Contactless smart card with multiple communicating electronic modules

Abstract

Contactless smart card with multiple communicating electronic modules The invention relates to a portable communicating object (1) with contactless operation or mixed contact and contactless operation, comprising a body in which is integrated a main antenna (8) capable of receiving electrical energy by radio frequency from an external reader and communicating with it, and two electronic modules (2, 3) each provided with a dielectric substrate carrying at least one microelectronic chip connected to an antenna (12, 13) arranged on each module (2, 3) and inductively coupled with the main antenna (8) by means of a secondary antenna (7; 7a, 7b) also integrated in the body, characterized in that the two electronic modules (2, 3) are located in two neighboring cavities (4, 5) located on opposite faces of the body. Figure for abstract: figure 15

Description

Title of the invention: Contactless smart card with multiple communicating electronic modules

[0001] The invention relates to secure and communicating portable objects such as in particular chip identification cards or documents, provided with a first microelectronic module with contactless operation or with mixed contact and contactless operation, and a second electronic module or component such as a biometric sensor, possibly intended to communicate with the first module. The communicating portable object comprises an antenna integrated into the body of the portable object to communicate remotely with a radiofrequency reader.

[0002] By way of example and simplification of the description, the invention will be described in the context of its application to smart cards, without however limiting the scope of the invention to this form factor, the invention being applicable to other portable objects or to other form factors.

[0003] However, contactless chip cards produced in ISO 7816-2 format constitute the most widespread example of identification cards to which the invention applies. State of the art

[0004] Most known contactless smart cards or dual cards with mixed contact and contactless operation comprise a card body, a single electronic module inserted in a cavity of the card body and provided with a microelectronic chip, and an antenna arranged in the card body and electrically connected to output pads of the microelectronic chip of the single module.

[0005] Alternatively, there are smart cards whose card body antenna is a main antenna, which is inductively coupled with a radiofrequency smart card reader, connected with a secondary antenna itself in inductively coupled with the antenna located on the electronic module itself.

[0006] The main antenna of the card body generally consists of turns made using electrically conductive tracks, made on an insert or a flexible substrate which is integrated into the card body during assembly of the card.

[0007] In order to obtain adequate contactless communication performance, and in particular a sufficient operating range, the turns of the main antenna must be large, typically in the so-called ID1 format, which corresponds to the measurements of 85.60 x 53.98 mm for the card body. This format is commonly used in particular for bank cards.

[0008] In a number of applications, it becomes necessary to integrate into the card chip one or more electronic modules complementary to the main module, for example for the integration of biometric sensors capable of collecting biometric information from the user and transmitting it to the main electronic module for the purpose of biometric identification of the user of the smart card.

[0009] In this case, the state of the art consists of arranging the sensors and the main module on a PCB type substrate (acronym for "Printed Circuit Board" in English terminology) and interconnecting them by physical tracks in a thin metal layer, or of arranging the physical tracks directly in the form of a wire connection on a polymer substrate integrated into the structure of the card body. In the first case (PCB), the components such as the terminal block used to ensure the ISO 7816 contact connection and the biometric sensor are present on the PCB and the polymer layers are pre-drilled at the location accommodating the two components. In the second case of wired connections, more standard machining exposes the ends of the connection wires in order to interconnect the smart card and biometric modules. These arrangements have several drawbacks.

[0010] Indeed, the interconnection of several modules is expensive because it requires additional components and a modification of the conventional manufacturing processes for smart cards. The interconnection of electronic modules is also unreliable over time because the repeated bending that the product will have to undergo during its use risks breaking these interconnections more or less quickly. These disadvantages explain why the market for smart cards equipped with biometric sensors or a dCVV display is struggling to take off, particularly due to the difficulty in producing cards with multiple modules industrially and inexpensively.

[0011] Also known from document EP 2 098 981 A1 is a portable object comprising a first inductive antenna and a plurality of chips each comprising an integrated circuit and a second inductive antenna for the power supply and communication of said integrated circuit. Some of the chips are not intended to communicate with an external reader, but only with other chips of the portable object. This document therefore provides an architecture according to which the chips can communicate with each other independently without using the antenna provided for communicating with the outside, but by inductive coupling between them.

