Electronics temperature-control device and electrochemical system

Abstract

The invention relates to an electronics temperature-control device for an electrochemical system, with at least one electronics receiving unit (14a; 14b; 14c; 14d; 14e) for receiving an electronics unit (16a; 16b; 16c; 16d; 16e) of the electrochemical system and with at least one air cooling unit (18a; 18b; 18c; 18d; 18e) for cooling an interior of the electronics receiving unit (14a; 14b; 14c; 14d; 14e). According to the invention, the electronics temperature-control device has at least one air guide element (20a; 20b; 20c; 20d; 20e) for guiding air (22a; 22b; 22c; 22d; 22e) from an external air inlet (24a; 24b; 24c; 24d; 24e) of the air cooling unit (18a; 18b; 18c; 18d; 18e) to an internal air inlet (26a; 26b; 26c; 26d; 26e) of the air cooling unit (18a; 18b; 18c; 18d; 18e) arranged within the interior.

Description

[0001] Description

[0002] State of the art

[0003] An electronics temperature control device for an electrochemical system has already been proposed, comprising at least one electronics receiving unit for receiving an electronics unit of the electrochemical system and at least one air cooling unit for cooling an interior of the electronics receiving unit.

[0004] Disclosure of the invention

[0005] The invention relates to an electronics temperature control device for an electrochemical system, comprising at least one electronics receiving unit for receiving an electronics unit of the electrochemical system and at least one air cooling unit for cooling an interior of the electronics receiving unit.

[0006] It is proposed that the electronic temperature control device comprise at least one air guide element for guiding air from an external air inlet of the air cooling unit to an internal air inlet of the air cooling unit arranged within the interior space. The electrochemical system preferably comprises at least one electrochemical cell for electrochemically converting at least one reactant. The at least one electrochemical cell can be designed as a fuel cell or as an electrolysis cell. The electronics unit comprises, for example, an inverter for coupling an electrical current produced / absorbed by the at least one electrochemical cell to an external power supply.Additionally or alternatively, the electronics unit comprises power electronics for controlling at least one motor of a fluid delivery unit, such as a pump, a compressor, or a blower, of the electrochemical system and / or peripheral devices of the electrochemical system, for example, fluid delivery units of the electrochemical system. For example, the electronics unit comprises a control or regulating unit for controlling or regulating peripheral devices of the electrochemical system and / or the power electronics. Additionally or alternatively, the electronics unit comprises a communication interface for data exchange with an external control system for remote control and / or remote monitoring of the electrochemical system.

[0007] The electronics housing unit preferably comprises an electronics housing in which the components of the electronics unit, such as the inverter, the power electronics, the control or regulating unit, the communication interface and / or further components, are arranged. The at least one electrochemical cell and the electronics housing are preferably arranged in a common outer housing of the electrochemical system. Alternatively, the electronics housing is arranged outside the outer housing. The electronics housing is preferably provided to fluidically separate the electronics unit from a location of use of the at least one electrochemical cell, in particular from a cell compartment of the outer housing. The electronics housing can be formed separately from the outer housing or at least comprise a common wall with the outer housing.In an advantageously component-poor design, the electronics housing is designed as a partition wall which divides an interior of the outer housing into the cell compartment and the electronics receiving unit.

[0008] The external air inlet is preferably arranged on the electronics housing. The external air inlet can be arranged within the outer housing, in particular with a common air supply to the cell compartment and the electronics housing unit. Alternatively, the external air inlet or an additional air inlet of the air cooling unit is arranged on an outer wall of the electronics housing. The external inlet is preferably provided for sucking air into the electronics housing unit. The air cooling unit preferably comprises an external air outlet for discharging the air from the electronics housing unit. The external air outlet is preferably arranged on the electronics housing. The external air outlet can be arranged within the outer housing, in particular for heat recovery and / or preheating of the cell compartment.The external air outlet or an additional air outlet of the air cooling unit is preferably arranged on an outer wall of the electronics housing. The air cooling unit preferably comprises at least one air conveying unit, such as a blower, a fan, or a compressor, to convey air from the external air outlet through the electronics housing unit to the external air outlet. The air conveying unit preferably comprises at least one conveying element arranged at the external air inlet. Alternatively or additionally, the air conveying unit comprises at least one conveying element arranged at the external air outlet. Alternatively or additionally, the air conveying unit comprises at least one conveying element arranged at a distance from the external air inlet and the external air outlet within the electronics housing, in particular on a heat sink of the electronics unit.

