Speaker telemetry and calibration data

Abstract

A speaker assembly and a method for a speaker assembly for speaker calibration and telemetry. The speaker assembly including a driver, a memory, a processor, and a housing, wherein the driver, the memory and the processor are within the housing. The processor is configured to receive one or more diagnostic signals, compare the one or more diagnostic signals with threshold values stored in the memory, determine a fault within the speaker assembly if the one or more diagnostic signals are outside of the threshold values, and adjust one or more features of the speaker assembly when a fault is determined.

Description

[0001] The present invention relates to a speaker assembly, a corresponding method for a speaker assembly, and telemetry and calibration data for a speaker assembly.BACKGROUND OF THE INVENTION

[0002] Speaker assemblies, including individual drivers (for example, loud speakers) and units comprising multiple drivers (for example, one or more bass, mid-range, tweeters, or similar), can be implemented in a number of different scenarios. For example, one or more speaker assemblies are frequently included in the cabins of vehicles (such as automobiles, boats, airplanes and the like). Such vehicles, due to their nature of use, may exhibit a variety of different temperature fluctuations. For example, a vehicle may be manufactured to sustain temperatures between -20°C and up to 40°C. Accordingly, each component within the vehicle, including the one or more speaker assemblies, may be manufactured to sustain those temperatures without failing. For example, a speaker assembly may be switched off when the vehicle detects that the outside or inside temperature of the vehicle is below -20°C or above 40°C. However, such a measurement may not reflect the temperature of the driver of the vehicle, which may lead to pre-mature switching off of the speaker assembly (if the temperature at the speaker assembly does not exceed those thresholds) or damage to the speaker assembly (if the temperature at the speaker assembly exceeds those thresholds).

[0003] If one or more components of the audio system (including the one or more speaker assemblies, an amplifier, lighting systems, computing means, etc.) have been damaged (for example, due to excessive temperatures), it is also difficult to ascertain which component has been damaged. This typically leads to time consuming investigation and sometimes entire replacement of the audio system, adding further unnecessary cost to the consumer.

[0004] In addition to this, there is a demand for increased sound quality from speaker assemblies at a lower cost to the consumer. With the reduction of manufacturing costs and the further increase of mass production, it is difficult to maintain a constant high quality of sound from each speaker assembly during manufacturing.

[0005] It is an aim of this invention to address the above-mentioned issues, for example, by providing a cost-efficient speaker assembly that is configured to receive one or more diagnostic signals and to determine one or more faults with the speaker assembly.SUMMARY

[0006] To achieve the above objectives, the invention sets out a speaker assembly, a vehicle, and a method for a speaker assembly as in the claims below.

[0007] In a preferred embodiment, a speaker assembly is provided. The speaker assembly includes a driver, a memory, a processor (for example, a microcontroller (MCU)), and a housing wherein the driver, the memory and the processor are within the housing. The processor is configured to receive one or more diagnostic signals, compare the one or more diagnostic signals with threshold values stored in the memory, determine a fault within the speaker assembly if the one or more diagnostic signals are outside of the threshold values, and adjust one or more features of the speaker assembly when a fault is determined. Advantageously, the speaker assembly includes computing means to determine whether any components of the speaker assembly are faulty. In a system of speaker assemblies, this more accurately determines faults at the speaker level, because each speaker assembly comprises circuitry to determine faults, compared to a systems of speaker assemblies that has one fault detection circuitry for all speaker assemblies. This is because the fault detection is done at the speaker assembly, which reduces the need for diagnostic signals to be communicated over multiple channels. Furthermore, diagnostics (for example, temperature and / or voltage measurements) are measured at the speaker level which provides a more accurate measurement of the condition of the speaker assembly compared, for example, to diagnostics being measured on a system level (for example, an ambient air temperature measured by a vehicle). Furthermore, this reduces the failure rate of fault detection due to the presence of multiple fault detection means (i.e. in each speaker assembly, rather than one in a system).

[0008] In an embodiment, the speaker assembly may further include one or more electronic devices that is not a driver. The one or more electronic device include a temperature measuring device (for example, a thermometer), a voltmeter (which may be part of the processor), a light assembly comprising at least one illuminating element, a motor operable to move the driver relative to the housing or to move the speaker assembly relative to a fixture to which the speaker assembly is attached, or any combination of the above. Advantageously, the speaker assembly can have multiple functions in addition to providing audio to a consumer, such as providing immersive lighting and movement arrangements. By providing a thermometer and / or a voltmeter at the speaker assembly level, more accurate measurements of temperature and / or circuit voltage can be taken. This reduces the need to include large tolerances for temperature and / or voltage headroom when determining a fault (for example, excessive temperature and / or a loss in voltage / power) in the speaker assembly. Thus, the speaker assembly can be safely kept switched on in more extreme temperatures.

[0009] In an embodiment, the temperature measuring device may be configured to measure the temperature (this may be done periodically or continuously) of the driver, and send the temperature measurement to the processor, wherein the temperature measurement is one of the one or more diagnostic signals. Advantageously, the temperature of the driver and / or speaker assembly can be measured more accurately.

[0010] In an embodiment, a fault may be determined when the temperature measurement is above a first threshold temperature or below a second threshold temperature, the first threshold temperature is higher than the second threshold temperature. The processor may be further configured to reduce power provided to the driver when the temperature measurement is above the first threshold temperature. The processor may alternatively or additionally be configured to increase power provided to the driver when the temperature measurement is below the second threshold temperature. Advantageously, the speaker assembly can be safely used in more extreme temperatures because the temperature measurements taken at the speaker assembly / driver level are more accurate than measurements taken at a system level (for example, ambient air temperature). Thus, temperature headroom for speakers can be tuned more accurately and the speaker assembly can be made available for a larger temperature range without large modification of the driver. For example, a speaker assembly that was previously configured for temperatures between -20°C and 40°C may be configured for temperatures between -40°C and 85°C with this arrangement.

[0011] In an embodiment, the driver may be electrically coupled (for example, by means of a wired connection) to an amplifier and the processor. The one or more electronic devices may be electrically coupled in a bus configuration between the driver and the amplifier. Alternatively, the one or more electronic devices may be electrically coupled between the driver and the processor. Advantageously, the one or more electronic devices can be added after manufacturing of the speaker assembly (for example, by the speaker assembly manufacturer or by a subsequent manufacturer, such as an automotive manufacturer) because the bus configuration does not require disassembly or re-wiring of the speaker assembly.

[0012] In an embodiment, the processor may be further configured to measure a voltage of one or more electrical connections between: the driver and the processor, the driver and the amplifier, and / or the processor and an electronic control module (ECM) of a vehicle. The processor may be further configured to determine that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold, wherein the one or more voltages is one of the one or more diagnostic signals. The processor may be further configured to send a signal to the amplifier or to the ECM indicating that the speaker assembly is faulty, if one or more electrical connections are determined to be faulty. Advantageously, the speaker assembly can diagnose whether one or more components within the speaker assembly are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on a computer system (for example, of a vehicle) and can be retrieved by a user (for example, a mechanic) to determine exactly which speaker assembly of multiple speaker assemblies is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0013] In an embodiment, the processor may be further configured to receive a sound signal from an amplifier and to apply first pre-determined sound characteristics (for example, calibrating sound characteristics specific to the speaker assembly) to the sound signal, the first pre-determined sound characteristics stored on the memory. The processor may be further configured to receive second pre-determined sound characteristics from an electronic control module (ECM) of a vehicle (for example, sound characteristics determined by a manufacturer) and to apply the second pre-determined sound characteristics to the sound signal. The processor may be further configured to send a first modified sound signal corresponding to the sound signal with the applied first pre-determined sound characteristics and second pre-determined sound characteristics to the driver. Despite rigorous quality and assessment, the sound characteristics of speaker assemblies of a certain model type can vary significantly from speaker assembly to speaker assembly. By storing calibration data that is specific to each speaker assembly unit of a speaker assembly model, the speaker assembly can be tuned to reproduce a sound characteristic that is intended by the manufacturer. In addition to this, a vehicle manufacturer can apply further sound characteristics (second pre-determined sound characteristics) to represent a sound quality that is intended by the vehicle manufacturer. Advantageously, a universal sound quality can be guaranteed despite variations in build quality of speaker assembly units.

[0014] In an embodiment, a system is provided, the system including the speaker assembly as described above and a second speaker. The processor of the second speaker assembly may be configured to receive the sound signal from the amplifier, and to apply third pre-determined sound characteristics to the sound signal, the third pre-determined sound characteristics stored on the memory of the second speaker assembly are different to the first pre-determined sound characteristics. The processor of the second speaker assembly may be further configured to receive the second pre-determined sound characteristics from the ECM, apply the second pre-determined sound characteristics to the sound signal, and send a second modified sound signal corresponding to the sound signal with the applied third pre-determined sound characteristics and second pre-determined sound characteristics to the driver of the second speaker assembly. The sound characteristics of first modified sound signal and the second modified sound signal may be identical. Advantageously, a universal sound quality can be guaranteed despite variations in build quality of speaker assembly units. By storing calibration data that is specific to each speaker assembly unit of a speaker assembly model, the speaker assembly can be tuned to reproduce a sound characteristic that is intended by the manufacturer (for example, each speaker assembly unit will have different stored calibration data / pre-determined sound characteristics such that all speaker assembly units of the same model represent sound with the same characteristics).

[0015] In an embodiment, the first pre-determined sound characteristics, the second pre-determined sound characteristics, and the third pre-determined sound characteristics may include sound equaliser settings, volume, resonance frequency, or any combination of the above. Advantageously, the sound reproduced by the speaker assembly can be accurately fine-tuned to overcome any manufacturing defects.

[0016] In a preferred embodiment, a vehicle is provided. The vehicle may include at least one speaker assembly as defined above, an amplifier electrically coupled to the at least one speaker assembly, and an electronic control module, ECM, the ECM electrically coupled to the amplifier and the at least one speaker assembly.

[0017] In an embodiment, the ECM may be operable to send an acknowledge (ACK) signal to the amplifier and the at least one speaker assembly. The ECM may be further operable to determine the amplifier is faulty when the ECM receives a negative acknowledgement (NACK) signal from the amplifier, determine one or more of the at least one speaker assembly is faulty when the ECM receives a NACK signal from one or more of the at least one speaker assembly, or a combination of the above. The ECM may be further operable to store the one or more NACK signals on memory of the ECM. Advantageously, the ECM can diagnose whether one or more components within the vehicle are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on the ECM and can be retrieved by a user (for example, a mechanic) to determine exactly which component (for example, which speaker assembly, amplifier, processor, memory, etc) of the system is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0018] In a preferred embodiment, a method for a speaker assembly is provided. The method includes receiving, by a processor of a speaker assembly as defined above, one or more diagnostic signals. The method further includes comparing, by the processor, the one or more diagnostic signals with threshold values stored in memory of the speaker assembly. The method further includes determining, by the processor, a fault within the speaker assembly if the one or more diagnostic signals are outside of the threshold values. The method further includes adjusting one or more features of the speaker assembly when a fault is determined. Advantageously, it can be determined whether any components of the speaker assembly are faulty. In a system of speaker assemblies, this more accurately determines faults at the speaker level, because each speaker assembly comprises circuitry to determine faults, compared to a systems of speaker assemblies that has one fault detection circuitry for all speaker assemblies. This is because the fault detection is done at the speaker assembly, which reduces the need for diagnostic signals to be communicated over multiple channels. Furthermore, diagnostics (for example, temperature and / or voltage measurements) are measured at the speaker level which provides a more accurate measurement of the condition of the speaker assembly compared, for example, to diagnostics being measured on a system level (for example, an ambient air temperature measured by a vehicle). Furthermore, this reduces the failure rate of fault detection due to the presence of multiple fault detection means (i.e. in each speaker assembly, rather than one in a system).

[0019] In an embodiment, the method may further include measuring a temperature of the driver, and sending the temperature measurement to the processor, wherein the temperature measurement is one of the one or more diagnostic signals. The method may further include determining a fault when the temperature measurement is above a first threshold temperature or below a second threshold temperature, the first threshold temperature is higher than the second threshold temperature. Th method may further include reducing, by the processor, power provided to the driver when the temperature measurement is above the first threshold temperature or increasing, by the processor, power provided to the driver when the temperature measurement is below the second threshold temperature. Advantageously, the speaker assembly can be safely used in more extreme temperatures because the temperature measurements taken at the speaker assembly / driver level are more accurate than measurements taken at a system level (for example, ambient air temperature). Thus, temperature headroom for speakers can be tuned more accurately and the speaker assembly can be made available for a larger temperature range without large modification of the driver. For example, a speaker assembly that was previously configured for temperatures between -20°C and 40°C may be configured for temperatures between -40°C and 85°C with this arrangement.

