[0027] According to a possible arrangement, an inlet port and an outlet port of a first piping are arranged near a same side of said metal plate on which an inlet port and an outlet port of a second piping are arranged.

[0028] According to an alternative arrangement, the inlet port and the outlet port of a first piping of are arranged on a side of said metal plate different from another side on which said inlet port and said outlet port of a second piping are arranged.

[0029] Independently from the arrangement, the refrigerant fluid flows in the sections of pipe of one of the piping preferably so as to be in counter-current with respect to the refrigerant fluid flowing in the section of pipes of the other piping.LIST OF DRAWINGS

[0030] Further characteristics and advantages of the invention will emerge from the description of preferred, but not exclusive embodiments of a heat pump system according to the present disclosure, non-limiting examples of which are provided in the attached drawings, wherein: Figure 1 is a schematic view of a heat pump system according to the present invention; Figure 2 is a schematic view of a group of components of a heat pump system according to the invention; Figure 3 is a schematic view of an arrangement of a group of components of a heat pump system according to the invention; Figure 4 and 5 are prospective view of a possible embodiment of a heat sink of a heat pump system according to the invention, wherein such heat sink is shown coupled to sections of pipe of refrigerant loops of the same heat pump system; Figure 6 is a lateral view of the heat sink of Figures 4 and 5; Figures 7 and 8 are perspective views of two different components of the heat sink of Figures 4 and 5; Figure 9 is an exploded view of the heat sink of Figures 4 and 5; Figure 10 is a schematic view of another embodiment of a heat sink of a heat pump system according to the invention; Figure 11 is a schematic view of an outdoor unit of a heat pump system according to the invention; Figures 12 and 13 are schematic views of possible arrangements of a group of components of a heat pump system according to the invention.

[0031] In the figures, the same reference numbers refer to the same components.DETAILED DESCRIPTION

[0032] Figure 1 shows schematically a multi-circuit heat pump system 1 according to the present invention. As shown, the heat pump system 1 comprises two refrigerant loops 11, 12 (or circuits 11, 12). However, the heat pump system 1 could comprise more than two refrigerant loops (circuits). Along each refrigerant loop 11, 12 a relative refrigerant fluid R1, R2 circulates. Each refrigerant loop 11, 12 comprises a relative compressor 31, 32 to increase the values of pressure and temperature of the relative refrigerant fluid R1, R2 and expansion means (e.g. an expansion valve) to decrease the values of pressure and temperature of the relative fluid R1, R2. According to a possible embodiment, for each of the refrigerant loops 11, 12, the relative compressor 31, 32 can be activated by an inverter. Alternatively, each compressor 31, 32 could be of the ON-OFF type.

[0033] The heat pump system 1 comprises supply heat exchange means 21 provided to carry out a heat exchange between the refrigerant fluid R1, R2 of each circuit 11, 12 and a user side fluid, in particular water circulating in a circuit 8 operatively connected to one or more users. A water pump 88 is provided to allow the circulation of the water along the circuit 8. Depending on the operative mode (cooling or heating) of the refrigerant circuits 11, 12, the supply heat exchange means 21 can act as an evaporator or alternatively as a condenser. According to a possible embodiment, the supply heat exchange means 21 can comprise a heat exchanger (e.g. a metal plate exchanger) for each of the refrigerant loops 11, 12.

[0034] The heat pump system 1 also comprises source exchanger means 22 provided to carry out a heat exchange between the refrigerant fluid R1, R2 of each circuit 11, 12 and an external fluid, in particular air. The source exchange means 22 act as condenser means, when the supply heat exchange means 21 act as evaporator (i.e. during the operation in the cooling mode) or alternatively as evaporator means when the supply heat exchange means 22 act as condenser means (i.e. during the operation in the heating mode). According to a possible embodiment, also the source heat exchange means 22 can comprise a plurality of heat exchange means each of which to carry out a heat exchange between said external fluid (air) and a refrigerant fluid R1, R2 of a relative refrigerant circuit 11, 12. According to a solution known per se, in order to improve the heat exchange at the source heat exchanger 22, the heat pump system 1 comprises a relative fan 811, 822 for each of the refrigerant loops 11, 12.

