Thinning process

Abstract

Thinning Method The present description relates to a method for thinning a first layer (10) of a piezoelectric material comprising: a. implanting ions into the first layer (10) so as to amorphize an upper portion (10a) of the first layer (10), and b. removing the upper portion (10a) by a chemical-mechanical polishing step. Figure for abstract: Fig. 1C

Description

Title of the invention: Thinning method Technical field

[0001] The present description relates generally to electronic devices and their manufacturing methods. More particularly, the present description relates to electronic devices comprising piezoelectric layers and their manufacturing methods. Prior art

[0002] There are known methods of manufacturing a device comprising a thin layer of a piezoelectric material on a substrate. For example, document WO 2019 / 002080 teaches a so-called Smart Cut™ method of transferring a thin layer from a support onto a substrate.

[0003] The so-called Smart Cut™ method, as well as other methods of manufacturing a device comprising a layer of a piezoelectric material on a substrate, comprise a step of thinning by grinding the layer of piezoelectric material. This grinding step results in surface defects on the layer of piezoelectric material. Summary of the invention

[0004] One embodiment provides a method of thinning a first layer of a piezoelectric material comprising: a. implanting ions into the first layer so as to amorphize an upper portion of the first layer, and b. removing the upper portion by a chemical mechanical polishing step.

[0005] According to one embodiment, the first layer is in a material among LiNbO3, LiTaO3, quartz, langasite, langatate, KNbO3, K(Ta, Nb)O3, SrTiO3 or Pb(Zr, Ti)O3.

[0006] According to one embodiment, the ions comprise hydrogen and / or helium and / or oxygen ions.

[0007] According to one embodiment, the first layer is located on a substrate.

[0008] According to one embodiment, the first layer is obtained by a step of grinding.

[0009] According to one embodiment, the method comprises an annealing step between steps a. and b.

[0010] According to one embodiment, the characteristics of step a. are such that the rate of removal of the upper part of the first layer by polishing is at least 10% faster than the rate of removal of a lower part which has not received ions from the first layer by polishing.

[0011] According to one embodiment, the lower part has a thickness of less than 10 μm.

[0012] According to one embodiment, the lower part has a thickness of less than 1 μm.

[0013] According to one embodiment, the method comprises several distinct steps ion implantation.

[0014] Another embodiment provides a method of manufacturing a surface acoustic wave filter comprising: forming a first layer of a piezoelectric material on a substrate; thinning the first layer by a method as described above; forming electrodes having interdigitated comb shapes on the first layer.

[0015] Another embodiment provides a method of manufacturing a bulk acoustic wave filter comprising: forming a second layer on a substrate; forming a first conductive or semiconductive region in the second layer; forming a first layer on the second layer; thinning the first layer by a method as described above; forming a cavity passing through the first layer so as to reach the first conductive or semiconductive region; forming a second conductive region on the first layer.

[0016] According to one embodiment, the second layer is a Bragg mirror.

[0017] According to one embodiment, the method comprises forming a cavity comprising a gaseous element between a portion of the first region and the second layer.

[0018] According to one embodiment, the filter is adapted to radio frequencies. Brief description of the drawings

[0019] These characteristics and advantages, as well as others, will be explained in detail in the following description of particular embodiments given without limitation in relation to the attached figures among which:

[0020] [Fig.1A] represents a step of a thinning process;

[0021] [Fig.lB] represents another step of the method of [Fig.lA];

[0022] [Fig.lC] represents another step of the method of [Fig.lA];

[0023] [Fig.2] represents a step of another thinning process;

[0024] [Fig.3] represents a filter comprising a piezoelectric layer;

[0025] [Fig.4] represents a filter comprising a piezoelectric layer; and

[0026] [Fig.5] represents a filter comprising a piezoelectric layer. Description of the embodiments

[0027] The same elements have been designated by the same references in the different figures. In particular, the structural and / or functional elements common to the different embodiments may have the same references and may have identical structural, dimensional and material properties.

[0028] For the sake of clarity, only the steps and elements useful for understanding the embodiments described have been represented and are detailed.

