Microcircuit module intended to be mounted in a microcircuit card

Abstract

The present invention relates to a microcircuit module intended to be mounted in a microcircuit card, the module comprising a substrate, contact pads carried on the outer face of the substrate, the contact pads being arranged in two series parallel to a first direction of several contact pads, separated by a central zone, the contact pads being separated by gaps, a microcircuit carried on the inner face of the substrate, and electrically connected with the contact pads through the substrate, at least one electroluminescent component carried on the inner face of the substrate, characterized in that at least one gap portion has a width L greater than the reference width, this widened portion being positioned outside the theoretical bands, the electroluminescent component being positioned in the vicinity of the image zone of the gap portion,beyond the reference width applied to the gap portion. Abbreviated figure: [Fig. 2],

Description

Title of the invention: Microcircuit module intended to be mounted in a microcircuit card

[0001] The present invention relates to a microcircuit module intended to be mounted in a microcircuit card, as well as a card comprising such a module. It relates more particularly to microcircuit cards used for so-called contact or contactless payments, the latter being carried out via communication between a bank reader terminal and an antenna of the microcircuit card.

[0002] To implement a contact transaction, the card comprises a module comprising contact pads connected to a microcircuit of the card. The contact pads come into contact with pins of the terminal to carry out an exchange of data between the terminal and the microcircuit of the card. To implement a contactless transaction between a microcircuit card and a banking terminal, it is known to position the card near the terminal so that the card and the terminal can communicate and exchange secure data to set up the payment protocol.

[0003] During a communication in contact mode, that is to say by physical connection, in which the electronic document is inserted into the card reader of the terminal, a user is generally notified, by a message displayed on a screen of the terminal, that the transaction has been carried out and that the electronic document can be withdrawn.

[0004] In contactless communication, in which the electronic document is only brought close to the terminal, the document is generally positioned above the terminal screen and then hides the warning message. As a result, the user is no longer notified when the transaction is complete and risks withdrawing the electronic document prematurely.

[0005] The risk of removing the electronic document from the terminal prematurely before the end of the transaction is then high and results in a failure of the transaction.

[0006] In order to overcome this drawback, document EP2426627 discloses a card comprising at least one light source indicating a communication status between the terminal and the card. For this purpose, the card comprises a microcircuit module capable of being mounted in a cavity of the card body. This module comprises a light source carried by an internal face of a support of the module. The light source is powered by an antenna arranged in the card body. Light is emitted when a current of predefined intensity flows in the antenna, i.e. when Near-field communication is established with an external contactless card reader. Thus, when a contactless transaction is in progress, the light source emits radiation indicating that the transaction is in progress.

[0007] Also known from document EP4033408 is a card comprising a luminous means for indicating the status of a transaction. This means consists of an LED mounted inside the electronic module. The module is particular in that it comprises an opening on the upper face of the module, and more particularly on one of the contact pads of the module, through which the light emitted by the light source is visible.

[0008] However, the integration of the light source on the module, in particular according to the arrangement described in patent EP4033408, can pose several problems. First of all, the creation of an opening on the upper face of a module can lead to a risk of deterioration of the face of the module in the vicinity of the opening. Indeed, when inserting the card into a reader, the pins of the terminal rub on the contact pads of the module and deform the upper face of the module. In particular, the repetitive passages of the pins on the opening in one direction of insertion of the card then in the opposite direction when removing the card, lead to premature wear at the opening with a risk of enlargement or deformation of the outline of the latter.

[0009] Furthermore, the arrangements of the external faces of the modules must meet constraints specified in the ISO 7810 standards, in particular to guarantee sufficient rigidity to support the passage of the reader pins, while having sufficient deformation properties to withstand torsion tests without risking sudden tearing of the module mounted in the card cavity.