[0009] The internal air inlet is preferably arranged downstream of the external air inlet and upstream of the external air outlet along the intended air flow path through the electronics housing unit. The internal air inlet is preferably arranged at a distance from the external air inlet. The air guiding element can be designed, for example, as a pipe, hose, duct, baffle, partition, or the like. The air guiding element is particularly intended to guide air from the external air inlet to the internal air inlet. The internal air inlet is preferably formed by an end of the air guiding element facing away from the external air inlet. The air guiding element can enclose the intended air flow path upstream of the internal air inlet in a plane perpendicular to the flow path.Alternatively, the air guide element delimits the intended flow path of the air upstream of the internal air inlet in a plane perpendicular to the flow path in interaction with an inner wall of the electronics housing. The air guide element can be designed as a separate component from the electronics housing or formed integrally with the electronics housing. Preferably, the air guide element forms an air duct from the outer air inlet to the internal air inlet, with the electronics unit being arranged outside this air duct. The air guide element is preferably designed to guide at least a substantial portion of the air flowing through the outer air inlet to the internal air inlet. A "substantial portion" of an air flow should preferably be understood as at least 10%, preferably more than 25%, particularly preferably more than 50%, based on an air volume flow entering through the air inlet.

[0010] "Intended" should be understood in particular to mean specifically programmed, designed, and / or equipped. The fact that an object is intended for a specific function should be understood in particular to mean that the object fulfills and / or performs this specific function in at least one application and / or operating state.

[0011] The inventive design allows for an advantageously precise air flow path in the electronics housing unit. In particular, sufficient cooling of all components of the electronics unit can be achieved.

[0012] It is further proposed that the outer air inlet and the internal air inlet are arranged in different halves of the electronics housing unit. The electronics housing unit preferably comprises a longitudinal axis. The electronics housing preferably has its maximum longitudinal extent along the longitudinal axis. A plane perpendicular to the longitudinal axis divides the electronics housing unit, for example, into a bottom half and a top half. The bottom half is intended to be arranged facing a substrate for operation of the electrochemical system. The outer air inlet is preferably arranged in the top half. The internal air inlet is preferably arranged in the bottom half. A minimum distance between the internal air inlet and the outer air inlet preferably corresponds to at least a substantial proportion of a maximum extent, in particular the maximum longitudinal extent, of the electronics housing along the longitudinal axis.A "significant portion" of an extension should preferably be understood as at least 10%, preferably at least 25%, particularly preferably at least 33% of this extension. The inventive design allows a large volume portion of the electronics housing unit to be reliably supplied with fresh air. In particular, the risk of dead spaces within the electronics housing unit can be advantageously kept low.

[0013] It is further proposed that the internal air inlet and an external air outlet, in particular the aforementioned external air outlet, of the air cooling unit for discharging the air from the electronics housing unit are arranged in different halves of the electronics housing unit. The external air outlet is preferably arranged in the same half as the external air inlet. The external air outlet is preferably arranged in the ceiling half. The external air inlet, the air guiding element and the external air outlet preferably define a U-shaped flow path for the air through the electronics housing unit. The design according to the invention allows the provided flow path to be advantageously adapted to natural convection of the air. In particular, any counteraction of the convection to an air flow caused by the conveying unit can advantageously be kept low.

