Housing for a coolant fluid pump
The coolant fluid pump housing uses a gap-free, material-bonded connection via laser welding to improve assembly efficiency and enhance EMC/ESD properties, addressing assembly complexity and component positioning limitations in immersion cooling circuits.
EP4741665A1Pending Publication Date: 2026-05-13NIDEC GPM GMBH
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Patent Information
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- NIDEC GPM GMBH
- Filing Date
- 2025-10-23
- Publication Date
- 2026-05-13
Smart Images
Figure IMGAF001_ABST
Abstract
The invention relates to a housing for a coolant fluid pump (2), in particular for a coolant fluid pump of an immersion cooling circuit, comprising a drive housing (3), a cover (4) and a pump housing (5), wherein the drive housing (3) is axially covered on one side by the cover (4) and is positioned axially opposite the cover (4) of the pump housing (5), wherein the drive housing (3) is connected to the pump housing (5) and the drive housing (3) is connected to the cover (4) in a gap-free, materially bonded manner, i.e. by means of a gap-free, materially bonded connection.
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