[0035] For each of the refrigerant loops 11, 12, the heat pump system 1 also comprises inversion means [not shown in the figures] to change, depending on the operative mode (cooling-heating), the flow direction of the refrigerant fluid R1, R2 at the exit of the relative compressor 31, 32. According to an embodiment, the inversion means comprises a four-way valve (not shown in Figure 1) switchable between a first operative configuration and a second operative configuration respectively relative to the cooling mode and the heating mode. When such a valve assumes the first operative configuration, the refrigerant fluid R1, R2 pressurized by the compressor 31, 32 is delivered to the source heat exchanger means 22 and the refrigerant fluid R1, R2 expanded by the expansion means is delivered to the heat exchange means 21. According to said second operative configuration, the pressurized refrigerant fluid R1, R2 is delivered at the enter of the supply heat exchange means while the expanded refrigerant fluid is delivered at the enter of the source heat exchanger means.

[0036] Therefore, the heat pump system 1 schematically shown in Figure 1 is of air-water type. In a possible embodiment, the water circuit 8 could be replace by a buffer water tank. Further, the combination of user side fluid and external fluid of Figure 1 (air-water) could be replaced by another combination. On this regard, the heat pump system could be of the air-air type or alternatively of the water-water type or also alternatively of the water-air type.

[0037] In the case of air-air type system, for example, the heat pump system can comprise fan coils operatively associated to the supply heat exchanging means to make effective the heat exchange between the refrigerant fluid and the internal air (user side fluid).

[0038] In the case of a system of the water-water type the external fluid could be ground water, while the user side water could circulate in a circuit or be accumulated in a water buffer tank. One of the latter solutions could be provided also in a system of the water-air type. In this case, for each refrigeration loops a fan could be associated to the source heat exchanger means.

[0039] In any case the heat pump system according to the invention comprises a control unit 5 that includes electronic components (schematically indicated with the boxes 510, 520, 610, 620 in the figures) for controlling its operation. On this regard, Figure 2 shows a possible embodiment of the invention wherein, for each of the refrigerant loops 11, 12, the control unit 5 (dotted line in Figure 2) comprises a plurality of controllers 5A, 5B (dash dot lines in Figure 2) one for each of the refrigerant loops 11, 12 of the heat pump system 1.

[0040] For the purpose of the present invention, the term "control unit" wants to mean the whole of the controllers 5A, 5B, and consequently the whole of the electronic components 510, 520, 610, 620 provided for controlling the operation of the system 1. The term "controller" wants to indicate a group of electronic components 510-610, 520- 620 provided for the operation of a specific refrigerant loop 11, 12. On this regard, for the purpose of the present invention, a controller 5A, 5B comprises one or more printed circuit boards (PCB) electrically connected to devices (e.g. a compressor or an inverter, water pump, fan, fan coils, etc) and / or sensors of the heat pump system 1.

[0041] With reference again to Figure 2, preferably, each controller 5A, 5B comprises a first control module 51, 52 which includes one or more power electronic components 510, 520 specifically provided for the activating / deactivating the operative devices (e.g. the compressor 31, 32, the fan 81, 82, the expansion valve 41, 42, the four-way valve and in the case other devices of the system). In general, the first control module 51, 52 has the purpose of activating / disactivating charging and / or power conversion devices of the relative refrigerant loops or in general of the heat pump system (e.g. the circulation pump 88 of the water circuit 8).

[0042] Preferably, each controller 5A, 5B also comprises a second control module 61, 62 including electric components 610, 620 for controlling the functions of the relative refrigerant loop 11, 12. The second control module 61, 62, for example, determines the operative mode of the refrigerant loops depending on the user needs. For this purpose, the second control module 61, 62 receives electric signals indicative of the user needs as well as signals send from sensors (e.g. outdoor and / or indoor temperatures sensors) of the heat pump system 1. The second control module 61, 62 elaborates such signals and send command signals to the first control module 51, 52 for activating the relative devices.

