Cooling circuit device and heat pump

Abstract

The invention relates to a cooling circuit device (10) for a heat pump, comprising a first cooling circuit module (11) with a first flat connection surface, a second cooling circuit module (12) with a second flat connection surface, a first functional element (21), and a connection means (30, 31). The first connection surface is parallel to the second connection surface. The first functional element (21) is arranged between the first connection surface and the second connection surface, and the connection means (30, 31) exerts a force on the first cooling circuit module (11) and the second cooling circuit module (12) in order to clamp the first functional element (21) between the first cooling circuit module (11) and the second cooling circuit module (12).

Description

[0001] REFRIGERATING CYCLE AND HEAT PUMP

[0002] Field of the invention

[0003] The present invention relates to a refrigeration circuit device for a heat pump and a heat pump for heating and / or cooling a building. In particular, a particularly simple and compact design of the refrigeration circuit device with as few refrigerant lines as possible is to be achieved. With such a refrigeration circuit device, the heat pump can be operated particularly safely and with low maintenance.

[0004] Background of the invention

[0005] Modern heat pumps are characterized by their high efficiency, making them particularly attractive from an ecological and economic perspective for heating and / or cooling a building, especially a residential or office building. Heating with ambient heat is, on the one hand, climate-friendly. On the other hand, many energy suppliers have been offering special heat pump tariffs for several years that are more financially attractive than a standard electricity tariff.

[0006] German patent application DE 10 2018 102 670 A1 describes a heat pump 1 with an integrated buffer storage tank 3, which is schematically illustrated in Fig. 1. The heat pump system 10 illustrated in Fig. 1 consists, in a known manner, of a heat pump 1 and a heat sink 2. As heat sink 2, a heating circuit 2.1 with a plurality of radiators 2.3 and a hot water tank 2.2 are illustrated as an example in Fig. 1. During normal operation or heating mode, ambient heat is transferred from the heat pump 1 to the heat sink 2.

[0007] The heat pump system 10 has a heat exchanger 6 operating as a condenser and through which a heating circuit medium flows. An outlet 3.2 of the buffer tank 3 is connected upstream of an inlet 6.2 of the heat exchanger 6, as seen in the flow direction of the heating circuit medium. The heating circuit medium flows via a return line RL from the heat sink 2 or from the outlet 3.2 of the buffer tank 3 towards the heat pump 1, which is indicated in Fig. 1 by an arrow pointing to the left. Correspondingly, the heating circuit medium flows via a flow line VL from the heat pump to the heat sink 2 or to the inlet 3.1 of the buffer tank 3, which is indicated in Fig. 1 by an arrow pointing to the right.

[0008] The heat pump system 10 shown in Fig. 1 consists of two interconnected system components, one of which is located inside the building and one outside the building. Such a configuration is also referred to as a split heat pump. The two system components are usually referred to as the outdoor unit (ODU) and the indoor unit (IDU). The refrigerant circulates between the outdoor unit (ODU) and the indoor unit (IDU). In this embodiment, the buffer tank 3 is also located in the indoor unit (IDU). In a known monoblock heat pump, the outdoor unit (ODU) and the indoor unit (IDU) are arranged in a common housing.

[0009] A heating circuit pump 7 for circulating the heating circuit medium is arranged between the inlet 6.2 of the heat exchanger 6 on the return line RL and the buffer tank 3. Furthermore, a temperature sensor 11 for measuring the return temperature of the heating circuit medium is arranged in the return line RL.

[0010] During normal operation, the refrigerant of the heat pump 1 absorbs ambient heat via the outdoor unit ODU (Fig. 1 shows a schematic of the evaporator with a fan 8). The refrigerant is then transported via a compressor 9.1 to the heat exchanger 6, which acts as a condenser, where it transfers the absorbed heat to the heating circuit medium. The refrigerant is then expanded in a known manner via an expansion valve 9.2 before returning to the evaporator 5. From the heat exchanger 6, the heating circuit medium initially flows via the flow line VL to a valve 4, which is designed, for example, as a 4 / 3-way valve. Depending on requirements, the heating circuit medium is then directed to the heating circuit 2.1 with the radiators 2.3 and / or to the hot water tank 2.2. The cooled heating circuit medium returns via the return line RL through the inlet 6.2 into the heat exchanger 6 to close the circuit.

[0011] Furthermore, international patent application WO 2010 / 014878 A1 discloses a refrigeration circuit device consisting of several refrigeration circuit components and several refrigeration circuit lines connecting the refrigeration circuit components. At least part of a refrigeration circuit component and at least one refrigeration circuit line are formed in a monolithic body produced by primary molding, thereby reducing the number and length of lines in the refrigerant circuit.

[0012] As defined by Wikipedia (see https: / / de.wikipedia.org / wiki / Urformen), the term "primary forming" here and in the following description refers to a main group of manufacturing processes in which a solid body with a geometrically defined shape is produced from a formless material or blank. Primary forming can include, in particular, a milling process, a casting process, a sintering process, an additive process, and the like. As an alternative to primary forming, one-piece or monolithic components can also be manufactured by forming, e.g., by deep drawing a single sheet.

[0013] The adjective "monolithic" used above (again as in Wikipedia: https: / / de.wikipedia.org / wiki / Monolith) here and in the following description means something like "compact" or "cast in one piece" or "integral" or "continuous". A monolithic body formed by primary forming can, for example, be a workpiece that is manufactured from a single, continuous metal blank by machining such as milling. Another example of a monolithic body formed by primary forming is a workpiece that is formed from metal powder or plastic powder by additive processes (e.g. laser deposition welding, sintering, or 3D printing). Furthermore, for example, a component manufactured by an injection molding process or by a metal casting process can be a monolithic body formed by primary forming.

[0014] The refrigerant circuit of a heat pump of the type described above according to the prior art can comprise a plurality of lines, which can be made, for example, of copper and / or other metals and / or plastics. These lines can be designed, in particular, as pipes and / or hoses and can thus be rigid or movable. Individual pipe sections and / or hose sections can be permanently connected, for example, by soldering, pressing, welding, or similar methods, or they can be detachably connected to one another using a sealed coupling. There is a risk of leaks occurring, particularly at such detachable connections.

[0015] Since copper, in particular, is a raw material that can be expensive to manufacture, there is a need to keep the total length of all the lines in the refrigeration circuit as short as possible. Reducing the total length of the lines can also advantageously reduce the amount of refrigerant required. Furthermore, the number of connections between individual line sections should be reduced. This can significantly reduce the risk of leaks. This can be particularly advantageous when using a flammable and / or toxic and / or environmentally harmful refrigerant. Due to its flammability, it is particularly advantageous when using the natural refrigerant R290 (propane) to keep the total amount of refrigerant and the risk of leaks as small as possible.

[0016] Reducing the overall length of pipes and the number of connections can also enable a more compact design and thus a lower weight of the heat pump. This can be particularly advantageous for monoblock heat pumps. Small size and low weight can be advantageous, for example, in the manufacture and installation of heat pumps, and especially when retrofitting a heat pump heating system in an older building.

[0017] Furthermore, reducing the overall length of pipes can also reduce the noise emitted by the heat pump. Especially in residential buildings, it is advantageous if a heat pump can operate as quietly as possible. This can also advantageously make it possible to dispense with the relief valves used in some heat pumps to prevent vibrations.

[0018] One approach to reducing the number of lines in a refrigeration circuit is described, for example, in German patent application DE 102022116 807. The refrigeration circuit device disclosed therein comprises a plurality of refrigeration circuit components and a plurality of refrigeration circuit lines connecting the refrigeration circuit components to one another. At least one part of a refrigeration circuit component and at least one refrigeration circuit line are formed in a monolithic body produced by primary molding. An interface connected to one part of one refrigeration circuit component or to one refrigeration circuit line is arranged on this body for the external connection of one of the remaining refrigeration circuit components or one of the remaining refrigeration circuit lines.