[0020] In an embodiment, the method may further include measuring a voltage of one or more electrical connections between: the driver and the processor, the driver and the amplifier, and / or the processor and an electronic control module (ECM) of a vehicle. The method may further include determining that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold, wherein the one or more voltages is one of the one or more diagnostic signals. The method may further include sending a signal to the amplifier or to the ECM indicating that the speaker assembly is faulty, if one or more electrical connections are determined to be faulty. Advantageously, it can be diagnosed whether one or more components within the speaker assembly are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on a computer system (for example, of a vehicle) and can be retrieved by a user (for example, a mechanic) to determine exactly which speaker assembly of multiple speaker assemblies is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0021] In an embodiment, the method may further include sending an acknowledge (ACK) signal from an electric control module, ECM, of a vehicle to the amplifier and the at least one speaker assembly. The method may further include determining, by the ECM, the amplifier is faulty when the ECM receives a negative acknowledgement (NACK) signal from the amplifier, determining one or more of the at least one speaker assembly is faulty when the ECM receives a NACK signal from one or more of the at least one speaker assembly, or a combination of the above. The method may further include storing the one or more NACK signals on memory of the ECM. Advantageously, the ECM can diagnose whether one or more components within the vehicle are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on the ECM and can be retrieved by a user (for example, a mechanic) to determine exactly which component (for example, which speaker assembly, amplifier, processor, memory, etc) of the system is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The features, objects, and advantages of the present disclosure will become more apparent from the detailed description set forth below when taken in conjunction with the drawings in which like reference numerals refer to similar elements. Figure 1 shows an example system of a speaker assembly, an amplifier and an electronic control module; Figure 2 shows an example of the system of figure 1 in a vehicle; Figure 3 shows a calibration arrangement for a speaker assembly, such as the speaker assembly in figures 1 and 2; Figure 4 depicts a flow chart of a method for a speaker assembly, such as the speaker assembly in figures 1, 2 and 3, according to the invention; Figure 5 depicts a flow chart of further methods for a speaker assembly, according to alternative embodiments of the invention; Figure 6 depicts a flow chart of yet further methods for a speaker assembly, according to alternative embodiments of the invention; and Figure 7 depicts a flow chart of yet further methods for a speaker assembly, according to alternative embodiments of the invention. DETAILED DESCRIPTION

[0023] The present invention provides a cost-efficient speaker assembly that is configured to receive one or more diagnostic signals and to determine one or more faults with the speaker assembly.

[0024] Figure 1 shows a system 100 for a playing back sound / music. The system may include multiple components, such as a speaker assembly 102, an amplifier 108, and a computing means 112 (which may, for example, be an electronic control module (ECM)). The components of the system 100 may communicate with one another, to send and / or receive power and / or data, by means of a wired or wireless coupling. To accomplish this, each of the speaker assembly 102, the amplifier 108 and the computing means 112 may include wired connections and / or wireless transceivers operable to couple the components with each other. The speaker assembly 102 may be coupled to the amplifier 108, the amplifier may be coupled to the computing means 112, and the computing means 112 may be coupled to the speaker assembly 102.

[0025] The speaker assembly 102 includes a driver 104, such as a loudspeaker. In an embodiment, the speaker assembly 102 includes multiple drivers 104 (not shown) which may be one or more identical drivers, one or more different types of drivers (for example, bass, mid-range and / or tweeters), or a combination thereof. The speaker assembly 102 also includes additional electronic components 106. The additional electronic components 106 include computing means which have a processor and a memory (not shown) and may include one or more electronic devices. The memory may be any type of memory capable of storing instructions and / or data thereon. The processor may be a microcontroller (MCU) or any other suitable low power processor. The speaker assembly 102 includes a housing (not shown), wherein the driver 104 or plurality of drivers 104 and the additional electronic components 106 (including the processor and the memory) are within the housing. The speaker assembly 102 may include the amplifier 108 and the amplifier may be within the housing.

[0026] The additional electronic components 106 are different to the one or more drivers 104 and, in addition to the memory and processor as described above, may include a variety of electronic devices (such as circuitry) to add a number of additional features to the speaker assembly 102. In an embodiment, the electronic components 106 may include a temperature measuring device (for example, thermometer - this may be integrated to a mic controller of the speaker assembly 102) operable to measure a temperature of the one or more drivers 104. The electronic components 106 may include a voltmeter, an ammeter or any other component suitable to measure a voltage, current and / or power of an electrical connection and / or electrical device. The voltmeter, ammeter, or other may be part of the processor of the speaker assembly 102. The electronic components 106 may include a light assembly comprising at least one illuminating element. This may include one or more light emitting diodes (LEDs) or any other suitable illuminating element and may be operable to perform a light show based on instructions stored on the memory of the speaker assembly 102 and sent to the light assembly by the processor of the speaker assembly 102. The electronic components 106 may include a motor (for example, an AC motor, DC motor, brushed motor, brushless motor, servo motor, or any other suitable type of motor). The motor may be operable to move the one or more drivers 104 relative to the housing or to move the speaker assembly 102 relative to a fixture to which the speaker assembly is attached (for example, to a component of a vehicle such as a dashboard). For example, the motor may be able to protract the one or more drivers 104 or the speaker assembly 102 when an audio system of a vehicle is switched on, and to retract (hide) the one or more drivers 104 or the speaker assembly 102 when an audio system of the vehicle is switched off (for example, to provide more cabin space in the vehicle and / or to protect the one or more drivers 104 or the speaker assembly 102). Advantageously, the speaker assembly 102 can have multiple functions in addition to providing audio to a consumer, such as providing immersive lighting and movement arrangements. By providing a thermometer and / or a voltmeter at the speaker assembly level, more accurate measurements of temperature and / or circuit voltage can be taken. This reduces the need to include large tolerances for temperature and / or voltage headroom when determining a fault (for example, excessive temperature and / or a loss in voltage / power) in the speaker assembly. Thus, the speaker assembly can be safely kept switched on in more extreme temperatures.

[0027] The memory and the processor of the speaker assembly 102 may be part of a single printed circuit board (PCB). Some (i.e. one or more) or all of the electrical components 106 may be part of the PCB. Alternatively, additional electrical components 106 may be electrically coupled (i.e. plugged) onto the PCB. Advantageously, the electrical components 106 can be more easily integrated into the speaker assembly 102 in a smaller package. This allows for a smaller speaker assembly 102 that can be manufactured at a reduced cost (due to fewer electrical components and electrical connections being required).

[0028] The one or more electronic devices may be electrically coupled in a bus configuration between the driver 104 and the amplifier 108 (for example, the amplifier circuitry 108). Alternatively, the one or more electronic devices may be electrically coupled between the driver 104 and the processor of the speaker assembly 102. Advantageously, the one or more electronic devices can be added after manufacturing of the speaker (for example, by the speaker assembly manufacturer or by a subsequent manufacturer, such as an automotive manufacturer) because the bus configuration does not require disassembly or re-wiring of the speaker and allows fitting the speaker with electronics as part of the production of the speaker assembly. This can occur in the PCB arrangement, where the one or more electronic devices can be plugged into the PCB. By utilising electronic devices that are connected in a bus arrangement relative to the driver 104 and / or the processor / memory of the speaker assembly 102, the possibility is opened up of adding any further desired functionality that has previously been deemed cost prohibitive at very little additional cost. This is especially useful in the automotive industry, where the addition of electrical components after the manufacturing of the vehicle can prove very time consuming and costly.

[0029] The amplifier 108 may be any type of amplifier suitable for amplifying a sound signal to a level of power required for the speaker assembly 102. In addition to this, the amplifier 108 may include an amplifier circuit 110 which may include memory and a processor (not shown). The memory may be any type of memory capable of storing instructions and / or data thereon. The processor may be a microcontroller (MCU) as described above. The amplifier circuitry 110 may be electrically coupled (wired or wirelessly) to the speaker assembly 102. In an embodiment, the amplifier circuitry 110 may be electrically coupled to driver 104 of the speaker assembly 102 and / or to the additional electronic components 106 of the speaker assembly 102. Accordingly, the amplifier circuitry can send (via its processor) instructions / data (stored on its memory) to the speaker assembly 102. These instructions / data may include an acknowledge (ACK) signal sent to the driver 104 (or to each of the plurality of drivers 104) and / or to the additional electronic components 106 in order to determine that the driver(s) 104 and / or the additional electronic components 106 are functioning correctly. Additionally or alternatively, the amplifier circuitry 110 can send (via its processor) instructions / data (stored on its memory) to the computing means 112. These instructions / data may include an acknowledge (ACK) signal sent to the computing means 112 in order to determine that the computing means 112 are functioning correctly. Similarly, the computing means 112 may include a processor and memory (not shown).

[0030] The computing means 112 can send (via its processor) instructions / data (stored on its memory) to the amplifier circuitry 110 of the amplifier, the driver(s) 104 of the speaker assembly 102, the additional electronic components 106 of the driver, or any combination thereof. These instructions / data may include an acknowledge (ACK) signal in order to determine that any one or more of the amplifier circuitry 110, the driver(s) 104, and the additional electronic components 106 are functioning correctly.

[0031] The processor of the speaker assembly 102 is configured to receive one or more diagnostic signals. The diagnostic signals may be received from any component within the speaker assembly 102, such as one or more drivers 104 and / or one or more the additional electronic components 106. The diagnostic signals may be received from the amplifier circuitry 108 and / or the computing means 112. The diagnostic signals may include a temperature measurement of the one or more drivers 104 taken by the temperature measuring device as described above. Additionally, or alternatively, the diagnostic signals may include a voltage reading (this may also be a current and / or power reading) taken by the processor of the speaker assembly 102, or a voltmeter of the speaker assembly 102. The diagnostic signals may include a voltage reading (this may also be a current and / or power reading) taken by the processor of the amplifier circuitry 110, the computing means 112, a voltmeter of the amplifier 108, and / or a voltmeter of the computing means 112. The diagnostic signals may include an acknowledge signal (ACK), a not acknowledged signal (NACK), or a combination of the above received by the processor of the speaker assembly 102 from the amplifier circuitry 110 and / or the computing means 112. The diagnostic signals may include an ACK, a NACK or a combination of the above received by the processor of the amplifier circuitry 110 from the processor of the speaker assembly and / or the computing means or received by the computing means 112 from the processor of the amplifier circuitry 110 or the processor of the speaker assembly 102.

[0032] The temperature measuring device may be configured to measure the temperature (this measurement may be done periodically (repeatedly at pre-determined intervals) or continuously) of the one or more drivers 104 and send the temperature measurement to the processor of the speaker assembly 102. Advantageously, the temperature of the driver and / or speaker assembly can be measured more accurately.

[0033] As described above, the processor of the speaker assembly, or the voltmeter, may be further configured to measure a voltage of one or more electrical connections between the one or more drivers 104 and the processor of the speaker assembly 102, between the one or more drivers 104 and the amplifier 108, and / or between the processor of the speaker assembly 102 and the computing means 112 (for example, an electronic control module (ECM) of a vehicle). This measurement may be done periodically (repeatedly at pre-determined intervals) or continuously. The processor of the speaker assembly 102 may be further configured to determine that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold. The processor of the speaker assembly 102 may be configured to send a signal (i.e. a diagnostic signal) to the amplifier 110 (for example, the amplifier circuitry 108) or to the computing means 112 (for example, the ECM) indicating that the speaker assembly 102 is faulty, if one or more electrical connections are determined to be faulty. Alternatively, the amplifier 110 (for example, the amplifier circuitry 108) or the computing means 112 (for example, the ECM) may receive the signal (i.e. the diagnostic signal) from the processor of the speaker assembly 102. Subsequently, the amplifier 110 or the computing means 112 may determine that the speaker assembly 102 is faulty. Advantageously, the speaker assembly can diagnose whether one or more components within the speaker assembly are faulty, or if the connection between the driver / speaker 104 and the amplifier 108 is faulty (for example, because of a short circuit or other electrical failure). This information can be stored on a computer system (for example, of a vehicle) and can be retrieved by a user (for example, a mechanic) to determine exactly which speaker assembly of multiple speaker assemblies is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0034] The processor of the speaker assembly 102 compares the one or more received diagnostic signals with threshold values stored in the memory of the speaker assembly. The threshold values may include threshold temperature values for the temperature measurement as described above, and threshold voltage values for the voltage measurement as described above. The threshold temperature values may include an upper threshold limit (for example, 40°C, 50°C, 60°C, 85°C, or any other temperature). When this upper threshold limit is exceeded, a fault may be determined within the speaker assembly 102, as described below. The threshold temperature values may include a lower threshold limit (for example, 0°C, -10°C, -20°C, -40°C, or any other temperature). When this lower threshold limit is exceeded, a fault may be determined within the speaker assembly 102, as described below. The threshold voltage value may include a lower value set at 0 Volt (or relatively, 0 Volt i.e. no or minimal voltage / current passing through the circuit being tested) and may include an upper threshold limit which may be set depending on the specific appliance. The upper threshold limit may, for example, be set at 5.5 Volt for a system that is supposed to run at 5 Volt. When the voltage either drops to 0 Volt (or close to 0 Volt, for example, 0.1 Volt) or increases above the upper threshold limit, then a fault may be determined within the speaker assembly 102, as described below. The one or more diagnostic signals may include an ACK and / or a NACK signal as described above. When the processor of the speaker assembly 102 receives a NACK signal (i.e. the signal sent to the one or more components of the system 100 have not been received by the one or more components of the system - the amplifier 110, and / or the computing means 112), then a fault may be determined within the speaker assembly 102, as described below. Although a lower value of 0 Volt and an upper threshold limit of 5.5 Volt are described, the lower value and the upper threshold limit may be set to any positive or negative voltage. This may be set relative to the battery voltage (for example, the battery voltage of a vehicle).

