Vibration absorption structure and electronic device

Abstract

The present disclosure discloses a vibration absorption structure and an electronic device. The vibration absorption structure is assembled in an electronic device (10) having an internal chamber (20) in which at least one member is placed. The vibration absorption structure includes at least one electroacoustic transducer module (30) and a vibration absorption member (40). At least part of the electroacoustic transducer module (30) is located in the internal chamber (20). The internal chamber (20) is partitioned by the at least one member in the electronic device (20) and the part of the electroacoustic transducer module (30) to form a damping space (21). The vibration absorption member (40) is located in the damping space (21). The present disclosure solves the problem of the shell resonance of the electronic device (10) caused by airflow turbulence generated by vibration sounding, thereby reducing the impact of the airflow on the shell, weakening the resonance of the electronic device (10), and optimizing user experience.

Description

RELATED APPLICATION

[0001] The present disclosure claims priority to Chinese Utility Model Patent Application No. 202320170994.6, filed on January 20, 2023, and entitled "vibration absorption structure and electronic device".TECHNICAL FIELD

[0002] The present disclosure relates to the field of acoustoelectric technologies, and in particular to a vibration absorption structure and an electronic device.BACKGROUND

[0003] In modern mainstream electronic devices, the pursuit of high-quality audio performance from speakers or receivers has led to prevalent adoption of open acoustic chamber designs. This configuration features non-sealed rear chambers in speaker modules or receiver modules, allowing airflow into internal acoustic chambers of devices. However, turbulent airflow frequently induces resonance of the device's shell, resulting in perceptible vibrations when the user holds the shell. The vibrations intensify with increasing sound volume, ultimately compromising user experience. Consequently, designing optimized acoustic chamber structures of electronic devices to enhance holding comfort remains a critical challenge requiring urgent resolution.

[0004] In existing technologies, one type of electronic device employs a semi-open chamber design, where a damping element is mounted on a leakage hole of the rear chamber to improve the compliance of the rear acoustic chamber while maintaining controllable leakage. This design can reduce resonance to some extent. Another type of electronic device in existing technologies adopts a design in which an acoustic guide channel is provided on the rear chamber of the speaker module and then is connected to an open acoustic chamber. By utilizing multiple directional changes and reflections within the vibration-damping channel, this design absorbs airflow vibration energy, thereby achieving airflow energy attenuation and mitigating shell resonance to a certain extent. However, both the semi-open chambers and chambers with acoustic guide channels can only mitigate shell resonance to a limited extent in practical applications. The shell resonance issue caused by the open acoustic chamber design in electronic devices still requires further resolution.SUMMARY

[0005] The present disclosure provides a vibration absorption structure and an electronic device. By filling a vibration absorption member in a damping space, the problem of the resonance of a shell of the electronic device caused by airflow turbulence due to vibration sounding can be solved, and the impact of the airflow on the shell can be reduced, thereby reducing the resonance of the electronic device and optimizing user experience.

[0006] The above objective of the present disclosure is mainly achieved by the following technical solutions.

[0007] The present disclosure provides a vibration absorption structure assembled in an electronic device. The electronic device includes an internal chamber in which at least one member is placed. The vibration absorption structure includes at least one electroacoustic transducer module and a vibration absorption member. At least part of the electroacoustic transducer module is located in the internal chamber. The internal chamber is partitioned by the at least one member in the electronic device and the part of the electroacoustic transducer module to form a damping space. The vibration absorption member is located within the damping space. The electroacoustic transducer module is provided with at least one vent hole communicated with the damping space, and the at least one vent hole is covered with an isolation mesh.

[0008] The present disclosure further provides another vibration absorption structure assembled in an electronic device. The electronic device includes an internal chamber in which at least one member is placed. The vibration absorption structure includes at least one screen vibration excitation module and a vibration absorption member. The internal chamber is partitioned by the at least one screen vibration excitation module and the at least one member of the electronic device to form a damping space. The vibration absorption member includes an isolation mesh and a vibration absorption medium. The vibration absorption medium is located in the damping space, and the isolation mesh is configured to isolate the vibration absorption medium from the at least one screen vibration excitation module.

[0009] The present disclosure further provides an electronic device, including a shell and the afore-mentioned vibration absorption structure mounted in the shell.

[0010] Compared with the prior art, the technical solutions of the present disclosure have the following characteristics and advantages: By filling the vibration absorption member in the electronic device, the impact of the internal airflow on the shell of the electronic device is reduced, thereby reducing the resonance of the electronic device, optimizing the user experience and enhancing the competitiveness of the electronic device in the market.BRIEF DESCRIPTION OF THE DRAWINGS

[0011] For a clearer illustration of technical features in the embodiments of the present disclosure or the prior art, a brief description of the drawings for the embodiments or the prior art will be given below. The drawings described below involve only some embodiments of this disclosure. For those of ordinary skill in the art, other drawings can be derived from these drawings without any inventive efforts. In the drawings: FIG. 1 illustrates a structural diagram of the first embodiment of the present disclosure; FIG. 2 illustrates a structural diagram of the second embodiment of the present disclosure; FIG. 3 illustrates a structural diagram of the third embodiment of the present disclosure; FIG. 4 illustrates a structural diagram of the fourth embodiment of the present disclosure; FIG. 5 illustrates a structural diagram of the fifth embodiment of the present disclosure; FIG. 6 illustrates a structural diagram of the sixth embodiment of the present disclosure; and FIG. 7 illustrates a structural diagram of the seventh embodiment of the present disclosure. Reference numerals:

[0012] 10: electronic device; 11: middle frame; 12: cover; 13: rear cover; 20: internal chamber; 21: damping space; 22: subspace; 30: electroacoustic transducer module; 31: vent hole; 40: vibration absorption member; 50: isolation mesh; 60: screen vibration excitation module; 70: vibration absorption medium; 81: processor; 82: lens module; 83: battery; 90: screen.DETAILED DESCRIPTION OF THE EMBODIMENTS

[0013] For a clearer understanding of the technical features of the present application, a clear and complete description of the technical features of the embodiments of the present application will be set forth with reference to the drawings. The described embodiments are only a part, rather than all, of the embodiments of the present application. All other embodiments derived by persons skilled in the art from the embodiments of the present application without making inventive efforts shall fall within the scope of the present application.

[0014] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on another element or there may be an intervening element. When an element is considered to be "connected to" another element, it may be directly connected to another element or there may be an intervening element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustration purposes only and do not indicate a unique embodiment.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by persons skilled in the technical field of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing the specific embodiments, and are not intended to limit the present disclosure. As used herein, the term "and / or" includes any and all combinations of one or more associated listed items.Embodiment 1

[0016] The present disclosure provides a vibration absorption structure assembled in an electronic device 10. As illustrated in FIGS. 1 and 2, the electronic device 10 includes an internal chamber 20 in which at least one member is placed. The vibration absorption structure includes at least one electroacoustic transducer module 30 and a vibration absorption member 40. At least part of the electroacoustic transducer module 30 is located in the internal chamber 20. The internal chamber 20 is partitioned by the at least one member in the electronic device 10 and the part of the electroacoustic transducer module 30 to form a damping space 21. The vibration absorption member 40 is located in the damping space. The electroacoustic transducer module 30 is provided with at least one vent hole 31 communicated with the damping space 21, and the at least one vent hole 31 is covered with an isolation mesh 50.

