ORBITAL HALL EFFECT MAGNETIC DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE

Abstract

ORBITAL HALL EFFECT MAGNETIC DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE The invention aims to provide a simple-to-implement orbital Hall effect magnetic device (1) that offers magnetization control at least equivalent to prior art devices. To this end, the device comprises: a magnetic tunnel junction; a conductive spacer with low spin-orbit coupling and a high average orbital moment diffusion length; and a conductive track capable of generating an orbital moment current from a charge current and exhibiting low spin-orbit coupling. Figure to be published with the abstract: Figure 1

Description

Title of the invention: ORBITAL HALL EFFECT MAGNETIC DEVICE AND METHOD MANUFACTURING SUCH A DEVICE TECHNICAL FIELD OF THE INVENTION

[0001] The technical field of the invention is that of magnetic devices such as a memory or a magnetic field sensor, and more particularly magnetic devices exploiting the orbital Hall effect (known as "OHE"). TECHNOLOGICAL BACKGROUND OF THE INVENTION

[0002] Non-volatile magnetic memories, for example, use a magnetic tunnel junction (MTJ) consisting of two magnetic layers separated by a non-magnetic insulating layer. One of the magnetic layers is called the "trapped layer" or "reference layer" because it has a fixed magnetization. The other magnetic layer is called the "free layer" or "storage layer" because it has a variable magnetization that can take on different values ​​or orientations. The non-magnetic insulating layer is called the "tunnel barrier" because it acts as a tunnel barrier during electronic transmission between the two magnetic layers. The relative orientation of the magnetization of the free layer with respect to the magnetization of the reference layer allows information to be stored.The difference in resistance at the tunnel junction allows the stored information to be read (i.e., the orientation of one magnetization relative to the other). For example, a parallel configuration of magnetizations corresponds to a state of minimum electrical resistance and, for example, a low state, i.e., a data bit of "0". An antiparallel configuration of magnetizations corresponds to a state of maximum resistance and, for example, a high state, i.e., a data bit of "1". The relative difference is expressed as a percentage of tunnel magnetoresistance (TMR), which is usually on the order of 100% to 150% for typical "top-pinned" junctions and on the order of 150% to 200% for typical "bottom-pinned" junctions. The trapped and free layers most often have magnetization orientations that are perpendicular to the plane of the layers.This is referred to as a perpendicular magnetic tunnel junction, or "pMTJ" for "perpendicular magnetic tunnel junction" in English.

[0003] Magnetic tunnel junctions are also known to be used as a magnetic field sensor.

[0004] A first generation of magnetic devices (which can be used as magnetic memories or sensors) relies on a spin torque transfer effect (also called "spin transfer" or "STT") to exert a torque on the magnetization of the free layer. Spin transfer is based on the flow of an electric current through the tunnel junction. The magnetic tunnel junction is therefore usually connected to two terminals.

[0005] A second generation of magnetic devices relies on a spin-orbit torque effect, also called the "spin-orbit torque effect" or simply "spin-orbit torque" (SOT). A spin-orbit device comprises, in addition to the magnetic tunnel junction, a writing track, also called the spin-orbit track, most often made of a heavy transition metal such as Pt or [3-W]. The spin-orbit effect is a phenomenon that allows the transmission of torque at an interface. The spin-orbit track is therefore placed directly in contact with the free layer of the magnetic tunnel junction. The flow of an electric current in the spin-orbit track, and not through the tunnel junction, generates a spin current (distinct from an electronic current) which can be called the spin Hall effect (SHE) and can exert a torque on the magnetization of the free layer.The spin-orbit effect offers the advantage of separating the current paths used for reading (and flowing through the tunnel junction) from the writing current (flowing only in the spin-orbit track). Unlike devices based on spin transfer, devices based on the spin-orbit torque require three terminals. Two of them connect to the spin-orbit track to exert a torque on the magnetization of the free layer (which we will call the write layer), and a third connects to the tunnel junction, opposite the spin-orbit track, to read the state of the magnetic tunnel junction.

[0006] Although less compact than spin-transfer devices, spin-orbit devices offer greater endurance because the writing current travels only along the spin-orbit track and does not pass through the tunnel barrier (which is then only traversed by the read current, which is always lower than the write current). They can also be faster because their spin-orbit writing time can be shorter (for example, between 0.3 ns and 1 ms) than the spin-transfer writing time (which is generally between 10 ns and 100 ns). Finally, spin-orbit devices have better energy efficiency (in terms of power consumption per junction).These advantages therefore direct the use of spin-orbit devices, and the resulting random access memories (known as "SOT-MRAM" for "SOT Magnetic Random Access Memory" in English), towards embedded applications or "cache" type applications (memory which a microprocessor accesses more quickly and more frequently during calculations). For example, SOT-MRAMs are intended to replace static RAM such as "Embedded SRAM," which currently has no alternative. However, the manufacturing processes for spin-orbit devices and SOT-MRAMs are more complex and are not yet fully mastered.

[0007] An alternative to magnetic devices based on the conversion of a charge current (e.g., electrons) into a spin current consists of exploiting another form of current writing while retaining the advantage of a separate writing path from the reading path. The writing is achieved by converting the charge current into an orbital momenta current, which has a similar ability to spin currents to exert a torque on the magnetization of a magnetic layer. This is the orbital Hall effect (OHE), which differs from the spin Hall effect. Orbital Hall effect writing is a good candidate for improving the characteristics of magnetic devices.

[0008] The structure of an orbital Hall effect device is similar to that of a spin-orbit device except that the writing track, also called the "OT" track for "Orbital Torque" in English, is a track configured to generate an orbital moment current from a charge current.

[0009] US patent 2023 / 0309411 Al discloses, for example, a magnetic device comprising a magnetic tunnel junction, a conducting track extending in a plane and capable of generating an orbital momenta current, and a thin conversion layer interposed between the tunnel junction and the conducting track. The thin conversion layer converts the orbital momenta current from the conducting track into a spin current so that the spins can exert a spin-orbit torque on the free layer of the magnetic tunnel junction.

[0010] An orbital Hall effect device such as that presented in the aforementioned document can be fabricated using processes employed for spin-orbit devices. However, as with spin-orbit devices and SOT-MRAMs, the fabrication processes for orbital Hall effect devices are complex and not yet fully mastered.

[0011] There is therefore a need to provide a magnetic device that is simpler to manufacture and that allows control of the magnetization by orbital Hall effect with a control efficiency at least equivalent to prior art devices. Summary of the invention

[0012] To this end, the invention relates to a magnetic device comprising: • a magnetic tunnel junction; • a conductive spacer; and • a leading edge, the conductive spacer extending in line with the magnetic tunnel junction in a direction perpendicular to a plane, the plane being called the "layer plane", the conductive spacer being disposed between the magnetic tunnel junction and the conductive track, the conductive spacer being in direct contact with the conductive track, the conductive track comprising at least a portion extending parallel to the layer plane and directly against the conductive spacer, the conductive spacer having: • an average spin-orbit coupling strictly less than 136 eV; • an average orbital moment diffusion length strictly greater than 10 nm; • a thickness less than the average diffusion length of orbital moments, the conductive track being capable of generating an orbital moment current from a charge current and exhibiting a spin-orbit coupling strictly less than 136 eV.

[0013] By “magnetic tunnel junction”, we mean a stack of layers comprising two magnetic layers separated by an insulating layer capable of allowing an electron current to flow by tunneling effect.

[0014] By “spacer” we mean a layer intended to space the magnetic tunnel junction and the conductive track.

[0015] By “conductor” or “conductive” is meant having an electrical conductivity (preferably averaged over the volume of the element considered) greater than 103 S / m and preferably greater than 104 S / m.

[0016] By "the conductive spacer extends in line with the magnetic tunnel junction," it is meant that the magnetic tunnel junction and the spacer are bounded by the same flank. By "flank," we mean a surface extending perpendicularly to the plane of the layers.

[0017] By "direct contact" we mean contact without an intermediary.

[0018] By "thickness", we mean a dimension measured perpendicular to the plane of the diapers.

[0019] By "track" we mean a layer having a length and a width, measured parallel to the plane of the layers, its length being greater than its width.

[0020] By "average spin-orbit coupling of an element", we mean an average over the volume of the element of the spin-orbit coupling carried out over the entire volume of the spacer.

[0021] By "average orbital moment diffusion length of an element", we mean an average over the volume of the element of the average orbital moment diffusion length.