[0019] In other words, parts of the refrigeration circuit components and parts of the refrigeration circuit lines are formed in a body that is essentially a monolithic block produced by primary molding. This makes it possible to provide a particularly compact device for connecting additional circuit components and lines. Such a block can also be manufactured particularly easily.

[0020] Furthermore, the high modularity of individual components allows for easy

[0021] Replacing functional components of the heat pump's refrigerant circuit can be achieved, which can, for example, simplify maintenance or manufacturing of the heat pump, thus saving time and costs.

[0022] Problem underlying the invention

[0023] Based on the known prior art, it is an object of the present invention to achieve a particularly simple construction of a refrigeration circuit device in order to provide an improved heat pump with the lowest possible weight, the smallest possible size and the shortest possible total length of lines in the refrigerant circuit.

[0024] Inventive solution

[0025] According to a first aspect of the present invention, a refrigeration circuit device for a heat pump is provided according to claim 1. A second aspect of the present invention relates to a heat pump for heating and / or cooling a building according to claim 14. Such a heat pump can typically also be used for hot water preparation. A heat pump according to the invention for heating and / or cooling a building comprises a refrigeration circuit device according to the present invention. Further aspects of the present invention are the subject of the dependent claims, the drawings, and the following description of exemplary embodiments.

[0026] To switch the heat pump's operation between heating and cooling, the flow direction of the refrigerant in the refrigerant circuit can preferably be reversed, for example, using a 4 / 2-way valve or similar. In this case, the condenser and the evaporator each exchange their functions. In other words, the condenser becomes the evaporator, and the evaporator becomes the condenser.

[0027] A "module" or "refrigeration circuit module" is preferably understood here as a component or assembly of the refrigerant circuit that comprises several parts or components, which are often, but not necessarily, arranged in a module housing or on or in a support, in such a way that they are designed to be preassembled together in a single unit. Generally speaking, in such a modularized structure, the parts or components are assembled into modules along predefined locations. Accordingly, the resulting assembly or component can be transported as a unit and installed into or removed from the refrigerant circuit device.

[0028] Preferred embodiments of the invention

[0029] Advantageous training and further education, which can be used individually or in combination, are the subject of the dependent claims.

[0030] The refrigeration circuit device comprises a first refrigeration circuit module with a flat first connecting surface and a second refrigeration circuit module with a flat second connecting surface, as well as a first functional element arranged between the first connecting surface and the second connecting surface. A connecting means exerts a force on the first refrigeration circuit module and the second refrigeration circuit module to clamp the first functional element between the first refrigeration circuit module and the second refrigeration circuit module.

[0031] For example, the refrigeration circuit device according to the invention with refrigeration circuit modules can reduce the risk of leaks in which refrigerant escapes. Furthermore, the total amount of refrigerant required in the refrigerant circuit can be reduced. This can contribute to the safe operation of the heat pump, particularly when using a flammable, highly flammable and / or toxic refrigerant.

[0032] In addition, by integrating the refrigerant lines into the refrigeration circuit modules, low-vibration operation of the heat pump can be achieved, so that the heat pump can be operated particularly quietly and the service life of the components or the heat pump can be improved.

[0033] The flat connecting surfaces serve as interfaces between refrigeration circuit modules. For example, a plurality of connections can be provided on or in the connecting surfaces to establish a flow connection between refrigeration circuit modules. The connections can, for example, comprise flanges or the like to establish a flow connection.

[0034] Preferably, each of the plurality of connections of a first connecting surface can each have connecting nozzles. Accordingly, each of a plurality of connections of a second connecting surface provided for connection to the first connecting surface can each have appropriately assigned connecting sleeves. The connecting nozzles and connecting sleeves can together form a plug-in connection to enable a particularly simple and detachable connection of two refrigeration circuit modules.

[0035] The planar connecting surfaces do not necessarily have to be contiguous. They can also be realized, for example, by arranging a plurality of connections in an imaginary plane. Thus, a connecting surface can be composed, in particular, of a plurality of annular partial surfaces of these connections.

[0036] The design of the refrigeration circuit device with refrigeration circuit modules and functional elements allows a layered construction of the refrigeration circuit device, which is particularly easy to manufacture. This allows, in particular, the manufacture and maintenance of the refrigeration circuit device to be carried out in a particularly simple manner. According to preferred embodiments, the refrigeration circuit device can have more than two refrigeration circuit modules. Furthermore, the refrigeration circuit device can have more than one functional element. Particularly preferably, a functional element is arranged between each two refrigeration circuit modules. Thus, the refrigeration circuit device can preferably have at least one refrigeration circuit module more than functional elements.

[0037] The refrigeration circuit modules, together with the functional elements, form at least part of a refrigerant circuit of the heat pump. In preferred embodiments, the entire refrigerant circuit of the heat pump can be formed by the refrigeration circuit modules and functional elements of the refrigeration circuit device.

[0038] The refrigeration circuit device preferably comprises a third refrigeration circuit module with a flat fourth connecting surface and a second functional element. The second refrigeration circuit module can have a flat third connecting surface. The third and fourth connecting surfaces can each be arranged parallel to the first and second connecting surfaces. The second functional element can be arranged between the third connecting surface and the fourth connecting surface. Preferably, the connecting means exerts a force on the second refrigeration circuit module and the third refrigeration circuit module in order to clamp the second functional element between the second refrigeration circuit module and the third refrigeration circuit module.

[0039] A refrigeration circuit module combines components of a sub-process of a heat pump's refrigerant circuit into a compact assembly, so that at least part of the refrigerant circuit or the entire refrigerant circuit of the heat pump can be constructed by combining several refrigeration circuit modules. The individual refrigeration circuit modules can each be exchanged for a similar refrigeration circuit module to enable the simplest possible production and maintenance of the heat pump. The individual sub-processes in the refrigerant circuit of a heat pump include, in simplified terms, the compression of the refrigerant, the liquefaction of the refrigerant, the expansion of the refrigerant, and the evaporation of the refrigerant. Compression preferably takes place in a compressor.Condensation occurs in a first heat exchanger, known as a condenser, where the refrigerant transfers the absorbed heat to a heating medium of an external heating circuit. The refrigerant expands in an expansion valve. Evaporation of the refrigerant occurs, for example, in a second heat exchanger, known as an evaporator, where the refrigerant preferentially absorbs the ambient heat.

[0040] Further preferably, a further circuit carrying the heating circuit medium can be connected, which is connected to an evaporator where the heating circuit medium absorbs ambient heat. Advantageously, both heat exchangers arranged in the refrigerant circuit can be designed as compact plate heat exchangers, while the relatively large evaporator, in the case of an air-water heat pump, for example, can be arranged spatially separate from the installation space of the refrigerant circuit.

[0041] Similar to the functional elements, certain subcomponents such as sensors, actuators, drives, electronics and the like can be arranged as external functional assemblies on an outer surface of a refrigeration cycle module and interact with components arranged inside the refrigeration cycle module.

[0042] The functional elements can preferably each comprise at least one of the following components: a flow path for connecting flow paths of adjacent refrigeration circuit modules; a seal for sealing flow paths of adjacent refrigeration circuit modules; a vibration damper; an electrical contact for transmitting electrical signals between adjacent refrigeration circuit modules, between which the functional element is arranged; electrical insulation; thermal insulation, in particular for separating a warm partial circuit from a cold partial circuit; a thermal contact for transmitting heat between adjacent refrigeration circuit modules; a sensor for measuring a temperature of the refrigerant; a sensor for measuring a pressure of the refrigerant; a sensor for measuring a volume flow of the refrigerant; a safety high-pressure switch for switching off the heat pump orof the compressor when the refrigerant pressure exceeds a specified limit; an actuator for operating a valve, such as a changeover valve or for controlling an expansion valve.