[0012] Document FR 2 727 227 A1 describes an active memory security device intended for the protection of secret information contained in the memory. In order to prevent access to the secret information by external exploration means, this device provides that the secret information is distributed between two circuits, and the connection between the two circuits is made by various means of communication, including an opto-electronic link, arranged in such a way that the slightest per Disruption of the relative arrangement of the circuits leads to a break in the connection between the circuits. Purpose of the invention

[0013] The general aim of the invention is consequently to propose a new structure for a portable communicating object, in particular a smart card or equivalent, which is free from the above drawbacks, and in particular a structure making it possible to optimize the integration of several electronic modules in a smart card without the addition of peripheral components other than an antenna arranged in the card body.

[0014] Another aim of the invention is to allow the use, for the integration of the electronic modules, of an already existing and well-controlled manufacturing process, namely the simple transfer of the electronic modules into cavities provided in the card body. Summary of the invention

[0015] In principle, the solution according to the invention consists of making a cavity in the card body for each electronic module to be integrated, and ensuring that these cavities are located on opposite faces of the card at a judiciously chosen location, for example that defined by the ISO 7816-2 standard. The electronic modules can be of standard size, namely 13 mm by 11.8 mm or 11 mm by 8.3 mm. The electronic modules are generally inserted into cavities machined in the card body and having a first zone machined to a depth PI receiving the substrate of the module, and a second zone machined to a depth P2 greater than PI and receiving the microelectronic component of the module protected or not by a drop of protective resin. When two modules must be arranged on the card body, several cases may arise.

[0016] Depending on the size of the modules used, and consequently on the size and depth of the cavities required in the card body, the two cavities of depth PI, or the two cavities of depth P2, may be disjoint, or else have an intersection zone, i.e. at least one superposition zone in the main plane of the portable object. Several cases may then arise.

[0017] When the two cavities of depth PI or P2 are completely separate, it is not possible to have metal reinforcements there which would allow a capacitive communication channel to be established between the two modules. On the other hand, it is possible to establish optical communication between the modules by means of a waveguide integrated into the card body and extending between the two electronic modules or to establish radiofrequency communication between the two modules.

[0018] When only the two cavities of depth PI have at least one zone of superposition in the main plane of the portable object and the two P2 cavities are completely separate, it is possible to place metal reinforcements there to establish a capacitive communication channel between the two electronic modules, but it is not possible to establish a direct optical communication channel from module to module, unless using a waveguide integrated into the card body or using the intrinsic optical properties of the laminated layers (sufficiently translucent) and the proximity between the two modules. Furthermore, it is possible in this case to connect the two modules by a galvanic connection in this superposition zone provided that one or more wells receiving a conductive element are first created.

[0019] When the two cavities of depth P2 have an intersection zone, it is possible to establish a direct optical communication channel between the two modules, without the need for a waveguide or light propagation through the materials located between the two modules.

[0020] The two electronic modules may have their own secondary antenna or concentrator coupled with the main antenna of the card body, but it is also possible to share a concentrator antenna between the two electronic modules.

[0021] The invention therefore relates to a portable communicating object with contactless operation or with mixed contact and contactless operation, comprising a body in which is integrated a main antenna capable of receiving electrical energy by radio frequency from an external reader and of communicating with it, and at least two electronic modules each provided with a dielectric substrate carrying a microelectronic chip connected to an antenna arranged on each module and inductively coupled with the main antenna of the body by means of a secondary antenna acting as a concentrator and also integrated into the body, characterized in that the two electronic modules are located in two neighboring cavities located on opposite faces of the body of the portable object.

[0022] According to one embodiment of the invention, said cavities adjacent to the body have a superposition zone in the main plane of the portable object, and this superposition zone may be total or only partial.

[0023] According to one embodiment, one of the electronic modules is a main module capable of carrying out a data exchange with the external reader, and another electronic module is a secondary module provided with a biometric sensor or a display screen.

[0024] According to one embodiment, the main module is visible on a first face of the portable object and the secondary module is visible on the face opposite the first face of the communicating portable object.

[0025] According to one embodiment, each cavity comprises a first zone of depth PI intended to receive the substrate of an electronic module and a second zone of depth P2 greater than PI intended to receive at least one microelectronic component arranged on said substrate, and the two zones of depth PI are neighbors without an overlapping zone in the main plane of the object.