[0017] The vibration absorption member 40 is disposed in the damping space 21 in the internal chamber 20 of the electronic device 10, so as to reduce the resonance influence of the electroacoustic transducer module 30 on the electronic device 10 during operation. The vibration absorption structure can obviously reduce the impact on the shell of the electronic device 10 caused by airflow turbulence generated during operation of the electroacoustic transducer module 30, thereby reducing the resonance of the electronic device 10. Meanwhile, by covering an end face of the electroacoustic transducer module 30 facing the damping space 21 with the isolation mesh 50, the vibration absorption member 40 can be effectively isolated from the electroacoustic transducer module 30 to prevent the vibration absorption member 40 from entering the electroacoustic transducer module 30.

[0018] Specifically, as illustrated in FIG. 1, the electroacoustic transducer module 30 is fixed on a middle frame 11, and the internal chamber 20 is formed between the middle frame 11 and a rear cover 13 for accommodating members of the electronic device 10. In this embodiment, a cover 12 is disposed between the middle frame 11 and the rear cover 13 to fix the members of the electronic device 10, the damping space 21 is formed between the cover 12 and the rear cover 13, and the vibration absorption member 40 is disposed in the damping space 21. The internal space of the electroacoustic transducer module 30 is communicated with the damping space 21. An end face of the electroacoustic transducer module 30 facing the damping space 21 is provided with a plurality of vent holes 31, through which the airflow in the electroacoustic transducer module 30 is exhausted or drawn in. The vent holes 31 are covered with the isolation mesh 50 to prevent the vibration absorption member from entering the electroacoustic transducer module 30. In this embodiment, the electroacoustic transducer module 30 is a speaker module.

[0019] Further, as illustrated in FIG. 2, in this embodiment, the electroacoustic transducer module 30 is fixed on the middle frame 11, and a processor 81 and a lens module 82 are also fixed on the middle frame 11. The damping space 21 is defined by the middle frame 11, the rear cover 13, the electroacoustic transducer module 30, the processor 81 and the lens module 82. The vibration absorption member 40 is disposed in the damping space 21.

[0020] In a feasible embodiment of the present disclosure, as illustrated in FIGS. 3 and 4, the damping space 21 includes a plurality of subspaces 22. Each of the subspaces 22 is internally provided with the vibration absorption member 40, or some of the subspaces 22 are internally provided with the vibration absorption member 40.

[0021] Inside the electronic device 10, due to the mounting positions of various members, the damping space 21 is generally partitioned into a plurality of subspaces 22. By disposing the vibration absorption member 40 in some or all of the subspaces 22, the impact on the shell of the electronic device 10 caused by airflow turbulence generated during operation of the electroacoustic transducer module 30 can be further reduced, thereby further optimizing the user experience.

[0022] Specifically, as illustrated in FIG. 3, in this embodiment, a battery 83 is mounted in the damping space 21 between the cover 12 and the rear cover 13, and partitions the damping space 21 into two subspaces 22 communicated with each other, with each subspace 22 being internally provided with the vibration absorption member 40. The embodiment illustrated in FIG. 3 is merely illustrative. In practice, the electronic device 10 may also have other internal members, and the interior of the damping space 21 is partitioned into a plurality of subspaces 22 each internally provided with the vibration absorption member 40. In another feasible embodiment, the vibration absorption member 40 may be disposed in some of the subspaces 22 according to actual size of the internal space of the electronic device 10 and the damping requirements.

[0023] Further, as illustrated in FIG. 4, in this embodiment, the battery 83 is mounted in the damping space 21 between the middle frame 11 and the rear cover 13, and the processor 81 and the lens module 82 are also fixed on the middle frame 11. The damping space 21 is partitioned into a plurality of subspaces 22 by the battery 83, the processor 81 and the lens module 82, and each subspace 22 is provided with the vibration absorption member 40. The embodiment illustrated in FIG. 4 is merely illustrative and the present disclosure is not limited thereto. In another feasible embodiment, the vibration absorption member 40 may be disposed in some of the subspaces 22 according to actual size of the internal space of the electronic device 10 and the damping requirements.

[0024] According to an embodiment of the present disclosure, the vibration absorption member 40 is filled within the damping space 21, or the vibration absorption member 40 is a vibration absorption coating layer formed on an inner wall of the damping space 21 by means of dipping, coating or sticking.

[0025] Specifically, in this embodiment, the vibration absorption member 40 is directly filled within the damping space 21. In another feasible embodiment, the vibration absorption member 40 is a vibration absorption coating layer formed on the inner wall of the damping space 21 by means of dipping, coating or sticking.

[0026] According to an embodiment of the present disclosure, the vibration absorption member 40 is a granular, flaky, or fibrous structure made of porous carbon material. Further, the porous carbon material is activated carbon, graphene, or carbon nanotubes.

[0027] Specifically, in a feasible embodiment, the vibration absorption member 40 is processed from porous carbon material into a granular structure, flaky structure, or fibrous structure. This granular, flaky, or fibrous vibration absorption member 40 is directly filled in the damping space 21 of the electronic device 10.

[0028] In another feasible embodiment, the vibration absorption member 40 is a granular, flaky, or fibrous structure formed by porous carbon material and a matrix medium, and the matrix medium is made of sound absorption cotton, foam, carbon skeleton, or organic skeleton.

[0029] Specifically, the matrix medium and the porous carbon material may be bonded by means of spraying or the like. For example, when the matrix medium is a granular or flaky structure, a uniformly dispersed suspension may first be prepared by mixing the porous carbon material, an adhesive and a solvent. This suspension is then combined with a granular matrix medium by means of dipping or spraying, or sprayed and dipped on a surface of a flaky matrix medium. The prepared finished product, i.e., the vibration absorption member 40, is obtained after subsequent drying and curing.

[0030] In order to verify that the vibration absorption member 40 filled between the speaker module and the rear cover 13 in the present disclosure can effectively reduce the impact on the rear cover 13 caused by airflow turbulence generated during operation of the speaker module, and verify the effects of different materials of the vibration absorption member 40, sounding vibration tests are conducted on three groups of vibration absorption structures under different conditions, and the specific test conditions are as follows.