[0029] Unless otherwise specified, when referring to two elements connected to each other, this means directly connected without intermediate elements other than conductors, and when referring to two elements connected (in English "coupled") to each other, this means that these two elements can be connected or be connected by means of one or more other elements.

[0030] In the following description, when reference is made to absolute position qualifiers, such as the terms "front", "back", "top", "bottom", "left", "right", etc., or relative position qualifiers, such as the terms "above", "below", "upper", "lower", etc., or to orientation qualifiers, such as the terms "horizontal", "vertical", etc., reference is made unless otherwise specified to the orientation of the figures.

[0031] Unless otherwise specified, the expressions "about", "approximately", "substantially", and "of the order of" mean to within 10%, preferably to within 5%.

[0032] A piezoelectric material is defined as a material having the property of becoming electrically polarized under the action of a mechanical stress and conversely of deforming when an electric field is applied to it. One category of piezoelectric material corresponds to ferroelectric materials, i.e. materials having an electrical polarization in their natural state, a polarization which can be reversed by the application of an external electric field. Another category of piezoelectric material corresponds to pyroelectric materials, i.e. materials in which a variation in electrical polarization can be generated by a change in the temperature of the material.

[0033] Figures 1A, 1B and 1C represent steps, preferably successive, of a method for thinning a layer of a piezoelectric material. The method of Figures 1A, 1B, 1C makes it possible, for example, to obtain a so-called thin layer of a piezoelectric material. The desired thin layer is preferably planar, that is to say having upper and lower faces, opposite one another, parallel and planar.

[0034] [Fig.1A] represents a step of a thinning process.

[0035] During this step, a layer 10 of a piezoelectric material is fixed on a support 12.

[0036] The support 12 is for example a semiconductor substrate, for example made of silicon (Si), silicon carbide (SiC) or diamond. For example, the support 12 corresponds to the manipulator substrate, also called handle substrate, or base, of the thinning process.

[0037] Alternatively, the support 12 may comprise several materials, for example several layers of different materials. The support 12 corresponds for example to the substrate of a chip on which a filter can be formed.

[0038] The layer 10 is made of a piezoelectric material, preferably a monocrystalline piezoelectric material. The layer 10 is for example made of a ferroelectric material or a pyroelectric material. For example, the layer 10 is made of LiNbO3, LiTaO3, quartz, langasite, langatate, KNbO3, K(Ta, Nb)O3, SrTiO3 or Pb(Zr, Ti)O3.

[0039] The layer 10 corresponds for example to a solid block of piezoelectric material. The layer 10 is for example obtained from an ingot of piezoelectric material having been cut and thinned so as to obtain said solid block.

[0040] The layer 10 is fixed to the support 12. The layer is for example fixed by molecular adhesion. The layer 10 is for example fixed to the support 12 by a fixing layer 14, or bonding layer 14. The layer 14 is for example made of a dielectric material, for example silicon oxide (SiO2), silicon nitride (SiN), Al2 O3 or HfO2, a polymer or a metal, for example gold, tungsten, platinum or titanium.

[0041] In other words, the support 12 comprises an upper face, that is to say the face closest to the layer 10, covered by the fixing layer 14, more precisely by a lower face of the fixing layer 14. The fixing layer 14 is covered by the layer 10. More precisely, the upper face of the fixing layer 14 is covered by a lower face of the layer 10.

[0042] The thickness of the support 12 is for example between 50 μm and 2000 mm, for example substantially equal to 100 μm, 150 μm or 200 μm.

[0043] The thickness of the layer 10 is greater than the desired thickness after the application of the thinning process. The layer 10 has for example a thickness of between 5 and 2000 μm.

[0044] [Fig.lB] represents another step of the method of [Fig.lA].

[0045] The step of [Fig. 1B] corresponds to a first thinning step. This thinning step removes, for example, a significant portion of the thickness of the layer 10, for example at least half of the layer 10. It is preferably a grinding step.

[0046] The step of [Fig.1B], i.e. the grinding step, causes defects to form on the upper face of the layer 10, i.e. on the ground face. Said surface defects correspond, for example, to a lack of uniformity in the thickness of the layer 10, for example to cracks in the layer 10. Thus, certain regions of the layer 10 after grinding comprise unwanted cavities on the upper face. Furthermore, the grinding step may have caused degradation of the electrical characteristics of the layer 10 on the upper face.