[0026] According to another embodiment, each cavity comprises a first zone of depth PI intended to receive the substrate of an electronic module and a second zone of depth P2 greater than PI intended to receive at least one microelectronic component arranged on said substrate, and the two zones of depth PI have at least one superposition zone in the main plane of the object.

[0027] According to a first embodiment variant, each cavity of the body comprises a first zone of depth PI intended to receive the dielectric substrate of a first electronic module and a second zone of depth P2 greater than PI intended to receive a second electronic module or a microelectronic component, and the two zones of depth P2 are neighboring but disjoint. In this case, the two electronic modules may comprise electrically conductive areas intended to form the armatures of a capacitor once placed opposite each other, so as to establish a capacitive communication channel between the two electronic modules.

[0028] According to another embodiment variant, each cavity of the body comprises a first zone of depth PI intended to receive the dielectric substrate of a first electronic module and a second zone of depth P2 greater than PI intended to receive a second electronic module or a microelectronic component, and the two zones of depth P2 are neighboring but this time comprise an intersection zone, so that the two cavities have a common cavity portion. In this case, the two electronic modules advantageously comprise at least one optoelectronic component so as to establish a direct optical communication channel between the two electronic modules via the common cavity portion. In addition, each electronic module may comprise a drop of resin for coating its electronic component, made of an optically transparent material.

[0029] According to one embodiment, said optical communication channel is produced via a waveguide.

[0030] According to one embodiment, said waveguide is produced either directly via the substrate of the main antenna, or by a complex carrying the antenna substrate and protective layers, or by non-opaque layers having a light transmission rate sufficient to allow optical communication.

[0031] According to one embodiment, said optical communication is carried out using the intrinsic optical properties of the materials constituting the object.

[0032] The portable communicating object according to the invention may comprise a secondary antenna acting as a flux concentrator between the main antenna of the body and the antenna of each module. This concentrator antenna may be configured in various ways. According to one embodiment, said secondary antenna is arranged in the form of a single concentrator whose turns are arranged around the overall area occupied by the set of two electronic modules and are inductively coupled with the antenna of each of the modules. According to another embodiment, said secondary antenna is arranged in the form of two separate concentrators, the turns of each concentrator being arranged only around a dedicated electronic module and being inductively coupled mainly with the antenna of this electronic module.

[0033] The invention provides that the two electronic modules can be arranged to transmit data from one to the other.

[0034] Depending on the respective positioning of the cavities receiving the two electronic modules, these can communicate by an optical, galvanic, capacitive, or inductive connection. The two electronic modules could also be arranged to include an acoustic means of communication.

[0035] Alternatively, the two electronic modules can be arranged to communicate with the external reader, without communicating with each other.

[0036] According to one embodiment, the two electronic modules are thin enough to be arranged in cavities of the body facing each other with a zone of total superposition of the cavities P1 and P2.

[0037] According to one embodiment, the communicating portable object is in the form of a smart card, and the electronic module of each face is arranged in an area of this face corresponding to the position defined by the ISO 7816-2 standard.