[0043] The first control module 51, 52 preferably comprises a first PCB and the second control module 61, 62 preferably comprises a second PCB, wherein the first PCB is physically independent from the second PCB. According to an alternative embodiment, for each of the controllers 5A, 5B a sole PCB could be provided that includes both the relative control modules 51-61, 52-62. According to another alternative embodiment, the first control module 51, 52 and the second control module 61, 62 could be part of a sole PCB of the relative control unit 5. In this case, all the electronic components 510, 520, 610, 620 of the control unit 5 could be in such a sole PCB (as schematically drawn in Figure 1).

[0044] According to the present invention, the heat pump system 1 comprises heat exchange means 100 in thermal connection with said control unit 5 and in thermal connection with two of the refrigerant loops 11, 12 (see Figure 1). More in detail, according to the invention such heat exchange means 100 are configured to exchange heat between any control component 510, 520, 610, 620 of the control unit 5 and at least one refrigerant R1, R2 of a corresponding loop 11, 12. Therefore, the circulation of one of the refrigerants R1, R2 in the corresponding loop 11, 12 is actually sufficient to dissipate the heat generated by any control component 510, 520, 610, 620 of the control unit 5.

[0045] The heat exchange means 100 could comprises one or more element suitable to dissipate the heat generated by the electronic components, depending on the configuration of the control unit. On this regard, as schematically shown in Figure 2, when the control unit 5 comprises a plurality of controllers 5A, 5B the heat exchange means comprises a heat sink 101, 102 for each of said controllers 5A, 5B of the control unit 5. Each heat sink 101, 102 is in thermal connection with a controller 5A, 5B and with two refrigerant loops 11, 12 of the heat pump system 1. Therefore, in Figure 2, a first heat sink 101 is in thermal connection with the controller 5A of the first loop 11 and in thermal connection with both the refrigerant loops 11, 12. Analogously, a second heat sink 102 is in thermal connection with the controller 5B of the second loop 12 and both the refrigerant loops 11, 12.

[0046] Clearly, the heat to be dissipated is generated when the electronic components 510, 520, 610, 620 are activated. The heat sinks 101, 102 are configured so as to carry out a heat exchange between the relative controller 5A, 5B (in the case the modules 51, 52, 61, 62 of the controller 5 that comprise the electronic components 510, 520, 610, 620) and two different refrigerants R1, R2: a first one circulating along the same refrigerant loop to which the controller 5A, 5B refers, and a second one circulating in a different refrigerant loop.

[0047] With reference again to Figure 2, for the first refrigerant loop 11, the first heat sink 101 is provided for dissipating the heat generated by its controller 5A (or first controller 5A), while for the second refrigerant loop 12, the second heat sink 102 is provided for dissipating the heat generated by its controller 5B (or second controller 5B).

[0048] The first heat sink 101 carries out a heat exchange between the first controller 5A and first refrigerant fluid R1 circulating in the first refrigerant loop 11 and between first controller 5A and the second refrigerant fluid R2 circulating in the second refrigerant loop 12. Therefore, by means of the first heat sink 101, the heat generated from the electronic components 510, 520 of the first controller 5A can be transferred to, and consequently dissipated by, two different refrigerant fluids R1, R2 one of which circulating in a refrigerant loop different to that to which the first controller 5A refers. This solution allows a dissipation of the heat even when there is not a circulation of the first refrigerant fluid R1, i.e. when the compressor 31 of the first refrigerant loop 11 is not operated. Analogously, the second heat sink 102 carries out a heat exchange between the second controller 5B and the second refrigerant fluid R2 circulating in the second refrigerant loop 12 and between the same controller 5B and the first refrigerant fluid R1 circulating in the first refrigerant loop 11.

[0049] Therefore, for each of the two refrigerant loops 11, 12, the cooling of the relative controller 5A, 5B is guaranteed independently from the circulation of the refrigerant R1, R2 in the same refrigerant loop 11, 12. Advantageously, this operative condition improves the reliability and the durability of the electric components 510, 520, 610, 620 of the controllers 5A, 5B.

