Ceramic component and method for producing a ceramic component

Abstract

The invention relates to a ceramic component, comprising: – a ceramic main body (10) with at least one metallization (20) on at least one surface (11) of the main body and at least one electrical lead (30) in electrical contact with the metallization (20), – an encapsulation (40) enclosing the ceramic main body (10), the at least one metallization (20) and also a first portion (31) of the at least one lead (30), the first portion (31) directly adjoining the metallization (20), – a protective layer (50) enclosing the encapsulation (40) and a second portion (32) of the at least one lead (30), the second portion (32) directly adjoining the first portion (31), and – an insulation layer (60) enclosing the protective layer (50) and a third portion (33) of the lead (30), the third portion (33) directly adjoining the second portion (32). The invention furthermore relates to a method for producing a ceramic component.

Description

[0001] Description

[0002] Ceramic component and method for producing a ceramic component

[0003] The application relates to a ceramic component and a method for producing a ceramic component.

[0004] Electroceramic components are known which are used as resistance elements in electronics. In particular, electroceramic components with variable resistance properties are known, for example temperature-dependent resistors. Temperature-dependent resistors include PTC resistors (PTC = Positive Temperature Coefficient), whose ceramics conduct electricity better at lower temperatures than at high temperatures, and NTC resistors (NTC = Negative Temperature Coefficient), whose ceramics are characterized by increasing electrical conductivity or decreasing resistance as the temperature rises. NTC resistors or NTC thermistors are used, for example, as sensor elements for temperature measurement in various areas, such as in automobiles, household appliances or industrial applications.The measurement can be used to adjust, regulate and control the temperature.

[0005] Although conventional ceramic components generally have an insulating layer to protect them from environmental influences such as water vapor, humidity, or other media, an unacceptable change in the resistance-temperature characteristic or even a loss of function can often be observed under operating conditions with increasing service life and / or at elevated operating temperatures. This applies, for example, to the use of NTC resistors as temperature sensors in automotive applications.

[0006] The object of at least one embodiment of the present invention is therefore to provide ceramic components with improved properties.

[0007] This object is achieved according to the invention by a ceramic component and by a method for producing a ceramic component according to the independent claims. Advantageous embodiments of the component and the method are the subject of further claims.

[0008] A ceramic component is specified. According to at least one embodiment, the ceramic component comprises a ceramic base body with at least one metallization on at least one surface of the base body and at least one electrical lead in electrical contact with the metallization.

[0009] The ceramic base body may contain a ceramic or consist of one. Furthermore, the ceramic base body may have different geometric shapes. For example, the ceramic base body may be cuboid-shaped.

[0010] Under the "at least one surface" here and in the

[0011] In the following, a partial area of ​​the entire surface of the ceramic base body is to be understood. If the ceramic base body is cuboid-shaped, for example, the at least one surface can comprise one of the side surfaces of the cuboid. If metallizations are present on more than one surface of the base body, for example on two surfaces of the base body, then these surfaces are spatially separate partial areas of the entire surface. If the base body is cuboid-shaped, for example, metallizations can be present on two opposite side surfaces of the base body.

[0012] The at least one metallization layer is applied to the base body in such a way that the base body can be electrically contacted by means of the metallization layer. In particular, the at least one metallization layer is in direct mechanical contact with the ceramic base body.

[0013] The supply line can, in particular, be a wire. "Electrical contact" is understood to mean, in particular, a direct mechanical connection of the at least one supply line to the metallization.

[0014] According to at least one embodiment, the ceramic component further comprises an encapsulation which encloses the ceramic base body, the at least one metallization, and a first partial section of the at least one supply line, wherein the first partial section directly adjoins the metallization. In this context, "enclosing" means that the encapsulation completely covers all exposed surfaces of the ceramic base body, the at least one metallization, and the first partial section of the supply line. The encapsulation can have a common interface with the ceramic base body, the at least one metallization, and / or with the first partial section of the at least one supply line, and / or can enclose cavities.