[0010] The invention aims to overcome these drawbacks in that it proposes a microcircuit module intended to be mounted in a microcircuit card, the module comprising, a substrate of substantially rectangular shape having an outer face and an inner face, contact pads carried on the outer face of the substrate, the contact pads being formed by deposition of metal on the substrate, the contact pads being arranged in two series parallel to a first direction of several contact pads, separated by a central zone, each contact pad covering at least one theoretical contact zone, the theoretical contact zones being arranged in two series parallel to the first direction of several theoretical contact zones, the theoretical contact zones being substantially identical and positioned symmetrically with respect to the first direction,two theoretical contact zones symmetrical with respect to the first direction defining a theoretical strip for passage of the pins of a terminal, the contact areas being separated by gaps extending substantially in the first direction and in a second, direction perpendicular to the first direction, the gaps having an initial reference width 1 devoid of metal, a microcircuit carried on the inner face of the substrate, and electrically connected with the contact pads through the substrate, at least one electroluminescent component carried on the inner face of the substrate, characterized in that at least one gap portion has a width L greater than the reference width, this widened portion being positioned outside the theoretical bands, the electroluminescent component being positioned in the vicinity of the image zone of the gap portion, beyond the reference width applied to the widened gap portion.

[0011] Thanks to these provisions, it is possible to add electroluminescent components to the inner face of a module without increasing the fragility of this module or risking damaging the electroluminescent component.

[0012] Particularly simple, convenient and economical preferred features of the device according to the invention are presented below: the widened portion is formed on a gap formed in the central zone and connecting two gaps delimiting two contact areas located substantially symmetrically with respect to the first direction, the electroluminescent component has an element emitting light radiation oriented towards the widened portion of interstice, the element emitting the radiation is positioned partially under the widened portion of interstice, outside the reference width 1, in which the element emitting the radiation consists of a light source of a transparent cover diffusing the light, that the electroluminescent component is powered by the antenna, the ignition is controlled by the microcircuit.

[0013] The invention, according to an exemplary embodiment, will be well understood and its advantages will appear better on reading the detailed description which follows, given for information purposes and in no way limiting, with reference to the appended drawings in which:

[0014] [Fig.l] [Fig.l] represents a view of a card comprising a module according to the invention

[0015] [Fig.2] [Fig.2] represents a view of the external face of the module according to a first embodiment

[0016] [Fig.3] [Fig.3] represents a view similar to that of the claim of a second embodiment of the module

[0017] [Fig.4] [Fig.4] illustrates a detailed view of the module,

[0018] [Fig.5] [Fig.5] illustrates a similar view of [Fig.4] according to a variant of realization,

[0019] [Fig.6] [Fig.6] is a schematic sectional view along direction AA of the [Fig.2],

[0020] The invention relates to ID-1 format cards 10 conforming to the dimensional specifications provided in particular by the ISO 7810 standard, as illustrated by [Fig.l]. This standard defines the dimensions and tolerances that a card 10 must comply with, depending on its format, in order to be able to cooperate by contact in good conditions with all the reading terminals provided for this purpose. Failure to comply with this standardized format can lead to significant problems during the interaction of the card 10 with the reading terminal. Typically, a card 10 not conforming to the ISO 7810 standard risks not being detected by the reading terminal or degrading the operation of the latter, or even not being read. The ID-1 format corresponds to a card 10 delimited by a rectangular shape measuring 85.6 mm x 54 mm x 0.76 mm thick.

[0021] Furthermore, the constraints imposed by the ISO 7810 standard also limit the size and arrangement of the electronic components that are likely to be integrated on a card 10. In particular, this standard specifies the positioning constraints of a microcircuit module 12 mounted in the card body 10 and carrying a microcircuit 36, shown schematically in [Fig.6] and allowing communication in contact mode between the microcircuit 36 ​​and the reader.

[0022] In addition to the constraints linked to the physical structure of the card 10, there are also constraints linked to the resistance of the card 10. To this end, the card 10 must remain compliant with the ISO7810 standards specifying the various torsion and elastic deformation tests to which the card 10 must resist.

[0023] The present invention provides a new module 12 adapted to meet the requirements specified in the standards. The module 12 according to the invention will be described with reference to Figures 2 to 3 initially. For reasons of clarity of the drawings, not all of the references indicated in one of the figures are indicated in the other figure, although Figures 2 and 3 illustrate two identical modules 12, with the exception of a gap which will be described in more detail later in the description. Except for this difference, the references in [Fig. 2] apply in the same way to [Fig. 3] and vice versa.