[0014] It is further proposed that the air guide element be formed at least partially by a mounting plate of the electronics receiving unit. The mounting plate is preferably fixed within the electronics housing, in particular screwed, clamped, welded, or the like. The mounting plate is preferably provided for fixing the components of the electronics unit, such as the inverter, the power electronics, the control or regulating unit, the communication interface, and / or other components. The mounting plate preferably has a main extension plane that is arranged at least substantially parallel to the longitudinal axis of the electronics receiving unit in the electronics housing.A "main extension plane" of a structural unit is to be understood in particular as a plane which is parallel to a largest side surface of a smallest imaginary cuboid which just completely encloses the structural unit and in particular runs through the center of the cuboid. "Substantially parallel" is to be understood here in particular as an alignment of a direction relative to a reference direction, in particular in a plane, wherein the direction has a deviation from the reference direction of in particular less than 8°, advantageously less than 5° and particularly advantageously less than 2°. The mounting plate can be designed as a single continuous plate or divided into several segments, preferably arranged in a plane, which are intended to fix different components of the electronics unit.The electronics temperature control device preferably comprises a mounting unit comprising the mounting plate and at least one spacer, by means of which the mounting plate is arranged at a distance from at least one inner wall of the electronics housing. The spacer is preferably formed integrally with the mounting plate. “Integral” is to be understood in particular as being at least materially connected, for example by a welding process, an adhesive process, an injection molding process and / or another process deemed appropriate by a person skilled in the art, and / or advantageously formed in one piece, such as by being manufactured from a single casting and / or by being manufactured using a single-component or multi-component injection molding process and advantageously from a single blank. For example, the mounting unit has a U-shaped profile in a plane perpendicular to the longitudinal axis of the electronics housing unit.Alternatively or additionally, the mounting plate extends in a direction perpendicular to the longitudinal axis over at least the entire width of the electronics housing. The mounting plate, in particular the mounting unit, preferably forms the air guiding element, in particular in the form of an air duct, together with an inner wall of the electronics housing. The outer air inlet and intended mounting locations of the mounting plate for fixing the components of the electronics unit are preferably arranged on different sides of the main extension plane of the mounting plate. The outer air inlet preferably extends through the electronics housing into a space between the mounting plate and an inner wall of the electronics housing. The mounting plate is preferably made of metal, alternatively of a plastic. In some embodiments, the mounting plate can be designed as a printed circuit board of the electronics unit.The internal air inlet is preferably formed by an end edge of the mounting plate, in particular of the mounting unit, which preferably forms an end of the mounting plate facing away from the outer air inlet, in conjunction with the inner wall of the electronics housing. Alternatively or additionally, the mounting plate comprises an opening extending through the main extension plane of the mounting plate, which forms the internal air inlet. The design according to the invention makes it possible to provide an advantageously component-poor and compact electronics temperature control device.

[0015] It is further proposed that the electronics temperature control device comprise an inverter heat sink, wherein the internal air inlet is arranged on the inverter heat sink. The inverter heat sink is preferably provided for cooling the inverter of the electronics unit. The inverter heat sink is preferably arranged in the bottom half of the electronics housing. The inverter heat sink is preferably arranged upstream of the remaining mounting locations of the mounting plate with respect to the intended flow path of the air through the electronics housing unit. The inventive design advantageously allows the inverter heat sink to be effectively cooled. In particular, a maximum temperature within the electronics housing unit can advantageously be kept low.

[0016] It is further proposed that the internal air inlet be arranged on a side of the inverter heat sink facing the outer air inlet. Preferably, the mounting plate, in particular with the aforementioned end edge, sits on the inverter heat sink or engages with it. Preferably, the inverter heat sink and the mounting plate are arranged in direct physical contact with one another or are connected to one another via a sealing element. Preferably, the air guide element directs the air directly into the inverter heat sink. Alternatively, the internal air inlet is arranged at a distance from the inverter heat sink, so that a, in particular larger, portion of the air can flow through the inverter heat sink and a, in particular smaller, portion of the air can flow past the inverter heat sink.In some embodiments, a conveying element of the air conveying unit is arranged at and / or within the internal air inlet and / or on the inverter heat sink to convey the air through the inverter heat sink. The embodiment according to the invention makes it possible to provide an advantageously compact electronics temperature control device.