[0035] The processor of the speaker assembly 102 determines a fault within the speaker assembly 102 if the one or more diagnostic signals are outside of the threshold values and / or when a NACK signal is received. Advantageously, the speaker assembly 102 includes computing means 106 to determine whether any components 104, 106 of the speaker assembly 102 are faulty, or when one or more drivers 104 of the speaker assembly are approaching a dangerously high or low temperature. In the system 100 of speaker assemblies 102, this more accurately determines faults at the speaker / driver level, because each speaker assembly comprises circuitry to determine faults, compared to a system of speaker assemblies that has one fault detection circuitry for all speaker assemblies. This is because the fault detection is done at the speaker assembly 102, which reduces the need for diagnostic signals to be communicated over multiple channels. Furthermore, diagnostics (for example, temperature and / or voltage measurements) are measured at the speaker level which provides a more accurate measurement of the condition of the speaker assembly 102 compared, for example, to diagnostics being measured on a system level (for example, an ambient air temperature measured by a vehicle). Furthermore, this reduces the failure rate of fault detection due to the presence of multiple fault detection means (i.e. in each speaker assembly, rather than one in a system).

[0036] In an embodiment, the processor of the speaker assembly 102 may determine a fault within the amplifier 108 and / or the computing means 112, if diagnostic signals (for example, a temperature reading, or a voltage reading) are received by the processor of the speaker assembly 102 from the amplifier 108 and / or the computing means 112, and if the one or more diagnostic signals are outside of threshold values (for example, a low voltage reading, receipt of a NACK signal, a low or high temperature reading, or a combination thereof).

[0037] A fault may be determined when the temperature measurement is above a first threshold temperature (a higher threshold limit) or below a second threshold temperature (a lower threshold limit), as described above. The first threshold temperature is higher than the second threshold temperature. The processor of the speaker assembly 102 may be further configured to reduce power provided to the one or more drivers 104 when the temperature measurement is above the first threshold temperature. The processor of the speaker assembly 102 may be configured to gradually reduce power provided to the one or more drivers 104 as the temperature measurement increases. For example, the processor of the speaker assembly 102 may be configured to reduce power by a first factor when the temperature measurement is above the first threshold temperature. The processor of the speaker assembly 102 may be configured to reduce power by a second factor which is larger than the first factor when the temperature measurement is above a third threshold temperature (which is higher than the first threshold temperature). The processor of the speaker assembly 102 may be configured to reduce power by a third factor which is larger than the second factor when the temperature measurement is above a fourth threshold temperature (which is higher than the third threshold temperature). The first threshold temperature may be a temperature close to a failing point of the one or more drivers, the third threshold temperature may be a temperature at a failing point of the one or more drivers 104, and the fourth threshold temperature may be a temperature above the failing point of the one or more drivers 104. The processor of the speaker assembly 102 may alternatively or additionally be configured to increase power provided to the one or more drivers 104 when the temperature measurement is below the second threshold temperature. Advantageously, the speaker assembly 102 can be safely used in more extreme temperatures because the temperature measurements taken at the speaker assembly 102 driver 104 level are more accurate than measurements taken at a system level (for example, ambient air temperature). Thus, temperature headroom for speakers can be tuned more accurately and the speaker assembly can be made available for a larger temperature range without large modification of the driver. For example, a speaker assembly that was previously configured for temperatures between -20°C and 40°C may be configured for temperatures between -40°C and 85°C with this arrangement.

[0038] By taking temperature and voltage measurements, and determining a fault is present within the speaker assembly 102 utilising the existing communication infrastructure (as opposed to additional temperature measurement components that are outside the speaker assembly 102 and the other components of the system 100, automotive logistics and cost requirements are made easier.

[0039] In an embodiment, the processor of the speaker assembly 102 sends the one or more diagnostic signals to the amplifier circuitry 110 or the computing means 112. The amplifier circuitry 110 or the computing means 112 may be operable to compare the one or more received diagnostic signals with threshold values (for example, the threshold values as described above) stored in a memory of the amplifier circuitry 110 or the computing means 112. The amplifier circuitry 110 or the computing means 112 may determine a fault with the received diagnostic signals in the same way as described above with regard to the processor of the speaker assembly 102. The amplifier circuitry 110 or the computing means 112 may reduce power provided to the one or more drivers 104 as described above in a similar manner as the processor of the speaker assembly 102.

[0040] In an embodiment, the system 100 includes a signal processing block (not shown). The signal processing block may be electrically coupled to the amplifier circuitry 110. The signal processing block may be part of the amplifier 108, the computing means 112, or it may be a standalone device. The signal processing block may receive, from the speaker assembly 102, the diagnostic signals. The signal processing block may be operable to compare the one or more received diagnostic signals with threshold values (for example, the threshold values as described above) stored in a memory of the amplifier circuitry 110, the computing means 112, or the signal processing block. The signal processing block may determine a fault with the received diagnostic signals in the same way as described above with regard to the processor of the speaker assembly 102. The signal processing block may instruct the amplifier circuitry 110 to reduce power provided by the amplifier 108 to the one or more drivers 104, as described above in a similar manner as the processor of the speaker assembly 102.

[0041] It is imperative that the temperature of the speaker assembly 102 (in particular, the one or more drivers 104 and the cables within the speaker assembly 102) do not exceed the higher threshold temperature as described above. If they do, there are risks of permanent damage to the speaker assembly 102. Previous attempts of doing so involved leaving a large headroom between how hard the one or more drivers 104 are driving and the absolute maximum temperature rating. The temperature of the speaker assembly 102 and / or the one or more drivers 102 could also be model as a function of the content played back by the speaker assembly and, accordingly, compression of that content could be applied when the temperature has been determined to be too high.

[0042] By adding temperature measurement to the speaker assembly 102 and, in particular, to the one or more drivers 104, protective compression can be avoided. This is beneficial because the protective compression significantly reduces the sound quality and typically degrades the performance of the content played back before it is accurately known that an actual temperature threshold (i.e. one where irreparable damage to the speaker assembly 102 and / or the one or more drivers 104) has been exceeded. This is especially valuable in sound zone applications where precise control of the sound field is required and compression would significantly reduce the ability to create useful sound fields. A sound field is an arrangement in a space, for example in a cabin of a vehicle, where multiple speaker assemblies (and / or multiple drivers) are operated simultaneously and, where multiple 'zones' are created. For example, a first user within the space may be listening to first content and a second user may be listening to second content that is different to the first content. A first speaker assembly may playback the first content and also sound that cancels out the waves of the second content. Similarly, a second speaker assembly may playback the second content and also sound that cancels out the waves of the first content. Thus, each user within the space can listen to their content with minimal to no interruptions from the other content. This requires a high level of calibration, which can be improved on when no compression has to be added to the sound content due to inaccurate temperature measurements. Once the higher threshold temperature is reached (by the measurement) then limiting factors may be applied to the speaker assembly 102, for example, by reducing energy put into the one or more drivers 104 or, if need be, applying compression.

[0043] By adding voltage measurement to the speaker assembly 102, improved diagnostics can be provided to the system 100 by being able to determine if a signal arrives at the speaker assembly 102 terminals (or the terminals of any other component(s) within the system 100). Diagnostics are very important within the automotive industry and are also becoming an increasingly more important selling point for consumers who seek out more environmentally friendly components (for example, that are easier and more economical to repair). By improving the diagnostics, a vehicle including the system 100 as described above, can store which component(s) of the system 100 are faulty. This information can be displayed to the user or in a workshop (for example, via a user interface coupled to the system 100 - this user interface may be a separate user interface that can be plugged into the system 100).

[0044] Figure 2 depicts a vehicle 200 that includes the system 100 as described above with reference to Figure 1. The vehicle may be a road, off-road, air, amphibious or any other suitable type of vehicle. In addition to the system 100 as described above, the vehicle 200 may include one speaker assembly 102 as described above or, alternatively, it may include a plurality of speaker assemblies 102a, 102b, 102c, 102d. Each speaker assembly 102a, 102b, 102c, 102d may have the same connections and functionality as described above with reference to Figure 1. Although four speaker assemblies 102a, 102b, 102c, 102d are depicted in Figure 2, the invention is not limited to four speaker assemblies and may include one speaker assembly, two speaker assemblies or any number of speaker assemblies.

[0045] The vehicle 200 may include at least one speaker assembly 102 as defined above, an amplifier 108 as described above electrically coupled to the at least one speaker assembly 102, and computing means 112 (for example, an ECM) as described above. The computing means 112 may be electrically coupled to the amplifier 108 and the at least one speaker assembly 102. The computing means 112 may be operable to send an acknowledge (ACK) signal to the amplifier 108 and the at least one speaker assembly 102n. The computing means 112 may be further operable to determine the amplifier 108 is faulty when the computing means 112 receives a negative acknowledgement (NACK) signal from the amplifier 108. The computing means 112 may determine one or more of the at least one speaker assembly 102n is faulty when the computing means 112 receives a NACK signal from one or more of the at least one speaker assembly 102n, or a combination of the above. The computing means 112 may be further operable to store the one or more NACK signals on memory of the computing means 112. This mechanism is as also described above in Figure 1 with regard to the processor of the speaker assembly 102 and the sending and receiving of ACK and NACK signals. Similarly, the computing means 112 may determine that the amplifier 108 and / or the one or more speaker assemblies 102n are not faulty when an ACK are received.

[0046] Advantageously, the computing means 112 can diagnose whether one or more components within the vehicle 200 are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on the computing means 112 and can be retrieved by a user (for example, a mechanic) to determine exactly which component (for example, which speaker assembly 102n, amplifier 108, processor, memory, etc) of the system 200 is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method

[0047] In an embodiment, each memory of each speaker assembly 102n may store individual pre-determined sound characteristics for the one or more drivers 104 of each speaker assembly 102n. Accordingly, the memory of the first speaker assembly 102a may store individual pre-determined sound characteristics for the one or more drivers 104 of the first speaker assembly, the memory of the second speaker assembly 102a may store individual pre-determined sound characteristics for the one or more drivers 104 of the second speaker assembly that are different to the pre-determined sound characteristics for the one or more drivers 104 of the first speaker assembly, etc.

[0048] Speakers, such as speaker assemblies 102n, can vary significantly in sensitivity due to manufacturing tolerances with the drivers 104, the cables, and any additional hardware components. Speakers with good tolerances require high skills, more expensive materials and increased time to manufacture and, thus, come at a higher price. Since the speaker assemblies 102n include a memory (for example, on a PCB) as described above, the sensitivity of each speaker assembly 102a, b, c, d, ..., n can be characterised during manufacturing of the speaker assemblies 102n. This is done, as shown in Figure 3, by testing each speaker assembly 102n individually (with calibrator 302) and by applying (by calibrator 302) individual sound characteristic to each speaker assembly 102n. This may include performing, by the one or more drivers 104 a frequency sweep and recording, by a microphone of the calibrator, the frequency sweep of the one or more drivers 104 to determine the frequency response of the speaker assembly 102n. The individual sound characteristics are then stored on the memory of each speaker assembly 102n. The individual sound characteristics may be applied to the one or more drivers 104 of each speaker assembly 102n. The individual sound characteristic includes changes (for example, to the frequency response (i.e. sound equaliser settings, the volume), the resonance frequency, or any combination thereof) and ensures that any differences in sound quality are overcome so that each speaker assembly 102n has the same sound quality after it has been manufactured. Thus the performance of speaker assemblies 102n can be improved without increasing the manufacturing cost, which increases the value of the speaker assemblies 102n. Accordingly, each speaker assembly 102n can perform as if it has drivers and hardware with better tolerances without manufacturing them for better tolerances. This is especially valuable in sound zone applications (as described above) where precise control of the sound field is required and where the speaker tolerances play a large role in producing a high quality sound zone.