[0015] According to at least one embodiment, the ceramic component further comprises a protective layer which encloses the encapsulation and a second subsection of the at least one supply line, wherein the second subsection directly adjoins the first subsection. In this context, “enclosing” means that the protective layer completely covers all exposed surfaces of the encapsulation and of the second subsection of the at least one supply line. In particular, there are no cavities, for example air inclusions, between the encapsulation and the protective layer or between the second subsection of the supply line and the protective layer. Thus, the encapsulation and the protective layer as well as the second subsection of the supply line and the protective layer each have common interfaces, in particular over their entire area.

[0016] The second section of the at least one supply line adjoins the first section, i.e., it is arranged on the side of the first section facing away from the metallization. The protective layer is thus arranged indirectly on the first section and directly on the second section of the at least one supply line.

[0017] According to at least one further embodiment, the ceramic component further comprises an insulation layer which encloses the protective layer and a third sub-section of the supply line, wherein the third sub-section directly adjoins the second sub-section. In this context, “enclosing” means that the insulation layer completely covers all exposed surfaces of the protective layer and of the third sub-section of the at least one supply line. In particular, there are no cavities, for example air inclusions, between the insulation layer and the protective layer or between the insulation layer and the third sub-section of the at least one supply line. Thus, the insulation layer and the protective layer as well as the third sub-section of the supply line and the insulation layer each have common interfaces, in particular over their entire area.

[0018] The third subsection of the at least one supply line adjoins the second subsection, i.e., it is arranged on the side of the second subsection facing away from the metallization. The insulation layer is thus arranged indirectly on the first and second subsections and directly on the third subsection of the at least one supply line.

[0019] The first, second, and third subsections of the at least one supply line are thus to be understood as a contiguous section of the at least one supply line. According to at least one embodiment, the first, second, and third subsections of the at least one supply line do not represent the entire supply line. In other words, the supply line has a fourth subsection which directly adjoins the side of the third subsection facing away from the second subsection and which is enclosed neither by encapsulation, protective layer, nor insulation layer.

[0020] According to at least one embodiment, a ceramic

[0021] Component specified, comprising: - a ceramic base body with at least one metallization on at least one surface of the base body and at least one electrical lead in electrical contact with the metallization,

[0022] - an encapsulation which encloses the ceramic base body, the at least one metallization, and a first partial section of the at least one supply line, wherein the first partial section directly adjoins the metallization,

[0023] - a protective layer which surrounds the encapsulation and a second section of the at least one supply line , the second section being directly adjacent to the first section , and

[0024] - an insulation layer which encloses the protective layer and a third section of the supply line, the third section being directly adjacent to the second section.

[0025] The presence of an additional protective layer between the encapsulation and the insulation layer can improve the stability of the ceramic component.

[0026] In principle, the insulation layer alone protects the encapsulated component from environmental influences. However, in the event of prolonged contact with water or water vapor or high air humidity, as well as contact with media such as exhaust gas condensate and engine oil when the component is used in automobiles, an unacceptable change in the resistance-temperature characteristic curve occurs despite the insulation layer. The water, water vapor and / or the media can enter directly via the insulation layer or along the interfaces between the insulation layer and at least one lead. If the insulation layer is slightly detached due to environmental influences, moisture or other media penetrates the thin gap that forms between the encapsulation and the insulation layer. This penetration in turn leads to dissolution effects with high ion concentrations in the materials of the component.When a voltage is applied, ions migrate in the electric field, forming so-called migration defects. This can, for example, cause at least one lead to decomposition. The result is an undesirable reduction in resistance, even leading to a short circuit and thus a loss of function.

[0027] The protective layer between the encapsulation and the insulation layer can significantly impede or prevent detachment of the insulation layer. It acts as an adhesion promoter between the encapsulation and the insulation layer and between the supply line and the insulation layer, thus ensuring an improved or stronger bond between the insulation layer and the encapsulation and the supply line. This prevents the formation of gaps as described above through the use of the protective layer. Any ingress of moisture and / or other media is thus impeded or prevented, and electromigration is effectively suppressed.