[0017] It is further proposed that the internal air inlet or another internal air inlet of the air cooling unit be arranged on a side of the inverter heat sink facing away from the external air inlet. For example, the air guiding element, in particular the mounting plate, extends past the inverter heat sink or through the inverter heat sink in a direction parallel to the longitudinal axis. The air guiding element can have a common end plane with the inverter heat sink perpendicular to the longitudinal axis or can protrude beyond an end plane of the inverter heat sink. The electronics temperature control device preferably comprises an adapter unit to which the inverter heat sink and the internal air inlet are fluidically connected. The adapter unit is preferably provided to guide at least a substantial portion of the air flow from the internal air inlet through the inverter heat sink.The adapter unit comprises, for example, a particularly precisely fitting opening for accommodating the inverter heat sink, at least one nozzle, or the like. In some embodiments, at least one conveying element of the air conveying unit is arranged in or on the adapter unit. The inventive design advantageously allows for an air flow from the floor half to the ceiling half, advantageously providing sufficient cooling for all components of the electronics unit.

[0018] Furthermore, it is proposed that the inverter heat sink form at least two fluid channels which are designed for opposing air flow. The inverter heat sink preferably has at least one fresh air channel and at least one return channel. The fresh air channel is preferably fluidically connected to the internal air inlet. The return channel preferably runs at least substantially parallel to the fresh air channel. The fresh air channel and the return channel are preferably fluidically separated from one another within the inverter heat sink, in particular by a cooling fin of the inverter heat sink. The fresh air channel and the return channel are preferably fluidically connected to one another by a free space between the inverter heat sink and the electronics housing, which free space is arranged on a side of the inverter heat sink facing away from the internal air inlet.Alternatively, the inverter heat sink has at least one air duct that connects the fresh air duct to the return duct. The configuration according to the invention advantageously allows the electronics temperature control device to be kept compact. It is further proposed that the air cooling unit comprise at least one additional internal air inlet that is arranged upstream of the internal air inlet on the air guide element. The additional internal air inlet preferably has a smaller maximum opening width, in particular a maximum opening width that is smaller by a factor of more than a factor of 2, than the internal air inlet. The additional internal air inlet is preferably arranged closer to the outer air inlet than the internal air inlet. The internal air inlet and the additional internal air inlet preferably provide two fluidically parallel flow paths from the outer air inlet to the outer air outlet.For example, the additional internal air inlet is designed as an opening that extends through the main extension plane of the mounting plate. The additional internal air inlet is preferably assigned to a mounting location on the mounting plate for fixing one of the electronic components, in particular an electronic component different from the inverter, of the electronic unit. The additional internal air inlet is arranged in a direction parallel to the longitudinal axis, preferably between the inverter heat sink and the mounting location assigned to the additional internal air inlet. Alternatively, the additional internal air inlet is arranged in a plane perpendicular to the longitudinal axis with the mounting location assigned to the additional internal air inlet. The air cooling unit preferably comprises a plurality of additional internal air inlets that are assigned to different mounting locations on the mounting plate.Preferably, the additional internal air inlets are so small that at least a significant portion of the air is directed through the internal air inlet. The inventive design advantageously allows a maximum air temperature at the components of the electronics unit other than the inverter to be kept low. In particular, a fluctuation range of the air temperature can advantageously be individually designed for different components of the electronics unit by adjusting the maximum opening width and arrangement.

[0019] Furthermore, an electrochemical system is proposed with at least one electrochemical unit for the electrochemical conversion of at least one reactant, with at least one electronics unit for coupling an electrical current generated or absorbed by the electrochemical conversion to an external power supply, and with at least one electronics temperature control device according to the invention for temperature control of the electronics unit. The electrochemical unit preferably comprises the at least one electrochemical cell. The at least one electrochemical cell is particularly preferably designed as an electrochemical high-temperature cell, in particular as a high-temperature fuel cell or as a high-temperature electrolysis cell. The at least one electrochemical cell is preferably designed as a solid oxide fuel cell or solid oxide electrolysis cell, or as a molten carbonate fuel cell or molten carbonate electrolysis cell.Alternatively, the at least one electrochemical cell is designed as a phosphoric acid fuel cell / electrolysis cell, as a direct methanol fuel cell / electrolysis cell, as a polymer electrolyte fuel cell / electrolysis cell, or the like. If a fuel cell is used, the at least one reactant is, for example, a fuel which preferably comprises hydrogen, ammonia, methane, or another hydrocarbon as the main energy carrier, and which is, for example, in the form of natural gas or biogas. If an electrolysis cell is used, the at least one reactant is, for example, water. The electrochemical unit preferably comprises a plurality of electrochemical cells arranged in one or more stacks. The electrochemical cells are preferably electrically connected in series and, in particular, are intended for joint operation.