[0031] The vibration absorption structures having the damping spaces 21 filled with different materials are subjected to a sounding vibration test, respectively, and a maximum acceleration value of the rear cover 13 of each group of vibration absorption structures is measured under the same test environment. Test Group 1: the vibration absorption structure of the present disclosure having a speaker module is adopted, in which the damping space 21 is not filled with the vibration absorption member 40; Test Group 2: the vibration absorption structure of the present disclosure having the speaker module is adopted, in which the damping space 21 is filled with the vibration absorption member 40 which is made of zeolite material; and Test Group 3: the vibration absorption structure of the present disclosure having the speaker module is adopted, in which the damping space 21 is filled with the vibration absorption member 40 which is made of porous carbon material.

[0032] Test Conditions: the effective radiation area of the diaphragm of each speaker module is 70 mm 2< , the resonant frequency of each speaker module is 800 Hz, the maximum amplitude of each speaker module is 0.5 mm, the volume of the rear chamber of each speaker module is 4 cm 3< (in which length × width × height of the rear chamber is 150 mm × 60 mm × 0.45 mm), and the thickness of the rear cover 13 is 0.6 mm.

[0033] The test results are shown in the following table: Effective radiation area of diaphragmResonant frequency of speakerMaximum amplitudeVolume of rear chamberThickness of rear coverMaximum acceleration of rear coverTest Group 170 mm 2< 800 Hz0.5 mm4 cm 3< 0.6 mm2.43*10 3< mm / s 2< Test Group 270 mm 2< 800 Hz0.5 mm4 cm 3< (filled with zeolite)0.6 mm0.05*10 3< mm / s 2< Test Group 370 mm 2< 800 Hz0.5 mm4 cm 3< (filled with porous carbon)0.6 mm0.01*10 3< mm / s 2<

[0034] As can be seen from the maximum acceleration of the rear cover 13 of each test group, the maximum acceleration of the Test Group 3 filled with the vibration absorption member 40 (zeolite) is much smaller than that of either of the other three test groups. Therefore, by filling the vibration absorption member 40 (zeolite) between the speaker module and the rear cover 13, the impact on the rear cover 13 caused by airflow turbulence generated during operation of the speaker module can be effectively reduced, thereby reducing the resonance of the electronic device 10. In addition, the vibration absorption member 40 made of the porous carbon material achieves a better vibration absorption effect compared with those made of other materials.

[0035] In a feasible embodiment of the present disclosure, as illustrated in FIGS. 1 and 3, the isolation mesh 50 is closely attached to and covers the at least one vent hole 31. By closely attaching the isolation mesh 50 to cover the vent hole 31 of the electroacoustic transducer module 30, the space occupied by the isolation mesh 50 inside the electronic device 10 can be effectively reduced.

[0036] In another feasible embodiment of the present disclosure, as illustrated in FIGS. 2 and 4, the isolation mesh 50 is disposed to cover an end of the electroacoustic transducer module 30 facing the damping space 21, with a gap maintained between the isolation mesh 50 and an end face of the electroacoustic transducer module 30 provided with the at least one vent hole 31. By employing the whole isolation mesh 50 to cover the end of the electroacoustic transducer module 30, the electroacoustic transducer module 30 can be more effectively protected, and the vibration absorption member 40 can be prevented from entering the electroacoustic transducer module 30.

[0037] In a feasible embodiment of the present disclosure, since the vibration absorption member 40 made of porous carbon material is prone to adsorb moisture, the isolation mesh 50 may be a waterproof breathable film to prevent moisture from coming into contact with the porous carbon material.Embodiment 2

[0038] The present disclosure further provides another vibration absorption structure assembled in an electronic device 10. As illustrated in FIGS. 5 to 7, the electronic device 10 includes an internal chamber 20 in which at least one member is placed. The vibration absorption structure includes at least one screen vibration excitation module 60 and a vibration absorption member 40. The internal chamber 20 is partitioned by the at least one screen vibration excitation module 60 and the at least one member of the electronic device 10 to form a damping space 21. The vibration absorption member 40 includes an isolation mesh 50 and a vibration absorption medium 70. The vibration absorption medium 70 is located in the damping space 21, and the isolation mesh 50 is configured to isolate the vibration absorption medium 70 from the at least one screen vibration excitation module 60.

[0039] The vibration absorption member 40 is disposed in the damping space 21 in the internal chamber 20 of the electronic device 10, so as to reduce the resonance influence of the screen vibration excitation module 60 on the electronic device 10 during operation. The vibration absorption structure can obviously reduce the impact on the shell of the electronic device 10 caused by airflow turbulence generated during operation of the screen vibration excitation module 60, thereby reducing the resonance of the electronic device 10. Meanwhile, by disposing the isolation mesh 50 between the screen vibration excitation module 60 and the vibration absorption medium 70, the screen vibration excitation module 60 and the vibration absorption medium 70 can be effectively protected.

[0040] Specifically, as illustrated in FIG. 5, a lower part of a screen 90 of the electronic device 10 is provided with a plurality of screen vibration excitation modules 60 for driving the vibration sounding of the screen 90. The internal chamber 20 is formed between the screen 90 and a rear cover 13 to mount members of the electronic device 10. A middle frame 11 is mounted between the screen 90 and the rear cover 13. A processor 81 and a lens module 82 are fixedly mounted on the middle frame 11. The screen 90, the middle frame 11, the processor 81 and the lens module 82 define the damping space 21 inside the internal chamber 20, and the vibration absorption member 40 including the isolation mesh 50 and the vibration absorption medium 70 is disposed in the damping space 21. In this embodiment, the isolation mesh 50 wraps the screen vibration excitation module 60, the vibration absorption medium 70 is disposed in the damping space 21 outside the isolation mesh 50, and the isolation mesh 50 separates the vibration absorption medium 70 from the screen vibration excitation module 60.

[0041] In a feasible embodiment of the present disclosure, as illustrated in FIG. 5, the damping space 21 includes a plurality of subspaces 22. Each of the subspaces 22 is internally provided with the vibration absorption medium 70, or some of the subspaces 22 are internally provided with the vibration absorption member 40.

[0042] Inside the electronic device 10, due to the mounting positions of various members, the damping space 21 is generally partitioned into a plurality of subspaces 22. By disposing the vibration absorption medium 70 in some or all of the subspaces 22, the impact on the shell of the electronic device 10 caused by airflow turbulence generated during operation of the screen vibration excitation module 60 can be further reduced, thereby further optimizing the user experience.

[0043] Specifically, as illustrated in FIG. 5, in this embodiment, the processor 81 and the lens module 82 fixedly mounted on the middle frame 11 partition the damping space 21 into a plurality of subspaces 22 each internally provided with the vibration absorption medium 70. The embodiment illustrated in FIG. 5 is merely illustrative. In practice, the electronic device 10 may also have other internal members, and the interior of the damping space 21 is partitioned into a plurality of subspaces 22 each internally provided with the vibration absorption medium 70. In another feasible embodiment of the present disclosure, the vibration absorption member 40 may be disposed in some of the subspaces 22 according to actual size of the internal space of the electronic device 10 and the damping requirements.