[0047] The thickness of the layer 10 after the grinding step is greater than the thickness desired after the application of the thinning process. More precisely, the grinding step is such that the thickness of the layer 10 after grinding is greater than the sum of the desired thickness after the application of the thinning process and the maximum thickness of the defects generated by grinding. For example, the thickness of the layer 10 after the step of [Fig.lB] is between 15 pm and 50 pm.

[0048] [Fig.lC] represents another step of the method of [Fig.lA].

[0049] During this step, an upper part 10a is formed in the layer 10. The Part 10a extends from the upper face of layer 10. Part 10a extends towards the lower face of layer 10. Part 10a corresponds to the entire upper part of layer 10.

[0050] The layer 10 further has a lower portion 10b. The portion 10b corresponds to the entire portion of the layer 10 extending between the portion 10a and the support 12. Thus, the layer 10 corresponds to a stack of the portion 10b and the portion 10a.

[0051] The portion 10b has a thickness greater than or equal to, preferably substantially equal to, the height of the desired layer 10 after the thinning process. The portion 10a has a thickness greater than or equal to, preferably greater than, the maximum height of the surface defects generated by the grinding.

[0052] The part 10a is obtained by the introduction into the layer 10 of at least one so-called light species. The introduction of said light species corresponds for example to an implantation, that is to say to an ion bombardment of the upper face of the layer 10 by light ions, for example hydrogen and / or helium and / or oxygen ions, and possibly by heavier ions, for example argon or carbon. For example, the part 10a is obtained by a cointegration, that is to say the integration of several ions. The part 10a thus corresponds to a so-called amorphized, or damaged, part of the layer 10.

[0053] The nature, the dose of the implanted species and the implantation energy are chosen according to the thickness of the defects and the thickness of the desired thinning. It is thus possible to form a layer, corresponding to part 10b, having, depending on the applications, a thickness greater than 10 μm, a thickness between 1 μm and 10 μm, or a thickness less than 1 μm.

[0054] The ion implantation process, very homogeneous on a plate scale, ensures that the part 10a has a flat lower face, preferably parallel to the lower face of the layer 10, preferably parallel to the upper face of the layer 10.

[0055] The step of [Fig. IC] comprises for example a step of annealing the structure.

[0056] The thinning method comprises, after the step of [Fig.lC], a step of Chemical Mechanical Polishing (CMP). The polishing step removes part 10a. The layer formed by the thinning process thus corresponds to part 10b.

[0057] The degradation of the portion 10a of the layer 10 of piezoelectric material results in a modification of the etching rate, or removal rate, of the piezoelectric material of the portion 10b. Thus, the material of the portion 10a is etched more quickly, for example at least 10% more quickly than the material of the portion 10a. For example, in the case of a layer 10 made of LiNbO3, the portion 10a is etched 30% more quickly than the portion 10b.

[0058] It is thus possible to remove the part 10a without etching or damaging the part 10b. The difference in etching speed ensures that the height differences of the part 10a caused by the surface defects do not impact the upper face of the part 10b. The part 10b thus has a flat upper face, without surface defects caused by grinding.

[0059] Alternatively, the method of Figures 1A to 1C may be used to reduce non-uniformity after polishing and before a local abrasion ("trimming") step.

[0060] As a variant, layers 10 and 14 can be replaced by a layer of piezoelectric material obtained by physical deposition (Physical Vapor Deposition) or chemical deposition (Chemical Vapor Deposition).

[0061] [Fig.2] represents a step of another thinning process. More precisely Specifically, [Fig. 2] illustrates a variant of the manufacturing process of figures 1A to 1C. The variant of [Fig. 2] is, for example, particularly suitable for the formation of a thin layer, for example less than 10 μm. [Fig. 2] illustrates more precisely a variant of the step of [Fig. 1C].

[0062] The method illustrated by [Fig.2] comprises, like the method of figures 1A to 1C, the steps of figures 1A and 1B.