[0024] As seen in Figures 2 to 3, the module 12 comprises a dielectric substrate 16 generally of rectangular shape having an outer face flush with a surface of the card 10 and an inner face. For a better illustration, the substrate 16 of Figures 2 and 3 is shown larger than the contact pads 14. In reality, the substrate 16 and the contact pads 14 have a similar outline. The module 12 further comprises individual contact pads 14 or surfaces connected to a microcircuit 36 ​​mounted on the inner face of the module 12. The inner face of the module may also include capacitors 38 for managing the power supply of the microcircuit 36 ​​or other microcircuits, as illustrated in [Fig.6]. The contact pads 14, carried on the outer face of the substrate 16, are formed by deposition of metal on the substrate 16 by chemical etching techniques known to those skilled in the art. The purpose of these contact pads 14 is to ensure the electrical connection between the microcircuit 36 ​​and an external terminal, such as a banking terminal.

[0025] The microcircuit 36 ​​is carried on the inner face of the substrate 16, and is electrically connected with the contact pads 14 through the substrate 16 for example by gold wires not shown in the figures.

[0026] As visible in Figures 2 and 3, the contact pads 14 are distributed in two series parallel to a first direction 18 of several contact pads 14. Figures 2 and 3 illustrate two series of three contact pads 14. Other modules, not shown, comprise two series of four contact pads 14. The six or eight contact pads 14 are commonly designated by the names C1 to C6 (or C8). In Figures 1 to 3, a first series 14a, 14b, 14c, forming a first column, comprises the contact pads 14 C1 to C3, and a second series 14d, 14e, 14f forming a second column parallel to the first column, comprises the contact pads 14 C4 to C6. The two series of contact pads are separated by a central zone 20 which is also covered with metal and separated from a part of the contact pads 14 by gaps 22.

[0027] For information, contact areas 14 C1 and C5 are used for the power supply: C1 VCC (Supply voltage) and C5 GND (Ground); contact area C2, also called RST, is used for resetting the chip; contact surface C3, also called CLK, is used for the chip clock; contact surface C7, also called I / O, is used for the chip information inputs and outputs.

[0028] The contact surfaces C4, C6 and C8 are intended for so-called "reserved" contacts, which do not have any particular functions. Today, these contacts C4 and C8 can be used for USB ports and contact C6 for the SWP ("Single Wire Protocol") communication protocol.

[0029] The ISO7816 standard defines theoretical contact areas 24, namely the dimensions of the minimum areas of these areas 14, namely 2 mm wide and 1.7 mm high. The ISO7816 standard also defines their relative locations with respect to the edges of the card 10.

[0030] The theoretical contact zones 24 are arranged in two series parallel to the first direction 18. The two series of theoretical zones 24 are substantially identical and positioned symmetrically with respect to the first direction 18.

[0031] These theoretical zones 24 being minimal, it is necessary that each contact area covers a theoretical contact zone as defined in the ISO 7816 standard. Indeed, two theoretical contact zones 24 symmetrical with respect to the first direction 18 define a theoretical strip 26 for the passage of the pins of a terminal.

[0032] The contact pads 14 are separated by gaps 22 extending substantially along the first direction 18 and along a second direction perpendicular to the first. The gaps 22 have an initial reference width 1 free of metal. The gaps 22 correspond to very thin areas of the dielectric substrate 16 of the module 12 free of metal. The gaps 22 therefore make it possible to electrically isolate two contact pads 14.

[0033] As indicated in the preamble, microcircuit cards must meet certain standards concerning their elastic deformation properties and must be able to withstand torsion or deformation forces whose parameters are specified in said standards. The modules integrated in these cards consequently undergo simultaneously these torsion forces applied in the two directions of the card 10. The module 12 absorbs part of the forces applied thanks to the interstices 22 formed by non-metallized lines which are therefore less rigid than the metallized surfaces. Thus it is possible to avoid the tearing of the module 12 from the cavity in which it is mounted when the card 10 is deformed.