[0043] The functional elements can preferably be multi-layered or constructed from multiple layers, with the individual layers comprising different materials with different properties. For example, the sealing function can be combined with the function of transmitting an electrical signal or heat. Furthermore, sensors can be arranged within or between the layers.

[0044] The functional elements may particularly preferably contain materials which can adsorb or absorb a certain amount of leaked refrigerant, for example in the event of a leak.

[0045] A functional element is particularly preferably a thin, flat, planar, multilayer component that can be used to seal connections between two refrigeration circuit modules. Additionally, one or more of the functions described above can be implemented. Furthermore, a refrigeration circuit module is characterized in that at least some of the flow paths for the refrigerant, for supplying and discharging the refrigerant to and from the relevant sub-process, are arranged inside the refrigeration circuit module. Thus, conventional lines such as pipes or hoses can be completely or at least partially dispensed with, allowing a multitude of advantages to be achieved.

[0046] A refrigeration cycle module can preferably integrate more than one subprocess into a single assembly. By increasing the degree of integration, the refrigeration cycle device can be designed even more compactly, saving space and weight and further reducing the overall length of refrigerant lines.

[0047] At least one of the refrigeration circuit modules can comprise at least one of the following components: a compressor for compressing the refrigerant; a condenser for transferring heat from the refrigerant to a heating circuit medium of an external heating circuit, wherein the condenser can preferably operate as an evaporator in reverse operation of the heat pump; one or more expansion valves for expanding the refrigerant; an evaporator for transferring heat from an ambient medium to the refrigerant, wherein the evaporator can preferably operate as a condenser in reverse operation of the heat pump; a control device for controlling active components in the refrigerant circuit, for example valves and / or a speed of a motor of the compressor; a changeover valve for switching between branches orPartial circuits of the refrigerant circuit and / or for reversing a flow direction of the refrigerant, wherein the changeover valve can be designed, for example, as a 4 / 3-way valve or 4 / 2-way valve or by several valves; an internal heat exchanger, in particular for cooling a.

[0048] Converter; an economiser, in particular for cooling the compressor; a phase separator, in particular a liquid separator or accumulator on a low-pressure side of the refrigerant circuit or in particular a refrigerant collector for collecting the refrigerant on a high-pressure side of the refrigerant circuit; a filter, in particular for filtering out impurities in the refrigerant; an oil separator, in particular for separating oil in the refrigerant orfor returning oil in the refrigerant, in particular to an oil sump in the compressor; a dryer, in particular for binding water in the refrigerant; a sensor for measuring a temperature of the refrigerant; a sensor for measuring a pressure of the refrigerant; a sensor for measuring a volume flow of the refrigerant; an actuator for actuating and / or a coil for controlling a valve, in particular a changeover valve and / or an expansion valve and / or an inlet valve of the compressor and / or an outlet valve of the compressor; a safety high-pressure switch, in particular for switching off the compressor if a measured pressure of the refrigerant exceeds a predetermined limit value; a flow path or a plurality of flow paths for the refrigerant.

[0049] Preferably, one of the refrigeration circuit modules comprises a compressor. A compression chamber of the compressor and flow paths for the refrigerant are preferably formed in a monolithic body of this refrigeration circuit module, manufactured by primary forming. Movable components of the compressor can be arranged in the monolithic body. A drive unit for driving the movable components of the compressor can be arranged on an outer surface of one refrigeration circuit module. Particularly preferably, the first refrigeration circuit module comprises a compressor for compressing a refrigerant and flow paths for the refrigerant. The first refrigeration circuit module can accordingly also be referred to as a compressor module.The first refrigeration circuit module thus integrates all components required for the process of compressing the refrigerant, as well as at least part of the flow paths to and from the compressor, i.e. a supply line and a return line of the compressor.

[0050] The second refrigeration circuit module preferably comprises an expansion valve for expanding the refrigerant and flow paths for the refrigerant. The second refrigeration circuit module can therefore also be referred to as an expansion module. The expansion valve can, in particular, be a thermostatic expansion valve, an electronic expansion valve, or a throttle. The characteristic curve of the expansion valve can, for example, be linear or equal-percentage. The expansion valve can be controlled unipolarly or bipolarly. One function of the expansion valve is to keep the refrigerant circuit in balance and ensure an even distribution of the refrigerant throughout the circuit.

[0051] The first refrigeration circuit module is preferably fluidly connected to the second refrigeration circuit module via the first functional element. Preferably, the first refrigeration circuit module can be connected via a suitable interface on an outer surface of the first refrigeration circuit module to a corresponding interface on an outer surface of the second refrigeration circuit module, with the first functional element arranged therebetween. Openings for connecting the flow paths are arranged in particular in these interfaces. The interfaces of the first refrigeration circuit module and the second refrigeration circuit module can preferably be the planar connecting surfaces.

[0052] Each refrigeration circuit module can have a plurality of connections to establish a flow connection with a refrigeration circuit module. These connections can, for example, be combined into interfaces to enable simple and time-saving connection of the refrigeration circuit modules. Consequently, assembly and maintenance of the refrigeration circuit device can be carried out particularly easily and time-savingly. A functional element, for example, can be used as a seal to seal the plurality of connections. The interfaces are arranged, for example, in the aforementioned flat connecting surfaces.

[0053] The flow paths in the refrigeration circuit modules can preferably have connecting pieces and connectors. The connecting pieces are, for example, sections of the flow paths, each of which can be arranged in a plane running through the refrigeration circuit module. The connectors are preferably sections of the flow paths, each of which can be arranged perpendicular to the plane, for example. This allows for a particularly simple and space-saving design that is easy to manufacture.

[0054] At the ends of the connecting pieces, connections are preferably arranged as interfaces for connecting to corresponding connections of adjacent refrigeration circuit modules. This advantageously allows for the implementation of predefined interfaces between the refrigeration circuit modules, which allow individual refrigeration circuit modules to be replaced, in particular, with functionally identical refrigeration circuit modules that may also have different internal designs. This allows for a high degree of modularity, so that different designs of refrigerant circuits can be realized by exchanging individual refrigeration circuit modules. The interfaces are preferably arranged in the flat connecting surfaces.

[0055] The second refrigeration circuit module preferably comprises a first expansion valve and a second expansion valve. In preferred embodiments, the second refrigeration circuit module can also have a third expansion valve. The expansion valves can each be arranged in different flow paths in the second refrigeration circuit module. For example, by providing switching valves, the various expansion valves can be integrated into the active circuit depending on the desired configuration, thus enabling different refrigerant circuits to be implemented.

[0056] In preferred embodiments, the second refrigeration circuit module can comprise one or more reversing valves for switching between branches of the refrigerant circuit and / or for reversing the flow direction of the refrigerant. A reversing valve can be designed, for example, as a 4 / 3-way valve or a 4 / 2-way valve. The second refrigeration circuit module can thus also be referred to as a valve module in which a plurality of valves are arranged.

[0057] According to a preferred embodiment, the second refrigeration circuit module, in particular, may have a bypass line instead of a reversing valve or in addition to a reversing valve. The bypass line is a flow path provided, for example, to enable hot gas bypass defrosting.

[0058] The second refrigeration circuit module can preferably have a phase separator. The phase separator can, in particular, be a refrigerant collector for collecting the refrigerant. Liquid refrigerant and / or gaseous refrigerant can be tapped from the phase separator.