[0049] In an embodiment, the individual sound characteristics may be stored in amplifier circuitry 110 (for example, a memory of the amplifier circuitry 110), in the computing means 112 (for example, memory of the computing means 112), or in the signal processing block (as described above). The amplifier 108 can apply the individual sound characteristics to a signal (for example, an amplified sound signal to be played back by the one or more drivers 104 of each speaker assembly 102n) and subsequently send the signal sent to the one or more drivers 104 of each speaker assembly 102n.

[0050] In an embodiment, the processor of a first speaker assembly 102a may be further configured to receive a sound signal (for example, a signal including sound to be played back by the one or more drivers 104 of the first speaker assembly 102a) from the amplifier 108 and to apply first pre-determined sound characteristics (for example, calibrating sound characteristics specific to the first speaker assembly 102a and calibrated by calibrator 302) to the sound signal. The first pre-determined sound characteristics are stored on the memory of the first speaker assembly 102a. The processor of the first speaker assembly 102a may be further configured to receive second pre-determined sound characteristics from an electronic control module (ECM) of the vehicle 200. The second pre-determined sound characteristics may be sound characteristics determined by a vehicle manufacturer to specify a specific type of sound type for the manufacturer (for example, this may be a more bass-heavy sound for a first vehicle manufacturer or a brighter sound for a second vehicle manufacturer). The processor of the first speaker assembly 102a may apply the second pre-determined sound characteristics to the sound signal. The processor first speaker assembly 102a may be further configured to send a first modified sound signal corresponding to the sound signal with the applied first pre-determined sound characteristics and second pre-determined sound characteristics to the driver to be played back. Accordingly, the sound played back includes both a first sound characteristic to ensure that the first speaker assembly 102 sounds as it was intended by the speaker manufacturer (with reduced tolerances) and a second sound characteristic to ensure that the first speaker assembly 102 sounds as it was intended by the vehicle manufacturer (for example, with an increased focus on bass sounds). As described above, despite rigorous quality and assessment, the sound characteristics of speaker assemblies of a certain model type can vary significantly from speaker assembly to speaker assembly. By storing calibration data that is specific to each speaker assembly unit of a speaker assembly model, the speaker assembly can be tuned to reproduce a sound characteristic that is intended by the manufacturer. In addition to this, a vehicle manufacturer can apply further sound characteristics (second pre-determined sound characteristics) to represent a sound quality that is intended by the vehicle manufacturer. Advantageously, a universal sound quality can be guaranteed despite variations in build quality of speaker assembly units.

[0051] In an embodiment the processor of a second speaker assembly 102b may be configured to receive the sound signal from the amplifier 108, and to apply third pre-determined sound characteristics (i.e. calibration for the second speaker assembly 102b) to the sound signal. The third pre-determined sound characteristics stored on the memory of the second speaker assembly 102b are different to the first pre-determined sound characteristics stored on the memory of the first speaker assembly 102a. The processor of the second speaker assembly 102b may be further configured to receive the second pre-determined sound characteristics from the ECM 112 and apply the second pre-determined sound characteristics to the sound signal. The ECM 112 may be further configured to send a second modified sound signal corresponding to the sound signal with the applied third pre-determined sound characteristics and second pre-determined sound characteristics to the driver of the second speaker assembly (to be played back by the one or more drivers 104 of the second speaker assembly 102b). The sound characteristics of first modified sound signal and the second modified sound signal may be identical. Advantageously, a universal sound quality can be guaranteed despite variations in build quality of speaker assembly units. By storing calibration data that is specific to each speaker assembly unit of a speaker assembly model, the speaker assembly can be tuned to reproduce a sound characteristic that is intended by the manufacturer (for example, each speaker assembly unit will have different stored calibration data / pre-determined sound characteristics such that all speaker assembly units of the same model represent sound with the same characteristics).

[0052] In an embodiment, the first pre-determined sound characteristics, the second pre-determined sound characteristics, and the third pre-determined sound characteristics may include sound equaliser settings, volume, resonance frequency, or any combination of the above. Advantageously, the sound reproduced by the speaker assembly can be accurately fine-tuned to overcome any manufacturing defects. The invention is not limited to first, second and third pre-determined sound characteristics and may further include fourth pre-determined sound characteristics (for a third speaker assembly 102c), fifth pre-determined sound characteristics (for a fourth speaker assembly 102d), and n+1 pre-determined sound characteristics (for an n th< speaker assembly 102n).

[0053] Figure 4 shows a flow chart of a method 300 for a speaker assembly, for example speaker assembly 102 or speaker assemblies 102n as described above with reference to Figures 1 to 3, and according to the invention. The method includes includes receiving, by a processor of the speaker assembly 102, 102n as defined above, one or more diagnostic signals as shown in 402. The method further includes comparing, by the processor, the one or more diagnostic signals with threshold values stored in memory of the speaker assembly 102, 102n as shown in 404. The method further includes determining, by the processor, a fault within the speaker assembly 102, 102n if the one or more diagnostic signals are outside of the threshold values as shown in 406. The method further includes adjusting one or more features of the speaker assembly 102, 102n when a fault is determined as shown in 408. Advantageously, it can be determined whether any components of the speaker assembly are faulty. In a system of speaker assemblies, this more accurately determines faults at the speaker level, because each speaker assembly comprises circuitry to determine faults, compared to a systems of speaker assemblies that has one fault detection circuitry for all speaker assemblies. This is because the fault detection is done at the speaker assembly, which reduces the need for diagnostic signals to be communicated over multiple channels. Furthermore, diagnostics (for example, temperature and / or voltage measurements) are measured at the speaker level which provides a more accurate measurement of the condition of the speaker assembly compared, for example, to diagnostics being measured on a system level (for example, an ambient air temperature measured by a vehicle). Furthermore, this reduces the failure rate of fault detection due to the presence of multiple fault detection means (i.e. in each speaker assembly, rather than one in a system).

[0054] Figures 5, 6 and 7 show additional method steps of a speaker assembly (such as speaker assembly 102, 102n as described above with reference to Figures 1 to 3) as described above with reference to the method 400 of Figure 4. The steps in Figures 5, 6 and 7 may each be performed separately in combination with those of Figure 4. The steps in Figures 5, 6 and 7 may each be performed in any combination (for example, the steps of Figures 5 and 6, the steps of Figures 5 and 7, the steps of Figures 6 and 7, or any combination of any steps within any of Figures 5 to 7) in combination with those of Figure 4.

[0055] In Figure 5 the method may further include measuring a temperature of the driver 104 as shown in 502. The method may further include sending the temperature measurement to the processor of the speaker assembly 102, 102, wherein the temperature measurement is one of the one or more diagnostic signals as shown in 504. The method may further include determining a fault when the temperature measurement is above a first threshold temperature or below a second threshold temperature, the first threshold temperature is higher than the second threshold temperature as shown in 506. The method may further include reducing, by the processor of the speaker assembly 102, 102n, power provided to the driver when the temperature measurement is above the first threshold temperature or increasing, by the processor of the speaker assembly 102, 102n, power provided to the driver 104 when the temperature measurement is below the second threshold temperature as shown in 508. Advantageously, the speaker assembly 102, 102n can be safely used in more extreme temperatures because the temperature measurements taken at the speaker assembly / driver level are more accurate than measurements taken at a system level (for example, ambient air temperature). Thus, temperature headroom for speakers can be tuned more accurately and the speaker assembly can be made available for a larger temperature range without large modification of the driver. For example, a speaker assembly that was previously configured for temperatures between -20°C and 40°C may be configured for temperatures between -40°C and 85°C with this arrangement.

[0056] In Figure 6 the method may further include measuring a voltage of one or more electrical connections between: the driver 104 and the processor of the speaker assembly 102, 102n, the driver 104 and the amplifier 108, and / or the processor of the speaker assembly 102, 102n and an electronic control module (ECM) 112 (or any other suitable computing means 112) of a vehicle (for example, vehicle 200 as described above with reference to Figure 2) as shown at 602. The method may further include determining that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold, wherein the one or more voltages is one of the one or more diagnostic signals as shown at 604. The method may further include sending a signal to the amplifier 108 or to the ECM 112 indicating that the speaker assembly 102, 102n is faulty, if one or more electrical connections are determined to be faulty as shown at 606. Advantageously, it can be diagnosed whether one or more components within the speaker assembly 102, 102n are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on a computer system (for example, of a vehicle) and can be retrieved by a user (for example, a mechanic) to determine exactly which speaker assembly of multiple speaker assemblies is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0057] In Figure 7 the method may further include sending an acknowledge (ACK) signal from an electric control module (ECM) 112 (or computing means 112 as described above) of a vehicle (for example, vehicle 200 as described with reference to Figure 2) to the amplifier 108 and the at least one speaker assembly 102, 102n as shown at 702. The method may further include determining, by the ECM 112, the amplifier 108 is faulty when the ECM 112 receives a negative acknowledgement (NACK) signal from the amplifier 108 as shown at 704. The method may further include determining one or more of the at least one speaker assembly 102, 102n is faulty when the ECM 112 receives a NACK signal from one or more of the at least one speaker assembly 102, 102n, or a combination of the above as shown at 706. The method may further include storing the one or more NACK signals on memory of the ECM 112 as shown at 708. The method may proceed from 702 directly to 706, skipping 704. The method may proceed from 704 directly to 708, skipping 706. Advantageously, the ECM can diagnose whether one or more components within the vehicle are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on the ECM and can be retrieved by a user (for example, a mechanic) to determine exactly which component (for example, which speaker assembly, amplifier, processor, memory, etc) of the system is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

Examples

Embodiment Construction

[0023]The present invention provides a cost-efficient speaker assembly that is configured to receive one or more diagnostic signals and to determine one or more faults with the speaker assembly.

[0024]Figure 1 shows a system 100 for a playing back sound / music. The system may include multiple components, such as a speaker assembly 102, an amplifier 108, and a computing means 112 (which may, for example, be an electronic control module (ECM)). The components of the system 100 may communicate with one another, to send and / or receive power and / or data, by means of a wired or wireless coupling. To accomplish this, each of the speaker assembly 102, the amplifier 108 and the computing means 112 may include wired connections and / or wireless transceivers operable to couple the components with each other. The speaker assembly 102 may be coupled to the amplifier 108, the amplifier may be coupled to the computing means 112, and the computing means 112 may be coupled to the speaker assembly 102.

[...

[0001] The present invention relates to a speaker assembly, a corresponding method for a speaker assembly, and telemetry and calibration data for a speaker assembly.BACKGROUND OF THE INVENTION

[0002] Speaker assemblies, including individual drivers (for example, loud speakers) and units comprising multiple drivers (for example, one or more bass, mid-range, tweeters, or similar), can be implemented in a number of different scenarios. For example, one or more speaker assemblies are frequently included in the cabins of vehicles (such as automobiles, boats, airplanes and the like). Such vehicles, due to their nature of use, may exhibit a variety of different temperature fluctuations. For example, a vehicle may be manufactured to sustain temperatures between -20°C and up to 40°C. Accordingly, each component within the vehicle, including the one or more speaker assemblies, may be manufactured to sustain those temperatures without failing. For example, a speaker assembly may be switched off when the vehicle detects that the outside or inside temperature of the vehicle is below -20°C or above 40°C. However, such a measurement may not reflect the temperature of the driver of the vehicle, which may lead to pre-mature switching off of the speaker assembly (if the temperature at the speaker assembly does not exceed those thresholds) or damage to the speaker assembly (if the temperature at the speaker assembly exceeds those thresholds).

[0003] If one or more components of the audio system (including the one or more speaker assemblies, an amplifier, lighting systems, computing means, etc.) have been damaged (for example, due to excessive temperatures), it is also difficult to ascertain which component has been damaged. This typically leads to time consuming investigation and sometimes entire replacement of the audio system, adding further unnecessary cost to the consumer.

[0004] In addition to this, there is a demand for increased sound quality from speaker assemblies at a lower cost to the consumer. With the reduction of manufacturing costs and the further increase of mass production, it is difficult to maintain a constant high quality of sound from each speaker assembly during manufacturing.

[0005] It is an aim of this invention to address the above-mentioned issues, for example, by providing a cost-efficient speaker assembly that is configured to receive one or more diagnostic signals and to determine one or more faults with the speaker assembly.SUMMARY

[0006] To achieve the above objectives, the invention sets out a speaker assembly, a vehicle, and a method for a speaker assembly as in the claims below.