[0050] As above, a heat pump system 1 according to the invention can comprise more than two refrigerant loops. Preferably, for each of the controllers 5A, 5B, the relative heat sink 101, 102 is configured so as to carry a heat exchange with each of the refrigerant fluids circulating in a relative refrigerant loop 11, 12. According to this solution, if the heat pump system, for example, comprise three refrigerant loops (that means three controllers and three refrigerants are provided), each of the controllers would be cooled by means of anyone of the three refrigerant fluids provided for the heat pump system.

[0051] With reference to Figure 3, according to an embodiment of the invention, for each of the refrigerant loops a main line 110 can be identified. Such a main line 110 is functional the refrigerant cycle, i.e. it is provided to circulate the refrigerant between the components (compressor 31, expansion means 41, condenser 22, evaporator 21 - considering a cooling mode) that overall perform the refrigerant cycle. In Figure 3, only the first loop 11 is drawn only for clarity reasons, however the considerations below about the possible configuration of the first loop 11 are valid, mutatis mutandis, also for the second loop 12.

[0052] Preferably, each refrigerant loops also comprises a capillary branch 120 that is in fluidic connection with the main line 110. The capillary branch 120 is not functional for the refrigerant cycle, i.e. the refrigerant R1 flowing in the capillary branch 120 comes from (and back to) the main line 110. Therefore, during the flowing in the capillary branch 120, the refrigerant R1 it is not processed in any of the components involved in the refrigerant cycle. Both the main line 110 and the capillary branch 120 are clearly defined by one or more pipes. The diameter of the capillary branch pipes is less than the diameter of the main line pipes.

[0053] Always with reference to Figure 3, and inlet connection IN and an outlet connection OUT are provided for the fluidic connection of the capillary branch 120 with the main line 110. Preferably, the fluidic connections IN, OUT are arranged upstream the compressor 31 of the refrigerant loop 11 or alternatively downstream the expansion means 41 (with respect to the flow direction indicated by the arrow in Figure 3 - heating mode).

[0054] Preferably, as can be derived from Figure 3, for each of the controller 5A, 5B of the control unit 5, the relative heat sink 101, 102 is configured to exchange heat between the electronic components of the controller 5A, 5B and the refrigerant R1, R2 flowing in the capillary branch 120 of each refrigerant loop 11, 12. That means, each heat sink 101, 102 is in thermal connection with the capillary branch 120 of both the refrigerant loops 11, 12. This solution allows to cool the controllers 5A, 5B of the control unit 5 without affecting the performance of the refrigerant cycle in each of the refrigerant loop 11, 12. Further, the use of a capillary branch 120 makes easier the installation operations and in particular the thermal connection of the heat sinks 101, 102 with the refrigerant loops 11, 12.

[0055] Figures 4 to 9 refer to a possible embodiment of the first heat sink 101 provided for the cooling of the first controller 5A of the first refrigerant loop 11. However, the technical solutions hereinafter disclosed and referred to the heat sink 101 should be considered valid, mutatis-mutandis, also for the heat sink 102 provided for the controller 5B of the second refrigerant loop 12.

[0056] The first heat sink 101 comprises a metal plate 90 that includes at least a first face 90A in thermal connection with the controller 5A of the first refrigerant loop 11. More in detail, the controller 5A is attached to the first face 90A (i.e., the control modules 51, 61 of the controller 5A are both attached to the first face 90A). The heat sink 101 also comprises a second surface 90B, different from the first face 90A at which the heat sink 101, 102 is in thermal connection with two refrigerant loops 11, 12, more in detail with one or more sections of pipe 81 82 of each of said refrigerant loops 11, 12. Preferably, for each of the refrigerant loops 11, 12, each of said section of pipe 81, 82 is a part of the capillary branch 120 in fluidic connection with the main line 110 of the relative refrigerant loop 11 according to the solution above.