[0044] In an exemplary embodiment of the present disclosure, as illustrated in FIGS. 6 and 7, the isolation mesh 50 is in sealed connection with the members in the electronic device 10 to form the internal space in which the vibration absorption medium 70 is filled. The isolation mesh 50 wraps the vibration absorption medium 70 to isolate the vibration absorption medium 70 from the screen vibration excitation module 60.

[0045] Specifically, as illustrated in FIG. 6, in this embodiment, the isolation mesh 50 is in sealed connection with the middle frame 11 of the electronic device 10, with an internal space formed therebetween to be filled with the vibration absorption medium 70, and the isolation mesh 50 is in a relaxed state. Alternatively, as illustrated in FIG. 7, in this embodiment, the isolation mesh 50 is in a tensioned state to effectively reduce the space volume of the vibration absorption medium 70.

[0046] According to an embodiment of the present disclosure, the vibration absorption medium 70 is a granular, flaky, or fibrous structure made of porous carbon material. Further, the porous carbon material is activated carbon, graphene, or carbon nanotubes.

[0047] Specifically, in a feasible embodiment, the vibration absorption medium 70 is processed from porous carbon material into a granular structure, flaky structure, or fibrous structure. This granular, flaky, or fibrous vibration absorption medium 70 is directly filled in the damping space 21 of the electronic device 10.

[0048] In another feasible embodiment, the vibration absorption medium 70 is a granular, flaky, or fibrous structure formed by porous carbon material and a matrix medium, and the matrix medium is made of sound absorption cotton, foam, carbon skeleton, or organic skeleton.

[0049] Specifically, the matrix medium and the porous carbon material may be bonded by means of spraying or the like. For example, when the matrix medium is a granular or flaky structure, a uniformly dispersed suspension may first be prepared by mixing the porous carbon material, an adhesive and a solvent. This suspension is then combined with a granular matrix medium by means of dipping or spraying, or sprayed and dipped on a surface of a flaky matrix medium. The prepared finished product, i.e., the vibration absorption medium 70, is obtained after subsequent drying and curing.

[0050] The vibration absorption effect tests for the vibration absorption medium 70 made of different materials have been described in detail in Embodiment 1 through the test data, and will not be repeated here.Embodiment 3

[0051] The present disclosure further provides an electronic device 10, which includes a shell and the afore-mentioned vibration absorption structure mounted in the shell. The specific structure, the working principle and the advantageous effects of the vibration absorption structure are the same as those of the vibration absorption structures according to Embodiment 1 and Embodiment 2, and will not be repeated here. The vibration absorption structure inside the electronic device 10 can significantly mitigate the resonance during the use of the electronic device 10 and optimize the user experience.

[0052] Specifically, the electronic device 10 may be a mobile phone, an audio device, a notebook computer, a tablet computer, a teleconferencing device, a wearable device or an AR / VR device, an automobile, a smart home device, and the like with the afore-mentioned vibration absorption structure, and is not specifically limited here.

[0053] The specific embodiments described above further explain the objectives, the technical solutions and the advantageous effects of the present disclosure in detail. It should be understood that those described above are only specific embodiments of the present disclosure and are not intended to limit the protection scope of the present disclosure. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.

Examples

embodiment 1

[0016]The present disclosure provides a vibration absorption structure assembled in an electronic device 10. As illustrated in FIGS. 1 and 2, the electronic device 10 includes an internal chamber 20 in which at least one member is placed. The vibration absorption structure includes at least one electroacoustic transducer module 30 and a vibration absorption member 40. At least part of the electroacoustic transducer module 30 is located in the internal chamber 20. The internal chamber 20 is partitioned by the at least one member in the electronic device 10 and the part of the electroacoustic transducer module 30 to form a damping space 21. The vibration absorption member 40 is located in the damping space. The electroacoustic transducer module 30 is provided with at least one vent hole 31 communicated with the damping space 21, and the at least one vent hole 31 is covered with an isolation mesh 50.

[0017]The vibration absorption member 40 is disposed in the damping space 21 in the int...

embodiment 2

[0038]The present disclosure further provides another vibration absorption structure assembled in an electronic device 10. As illustrated in FIGS. 5 to 7, the electronic device 10 includes an internal chamber 20 in which at least one member is placed. The vibration absorption structure includes at least one screen vibration excitation module 60 and a vibration absorption member 40. The internal chamber 20 is partitioned by the at least one screen vibration excitation module 60 and the at least one member of the electronic device 10 to form a damping space 21. The vibration absorption member 40 includes an isolation mesh 50 and a vibration absorption medium 70. The vibration absorption medium 70 is located in the damping space 21, and the isolation mesh 50 is configured to isolate the vibration absorption medium 70 from the at least one screen vibration excitation module 60.

[0039]The vibration absorption member 40 is disposed in the damping space 21 in the internal chamber 20 of the ...

embodiment 3

[0051]The present disclosure further provides an electronic device 10, which includes a shell and the afore-mentioned vibration absorption structure mounted in the shell. The specific structure, the working principle and the advantageous effects of the vibration absorption structure are the same as those of the vibration absorption structures according to Embodiment 1 and Embodiment 2, and will not be repeated here. The vibration absorption structure inside the electronic device 10 can significantly mitigate the resonance during the use of the electronic device 10 and optimize the user experience.

[0052]Specifically, the electronic device 10 may be a mobile phone, an audio device, a notebook computer, a tablet computer, a teleconferencing device, a wearable device or an AR / VR device, an automobile, a smart home device, and the like with the afore-mentioned vibration absorption structure, and is not specifically limited here.

RELATED APPLICATION

[0001] The present disclosure claims priority to Chinese Utility Model Patent Application No. 202320170994.6, filed on January 20, 2023, and entitled "vibration absorption structure and electronic device".TECHNICAL FIELD

[0002] The present disclosure relates to the field of acoustoelectric technologies, and in particular to a vibration absorption structure and an electronic device.BACKGROUND

[0003] In modern mainstream electronic devices, the pursuit of high-quality audio performance from speakers or receivers has led to prevalent adoption of open acoustic chamber designs. This configuration features non-sealed rear chambers in speaker modules or receiver modules, allowing airflow into internal acoustic chambers of devices. However, turbulent airflow frequently induces resonance of the device's shell, resulting in perceptible vibrations when the user holds the shell. The vibrations intensify with increasing sound volume, ultimately compromising user experience. Consequently, designing optimized acoustic chamber structures of electronic devices to enhance holding comfort remains a critical challenge requiring urgent resolution.