[0028] The water resistance and the resistance to other media lead to improved long-term stability, even when the component is used at elevated temperatures, for example at temperatures of up to 260 °C, compared to conventional components without such a protective layer. According to at least one embodiment, the component has two metallizations on two surfaces of the base body and one electrical lead in electrical contact with a metallization each. All statements regarding the at least one metallization on the at least one surface and the at least one electrical lead apply analogously to any further metallization, surface and lead.The encapsulation then encloses, for example, the ceramic base body, the two metallizations, as well as the first section of each of the two leads, the protective layer then encloses the encapsulation and the second section of each of the two leads, and the insulation layer then encloses the protective layer and the third section of each of the two leads.

[0029] According to at least one embodiment, the protective layer comprises a material that contains an organic portion and an inorganic portion. In particular, the material of the protective layer comprises approximately 50% by weight organic portion and approximately 50% by weight inorganic portion. For example, the inorganic portion can comprise inorganic particles embedded in the organic portion, which functions as a matrix.

[0030] According to at least one embodiment, the organic portion comprises a fluorine-containing polymer and the inorganic portion comprises a metal oxide. The fluorine-containing polymer is, for example, a perfluoroalkoxy polymer. The metal oxide can in particular be selected from FeO, SiCh, SnO, Al2O3 and combinations thereof. For example, metal oxide particles can be embedded in the fluorine-containing polymer. According to at least one embodiment, the protective layer has a thickness selected from the range 1 pm to 250 pm. Depending on the precise composition of the material of the protective layer, this is thin or thick when applied.In the case of a thin-viscous material, a protective layer can be produced, for example, with a thickness in the range inclusive of 1 pm up to and including 25 pm; in the case of a thick-viscous material, a protective layer can be produced, for example, with a thickness in the range inclusive of 20 pm up to and including 250 pm.

[0031] According to at least one embodiment, chemical bonds and / or chemical interactions are present between the protective layer and the encapsulation and / or between the protective layer and the insulation layer. Such bonds and / or interactions can increase the adhesion of the protective layer between the insulation layer and the encapsulation. If, for example, the encapsulation contains a glass, i.e. an oxide network, a metal oxide contained in the protective layer can, for example, enter into a reaction with the oxide network and thus ensure improved bonding between the encapsulation and the protective layer. If, for example, the insulation layer contains a fluorine-containing polymer, this can form a homogeneous organic network with, for example, a fluorine-containing polymer in the protective layer and thus lead to good bonding of the insulation layer to the protective layer.

[0032] According to at least one embodiment, the ceramic

[0033] Base body a ceramic material with negative

[0034] Temperature coefficients of electrical resistance. The ceramic base body is therefore an NTC element or an NTC chip. A ceramic material with a negative temperature coefficient of electrical resistance can be selected from spinels. A spinel is a ceramic with the general composition AB2O4, in which the divalent metal ions B 2+ on the tetrahedral sites of the crystal lattice and the trivalent metal ions B 3+ are arranged on the octahedral sites of the crystal lattice. For example, a spinel can be an oxide composition of the elements Mn, Co, and Ni. Depending on the spinel ceramic used, different resistances and characteristic curve gradients (so-called B values) can be realized.

[0035] According to at least one embodiment, the encapsulation comprises a glass. The ceramic component is thus a glass-encapsulated, wired element, a so-called glass sensor.

[0036] According to at least one embodiment, the insulation layer comprises a material selected from fluorine-containing organic polymers. In particular, a perfluoroalkoxy polymer (PFA) can be selected as the material for the insulation layer. The insulation resistance of such a PFA insulation layer is over 100 MΩ at an applied voltage of 100 V DC.