[0063] The step of [Fig. 2] differs from the step of [Fig. 1C] in that the layer 10 undergoes, before the polishing step, several ion implantations, each implantation being represented by a dotted line in [Fig. 2]. More precisely, the dotted lines indicate the lower level of the part receiving the ions for each implantation. Each implantation is for example followed by annealing. Each implantation is carried out at a different depth.

[0064] At least some of the different implantations are for example carried out with different ions, and / or different energy levels.

[0065] [Fig.3] represents a filter 15 comprising a piezoelectric layer 10b. More Specifically, [Fig.3] represents a 15 surface acoustic wave (SAW) filter.

[0066] The filter 15 comprises the layers 12 and 14 described previously and a layer 10b obtained by one of the embodiments described previously.

[0067] The manufacturing method, and in particular the characteristics of the ion implantation, is for example configured so that the layer 10b has a thickness of between between 3 pm and 5 pm.

[0068] The filter 15 further comprises electrodes 16 located on the upper face of the layer 10b. The electrodes 16 have interdigitated comb shapes, such that the acoustic waves propagate on the surface of the piezoelectric material of the layer 10b.

[0069] [Fig.4] represents another filter 17 comprising a piezoelectric layer 10b. More precisely, [Fig.4] represents a bulk acoustic wave (BAW) filter 17. The filter 17 is for example of the self-suspended bulk acoustic wave resonator (FBAR or film bulk acoustic resonator) type, in which the acoustic insulation is provided by an air cavity 22. For example, the filter 17 is adapted to radio frequency waves.

[0070] The filter 17 comprises the layers 12 and 14 described previously and a layer 10b obtained by one of the embodiments described previously.

[0071] The filter 17 further comprises a layer 18 located between the fixing layer 14 and the layer 10b. The layer 18 is, for example, a layer made of an insulating material. The layer 18 is, for example, made of silicon oxide.

[0072] The filter 17 further comprises a conductive or semiconductive region 20 and a cavity 22 in the layer 18, i.e. between the layer 14 and the layer 10b.

[0073] Region 20 constitutes a lower electrode of the filter. Layer 20 is for example made of metal. Layer 20 is preferably flush with the upper face of layer 18. Thus, the upper face of region 20 is preferably coplanar with the upper face of layer 18. Preferably, region 20 rests partially on layer 18. Thus, a portion of the lower face of region 20 is in contact with layer 18.

[0074] The cavity 22 is for example filled with a gaseous element, for example air. The cavity 22 extends under a part of the region 20. Thus, a part of the lower face of the region 22 constitutes a part of the walls of the cavity 22. The cavity 22 extends for example to the upper face of the layer 18, for example at a side wall of the region 20. The cavity 22 thus reaches the lower face of the layer 10b. The cavity is delimited by the layer 18, the region 20 and the layer 10b. The cavity 22 is thus for example closed.

[0075] The region 20 and the cavity 22 are for example formed before the formation of the layer 10b. Alternatively, the cavity 22 is filled with a sacrificial material until the end of the formation of the layer 10b. A release hole, not shown, passing through the layer 10b at the level of the layer 22 is then formed, so as to remove the sacrificial material via said release hole.

[0076] The filter 17 further comprises a cavity 24 passing through the layer 10b so as to reach the region 20.

[0077] The filter 17 further comprises a conductive or semiconductive region 26 resting on the layer 10b, preferably opposite at least part of the region 20. The region 26 constitutes an upper electrode of the filter 17.

[0078] [Fig. 5] represents a filter 30 comprising a piezoelectric layer 10b. More precisely, [Fig. 5] represents a bulk acoustic wave (BAW) filter 30. The filter 30 is for example of the Bragg reflector (or mirror) resonator (SMR or solidly mounted resonator) type. For example, the filter 30 is suitable for radio frequency waves.

[0079] The filter 30 comprises the layers 12 and 14 described previously and a layer 10b obtained by one of the embodiments described previously.

[0080] The filter 30 further comprises the layer 18 located between the fixing layer 14 and the layer 10b. The layer 18 is for example a layer made of an insulating material. The layer 18 is for example made of silicon oxide.