[0004] In existing technologies, one type of electronic device employs a semi-open chamber design, where a damping element is mounted on a leakage hole of the rear chamber to improve the compliance of the rear acoustic chamber while maintaining controllable leakage. This design can reduce resonance to some extent. Another type of electronic device in existing technologies adopts a design in which an acoustic guide channel is provided on the rear chamber of the speaker module and then is connected to an open acoustic chamber. By utilizing multiple directional changes and reflections within the vibration-damping channel, this design absorbs airflow vibration energy, thereby achieving airflow energy attenuation and mitigating shell resonance to a certain extent. However, both the semi-open chambers and chambers with acoustic guide channels can only mitigate shell resonance to a limited extent in practical applications. The shell resonance issue caused by the open acoustic chamber design in electronic devices still requires further resolution.SUMMARY

[0005] The present disclosure provides a vibration absorption structure and an electronic device. By filling a vibration absorption member in a damping space, the problem of the resonance of a shell of the electronic device caused by airflow turbulence due to vibration sounding can be solved, and the impact of the airflow on the shell can be reduced, thereby reducing the resonance of the electronic device and optimizing user experience.

[0006] The above objective of the present disclosure is mainly achieved by the following technical solutions.

[0007] The present disclosure provides a vibration absorption structure assembled in an electronic device. The electronic device includes an internal chamber in which at least one member is placed. The vibration absorption structure includes at least one electroacoustic transducer module and a vibration absorption member. At least part of the electroacoustic transducer module is located in the internal chamber. The internal chamber is partitioned by the at least one member in the electronic device and the part of the electroacoustic transducer module to form a damping space. The vibration absorption member is located within the damping space. The electroacoustic transducer module is provided with at least one vent hole communicated with the damping space, and the at least one vent hole is covered with an isolation mesh.

[0008] The present disclosure further provides another vibration absorption structure assembled in an electronic device. The electronic device includes an internal chamber in which at least one member is placed. The vibration absorption structure includes at least one screen vibration excitation module and a vibration absorption member. The internal chamber is partitioned by the at least one screen vibration excitation module and the at least one member of the electronic device to form a damping space. The vibration absorption member includes an isolation mesh and a vibration absorption medium. The vibration absorption medium is located in the damping space, and the isolation mesh is configured to isolate the vibration absorption medium from the at least one screen vibration excitation module.

[0009] The present disclosure further provides an electronic device, including a shell and the afore-mentioned vibration absorption structure mounted in the shell.

[0010] Compared with the prior art, the technical solutions of the present disclosure have the following characteristics and advantages: By filling the vibration absorption member in the electronic device, the impact of the internal airflow on the shell of the electronic device is reduced, thereby reducing the resonance of the electronic device, optimizing the user experience and enhancing the competitiveness of the electronic device in the market.BRIEF DESCRIPTION OF THE DRAWINGS

[0011] For a clearer illustration of technical features in the embodiments of the present disclosure or the prior art, a brief description of the drawings for the embodiments or the prior art will be given below. The drawings described below involve only some embodiments of this disclosure. For those of ordinary skill in the art, other drawings can be derived from these drawings without any inventive efforts. In the drawings: FIG. 1 illustrates a structural diagram of the first embodiment of the present disclosure; FIG. 2 illustrates a structural diagram of the second embodiment of the present disclosure; FIG. 3 illustrates a structural diagram of the third embodiment of the present disclosure; FIG. 4 illustrates a structural diagram of the fourth embodiment of the present disclosure; FIG. 5 illustrates a structural diagram of the fifth embodiment of the present disclosure; FIG. 6 illustrates a structural diagram of the sixth embodiment of the present disclosure; and FIG. 7 illustrates a structural diagram of the seventh embodiment of the present disclosure. Reference numerals:

[0012] 10: electronic device; 11: middle frame; 12: cover; 13: rear cover; 20: internal chamber; 21: damping space; 22: subspace; 30: electroacoustic transducer module; 31: vent hole; 40: vibration absorption member; 50: isolation mesh; 60: screen vibration excitation module; 70: vibration absorption medium; 81: processor; 82: lens module; 83: battery; 90: screen.DETAILED DESCRIPTION OF THE EMBODIMENTS

[0013] For a clearer understanding of the technical features of the present application, a clear and complete description of the technical features of the embodiments of the present application will be set forth with reference to the drawings. The described embodiments are only a part, rather than all, of the embodiments of the present application. All other embodiments derived by persons skilled in the art from the embodiments of the present application without making inventive efforts shall fall within the scope of the present application.

[0014] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on another element or there may be an intervening element. When an element is considered to be "connected to" another element, it may be directly connected to another element or there may be an intervening element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustration purposes only and do not indicate a unique embodiment.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by persons skilled in the technical field of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing the specific embodiments, and are not intended to limit the present disclosure. As used herein, the term "and / or" includes any and all combinations of one or more associated listed items.Embodiment 1

[0016] The present disclosure provides a vibration absorption structure assembled in an electronic device 10. As illustrated in FIGS. 1 and 2, the electronic device 10 includes an internal chamber 20 in which at least one member is placed. The vibration absorption structure includes at least one electroacoustic transducer module 30 and a vibration absorption member 40. At least part of the electroacoustic transducer module 30 is located in the internal chamber 20. The internal chamber 20 is partitioned by the at least one member in the electronic device 10 and the part of the electroacoustic transducer module 30 to form a damping space 21. The vibration absorption member 40 is located in the damping space. The electroacoustic transducer module 30 is provided with at least one vent hole 31 communicated with the damping space 21, and the at least one vent hole 31 is covered with an isolation mesh 50.

[0017] The vibration absorption member 40 is disposed in the damping space 21 in the internal chamber 20 of the electronic device 10, so as to reduce the resonance influence of the electroacoustic transducer module 30 on the electronic device 10 during operation. The vibration absorption structure can obviously reduce the impact on the shell of the electronic device 10 caused by airflow turbulence generated during operation of the electroacoustic transducer module 30, thereby reducing the resonance of the electronic device 10. Meanwhile, by covering an end face of the electroacoustic transducer module 30 facing the damping space 21 with the isolation mesh 50, the vibration absorption member 40 can be effectively isolated from the electroacoustic transducer module 30 to prevent the vibration absorption member 40 from entering the electroacoustic transducer module 30.

[0018] Specifically, as illustrated in FIG. 1, the electroacoustic transducer module 30 is fixed on a middle frame 11, and the internal chamber 20 is formed between the middle frame 11 and a rear cover 13 for accommodating members of the electronic device 10. In this embodiment, a cover 12 is disposed between the middle frame 11 and the rear cover 13 to fix the members of the electronic device 10, the damping space 21 is formed between the cover 12 and the rear cover 13, and the vibration absorption member 40 is disposed in the damping space 21. The internal space of the electroacoustic transducer module 30 is communicated with the damping space 21. An end face of the electroacoustic transducer module 30 facing the damping space 21 is provided with a plurality of vent holes 31, through which the airflow in the electroacoustic transducer module 30 is exhausted or drawn in. The vent holes 31 are covered with the isolation mesh 50 to prevent the vibration absorption member from entering the electroacoustic transducer module 30. In this embodiment, the electroacoustic transducer module 30 is a speaker module.