[0020] The electrochemical unit preferably comprises an insulating housing for thermally insulating the at least one electrochemical cell from the environment of the electrochemical unit. The electrochemical system preferably comprises the outer housing, in which the at least one electrochemical unit, the electronics unit, and the electronics temperature control device are jointly arranged. The insulating housing and / or the electronics housing can be inserted into the outer housing or formed by the outer housing. The electrochemical unit preferably comprises peripheral devices for operating the at least one electrochemical cell.Examples of peripheral devices include, for example, a reformer for reforming a fuel as a reactant, an afterburner for thermally converting fuel residues downstream of the at least one fuel cell, an exhaust gas recirculation system, at least one reactant conveying unit for adjusting a reactant volume flow, at least one internal product heat exchanger for recovering heat from a product of the electrochemical conversion, a recirculation conveying unit for feeding a product of the electrochemical conversion back into the at least one reactant, and / or the like. The peripheral devices are preferably arranged within the outer housing. Depending on an intended operating temperature, some or all of the peripheral devices can be arranged inside or outside the insulating housing.

[0021] The electrochemical system preferably comprises a process air supply for supplying air to the at least one electrochemical unit. The process air supply is preferably designed as a central air supply to which the external air inlet of the electronic temperature control device is connected, preferably within the outer housing. Alternatively, the external air inlet is designed separately and preferably spaced apart from the process air supply and preferably extends through the outer housing. The inventive design makes it possible to provide an electrochemical system that has an advantageously low risk of overheating and, at the same time, can be kept advantageously compact.

[0022] The electronic temperature control device and / or the electrochemical system according to the invention should not be limited to the application and embodiment described above. In particular, the electronic temperature control device and / or the electrochemical system according to the invention can have a number of individual elements, components, and units that differs from the number stated herein to fulfill a functionality described herein. Furthermore, within the value ranges specified in this disclosure, values ​​within the stated limits are also to be considered disclosed and can be used arbitrarily.

[0023] Drawings

[0024] Further advantages will become apparent from the following description of the drawings. The drawings illustrate five exemplary embodiments of the invention. The drawings, the description, and the claims contain numerous features in combination. Those skilled in the art will also expediently consider the features individually and combine them into useful further combinations.

[0025] They show:

[0026] Fig. 1 is a schematic perspective view of an electrochemical system according to the invention,

[0027] Fig. 2 shows a schematic cross section of an electronic temperature control device according to the invention,

[0028] Fig. 3 is a schematic representation of an alternative embodiment of an electronic temperature control device according to the invention,

[0029] Fig. 4 is a schematic representation of a further alternative embodiment of an electronic temperature control device according to the invention,

[0030] Fig. 5 is a schematic representation of an additional alternative embodiment of an electronic temperature control device according to the invention and

[0031] Fig. 6 is a schematic representation of a further additional alternative embodiment of an electronic temperature control device according to the invention.

[0032] Description of the embodiments

[0033] Figure 1 shows an electrochemical system 12a. The electrochemical system 12a comprises at least one electrochemical unit 40a for the electrochemical conversion of a reactant. The electrochemical unit 40a preferably comprises at least one electrochemical cell, in particular at least one high-temperature fuel cell. The electrochemical unit 40a preferably comprises an insulating housing 42a in which the at least one electrochemical cell is arranged. The electrochemical system 12a comprises at least one electronics unit 16a for coupling an electrical current generated or absorbed by the electrochemical conversion to an external power supply. The electronics unit 16a preferably comprises an inverter 48a for coupling the electrical current. The electronics unit 16a comprises, for example, at least one power electronics unit 50a for controlling a conveyor unit of the electrochemical unit 40a.The electronics unit 16a comprises, for example, at least one further component 52a, such as a fuse, a control or regulating unit, a communication interface, a power supply, or the like. The electrochemical system 12a comprises at least one electronics temperature control device 10a for temperature control of the electronics unit 16a. The electronics temperature control device 10a comprises at least one electronics receiving unit 14a for receiving the electronics unit 16a of the electrochemical system 12a. The electronics receiving unit 14a preferably comprises an electronics housing 46a in which the electronics unit 16a is arranged. The electronics receiving unit 14a preferably comprises a mounting plate 30a to which the components of the electronics unit 16a are fixed. The mounting plate 30a is preferably arranged within the electronics housing 46a.