[0057] The heat generated by the electric components 510, 610 of the controller 5A (i.e. of the modules 51, 61) during their activation is transferred to the metal plate 90 by thermal conductivity. The heat is then transmitted by metal plate 90 to the first refrigerant fluid R1 - circulating in the sections of the pipe 81 of the first loop 11- and to the second refrigerant fluid R2 - circulating in the section of pipe 82 of the second loop 12. Therefore, the refrigerants R1, R2 remove the heat by thermal convection. Further, beyond the heat dissipation action of the refrigerants R1, R2, the heat transferred to the metal plate 90 can be also irradiated by its external surfaces. As shown in Figure 4 to 7, preferably the first face 90A and the second face 90B are opposite. For this reason, the metal plate 90 preferably has a substantially prismatic shape with two opposite main faces and with a thickness T (i.e. the distance between the two main surfaces indicated in Figure 6) remarkable lower than the length or the width of each of the main faces 90A, 90B. Preferably, the first face 90A and the second face 90B correspond to the main faces of the plate 90.

[0058] In any case, the metal plate 90 is made of a material having high thermal conductivity, preferably, but not exclusively, aluminium.

[0059] As clearly shown in Figure 7, the second face 90B preferably comprises a first plurality of recesses 71 (or first recesses 71) each of which for accommodating, at least partially, one said section of pipe 81,82 of one of the loops 11, 12. Preferably, the first recesses 71 have a concave semi-circular cross section suitable to accommodate a first circular sector of the surface one of said section of pipe 81,82 above (see Figures 6 and 7). Preferably, the first recesses 71 are rectilinear and mutually parallel (see Figure 7).

[0060] For the purpose of the present invention, the term "section of pipe" wants to indicate specifically a part of a piping of the refrigerant loop 11, 12 (or preferably of its capillary branch 120) in thermal contact with the metal plate 90.

[0061] With reference again to Figures 4 to 9, preferably the heat sink 101 comprises two fixing plate 96 that are connected to the first plate 90 so as to fix the position of the sections of pipe 81, 82 of the refrigerant loops 11, 12 against the second face 90B of the plate 90. In an alternative embodiment not shown in the Figures, a sole fixing plate could be provided.

[0062] Preferably, the fixing plate 96 comprises a coupling surface 96A defining a second plurality of recesses 72 each of (or second recesses 72) each of which for accommodating, at least partially, one of said section of pipes 81,82. Preferably the second recesses 72 are geometrical consistent with said first recesses 71 of the metal plate 90. This in order to accommodate a second sector of surface of a corresponding section of pipe 81, 82, wherein said second sector is opposite to the first one accommodated in one of the first recesses 71 of the metal plate 90 (see again Figure 6). Therefore, as well shown in Figure 6, when the connecting plates 96 are installed, each of the section part 81,82, in thermal connection with the metal plate 90, is physically comprised between the metal plate 90 and the connecting metal plates 96.

[0063] Preferably, the connecting metal plates 96 are detachably attached to the metal plate 90 (e.g. by means of screws 99 of other equivalent connection means). This makes easier the assembly of the heat sink 101 and the installing of the section of pipes 81, 82. In the embodiment shown in Figures 4-9, the fixing plates 96 are in the form of a pressed sheet metal element. The thickness of the fixing plates 96 is remarkable less than that of the metal plate 90.

[0064] In an alternative embodiment schematically shown in Figure 10, instead of one or more thin connecting plates 96, a metal plate 97 having a size closer to that of the metal plate 90 could be used. In this case, following the join of the two metal plates 90, 97, the sections of pipe 81, 82 would be substantially embedded in the structure of the heat sink 101.

[0065] Other alternative embodiments of a connecting plate usable for fixing the position of the section of pipes have to be regarded as part of the invention.