[0019] Further, as illustrated in FIG. 2, in this embodiment, the electroacoustic transducer module 30 is fixed on the middle frame 11, and a processor 81 and a lens module 82 are also fixed on the middle frame 11. The damping space 21 is defined by the middle frame 11, the rear cover 13, the electroacoustic transducer module 30, the processor 81 and the lens module 82. The vibration absorption member 40 is disposed in the damping space 21.

[0020] In a feasible embodiment of the present disclosure, as illustrated in FIGS. 3 and 4, the damping space 21 includes a plurality of subspaces 22. Each of the subspaces 22 is internally provided with the vibration absorption member 40, or some of the subspaces 22 are internally provided with the vibration absorption member 40.

[0021] Inside the electronic device 10, due to the mounting positions of various members, the damping space 21 is generally partitioned into a plurality of subspaces 22. By disposing the vibration absorption member 40 in some or all of the subspaces 22, the impact on the shell of the electronic device 10 caused by airflow turbulence generated during operation of the electroacoustic transducer module 30 can be further reduced, thereby further optimizing the user experience.

[0022] Specifically, as illustrated in FIG. 3, in this embodiment, a battery 83 is mounted in the damping space 21 between the cover 12 and the rear cover 13, and partitions the damping space 21 into two subspaces 22 communicated with each other, with each subspace 22 being internally provided with the vibration absorption member 40. The embodiment illustrated in FIG. 3 is merely illustrative. In practice, the electronic device 10 may also have other internal members, and the interior of the damping space 21 is partitioned into a plurality of subspaces 22 each internally provided with the vibration absorption member 40. In another feasible embodiment, the vibration absorption member 40 may be disposed in some of the subspaces 22 according to actual size of the internal space of the electronic device 10 and the damping requirements.

[0023] Further, as illustrated in FIG. 4, in this embodiment, the battery 83 is mounted in the damping space 21 between the middle frame 11 and the rear cover 13, and the processor 81 and the lens module 82 are also fixed on the middle frame 11. The damping space 21 is partitioned into a plurality of subspaces 22 by the battery 83, the processor 81 and the lens module 82, and each subspace 22 is provided with the vibration absorption member 40. The embodiment illustrated in FIG. 4 is merely illustrative and the present disclosure is not limited thereto. In another feasible embodiment, the vibration absorption member 40 may be disposed in some of the subspaces 22 according to actual size of the internal space of the electronic device 10 and the damping requirements.

[0024] According to an embodiment of the present disclosure, the vibration absorption member 40 is filled within the damping space 21, or the vibration absorption member 40 is a vibration absorption coating layer formed on an inner wall of the damping space 21 by means of dipping, coating or sticking.

[0025] Specifically, in this embodiment, the vibration absorption member 40 is directly filled within the damping space 21. In another feasible embodiment, the vibration absorption member 40 is a vibration absorption coating layer formed on the inner wall of the damping space 21 by means of dipping, coating or sticking.

[0026] According to an embodiment of the present disclosure, the vibration absorption member 40 is a granular, flaky, or fibrous structure made of porous carbon material. Further, the porous carbon material is activated carbon, graphene, or carbon nanotubes.

[0027] Specifically, in a feasible embodiment, the vibration absorption member 40 is processed from porous carbon material into a granular structure, flaky structure, or fibrous structure. This granular, flaky, or fibrous vibration absorption member 40 is directly filled in the damping space 21 of the electronic device 10.

[0028] In another feasible embodiment, the vibration absorption member 40 is a granular, flaky, or fibrous structure formed by porous carbon material and a matrix medium, and the matrix medium is made of sound absorption cotton, foam, carbon skeleton, or organic skeleton.

[0029] Specifically, the matrix medium and the porous carbon material may be bonded by means of spraying or the like. For example, when the matrix medium is a granular or flaky structure, a uniformly dispersed suspension may first be prepared by mixing the porous carbon material, an adhesive and a solvent. This suspension is then combined with a granular matrix medium by means of dipping or spraying, or sprayed and dipped on a surface of a flaky matrix medium. The prepared finished product, i.e., the vibration absorption member 40, is obtained after subsequent drying and curing.

[0030] In order to verify that the vibration absorption member 40 filled between the speaker module and the rear cover 13 in the present disclosure can effectively reduce the impact on the rear cover 13 caused by airflow turbulence generated during operation of the speaker module, and verify the effects of different materials of the vibration absorption member 40, sounding vibration tests are conducted on three groups of vibration absorption structures under different conditions, and the specific test conditions are as follows.

[0031] The vibration absorption structures having the damping spaces 21 filled with different materials are subjected to a sounding vibration test, respectively, and a maximum acceleration value of the rear cover 13 of each group of vibration absorption structures is measured under the same test environment. Test Group 1: the vibration absorption structure of the present disclosure having a speaker module is adopted, in which the damping space 21 is not filled with the vibration absorption member 40; Test Group 2: the vibration absorption structure of the present disclosure having the speaker module is adopted, in which the damping space 21 is filled with the vibration absorption member 40 which is made of zeolite material; and Test Group 3: the vibration absorption structure of the present disclosure having the speaker module is adopted, in which the damping space 21 is filled with the vibration absorption member 40 which is made of porous carbon material.

[0032] Test Conditions: the effective radiation area of the diaphragm of each speaker module is 70 mm 2< , the resonant frequency of each speaker module is 800 Hz, the maximum amplitude of each speaker module is 0.5 mm, the volume of the rear chamber of each speaker module is 4 cm 3< (in which length × width × height of the rear chamber is 150 mm × 60 mm × 0.45 mm), and the thickness of the rear cover 13 is 0.6 mm.

[0033] The test results are shown in the following table: Effective radiation area of diaphragmResonant frequency of speakerMaximum amplitudeVolume of rear chamberThickness of rear coverMaximum acceleration of rear coverTest Group 170 mm 2< 800 Hz0.5 mm4 cm 3< 0.6 mm2.43*10 3< mm / s 2< Test Group 270 mm 2< 800 Hz0.5 mm4 cm 3< (filled with zeolite)0.6 mm0.05*10 3< mm / s 2< Test Group 370 mm 2< 800 Hz0.5 mm4 cm 3< (filled with porous carbon)0.6 mm0.01*10 3< mm / s 2<

[0034] As can be seen from the maximum acceleration of the rear cover 13 of each test group, the maximum acceleration of the Test Group 3 filled with the vibration absorption member 40 (zeolite) is much smaller than that of either of the other three test groups. Therefore, by filling the vibration absorption member 40 (zeolite) between the speaker module and the rear cover 13, the impact on the rear cover 13 caused by airflow turbulence generated during operation of the speaker module can be effectively reduced, thereby reducing the resonance of the electronic device 10. In addition, the vibration absorption member 40 made of the porous carbon material achieves a better vibration absorption effect compared with those made of other materials.