[0034] The electrochemical unit 40a, the electronics unit 16a and the electronic temperature control device 10a are preferably arranged in a common outer housing 44a of the electrochemical system 12a, of which only one base is shown here for the sake of clarity.

[0035] Figure 2 shows the electronics temperature control device 10a. The electronics temperature control device 10a comprises at least one air cooling unit 18a for cooling an interior of the electronics housing unit 14a. The air cooling unit 18a comprises an external air inlet 24a for admitting air 22a into the electronics housing 46a. The air cooling unit 18a comprises an external air outlet 28a for discharging air 22a from the electronics housing 46a. The air cooling unit 18a preferably comprises an air conveying unit, in particular a fan, blower, or compressor, for conveying the air 22a through the electronics housing 46a. The air conveying unit comprises, for example, at least one inlet conveying element 54a arranged at the external air inlet 24a. Alternatively or additionally, the air conveying unit comprises at least one outlet conveying element 56a arranged at the external air outlet 28a.

[0036] The electronics temperature control device 10a comprises at least one air guide element 20a for guiding air 22a from the outer air inlet 24a of the air cooling unit 18a to an internal air inlet 26a of the air cooling unit 18a arranged within the interior space. The air guide element 20a is formed at least partially by the mounting plate 30a of the electronics housing unit 14a. The mounting plate 30a preferably forms, together with an inner wall of the electronics housing 46a, an air duct that leads from the outer air inlet 24a to an internal air inlet 26a. The components of the electronics unit 16a are preferably arranged on a side of the mounting plate 30a facing away from the air duct.

[0037] The external air inlet 24a and the internal air inlet 26a are arranged in different halves of the electronics housing unit 14a. The internal air inlet 26a and the external air outlet 28a of the air cooling unit 18a for discharging the air 22a from the electronics housing unit 14a are arranged in different halves of the electronics housing unit 14a. Preferably, the external air outlet 28a and the external air inlet 24a are arranged in the same half of the electronics housing unit 14a. The air cooling unit 18a preferably defines a U-shaped flow path for the air 22a.

[0038] The electronics temperature control device 10a preferably comprises an inverter heat sink 32a. The inverter 48a is preferably arranged on the inverter heat sink 32a or forms the inverter heat sink 32a. The internal air inlet 26a is arranged on the inverter heat sink 32a. The internal air inlet 26a is arranged on a side of the inverter heat sink 32a facing away from the external air inlet 24a. The air guide element 20a preferably extends from the external air inlet 24a past the inverter heat sink 32a, preferably such that the internal air inlet 26a and the external air outlet 28a are arranged on different sides of the inverter heat sink 32a.The air cooling unit 18a comprises at least one additional internal air inlet 34a, 36a, which is arranged upstream of the internal air inlet 26a on the air guide element 20a. The additional internal air inlet 34a is preferably assigned to a component of the electronics unit 16a that is different from the inverter 48a. For example, the air cooling unit 18a comprises the additional internal air inlet 36a, which is assigned to the power electronics 50a and is arranged, for example, between the power electronics 50a and the inverter heat sink 32a. For example, the air cooling unit 18a comprises the additional internal air inlet 34a, which is assigned to the further component 52a and is arranged, for example, between the further component 52a and the inverter heat sink 32a, in particular the power electronics 50a. The at least one additional internal air inlet 34a, 36a is preferably smaller than the internal air inlet 26a.

[0039] Further exemplary embodiments of the invention are shown in Figures 3 to 6. The following descriptions and the drawings are essentially limited to the differences between the exemplary embodiments, whereby with regard to components with the same designation, in particular with regard to components with the same reference symbols, reference can in principle also be made to the drawings and / or the description of the other exemplary embodiments, in particular Figures 1 to 2. To distinguish the exemplary embodiments, the letter a is placed after the reference symbols of the exemplary embodiment in Figures 1 to 2. In the exemplary embodiments in Figures 3 to 6, the letter a is replaced by the letters b to e.