[0022] By "parallel" and "parallel," we mean parallel to within 20°, or even 10°, and preferably to within 5°. Similarly, by "perpendicularly" and "perpendicular," we mean perpendicular to within 20°, or even 10°, and preferably to within 5°.

[0023] By "charge current", we mean a current of charge carriers which may be a current of electrons and / or holes.

[0024] By "orbital moment scattering length" is meant a characteristic distance of orbital moment displacement when considering a displacement by scattering. An example of an orbital moment scattering length is given for titanium in the document [Choi et al. “Observation of the orbital Hall effect in a light metal Ti”, Nature 2023, vol. 619, no. 7968, p. 52-56.]

[0025] The magnetic device provides a means of controlling the magnetization of the magnetic tunnel junction by orbital Hall effect. The circulation of a longitudinal charge current (i.e., parallel to the plane of the layers) in the conductive track creates a transverse orbital moment current (i.e., perpendicular to the plane of the layers) in the conductive track. This orbital moment current is then injected into the conductive spacer, which is in contact with the conductive track. The spacer allows the orbital moment current to propagate towards the magnetic stack to apply a torque to the magnetization of the magnetic tunnel junction. Since the average diffusion length of the orbital moments is greater than the thickness of the spacer, a significant portion of the orbital moment current passes through the spacer and can be injected at the tunnel junction.This orbital moment current can therefore exert a spin-orbit torque on the magnetization of the tunnel junction. This orbital moment current allows control of the tunnel junction's magnetization to induce its precession and / or perform its switching. The spacer thus allows the orbital Hall effect (OHE) to be delocalized from the conductive track.

[0026] The spacing provided by the spacer also allows for a relaxation of the constraints on the manufacturing of the conductive track. For example, it is possible to use materials whose manufacturing processes are not compatible with those of a tunnel junction in the immediate vicinity.

[0027] Spin-orbit coupling facilitates the conversion of an electric charge current into a spin current. Without spin-orbit coupling, an electric charge current can theoretically be converted into an orbital moment current.

[0028] Weak spin-orbit coupling allows for the generation of a weak, or even negligible, spin current and a strong, or even dominant, orbital moment current. A spin current and an orbital moment current can interact constructively and / or destructively with each other in a way that can be difficult to control. This constructive / destructive interaction can depend on the materials used for the conductive track and / or the spacer. It can also depend on the spacer thickness. Indeed, the competition between spin and orbital moment currents can lead to a rapid reduction in the total current with increasing distance. Reducing, or even eliminating, these constructive / destructive interactions allows for better control of the orbital moment current amplitude at the tunnel junction and therefore better control of the torque exerted on the free magnetization of this junction.

[0029] Compared to a device whose track (called a "SOT" track for "Spin Orbit Torque") is capable of generating a spin current from a charge current, the device of the invention offers several advantages. To generate a spin current, the materials usually considered exhibit a spin-orbit coupling that can exceed 50 Ry, or 680 eV (considering 1 Ry = 13.6 eV). However, these materials generally have low conductivity, on the order of 10² S / m. This low conductivity reduces the energy efficiency of the resulting devices but also necessitates the formation of very thin tracks, with a thickness of less than 10 nm and approaching 4 nm. These small thicknesses severely constrain the fabrication of such tracks because, without precise control of the etching depth of the devices, these tracks are generally cut.

[0030] Materials for forming a track capable of generating an orbital moment current are generally simpler to use. For example, they exhibit high electrical conductivity, allowing the formation of thick conductive tracks, on the order of 100 nm, and therefore robust to etching (even if the etching depth is not well controlled).

[0031] Advantageously, the conductive spacer has a thickness greater than or equal to 20 nm.

[0032] Advantageously, the average spin-orbit coupling of the conducting spacer is strictly less than 13.6 eV.

[0033] Advantageously, the conductive track has a thickness strictly greater than 10 nm and preferably greater than 50 nm.

[0034] Advantageously, the average spin-orbit coupling of the conducting track is strictly less than 13.6 eV.

[0035] Advantageously, the conductive track is capable of converting at least 10% of the charging current into orbital moment current and preferably at least 50% of the charging current into orbital moment current.

[0036] Advantageously, the device comprises a substrate. The magnetic tunnel junction is disposed between the conductive spacer and the substrate or the conductive spacer is disposed between the magnetic tunnel junction and the substrate.

[0037] Advantageously, the conductive spacer is in direct contact with the magnetic tunnel junction.

[0038] Advantageously, the device includes an additional layer, called a "conversion layer", having a spin-orbit coupling greater than 680 eV, disposed between the magnetic tunnel junction and the conductive spacer, the conversion layer extending directly against the magnetic tunnel junction and directly against the conductive spacer.

[0039] Advantageously, the conversion layer has a thickness strictly less than 10 nm.

[0040] The invention further relates to a method for manufacturing a magnetic device comprising the following steps: • deposit a magnetic stack extending parallel to a plane, called the "layer plane" and intended to form, after etching, a magnetic tunnel junction; • deposit a conductive layer on the magnetic stack; • etch the conductive layer anisotropically to form a conductive spacer; • etch the magnetic stack to form a magnetic tunnel junction, the etching being carried out using the conductive spacer as an etching mask, the conductive spacer presenting, after the etching of the magnetic stack: • an average spin-orbit coupling strictly less than 136 eV; • an average orbital moment diffusion length strictly greater than 10 nm; and • a thickness less than the average orbital moment diffusion length; and • form a conductive track in direct contact with the conductive spacer from a material capable of generating an orbital moment current from a charge current and exhibiting a spin-orbit coupling strictly at 136 eV, the conductive track comprising at least a portion extending parallel to the plane of the layers and directly against the conductive spacer.

[0041] This method makes it possible to manufacture a magnetic device in which the spacer rests on the tunnel junction. This configuration is called "bottom pinned" because it advantageously allows one of the magnetic layers of the junction, having a fixed magnetization, to be placed at the bottom of the device.

[0042] Orbital moment currents can be degraded by the interfaces they cross, particularly when the quality of the latter is not optimal. The spacer, after being deposited onto the magnetic stack, protects the stack's surface condition. Therefore, the surface condition of the magnetic stack (under the spacer) is not affected by subsequent manufacturing steps (such as the delimitation of the magnetic stack). This surface condition can thus maintain optimal quality. Consequently, the injection of orbital moments into the magnetic stack is optimal. For example, the stack has a surface condition obtained at the time of its deposition, and the conductive layer is deposited onto the magnetic stack in such a way as to preserve the stack's surface condition. The magnetic stack and the conductive layer are, for example, deposited consecutively under vacuum, without re-exposure to air between the two depositions. In this way, the surface condition of the first magnetic layer is optimal.

[0043] The conductive track can also be made in a second step, without any degradation of the interface between the tunnel injunction and the spacer being feared.

[0044] Furthermore, the protection offered by the spacer also protects the surface condition of the stack, allowing for cleaning of a surface of the spacer onto which the conductive track will be transferred. Thus, the interface between the conductive track and the spacer can also be of good quality, without degrading the other interfaces.

[0045] The thickness of the spacer is constrained only by its average orbital moment diffusion length, which imposes a maximum final thickness. Therefore, the conductive layer can have a substantial initial thickness, for example, as large as necessary, to undergo aggressive manufacturing steps, such as polishing or etching, to obtain a conductive track with a suitable shape.

[0046] At the end of this process, the stack and the spacer are delimited by one and the same side.

[0047] Advantageously, the conductive layer has an initial thickness that is a function of: • the thickness of the magnetic stack; • the engraving speed of the magnetic stack; • the etching speed of the conductive layer; and • the average diffusion length of orbital moments of the conducting spacer after etching of the magnetic stack, • the etching speed of the magnetic stack and the etching speed of the conductive layer being considered for identical etching conditions.

[0048] Advantageously, the conductive spacer has a lower etching speed than the etching speed of the magnetic stack, the etching speeds of the spacer conductor and magnetic stacking being considered for identical etching conditions.

[0049] Advantageously, the conductive layer is a multilayer comprising a first sublayer and a second sublayer, the second sublayer being disposed between the first sublayer and the magnetic stack, the first sublayer having an etching speed lower than the etching speed of the magnetic stack and lower than the etching speed of the second sublayer, the etching speeds of the first and second sublayers and of the magnetic stack being considered for identical etching conditions.