[0081] The filter 30 further comprises the conductive or semiconductive region 20 in the layer 18, i.e. between the layer 14 and the layer 10b.

[0082] Region 20 constitutes, as previously, a lower electrode of the filter. Layer 20 is for example made of metal. Layer 20 is preferably flush with the upper face of layer 18. Thus, the upper face of region 20 is preferably coplanar with the upper face of layer 18.

[0083] Filter 30 differs from filter 17, among other things, in that filter 30 does not include cavity 22. Thus, region 20 rests entirely on layer 18. In other words, the lower face, and preferably the side walls, of region 20 are entirely in contact with layer 18.

[0084] The region 20 is for example formed before the formation of the layer 10b. The filter 30 further comprises the cavity 24, or release hole 24, passing through the layer 10b so as to reach the region 20, allowing access to the lower electrode 20.

[0085] The filter 30 further comprises the conductive region 26 resting on the layer 10b, preferably opposite at least a portion of the region 20. The region 26 constitutes an electrode of the filter 30. The layer 18 constitutes the Bragg mirror, i.e. an alternation of thin layers of materials having a low acoustic impedance, for example SiO2, SiOC, SiON, and thin layers of materials having a high acoustic impedance, for example AIN, W, TaN, Ta2O5, WO2, WN, HfO2, or HfN, making it possible to acoustically isolate the resonator from the substrate.

[0086] An advantage of the embodiments described above is that they make it possible to form thin layers of piezoelectric material not comprising surface defects.

[0087] Various embodiments and variations have been described. Those skilled in the art will understand that certain features of these various embodiments and variants could be combined, and other variants will occur to those skilled in the art.

[0088] Finally, the practical implementation of the embodiments and variants described is within the reach of those skilled in the art from the functional indications given above.

Claims

Claims

1. A method of thinning a first layer (10) of a piezoelectric material comprising: a. implanting ions into the first layer (10) so as to amorphize an upper portion (10a) of the first layer (10), and b. removing the upper portion (10a) by a chemical-mechanical polishing step.

2. The method of claim 1, wherein the first layer (10) is made of one of LiNbO3, LiTaO3, quartz, langasite, langatate, KNbO3, K(Ta, Nb)O3, SrTiO3 or Pb(Zr, Ti)O3.

3. A method according to claim 1 or 2, wherein the ions comprise hydrogen and / or helium and / or oxygen ions.

4. A method according to any one of claims 1 to 3, wherein the first layer (10) is located on a substrate (12).

5. A method according to any one of claims 1 to 4, wherein the first layer (10) is obtained by a grinding step.

6. A method according to any one of claims 1 to 5, wherein the method comprises an annealing step between steps a. and b.

7. A method according to any one of claims 1 to 6, wherein the characteristics of step a. are such that the rate of removal of the upper portion (10a) of the first layer by polishing is at least 10% faster than the rate of removal of a lower portion (10b) not having received ions from the first layer by polishing.

8. The method of claim 7, wherein the lower portion (10b) has a thickness of less than 10 pm.

9. A method according to claim 7 or 8, wherein the lower portion (10b) has a thickness of less than 1 pm.

10. A method according to any one of claims 1 to 9, wherein the method comprises several distinct ion implantation steps.

11. A method of manufacturing a surface acoustic wave filter comprising: forming a first layer of a piezoelectric material on a substrate; thinning the first layer by a method according to any one of claims 1 to 10; forming electrodes (16) having interdigitated comb shapes on the first layer.

12. A method of manufacturing a bulk acoustic wave filter comprising: forming a second layer (18) on a substrate; forming a first conductive (20) or semiconductive region in the second layer; forming a first layer on the second layer; thinning the first layer by a method according to any one of claims 1 to 10; forming a cavity (24) passing through the first layer so as to reach the first conductive or semiconductive region; forming a second conductive region (26) on the first layer (10b).

13. The method of claim 12, wherein the second layer (18) is a Bragg mirror.

14. The method of claim 13, wherein the method comprises forming a cavity (22) comprising a gaseous element between a portion of the first region and the second layer.

15. A method according to any one of claims 11 to 14, wherein the filter is adapted to radio frequencies.

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