[0037] According to at least one embodiment, the at least one metallization comprises Au.

[0038] According to at least one embodiment, the at least one supply line comprises a metal selected from Fe, Ni, Cu, and combinations thereof. For example, the supply line comprises a Cu-coated FeNi alloy.

[0039] According to at least one embodiment, the ceramic component further comprises a contact metal that surrounds the at least one lead and the at least one metallization in the region in which the lead and the metallization have a common interface. The contact metal is, in particular, Au. The contact metal ensures, in particular, a good and stable fixation of the lead to the metallization.

[0040] According to at least one embodiment, the ceramic component is designed as an NTC sensor. The NTC sensor can be used in particular for temperature measurement, for example, in the automotive sector.

[0041] Furthermore, a method for producing a ceramic component is specified. The method is suitable for producing a ceramic component as described here. All features and embodiments specified in connection with the ceramic component therefore also apply to the method, and vice versa.

[0042] According to at least one embodiment, the method for producing a ceramic component comprises the following process steps:

[0043] - Providing a ceramic base body,

[0044] - Arranging at least one metallization on at least one surface of the ceramic base body,

[0045] - electrically contacting the at least one metallization with an electrical supply line, - forming an encapsulation enclosing the ceramic base body, the at least one metallization and a first partial section of the at least one supply line, wherein the first partial section directly adjoins the metallization,

[0046] - forming a protective layer surrounding the encapsulation and a second partial section of the at least one supply line, the second partial section being directly adjacent to the first partial section,

[0047] - applying an insulation layer surrounding the protective layer and a third partial section of the at least one supply line, wherein the third partial section directly adjoins the second partial section.

[0048] According to at least one embodiment, the step of arranging at least one metallization on at least one surface of the ceramic base body comprises the steps of applying and fixing a material to form a metallization. According to at least one embodiment, the application is carried out by printing, in particular by screen printing. According to at least one embodiment, the fixing is carried out by heating, in particular by firing. In particular, the heating takes place at a temperature in the range from 800°C to 890°C, in particular at 850°C.

[0049] According to one embodiment, an Au paste is selected as the material for forming a metallization. This is fired onto the at least one surface of the ceramic base body during heating, thus forming the metallization. According to at least one embodiment, the step of electrically contacting the at least one metallization with an electrical lead comprises the steps of arranging the lead on the metallization and fixing the lead on the metallization. During the arranging, a section, in particular a part of the first subsection of the lead is brought into mechanical contact with the metallization, such that the metallization and the lead have a common interface.According to one embodiment, the step of fixing the lead to the metallization comprises arranging a contact metal in the region where the metallization and the lead have a common interface and drying the contact metal. For example, another Au paste can be used as the contact metal.

[0050] According to at least one embodiment, the step of forming an encapsulation enclosing the ceramic base body, the at least one metallization and a first section of the at least one lead comprises arranging a material from which the encapsulation is produced on the ceramic base body, the metallization and the first section of the lead and fusing this material. The fusing takes place in particular at a temperature in the range 600 °C to 800 °C. The material of the encapsulation can in particular be glass. For example, a glass tube is pushed over the ceramic base body with the metallization and the first section of the lead and then fused. The fusing forms a tight and closed encapsulation from which only the at least one lead protrudes.During the melting of the encapsulation material, the previously applied contact metal can also be melted in. This burns in the contact metal and forms a permanent and stable fixation of the lead to the metallization.

[0051] According to at least one embodiment, forming the protective layer comprises the step of applying a liquid material to form the protective layer. According to one embodiment, the liquid material is applied using a method selected from dip coating, spray coating, and roller coating. If, for example, dip coating is selected as the method, the already encapsulated component can be immersed in the liquid material. It is immersed to such an extent that it is ensured that the second section of the lead is also covered with the liquid material. If the encapsulated component has a length of approximately 1 mm, for example, it can be immersed up to 10 mm in the liquid material to apply the liquid material of the protective layer.