[0050] Advantageously, the formation of the conductive track includes the sub-steps of: • depositing a dielectric layer covering the conductive spacer; • etch a portion of the dielectric layer with a stop on the top of the conductive spacer so that the dielectric layer has a flank extending perpendicularly to the plane of the layers and arranged in line with a portion of a flank of the conductive spacer; • place the conductive track partly against the dielectric layer and partly against the conductive spacer, the conductive track having two consecutive portions, one of the portions, called the "parallel portion", extending parallel to the plane of the layers and directly against the conductive spacer, and the other of the portions, called the "perpendicular portion", extending perpendicularly to the plane of the layers and directly against the side of the dielectric layer.

[0051] Advantageously, the formation of the conductive track includes the sub-steps of: • depositing an insulating layer against a flank of the conductive spacer; • form a dielectric layer extending against the insulating layer while leaving a portion of the conductive spacer exposed; • form a first conductive terminal and a second conductive terminal on the dielectric layer, on either side of the spacer, the first and second terminals being distant from each other and separated from the spacer by the insulating layer; • lay the conductive track so that it extends parallel to the plane of the layers and against the clear portion of the spacer, electrically connecting the first and second terminals.

[0052] The invention also relates to a method for manufacturing a magnetic device comprising the following steps: • deposit a conductive layer extending parallel to a plane, called the "layer plane", the conductive layer having an average spin-orbit coupling strictly less than 136 eV, an average diffusion length of orbital moments strictly greater than 10 nm and capable of generating a current of orbital moments from a current of charges; • deposit a magnetic stack on a conductive layer, the magnetic stack being intended to form, after etching, a magnetic tunnel junction; • etch the magnetic stack to form a magnetic tunnel junction, the etching being performed through an etching mask, • partially etch the conductive layer through the etching mask to form a conductive spacer and retain a portion of the conductive layer forming a conductive track in direct contact with the conductive spacer, the thickness of the conductive spacer being less than the average orbital moment diffusion length, the conductive track comprising at least a portion extending parallel to the plane of the layers and directly against the conductive spacer.

[0053] This method makes it possible to manufacture a magnetic device in which the magnetic tunnel junction rests on the spacer. This configuration is called "top pinned" because it advantageously allows one of the magnetic layers of the junction, having a fixed magnetization, to be placed at the top of the device.

[0054] The magnetic stack, after being deposited on the spacer, protects the surface condition between said stack and said spacer. Therefore, the surface condition between the magnetic stack and the spacer is not affected by subsequent manufacturing steps (such as the delimitation of the magnetic stack). This surface condition can thus maintain optimal quality. Thus, the injection of orbital moments into the magnetic stack is optimal. For example, the conductive layer and the magnetic stack can be deposited in such a way as to preserve the surface condition between the spacer and the stack. They are, for example, deposited consecutively under vacuum, without re-exposure to air between the two depositions.

[0055] The conductive track is formed from the same conductive layer as the spacer. This ensures a flawless interface between the two elements.

[0056] According to this method, said stack and the spacer are also delimited by one and the same side.

[0057] The invention and its various applications will be better understood by reading the following description and examining the accompanying figures. BRIEF DESCRIPTION OF THE FIGURES

[0058] The figures are shown for illustrative purposes only and are not intended to limit the invention. Unless otherwise specified, the same element appearing in different figures has a unique reference numeral.

[0059] Figures [Fig.1], [Fig.2], [Fig.3] and [Fig.4] present four embodiments of an orbital Hall effect magnetic device according to the invention.

[0060] Figures [Fig.5], [Fig.6], [Fig.7], [Fig.8], [Fig.9] and [Fig.10] schematically present different stages of a manufacturing process enabling the production of a magnetic device in a so-called "bottom pinned" configuration.

[0061] Figure 11 schematically presents a step in a manufacturing process for obtaining a magnetic device in a so-called "top pinned" configuration. DETAILED DESCRIPTION

[0062] Figure 1 schematically presents a first embodiment of a magnetic device 1 according to the invention. In particular, in this example, it is a non-volatile magnetic memory using an orbital momenta current to switch the magnetization of the memory. In the following description, the terms "device," "magnetic device," "memory," and "sensor" will be used interchangeably to describe this device. The principles concerning this device, presented in the context of a non-volatile storage memory, can be applied to a magnetic field sensor.

[0063] In the embodiment of [Fig. 1], the device 1 is connected to a first conductive terminal 41. This is, for example, a conductive via passing through a substrate 5 and opening onto its surface. The first terminal 41 can be a conductive via, for example made of copper, responsible for routing within an integrated circuit, for example at the level of a backend-of-line functional block. Alternatively, the first terminal 41 can be a plug, for example made of tungsten, placed on the via to block the diffusion of species such as copper to the different levels of the backend-of-line. The substrate 5 represents, for example, a level of the backend-of-line. The substrate 5 is preferably non-conductive; for example, it is a semiconductor layer, for example made of silicon, covered by one or more dielectric layers, for example made of silicon oxide.

[0064] The substrate 5, and in particular its surface, defines a reference plane {X; Y] on which the different layers of the device 1 are deposited. For this reason, this plane is also called the "layer plane". The Z-axis, illustrated in [Fig. 1], extends perpendicularly to the layer plane {X; Y] and can be called the "vertical" axis. The same convention of axes and plane is used in Figures 2 to 11, although they are not repeated.

[0065] Device 1 shown in [Fig. 1] comprises: • a magnetic tunnel junction 10; • a 30 mm conductive spacer; and • a conductive track 20.

[0066] The conductive spacer 30 is arranged between the tunnel junction 10 and the conductive track 20 to separate them. In this embodiment, the magnetic tunnel junction 10 rests on the first terminal 41 with which it can be electrically contacted. The spacer 30 rests on the tunnel junction 10. Finally, the conductive track 20 rests on the spacer 30.

[0067] The spacer 30 extends along the vertical Z in line with the magnetic tunnel junction 10. The spacer 30 and the junction 10 are delimited by a common flank 30, 10a which, in this example, is parallel to the vertical Z. By "flank," we mean a lateral surface 30a, 10a delimiting the perimeter of the spacer 30 and the junction 10. This delimitation in line with the extension is a consequence of a manufacturing method of the device 1 and results, for example, from the delimitation by successive engravings of the two elements through the same engraving mask. The stack of the tunnel junction 10 and the spacer 30 can thus have a cylindrical, ellipsoidal, or parallelepiped shape, one base of which rests on the first terminal 4L

[0068] The magnetic tunnel junction 10 of [Fig. 1] comprises a first layer 11 is a magnetic layer, called the "free layer," a second non-magnetic and insulating layer 12, called the "tunnel barrier," and a third magnetic layer 13, called the "reference layer." The magnetic layers 11 and 13 extend parallel to the plane of the layers.

[0069] The free layer 11 extends parallel to the plane of the {X; Y} layers. It exhibits magnetization and magnetic anisotropy. The anisotropy of the free layer 11 is configured to stabilize the magnetization in at least two distinct configurations. For example, the anisotropy of the free layer 11 can spontaneously orient (and in the absence of an external field) the magnetization out of the plane of the {X; Y} layers and preferably perpendicular to the plane of the {X; Y} layers (this is referred to as perpendicular magnetic anisotropy). It can then be directed parallel or antiparallel to the vertical Z. Alternatively, the anisotropy of the free layer 11 can also be such that the magnetization spontaneously orients itself in the plane of the {X; Y} layers. Magnetization can also adopt a vortex or skyrmion configuration having out-of-plane polarity (i.e., a net out-of-plane magnetic moment).

[0070] The free layer 11 can be made from Fe, Co, Ni or an alloy of these elements, for example CoFe, CoFeB or NiFe.

[0071] The reference layer 13 also exhibits a magnetization, referred to as the "reference magnetization," and an anisotropy. The anisotropy of the reference layer 13 is preferably configured so that the reference magnetization has a predetermined configuration, for example along a fixed direction and oriented in the plane of the layers {X; Y} or oriented out of this plane. The anisotropy of the reference layer 13 is preferably such that the reference magnetization maintains its configuration throughout the lifetime or use of the device 1. For this purpose, the tunnel junction 10 may include an antiferromagnetic layer (not shown in [Fig. 1]), coupled to the reference layer 13, to reinforce the anisotropy of the reference layer 13. This may be a multilayer of ferromagnetic layers coupled to each other in an antiparallel manner, called a "synthetic antiferromagnet layer" or "SAF".