[0035] In a feasible embodiment of the present disclosure, as illustrated in FIGS. 1 and 3, the isolation mesh 50 is closely attached to and covers the at least one vent hole 31. By closely attaching the isolation mesh 50 to cover the vent hole 31 of the electroacoustic transducer module 30, the space occupied by the isolation mesh 50 inside the electronic device 10 can be effectively reduced.

[0036] In another feasible embodiment of the present disclosure, as illustrated in FIGS. 2 and 4, the isolation mesh 50 is disposed to cover an end of the electroacoustic transducer module 30 facing the damping space 21, with a gap maintained between the isolation mesh 50 and an end face of the electroacoustic transducer module 30 provided with the at least one vent hole 31. By employing the whole isolation mesh 50 to cover the end of the electroacoustic transducer module 30, the electroacoustic transducer module 30 can be more effectively protected, and the vibration absorption member 40 can be prevented from entering the electroacoustic transducer module 30.

[0037] In a feasible embodiment of the present disclosure, since the vibration absorption member 40 made of porous carbon material is prone to adsorb moisture, the isolation mesh 50 may be a waterproof breathable film to prevent moisture from coming into contact with the porous carbon material.Embodiment 2

[0038] The present disclosure further provides another vibration absorption structure assembled in an electronic device 10. As illustrated in FIGS. 5 to 7, the electronic device 10 includes an internal chamber 20 in which at least one member is placed. The vibration absorption structure includes at least one screen vibration excitation module 60 and a vibration absorption member 40. The internal chamber 20 is partitioned by the at least one screen vibration excitation module 60 and the at least one member of the electronic device 10 to form a damping space 21. The vibration absorption member 40 includes an isolation mesh 50 and a vibration absorption medium 70. The vibration absorption medium 70 is located in the damping space 21, and the isolation mesh 50 is configured to isolate the vibration absorption medium 70 from the at least one screen vibration excitation module 60.

[0039] The vibration absorption member 40 is disposed in the damping space 21 in the internal chamber 20 of the electronic device 10, so as to reduce the resonance influence of the screen vibration excitation module 60 on the electronic device 10 during operation. The vibration absorption structure can obviously reduce the impact on the shell of the electronic device 10 caused by airflow turbulence generated during operation of the screen vibration excitation module 60, thereby reducing the resonance of the electronic device 10. Meanwhile, by disposing the isolation mesh 50 between the screen vibration excitation module 60 and the vibration absorption medium 70, the screen vibration excitation module 60 and the vibration absorption medium 70 can be effectively protected.

[0040] Specifically, as illustrated in FIG. 5, a lower part of a screen 90 of the electronic device 10 is provided with a plurality of screen vibration excitation modules 60 for driving the vibration sounding of the screen 90. The internal chamber 20 is formed between the screen 90 and a rear cover 13 to mount members of the electronic device 10. A middle frame 11 is mounted between the screen 90 and the rear cover 13. A processor 81 and a lens module 82 are fixedly mounted on the middle frame 11. The screen 90, the middle frame 11, the processor 81 and the lens module 82 define the damping space 21 inside the internal chamber 20, and the vibration absorption member 40 including the isolation mesh 50 and the vibration absorption medium 70 is disposed in the damping space 21. In this embodiment, the isolation mesh 50 wraps the screen vibration excitation module 60, the vibration absorption medium 70 is disposed in the damping space 21 outside the isolation mesh 50, and the isolation mesh 50 separates the vibration absorption medium 70 from the screen vibration excitation module 60.

[0041] In a feasible embodiment of the present disclosure, as illustrated in FIG. 5, the damping space 21 includes a plurality of subspaces 22. Each of the subspaces 22 is internally provided with the vibration absorption medium 70, or some of the subspaces 22 are internally provided with the vibration absorption member 40.

[0042] Inside the electronic device 10, due to the mounting positions of various members, the damping space 21 is generally partitioned into a plurality of subspaces 22. By disposing the vibration absorption medium 70 in some or all of the subspaces 22, the impact on the shell of the electronic device 10 caused by airflow turbulence generated during operation of the screen vibration excitation module 60 can be further reduced, thereby further optimizing the user experience.

[0043] Specifically, as illustrated in FIG. 5, in this embodiment, the processor 81 and the lens module 82 fixedly mounted on the middle frame 11 partition the damping space 21 into a plurality of subspaces 22 each internally provided with the vibration absorption medium 70. The embodiment illustrated in FIG. 5 is merely illustrative. In practice, the electronic device 10 may also have other internal members, and the interior of the damping space 21 is partitioned into a plurality of subspaces 22 each internally provided with the vibration absorption medium 70. In another feasible embodiment of the present disclosure, the vibration absorption member 40 may be disposed in some of the subspaces 22 according to actual size of the internal space of the electronic device 10 and the damping requirements.

[0044] In an exemplary embodiment of the present disclosure, as illustrated in FIGS. 6 and 7, the isolation mesh 50 is in sealed connection with the members in the electronic device 10 to form the internal space in which the vibration absorption medium 70 is filled. The isolation mesh 50 wraps the vibration absorption medium 70 to isolate the vibration absorption medium 70 from the screen vibration excitation module 60.

[0045] Specifically, as illustrated in FIG. 6, in this embodiment, the isolation mesh 50 is in sealed connection with the middle frame 11 of the electronic device 10, with an internal space formed therebetween to be filled with the vibration absorption medium 70, and the isolation mesh 50 is in a relaxed state. Alternatively, as illustrated in FIG. 7, in this embodiment, the isolation mesh 50 is in a tensioned state to effectively reduce the space volume of the vibration absorption medium 70.

[0046] According to an embodiment of the present disclosure, the vibration absorption medium 70 is a granular, flaky, or fibrous structure made of porous carbon material. Further, the porous carbon material is activated carbon, graphene, or carbon nanotubes.

[0047] Specifically, in a feasible embodiment, the vibration absorption medium 70 is processed from porous carbon material into a granular structure, flaky structure, or fibrous structure. This granular, flaky, or fibrous vibration absorption medium 70 is directly filled in the damping space 21 of the electronic device 10.

[0048] In another feasible embodiment, the vibration absorption medium 70 is a granular, flaky, or fibrous structure formed by porous carbon material and a matrix medium, and the matrix medium is made of sound absorption cotton, foam, carbon skeleton, or organic skeleton.

[0049] Specifically, the matrix medium and the porous carbon material may be bonded by means of spraying or the like. For example, when the matrix medium is a granular or flaky structure, a uniformly dispersed suspension may first be prepared by mixing the porous carbon material, an adhesive and a solvent. This suspension is then combined with a granular matrix medium by means of dipping or spraying, or sprayed and dipped on a surface of a flaky matrix medium. The prepared finished product, i.e., the vibration absorption medium 70, is obtained after subsequent drying and curing.