[0059] A phase separator can also be referred to as an accumulator. The refrigerant collector preferably serves as an equalizing tank to regulate the pressure in the refrigerant circuit. The phase separator can alternatively be designed as a liquid separator. For example, phase separation between liquid and gaseous refrigerant can take place in the refrigerant collector. A refrigerant collector is generally used in a high-pressure region of the refrigerant circuit. A liquid separator is generally used in a low-pressure region of the refrigerant circuit. The compressor of the first refrigeration circuit module is preferably a reciprocating piston compressor comprising a crankshaft and at least one piston connected to the crankshaft. A reciprocating piston compressor can be particularly advantageous because it can be operated with little or even oil-free oil, particularly in the working chamber or at the contact points with the refrigerant or the refrigeration circuit.This prevents the refrigerant from mixing with oil. This can increase the longevity of the refrigerant, the refrigerant circuit, and the refrigerant-carrying components, allowing the heat pump according to the invention to operate with particularly low maintenance.

[0060] Furthermore, the use of an additional oil separator in the refrigerant circuit can preferably be omitted, thereby reducing the complexity of the refrigerant circuit, which in turn can simplify manufacturing and reduce costs. In particular, the amount of refrigerant required can be advantageously reduced, as it is not bound to oil.

[0061] Furthermore, particularly safe operation of the heat pump can be ensured, as adequate lubrication is not required at certain operating points, which can be particularly advantageous, for example, during start-up or switching. The advantages described here can also contribute to improving the overall energy efficiency of the heat pump or the entire HVAC (heating, ventilation, air conditioning, and refrigeration) system.

[0062] The reciprocating piston compressor preferably has an even number of cylinders. For example, the reciprocating piston compressor can have two, four, six, or eight cylinders. An even number of cylinders can preferably be arranged in pairs along a common cylinder axis. When cylinders are arranged in pairs, the vibrations generated by the movement of the pistons in the cylinders can be particularly advantageously compensated in pairs. The reciprocating pistons of a cylinder pair can each have a phase shift of 180 degrees. This means that the pistons each move in opposite directions, so that the generated vibrations compensate each other. This allows for particularly low-vibration operation of the compressor.

[0063] A particularly preferred reciprocating piston compressor has three pairs of cylinders, each arranged at an angle of 60 degrees to each other. Such an arrangement is also referred to as a star arrangement. This allows first- and second-order oscillating inertial forces to be avoided or at least reduced in a particularly advantageous manner, thus achieving particularly low-vibration operation of the compressor.

[0064] The cylinder axes of the three cylinder pairs are preferably located in a common plane. The cylinders are particularly preferably arranged in a star configuration. This allows for a particularly compact and flat compressor design, thus saving space.

[0065] The crankshaft is preferably arranged between the cylinders. With a star-shaped cylinder arrangement, the crankshaft can be arranged at a center point between the plurality of cylinders. This allows the forces acting on the crankshaft to be compensated and first- and second-order vibrations to be avoided or at least reduced.

[0066] The pistons are preferably driven by the rotating crankshaft in such a way that, during compression, they move away from the crankshaft in pairs in opposite cylinders in the same phase. In this way, a particularly favorable arrangement can be created in which the occurring oscillating first and second order inertial forces can be avoided or at least reduced particularly easily. The flow paths of the first refrigeration circuit module can, in particular, comprise a supply channel and a return channel. The return channel is located on a low-pressure side and supplies the refrigerant to the compressor, for example via inlet valves. The supply channel is located on a high-pressure side and carries the compressed refrigerant away from the compressor towards an evaporator in the refrigeration circuit.

[0067] The supply channel and the return channel can preferably each be annular. The supply channel and the return channel are preferably arranged parallel to each other, and an axis of symmetry of the supply channel and the return channel is preferably arranged perpendicular to the cylinder axes of the compressor. This allows a particularly compact design of the reciprocating piston compressor to be achieved, especially if the reciprocating piston compressor has three cylinder pairs arranged in a star configuration.

[0068] Thermal insulation is preferably arranged between the supply and return ducts. Thermal insulation can be achieved, for example, by arranging an insulating material with very low thermal conductivity or by creating an air gap or a vacuum. With an air gap, heat transfer by convection is very low. Through an air gap or a vacuum, heat can thus be transferred almost exclusively by radiation, which is negligible at the temperatures occurring in a refrigeration circuit. Heat conduction along the surrounding material can also preferably be very small. Thus, thermal insulation can reduce heat transfer between the supply and return to a negligible level.

[0069] The first refrigeration circuit module preferably comprises a drive unit for driving the crankshaft of the compressor. The drive unit may, for example, comprise an electric motor and is preferably arranged on an outer surface of the first refrigeration circuit module. Furthermore, the first refrigeration circuit module may comprise a control unit for controlling the drive unit. The drive unit preferably comprises an inverter for controlling a rotational speed of the compressor and thus a compression power of the compressor.

[0070] A preferred refrigeration circuit device comprises a third refrigeration circuit module, which includes a condenser for transferring heat from the refrigerant to a heating circuit medium of an external heating circuit. The third refrigeration circuit module can thus also be referred to as a condenser module. The condenser can be a heat exchanger with a condenser, where the gaseous refrigerant condenses, thereby transferring heat to the heating circuit medium. Accordingly, the third refrigeration circuit module can also have connections for connecting lines of the external heating circuit.

[0071] A preferred refrigeration circuit device comprises a fourth refrigeration circuit module, which includes an evaporator for transferring heat from an ambient medium to the refrigerant. The fourth refrigeration circuit module can thus also be referred to as an evaporator module. The evaporator can be a heat exchanger at which the refrigerant absorbs heat from the ambient air, causing the refrigerant to evaporate.

[0072] According to a preferred embodiment, the evaporator in the fourth refrigeration cycle module can be a finned heat exchanger, as described, for example, in the published patent application No. DE 102010 021692 A2.

[0073] Alternatively, the fourth refrigeration circuit module can have a heat exchanger, preferably designed as a plate heat exchanger, where heat is transferred between the refrigerant and a heat transfer medium of a further circuit. This further circuit preferably includes an evaporator, where heat can be absorbed from an ambient medium, such as the ground in the case of a brine-water heat pump or the ambient air in the case of an air-water heat pump. Brine, for example, can be used as the heat transfer medium in the further circuit, and is pumped through a geothermal probe or a flat-plate geothermal collector.

[0074] In an air-to-water heat pump design, a large evaporator with a fan can be used, which can be arranged outside the refrigeration circuit in the further circuit. This allows the refrigeration circuit to be manufactured compactly and with a high degree of integration.

[0075] In a preferred embodiment of the invention, the fourth refrigeration circuit module can be arranged at a distance from the remaining refrigeration circuit modules. Pipes or hoses can be used as lines for the refrigerant. These lines include, in particular, a supply line and a return line. Each of the lines should be no longer than 100 cm, preferably no longer than 50 cm.

[0076] A preferred refrigeration circuit device comprises a fifth refrigeration circuit module, which includes an internal heat exchanger for transferring heat from a first sub-circuit of the refrigerant circuit to a second sub-circuit of the refrigerant circuit. Preferably, the internal heat exchanger can be used to cool an inverter.

[0077] A preferred refrigeration circuit device comprises a sixth refrigeration circuit module with a plurality of flow paths for the refrigerant and a plurality of connections for connecting the flow paths to other refrigeration circuit modules. The sixth refrigeration circuit module can also be referred to as a distribution module and serves as an interface between at least two of the remaining refrigeration circuit modules in order to interconnect the components in the refrigeration circuit modules according to a preferred embodiment of the refrigerant circuit and to distribute the refrigerant accordingly between the refrigeration circuit modules. For this purpose, two or more of the plurality of flow paths can branch and / or combine in the distribution module. Furthermore, the distribution module can have an expansion tank or refrigerant collector or liquid separator.