[0072] The reference layer 13 can also be made from Fe, Co, Ni or an alloy of these elements, such as those mentioned above for the free layer 11, or from a multilayer comprising, for example, alternating layers of Co and Pt

[0073] The tunnel barrier 12 is configured to induce a tunneling effect when an electron current flows through the tunnel junction 10. This current is used, for example, to measure the magnetization configuration of the free layer 11 relative to the magnetization of the reference layer 13. The tunnel barrier 12 is an insulating and non-magnetic layer. It separates the free layer 11 from the reference layer 13 and preferentially extends at the contact between these two layers 11 and 13. It can be made from an oxide, a nitride, or a combination of oxides and nitrides. For example, it can be made of MgO, MgAlxOy, AlOx, TiOx, HfOx, TaOx, NiAin, or ZnO

[0074] The shape of the free layer 11 and the reference layer 13 can contribute to the magnetic anisotropy of these layers, orienting their magnetizations out of the plane of the layers or, conversely, in the plane of the layers. Therefore, the delimitation of the tunnel junction 10 can have a significant impact on the anisotropy of the resulting layers. The tunnel barrier 12 can also contribute to the magnetic anisotropy of the free layer 11 and / or the reference layer. When made of MgO, it can induce an out-of-plane interfacial anisotropy at the contact with CoFe or CoFeB layers. This interfacial anisotropy is advantageously used to orient the magnetization of the free layer 11 out of the plane of the {X; Y} layers.

[0075] The magnetic tunnel junction 10 allows the device 1 to function as a non-volatile magnetic memory or as a magnetic field sensor. Direct contact of the spacer 30 (or conversion layer) with the free layer 11 allows a torque to be applied to the magnetization of the latter.

[0076] The tunnel junction 10 may also include additional layers, not shown in [Fig. 1]. This includes, for example, an adaptation layer, also called "seed layer" in English, allowing a crystalline network to be favoured during the growth of the layers forming the tunnel junction 10. It can be made of Ta, Pt, W or even MgO.

[0077] In the embodiment of [Fig. 1], the device 1 is in a so-called "bottom pinned" configuration (or arrangement). The tunnel junction 10 is disposed between the substrate 5 and the spacer 30. More precisely, this configuration can correspond to the arrangement of the magnetic layers 11, 13 of the tunnel junction 10, which can influence the arrangement of the spacer 30 and the conductive track 20. In a bottom pinned configuration, the tunnel junction 10 rests on the reference layer 13. That is to say, the reference layer 13 is disposed between the free layer 11 and the substrate 5. The free layer 11 is therefore disposed on top of the tunnel junction 10, on which the spacer 30 rests.

[0078] The bottom-pinned configuration offers an advantage when delimiting the tunnel junction 10 and, in particular, the insulating layer by etching. Indeed, in an inverted configuration (known as "top-pinned"), the free layer 11 is generally thin and located close to the underlying substrate 5. During its etching, etching residues can be deposited on the walls of the junction 10 and short-circuit the tunnel barrier 12. In contrast, in the bottom-pinned configuration, the reference layer 13 is generally thicker and moves the tunnel barrier further away from the underlying substrate 5. The risk of short-circuiting the tunnel barrier is reduced.

[0079] The spacer 30 is a non-magnetic conductor. It extends along the vertical Z of the tunnel junction 10 to separate the conductive track 20 from the tunnel junction 10. This allows the tunnel junction 10 and the conductive track 20 to be manufactured in separate steps without compromising either the junction 10 or the track 20. It is also suitable for transferring an orbital moment current generated by the track 20 to the tunnel junction 10 so as to control the magnetization of the latter.

[0080] The spacer 30 comprises at least two faces, opposite each other. One of the two faces corresponds to the apex of the spacer 30 (in the ascending direction along the vertical Z). The other of the two faces, called the "foot" and opposite the apex, is opposite the tunnel junction 10.

[0081] The conductive track 20 is in direct contact with the top of the spacer 30.

[0082] The spacer 30 can be in direct contact with the tunnel junction 10 and, for example, with the free layer 11 of junction 10. By "direct contact," we mean that the spacer 30 and the free layer 11 share a common interface; there is no intermediate layer. Thus, the foot of the spacer 30 (opposite the top) is in direct contact with the free layer 11 of junction 10. Therefore, the orbital moment current is injected directly into tunnel junction 10. In addition, the number of interfaces is restricted, allowing the injected current to be maximized.

[0083] Alternatively, the device 1 may include a conversion layer (not shown in the figures and discussed below). In this alternative, the spacer 30 (and more particularly the foot of the spacer 30) may be separated from the free layer 11 by the conversion layer.

[0084] The spacer 30 has a thickness h30, measured perpendicular to the plane of the layers {X ; Y] (which can also be called "height").

[0085] The spacer 30 also exhibits an average orbital moment diffusion length θ30. The average orbital moment diffusion length θ (also referred to as the "average diffusion length") corresponds to the length that a stream of orbital moments can travel in a material before being significantly absorbed. The average length corresponds to an average of the diffusion length over the volume of the spacer 30.

[0086] In order to influence the magnetization of the free layer 11, it is necessary that the spacer 30 be able to transfer a substantial portion of the orbital moment current generated by the track 20 to the tunnel junction 10 and, in particular, to the free layer 11. For this to happen, the diffusion length ô30 of the spacer 30 is strictly greater than the thickness h30 of the spacer 30. In other words, by limiting the thickness h30 of the spacer 30 to a value less than the average orbital moment diffusion length ô, a portion of the orbital moment current induced by the conducting track 20 is effectively transferred to the tunnel junction 10.

[0087] The average diffusion length of the spacer 30 is strictly greater than 10 nm. Therefore, the thickness of the spacer 30 can reach 10 nm or even more, within the limit of the average diffusion length. A thickness h30 greater than or equal to 10 nm ensures sufficient distance between the tunnel junction 10 and the apex of the spacer 30 to allow the conductive track to be formed, even with aggressive manufacturing steps, without risking damage to the tunnel junction 10. It also reduces the risk of migration of a species from the conductive track 20 to the tunnel junction 10 or vice versa. The greater the thickness h30 of the spacer 30, the lower the risk of damage or migration.

[0088] Preferably the average diffusion length of the spacer is greater than or equal to 20 nm or even greater than or equal to 50 nm or even greater than or equal to 100 nm in order to obtain a spacer 30 having a high thickness, for example greater than 100 nm.

[0089] The spacer 30 also exhibits weak spin-orbit coupling. Thus, the propagation of orbital moment currents to the junction 10 is only weakly perturbed by spin currents. By weak spin-orbit coupling, one This implies a coupling of less than 10 Ry (the Rydberg unit, commonly used to express spin-orbit coupling, is equal to 13.6 eV). Preferably, the spin-orbit coupling of spacer 30 is less than 1 Ry.

[0090] Materials offering weak spin-orbit coupling and a long diffusion length include, for example: titanium, vanadium, chromium, manganese, copper, zirconium, niobium, molybdenum, ruthenium, aluminum, polycrystalline silicon, and tungsten carbide in the alpha phase (known as "aW," to be distinguished from the beta phase, known as "[3-W," which exhibits excessively strong spin-orbit coupling). The spacer 30 can therefore be formed from one of these materials or from an alloy of these materials. It is also advantageous, to facilitate the fabrication of device 1, to produce the spacer 30 from a nitride of these materials or from a hardened alloy of these materials.

[0091] Titanium and titanium nitride materials have the advantage of being frequently used to form hard masks, so their use is well understood.

[0092] The spacer 30 has the particularity of being placed on the paths enabling writing and reading in the device 1. Indeed, it is positioned on the orbital moment current path during writing, and on the spin-polarized current path passing through the junction 10 during reading. The spacer 30 is therefore advantageously chosen to have a high electrical conductivity, equal to or advantageously greater than that of the conductive track 20. For example, it is greater than or equal to 10³ S / m, or preferably greater than 10⁴ S / m.

[0093] Since the orbital moments do not allow for a direct torque to be applied to the magnetization of junction 10, one of the following two mechanisms may be required. The action of the orbital moments on the magnetization may be due to an entanglement of the orbital moments with the spin moments (known as "spin-orbital entanglement") and / or a portion of the orbital moment current is converted into a spin current in junction 10, the latter applying a torque to a magnetization of junction 10. The advantage of such mechanisms is that they are not localized in the immediate vicinity of the interface between the spacer 30 and junction 10. The orbital moments can propagate through the volume of the magnetic layers and create a torque within the volume of these layers. It should be noted that magnetic materials may also exhibit significant spin-orbit coupling, which also tends to generate a spin current from a portion of the orbital moment current.This spin current can then directly apply a torque to the magnetization of the stack.