[0052] Depending on its composition, the liquid material used to form the protective layer can have different viscosities and thus be, for example, thin or thick. This parameter can influence the thickness of the resulting protective layer.

[0053] According to at least one embodiment, the formation of the protective layer further comprises the step of intermediate drying after the application of the liquid material. The intermediate drying can take place, for example, at room temperature or at elevated temperatures in the range 90°C to 130°C. In this case, the liquid material becomes at least partially solid before the insulating layer is applied. Alternatively, the intermediate drying step can be omitted and the insulating layer can be applied to the liquid material. This is then a so-called wet process. According to one embodiment, the protective layer is completely dried after the insulating layer has been applied.During drying, chemical bonds and / or interactions may be formed between the encapsulation and the protective layer and / or between the protective layer and the insulation layer, thereby giving the protective layer its function as an adhesion promoter.

[0054] According to at least one embodiment, the step of applying an insulating layer is carried out by means of electrostatic powder coating.

[0055] Further advantageous embodiments and developments of the component and the method will become apparent from the exemplary embodiments described below in conjunction with the figures.

[0056] Figure 1a shows a schematic sectional view of a ceramic component with encapsulation.

[0057] Figure 1b shows a schematic sectional view of a ceramic component with encapsulation and protective layer.

[0058] Figure 1c shows a schematic sectional view of a ceramic component with encapsulation, protective layer and insulation layer.

[0059] Figure 2 shows an image of a conventional ceramic component with the defect pattern Cu migration.

[0060] Figure 3a shows the resistance drift of components according to exemplary embodiments and a comparative example. Figure 3b shows the resistance drift of components according to exemplary embodiments.

[0061] The figures and the relative sizes of the elements shown in the figures are not to be understood as being to scale. Furthermore, identical or similar elements are identified by the same reference symbols.

[0062] Figure 1a shows a schematic sectional view of an encapsulated component. This is an exemplary embodiment of a ceramic component before its completion. The encapsulated component contains a ceramic base body 10. The ceramic base body 10 contains an NTC ceramic, for example a spinel. Metallizations 20 are applied to two spatially separated surfaces 11, which can also be referred to as partial surfaces, of the ceramic base body 10. In this example, these metallizations contain or consist of Au as the material.

[0063] Electrical leads 30 are arranged on the metallizations 20, each of which has a common interface 23 with the metallizations 20. In this example, the leads are Cu-coated wires made of an FeNi alloy.

[0064] In the area of ​​the common interface 23 of the metallizations 20 and the leads 30, a contact metal 21, for example Au, is also present, which fixes the leads 30 to the metallizations. A voltage can be applied to the ceramic base body by means of the metallizations 20, leads 30, and the contact metal 21.

[0065] The supply lines 30 each contain a first subsection 31, the area of ​​which is indicated in Figure 1a by the two dashed lines. This first subsection 31 of the two supply lines 30, the metallizations 20, the contact metals 21, and the ceramic base body 10 are enclosed by an encapsulation 40.

[0066] The encapsulation 40 contains or consists of a glass. The regions of the two supply lines 30 that do not belong to the first subsection 31 protrude from the encapsulation 40.

[0067] The component shown in Figure 1a is in particular a glass-encapsulated NTC resistor or NTC thermistor.

[0068] Figure 1b shows a schematic sectional view of a ceramic component as already explained with reference to Figure 1a, which furthermore has a protective layer 50. Figure 1b thus again shows a not yet completed component according to an exemplary embodiment. The protective layer 50 surrounds the encapsulation 40 and a second partial section 32 of the leads 30. The region of the second partial section 32 is again indicated by dashed lines. The protective layer 50 thus surrounds a larger area than the underlying encapsulation 40.