[0040] Figure 3 shows an electronics temperature control device 10b for an electrochemical system. The electronics temperature control device 10b comprises at least one electronics receiving unit 14b for receiving an electronics unit 16b of the electrochemical system. The electronics temperature control device 10b comprises an air cooling unit 18b for cooling an interior space of the electronics receiving unit 14b. The electronics temperature control device 10b comprises at least one air guiding element 20b for guiding air 22b from an external air inlet 24b of the air cooling unit 18b to an internal air inlet 26b of the air cooling unit 18b arranged within the interior space.An air conveying unit of the air cooling unit 18b preferably comprises an inverter conveying element 58b arranged on an inverter heat sink 32b of the electronics temperature control device 10b. The air conveying unit can comprise the inverter conveying element 58b alternatively or in addition to an input conveying element and / or an output conveying element. The inverter conveying element 58b is preferably arranged on the inverter heat sink 32b on a side of the inverter heat sink 32b facing away from the internal air inlet 26b.

[0041] For further features of the electronic temperature control device 10b, reference is made to the description of Figures 1 and 2.

[0042] Figure 4 shows an electronics temperature control device 10c for an electrochemical system. The electronics temperature control device 10c comprises at least one electronics receiving unit 14c for receiving an electronics unit 16c of the electrochemical system. The electronics temperature control device 10c comprises an air cooling unit 18c for cooling an interior of the electronics receiving unit 14c. The electronics temperature control device 10c comprises at least one air guiding element 20c for guiding air 22c from an external air inlet 24c of the air cooling unit 18c to an internal air inlet 26c of the air cooling unit 18c arranged within the interior. The internal air inlet 26c is arranged on a side of an inverter heat sink 32c of the electronics temperature control device 10c facing the external air inlet 24c. The fluid guiding element 20c is preferably seated on the inverter heat sink 32c.The inverter heat sink 32c forms at least two fluid channels which are designed for opposing air flow.

[0043] For further features of the electronic temperature control device 10c, reference is made to the description of Figures 1 to 3.

[0044] Figure 5 shows an electronics temperature control device 10d for an electrochemical system. The electronics temperature control device 10d comprises at least one electronics receiving unit 14d for receiving an electronics unit 16d of the electrochemical system. The electronics temperature control device 10d comprises an air cooling unit 18d for cooling an interior space of the electronics receiving unit 14d. The electronics temperature control device 10d comprises at least one air guiding element 20d for guiding air 22d from an external air inlet 24d of the air cooling unit 18d to an internal air inlet 26d of the air cooling unit 18d arranged within the interior space.The internal air inlet 26d is arranged on a side of an inverter heat sink 32d of the electronics temperature control device 10d facing the outer air inlet 24d. An air conveying unit of the air cooling unit 18d preferably comprises an inverter conveying element 58d arranged on the inverter heat sink 32d. The air conveying unit can comprise the inverter conveying element 58d alternatively or in addition to an input conveying element and / or an output conveying element. The inverter conveying element 58d is preferably arranged in the internal air inlet 26d or between the internal air inlet 26b and the inverter heat sink 32d.

[0045] For further features of the electronic temperature control device 10d, reference is made to the description of Figures 1 to 4.

[0046] Figure 6 shows an electronics temperature control device 10e for an electrochemical system. The electronics temperature control device 10e comprises at least one electronics receiving unit 14e for receiving an electronics unit 16e of the electrochemical system. The electronics temperature control device 10e comprises an air cooling unit 18e for cooling an interior space of the electronics receiving unit 14e. The electronics temperature control device 10e comprises at least one air guiding element 20e for guiding air 22e from an external air inlet 24e of the air cooling unit 18e to an internal air inlet 26e of the air cooling unit 18e arranged within the interior space. The internal air inlet 26e is arranged on a side of an inverter heat sink 32e of the electronics temperature control device 10e facing the external air inlet 24e.An air conveying unit of the air cooling unit 18e preferably comprises an inverter conveying element 58e arranged on the inverter heat sink 32e. The air conveying unit can comprise the inverter conveying element 58e alternatively or in addition to an input conveying element and / or an output conveying element. The inverter conveying element 58e is preferably arranged at a distance from the internal air inlet 26e on the inverter heat sink 32e, in particular at an air outlet of the inverter heat sink 32e. For further features of the electronics temperature control device 10e, reference is made to the description of Figures 1 to 5.