[0078] The sixth refrigeration circuit module is preferably fluidly connected to the second refrigeration circuit module. Further preferably, the sixth refrigeration circuit module is fluidly connected to the third refrigeration circuit module and / or to the fourth refrigeration circuit module and / or to the fifth refrigeration circuit module.

[0079] In a preferred embodiment, a portion of the refrigerant can be used after condensation to generate steam with the aid of an additional heat exchanger (e.g., the internal heat exchanger) and an additional expansion valve. This steam can be injected directly into the compressor. This additional steam injection can advantageously increase efficiency. Such steam injection can be used in the reciprocating compressor described in more detail below and, in alternative embodiments, particularly in a scroll compressor.

[0080] Preferably, a functional element with thermal insulation can be arranged between the sixth refrigeration circuit module and the second refrigeration circuit module. The thermal insulation serves to prevent or at least minimize heat transfer between the refrigerant in the sixth refrigeration circuit module and the refrigerant in the second refrigeration circuit module. This allows, for example, a hot subcircuit to be thermally separated from a cold subcircuit of the refrigerant circuit.

[0081] A preferred refrigeration circuit device comprises a housing that surrounds the refrigeration circuit modules, wherein the housing preferably has an opening in which a fan or ventilator for drawing in ambient air is arranged. Preferably, an evaporator of the refrigeration circuit device is arranged in an air flow generated by the fan. According to a preferred embodiment, the heat pump can be a monoblock heat pump, which can in particular be designed as an air-to-water heat pump. Such a monoblock heat pump preferably uses the energy of the ambient air for heating. Unlike split-system air-to-water heat pumps, the refrigerant circuit of a monoblock heat pump is located in a single unit. In other words, the refrigerant circuit of the monoblock heat pump is arranged in a common housing.

[0082] A monoblock heat pump is preferably installed outside the building to be heated (or cooled), for example, on the roof of the building or on a plot of land adjacent to the building. However, it is also possible to install the monoblock heat pump inside the building. Due to its compact design, a monoblock heat pump can be advantageously used as a retrofit solution for existing buildings. Compared to a split-system heat pump, the installation of a monoblock heat pump can be less labor-intensive, as no refrigerant lines need to be laid between the outdoor unit and the indoor unit. Furthermore, monoblock heat pumps can require less maintenance than split-system heat pumps.

[0083] Another exemplary embodiment of the heat pump according to the invention is a water-to-water heat pump, a brine-to-water heat pump, or a geothermal heat pump. In such an embodiment, the two heat exchangers in the evaporator and the condenser can, in particular, be designed as plate heat exchangers.

[0084] According to a preferred embodiment, the heat pump has no more than two refrigerant-carrying lines arranged outside one of the refrigeration circuit modules. These two lines can, for example, be pipes or hoses connected to a heat exchanger in the refrigeration circuit. The two lines are each no longer than 100 cm, more preferably no longer than 50 cm, and most preferably no longer than 30 cm. Particularly preferred embodiments of the present invention can entirely dispense with such lines outside the refrigeration circuit modules. In other words, in such embodiments, all flow paths for the refrigerant are formed in the refrigeration circuit modules.

[0085] Particularly preferably, the refrigeration circuit device of the heat pump does not have any lines for the refrigerant arranged outside the refrigeration circuit modules. In such a design, the refrigeration circuit modules are directly connected to one another. In particular, the third refrigeration circuit module, the fourth refrigeration circuit module, and the fifth refrigeration circuit module, each of which preferably has a plate heat exchanger, can be connected directly to the sixth refrigeration circuit module. In this way, a very compact design of the refrigeration circuit device can be achieved.

[0086] A preferred heat pump further comprises an inverter thermally coupled to an internal heat exchanger of the refrigeration cycle device for cooling the inverter. The inverter can, for example, convert the frequency of an alternating current to drive the compressor. More preferably, the inverter can provide a three-phase current to operate the compressor. For example, an inverter can convert a supply voltage with a predetermined frequency into an alternating voltage with a different frequency to control a motor speed of the compressor.

[0087] Further preferably, a DC motor can be used. Such a motor can, for example, use a DC converter that generates a pulse-width modulation (PWM) signal.

[0088] Brief description of the drawings

[0089] Further advantageous embodiments are described in more detail below with reference to an exemplary embodiment shown in the drawings, to which the invention is not limited, however. They show schematically: Figure 1 Fig. 1 illustrates a heat pump heating system according to the

[0090] State of the art.

[0091] Figure 2 Fig. 2 shows a perspective view of a refrigeration circuit device.

[0092] Figure 3 Fig. 3 shows an exploded view of the refrigeration circuit device from Fig. 2.

[0093] Figure 4 Fig. 4 shows a second refrigeration circuit module and a sixth refrigeration circuit module of the refrigeration circuit device from Fig. 2.

[0094] Figure 5 Fig. 5 illustrates a refrigeration cycle of the

[0095] Refrigeration circuit device from Fig. 2.

[0096] Figure 6 Fig. 6 shows a section through the

[0097] Reciprocating piston compressor from Fig. 2 and 3.

[0098] Figure 7 shows a side exploded view of a refrigeration circuit device according to the invention.

[0099] Figure 8 Fig. 8 shows a schematic illustration of the refrigeration circuit device from Fig. 7.

[0100] Detailed description of implementation examples

[0101] In the following description of a preferred embodiment of the present invention, like reference numerals designate like or comparable components.

[0102] Fig. 2 shows a perspective view of a refrigeration circuit device 10 for a heat pump. Fig. 3 shows an exploded view of the refrigeration circuit device 10 from Fig. 2. Fig. 4 shows a view of a second refrigeration circuit module 12 and a sixth refrigeration circuit module 16 of the refrigeration circuit device from Fig. 2. Fig. 2, Fig. 3 and Fig. 4 each show a right-handed orthogonal coordinate system with axes X, Y and Z. Fig. 5 schematically illustrates the refrigerant circuit of the refrigeration circuit device 10. The refrigeration cycle device 10 in Fig. 2 and Fig. 3 comprises a first refrigeration cycle module 11, a second refrigeration cycle module 12, a third refrigeration cycle module 13, a fourth refrigeration cycle module 14, a fifth refrigeration cycle module 15, a sixth refrigeration cycle module 16, a motor 17, a control device 18, and coils 19. No functional elements are shown in Figs. 2, 3 and 4.However, these can be provided between the individual refrigeration circuit modules 11 to 16.

[0103] The first refrigeration cycle module 11 comprises a reciprocating compressor comprising a crankshaft 11k (see Fig. 6) and six pistons 11f connected to the crankshaft 11k via connecting rods 11h. The reciprocating compressor comprises six cylinders 11e, each arranged in pairs along a common cylinder axis. A piston 11f is mounted in each cylinder 11e. Each cylinder 11e also has a valve flap 11g.

[0104] The three cylinder pairs are arranged in a star configuration and are each at an angle of 60 degrees to each other. The cylinder axes of the three cylinder pairs lie in a common plane, which is shown here parallel to the XY plane. This allows for a particularly compact and flat compressor design, thus saving space. The star-shaped arrangement of the reciprocating pistons allows the compressor to operate with particularly low vibration and therefore low noise. Furthermore, this minimizes another cause of leaks and improves service life or extends maintenance intervals.

[0105] The crankshaft 11k is arranged between the cylinders and is driven by an external motor 17. The motor 17 is controlled by the control device 18. For example, an inverter can be used to control the motor 17. Furthermore, the control device 18 can also be used to control the compressor valves.

