Electronic system including a means for managing escape and clearance distances

Abstract

Electronic system comprising a means for managing leakage and clearance distances. The invention relates to an electronic system (1) comprising an electronic module (6) and a cooling device (10) comprising a fluid circulation conduit (32) delimited by a heat exchange wall (12) against which the module (6) is attached, the wall (12) having a base (14) and a protrusion (16) thermally connected to the module (6) and allowing it to be positioned at a distance from the base (14) in a vertical direction (V), the electronic system being provided with a means (24) for managing leakage and clearance distances between at least one connection pin (22) of the module and the wall (12), the management means comprising an insulation assembly composed of at least two insulating means of different rigidities, among which a first insulating means (26) is compressed between the base (14) and the module (6),and a second insulating means (28) extends perpendicularly to the vertical direction (V). (Figure 2),

Description

Title of the invention: Electronic system comprising a means for managing flight and clearance distances

[0001] The present invention relates to the field of electronic systems implanted within electric vehicles.

[0002] In current applications, electronic systems comprising power modules are provided to manage electrical voltage and, for example, to manage the transformation of direct current into alternating current in on-board charging devices for motor vehicles.

[0003] These on-board charging devices thus comprise a plurality of electronic systems which can respectively include an electronic module equipped with at least one electrical connection pin intended to be electrically connected with a printed circuit board, an inverter or a DC / DC converter.

[0004] These on-board charging devices comprise one or more power modules, each containing, within its own protective housing, a support and electronic chips fixed to the support and housed within the protective housing. The electrical connection of these chips, via the support, is made by means of electrical connection pins intended to be electrically connected to a printed circuit board, the electrical connection pins passing through the protective housing for this purpose.Since the pins are not electrically insulated at the protruding portion of the protective housing, it is necessary to provide creepage distances (also called “creepage” in English literature) and clearance distances (also called “clearance” in English literature) between each pin and the conductive components located near the power module. Insufficient distances can, at best, lead to electrical interference between these elements and produce undesirable electrical phenomena resulting in a malfunction of the power module, and at worst, cause insulation faults that could, for example, lead to a fire hazard or a risk of electrocution.

[0005] In order to dissipate the heat generated by the power of the electronic module, electronic systems include a cooling device which may, in particular, include a heat exchange wall made of a thermally conductive material. Typically, this material is also electrically conductive, so it is necessary, as mentioned above, to provide leakage distances and clearance distances between the pins and the conductive walls of the cooling device.

[0006] Furthermore, electrical isolation distances must be ensured, since the walls of the cooling device can become coated with a film of water due to condensation. Thus, when the walls are located above the power module, the water can then flow onto it under the effect of gravity and cause various problems.

[0007] The clearance distance corresponds to the shortest distance in air separating these components, while the creepage distance corresponds to the shortest distance measured along an insulating surface arranged between said electrical and / or electronic components. These distances are notably governed by industry standards such as NF EN IEC 60664-1.

[0008] These standards governing these distances define a distance that depends, in particular, on the operating voltage of the electrical and / or electronic components. The higher the voltage of these components, the greater the required leakage and clearance distances. These standards pose challenges because, nowadays, and especially in electric vehicle applications, power modules must be increasingly compact and are designed to handle increasingly higher voltages. This can lead to mechanical space constraints, since choosing to apply large leakage and clearance distances may require excessive spacing between two electrically conductive components, thus limiting miniaturization.

[0009] The objective of the invention described in this document is therefore to overcome the disadvantages of the prior art by proposing an electronic system comprising a housing containing an electronic module and a cooling device. The electronic system is equipped with a means for managing leakage and clearance distances, consisting of at least two insulating elements of different rigidities, thus allowing the use of high voltages while complying with the standards defining the insulation of electrical components, within a reduced overall size of the electronic system.