[0007] In a preferred embodiment, a speaker assembly is provided. The speaker assembly includes a driver, a memory, a processor (for example, a microcontroller (MCU)), and a housing wherein the driver, the memory and the processor are within the housing. The processor is configured to receive one or more diagnostic signals, compare the one or more diagnostic signals with threshold values stored in the memory, determine a fault within the speaker assembly if the one or more diagnostic signals are outside of the threshold values, and adjust one or more features of the speaker assembly when a fault is determined. Advantageously, the speaker assembly includes computing means to determine whether any components of the speaker assembly are faulty. In a system of speaker assemblies, this more accurately determines faults at the speaker level, because each speaker assembly comprises circuitry to determine faults, compared to a systems of speaker assemblies that has one fault detection circuitry for all speaker assemblies. This is because the fault detection is done at the speaker assembly, which reduces the need for diagnostic signals to be communicated over multiple channels. Furthermore, diagnostics (for example, temperature and / or voltage measurements) are measured at the speaker level which provides a more accurate measurement of the condition of the speaker assembly compared, for example, to diagnostics being measured on a system level (for example, an ambient air temperature measured by a vehicle). Furthermore, this reduces the failure rate of fault detection due to the presence of multiple fault detection means (i.e. in each speaker assembly, rather than one in a system).

[0008] In an embodiment, the speaker assembly may further include one or more electronic devices that is not a driver. The one or more electronic device include a temperature measuring device (for example, a thermometer), a voltmeter (which may be part of the processor), a light assembly comprising at least one illuminating element, a motor operable to move the driver relative to the housing or to move the speaker assembly relative to a fixture to which the speaker assembly is attached, or any combination of the above. Advantageously, the speaker assembly can have multiple functions in addition to providing audio to a consumer, such as providing immersive lighting and movement arrangements. By providing a thermometer and / or a voltmeter at the speaker assembly level, more accurate measurements of temperature and / or circuit voltage can be taken. This reduces the need to include large tolerances for temperature and / or voltage headroom when determining a fault (for example, excessive temperature and / or a loss in voltage / power) in the speaker assembly. Thus, the speaker assembly can be safely kept switched on in more extreme temperatures.

[0009] In an embodiment, the temperature measuring device may be configured to measure the temperature (this may be done periodically or continuously) of the driver, and send the temperature measurement to the processor, wherein the temperature measurement is one of the one or more diagnostic signals. Advantageously, the temperature of the driver and / or speaker assembly can be measured more accurately.

[0010] In an embodiment, a fault may be determined when the temperature measurement is above a first threshold temperature or below a second threshold temperature, the first threshold temperature is higher than the second threshold temperature. The processor may be further configured to reduce power provided to the driver when the temperature measurement is above the first threshold temperature. The processor may alternatively or additionally be configured to increase power provided to the driver when the temperature measurement is below the second threshold temperature. Advantageously, the speaker assembly can be safely used in more extreme temperatures because the temperature measurements taken at the speaker assembly / driver level are more accurate than measurements taken at a system level (for example, ambient air temperature). Thus, temperature headroom for speakers can be tuned more accurately and the speaker assembly can be made available for a larger temperature range without large modification of the driver. For example, a speaker assembly that was previously configured for temperatures between -20°C and 40°C may be configured for temperatures between -40°C and 85°C with this arrangement.

[0011] In an embodiment, the driver may be electrically coupled (for example, by means of a wired connection) to an amplifier and the processor. The one or more electronic devices may be electrically coupled in a bus configuration between the driver and the amplifier. Alternatively, the one or more electronic devices may be electrically coupled between the driver and the processor. Advantageously, the one or more electronic devices can be added after manufacturing of the speaker assembly (for example, by the speaker assembly manufacturer or by a subsequent manufacturer, such as an automotive manufacturer) because the bus configuration does not require disassembly or re-wiring of the speaker assembly.

[0012] In an embodiment, the processor may be further configured to measure a voltage of one or more electrical connections between: the driver and the processor, the driver and the amplifier, and / or the processor and an electronic control module (ECM) of a vehicle. The processor may be further configured to determine that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold, wherein the one or more voltages is one of the one or more diagnostic signals. The processor may be further configured to send a signal to the amplifier or to the ECM indicating that the speaker assembly is faulty, if one or more electrical connections are determined to be faulty. Advantageously, the speaker assembly can diagnose whether one or more components within the speaker assembly are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on a computer system (for example, of a vehicle) and can be retrieved by a user (for example, a mechanic) to determine exactly which speaker assembly of multiple speaker assemblies is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0013] In an embodiment, the processor may be further configured to receive a sound signal from an amplifier and to apply first pre-determined sound characteristics (for example, calibrating sound characteristics specific to the speaker assembly) to the sound signal, the first pre-determined sound characteristics stored on the memory. The processor may be further configured to receive second pre-determined sound characteristics from an electronic control module (ECM) of a vehicle (for example, sound characteristics determined by a manufacturer) and to apply the second pre-determined sound characteristics to the sound signal. The processor may be further configured to send a first modified sound signal corresponding to the sound signal with the applied first pre-determined sound characteristics and second pre-determined sound characteristics to the driver. Despite rigorous quality and assessment, the sound characteristics of speaker assemblies of a certain model type can vary significantly from speaker assembly to speaker assembly. By storing calibration data that is specific to each speaker assembly unit of a speaker assembly model, the speaker assembly can be tuned to reproduce a sound characteristic that is intended by the manufacturer. In addition to this, a vehicle manufacturer can apply further sound characteristics (second pre-determined sound characteristics) to represent a sound quality that is intended by the vehicle manufacturer. Advantageously, a universal sound quality can be guaranteed despite variations in build quality of speaker assembly units.

[0014] In an embodiment, a system is provided, the system including the speaker assembly as described above and a second speaker. The processor of the second speaker assembly may be configured to receive the sound signal from the amplifier, and to apply third pre-determined sound characteristics to the sound signal, the third pre-determined sound characteristics stored on the memory of the second speaker assembly are different to the first pre-determined sound characteristics. The processor of the second speaker assembly may be further configured to receive the second pre-determined sound characteristics from the ECM, apply the second pre-determined sound characteristics to the sound signal, and send a second modified sound signal corresponding to the sound signal with the applied third pre-determined sound characteristics and second pre-determined sound characteristics to the driver of the second speaker assembly. The sound characteristics of first modified sound signal and the second modified sound signal may be identical. Advantageously, a universal sound quality can be guaranteed despite variations in build quality of speaker assembly units. By storing calibration data that is specific to each speaker assembly unit of a speaker assembly model, the speaker assembly can be tuned to reproduce a sound characteristic that is intended by the manufacturer (for example, each speaker assembly unit will have different stored calibration data / pre-determined sound characteristics such that all speaker assembly units of the same model represent sound with the same characteristics).

[0015] In an embodiment, the first pre-determined sound characteristics, the second pre-determined sound characteristics, and the third pre-determined sound characteristics may include sound equaliser settings, volume, resonance frequency, or any combination of the above. Advantageously, the sound reproduced by the speaker assembly can be accurately fine-tuned to overcome any manufacturing defects.

[0016] In a preferred embodiment, a vehicle is provided. The vehicle may include at least one speaker assembly as defined above, an amplifier electrically coupled to the at least one speaker assembly, and an electronic control module, ECM, the ECM electrically coupled to the amplifier and the at least one speaker assembly.

[0017] In an embodiment, the ECM may be operable to send an acknowledge (ACK) signal to the amplifier and the at least one speaker assembly. The ECM may be further operable to determine the amplifier is faulty when the ECM receives a negative acknowledgement (NACK) signal from the amplifier, determine one or more of the at least one speaker assembly is faulty when the ECM receives a NACK signal from one or more of the at least one speaker assembly, or a combination of the above. The ECM may be further operable to store the one or more NACK signals on memory of the ECM. Advantageously, the ECM can diagnose whether one or more components within the vehicle are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on the ECM and can be retrieved by a user (for example, a mechanic) to determine exactly which component (for example, which speaker assembly, amplifier, processor, memory, etc) of the system is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0018] In a preferred embodiment, a method for a speaker assembly is provided. The method includes receiving, by a processor of a speaker assembly as defined above, one or more diagnostic signals. The method further includes comparing, by the processor, the one or more diagnostic signals with threshold values stored in memory of the speaker assembly. The method further includes determining, by the processor, a fault within the speaker assembly if the one or more diagnostic signals are outside of the threshold values. The method further includes adjusting one or more features of the speaker assembly when a fault is determined. Advantageously, it can be determined whether any components of the speaker assembly are faulty. In a system of speaker assemblies, this more accurately determines faults at the speaker level, because each speaker assembly comprises circuitry to determine faults, compared to a systems of speaker assemblies that has one fault detection circuitry for all speaker assemblies. This is because the fault detection is done at the speaker assembly, which reduces the need for diagnostic signals to be communicated over multiple channels. Furthermore, diagnostics (for example, temperature and / or voltage measurements) are measured at the speaker level which provides a more accurate measurement of the condition of the speaker assembly compared, for example, to diagnostics being measured on a system level (for example, an ambient air temperature measured by a vehicle). Furthermore, this reduces the failure rate of fault detection due to the presence of multiple fault detection means (i.e. in each speaker assembly, rather than one in a system).

[0019] In an embodiment, the method may further include measuring a temperature of the driver, and sending the temperature measurement to the processor, wherein the temperature measurement is one of the one or more diagnostic signals. The method may further include determining a fault when the temperature measurement is above a first threshold temperature or below a second threshold temperature, the first threshold temperature is higher than the second threshold temperature. Th method may further include reducing, by the processor, power provided to the driver when the temperature measurement is above the first threshold temperature or increasing, by the processor, power provided to the driver when the temperature measurement is below the second threshold temperature. Advantageously, the speaker assembly can be safely used in more extreme temperatures because the temperature measurements taken at the speaker assembly / driver level are more accurate than measurements taken at a system level (for example, ambient air temperature). Thus, temperature headroom for speakers can be tuned more accurately and the speaker assembly can be made available for a larger temperature range without large modification of the driver. For example, a speaker assembly that was previously configured for temperatures between -20°C and 40°C may be configured for temperatures between -40°C and 85°C with this arrangement.

[0020] In an embodiment, the method may further include measuring a voltage of one or more electrical connections between: the driver and the processor, the driver and the amplifier, and / or the processor and an electronic control module (ECM) of a vehicle. The method may further include determining that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold, wherein the one or more voltages is one of the one or more diagnostic signals. The method may further include sending a signal to the amplifier or to the ECM indicating that the speaker assembly is faulty, if one or more electrical connections are determined to be faulty. Advantageously, it can be diagnosed whether one or more components within the speaker assembly are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on a computer system (for example, of a vehicle) and can be retrieved by a user (for example, a mechanic) to determine exactly which speaker assembly of multiple speaker assemblies is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0021] In an embodiment, the method may further include sending an acknowledge (ACK) signal from an electric control module, ECM, of a vehicle to the amplifier and the at least one speaker assembly. The method may further include determining, by the ECM, the amplifier is faulty when the ECM receives a negative acknowledgement (NACK) signal from the amplifier, determining one or more of the at least one speaker assembly is faulty when the ECM receives a NACK signal from one or more of the at least one speaker assembly, or a combination of the above. The method may further include storing the one or more NACK signals on memory of the ECM. Advantageously, the ECM can diagnose whether one or more components within the vehicle are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on the ECM and can be retrieved by a user (for example, a mechanic) to determine exactly which component (for example, which speaker assembly, amplifier, processor, memory, etc) of the system is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The features, objects, and advantages of the present disclosure will become more apparent from the detailed description set forth below when taken in conjunction with the drawings in which like reference numerals refer to similar elements. Figure 1 shows an example system of a speaker assembly, an amplifier and an electronic control module; Figure 2 shows an example of the system of figure 1 in a vehicle; Figure 3 shows a calibration arrangement for a speaker assembly, such as the speaker assembly in figures 1 and 2; Figure 4 depicts a flow chart of a method for a speaker assembly, such as the speaker assembly in figures 1, 2 and 3, according to the invention; Figure 5 depicts a flow chart of further methods for a speaker assembly, according to alternative embodiments of the invention; Figure 6 depicts a flow chart of yet further methods for a speaker assembly, according to alternative embodiments of the invention; and Figure 7 depicts a flow chart of yet further methods for a speaker assembly, according to alternative embodiments of the invention. DETAILED DESCRIPTION

[0023] The present invention provides a cost-efficient speaker assembly that is configured to receive one or more diagnostic signals and to determine one or more faults with the speaker assembly.

[0024] Figure 1 shows a system 100 for a playing back sound / music. The system may include multiple components, such as a speaker assembly 102, an amplifier 108, and a computing means 112 (which may, for example, be an electronic control module (ECM)). The components of the system 100 may communicate with one another, to send and / or receive power and / or data, by means of a wired or wireless coupling. To accomplish this, each of the speaker assembly 102, the amplifier 108 and the computing means 112 may include wired connections and / or wireless transceivers operable to couple the components with each other. The speaker assembly 102 may be coupled to the amplifier 108, the amplifier may be coupled to the computing means 112, and the computing means 112 may be coupled to the speaker assembly 102.