[0094] In an unillustrated embodiment, the device 1 may include a layer, called a "conversion layer," whose role is to convert a portion of the orbital moment current into a spin current. This conversion layer is, for example, made from a material exhibiting high spin-orbit coupling (i.e., greater than (at 50 Ry). Placed in the path of the orbital moment currents, the conversion layer converts all or part of the orbital moment current into spin currents, which can then apply torque to the magnetization. The conversion layer can be placed anywhere between the conductive track 20 and the tunnel junction 10. However, it is preferable for it to be placed between the spacer 30 and the tunnel junction 10. In this way, the conversion is carried out just before the orbital moment and spin currents enter the tunnel junction 10. Furthermore, the spacer 30 can have a spin diffusion length that may be shorter than the orbital moment diffusion length. In addition, between the spacer 30 and the tunnel junction 10, the conversion layer is also protected by the spacer 30, in the same way as the tunnel junction. The surface states of the conversion layer are then optimal.

[0095] The conversion layer extends for example parallel to the plane of the layers and against the tunnel junction 10. The spacer 30 extends against the conversion layer.

[0096] The conversion layer is preferably made from a material with strong spin-orbit coupling, i.e., greater than or equal to 50 Ry. This conversion layer is, for example, made from a heavy metal such as platinum or tungsten carbide in its beta phase (denoted "[3-W]"). Materials with high spin-orbit coupling generally have low electrical conductivity, for example, on the order of 10² S / m or even less. In order to maintain low electrical resistance within the device 1, the conversion layer is preferably thin, i.e., less than 10 nm thick. When it is made of platinum, for example, it has a thickness of 8 nm. When it is made of [3-W], for example, it has a thickness of 4 nm.

[0097] The conductive track 20 extends over the spacer 30 and is in direct contact with this spacer 30. In this example, it extends entirely parallel to the plane of the layers {X; Y] extending over the dielectric layer 90 surrounding the spacer 30. In other words, the device 1 has a T-shape, resting on the first terminal 41 with which it can be electrically connected.

[0098] The conductive track 20 is in direct contact with the spacer 30 and in particular directly against the top of the spacer 30. Thus, the spacer 30 separates the junction 10 from the track 20 and makes an electrical contact between the two (either directly between the junction 10 and the track 2, or by means of the conversion layer).

[0099] The conductive track 20 is connected to two conductive terminals 42, 43 allowing the flow of an electronic current in the track 20.

[0100] The conductive track 20 is configured so that, when an electric current flows through it, it induces an orbital momenta current in the spacer 30. The orbital momenta current is to be distinguished from a spin current or a current of spin-polarized electrons. In this case, it is a current involving the movement of charges in the form of orbital moments. In the example in [Fig. 1], the direction of the orbital moments is indicated by the circled crosses. The circulation of a longitudinal electric current in the conductive track 20, i.e., parallel to the plane of the {X; Y} layers, generates a transverse orbital moment current, i.e., perpendicular to the plane of the layers. The direction of propagation of the orbital moment current is indicated by the thick arrow in [Fig. 1]. Thanks to the direct contact between the track 20 and the spacer 30, the orbital moment current propagates in the spacer 30, in the direction of the tunnel junction 10.

[0101] The conductive track 20 is made from a material capable of generating an orbital moment current from an electric charge current. In particular, it is preferred that the material in question exhibits a sufficient conversion rate of the charge current to an orbital moment current. The conversion rate of charges to orbital moments is given per unit current and is therefore dimensionless. It is preferable to use materials for which the conversion rate to an orbital moment current from an electric charge current is greater than 1% and preferably greater than or equal to 10%, or even greater than or equal to 50%, and even more preferably greater than or equal to 100%, or even higher.

[0102] The track 20 is also made of a conductive material, i.e., one with an electrical conductivity greater than 10³ S / m, or even greater than or equal to 10⁴ S / m, or even greater than or equal to 5-10⁴ S / m. In this way, the resistive losses of the device 1 are low. The conductive track 20 can therefore be used to read the magnetic configuration of the tunnel junction 10, for example by spin transfer. The low resistance of the conductive track 20 also improves the reading speed of the device 1.

[0103] The conductive track 20 has a thickness h20, measured perpendicular to the plane of the layers {X; Y], which is preferably large. Indeed, the efficiency of converting the charge current into orbital momenta current increases with the thickness h20 of the conductive track 20. The conductive track 20 thus makes it possible to generate a significant orbital momenta current. Conversely, tracks used to generate spin currents (called "SOT tracks") generally have small thicknesses, for example, less than 10 nm. The conversion efficiency of a conductive track 20 according to the invention (i.e., a thick one), for generating orbital momenta currents, is therefore ten to one hundred times greater than that of an SOT track.

[0104] In addition, a higher thickness makes it possible to reduce the total resistance of the conductive track 20 and thus increase the reading speed of the device 1.

[0105] The thickness h20 of the conductive track 20 of the device 1 is preferably strictly greater than 10 nm and preferably greater than or equal to 20 nm or even greater than or equal to 50 nm. It is also conceivable and very advantageous for the thickness h20 of the track 20 to be equal to 100 nm.

[0106] In order for the orbital moment currents generated by track 20 to reach the spacer 30, it is advantageous for track 20 to also have a sufficient average orbital moment diffusion length θ20 (also called the "average diffusion length"). For example, it is preferred that this diffusion length θ20 be greater than or equal to the thickness h20 of track 20. In this case, the entire generated orbital moment current can reach the spacer 30. However, if this length θ20 is less than the thickness h20 of track 20, only a portion of this orbital moment current is likely to reach the spacer 30. This portion is proportional to θ20 / h20.

[0107] The conductive track 20 also preferentially exhibits weak spin-orbit coupling. Thus, the generation and propagation of orbital moment currents in the track 20 is only weakly perturbed by spin currents. By weak spin-orbit coupling, we mean a coupling of less than 10 Ry (the Rydberg unit, commonly used to express spin-orbit coupling, is equal to 13.6 eV); and preferably less than 1 Ry. Materials commonly used to form SOT tracks, for example heavy metals, exhibit spin-orbit couplings exceeding 50 Ry. For example, platinum exhibits a spin-orbit coupling of about 80 Ry.

[0108] The spin-orbit coupling can also be expressed relative to a known spin-orbit coupling for a common material. For example, expressed relative to platinum, the conductive track 20 preferentially exhibits a spin-orbit coupling less than 12% of the spin-orbit coupling of platinum, or even less than 1.2% of the spin-orbit coupling of platinum.

[0109] Materials offering a favorable conversion rate, sufficient electrical conductivity, weak spin-orbit coupling, and a long diffusion length include, for example: titanium, vanadium, chromium, manganese, copper, zirconium, niobium, molybdenum, ruthenium, aluminum, polycrystalline silicon, and tungsten carbide in the alpha phase (known as "aW," to be distinguished from the beta phase, known as "[3-W," which exhibits strong spin-orbit coupling). The conductive track 20 can therefore be formed from one of these materials or an alloy of these materials. It is also advantageous, to facilitate the fabrication of device 1, to produce the conductive track 20 from a nitride of these materials or from a hardened alloy of these materials.

[0110] The conductive track 20 is in direct contact with the spacer 30 in order to efficiently inject the orbital moment current into the spacer 30. It is advantageous for the conductive track 20 and the spacer 30 to therefore share a large and high-quality common interface. The spacer 30 and the track 20 can advantageously be made from the same material in order to reduce interface effects. They can also be deposited successively, for example under vacuum or in a neutral atmosphere, in order to maintain an optimal surface condition between the spacer 30 and the track 20.

[0111] Figure 2 schematically presents a second embodiment of the device 1. Unlike the embodiment shown in [Fig. 1], the conductive track 20 does not extend parallel to the plane of the {X; Y} layers. Instead, it has an L-shape (which can also be, alternatively, a double L, i.e., a U-shape). The conductive track 20 has two consecutive portions. A first portion 21, called the "parallel portion," extends perpendicularly to the plane of the {X; Y} layers and is in direct contact with the spacer 30. A second portion 22, called the "perpendicular portion," extends perpendicularly to the plane of the {X; Y} layers, i.e., along the vertical Z. In this example, the perpendicular portion 22 extends along the continuation of a side 30a of the spacer 30. It could also be laterally distant from the spacer 30.