[0038] Other characteristics and advantages of the invention will appear on reading the detailed description given in the application of the invention to a smart card, and the appended drawings in which: - [Fig.l] represents a plan view of a first embodiment of a smart card according to the invention, showing a superposition zone of the cavities PI and an intersection zone of the cavities P2 arranged on each face of the smart card; - [Fig.2] represents the smart card of [Fig.l], in three-dimensional perspective; - [Fig. 3] represents a plan view of a second embodiment of a smart card according to the invention, in which the cavities of the card body are adjacent but without an overlapping zone in the main plane of the smart card in their zones PI and P2; [Fig.4] represents the smart card of [Fig.3], in three-dimensional perspective; [Fig.5] shows a plan view of an alternative embodiment, in which two small electronic modules are used without an overlapping area of the cavities of depth PI and P2, each module being surrounded by its own concentrator. [Fig.6] represents an equivalent electrical diagram of an embodiment of the smart card of [Fig.l], with a capacitive connection between the two electronic modules of the smart card, and a single concentrator antenna; [Fig.7] represents an equivalent electrical diagram of an embodiment of the smart card of [Fig.l], with a galvanic connection between the two electronic modules of the smart card, and a single concentrator antenna; [Fig. 8] represents an equivalent electrical diagram of an embodiment of the smart card of [Fig. 1], with an optical link between the two electronic modules of the smart card, and a single concentrator antenna; [Fig. 9] represents a variant of the electrical diagram of [Fig. 5], with two concentrator antennas and an indirect optical link between the two electronic modules of the smart card, and two concentrator antennas; [Fig. 10] represents an equivalent electrical diagram of an embodiment of the smart card of [Fig. 1], in which the two electronic modules of the smart card cannot communicate with each other; [Fig. 1 1] represents a variant of the electrical diagram of [Fig. 10], with two concentrator antennas, in accordance with the embodiment of [Fig. 5]; [Fig. 12] shows a plan view of an electronic module provided with a microelectronic chip, a module antenna, and metal cabinets; Figures 13A and 13B respectively represent a plan view and a sectional view partially superimposing two electronic modules according to [Fig. 12] and showing their respective metal cupboards, the corresponding electrical diagram being that of [Fig. 6]; [Fig. 14] represents a sectional view partially superimposing two electronic modules and showing their respective metal cabinets connected by a galvanic connection, the corresponding electrical diagram being that of [Fig.7]; [Fig. 15] shows a sectional view of a smart card according to the invention with a direct optical connection or an inductive connection between the two modules of the smart card; - [Fig. 16] represents a sectional view of a smart card according to the invention without any communication between the two modules of the smart card corresponding to the equivalent diagram of [Fig.l 1]; - [Fig. 17] represents a sectional view of a smart card according to the invention with two modules communicating with each other via an optical link using a waveguide produced by the antenna substrate of the card body or an inductive link; - [Fig.18] represents a sectional view of a smart card according to the invention with two thin electronic modules superimposed face to face in fully superimposed cavities PI and P2. Detailed description

[0039] Figures 1 and 2 respectively show a plan view and a perspective view of a first embodiment of a smart card 1 according to the invention. It comprises two large electronic modules 2, 3, in the so-called “dual 8” format, each inserted into a cavity 4, 5 made on opposite faces of the smart card, at a position on each face defined by the ISO 7816-2 standard. Consequently, the two cavities 4, 5 have a superposition zone 6 in their shallowest areas, of depth noted PI, and an intersection zone 6' in their deepest areas, of depth noted P2. The modules 2, 3 are therefore partially opposite each other. Since the depth P2 areas of the two cavities have an intersection zone 6', it is not possible to use a dedicated concentrator for each module.The two modules 2, 3 are therefore surrounded by a single concentrator antenna 7, connected to a main antenna 8 of the card body, of large size, typically in the so-called “ID1” format, which allows radiofrequency communication with an external reader.

[0040] If the cavities P2 are sufficiently deep, they will have an intersection zone which will make it possible to provide the modules 2, 3 with an optical interface for direct optical communication between the 2 modules, as will be explained in more detail with reference to figures 8 and 15.

[0041] Figures 3 and 4 are similar to Figures 1 and 2, except that the modules 2, 3 used are smaller in size, in particular in the so-called “dual 6” format. Consequently, the cavities 4, 5 of the two modules 2, 3, seen in plan, are simply juxtaposed, without presenting an intersection zone, neither in their depth zone PI (denoted cavity PI), nor in that of depth P2 (denoted cavity P2). A single concentrator 7 is shared between the two electronic modules 2, 3.

[0042] [Fig. 5] shows a plan view of an embodiment similar to figures 1 and 3, using two small format modules 2, 3, placed in cavities whose zones of shallower depth PI are separated by a small space 9. In this case the cavities of depth P2 are also separated by a space of greater size than the small space 9, it is therefore possible to use a dedicated concentrator 7a, 7b for each module 2, 3, respectively surrounding each module, each of the concentrators 7a, 7b being inductively coupled with the antenna (not shown) of one of the modules 2, 3.

[0043] [Fig. 6] represents an equivalent electrical diagram of an embodiment of the smart card of [Fig. 1]. Communication between the two electronic modules 2, 3 is via a capacitive connection 10 between metal armatures arranged on each module. The booster antenna 11 of the smart card has a single concentrator antenna 7. Each of the electronic modules 2, 3 has its own antenna 12, 13 inductively coupled with the concentrator 7. In the example shown, the electronic module 2 can be a biometric module connected to a sensor or a display 14, and the electronic module 3 can be a conventional smart card security module.

[0044] [Fig.7] represents an equivalent electrical diagram similar to that of [Fig.6], except that the capacitive connection 10 between the electronic modules 2, 3, is replaced by a galvanic connection 15.