[0066] Each heat sink 101, 102 can be easily connected on a wall / face of the structural body 150 a of the heat pump system 1, i.e, on a surface of an operative unit of the pump heat pump system. The "structural body" wants generically to mean the plurality of walls / surfaces 200, 201, 202, 203 that overall define one or more housing 100A, 100B in which one or more components of the heat pump system can be placed. Preferably, a heat sink 101, 102 can be detachably connected to one of said walls 200, 201, 202, 203, for example at a seat / window defined through (or partially through) the same wall / surface. Therefore, each sink 101,102 can be advantageously provided as an independent part with respect to the structural body 150. This is beneficial for manufacturing, design, transportation and maintenance. As a fact, the radiator size can be chosen in function of the structural body design.

[0067] However, according to an alternative embodiment, not shown in the figures, the heat sink can be integral to the structural body 150 of the heat pump system 1. On this regard, the metal plate 90 could be defined by a portion of one of said walls / surfaces 200, 201, 202, 203 of the heat pump structural body.

[0068] Figure 11 schematically shown an outdoor unit 100 of a heat pump system 1 according to the invention for example of the air-water kind. As shown, such unit 100 could comprise two housings: a ventilation housing 100A, in which the fan and the outdoor source exchanging means are arranged, and a refrigeration cycle housing 100B, in which at least the compressor valve and the expansion valve are placed. The heat sink 101 could be connected, preferably in a detachable way, to at a wall 200 (preferably at an opening of said wall 200) that separates the two adjacent housings 100A, 100B so that one each of the main faces 90A, 90B of the heat sink 101 faces one of the sections 100A, 100B. On this regard, preferably, but not exclusively, the heat sink 1 is installed so that the controllers 5A, 5B attached to the metal plate 90 face the ventilation housing 100A. However, a different arrangement could be provided, i.e. the controllers 5A, 5B could face to the other section 100B.

[0069] Figures 12 and 13 refer to possible arrangements of the section 81, 82 of the refrigerant loops 11, 12 (preferably of a relative capillary branch 120A, 120B) on the second surface 90B of the first heat sink 101. Also in this case, the solutions below can be also for the second sink 102 provided for the controller 5B of the second refrigerant loop 12.

[0070] Preferably, the sections of pipe 81 and 82 develop parallelly along parallel rectilinear directions. In the embodiments of the Figures, for each of the loop 11, 12 at least a couple of rectilinear sections of pipe 81, 82 are provided. Each of the sections of pipe 81, 82 are in thermal connection with the second face 90B of the metal plate 90 and develop from a first side face 901 to a second side face 902 (indicated in Figure 7) of the metal plate 90. For each of the refrigerant loops 11, 12 the sections of pipe 81, 82 can be connected by a relative connection section 813, 823. According to an embodiment shown in the Figures, the connection section 813, 823 develop "outside" the metal plate 90, that is it is not in thermal contact with the metal plate 90. However, according to an alternative embodiment, the connection section can be in thermal contact with the metal plate 90.

[0071] Overall, the sections of pipe 81 of the first loop 11, (with the relative connection section 813 when present) identify a first piping with an "inletport" 81A and an "outletport" 81A. For the purpose of the present invention, the term "inlet port" wants to indicate the flow cross section of the first piping at which, for the first time, the refrigerant fluid R1, R2 comes in one of said section of pipe 81 of the first loop 11. Instead, the term "outlet port" 81B wants to indicate the flow cross of the first piping at which, for the last time, the refrigerant fluid R1, R2 leaves one section of pipe 81 of the first loop 11. An inlet port 81A and an outlet port 81B can be clearly identified after having set the flow direction of the refrigerant R1 along the section of pipe 81 of the first refrigerant loop 11.

[0072] Analogously, the sections of pipe 82 of the second loop 12 (and the relative connection section 823 when present) identify a second piping with an "inlet port" 82A and an "outlet port" 82B, wherein such ports 82A, 82B can be identified as above indicated for the ports 81A, 81B of the first piping.