[0112] Fig. 3 schematically presents a third embodiment of device 1. Unlike the embodiment of Fig. 1, the second and third terminals 42, 43 frame the top of the spacer 30 in order to shorten the length of the conductive track 20. In this example, the spacer 30 includes an electrically insulating layer 60 extending against its side 30a. The insulating layer 60 is intended to electrically isolate the spacer 30 from the second and third terminals 42, 43. Thus, the terminals 42, 43 are connected only to the conductive track 20. The insulating layer 60 may cover only a portion of the flank 30a of the spacer 30. This is at least the portion of the flank facing the second and third terminals 42, 43. The insulating layer may also extend against the flank 10a of the tunnel junction 10, in line with the flank 30a of the spacer 30.

[0113] The insulating layer 60 can be formed by oxidation of the flank 30a of the spacer 30. It can also be formed by conformal deposition of a dielectric or by conformal deposition of a semiconductor which is subsequently oxidized. However, care must be taken to protect the upper surface of the spacer 30 with which the conductive track 20 makes contact. For this purpose, the insulating layer 60 can be formed after the formation of the conductive track 20.

[0114] In the example illustrated by [Fig.3], the second and third terminals 42, 43, pressed against the spacer 30 (and in this case against the insulating layer 60), form a cavity (or trench) at the bottom of which extends the conductive track 20, connecting the two terminals. Each of the terminals 42, 43 has a wall 42a, 43a extending in line with part of the flank 30a of the spacer 30. These walls 42a, 43a thus form the walls of the cavity (or trench).

[0115] Alternatively, the two terminals 42, 43 can be arranged on either side of the spacer 30, flush with the top of the spacer 30. The conductive track 20 then extends in a planar manner over the two terminals 42, 43 and the top of the spacer 30.

[0116] Figure 4 shows an embodiment in which the device 1 is in a so-called “top pinned” configuration.

[0117] Unlike the embodiment of [Fig. 1], in which the device 1 is in a so-called "bottom pinned" configuration, the spacer 30 is disposed between the tunnel junction 10 and the substrate 5. In a top pinned configuration, the tunnel junction 10 rests on the spacer 30 by its free layer 11. That is to say, the reference layer 13 is disposed above the free layer 11.

[0118] In this example, the conductive track 20 and the spacer 30 are formed from the same material. The absence of an interface between the two materials improves the efficiency of the device 1.

[0119] Figures 5 to 10 schematically illustrate an embodiment of a manufacturing process for obtaining the device 1 of [Fig. 1], i.e., in a bottom-pinned configuration. The manufacturing process can be carried out using a substrate 5, as shown in [Fig. 5], the upper surface of which forms the plane of the {X; Y} layers. The substrate 5 is, for example, made of Si. In this embodiment, a first terminal 41 partially passes through the substrate 5 and opens onto its surface. The apex of the first terminal 41 is flush with the upper surface of the substrate 5. The first terminal 41 can be a via, a "BEOL" (for "Back End Of Line") type plug, or a trace extending partially into the substrate 5.

[0120] A first step of the process, illustrated by [Fig. 4], consists of depositing 101 a magnetic stack 10' onto the substrate 5. This stack comprises first, second, and third layers 11', 12', 13' which are intended to form the layers 11, 12, 13 of the tunnel junction 10 of [Fig. 1]. This deposit 101 comprises, for example, the deposit of two magnetic layers 11', 13' separated by an insulating layer 12'. The first magnetic layer 11' is, for example, intended to form, once delimited, the free layer 11 of the tunnel junction 10.

[0121] The process may also include an initial deposition of layers intended to form a seed layer and / or a synthetic antiferromagnetic (not shown in this figure), as discussed previously.

[0122] The process then comprises the deposition 102 of a conductive layer intended to form the spacer 30, illustrated in [Fig. 5]. The conductive layer 70 can be formed from a single material (or alloy of materials). In other words, it does not include a sublayer or inclusions. In this case, the conductive layer 70 comprises a material offering a long orbital moment current diffusion length, as discussed above. This material also exhibits a spin-orbit coupling strictly less than 10 Ry, or even 1 Ry. The conductive layer 70 is, for example, made from the materials described with reference to the spacer 30.

[0123] In this example, the conductive layer 70 is deposited directly in contact with the magnetic stack 10' and more particularly with the first magnetic layer 11'. In this case, the deposit 102 can be made using a physical deposition method. Other deposition methods can be considered, such as chemical deposition.

[0124] Alternatively, prior to the deposition of the conductive layer 70, the manufacturing process may include a step of deposition, on the magnetic stack 10', of a thin layer (less than 10 nm) exhibiting strong spin-orbit coupling, greater than 50 Ry, so as to form, after delimitation, a conversion layer. The conductive layer 70 is then deposited directly in contact with this layer, which is intended to form the conversion layer.

[0125] The stack 10' and the conductive layer 70 (and the conversion layer, if applicable) are advantageously deposited in successive stages. Thus, the surface finish of the first, freshly deposited magnetic layer 11' can be protected by the conductive layer 70 (or the conversion layer). The atmosphere in which these different layers are deposited is therefore preserved. The deposits are, for example, carried out under vacuum or in a neutral gas atmosphere, without re-exposure to air between these deposits. In this way, the quality of the surface finish of the first magnetic layer 11' is preserved and protected by the conductive layer 70. This deposit thus ensures a very high-quality interface between the free layer 11 of the tunnel junction 10 and the spacer 30.

[0126] The process may include annealing, carried out after the deposition 101, 102 of the magnetic stack 10' and the conductive layer 70. For example, when the first magnetic layer 11' of the stack 10' is made of CoFeB and the insulating layer 12' of MgO, annealing improves the interface between these two layers and increases the out-of-plane magnetic anisotropy between them. This can result, after delimitation of the junction, in a free layer 11 exhibiting perpendicular anisotropy. Annealing can also improve the interface between the first magnetic layer 11' and the conductive layer 70. Annealing can also to be carried out after etching of the conductive layer 70 and the magnetic stack 10'.

[0127] Figure 6 shows an etching step 103 of the conductive layer 70 to form the spacer 30. This etching is carried out anisotropically through a first etching mask 80. The etching 103 can be stopped on the magnetic stack 10'. The first mask 80, for example made of resin, is formed by photolithography on the spacer 30.

[0128] The etching 103 of the conductive layer 70 is advantageously aligned with the first terminal 41 so that the device 1 is correctly connected to the terminal 4L

[0129] Figure 7 shows a step 104 of etching the magnetic stack 10' of to form the tunnel junction 10. This delimitation 104 is achieved by anisotropic etching using the spacer 30 obtained in the previous step. The etching is stopped on the substrate 5. The stack 10' is thus etched in line with the spacer 30. The etching maintains a very good interface quality between the first magnetic layer 11' (now forming the free layer 11) and the spacer 30.

[0130] At the end of the etching step 104 of the magnetic stack 10', the spacer 30 has its final thickness h30. The initial thickness h70 of the conductive layer 70 is advantageously chosen so that the spacer 30 has the correct final thickness h30 at the end of the etching. Thus, the orbital moment currents can reach the tunnel junction 10.

[0131] The conductive layer 70 is deposited with an initial thickness h70, measured perpendicular to the substrate 5. This thickness h70 depends on the etching rate of the material used to form this layer 70 as well as the etching rate of the magnetic stack 10'. Generally speaking, "etching rate" refers to the rate at which a layer is etched. This etching rate is determined under reproducible etching conditions. The comparison between two etching rates is therefore carried out under identical etching conditions. Indeed, the etching rate depends strongly on the species used as the etching element or on the composition of the fluids or gases used to perform the etching. Moreover, since the magnetic stack 10' may comprise layers with different etching rates, the etching rate considered is the average rate of the etching rates of the layers in the stack 10'.

[0132] More specifically, the initial thickness h70 of the conductive layer 70 can depend on: • the etching speed v70 of the conductive layer 70 (and in particular the average etching speed if it is not homogeneous); • the etching speed vlO' and the thickness hlO' of the stack 10'; and • the average diffusion length of spacer 30 (which can correspond to the diffusion length of the conductive layer 70).

[0133] The initial thickness h70 can be substantially equal to: h70 ~ hlO' x v70 / vl0' + h30

[0134] By "substantially equal" or the sign " ", we mean equal to within 20%, or even within 10%.