[0010] The main object of the present invention is thus an electronic system comprising a housing, an electronic module, and a cooling device for said electronic module housed within said housing. The electronic module comprises electronic chips housed in a protective casing and connection pins connected to said chips and passing through the protective casing. The cooling device comprises a fluid circulation conduit delimited at least by a heat exchange wall against which the electronic module is brought. The heat exchange wall is provided with a base and a protrusion thermally connected to the electronic module via a thermal interface material, allowing the electronic module to be positioned at distance from the base in a vertical direction, the electronic system being provided with a means for managing leakage and clearance distances between at least one connection pin of the electronic module and the heat exchange wall, characterized in that the management means comprises an insulation assembly consisting of at least two insulating means of different rigidity, among which a first insulating means is compressed between the base of the heat exchange wall and the electronic module, and a second insulating means extends perpendicularly to the vertical direction.

[0011] The electronic system is specifically designed for use in an on-board charging device for electric vehicles, which converts the alternating current from an individual charging station into a direct current usable for powering the vehicle. To this end, the electronic system comprises a plurality of electronic components housed within a casing, including at least one electronic module whose operation generates a significant amount of heat that must be dissipated outside this casing.

[0012] The casing of the electronic system serves as a means of protection for each of these components and provides means for fixing, in particular, the cooling device.

[0013] The fluid circulating within the circulation duct is, for its part, a heat transfer fluid, which therefore has the capacity to exchange heat with its environment. In this way, it is understood that a heat exchange can take place between the electronic module and the fluid circulating in the circulation duct, via the heat exchange wall.

[0014] For this reason, it is understood that the heat exchange wall, and in particular in the area against which the electronic module is attached, i.e., the protrusion, must be made of a thermally conductive material that is also electrically conductive. Furthermore, at least one pin is made of an electrically conductive material in order to be electrically connected to elements external to the electronic module, for example, a printed circuit board. In this context, interference problems may arise due to excessively short creepage and clearance distances between the at least one pin and the heat exchange wall, hence the usefulness of the creepage and clearance distance management means in order to impose a deviation of the creepage and clearance distances.

[0015] The electronic module has a lower face of the housing which is in direct or indirect contact with the heat exchange wall in a fixing area which is here the protrusion, where appropriate with a thermal interface material between the electronic chips and the outside of the housing in order to increase the heat exchange performance.

[0016] Since the electronic module is positioned away from the base in the vertical direction by means of the protrusion, the electronic chips and the connection pins of this electronic module are arranged away from the heat exchange wall when the lower face of the housing is in contact with the protrusion.

[0017] More specifically, the pins of the electronic module are arranged at a distance from the base of the heat exchange wall in the vertical direction, the vertical direction here being a direction extending between said module and said base of the heat exchange wall, perpendicular to these two objects. It is thus understood that, in the absence of a control means, a gap is formed between the pins of the electronic module and the base of the heat exchange wall. The clearance distance would then extend from the pin to the base of the heat exchange wall through the air via the gap, and the leakage distance would extend from the pin to the protrusion of the heat exchange wall, along an insulating surface of the electronic module. In both cases, in the absence of the control means, these distances would be too short.Furthermore, under the influence of gravity, a thin film of water deposited on the walls of the condensation cooling device is likely to flow onto the power module and damage the electronic system.

[0018] The first insulation means, by being compressed between the base of the heat exchange wall and the electronic module, forms an insulating barrier around the protrusion of this wall. This has the effect, in particular, of lengthening the leakage distance, since the leakage path, from one of the pins, runs along the insulating surface of the electronic module, then along the first insulator without being able to reach the protrusion. The first insulation means also prevents the accumulation of water from condensation under the power module, which improves the reliability of the thermal interface material (TIM) by preventing its immersion in water, for which it is not designed.

[0019] It should be noted that the first insulating means can be compressed directly between the base and the module, or indirectly via another element, for example the second insulating means. This first insulating means is said to be compressed insofar as it exhibits, for example, a stiffness of between approximately 1 and 10 MPa.

[0020] The second insulating means, extending perpendicularly to the vertical direction, extends in the same direction as the base so as to at least partially cover the latter. This has the effect, in particular, of lengthening the previously mentioned leakage distance, since this distance must then run alongside the second insulating means, following the first insulating means, starting on the opposite side of the protrusion. This has also has the effect of lengthening the clearance distance, since it must go around the insulating material of the second insulating means to extend in the air of the spindle until it reaches the base of the heat exchange wall in an area of ​​the base not covered by the second insulating means.