[0073] According to a first possible arrangement shown in Figure 12, for each of said piping, the inlet port 81A, 82A and an outlet port 82A, 82B are arranged on the same surface 901 (in the following reference surface 901) of the metal plate 90. Preferably, the inlet port 82A and the outlet port 82B of the second piping are arranged so as to be comprised between the inlet port 81A and the outlet port 81B of the first pipe 81, wherein such a position is considered on a reference plane (defined by the longitudinal axes of the sections of pipes 81, 82) along which all the ports 81A, 81B, 82A, 82B are aligned.

[0074] Always with refence to Figures 12, preferably, each of the section of pipe 81 of the first piping are arranged on the second surface 90B of the metal plate 90 close to one of the section of pipe 82 of the second piping.

[0075] Preferably, the refrigerant fluid R1 flows in the sections of pipe 81 of the first piping so as to be in counter-current with respect to the refrigerant fluid R2 flowing in the section of pipe 82 of the second piping (condition indicated by the two arrows in Figure 12). Therefore, at the reference surface 901, the inlet port 81A of the first piping is arranged close to the outlet port 82B of the second piping and the inlet port 82A of the second piping is arranged close to the outlet port 81B of the first piping. It has been seen that the counter-current condition allows a more uniform dissipation of the heat generated by the electronic components 510, 610 of the controller 5A.

[0076] However, according to an alternative solution, the two refrigerants fluid R1, R2 could flow in the sections of pipe 81, 82 of the relative pipes 81, 82 so as to be in a co-current condition. In this case, at said reference surface 901, the inlet port 81A of the first piping it will be arranged close to the inlet port 82A of the second piping and the outlet port 82A of the second pipe 82 it will be arranged close to the outlet port 81B of the first pipe 81.

[0077] In a different possible arrangement shown in Figure 13, the two piping are arranged so that the inlet port 81A and an outlet port 81B of the first piping are placed at one surface 901 of the metal plate 90 different, preferably opposite, to another surface 902 at which the inlet port 82A and the outlet port 82B of the second piping are placed.

[0078] Always with reference to Figure 13, also in this arrangement the sections of pipe 81 of the first piping develops parallelly and near to one the sections of pipe 82 of the second piping. Preferably, the refrigerant fluids R1, R2 flow in their relative rectilinear sections of pipe 81, 82 so as to be in a counter-current condition. Alternatively, they can flow according to a co-current condition.

[0079] The described technical solutions allow to fully achieve the predetermined tasks and objects. In detail, the heat pump system to the invention allows to achieve the task and the purposes Above indicated. Further, the present invention is highly effective, reliable and easy to manufacture at competitive costs.

Claims

1. Heat pump system (1) comprising a plurality of refrigerant loops (11, 12) each of which for the circulation of a refrigerant fluid (R1, R2), each refrigerant loops (11, 12) comprising a compressor (31, 32) and an expansion means (41, 42) respectively for compressing and expanding a relative refrigerant fluid (R1, R2), each of said refrigerant loop (11, 12) exchanging thermal energy with a user side fluid (F1) and with an external side fluid (F2), wherein said heat pump system (1) comprises a control unit (5) provided with electronic components (510, 520, 610, 620) for controlling its operation, characterized in that said heat pump system (1) comprises heat exchanger means (10) in thermal connection with said control unit (5) and with at least two of said loops (11, 12), wherein said heat exchanger means are configured to exchange heat between any control component (510, 520, 610, 620) of said control unit (5) and at least one refrigerant fluid (R1, R2) of a corresponding loop (11, 12).

2. Heat pump system (1) according to claim 1, wherein said control unit (5) comprises a plurality of controllers (5A, 5B), one for each of said refrigerant loops (11, 12), and wherein, said exchanger means (10) comprise a heat sink (101, 102) for each of said controllers (5A, 5B), wherein each said heat sink (101, 102) is in thermal connection with a relative controller (5A, 5B) and with at least two of said refrigerant loops (11, 12).

3. Heat pump system (1) according to claim 2, wherein, for at least one of said refrigerant loop (11, 12), said controller (5A, 5B) comprises a first control module (51, 52) and a second control module (61, 62), wherein said first control module (51, 52) comprises at least a power electronic component (510, 520) and wherein said second control module (61, 62) comprises at least a control electronic component (610, 620).