[0045] [Fig.8] represents an equivalent electrical diagram of an embodiment of the smart card 1 of [Fig.l], with an optical link 16 between the two electronic modules 2, 3 of the smart card, and a single concentrator antenna 7.

[0046] Each module 2, 3 comprises a microcontroller and an optical communication stage comprising an emission LED 17 and a reception photodiode 18. The two modules 2, 3 are arranged in the smart card 1 so that the respective optical stages 17, 18 are preferably opposite each other to define an optical path between the two modules. In particular, the optical wave, for example the light emitted by the emission LED 17 of one module, must be able to be captured by the photodiode 18 of the other module. The optical communication is carried out by any appropriate protocol, for example according to the so-called LIFI protocol, and at any appropriate wavelength, for example in the visible light spectrum, but not necessarily.

[0047] [Fig.9] represents an equivalent electrical diagram similar to that of [Fig.8], except that the booster antenna 11 of the smart card 1 comprises two concentrators, namely a respective concentrator 7a, 7b dedicated to each of the electronic modules 2, 3.

[0048] In [Fig. 10], the two electronic modules, 2, 3, for example a biometric module and a security module, are not connected to each other, but each can communicate with a remote reader (not shown) via its module antenna 12, 13, and the booster antenna 11 provided with a single concentrator 7.

[0049] [Fig. 11] is similar to [Fig. 10], except that the booster antenna 11 of the smart card 1 comprises two concentrators 7a, 7b, respectively dedicated to the electronic modules 2, 3.

[0050] [Fig. 12] represents a single module 2, 3 with a drop of encapsulation resin 19 for its microelectronic chip (not shown) and its antenna 12, 13, as well as metallized zones 20 capable of forming capacitance plates. The interconnections between the chip, the antenna and the metal panels are not shown.

[0051] [Fig.13A] shows in plan view two electronic modules 2, 3 according to [Fig.12], superimposed and arranged with a partial overlap zone 21 corresponding to the superposition zone of the PI cavities in the main plane. The metal armatures 20 of the two modules 2, 3 are then opposite each other to establish a capacitive connection between the two modules 2, 3, in accordance with the equivalent electrical diagram of [Fig.6].

[0052] [Fig. 13B] represents a cross-sectional view AA of the smart card 1 showing the stack of modules 2, 3 of [Fig. 13A]. Each module 2, 3 is placed in a cavity comprising a zone PI receiving the substrate of the module and a deeper zone P2 receiving the encapsulation drop 19 of the module. As can be seen, the two cavities P2 are separate, and the two cavities PI have a partial overlap zone, in which facing metal armatures 20 are placed forming a capacitor to establish a capacitive connection between the two modules 2, 3.

[0053] [Fig. 14] represents an embodiment similar to that of [Fig. 13B], except that the metal cupboards 20 are connected by a galvanic connection 22 arranged in a well 23 connecting the areas of the PI cavities which are overlapping. This embodiment corresponds to the equivalent electrical diagram of [Fig. 7].

[0054] [Fig. 15] is a cross-sectional diagram of a smart card 1 according to the invention, with 2 cavities whose zones P2 have a common part 21. One of the modules 2, 3 may be a dCVV display or a biometric module, the other module preferably being a security module like those well known in the field of banking smart cards. The modules 2, 3 each have a chip protected by a drop of optically transparent encapsulating resin 19, so as to be able to establish a direct optical connection 16 between the two modules, in accordance with the electrical diagram of [Fig. 8].

[0055] [Fig. 16] shows a sectional view of an embodiment in which neither the P1 cavities nor the P2 cavities of the two modules 2, 3 have an overlapping zone, so that optical communication is in principle not possible. This embodiment corresponds to the equivalent electrical diagram of [Fig. 11]. The two modules 2, 3 do not communicate with each other, but each can communicate with a remote reader (not shown) via its dedicated hub 7a, 7b and the main antenna 8. Despite the separation of the cavities, in the case where the main polymer material composing the card 1 would have a sufficiently low opacity and the modules 2, 3 would be sufficiently close, an optical communication could operate and would correspond to the electrical diagram of [Fig.9].