[0069] The protective layer 50 is formed from a material that contains an organic and an inorganic portion. In the exemplary embodiments for ceramic components discussed below, exemplary embodiment B1 has a protective layer 50 that is formed from a fluorine-containing polymer, in this example a perfluoroalkoxy polymer, and the metal oxides SiCy and Al2O3 (for example the material "Primer Clear" from Chemours), while exemplary embodiment B2 has a protective layer 50 that is formed from a fluorine-containing polymer, in this example a perfluoroalkoxy polymer, and the metal oxides Fe2Oa, SnO, SiCy and Al2O3 (for example the material "Ruby Red" from Chemours). The material used to produce the protective layer 50 of example B1 is more fluid than the material of example B2.The protective layer 50, which is produced, for example, by means of dip coating, has a thickness in the range of 1 mm to 25 pm in example B1, and a thickness in the range of 20 pm to 250 pm in example B2.

[0070] Figure 1c shows a schematic sectional view of a ceramic component as already explained with reference to Figures 1a and 1b, which further comprises an insulation layer 60. This is a component according to an exemplary embodiment after its completion. The insulation layer 60 encloses the protective layer 50 and the third partial section 33 of the leads 30. The insulation layer 60 thus surrounds a larger area than the underlying encapsulation 40. The insulation layer 60 is a PFA layer, which is applied, for example, by means of electrostatic powder coating.

[0071] The component in Figure 1c represents an NTC thermistor, which exhibits significantly higher resistance to environmental influences than conventional components that do not contain a protective layer. Due to the protective layer 50, which serves as an adhesion promoter between the encapsulation 40 and the insulation layer 60, it prevents or significantly delays the ingress of media into the interior of the component. This prevents dissolution effects and—when a voltage is applied—the migration of ions, particularly Cu ions, from the leads 30. Therefore, no migration errors occur in the component, and thus no undesirable changes in resistance.

[0072] Figure 2 shows an image of a conventional component that lacks a protective layer 50 and exhibits the defect pattern of Cu migration. The arrow points to the area that has become defective, particularly due to electromigration. The result is an undesirable change in resistance, even a short circuit.

[0073] Figures 3a and 3b show measurements of the resistance drift dR25 (in %) measured at 25°C for components according to exemplary embodiments and a comparative example. Resistance drift refers to the deviation of the nominal resistance R25 from the desired value.

[0074] Figure 3a shows the measured resistance drift dR25 of the components according to Examples B1 and B2 as well as Comparative Example V. Comparative Example V does not have a protective layer 50, but does have an insulating layer 60 made of PFA.

[0075] The resistance drift dR25 was measured after 500 hours of water storage at a temperature of 80°C and an applied voltage of 1.2 V. 30 measurements were taken in each case and their distribution is plotted in Figure 3a. The dashed lines indicate the nominal resistance of 1000 Ω (dR25 = 0) and the tolerable resistance deviation of ± 3% (dR25 = 3 or dR25 = -3). Figure 3a shows that the two components B1 and B2 have a low resistance drift; in both examples this is almost zero, which is indicated by the solid lines on the 0 line. The comparison example V, on the other hand, shows a significant resistance drift with a distribution of values ​​that lies almost exclusively outside the tolerable range of ± 3% (grey box). The comparison example V shows total failures after only 500 hours of water storage.Electromigration leads to a reduction in resistance, a short circuit and ultimately to total failure.

[0076] Figure 3b shows a continuation of the test series described in connection with Figure 3a, with the components B1 and B2. Under otherwise identical test conditions as described in connection with Figure 3a, the storage time was varied here between 500 h and 5000 h. For better illustration, the resistance drift dR25 is shown on the y-axis only in the range of the tolerable deviation of ± 3%. In both examples, a resistance drift of less than 1% is observable even after storage for 5000 h.

[0077] It can therefore be shown that the use of the protective layer 50 between the encapsulation 40 and the insulation layer 60 significantly increases the stability and lifetime of ceramic components, even when used under environmental influences such as water or water vapor. The occurrence of electromigration and thus migration errors can be effectively suppressed. Ceramic components described here can therefore also be used under

[0078] Use in water or water vapor or high humidity far beyond conventional specifications, which, for example, in the automotive industry are around 2000 h.