4. Heat pump system (1) according to any of the claims 1 to 3, wherein at least one of said loops (11, 12) comprises a main line (110) along which the refrigerant cycle is performed and a capillary branch (120) in fluidic connection with said main line (110), wherein said capillary branch is not-functional for the refrigerant cycle, said heat exchanger means (100) being in thermal connection with said capillary branch (120) of at least one of said refrigerant loops (11, 12).

5. Heat pump system according to claim 4, wherein said capillary branch (120) is in fluidic connection with said main line (110) by means of a couple of connections (IN, OUT) that are arranged upstream said compressor (31, 32) or downstream said expansion means (41,42) considering the operative direction of the refrigerant (R1, R2) in said main line (110).

6. Heat pump system (1) according to any of the claims 2-5, wherein at least one of said heat sink (101A, 101B) comprises a metal plate (90), in thermal connection with said controllers (5A, 5B) on a first face (90A) and with said at least two refrigerant loops (11, 12) on a second face (90B) different, preferably opposite, to said first face (90A).

7. Heat pump system (1) according to Claim 6, wherein said second face (90B) comprises first recesses (71) each of which suitable for accommodating, at least partially, a section of pipe (81, 82) of one of said refrigerant loops (11, 12) so that each of said section of pipe is in thermal connection with said metal plate (90).

8. Heat pump system (1) according to Claim 7, wherein said heat sink (101, 102) comprises at least one fixing plate (96) that includes second recesses (72) for accommodating, at least partially, one of said section of pipe (81, 82), said fixing plate (96) being connected, to said second face (90B) of said metal plate (90) so that each of said section of pipe (82, 82) is comprised between said metal (90) and said fixing plate (96).

9. Heat pump system, (1) according to any of the claims 2-8, wherein said heat pump system (1) comprises at least one structural body (100) comprising a plurality of structural walls (200, 201, 202, 203) that define one or more housings (100A, 100B) each for accommodating one or more components of the heat pump system (1), wherein said heat sink (101, 102) is detachably connected to one wall (200) of said structural body (100).

10. Heat pump system (1) according to any of the claims 7-9, wherein for each of the refrigerant loops (11, 12), at least two sections of pipe (81, 82) are provided, wherein such sections of pipe (81, 82) are rectilinear and develop along parallel directions.

11. Heat pump system (1) according to claim 10, wherein, for each of the refrigerant loops (11, 12) the relative sections of pipe (81, 82) overall identify a piping, wherein each of said piping has inlet port (81A, 82A) and an outlet port (82A, 82B) and wherein, for each of said piping, said inlet port (81A, 82A) and said outlet port (82A, 82B) are arranged at different sides of said metal plate (90).

12. Heat pump (1) according to claim 10, wherein, for each of the refrigerant loops (11, 12) the relative sections of pipe (81, 82) overall identify a piping, wherein each of said piping has inlet port (81A, 82A) and an outlet port (82A, 82B) and wherein, for each of said piping (81,82), said inlet port (81A, 82A) and said outlet port (82A, 82B) are arranged near a same side (901, 902) of said metal plate (90).

13. Heat pump system (1) according to claim 12, wherein an inlet port (81A) and an outlet port (81B) of a first piping are arranged near a same side of said metal plate (90) on which an inlet port (82A) and an outlet port (82B) of a second piping are arranged.

14. Heat pump (1) according to Claim 12, wherein said inlet port (81A) and said outlet port (81B) of a first piping (81) of said pipes (81, 82) are arranged on a side (901) of said metal plate (90) different from another side (902) on which said inlet port (82A) and said outlet port (82B) of a second piping are arranged.

15. Heat pump system (1) according to claim 13 or 14, wherein the refrigerant fluid (R1, R2) flows in the sections of pipe (81, 82) of one of the piping so as to be in counter-current with respect to the refrigerant fluid (R2, R1) flowing in the section of pipes (81, 82) of the other piping.

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