Substrate support
EP4751136A1Pending Publication Date: 2026-06-03ASML NETHERLANDS BV
Patent Information
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- ASML NETHERLANDS BV
- Filing Date
- 2024-06-14
- Publication Date
- 2026-06-03
AI Technical Summary
Technical Problem
Existing substrate supports face challenges in securely holding warped substrates, requiring high flow and pressure which can lead to stress and damage on the substrates.
Method used
A substrate support system with a main body having a first side for supporting the substrate and a second side with a plurality of grooves, channels, and conduits, including check valves that control fluid flow to manage pressure and secure the substrate efficiently.
Benefits of technology
The system effectively secures substrates with minimal stress, reducing the amount of flow and pressure required, and is capable of handling substrates of different sizes and warpage efficiently.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure EP2024066514_30012025_PF_FP_ABST
Abstract
A substrate support (1) configured to support a substrate. The substrate support comprises a main body (10) having a first side configured to support the substrate, and a second side opposite to the first side. The second side is formed with a plurality of grooves. The plurality of grooves includes a plurality of channels (50) and a plurality of conduits (60). The plurality of channels comprises a first channel (51) and a second channel (52) substantially surrounding the first channel. The plurality of conduits includes at least one first conduit (61) and at least one second conduit (62). The first channel is in fluid communication with the at least one first conduit, and the at least one first conduit extends towards the periphery of the substrate support, and the second channel is in fluid communication with the at least one second conduit, and the at least one second conduit extends towards the periphery of the substrate support.
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