[0050] The vibration absorption effect tests for the vibration absorption medium 70 made of different materials have been described in detail in Embodiment 1 through the test data, and will not be repeated here.Embodiment 3

[0051] The present disclosure further provides an electronic device 10, which includes a shell and the afore-mentioned vibration absorption structure mounted in the shell. The specific structure, the working principle and the advantageous effects of the vibration absorption structure are the same as those of the vibration absorption structures according to Embodiment 1 and Embodiment 2, and will not be repeated here. The vibration absorption structure inside the electronic device 10 can significantly mitigate the resonance during the use of the electronic device 10 and optimize the user experience.

[0052] Specifically, the electronic device 10 may be a mobile phone, an audio device, a notebook computer, a tablet computer, a teleconferencing device, a wearable device or an AR / VR device, an automobile, a smart home device, and the like with the afore-mentioned vibration absorption structure, and is not specifically limited here.

[0053] The specific embodiments described above further explain the objectives, the technical solutions and the advantageous effects of the present disclosure in detail. It should be understood that those described above are only specific embodiments of the present disclosure and are not intended to limit the protection scope of the present disclosure. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.

Examples

embodiment 1

[0016]The present disclosure provides a vibration absorption structure assembled in an electronic device 10. As illustrated in FIGS. 1 and 2, the electronic device 10 includes an internal chamber 20 in which at least one member is placed. The vibration absorption structure includes at least one electroacoustic transducer module 30 and a vibration absorption member 40. At least part of the electroacoustic transducer module 30 is located in the internal chamber 20. The internal chamber 20 is partitioned by the at least one member in the electronic device 10 and the part of the electroacoustic transducer module 30 to form a damping space 21. The vibration absorption member 40 is located in the damping space. The electroacoustic transducer module 30 is provided with at least one vent hole 31 communicated with the damping space 21, and the at least one vent hole 31 is covered with an isolation mesh 50.

[0017]The vibration absorption member 40 is disposed in the damping space 21 in the int...

embodiment 2

[0038]The present disclosure further provides another vibration absorption structure assembled in an electronic device 10. As illustrated in FIGS. 5 to 7, the electronic device 10 includes an internal chamber 20 in which at least one member is placed. The vibration absorption structure includes at least one screen vibration excitation module 60 and a vibration absorption member 40. The internal chamber 20 is partitioned by the at least one screen vibration excitation module 60 and the at least one member of the electronic device 10 to form a damping space 21. The vibration absorption member 40 includes an isolation mesh 50 and a vibration absorption medium 70. The vibration absorption medium 70 is located in the damping space 21, and the isolation mesh 50 is configured to isolate the vibration absorption medium 70 from the at least one screen vibration excitation module 60.

[0039]The vibration absorption member 40 is disposed in the damping space 21 in the internal chamber 20 of the ...

embodiment 3

[0051]The present disclosure further provides an electronic device 10, which includes a shell and the afore-mentioned vibration absorption structure mounted in the shell. The specific structure, the working principle and the advantageous effects of the vibration absorption structure are the same as those of the vibration absorption structures according to Embodiment 1 and Embodiment 2, and will not be repeated here. The vibration absorption structure inside the electronic device 10 can significantly mitigate the resonance during the use of the electronic device 10 and optimize the user experience.

[0052]Specifically, the electronic device 10 may be a mobile phone, an audio device, a notebook computer, a tablet computer, a teleconferencing device, a wearable device or an AR / VR device, an automobile, a smart home device, and the like with the afore-mentioned vibration absorption structure, and is not specifically limited here.

Claims

1. A vibration absorption structure assembled in an electronic device, wherein the electronic device comprises an internal chamber in which at least one member is placed, the vibration absorption structure comprises at least one electroacoustic transducer module and a vibration absorption member, at least part of the electroacoustic transducer module is located in the internal chamber, the internal chamber is partitioned by the at least one member in the electronic device and the part of the electroacoustic transducer module to form a damping space, and the vibration absorption member is located in the damping space; wherein the electroacoustic transducer module is provided with at least one vent hole communicated with the damping space, and the at least one vent hole is covered with an isolation mesh.

2. The vibration absorption structure according to claim 1, wherein the damping space comprises a plurality of subspaces, each of which is internally provided with the vibration absorption member, or some of which are internally provided with the vibration absorption member.

3. The vibration absorption structure according to claim 1 or 2, wherein the vibration absorption member is filled within the damping space, or the vibration absorption member is a vibration absorption coating layer formed on an inner wall of the damping space by means of dipping, coating or sticking.

4. The vibration absorption structure according to claim 3, wherein the vibration absorption member is a granular, flaky, or fibrous structure made of porous carbon material.

5. The vibration absorption structure according to claim 4, wherein the porous carbon material is activated carbon, graphene, or carbon nanotubes.

6. The vibration absorption structure according to claim 3, wherein the vibration absorption member is a granular, flaky, or fibrous structure made of porous carbon material and a matrix medium.

7. The vibration absorption structure according to claim 6, wherein the matrix medium is made of sound-absorption cotton, foam, organic skeleton, hydrogel or aerogel.

8. The vibration absorption structure according to claim 1, wherein the isolation mesh is closely attached to and covers the at least one vent hole.

9. The vibration absorption structure according to claim 1, wherein the isolation mesh covers an end of the electroacoustic transducer module facing the damping space, with a gap maintained between the isolation mesh and an end face of the electroacoustic transducer module provided with the at least one vent hole.

10. A vibration absorption structure assembled in an electronic device, wherein the electronic device comprises an internal chamber in which at least one member is placed, the vibration absorption structure comprises at least one screen vibration excitation module and a vibration absorption member, the internal chamber is partitioned by the at least one screen vibration excitation module and the at least one member of the electronic device to form a damping space, the vibration absorption member comprises an isolation mesh and a vibration absorption medium, the vibration absorption medium is located in the damping space, and the isolation mesh is configured to isolate the vibration absorption medium from the at least one screen vibration excitation module.

11. The vibration absorption structure according to claim 10, wherein the damping space comprises a plurality of subspaces, each of which is internally provided with the vibration absorption medium, or some of which are internally provided with the vibration absorption medium.

12. The vibration absorption structure according to claim 10 or 11, wherein the isolation mesh is in sealed connection with the member in the electronic device to form an internal space in which the vibration absorption medium is filled.

13. The vibration absorption structure according to claim 10, wherein the vibration absorption medium is a granular, flaky, or fibrous structure made of porous carbon material.

14. The vibration absorption structure according to claim 13, wherein the porous carbon material is activated carbon, graphene, or carbon nanotubes.

15. The vibration absorption structure according to claim 10, wherein the vibration absorption medium is a granular, flaky, or fibrous structure made of porous carbon material and a matrix medium.

16. The vibration absorption structure according to claim 15, wherein the matrix medium is made of sound-absorption cotton, foam, organic skeleton, hydrogel or aerogel.

17. An electronic device, comprising a shell, and the vibration absorption structure according to any one of claims 1 to 16 mounted in the shell.

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