[0025] The speaker assembly 102 includes a driver 104, such as a loudspeaker. In an embodiment, the speaker assembly 102 includes multiple drivers 104 (not shown) which may be one or more identical drivers, one or more different types of drivers (for example, bass, mid-range and / or tweeters), or a combination thereof. The speaker assembly 102 also includes additional electronic components 106. The additional electronic components 106 include computing means which have a processor and a memory (not shown) and may include one or more electronic devices. The memory may be any type of memory capable of storing instructions and / or data thereon. The processor may be a microcontroller (MCU) or any other suitable low power processor. The speaker assembly 102 includes a housing (not shown), wherein the driver 104 or plurality of drivers 104 and the additional electronic components 106 (including the processor and the memory) are within the housing. The speaker assembly 102 may include the amplifier 108 and the amplifier may be within the housing.

[0026] The additional electronic components 106 are different to the one or more drivers 104 and, in addition to the memory and processor as described above, may include a variety of electronic devices (such as circuitry) to add a number of additional features to the speaker assembly 102. In an embodiment, the electronic components 106 may include a temperature measuring device (for example, thermometer - this may be integrated to a mic controller of the speaker assembly 102) operable to measure a temperature of the one or more drivers 104. The electronic components 106 may include a voltmeter, an ammeter or any other component suitable to measure a voltage, current and / or power of an electrical connection and / or electrical device. The voltmeter, ammeter, or other may be part of the processor of the speaker assembly 102. The electronic components 106 may include a light assembly comprising at least one illuminating element. This may include one or more light emitting diodes (LEDs) or any other suitable illuminating element and may be operable to perform a light show based on instructions stored on the memory of the speaker assembly 102 and sent to the light assembly by the processor of the speaker assembly 102. The electronic components 106 may include a motor (for example, an AC motor, DC motor, brushed motor, brushless motor, servo motor, or any other suitable type of motor). The motor may be operable to move the one or more drivers 104 relative to the housing or to move the speaker assembly 102 relative to a fixture to which the speaker assembly is attached (for example, to a component of a vehicle such as a dashboard). For example, the motor may be able to protract the one or more drivers 104 or the speaker assembly 102 when an audio system of a vehicle is switched on, and to retract (hide) the one or more drivers 104 or the speaker assembly 102 when an audio system of the vehicle is switched off (for example, to provide more cabin space in the vehicle and / or to protect the one or more drivers 104 or the speaker assembly 102). Advantageously, the speaker assembly 102 can have multiple functions in addition to providing audio to a consumer, such as providing immersive lighting and movement arrangements. By providing a thermometer and / or a voltmeter at the speaker assembly level, more accurate measurements of temperature and / or circuit voltage can be taken. This reduces the need to include large tolerances for temperature and / or voltage headroom when determining a fault (for example, excessive temperature and / or a loss in voltage / power) in the speaker assembly. Thus, the speaker assembly can be safely kept switched on in more extreme temperatures.

[0027] The memory and the processor of the speaker assembly 102 may be part of a single printed circuit board (PCB). Some (i.e. one or more) or all of the electrical components 106 may be part of the PCB. Alternatively, additional electrical components 106 may be electrically coupled (i.e. plugged) onto the PCB. Advantageously, the electrical components 106 can be more easily integrated into the speaker assembly 102 in a smaller package. This allows for a smaller speaker assembly 102 that can be manufactured at a reduced cost (due to fewer electrical components and electrical connections being required).

[0028] The one or more electronic devices may be electrically coupled in a bus configuration between the driver 104 and the amplifier 108 (for example, the amplifier circuitry 108). Alternatively, the one or more electronic devices may be electrically coupled between the driver 104 and the processor of the speaker assembly 102. Advantageously, the one or more electronic devices can be added after manufacturing of the speaker (for example, by the speaker assembly manufacturer or by a subsequent manufacturer, such as an automotive manufacturer) because the bus configuration does not require disassembly or re-wiring of the speaker and allows fitting the speaker with electronics as part of the production of the speaker assembly. This can occur in the PCB arrangement, where the one or more electronic devices can be plugged into the PCB. By utilising electronic devices that are connected in a bus arrangement relative to the driver 104 and / or the processor / memory of the speaker assembly 102, the possibility is opened up of adding any further desired functionality that has previously been deemed cost prohibitive at very little additional cost. This is especially useful in the automotive industry, where the addition of electrical components after the manufacturing of the vehicle can prove very time consuming and costly.

[0029] The amplifier 108 may be any type of amplifier suitable for amplifying a sound signal to a level of power required for the speaker assembly 102. In addition to this, the amplifier 108 may include an amplifier circuit 110 which may include memory and a processor (not shown). The memory may be any type of memory capable of storing instructions and / or data thereon. The processor may be a microcontroller (MCU) as described above. The amplifier circuitry 110 may be electrically coupled (wired or wirelessly) to the speaker assembly 102. In an embodiment, the amplifier circuitry 110 may be electrically coupled to driver 104 of the speaker assembly 102 and / or to the additional electronic components 106 of the speaker assembly 102. Accordingly, the amplifier circuitry can send (via its processor) instructions / data (stored on its memory) to the speaker assembly 102. These instructions / data may include an acknowledge (ACK) signal sent to the driver 104 (or to each of the plurality of drivers 104) and / or to the additional electronic components 106 in order to determine that the driver(s) 104 and / or the additional electronic components 106 are functioning correctly. Additionally or alternatively, the amplifier circuitry 110 can send (via its processor) instructions / data (stored on its memory) to the computing means 112. These instructions / data may include an acknowledge (ACK) signal sent to the computing means 112 in order to determine that the computing means 112 are functioning correctly. Similarly, the computing means 112 may include a processor and memory (not shown).

[0030] The computing means 112 can send (via its processor) instructions / data (stored on its memory) to the amplifier circuitry 110 of the amplifier, the driver(s) 104 of the speaker assembly 102, the additional electronic components 106 of the driver, or any combination thereof. These instructions / data may include an acknowledge (ACK) signal in order to determine that any one or more of the amplifier circuitry 110, the driver(s) 104, and the additional electronic components 106 are functioning correctly.

[0031] The processor of the speaker assembly 102 is configured to receive one or more diagnostic signals. The diagnostic signals may be received from any component within the speaker assembly 102, such as one or more drivers 104 and / or one or more the additional electronic components 106. The diagnostic signals may be received from the amplifier circuitry 108 and / or the computing means 112. The diagnostic signals may include a temperature measurement of the one or more drivers 104 taken by the temperature measuring device as described above. Additionally, or alternatively, the diagnostic signals may include a voltage reading (this may also be a current and / or power reading) taken by the processor of the speaker assembly 102, or a voltmeter of the speaker assembly 102. The diagnostic signals may include a voltage reading (this may also be a current and / or power reading) taken by the processor of the amplifier circuitry 110, the computing means 112, a voltmeter of the amplifier 108, and / or a voltmeter of the computing means 112. The diagnostic signals may include an acknowledge signal (ACK), a not acknowledged signal (NACK), or a combination of the above received by the processor of the speaker assembly 102 from the amplifier circuitry 110 and / or the computing means 112. The diagnostic signals may include an ACK, a NACK or a combination of the above received by the processor of the amplifier circuitry 110 from the processor of the speaker assembly and / or the computing means or received by the computing means 112 from the processor of the amplifier circuitry 110 or the processor of the speaker assembly 102.

[0032] The temperature measuring device may be configured to measure the temperature (this measurement may be done periodically (repeatedly at pre-determined intervals) or continuously) of the one or more drivers 104 and send the temperature measurement to the processor of the speaker assembly 102. Advantageously, the temperature of the driver and / or speaker assembly can be measured more accurately.

[0033] As described above, the processor of the speaker assembly, or the voltmeter, may be further configured to measure a voltage of one or more electrical connections between the one or more drivers 104 and the processor of the speaker assembly 102, between the one or more drivers 104 and the amplifier 108, and / or between the processor of the speaker assembly 102 and the computing means 112 (for example, an electronic control module (ECM) of a vehicle). This measurement may be done periodically (repeatedly at pre-determined intervals) or continuously. The processor of the speaker assembly 102 may be further configured to determine that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold. The processor of the speaker assembly 102 may be configured to send a signal (i.e. a diagnostic signal) to the amplifier 110 (for example, the amplifier circuitry 108) or to the computing means 112 (for example, the ECM) indicating that the speaker assembly 102 is faulty, if one or more electrical connections are determined to be faulty. Alternatively, the amplifier 110 (for example, the amplifier circuitry 108) or the computing means 112 (for example, the ECM) may receive the signal (i.e. the diagnostic signal) from the processor of the speaker assembly 102. Subsequently, the amplifier 110 or the computing means 112 may determine that the speaker assembly 102 is faulty. Advantageously, the speaker assembly can diagnose whether one or more components within the speaker assembly are faulty, or if the connection between the driver / speaker 104 and the amplifier 108 is faulty (for example, because of a short circuit or other electrical failure). This information can be stored on a computer system (for example, of a vehicle) and can be retrieved by a user (for example, a mechanic) to determine exactly which speaker assembly of multiple speaker assemblies is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0034] The processor of the speaker assembly 102 compares the one or more received diagnostic signals with threshold values stored in the memory of the speaker assembly. The threshold values may include threshold temperature values for the temperature measurement as described above, and threshold voltage values for the voltage measurement as described above. The threshold temperature values may include an upper threshold limit (for example, 40°C, 50°C, 60°C, 85°C, or any other temperature). When this upper threshold limit is exceeded, a fault may be determined within the speaker assembly 102, as described below. The threshold temperature values may include a lower threshold limit (for example, 0°C, -10°C, -20°C, -40°C, or any other temperature). When this lower threshold limit is exceeded, a fault may be determined within the speaker assembly 102, as described below. The threshold voltage value may include a lower value set at 0 Volt (or relatively, 0 Volt i.e. no or minimal voltage / current passing through the circuit being tested) and may include an upper threshold limit which may be set depending on the specific appliance. The upper threshold limit may, for example, be set at 5.5 Volt for a system that is supposed to run at 5 Volt. When the voltage either drops to 0 Volt (or close to 0 Volt, for example, 0.1 Volt) or increases above the upper threshold limit, then a fault may be determined within the speaker assembly 102, as described below. The one or more diagnostic signals may include an ACK and / or a NACK signal as described above. When the processor of the speaker assembly 102 receives a NACK signal (i.e. the signal sent to the one or more components of the system 100 have not been received by the one or more components of the system - the amplifier 110, and / or the computing means 112), then a fault may be determined within the speaker assembly 102, as described below. Although a lower value of 0 Volt and an upper threshold limit of 5.5 Volt are described, the lower value and the upper threshold limit may be set to any positive or negative voltage. This may be set relative to the battery voltage (for example, the battery voltage of a vehicle).

[0035] The processor of the speaker assembly 102 determines a fault within the speaker assembly 102 if the one or more diagnostic signals are outside of the threshold values and / or when a NACK signal is received. Advantageously, the speaker assembly 102 includes computing means 106 to determine whether any components 104, 106 of the speaker assembly 102 are faulty, or when one or more drivers 104 of the speaker assembly are approaching a dangerously high or low temperature. In the system 100 of speaker assemblies 102, this more accurately determines faults at the speaker / driver level, because each speaker assembly comprises circuitry to determine faults, compared to a system of speaker assemblies that has one fault detection circuitry for all speaker assemblies. This is because the fault detection is done at the speaker assembly 102, which reduces the need for diagnostic signals to be communicated over multiple channels. Furthermore, diagnostics (for example, temperature and / or voltage measurements) are measured at the speaker level which provides a more accurate measurement of the condition of the speaker assembly 102 compared, for example, to diagnostics being measured on a system level (for example, an ambient air temperature measured by a vehicle). Furthermore, this reduces the failure rate of fault detection due to the presence of multiple fault detection means (i.e. in each speaker assembly, rather than one in a system).

[0036] In an embodiment, the processor of the speaker assembly 102 may determine a fault within the amplifier 108 and / or the computing means 112, if diagnostic signals (for example, a temperature reading, or a voltage reading) are received by the processor of the speaker assembly 102 from the amplifier 108 and / or the computing means 112, and if the one or more diagnostic signals are outside of threshold values (for example, a low voltage reading, receipt of a NACK signal, a low or high temperature reading, or a combination thereof).