[0106] Fig. 6 shows a sectional view of the compressor through a cylinder 11e as well as through the supply line 11a and the return line 11b. The first refrigeration cycle module 11 comprises an annular supply channel 11a and an annular return channel 11b. The supply channel 11a and the return channel 11b are arranged concentrically around the crankshaft 11k, and the crankshaft 11k is arranged parallel to the Z-axis.

[0107] The annular supply channel 11a and the annular return channel 11b are arranged parallel to each other, and a symmetry axis of the supply channel 11a and the return channel 11b is perpendicular to the cylinder axes of the compressor. This, together with the star-shaped arrangement of the cylinders 11e, allows for a particularly compact design of the reciprocating compressor.

[0108] A thermal insulation layer 11d is arranged between the supply channel 11a and the return channel 11b to minimize heat transfer between the return channel 11b and the supply channel 11a. A compressor housing 11c, also annular, serves as a structural support for the cylinders 11e as well as for the supply channel 11a and the return channel 11b.

[0109] The motor 17 is controlled by the control device 18, which drives the crankshaft. Furthermore, the control device 18 controls coils 19 to open or close switching valves or expansion valves in the second refrigeration circuit module 12. Furthermore, the control device 18 can control inlet and outlet valves 11g in the compressor. The control device 18 can thus control the heating or cooling output of the heat pump. The control device 18 can also receive measured values ​​from sensors, in particular temperature sensors, pressure sensors, and volume flow sensors.

[0110] The rotary motion of the crankshaft 11k is transmitted via connecting rods 11h into an up and down movement of the pistons 11f in the cylinders 11e, see Fig. 6. When a piston 11f moves outwards in the cylinder 11e (upwards in Fig. 6), it compresses the gaseous refrigerant contained therein, which is then directed to the supply channel 11a by the corresponding opening and closing of inlet and outlet valves 11g. Refrigerant from the return line 11b is admitted into the pistons 11f via an inlet valve 11g as the piston 11f moves toward the crankshaft 11k. At bottom dead center, the inlet valve 11g is closed, and the piston 11f compresses the refrigerant in the cylinder 11e. Shortly before the top dead center, the outlet valve 11g is opened towards the flow line 11a in order to release the compressed refrigerant via the compressor housing 11c to the flow line 11a.The thermal insulation lld between the compressor housing 11c and the flow channel 11a minimizes heat transfer between the flow channel 11a and the return channel 11b and can dampen pulsating movements of the refrigeration cycle module 11 that occur during operation due to the pressure difference between the return channel 11b and the flow channel 11a.

[0111] The second refrigeration circuit module 12 comprises a first expansion valve 12e and a second expansion valve 12f, as well as a plurality of flow channels for the refrigerant. Furthermore, the second refrigeration circuit module 12 comprises a reversing valve 12g for reversing the flow direction of the refrigerant. The reversing valve 12g can be designed, for example, as a 4 / 2-way valve. The valves 12e, 12f, and 12g can be controlled by coils 19.

[0112] The second refrigeration circuit module 12 also includes an expansion tank 12d for collecting the refrigerant and equalizing the pressure in the refrigerant circuit. The expansion tank 12d is arranged here in a medium pressure region of the refrigerant circuit and is designed as a phase separator. In alternative embodiments, the expansion tank can preferably also be designed as a liquid separator.

[0113] A return line to the expansion tank 12d (flow path F) is preferably connected to an upper region of the expansion tank 12d to supply preferably gaseous refrigerant to the expansion tank 12d. A phase separation between gaseous and liquid refrigerant can occur in the expansion tank 12d. The outlet of the expansion tank 12d through the flow path with connection G (or the supply line of the expansion tank 12d) is preferably connected to a lower region of the expansion tank 12d to discharge preferably liquid refrigerant.

[0114] The second refrigeration circuit module 12 can, for example, be a monolithic body manufactured by primary forming and / or forming. Alternatively, it can be manufactured, for example, by joining two half-shell-shaped components, so that a plurality of flow paths and the expansion tank 12d for the refrigerant are formed in the second refrigeration circuit module 12. The sixth refrigeration circuit module 16 can be manufactured similarly to the second refrigeration circuit module 12.

[0115] The refrigeration circuit device 10 in Fig. 2 and 3 comprises three heat exchangers. The first heat exchanger is arranged in the third refrigeration circuit module 13 and serves as a condenser, where heat is transferred from the refrigerant to a heating circuit medium of an external heating circuit 8. The second heat exchanger is arranged in the fourth refrigeration circuit module 14 and serves as an evaporator, where ambient heat is transferred to the refrigerant. The third heat exchanger is arranged in the fifth refrigeration circuit module 15 and serves as an internal heat exchanger to increase the efficiency of the system and to achieve suction gas superheating. In addition, the internal heat exchanger can be used, for example, to cool an inverter 9 or to cool other components of the heat pump. The heat exchangers can be designed as plate heat exchangers, for example. Other forms of heat exchanger are also possible depending on the intended use or requirements of the refrigeration circuit device 10 orThe heat pump is possible. For example, the evaporator's heat exchanger can also be a fin-tube evaporator or plate heat exchanger, which enables direct heat transfer from air to refrigerant without a liquid intermediate medium.

[0116] The third refrigeration circuit module 13, the fourth refrigeration circuit module 14, and the fifth refrigeration circuit module 15 are fluidly connected to the second refrigeration circuit module 12 via a sixth refrigeration circuit module 16. The sixth refrigeration circuit module 16 comprises a plurality of flow paths for the refrigerant and serves as a distribution module or interface between the refrigeration circuit modules to distribute the refrigerant between the refrigeration circuit modules.

[0117] The flow paths in the sixth refrigeration circuit module 16 and in the second refrigeration circuit module 12 are described in more detail below with reference to Fig. 4 and the schematic circuit of Fig. 5. In Fig. 5, the refrigeration circuit modules 11, 13, 14 and 15 are each indicated by rectangles of dashed lines to show that the refrigeration circuit modules 11, 13, 14 and

[0118] 15 include not only a functional component of the refrigerant circuit but also flow paths and sensors.

[0119] In Fig. 4, the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16 are shown spaced apart from one another, similar to Fig. 3, although the components of the three-part refrigeration circuit modules 12 and 16 are not shown spaced apart from one another as in Fig. 3. For a simplified illustration, the first refrigeration circuit module 11, the third refrigeration circuit module 13, the fourth refrigeration circuit module 14, and the fifth refrigeration circuit module 15 have been omitted from Fig. 4.

[0120] In the exemplary embodiment shown in Fig. 4, the flow paths in the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16 are each aligned along the XY plane. Connections for connecting the refrigeration circuit modules are provided perpendicular to this, i.e., parallel to the Z axis.

[0121] As shown in Fig. 4, all connections of flow paths in the sixth refrigeration circuit module 16 are arranged in a plane parallel to the XY plane. The respective annular cross-sectional areas or end faces of these connections in the XY plane are the connecting surfaces of the sixth refrigeration circuit module.

[0122] 16 to the second refrigeration circuit module 12. The second refrigeration circuit module 12 has a corresponding connecting surface on the side facing the sixth refrigeration circuit module 16 and not visible. As shown in Fig. 7, a functional element 22 can be arranged between these connecting surfaces. This functional element serves, for example, to seal the connection between the connections and can also have a plurality of sensors, for example, for measuring temperature, pressure, and / or volume flow. The interfaces between the remaining refrigeration circuit modules 11 to 16 are designed in a similar manner.