[0135] Since the thickness h30 of the spacer 30 must be less than the diffusion length ô to allow an effect on the free layer, the initial thickness h70 of the conducting layer is preferably less than: h70 < hlO' x v70 / vl0' + ô

[0136] In this way, the final thickness h30 of the spacer 30 ensures the propagation of the orbital moment current generated by the conductive track 20 to the tunnel junction 10. The etching speed can vary within the conductive layer depending on its thickness (for example, when it is a multilayer). Thus, calculating the initial thickness h70 of the conductive layer 70 to obtain a final thickness h30 of the spacer 30 that is less than the average orbital moment diffusion length ensures the proper functioning of the fabricated device 1.

[0137] This inequality assumes that after the etching 103 of the conductive layer 70, the first mask 80 is completely removed. If a remnant of the first mask remains after this step, the etching speeds and / or the height of the conductive layer 70 are advantageously adjusted to take this remnant into account.

[0138] Following its delimitation, the magnetic layers 11 and 13 of the tunnel junction 10 can exhibit their final anisotropies, for example perpendicular or planar.

[0139] In order to limit the initial height h70 of the spacer 30, and to avoid the risk of its collapse during etching, it is advantageously chosen to be harder than the magnetic stack 10'. By "harder," we mean that it has a lower etching speed than the etching speed of the magnetic stack 10'. Thus, the magnetic stack 10' is etched faster than the spacer 30, and the conductive layer can have an initial thickness h70 close to the final thickness h30 of the spacer 30.

[0140] Moreover, the shape of the spacer 30, and in particular its width or diameter, measured parallel to the plane of the layers {X; Y], is better controlled when the conductive layer has a lower initial thickness h70, close to the final thickness h30 of the spacer 30. Thus, the conductive layer 70 preferentially has an etching speed less than 90% of the etching speed of the magnetic stack 10', or even less than 50% of the etching speed of the magnetic stack 10 and even more preferably, less than 20% of the etching speed of the magnetic stack 10'.

[0141] The conductive layer 70 can be made of a hardened alloy of titanium, vanadium, chromium, manganese, copper, zirconium, niobium, molybdenum, ruthenium, aluminium, polycrystalline silicon, or tungsten carbide aW. It can also be a nitride of these materials.

[0142] Advantageously, the conductive layer 70 is a multilayer comprising a first sublayer and a second sublayer. The first layer extends against the magnetic stack 10'. The first sublayer is hard, meaning that it has a lower etching speed than the etching speed of the magnetic stack 10' and also lower than the etching speed of the second sublayer. The etching speeds of the first and second sublayers and of the magnetic stack are considered for identical etching conditions. Thus, combining different etching speeds makes it possible to deposit a conductive layer 70 with a smaller initial thickness h70 (before etching the spacer or delimiting the magnetic stack). Indeed, the hard first sublayer reduces the etching speed of the conductive layer 70.Thus, the risk of collapse of spacer 30 before or during the etching of the magnetic stack 10' is deduced.

[0143] Orbital moment currents can be influenced by the presence of interfaces. To avoid interface proliferation, the thickness of the first sublayer can be chosen so that the first sublayer is completely removed after the etching of the magnetic stack 10'. The first sublayer thus acts as a temporary etching mask, allowing the etching speed of the conductive layer (or even the spacer 30) to be reduced, without remaining in the final device 1.

[0144] Figure 8 schematically shows the formation 105 of the conductive track 20. It initially comprises a substep of depositing a dielectric layer 90 flush with the top of the spacer 30 (i.e., the free part of the spacer 30). This dielectric layer 90 is deposited, for example, by covering the spacer 30. The dielectric layer 90 is then flattened, for example, by mechanical and / or chemical polishing, stopping at the top of the spacer 30. This step frees the top of the spacer from the dielectric layer 90. The dielectric layer 90 comprises, for example, SiO2. A sub-step of deposition of the material intended to form the conductive track 20 is deposited on the spacer 30 and the dielectric layer 90. The deposition is carried out through a mask or the layer is etched through a mask, or the material can be transferred to form the conductive track 20.

[0145] In [Fig. 8], the conductive track 20 extends flat (i.e., parallel to the plane of the layers), partly against the spacer 30 and partly on the dielectric layer 90. This configuration offers a sufficient accumulation of orbital moments on the surface of the conducting track 20 to allow their injection into the spacer 30.

[0146] The material used to form the conductive track 20 is capable of generating a current of orbital moments and also exhibits a low spin-orbit coupling, for example less than 10 Ry, or even less than 1 Ry. It is for example made from titanium, vanadium, chromium, manganese, copper, zirconium, niobium, molybdenum, ruthenium, aluminum, polycrystalline silicon, or tungsten carbide aW or an alloy of these materials.

[0147] Fig. 9 schematically presents the formation 106 of the second and third terminals 42, 43. They are obtained by depositing a metal through a mask so as to connect each one end of the conductive track 20. The second and third terminals 42, 43 can also take the form of vias rising from the substrate 5 to the conductive track 20.

[0148] To form the device 1 of [Fig.2], the step of forming the conductive track 20 differs from the step illustrated by [Fig.8] in that the dielectric layer 90 is not flattened by polishing. On the contrary, it exhibits a difference in height on either side of the spacer 30. The dielectric layer 90 has, on only one side of the spacer 30, a height greater than that of the spacer 30. The dielectric layer 90 thus offers a surface 91 (or "side"), extending in line with the side 30a of the spacer 30, on which a portion 22 of the conductive track 20 can extend. The difference in height of the dielectric layer 90 is obtained, for example, by etching a part of the dielectric layer 90 with a stop at the top of the spacer 30 so that the dielectric layer 90 presents this side 91 extending perpendicularly to the plane of the layers [X; Y] and arranged in line with a part of a side 30a of the spacer 30.The conductive track 20 can then be produced by conformal deposition to form a first portion 21 extending against the spacer 30 and a second portion 22 extending against the flank 91 of the dielectric layer.

[0149] Thus, the conductive track 20 has an L-shaped form with the perpendicular portion 22 extending at the right of the spacer 30 while moving away from the spacer 30. It has in particular a corner joining the parallel portion 21 with the perpendicular portion 22.

[0150] To form device 1 of [Fig.3], the steps of forming the conductive track 20 and of forming the second and third terminals 42, 43 are modified and reversed.

[0151] Initially, the manufacturing process includes an additional step of forming the insulating layer 60 on the flank 30a of the spacer 30. This insulating layer 60 is obtained, for example, by conformal deposition of a oxide film. It can also be obtained by conformal deposition of a semiconductor film which is subsequently thermally oxidized. Anisotropic etching or chemical and physical planarization of this conformal film makes it possible to expose the upper surface of the spacer 30 against which the conductive track 20 must make contact.

[0152] In a second step, the first sub-step of formation 105 of the conductive track 20 consisting of depositing the dielectric layer 90 is carried out in such a way as to leave a portion of the height of the spacer 30 exposed. In other words, the resulting dielectric layer does not reach and does not exceed the top of the spacer 30.

[0153] The second and third terminals 42, 43 are then formed to create, respectively, a first wall 42a and a second wall 43a, positioned on either side of the spacer 30 and forming a trench directly below the spacer 30, the portion exposed by the spacer 30 forming the bottom of the trench. The second and third terminals 42, 43 are, for example, formed on either side of the spacer 30, abutting the insulating layer 60. The terminals 42, 43 are formed to extend beyond the spacer 30. In other words, they form the walls 52a, 43a of the trench, the bottom of which is the spacer 30.

[0154] Finally, the second sub-step of formation 105 of the conductive track 20, consisting of depositing the material intended to form the conductive track 20, is carried out in the cavity formed by the terminals 42, 43. The conductive track 20 extends parallel to the plane of the layers {X; Y] and against the clear portion of the spacer 30, electrically connecting the first and second terminals.

[0155] Alternatively, the second and third terminals can be formed at the height of the spacer 30, i.e. flush with the top of the spacer 30 on the spacer 30 and the dielectric layer 90. The deposition of the conductive track 20 makes it possible to obtain a track parallel to the plane of the layers.

[0156] Figure 11 schematically presents an implementation of a manufacturing process for obtaining device 1 of Figure 4, i.e., in a top-pinned configuration. The manufacturing process can be carried out from a substrate 5, as shown in Figure 5.

[0157] In order to obtain the top pinned configuration, i.e. the inverse of the bottom pinned configuration, the steps of the manufacturing process are reversed.