[0037] A fault may be determined when the temperature measurement is above a first threshold temperature (a higher threshold limit) or below a second threshold temperature (a lower threshold limit), as described above. The first threshold temperature is higher than the second threshold temperature. The processor of the speaker assembly 102 may be further configured to reduce power provided to the one or more drivers 104 when the temperature measurement is above the first threshold temperature. The processor of the speaker assembly 102 may be configured to gradually reduce power provided to the one or more drivers 104 as the temperature measurement increases. For example, the processor of the speaker assembly 102 may be configured to reduce power by a first factor when the temperature measurement is above the first threshold temperature. The processor of the speaker assembly 102 may be configured to reduce power by a second factor which is larger than the first factor when the temperature measurement is above a third threshold temperature (which is higher than the first threshold temperature). The processor of the speaker assembly 102 may be configured to reduce power by a third factor which is larger than the second factor when the temperature measurement is above a fourth threshold temperature (which is higher than the third threshold temperature). The first threshold temperature may be a temperature close to a failing point of the one or more drivers, the third threshold temperature may be a temperature at a failing point of the one or more drivers 104, and the fourth threshold temperature may be a temperature above the failing point of the one or more drivers 104. The processor of the speaker assembly 102 may alternatively or additionally be configured to increase power provided to the one or more drivers 104 when the temperature measurement is below the second threshold temperature. Advantageously, the speaker assembly 102 can be safely used in more extreme temperatures because the temperature measurements taken at the speaker assembly 102 driver 104 level are more accurate than measurements taken at a system level (for example, ambient air temperature). Thus, temperature headroom for speakers can be tuned more accurately and the speaker assembly can be made available for a larger temperature range without large modification of the driver. For example, a speaker assembly that was previously configured for temperatures between -20°C and 40°C may be configured for temperatures between -40°C and 85°C with this arrangement.

[0038] By taking temperature and voltage measurements, and determining a fault is present within the speaker assembly 102 utilising the existing communication infrastructure (as opposed to additional temperature measurement components that are outside the speaker assembly 102 and the other components of the system 100, automotive logistics and cost requirements are made easier.

[0039] In an embodiment, the processor of the speaker assembly 102 sends the one or more diagnostic signals to the amplifier circuitry 110 or the computing means 112. The amplifier circuitry 110 or the computing means 112 may be operable to compare the one or more received diagnostic signals with threshold values (for example, the threshold values as described above) stored in a memory of the amplifier circuitry 110 or the computing means 112. The amplifier circuitry 110 or the computing means 112 may determine a fault with the received diagnostic signals in the same way as described above with regard to the processor of the speaker assembly 102. The amplifier circuitry 110 or the computing means 112 may reduce power provided to the one or more drivers 104 as described above in a similar manner as the processor of the speaker assembly 102.

[0040] In an embodiment, the system 100 includes a signal processing block (not shown). The signal processing block may be electrically coupled to the amplifier circuitry 110. The signal processing block may be part of the amplifier 108, the computing means 112, or it may be a standalone device. The signal processing block may receive, from the speaker assembly 102, the diagnostic signals. The signal processing block may be operable to compare the one or more received diagnostic signals with threshold values (for example, the threshold values as described above) stored in a memory of the amplifier circuitry 110, the computing means 112, or the signal processing block. The signal processing block may determine a fault with the received diagnostic signals in the same way as described above with regard to the processor of the speaker assembly 102. The signal processing block may instruct the amplifier circuitry 110 to reduce power provided by the amplifier 108 to the one or more drivers 104, as described above in a similar manner as the processor of the speaker assembly 102.

[0041] It is imperative that the temperature of the speaker assembly 102 (in particular, the one or more drivers 104 and the cables within the speaker assembly 102) do not exceed the higher threshold temperature as described above. If they do, there are risks of permanent damage to the speaker assembly 102. Previous attempts of doing so involved leaving a large headroom between how hard the one or more drivers 104 are driving and the absolute maximum temperature rating. The temperature of the speaker assembly 102 and / or the one or more drivers 102 could also be model as a function of the content played back by the speaker assembly and, accordingly, compression of that content could be applied when the temperature has been determined to be too high.

[0042] By adding temperature measurement to the speaker assembly 102 and, in particular, to the one or more drivers 104, protective compression can be avoided. This is beneficial because the protective compression significantly reduces the sound quality and typically degrades the performance of the content played back before it is accurately known that an actual temperature threshold (i.e. one where irreparable damage to the speaker assembly 102 and / or the one or more drivers 104) has been exceeded. This is especially valuable in sound zone applications where precise control of the sound field is required and compression would significantly reduce the ability to create useful sound fields. A sound field is an arrangement in a space, for example in a cabin of a vehicle, where multiple speaker assemblies (and / or multiple drivers) are operated simultaneously and, where multiple 'zones' are created. For example, a first user within the space may be listening to first content and a second user may be listening to second content that is different to the first content. A first speaker assembly may playback the first content and also sound that cancels out the waves of the second content. Similarly, a second speaker assembly may playback the second content and also sound that cancels out the waves of the first content. Thus, each user within the space can listen to their content with minimal to no interruptions from the other content. This requires a high level of calibration, which can be improved on when no compression has to be added to the sound content due to inaccurate temperature measurements. Once the higher threshold temperature is reached (by the measurement) then limiting factors may be applied to the speaker assembly 102, for example, by reducing energy put into the one or more drivers 104 or, if need be, applying compression.

[0043] By adding voltage measurement to the speaker assembly 102, improved diagnostics can be provided to the system 100 by being able to determine if a signal arrives at the speaker assembly 102 terminals (or the terminals of any other component(s) within the system 100). Diagnostics are very important within the automotive industry and are also becoming an increasingly more important selling point for consumers who seek out more environmentally friendly components (for example, that are easier and more economical to repair). By improving the diagnostics, a vehicle including the system 100 as described above, can store which component(s) of the system 100 are faulty. This information can be displayed to the user or in a workshop (for example, via a user interface coupled to the system 100 - this user interface may be a separate user interface that can be plugged into the system 100).

[0044] Figure 2 depicts a vehicle 200 that includes the system 100 as described above with reference to Figure 1. The vehicle may be a road, off-road, air, amphibious or any other suitable type of vehicle. In addition to the system 100 as described above, the vehicle 200 may include one speaker assembly 102 as described above or, alternatively, it may include a plurality of speaker assemblies 102a, 102b, 102c, 102d. Each speaker assembly 102a, 102b, 102c, 102d may have the same connections and functionality as described above with reference to Figure 1. Although four speaker assemblies 102a, 102b, 102c, 102d are depicted in Figure 2, the invention is not limited to four speaker assemblies and may include one speaker assembly, two speaker assemblies or any number of speaker assemblies.

[0045] The vehicle 200 may include at least one speaker assembly 102 as defined above, an amplifier 108 as described above electrically coupled to the at least one speaker assembly 102, and computing means 112 (for example, an ECM) as described above. The computing means 112 may be electrically coupled to the amplifier 108 and the at least one speaker assembly 102. The computing means 112 may be operable to send an acknowledge (ACK) signal to the amplifier 108 and the at least one speaker assembly 102n. The computing means 112 may be further operable to determine the amplifier 108 is faulty when the computing means 112 receives a negative acknowledgement (NACK) signal from the amplifier 108. The computing means 112 may determine one or more of the at least one speaker assembly 102n is faulty when the computing means 112 receives a NACK signal from one or more of the at least one speaker assembly 102n, or a combination of the above. The computing means 112 may be further operable to store the one or more NACK signals on memory of the computing means 112. This mechanism is as also described above in Figure 1 with regard to the processor of the speaker assembly 102 and the sending and receiving of ACK and NACK signals. Similarly, the computing means 112 may determine that the amplifier 108 and / or the one or more speaker assemblies 102n are not faulty when an ACK are received.

[0046] Advantageously, the computing means 112 can diagnose whether one or more components within the vehicle 200 are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on the computing means 112 and can be retrieved by a user (for example, a mechanic) to determine exactly which component (for example, which speaker assembly 102n, amplifier 108, processor, memory, etc) of the system 200 is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method

[0047] In an embodiment, each memory of each speaker assembly 102n may store individual pre-determined sound characteristics for the one or more drivers 104 of each speaker assembly 102n. Accordingly, the memory of the first speaker assembly 102a may store individual pre-determined sound characteristics for the one or more drivers 104 of the first speaker assembly, the memory of the second speaker assembly 102a may store individual pre-determined sound characteristics for the one or more drivers 104 of the second speaker assembly that are different to the pre-determined sound characteristics for the one or more drivers 104 of the first speaker assembly, etc.

[0048] Speakers, such as speaker assemblies 102n, can vary significantly in sensitivity due to manufacturing tolerances with the drivers 104, the cables, and any additional hardware components. Speakers with good tolerances require high skills, more expensive materials and increased time to manufacture and, thus, come at a higher price. Since the speaker assemblies 102n include a memory (for example, on a PCB) as described above, the sensitivity of each speaker assembly 102a, b, c, d, ..., n can be characterised during manufacturing of the speaker assemblies 102n. This is done, as shown in Figure 3, by testing each speaker assembly 102n individually (with calibrator 302) and by applying (by calibrator 302) individual sound characteristic to each speaker assembly 102n. This may include performing, by the one or more drivers 104 a frequency sweep and recording, by a microphone of the calibrator, the frequency sweep of the one or more drivers 104 to determine the frequency response of the speaker assembly 102n. The individual sound characteristics are then stored on the memory of each speaker assembly 102n. The individual sound characteristics may be applied to the one or more drivers 104 of each speaker assembly 102n. The individual sound characteristic includes changes (for example, to the frequency response (i.e. sound equaliser settings, the volume), the resonance frequency, or any combination thereof) and ensures that any differences in sound quality are overcome so that each speaker assembly 102n has the same sound quality after it has been manufactured. Thus the performance of speaker assemblies 102n can be improved without increasing the manufacturing cost, which increases the value of the speaker assemblies 102n. Accordingly, each speaker assembly 102n can perform as if it has drivers and hardware with better tolerances without manufacturing them for better tolerances. This is especially valuable in sound zone applications (as described above) where precise control of the sound field is required and where the speaker tolerances play a large role in producing a high quality sound zone.

[0049] In an embodiment, the individual sound characteristics may be stored in amplifier circuitry 110 (for example, a memory of the amplifier circuitry 110), in the computing means 112 (for example, memory of the computing means 112), or in the signal processing block (as described above). The amplifier 108 can apply the individual sound characteristics to a signal (for example, an amplified sound signal to be played back by the one or more drivers 104 of each speaker assembly 102n) and subsequently send the signal sent to the one or more drivers 104 of each speaker assembly 102n.

[0050] In an embodiment, the processor of a first speaker assembly 102a may be further configured to receive a sound signal (for example, a signal including sound to be played back by the one or more drivers 104 of the first speaker assembly 102a) from the amplifier 108 and to apply first pre-determined sound characteristics (for example, calibrating sound characteristics specific to the first speaker assembly 102a and calibrated by calibrator 302) to the sound signal. The first pre-determined sound characteristics are stored on the memory of the first speaker assembly 102a. The processor of the first speaker assembly 102a may be further configured to receive second pre-determined sound characteristics from an electronic control module (ECM) of the vehicle 200. The second pre-determined sound characteristics may be sound characteristics determined by a vehicle manufacturer to specify a specific type of sound type for the manufacturer (for example, this may be a more bass-heavy sound for a first vehicle manufacturer or a brighter sound for a second vehicle manufacturer). The processor of the first speaker assembly 102a may apply the second pre-determined sound characteristics to the sound signal. The processor first speaker assembly 102a may be further configured to send a first modified sound signal corresponding to the sound signal with the applied first pre-determined sound characteristics and second pre-determined sound characteristics to the driver to be played back. Accordingly, the sound played back includes both a first sound characteristic to ensure that the first speaker assembly 102 sounds as it was intended by the speaker manufacturer (with reduced tolerances) and a second sound characteristic to ensure that the first speaker assembly 102 sounds as it was intended by the vehicle manufacturer (for example, with an increased focus on bass sounds). As described above, despite rigorous quality and assessment, the sound characteristics of speaker assemblies of a certain model type can vary significantly from speaker assembly to speaker assembly. By storing calibration data that is specific to each speaker assembly unit of a speaker assembly model, the speaker assembly can be tuned to reproduce a sound characteristic that is intended by the manufacturer. In addition to this, a vehicle manufacturer can apply further sound characteristics (second pre-determined sound characteristics) to represent a sound quality that is intended by the vehicle manufacturer. Advantageously, a universal sound quality can be guaranteed despite variations in build quality of speaker assembly units.

[0051] In an embodiment the processor of a second speaker assembly 102b may be configured to receive the sound signal from the amplifier 108, and to apply third pre-determined sound characteristics (i.e. calibration for the second speaker assembly 102b) to the sound signal. The third pre-determined sound characteristics stored on the memory of the second speaker assembly 102b are different to the first pre-determined sound characteristics stored on the memory of the first speaker assembly 102a. The processor of the second speaker assembly 102b may be further configured to receive the second pre-determined sound characteristics from the ECM 112 and apply the second pre-determined sound characteristics to the sound signal. The ECM 112 may be further configured to send a second modified sound signal corresponding to the sound signal with the applied third pre-determined sound characteristics and second pre-determined sound characteristics to the driver of the second speaker assembly (to be played back by the one or more drivers 104 of the second speaker assembly 102b). The sound characteristics of first modified sound signal and the second modified sound signal may be identical. Advantageously, a universal sound quality can be guaranteed despite variations in build quality of speaker assembly units. By storing calibration data that is specific to each speaker assembly unit of a speaker assembly model, the speaker assembly can be tuned to reproduce a sound characteristic that is intended by the manufacturer (for example, each speaker assembly unit will have different stored calibration data / pre-determined sound characteristics such that all speaker assembly units of the same model represent sound with the same characteristics).