[0034] The card 10 according to the invention further comprises an antenna for establishing contactless communication with the reader, at a pre-defined communication frequency, such as 13.56 MHz defined by the ISO14443 standard. The antenna and the microcircuit 36 ​​of the module 12 are traditionally electrically connected by means of metal parts and a conductive adhesive, or conductive paste, when inserting the module 12.

[0035] The card 10 according to the invention also comprises an electroluminescent component 28. This electroluminescent component 28 is a light source, such as a light diode. The electroluminescent component 28 is arranged on the inner face of the substrate 16 of the module 12 and makes it possible to backlight the module 12 when it is powered via the antenna. Thus, when the card 10 is used in contactless mode, the electroluminescent component 28 is activated and diffuses light through the substrate 16 of the module 12.

[0036] The electroluminescent component 28 is a rigid or semi-rigid component which risks breaking or disconnecting when it is subjected to mechanical deformations. It is therefore important that the electroluminescent component 28 is not positioned at the level of the interstices 22 forming the deformation lines of the module 12. However, the light emitted by the component is diffused through these interstices 22 devoid of metal since the metal is completely opaque and does not allow light rays to pass through, whereas the dielectric substrate 16 of the module 12 allows the radiation from the electroluminescent component 28 to pass through. It is therefore necessary to optimize the positioning of the electroluminescent component 28 relative to the interstices 22 to meet the two conditions stated above.

[0037] In order to meet these two conditions, the present invention proposes to produce at least one gap portion 30 with a width L greater than the reference width 1 and that this widened portion 30 is positioned outside the theoretical strips 26 for passage of the reader pins. This arrangement is visible in [Fig.2],

[0038] According to a variant, illustrated by [Fig.3], the module 12 comprises two widened portions 30.

[0039] Thanks to these arrangements, the module 12 comprises a widened gap portion 30 through which the light is diffused. The widened portion 30 is then formed of a part of reference width 1 and a secondary part called widening e, so that l+e=L.

[0040] Furthermore, according to the invention, the electroluminescent component 28 is positioned in the vicinity of the image zone of the widened portion 30 of interstice, that is to say in the vicinity of the projection of the widened portion 30 of interstice onto the inner face of the module 12. The proximity of the electroluminescent component 28 to the widened portion 30 of interstice ensures that a large part of the radiation is emitted in the vicinity of the widened portion 30 of interstice and thus diffused through said widened portion 30 of interstice.

[0041] In order to protect the electroluminescent component 28, the latter is positioned in the vicinity of the widened portion 30 of interstice, but outside the part of the reference width 1. This makes it possible to prevent the component from being positioned on the deformation lines of the module 12 and being subjected to strong mechanical stresses.

[0042] According to a variant illustrated in [Fig.4] the electroluminescent component 28 is positioned so that the light source diffusing the light is positioned opposite the widening e, beyond the reference width 1 applied to the widened portion 30 L of interstice. According to another variant, illustrated in [Fig.5], the electroluminescent component 28 is positioned under the contact area delimiting the widening e, the component then being protected from deformation by the rigid metal contact area.

[0043] Thanks to these provisions, there is no creation of new zones devoid of metal in the theoretical strips 26 for the passage of the metal pins and the solution allows the light emitted by the electroluminescent component 28 to be able to be diffused without increasing the fragility of the module 12.

[0044] The widened gap portion 30 advantageously has a width equal to twice the reference width 1.

[0045] Advantageously, the widened gap portion 30 is formed in the central zone 20 connecting two gaps 22 delimiting two contact pads 14 located substantially symmetrically with respect to the first direction 18. This is illustrated by FIGS. 2 and 3. The widened gap portion 30 is thus positioned in the central zone 20 separating the two series of contact pads. This central zone 20 is mainly covered with metal and is therefore more rigid and less subject to deformation. The electroluminescent component 28 positioned near the widened gap portion 30 can therefore consequently be positioned under this central zone 20 and therefore protected from deformations applied to the card 10.