[0056] [Fig. 17] represents a sectional view of an embodiment similar to that of [Fig. 16], except that the card body comprises in its thickness an optically transparent waveguide 24, and the encapsulation drops 19 of the chips are also optically transparent, allowing the two modules 2, 3 to communicate via an optical link, in accordance with the equivalent electrical diagram of [Fig. 9],

[0057] The waveguide 24 can be produced in several ways: either via the antenna substrate directly, or by a complex including the antenna substrate and protective layers, or by non-opaque layers, i.e. having a light transmission rate sufficient to allow optical communication, located inside the object or the smart card 1.

[0058] [Fig. 18] shows a sectional view of an additional embodiment variant, using two electronic modules 2, 3 sufficiently thin to be able to be completely superimposed facing each other. In this case, the cavities PI are facing each other, and the cavities P2 open into each other and are completely superimposed in plan view. Galvanic, optical, capacitive and inductive connection modes between the modules are possible. Advantages of the invention

[0059] Ultimately, the invention allows a portable communicating object, in particular a smart card or an electronic passport, to achieve the intended goals.

[0060] In particular, the specific placement of the electronic modules and the cavities of the card body adjacently or in partial or total overlap eliminates the need for a PCB printed circuit, which contributes to reducing the manufacturing cost of the smart card and increasing the manufacturing yield. In addition, the structure of the smart card according to the invention is compatible with conventional low-cost and high-yield manufacturing methods, consisting of integrating electronic modules into surface cavities of the card body.

[0061] The proposed technology makes it possible to easily integrate and communicate several electronic modules of different types in a smart card or in an equivalent communicating device, without requiring wired connections between the modules, which means that the devices will be particularly resistant to reliability tests and will have a longer lifespan. This simplification of the method of manufacturing complex cards will make it easier to deploy these tech- nologies in the market.

[0062] Communication between the electronic modules, whether optical or not, is also facilitated and secured, so that the proposed solution is particularly secure and difficult to defeat by a potential fraudster.

Claims

Claims

1. A portable communicating object (1) with contactless operation or mixed contact and contactless operation, comprising a body in which is integrated a main antenna (8) capable of receiving electrical energy by radio frequency from an external reader and communicating with it, and two electronic modules (2, 3) each provided with a dielectric substrate carrying at least one microelectronic chip connected to an antenna (12, 13) arranged on each module (2, 3) and inductively coupled with the main antenna (8) by means of a secondary antenna (7; 7a, 7b) also integrated in the body and acting as a concentrator for carrying out the inductive coupling with the antenna (12, 13) of each electronic module (2, 3), the two electronic modules (2, 3) being located in two neighboring cavities (4, 5) located on opposite faces of the body, characterized in that said secondary antenna (7;7a, 7b) is arranged in the form of a single concentrator (7) whose turns are arranged around the overall area occupied by cavities receiving the two electronic modules (2, 3).;

2. A portable communicating object (1) with contactless operation or mixed contact and contactless operation, comprising a body in which is integrated a main antenna (8) capable of receiving electrical energy by radio frequency from an external reader and communicating with it, and two electronic modules (2, 3) each provided with a dielectric substrate carrying at least one microelectronic chip connected to an antenna (12, 13) arranged on each module (2, 3) and inductively coupled with the main antenna (8) by means of a secondary antenna (7; 7a, 7b) also integrated in the body and acting as a concentrator for carrying out the inductive coupling with the antenna (12, 13) of each electronic module (2, 3), the two electronic modules (2, 3) being located in two neighboring cavities (4, 5) located on opposite faces of the body, characterized in that said secondary antenna (7;7a, 7b) is arranged in the form of two separate concentrators (7a, 7b), the turns of each concentrator (7a, 7b) dedicated to an electronic module (2, 3) being arranged only around the area occupied by a cavity receiving each electronic module (2, 3).;

3. Portable communicating object (1) according to claim 1 or claim 2, characterized in that the turns of the single concentrator (7) or of the two separate concentrators (7a, 7b) are inductively coupled tively with the antenna (12, 13) of each of said electronic modules (2, 3).

4. Communicating portable object (1) according to one of the preceding claims, characterized in that said neighboring cavities (4, 5) have a partial or total overlapping zone in the main plane of the portable object (1).

5. Portable communicating object (1) according to one of the preceding claims, characterized in that one of the electronic modules (2) is a main module capable of carrying out a data exchange with an external reader, and in that the other electronic module (3) is a secondary module provided with a biometric sensor or a display screen.