[0052] In an embodiment, the first pre-determined sound characteristics, the second pre-determined sound characteristics, and the third pre-determined sound characteristics may include sound equaliser settings, volume, resonance frequency, or any combination of the above. Advantageously, the sound reproduced by the speaker assembly can be accurately fine-tuned to overcome any manufacturing defects. The invention is not limited to first, second and third pre-determined sound characteristics and may further include fourth pre-determined sound characteristics (for a third speaker assembly 102c), fifth pre-determined sound characteristics (for a fourth speaker assembly 102d), and n+1 pre-determined sound characteristics (for an n th< speaker assembly 102n).

[0053] Figure 4 shows a flow chart of a method 300 for a speaker assembly, for example speaker assembly 102 or speaker assemblies 102n as described above with reference to Figures 1 to 3, and according to the invention. The method includes includes receiving, by a processor of the speaker assembly 102, 102n as defined above, one or more diagnostic signals as shown in 402. The method further includes comparing, by the processor, the one or more diagnostic signals with threshold values stored in memory of the speaker assembly 102, 102n as shown in 404. The method further includes determining, by the processor, a fault within the speaker assembly 102, 102n if the one or more diagnostic signals are outside of the threshold values as shown in 406. The method further includes adjusting one or more features of the speaker assembly 102, 102n when a fault is determined as shown in 408. Advantageously, it can be determined whether any components of the speaker assembly are faulty. In a system of speaker assemblies, this more accurately determines faults at the speaker level, because each speaker assembly comprises circuitry to determine faults, compared to a systems of speaker assemblies that has one fault detection circuitry for all speaker assemblies. This is because the fault detection is done at the speaker assembly, which reduces the need for diagnostic signals to be communicated over multiple channels. Furthermore, diagnostics (for example, temperature and / or voltage measurements) are measured at the speaker level which provides a more accurate measurement of the condition of the speaker assembly compared, for example, to diagnostics being measured on a system level (for example, an ambient air temperature measured by a vehicle). Furthermore, this reduces the failure rate of fault detection due to the presence of multiple fault detection means (i.e. in each speaker assembly, rather than one in a system).

[0054] Figures 5, 6 and 7 show additional method steps of a speaker assembly (such as speaker assembly 102, 102n as described above with reference to Figures 1 to 3) as described above with reference to the method 400 of Figure 4. The steps in Figures 5, 6 and 7 may each be performed separately in combination with those of Figure 4. The steps in Figures 5, 6 and 7 may each be performed in any combination (for example, the steps of Figures 5 and 6, the steps of Figures 5 and 7, the steps of Figures 6 and 7, or any combination of any steps within any of Figures 5 to 7) in combination with those of Figure 4.

[0055] In Figure 5 the method may further include measuring a temperature of the driver 104 as shown in 502. The method may further include sending the temperature measurement to the processor of the speaker assembly 102, 102, wherein the temperature measurement is one of the one or more diagnostic signals as shown in 504. The method may further include determining a fault when the temperature measurement is above a first threshold temperature or below a second threshold temperature, the first threshold temperature is higher than the second threshold temperature as shown in 506. The method may further include reducing, by the processor of the speaker assembly 102, 102n, power provided to the driver when the temperature measurement is above the first threshold temperature or increasing, by the processor of the speaker assembly 102, 102n, power provided to the driver 104 when the temperature measurement is below the second threshold temperature as shown in 508. Advantageously, the speaker assembly 102, 102n can be safely used in more extreme temperatures because the temperature measurements taken at the speaker assembly / driver level are more accurate than measurements taken at a system level (for example, ambient air temperature). Thus, temperature headroom for speakers can be tuned more accurately and the speaker assembly can be made available for a larger temperature range without large modification of the driver. For example, a speaker assembly that was previously configured for temperatures between -20°C and 40°C may be configured for temperatures between -40°C and 85°C with this arrangement.

[0056] In Figure 6 the method may further include measuring a voltage of one or more electrical connections between: the driver 104 and the processor of the speaker assembly 102, 102n, the driver 104 and the amplifier 108, and / or the processor of the speaker assembly 102, 102n and an electronic control module (ECM) 112 (or any other suitable computing means 112) of a vehicle (for example, vehicle 200 as described above with reference to Figure 2) as shown at 602. The method may further include determining that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold, wherein the one or more voltages is one of the one or more diagnostic signals as shown at 604. The method may further include sending a signal to the amplifier 108 or to the ECM 112 indicating that the speaker assembly 102, 102n is faulty, if one or more electrical connections are determined to be faulty as shown at 606. Advantageously, it can be diagnosed whether one or more components within the speaker assembly 102, 102n are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on a computer system (for example, of a vehicle) and can be retrieved by a user (for example, a mechanic) to determine exactly which speaker assembly of multiple speaker assemblies is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

[0057] In Figure 7 the method may further include sending an acknowledge (ACK) signal from an electric control module (ECM) 112 (or computing means 112 as described above) of a vehicle (for example, vehicle 200 as described with reference to Figure 2) to the amplifier 108 and the at least one speaker assembly 102, 102n as shown at 702. The method may further include determining, by the ECM 112, the amplifier 108 is faulty when the ECM 112 receives a negative acknowledgement (NACK) signal from the amplifier 108 as shown at 704. The method may further include determining one or more of the at least one speaker assembly 102, 102n is faulty when the ECM 112 receives a NACK signal from one or more of the at least one speaker assembly 102, 102n, or a combination of the above as shown at 706. The method may further include storing the one or more NACK signals on memory of the ECM 112 as shown at 708. The method may proceed from 702 directly to 706, skipping 704. The method may proceed from 704 directly to 708, skipping 706. Advantageously, the ECM can diagnose whether one or more components within the vehicle are faulty (for example, because of a short circuit or other electrical failure). This information can be stored on the ECM and can be retrieved by a user (for example, a mechanic) to determine exactly which component (for example, which speaker assembly, amplifier, processor, memory, etc) of the system is malfunctioning. This significantly reduces the time to diagnose where an electrical fault is and which component is causing the electrical fault, thus providing an improved and more efficient diagnostic method.

Examples

Embodiment Construction

[0023]The present invention provides a cost-efficient speaker assembly that is configured to receive one or more diagnostic signals and to determine one or more faults with the speaker assembly.

[0024]Figure 1 shows a system 100 for a playing back sound / music. The system may include multiple components, such as a speaker assembly 102, an amplifier 108, and a computing means 112 (which may, for example, be an electronic control module (ECM)). The components of the system 100 may communicate with one another, to send and / or receive power and / or data, by means of a wired or wireless coupling. To accomplish this, each of the speaker assembly 102, the amplifier 108 and the computing means 112 may include wired connections and / or wireless transceivers operable to couple the components with each other. The speaker assembly 102 may be coupled to the amplifier 108, the amplifier may be coupled to the computing means 112, and the computing means 112 may be coupled to the speaker assembly 102.

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Claims

1. A speaker assembly comprising: a driver; a memory; a processor; and a housing, wherein the driver, the memory and the processor are within the housing, wherein the processor is configured to: receive one or more diagnostic signals, compare the one or more diagnostic signals with threshold values stored in the memory, determine a fault within the speaker assembly if the one or more diagnostic signals are outside of the threshold values, and adjust one or more features of the speaker assembly when a fault is determined.

2. The speaker assembly of claim 1 further comprising one or more electronic devices that is not a driver, the one or more electronic device comprises: a temperature measuring device (thermometer); a voltmeter; a light assembly comprising at least one illuminating element; a motor operable to move the driver relative to the housing or to move the speaker assembly relative to a fixture to which the speaker assembly is attached; or any combination of the above.

3. The speaker assembly of claim 2, wherein the temperature measuring device is configured to: measure the temperature of the driver; and send the temperature measurement to the processor, wherein the temperature measurement is one of the one or more diagnostic signals.

4. The speaker assembly of claim 3, wherein: a fault is determined when the temperature measurement is above a first threshold temperature; and the processor is further configured to reduce power provided to the driver when the temperature measurement is above the first threshold temperature.

5. The speaker assembly of any one of claims 2 to 4, wherein the driver is electrically coupled to an amplifier and the processor, and wherein the one or more electronic devices are electrically coupled in a bus configuration between the driver and the amplifier or between the driver and the processor.

6. The speaker assembly of any one of claims 1 to 5, wherein the processor is further configured to: measure a voltage of one or more electrical connections between: the driver and the processor, the driver and the amplifier, and / or the processor and an electronic control module, ECM, of a vehicle; determine that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold, wherein the one or more voltages is one of the one or more diagnostic signals; and send a signal to the amplifier or to the ECM indicating that the speaker assembly is faulty, if one or more electrical connections are determined to be faulty.

7. The speaker assembly of any one of claims 1 to 6, wherein the processor is further configured to: receive a sound signal from an amplifier; apply first pre-determined sound characteristics to the sound signal, the first pre-determined sound characteristics stored on the memory; receive second pre-determined sound characteristics from an electronic control module, ECM, of a vehicle; apply the second pre-determined sound characteristics to the sound signal; and send a first modified sound signal corresponding to the sound signal with the applied first pre-determined sound characteristics and second pre-determined sound characteristics to the driver.

8. A system comprising the speaker assembly of claim 7 and a second speaker assembly as set out in claims 1 to 6, the processor of the second speaker assembly is further configured to: receive the sound signal from the amplifier; apply third pre-determined sound characteristics to the sound signal, the third pre-determined sound characteristics stored on the memory of the second speaker assembly and the third pre-determined sound characteristics are different to the first pre-determined sound characteristics; receive the second pre-determined sound characteristics from the ECM; apply the second pre-determined sound characteristics to the sound signal; and send a second modified sound signal corresponding to the sound signal with the applied third pre-determined sound characteristics and second pre-determined sound characteristics to the driver of the second speaker assembly, wherein the sound characteristics of first modified sound signal and the second modified sound signal are identical.

9. The speaker assembly of claim 7 or the system of claim 8, wherein the first pre-determined sound characteristics, the second pre-determined sound characteristics, and the third pre-determined sound characteristics comprise: sound equaliser settings; volume; resonance frequency; or any combination of the above.

10. A vehicle comprising: at least one speaker assembly as defined in any one of claims 1 to 9; an amplifier electrically coupled to the at least one speaker assembly; and an electronic control module, ECM, the ECM electrically coupled to the amplifier and the at least one speaker assembly.

11. The vehicle of claim 10, wherein the ECM is operable to: send an acknowledge, ACK, signal to the amplifier and the at least one speaker assembly; determine: the amplifier is faulty when the ECM receives a negative acknowledgement, NACK, signal from the amplifier, one or more of the at least one speaker assembly is faulty when the ECM receives a NACK signal from one or more of the at least one speaker assembly, or a combination of the above; and store the one or more NACK signals on memory of the ECM.

12. A method for a speaker assembly comprising: receiving, by a processor of a speaker assembly as defined in claim 1, one or more diagnostic signals; comparing, by the processor, the one or more diagnostic signals with threshold values stored in memory of the speaker assembly; determining, by the processor, a fault within the speaker assembly if the one or more diagnostic signals are outside of the threshold values; and adjusting one or more features of the speaker assembly when a fault is determined.

13. The method of claim 12, further comprising: measuring a temperature of the driver; sending the temperature measurement to the processor, wherein the temperature measurement is one of the one or more diagnostic signals; determining a fault when the temperature measurement is above a first threshold temperature; and reducing, by the processor, power provided to the driver when the temperature measurement is above the first threshold temperature.

14. The method of any one of claims 12 or 13, further comprising: measuring a voltage of one or more electrical connections between: the driver and the processor, the driver and the amplifier, and / or the processor and an electronic control module, ECM, of a vehicle; determining that one or more electrical connections are faulty when the voltage of any one of the one or more electrical connections is above or below a pre-determined threshold, wherein the one or more voltages is one of the one or more diagnostic signals; and sending a signal to the amplifier or to the ECM indicating that the speaker assembly is faulty, if one or more electrical connections are determined to be faulty.

15. The method of any one of claims 12 to 14, further comprising: sending an acknowledge, ACK, signal from an electric control module, ECM, of a vehicle to the amplifier and the at least one speaker assembly; determining, by the ECM: the amplifier is faulty when the ECM receives a negative acknowledgement, NACK, signal from the amplifier, one or more of the at least one speaker assembly is faulty when the ECM receives a NACK signal from one or more of the at least one speaker assembly, or a combination of the above; and storing the one or more NACK signals on memory of the ECM.

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