[0046] The electroluminescent component 28 comprises an element 32 emitting light radiation and a connection means 34 with the microcircuit 36 ​​or the antenna which power the component when a current flows in the antenna. According to the invention, the element 32 emitting the light radiation is oriented towards the widened portion 30 of interstice. Thus, the radiation is oriented directly towards the widened portion 30 of interstice to optimize the illumination of said widened portion 30. These arrangements are visible in Figures 2 and 3 in which the element 32 emitting the light radiation is positioned laterally by means of connection 34.

[0047] According to an alternative embodiment, the element 32 emitting light radiation is positioned partially under the widened gap portion 30 to maximize the radiation projected under the widened gap portion 30. In accordance with the invention, the element 32 emitting light radiation from the electroluminescent component 28 is positioned outside the part of the gap of reference width 1.

[0048] The element 32 emitting the light radiation consists of a light source covered with a transparent cover diffusing the light towards a determined direction, namely the widened portion 30 of interstice.

[0049] As indicated in the preamble of the description, the module 12 according to the invention is integrated into a microcircuit card 10. This microcircuit card 10 comprises an antenna which is adapted to power the electroluminescent component 28. For this purpose, the component is electrically connected to the antenna. Light is emitted when a current of predefined intensity flows in the antenna, that is to say when near-field communication is established with an external contactless card reader 10. Thus, when a transaction in contactless mode is in progress, the light source emits radiation indicating that the transaction is in progress. According to an alternative embodiment, the electroluminescent component 28 is connected to the microcircuit 36 ​​of the module 12 so that the lighting of the component electroluminescent 28 is controlled by the microcircuit 36 ​​according to a scenario pre-recorded in the microcircuit.

Claims

1. Claims 1. Microcircuit module (12) intended to be mounted in a microcircuit card, the module (12) comprising, a substrate (16) of substantially rectangular shape having an outer face and an inner face, contact pads (14) carried on the outer face of the substrate (16), the contact pads (14) being formed by deposition of metal on the substrate (16), the contact pads (14) being arranged in two series parallel to a first direction (18) of several contact pads (14), separated by a central zone (20), Each contact pad covering at least one theoretical contact area, the theoretical contact areas (24) being arranged in two series parallel to the first direction (18) of several theoretical contact areas (24), the theoretical contact areas (24) being substantially identical and positioned symmetrically with respect to the first direction (18), two theoretical contact areas (24) symmetrical with respect to the first direction (18) defining a theoretical strip (26) for passage of the pins of a terminal, the contact pads (14) being separated by gaps (22) extending substantially in the first direction (18) and in a second direction perpendicular to the first direction, the gaps (22) having an initial reference width 1 devoid of metal, a microcircuit carried on the inner face of the substrate (16), and electrically connected with the contact pads (14) through the substrate (16),at least one electroluminescent component (28) carried on the inner face of the substrate (16), characterized in that, at least one portion (30) of interstice has a width L greater than the reference width 1, this widened portion (30) of interstice being positioned outside the theoretical bands (26), the electroluminescent component (28) being positioned in the vicinity of the image zone of the widened portion (30) of interstice, beyond the reference width 1 applied to the widened portion (30) of interstice.

2. Microcircuit module (12) according to claim 1, in which the widened portion (30) is formed on a gap formed in the central zone (20) and connecting two gaps (22) delimiting two contact areas (14) located substantially symmetrically with respect to the first direction (18).

3. Microcircuit module (12) according to claim 1 or 2, in which the electroluminescent component (28) has an element (32) emitting light radiation directed towards the enlarged portion (30) of interstice.

4. A microcircuit module (12) according to claim 3, wherein the radiation-emitting element (32) is positioned partially under the widened gap portion (30), outside the reference width 1.

5. Microcircuit module 12 according to one of the preceding claims, in which the element (32) emitting the radiation consists of a light source of a transparent cover diffusing the light.

6. Microcircuit card comprising an antenna and a microcircuit module (12) according to the invention, characterized in that the electroluminescent component (28) is powered by the antenna.

7. Microcircuit card according to the preceding claim, in which the ignition is controlled by the microcircuit.

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