[0123] The illustrated structure can enable a particularly compact design when connecting to other refrigeration circuit modules. The connections arranged on the opposite side of the sixth refrigeration circuit module 16, which are therefore not directly visible in Fig. 4, can also be arranged in a plane parallel to the XY plane, thus forming a connecting surface. All of these connections can preferably be connected directly to another refrigeration circuit module without the need for external lines, i.e., lines running outside the refrigeration circuit modules. Only one additional functional element 23 can be arranged there, as shown in Fig. 7.

[0124] To connect the connections or second refrigeration circuit modules, for example, clamps and / or tension elements such as screws or tie rods can be used, which exert a force on the refrigeration circuit modules. To seal the connections, sealing elements can be arranged between the refrigeration circuit modules. For example, a one-piece, flat, level sealing element (not shown) can be arranged between the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16, which has corresponding cutouts for the openings of the connections. The sealing element can also serve for thermal insulation between refrigeration circuit modules.

[0125] According to a preferred embodiment, the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16, in particular, can also be connected to one another by adhesive bonding. In this case, the adhesive can also advantageously serve as a sealant for sealing the connections between the connections. As shown in Fig. 4, the sixth refrigeration circuit module 16 has a cutout for the expansion tank 12d of the second refrigeration circuit module 12, which is curved further outward than the connections or parallel to the Z direction. The cutout in the sixth refrigeration circuit module 16 enables a particularly tight arrangement of the second refrigeration circuit module 12 next to or on the sixth refrigeration circuit module 16.

[0126] A reversing valve 12g and an expansion valve 12f are formed in a group 12h of connections and flow paths. A single reversing valve or multiple reversing valves can be arranged in the group 12h. The reversing valves serve, for example, to reverse the flow direction of the refrigerant and / or to switch between sub-circuits of the refrigerant circuit.

[0127] Reference symbol A indicates the connection where the high-pressure refrigerant from the compressor supply line (i.e., from the first refrigeration circuit module 11) enters the second refrigeration circuit module 12. Reference symbol B indicates the outlet of the second refrigeration circuit module, where the return line to the compressor or the first refrigeration circuit module 11 is connected.

[0128] Depending on the setting of the changeover valve 12g, the refrigerant can then flow to the connecting line with reference symbol C in the sixth refrigeration circuit module 16 in order to reach the condenser in the third refrigeration circuit module 13.

[0129] From the condenser in the third refrigeration circuit module 13, the refrigerant flows back into the sixth refrigeration circuit module 16 and further through flow path D to the first expansion valve 12f in the second refrigeration circuit module 12. From the first expansion valve 12f, the refrigerant flows via inlet E in the sixth refrigeration circuit module to the internal heat exchanger in the fifth refrigeration circuit module 15. The outlet of the internal heat exchanger in the fifth refrigeration circuit module 15 is connected to the connecting line F in the sixth refrigeration circuit module 16. The internal heat exchanger of the fifth refrigeration circuit module 15 serves, for example, to increase the overall efficiency of the system or to cool an inverter 9 for driving a compressor motor. The return line E to the internal heat exchanger and the flow line F from the internal heat exchanger are defined as the primary circuit of the internal heat exchanger.A return line K to the internal heat exchanger and a supply line J from the internal heat exchanger are defined as the secondary circuit of the internal heat exchanger. Return line K is connected to the switching valve 12g. Supply line J is connected to the return line B of the compressor 11.

[0130] As shown in Fig. 5, the flow path F is connected to the expansion tank 12d in the second refrigeration cycle module 12. The outlet of the expansion tank 12d is connected to the second expansion valve 12e, from where the refrigerant flows further via the ports G to the fourth refrigeration cycle module 14 with the evaporator. The flow path with the ports G can thus also be referred to as the evaporator return.

[0131] The outlet of the fourth refrigeration circuit module 14 is connected to flow path H in the sixth refrigeration circuit module 16. Flow path H can be referred to as the supply line of the evaporator, which supplies the refrigerant to the switching valve 12g in the second refrigeration circuit module 12. The evaporator is thus arranged between port G and flow path H in the sixth refrigeration circuit module 16, see also Fig. 3.

[0132] As shown in the schematic refrigeration circuit in Fig. 5, the refrigeration circuit device 10 comprises a plurality of sensors for measuring the temperature of the refrigerant and for measuring the pressure of the refrigerant. Furthermore, the refrigeration circuit device 10 can have sensors (not shown in Fig. 5) for measuring a volume flow of the refrigerant. The temperature sensors in the refrigerant circuit are marked with 0 in Fig. 5 and the pressure sensors are marked with p. In particular, a temperature sensor 0 is arranged in the return line E to the internal heat exchanger of the fifth refrigeration circuit module. Furthermore, a temperature sensor 0 is arranged in the return line G to the evaporator in the fourth refrigeration circuit module 14. In addition, a temperature sensor 0 is preferably arranged in the return line B to the compressor and in the flow line A from the compressor.A further temperature sensor 0 can be arranged in the flow of the external heating circuit 8, which absorbs heat from the refrigerant at the condenser of the third refrigeration circuit module 13.

[0133] In the present embodiment of Fig. 5, two pressure sensors p are arranged in the supply line A and the return line B of the compressor, respectively. Based on the measured values ​​of the pressure sensors p, a compression capacity of the compressor can be determined, for example. In particular, a control device 18 can evaluate the measured values ​​of the pressure sensors p and / or the temperature sensors 0 and control an operating state of the compressor or a drive motor 17 of the compressor and the two expansion valves 12e and 12f.

[0134] As shown in Fig. 5, the refrigeration cycle device 10 or the heat pump comprises a fan 20 that generates an air flow in which the fourth refrigeration cycle module 14 with the evaporator is arranged. The fan 20 can, for example, be arranged at an opening in a housing in which the refrigeration cycle device 10 is arranged.

[0135] The described embodiment of the refrigeration circuit device 10 according to the invention completely dispenses with refrigerant lines arranged outside the refrigeration circuit modules 11 to 16. In other words, all flow paths for the refrigerant are integrated into the refrigeration circuit modules 11 to 16. This makes it possible to realize a very compact refrigeration circuit device 10. The advantages of such a design include, for example, a particularly low risk of leaks, a particularly small amount of refrigerant, a particularly compact and space-saving design, particularly simple production, particularly easy installation, particularly low-maintenance operation, and particularly low noise generation. Fig. 7 shows a further development of the refrigeration circuit device 10 from Fig. 3. In addition to the previously described refrigeration circuit modules 11 to 16, this refrigeration circuit device 10 according to the invention has several functional elements 21, 22, 23.The first functional element 21 is arranged between the first refrigeration circuit module 11 and the second refrigeration circuit module 12. The second functional element 22 is arranged between the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16. The third functional element 23 is arranged between the sixth refrigeration circuit module 16 and the third, fourth, and fifth refrigeration circuit modules 13, 14, 15.

[0136] In Fig. 7, dashed lines are also drawn to illustrate where the refrigeration circuit modules are fluidly connected. Such a representation has been omitted for the connection between the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16.

[0137] Furthermore, the refrigeration circuit device 10 according to the invention comprises connecting means 30, 31, which are shown in Fig. 7. The connecting means 30, 31 serve to fasten the refrigeration circuit modules 11-16 and the functional elements 21-23 arranged therebetween to one another. In the present exemplary embodiment, the connecting means are implemented by two end plates 31 and four tie rods 30, whereby only two tie rods 30 are visible in the side view.

[0138] Unlike shown in Fig. 7, in particular the functional element 23 can consist of several parts, for example to enable a staggered arrangement of the refrigeration circuit modules 13, 14 and 15, or to better insulate the individual refrigeration circuit modules from each other, be it e.g. with regard to heat conduction or the transmission of vibrations.