[0158] Initially, the process comprises depositing the conductive layer 70 onto the substrate 5. Since the spacer 30 and the track 20 are formed from the conductive layer 70, its initial thickness h70 is equal to the sum of the thickness h30 of the targeted spacer 30 and the thickness h20 of the conductive track 20. The conductive layer 70 is made from the aforementioned materials. In particular, it must have an average spin-orbit coupling strictly less than 136 eV, a length average diffusion of orbital moments strictly greater than 10 nm and be able to generate an orbital moment current from a charge current.

[0159] Initially, the process comprises depositing 101 of the magnetic stack 10' onto a conductive layer 70. The magnetic stack 10' is similar to the stack shown in Figures 5 to 10, except that its orientation is reversed compared to those figures. The magnetic layer intended to form the free layer 11 is positioned opposite the conductive layer 70.

[0160] The process then includes etching 104 of the magnetic stack 10' to form the magnetic tunnel junction 10. This etching can be formed using an etching mask.

[0161] The method further comprises the partial etching 103 of the conductive layer 70 through the etching mask used to etch the magnetic stack 10'. This partial etching 103 makes it possible to delimit the conductive spacer 30 directly above the tunnel junction 10. It also makes it possible to keep a portion of the conductive layer 70 forming the conductive track 20 in direct contact with the conductive spacer 30.

[0162] In one variant, the tunnel junction 10 can be used as an etching mask to carry out all or part of the partial etching 103 of the conductive layer 70.

Claims

Demands

1. Magnetic device (1) comprising: a magnetic tunnel junction (10); a conductive spacer (30); and a conductive track (20), the conductive spacer (30) extending in the continuation of the magnetic tunnel junction (10) in a direction (Z) perpendicular to a plane ({X; Y}), the plane ({X; Y}) being said to be the "layer plane", the conductive spacer (30) being disposed between the magnetic tunnel junction (10) and the conductive track (20), the conductive spacer (30) being in direct contact with the conductive track (20), the conductive track (20) comprising at least a portion extending parallel to the layer plane ({X; Y}) and directly against the conductive spacer (30), the conductive spacer (30) having: an average spin-orbit coupling strictly less than 136 eV; an average orbital moment diffusion length strictly greater than 10 nm;a thickness (h30) less than the average orbital moment diffusion length, the conducting track (20) being capable of generating an orbital moment current from a charge current and exhibiting a spin-orbit coupling strictly less than 136 eV.;

2. Device (1) according to claim 1, wherein the conductive spacer (30) has a thickness (h30) greater than or equal to 20 nm.

3. Device (1) according to any one of claims 1 or 2, wherein the average spin-orbit coupling of the conducting spacer (30) is strictly less than 13.6 eV.

4. Device (1) according to any one of claims 1 to 3, wherein the conductive track (20) has a thickness (h20) strictly greater than 10 nm.

5. Device (1) according to any one of claims 1 to 4, wherein the average spin-orbit coupling of the conducting track (20) is strictly less than 13.6 eV.

6. Device (1) according to any one of claims 1 to 5, wherein the conductive track (20) is capable of converting at least 10% of the charge current into orbital moment current.

7. Device (1) according to any one of claims 1 to 6, comprising a substrate (5), the magnetic tunnel junction (10) being disposed between the conductive spacer (30) and the substrate (5).

8. Device (1) according to any one of claims 1 to 6, comprising a substrate (5), the conductive spacer (30) being disposed between the magnetic tunnel junction (10) and the substrate (5).

9. Device (1) according to any one of claims 1 to 8, wherein the conductive spacer (30) is in direct contact with the magnetic tunnel junction (10).

10. Device (1) according to any one of claims 1 to 8, comprising an additional layer, referred to as the "conversion layer", having a spin-orbit coupling greater than 680 eV, disposed between the magnetic tunnel junction (10) and the conductive spacer (30), the conversion layer extending directly against the magnetic tunnel junction (10) and directly against the conductive spacer (30).

11. Device (1) according to claim 10, wherein the conversion layer has a thickness strictly less than 10 nm.

12. A method for manufacturing a magnetic device (1) comprising the following steps: depositing (101) a magnetic stack (10') extending parallel to a plane ({X; Y}), called the "layer plane" and intended to form, after etching (104), a magnetic tunnel junction (10); depositing (102) a conductive layer (70) on the magnetic stack (10'); etching (103) the conductive layer (70) anisotropically to form a conductive spacer (30); etching (104) the magnetic stack (10') to form a magnetic tunnel junction (10), the etching being carried out using the conductive spacer (30) as an etching mask, the conductive spacer (30) having, after etching of the magnetic stack (10'): an average spin-orbit coupling strictly less than 136 eV; an average orbital moment diffusion length strictly greater than 10 nm; and a thickness (h30) less than the average orbital moment diffusion length;and form a conductive track (20) in direct contact with the conductive spacer (30) from a material capable of generating an orbital moment current from a charge current and having a spin-orbit coupling strictly at 136 eV, the conductive track (20) comprising at least a portion extending parallel to the plane of the layers ({X ; Y}) and directly against the conductive spacer (30).;

13. A method according to claim 12, wherein the conductive layer (70) has an initial thickness (h70) that is a function of: the thickness of the magnetic stack (10'); the etching speed of the magnetic stack (10'); the etching speed of the conductive layer (70); and the average orbital moment diffusion length of the conductive spacer (30) after etching of the magnetic stack (10'), the etching speed of the magnetic stack (10') and the etching speed of the conductive layer (70) being considered for identical etching conditions.

14. A method according to claim 13, wherein the conductive spacer (30) has a lower etching speed than the etching speed of the magnetic stack (10'), the etching speeds of the conductive spacer (30) and the magnetic stack (10') being considered for identical etching conditions.

15. A method according to any one of claims 13 or 14, wherein the conductive layer (70) is a multilayer comprising a first sublayer and a second sublayer, the second sublayer being disposed between the first sublayer and the magnetic stack (10'), the first sublayer having an etching speed lower than the etching speed of the magnetic stack (10') and lower than the etching speed of the second sublayer, the etching speeds of the first and second sublayers and of the magnetic stack (10') being considered for identical etching conditions.

16. A method according to any one of claims 12 to 15, wherein the formation (105) of the conductive track (20) comprises the substeps of: depositing a dielectric layer (90) covering the conductive spacer (30); etching a portion of the dielectric layer (90) with a stop on the top of the conductive spacer (30) so that the dielectric layer (90) has a flank (91) extending perpendicularly to the plane of the layers ({X; Y}) and disposed in the continuation of a portion of a flank (30a) of the conductive spacer (30); deposit the conductive track (20) partly against the dielectric layer (90) and partly against the conductive spacer (30), the conductive track (20) having two consecutive portions (21, 22), one of the portions (21), called the "parallel portion", extending parallel to the plane of the layers ({X;Y}) and directly against the conducting spacer (30), and the other of the portions (22), called "perpendicular portion", extending perpendicularly; at the plane of the layers ({X ; Y}) and directly against the flank (91) of the dielectric layer (90).

17. A method according to any one of claims 12 to 15, wherein the formation (105) of the conductive track (20) comprises the substeps of: depositing an insulating layer (60) against a flank (30a) of the conductive spacer (30); forming a dielectric layer (90) extending against the insulating layer (60) while leaving a portion of the conductive spacer (30) uncovered; forming a first conductive terminal (42) and a second conductive terminal (43) on the dielectric layer, on either side of the spacer, the first and second terminals being spaced apart and separated from the spacer by the insulating layer; depositing the conductive track (20) so that it extends parallel to the plane of the layers and against the uncovered portion of the spacer, electrically connecting the first and second terminals.

18. Method of manufacturing a magnetic device (1) comprising the following steps: depositing (102) a conductive layer (70) extending parallel to a plane ({X; Y}), called the "layer plane", the conductive layer (70) having an average spin-orbit coupling strictly less than 136 eV, an average orbital moment diffusion length strictly greater than 10 nm and capable of generating an orbital moment current from a charge current; depositing (101) a magnetic stack (10') on a conductive layer (70), the magnetic stack (10') being intended to form, after etching (104), a magnetic tunnel junction (10);etch (104) the magnetic stack (10') to form a magnetic tunnel junction (10), the etching being carried out through an etching mask, partially etch (103) the conductive layer (70) through the etching mask to form a conductive spacer (30) and keep a part of the conductive layer (70) forming a conductive track (20) in direct contact with the conductive spacer (30), the thickness (h30) of the conductive spacer (30) being less than the average orbital moment diffusion length, the conductive track (20) comprising at least a portion extending parallel to the plane of the layers ({X ; Y}) and directly against the conductive spacer (30).;

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