Claims

Claims 1. Electronics temperature control device for an electrochemical system, with at least one electronics receiving unit (14a; 14b; 14c; 14d; 14e) for receiving an electronics unit (16a; 16b; 16c; 16d; 16e) of the electrochemical system and with at least one air cooling unit (18a; 18b; 18c; 18d; 18e) for cooling an interior of the electronics housing unit (14a; 14b; 14c; 14d; 14e), characterized by at least one air guiding element (20a; 20b; 20c; 20d; 20e) for guiding air (22a; 22b; 22c; 22d; 22e) from an external air inlet (24a; 24b; 24c; 24d; 24e) of the air cooling unit (18a; 18b; 18c; 18d; 18e) to an internal air inlet (26a; 26b; 26c; 26d; 26e) of the air cooling unit (18a; 18b; 18c; 18d; 18e) arranged within the interior space.

2. Electronics temperature control device according to claim 1, characterized in that the outer air inlet (24a; 24b; 24c; 24d; 24e) and the internal air inlet (26a; 26b; 26c; 26d; 26e) are arranged in different halves of the electronics receiving unit (14a; 14b; 14c; 14d; 14e).

3. Electronics temperature control device according to claim 1 or 2, characterized in that the internal air inlet (26a; 26b; 26c; 26d; 26e) and an external air outlet (28a) of the air cooling unit (18a; 18b; 18c; 18d; 18e) for discharging the air (22a; 22b; 22c; 22d; 22e) from the electronics receiving unit (14a; 14b; 14c; 14d; 14e) are arranged in different halves of the electronics receiving unit (14a; 14b; 14c; 14d; 14e).

4. Electronics temperature control device according to one of the preceding claims, characterized in that the air guide element (20a; 20b; 20c; 20d; 20e) is at least partially formed by a mounting plate (30a; 30b; 30c; 30d; 30e) of the electronics receiving unit (14a; 14b; 14c; 14d; 14e) is formed.

5. Electronics temperature control device according to one of the preceding claims, characterized by an inverter heat sink (32a; 32b; 32c; 32d; 32e), wherein the internal air inlet (26a; 26b; 26c; 26d; 26e) is arranged on the inverter heat sink (32a; 32b; 32c; 32d; 32e).

6. Electronics temperature control device according to claim 5, characterized in that the internal air inlet (26c; 26d; 26e) is arranged on a side of the inverter heat sink (32c; 32d; 32e) facing the external air inlet (24c; 24d; 24e).

7. Electronics temperature control device according to claim 5 or 6, characterized in that the internal air inlet (26a; 26b) or a further internal air inlet of the air cooling unit (18a; 18b) is arranged on a side of the inverter heat sink (32a; 32b) facing away from the external air inlet (24a; 24b).

8. Electronics temperature control device according to one of claims 5 to 7, characterized in that the inverter heat sink (32c; 32d; 32e) forms at least two fluid channels which are designed for an opposite air flow.

9. Electronic temperature control device according to one of the preceding claims, characterized in that the air cooling unit (18a; 18b; 18c; 18d; 18e) comprises at least one additional internal air inlet (34a, 36a) arranged upstream of the internal air inlet (26a; 26b; 26c; 26d; 26e) on the air guide element (20a; 20b; 20c; 20d; 20e).

10. Electrochemical system with at least one electrochemical unit (40a) for the electrochemical conversion of a reactant, with at least one electronic unit (16a; 16b; 16c; 16d; 16e) for coupling an electrical current generated or absorbed by the electrochemical conversion to an external power supply and with at least one Electronics temperature control device according to one of the preceding claims for temperature control of the electronics unit (16a; 16b; 16c; 16d; 16e).

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