[0139] Fig. 8 shows a schematic representation of the refrigeration circuit device 10 from Fig. 7, wherein the refrigeration circuit modules 11-16 and the functional elements 21-23 arranged therebetween are held together by the connecting means 30, 31. The representation in Fig. 8 as well as the representation of the functional elements 21-23 and connecting means 30, 31 in Fig. 7 is greatly simplified and serves merely to illustrate the basic structure of the refrigeration circuit device 10 and how the individual refrigeration circuit modules 11-16 are fastened to one another by the connecting means 30, 31.

[0140] In particular, the end plates 31 can have recesses and / or cutouts, for example, to establish flush contact with the surfaces of the refrigeration circuit modules 11-16 and the control device 18. In reality, the functional elements 21-23 can preferably be designed much thinner than shown in order to achieve a particularly compact design.

[0141] The features disclosed in the above description, the claims and the drawings may be important both individually and in any combination for the realization of the invention in its various forms.

Claims

PATENT CLAIMS 1. Refrigeration circuit device (10) for a heat pump, comprising: a first refrigeration circuit module (11) with a flat first connecting surface; a second refrigeration cycle module (12) with a flat second Connecting surface; a first functional element (21); a connecting means (30, 31); and a housing (40) surrounding the refrigeration cycle modules (11, 12) and the functional element (21), wherein: the first connecting surface is arranged parallel to the second connecting surface; the first functional element (21) is arranged between the first connecting surface and the second connecting surface; the connecting means (30, 31) exerts a force on the first refrigeration cycle module (11) and the second refrigeration cycle module (12) in order to clamp the first functional element (21) between the first refrigeration cycle module (11) and the second refrigeration cycle module (12); the housing (40) has an opening in which a fan (20) for sucking in ambient air is arranged; and an evaporator of the refrigeration cycle device (10) is arranged in an air flow generated by the fan (20).

2. The refrigeration circuit device (10) according to claim 1, further comprising: a third refrigeration circuit module (16) having a flat fourth connecting surface; and a second functional element (22), wherein: the second refrigeration circuit module (12) has a flat third connecting surface; the third and fourth connecting surfaces are each arranged parallel to the first and second connecting surfaces; the second functional element (22) is arranged between the third connecting surface and the fourth connecting surface; and the connecting means (30, 31) exerts a force on the second refrigeration circuit module (12) and the third refrigeration circuit module (16) in order to clamp the second functional element (22) between the second refrigeration circuit module (12) and the third refrigeration circuit module (16).

3. Refrigeration circuit device (10) according to claim 1 or 2, wherein the refrigeration circuit modules (11-16) and functional elements (21-23) configure at least part of a refrigerant circuit, and the refrigeration circuit modules (11-16) each comprise at least one of the following components: a compressor for compressing the refrigerant; a condenser for transferring heat from the refrigerant to a heating circuit medium of an external heating circuit; an expansion valve for expanding the refrigerant; an evaporator for transferring heat from an ambient medium to the refrigerant; a control device for controlling active components in the refrigerant circuit; a switching valve for switching between branches of the refrigerant circuit and / or for reversing a flow direction of the refrigerant; a refrigerant collector for collecting the refrigerant; a liquid separator; an internal heat exchanger; an economizer; a phase separator; a filter; an oil separator;a dryer; a sensor for measuring a temperature of the refrigerant; a sensor for measuring a pressure of the refrigerant; a sensor for measuring a volume flow of the refrigerant; an actuator for operating a valve; a coil for controlling a valve; a flow path for the refrigerant.

4. Refrigeration cycle device (10) according to claim 3, wherein one of the refrigeration cycle modules (11) comprises a compressor, wherein: a compression chamber of the compressor and flow paths for the refrigerant are formed in a monolithic body of the refrigeration cycle module (11) manufactured by primary forming and / or forming; movable components of the compressor are arranged in the monolithic body; and a drive unit (17) for driving the movable components of the compressor is arranged on an outer surface of the one refrigeration cycle module (11).

5. Refrigeration cycle device (10) according to claim 4, wherein the compressor is a reciprocating piston compressor, wherein: the movable components comprise a crankshaft (11k) and at least one piston (11f) connected to the crankshaft (11k) via a connecting rod (11h); the drive unit (17) drives the crankshaft (11k); a cylinder (11e) is formed as a compression chamber of the compressor in the monolithic body; and the piston (11f) is mounted in the cylinder (11e).

6. Refrigeration cycle device (10) according to claim 5, wherein: the reciprocating compressor has an even number of cylinders (Ile); the cylinders (Ile) are arranged in pairs along a common cylinder axis; and the pistons (llf) of a cylinder pair each have a phase shift of 180 degrees.

7. Refrigeration circuit device (10) according to claim 6, wherein: the reciprocating compressor has three pairs of cylinders, each arranged at an angle of 60 degrees to each other; and the cylinder axes of the three pairs of cylinders lie in a common plane.

8. Refrigeration cycle device (10) according to claim 6 or 7, wherein: the crankshaft (11k) is arranged between the cylinders (11e); and the pistons (11f) are driven by the crankshaft (11k) such that they move away from the crankshaft (11k) during compression.

9. Refrigeration circuit device (10) according to one of claims 6 to 8, wherein: the flow paths of the refrigeration circuit module (11) with the compressor comprise a supply channel (11a) and a return channel (11b); and / or the supply channel (11a) and the return channel (11b) are each annular; and / or the supply channel (11a) and the return channel (11b) are arranged parallel to one another; and / or an axis of symmetry of the supply channel (11a) and the return channel (11b) is arranged perpendicular to the cylinder axes of the compressor. Thermal insulation is arranged between the supply channel (11a) and the return channel (11b).

10. Refrigeration circuit device (10) according to one of claims 1 to 9, wherein the functional elements (21-23) each comprise at least one of the following components: a flow path for connecting flow paths of adjacent refrigeration circuit modules (11-16); a seal for sealing flow paths of adjacent refrigeration circuit modules (11-16); a vibration damper; an electrical contact for transmitting electrical signals between adjacent refrigeration circuit modules (11-16), between which the functional element (21-23) is arranged; electrical insulation; thermal insulation; a thermal contact for transferring heat between adjacent refrigeration cycle modules (11-16); a sensor for measuring a temperature of the refrigerant; a sensor for measuring a pressure of the refrigerant; a sensor for measuring a volume flow of the refrigerant; a safety high-pressure switch; an actuator for actuating a valve.

11. Refrigeration circuit device (10) according to one of claims 3 to 10, wherein: the refrigerant circuit comprises a warm sub-circuit with a compressor and a condenser and a cold sub-circuit with an expansion valve and an evaporator; and the warm sub-circuit is thermally separated from the cold sub-circuit by at least one functional element (21-23) with thermal insulation.

12. Refrigeration circuit device (10) according to one of claims 1 to 11, wherein: the connecting means comprises at least one tie rod (30); or the connecting means comprises at least two tie rods (30); or the connecting means comprises at least three tie rods (30); or the connecting means comprises exactly four tie rods (30).

13. A heat pump for heating and / or cooling a building, comprising: a refrigeration circuit device (10) according to one of claims 1 to 12.

14. Heat pump according to claim 13, wherein the heat pump is a monoblock heat pump.

15. Heat pump according to claim 13 or 14, wherein the heat pump has no more than two refrigerant-carrying lines arranged outside a refrigeration circuit module (11-16) or functional element (21-23).

16. Heat pump according to claim 15, wherein the two lines are each pipes or hoses connected to an evaporator and / or a condenser in the refrigerant circuit.

17. Heat pump according to one of claims 13 to 16, further comprising a Inverter (9) which is thermally coupled to an internal heat exchanger of the refrigeration circuit device (10) in order to cool the inverter (9).

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