6. Portable communicating object (1) according to claim 5, characterized in that the main module (2) is visible on a first face of the portable communicating object (1) and in that the secondary module (3) is visible on the face opposite the first face of the portable communicating object (1).

7. Portable communicating object (1) according to one of claims 5 or 6, in which each cavity (4, 5) comprises a first zone of depth PI intended to receive the substrate of an electronic module (2, 3) and a second zone of depth P2 greater than PI intended to receive at least one microelectronic component arranged on said substrate, characterized in that the two zones of depth PI are neighbors without a superposition zone in the main plane of the object.

8. Portable communicating object (1) according to claims 5 or 6, in which each cavity (4, 5) comprises a first zone of depth PI intended to receive the substrate of an electronic module (2, 3) and a second zone of depth P2 greater than PI intended to receive at least one microelectronic component arranged on said substrate, characterized in that the two zones of depth PI have at least one superposition zone in the main plane of the object.

9. Portable communicating object (1) according to one of the preceding claims, in which each cavity (4, 5) comprises a first zone of depth PI intended to receive the substrate of an electronic module (2, 3) and a second zone of depth P2 greater than PI intended to receive at least one microelectronic component arranged on said substrate, characterized in that the two zones of depth P2 are neighboring but disjoint.

10. Portable communicating object (1) according to one of claims 1 to 9, in which each cavity (4, 5) comprises a first zone of depth PI intended to receive the substrate of an electronic module and a second zone of depth P2 greater than PI intended to receive at least one microelectronic component arranged on said substrate, characterized in that the two zones of depth P2 are neighboring and comprise an intersection zone (6), so that the two cavities (4, 5) have a common cavity portion.

11. Portable communicating object (1) according to claim 10, characterized in that the two electronic modules (2, 3) comprise at least one optoelectronic component (17, 18) so as to establish a direct optical communication channel (16) between the two electronic modules (2, 3) via said common cavity portion.

12. Portable communicating object (1) according to one of claims 1 to 11, characterized in that the two electronic modules (2, 3) comprise at least one optoelectronic component (17, 18) so as to establish an optical communication channel between the two electronic modules (2, 3), said optical communication being carried out via a waveguide (24).

13. Portable communicating object (1) according to claim 12, characterized in that said waveguide is produced either directly via the substrate of the main antenna (8), or by a complex carrying the antenna substrate and protective layers, or by non-opaque layers having a light transmission rate sufficient to allow optical communication.

14. Portable communicating object (1) according to one of claims 1 to 11, characterized in that the two electronic modules (2, 3) comprise at least one optoelectronic component (17, 18) so as to establish an optical communication channel between the two electronic modules (2, 3), said optical communication being carried out using the intrinsic optical properties of the materials constituting the object.

15. Portable communicating object (1) according to one of claims 11 to 14, characterized in that each electronic module (2, 3) comprises a drop of coating resin (19) of its microelectronic component made of an optically transparent material.

16. Portable communicating object according to one of claims 1 to 10, characterized in that the two electronic modules (2, 3) comprise electrically conductive pads (20) intended to form the armatures of a capacitor once placed opposite each other, so as to establish a capacitive communication channel between the two electronic modules (2, 3).

17. Portable communicating object (1) according to one of claims 1 to 10, characterized in that the antennas (12, 13) of the two electronic modules (2, 3) are configured to allow communication by means of inductive coupling.

18. Portable communicating object (1) according to one of claims 1 to 10, characterized in that the two electronic modules (2, 3) comprise an acoustic communication means.

19. Communicating portable object (1) according to any one of the preceding claims, characterized in that the two electronic modules are arranged to transmit data from one to the other.

20. Communicating portable object (1) according to any one of claims 1 to 18, characterized in that the two electronic modules (2, 3) are arranged to communicate with an external reader, without communicating with each other.

21. Portable communicating object (1) according to any one of the preceding claims, characterized in that the two electronic modules are sufficiently thin to be arranged in cavities of the body facing each other with a total overlapping zone of the cavities PI and P2.

22. Portable communicating object (1) according to any one of the preceding claims, characterized in that it is in the form of a smart card.

23. Portable communicating object (1) according to claim 22, characterized in that at least one of the two electronic modules (2, 3) is arranged in an area corresponding to the position defined by the ISO 7816-2 standard.

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