[0079] Reference symbol list

[0080] 10 ceramic base body

[0081] 11 Surface 20 Metallization

[0082] 21 Contact metal

[0083] 23 common interface

[0084] 30 electrical supply lines

[0085] 31 first section 32 second section

[0086] 33 third section

[0087] 40 Encapsulation

[0088] 50 protective layer

[0089] 60 I insulation layer dR25 resistance drift measured at 25 ° C

[0090] Bl From example

[0091] B2 Example

[0092] V Comparison example

Claims

Patent claims 1. Ceramic component, comprising: - a ceramic base body (10) with at least one metallization (20) on at least one surface (11) of the base body and at least one electrical lead (30) in electrical contact with the metallization (20), - an encapsulation (40) which encloses the ceramic base body (10), the at least one metallization (20), and a first partial section (31) of the at least one supply line (30), wherein the first partial section (31) directly adjoins the metallization (20), - a protective layer (50) which surrounds the encapsulation (40) and a second partial section (32) of the at least one supply line (30), wherein the second partial section (32) directly adjoins the first partial section (31), and - an insulation layer (60) which encloses the protective layer (50) and a third sub-section (33) of the supply line (30), wherein the third sub-section (33) directly adjoins the second sub-section (32).

2. Ceramic component according to the preceding claim, wherein the protective layer (150) comprises a material containing an organic portion and an inorganic portion.

3. Ceramic component according to the preceding claim, wherein the organic portion comprises a fluorine-containing polymer and wherein the inorganic portion comprises a metal oxide.

4. Ceramic component according to one of the preceding claims, wherein the protective layer (150) has a thickness selected from the range 1 pm to 250 pm.

5. Ceramic component according to one of the preceding claims, wherein chemical bonds and / or chemical interactions are present between the protective layer (50) and the encapsulation (40) and / or between the protective layer (50) and the insulation layer (60).

6. Ceramic component according to one of the preceding claims, wherein the ceramic base body (10) comprises a ceramic material with a negative temperature coefficient of electrical resistance.

7. Ceramic component according to one of the preceding claims, wherein the encapsulation (40) comprises a glass.

8. Ceramic component according to one of the preceding claims, wherein the insulating layer (60) comprises a material selected from fluorine-containing organic polymers.

9. Ceramic component according to one of the preceding claims, wherein the at least one metallization (20) comprises Au.

10. Ceramic component according to one of the preceding claims, wherein the at least one lead (30) comprises a metal selected from Fe, Ni, Cu and combinations thereof.

11. Ceramic component according to one of the preceding claims, which is designed as an NTC sensor.

12. Process for producing a ceramic component comprising the following process steps: - Providing a ceramic base body (10), - Arranging at least one metallization (20) on at least one surface (11) of the ceramic base body (10), - electrical contacting of the at least one metallization (20) with an electrical supply line (30), - forming an encapsulation (40) enclosing the ceramic base body (10), the at least one metallization (20) and a first partial section (31) of the at least one supply line (30), wherein the first partial section (31) directly adjoins the metallization (20), - forming a protective layer (50) surrounding the encapsulation (40) and a second partial section (32) of the at least one supply line (30), wherein the second partial section (32) directly adjoins the first partial section (31), - applying an insulation layer (60) surrounding the protective layer (50) and a third partial section (33) of the at least one supply line (30), wherein the third partial section (33) directly adjoins the second partial section (32).

13. The method according to the preceding paragraph, wherein forming the protective layer (50) comprises the step of applying a liquid material to form the protective layer (50).

14. A method according to the preceding claim, wherein the liquid material is applied by a method selected from dip coating, spray coating and roller coating.

15. The method according to claim 13 or 14, wherein the formation of the protective layer (50) further comprises the step of intermediate drying after the application of the liquid material.

Images