[0021] At the same time, this second means of electrical insulation by thermal insulation effect of the cold walls of the cooling device reduces the phenomenon of condensation during weather conditions favouring this condensation.

[0022] According to an optional feature of the invention, the second insulating means is in contact with the first insulating means and with the base of the heat exchange wall.

[0023] The contact between the first insulating means and the second insulating means ensures continuity of insulation, so that an electric current along the surface of the first insulating means must continue along the surface of the second insulating means, thus lengthening the leakage distance.

[0024] It is understood that the leakage distance is lengthened since after running along the insulating surfaces of the module and the first insulating means, it continues along the second insulating means until it reaches the base of the heat exchange wall in the area not covered by the second insulating means.

[0025] According to an optional feature of the invention, the first insulating means is interposed between the second insulating means and the electronic module.

[0026] It should then be understood that the first insulating means is compressed between the electronic module and the base of the heat exchange wall by means of the second insulating means. In this way, the contact between the first insulating means and the second insulating means is close since the first insulating means is compressed by the second insulating means, which then ensures the continuity of the insulation.

[0027] According to an optional feature of the invention, the first insulating means and the second insulating means are fixed to each other.

[0028] The first insulating means can, for example, be attached to the second insulating means by adhesion. In this case, the first insulating means can be an adhesive applied to the second insulating means after it has been positioned.

[0029] Alternatively, the first insulating means can also be fixed to the second insulating means using fixing means.

[0030] According to an optional feature of the invention, the second insulating means is a plate, a sheet, or a film. The second insulating means may have a constant thickness or a variable thickness.

[0031] The second insulating means is preferably made from fluorinated polymers such as polytetrafluoroethylene (PTFE), polypropylene (PP), Fluoroalkylate (PA), perfluoroalkylate (PFA), fluorinated ethylene propylene (FEP), and tetrafluoroethylene (TFE) are suitable materials. Their use ensures good tracking performance, also known as the Comparative Tracking Index (CTI). Other types of materials can also be used, such as polyester polymers (PET), polystyrene (PS), polyethylene naphthalate (PEN), polypropylene (PPS), polyimide (PI), and similar materials. Alternatively, one or more layers of organic polymers, such as epoxy or silicone resins, deposited as insulating paint, can be used as a secondary insulating medium. Furthermore, one or more layers of organic, hybrid, or inorganic materials can serve as a secondary insulating medium when applied using solution-gel processes.

[0032] The advantage of using inorganic materials deposited by solution-gelation process is that they allow a leakage distance greater than the clearance distance so as to comply with the IEC-60664 standard.

[0033] The second insulating material therefore covers at least part of the base of the heat exchange wall. To achieve this plate shape, the second insulating material must have a certain rigidity and must therefore be more rigid than the first insulating material. For example, the rigidity of the second insulating material is between approximately 10 MPa and 1 GPa if it is an organic polymer, and greater than 1 GPa if it is an inorganic material deposited by a solution-gelation process.

[0034] According to an optional feature of the invention, the first insulating means is in contact with the protrusion of the heat exchange wall.

[0035] It is thus understood that the first insulating means is disposed between the electronic module and the base of the heat exchange wall, while being in contact with the protrusion of this wall, which makes it possible to totally isolate said protrusion.

[0036] Alternatively, the first insulating means could be out of contact with the protrusion. Indeed, the first insulating means allows the leakage distance to be increased as long as it forms a continuous insulation layer by being compressed between the electronic module and the base of the heat exchange wall.

[0037] According to an optional feature of the invention, the first insulating means is in contact with the protrusion of the heat exchange wall so as to ensure the watertightness of the thermal interface material of the electronic module. This makes it possible, in particular, to avoid interference due to the presence of water at the level of the thermal interface material.

[0038] According to an optional feature of the invention, the second insulating means is in contact with the protrusion of the heat exchange wall. In this case, the first insulating means is indirectly compressed between the electronic module and the base via the second insulating means. Conversely, when the second insulating means is not in contact with the protrusion, the first insulating means can be compressed directly between the electronic module and the base of the heat exchange wall.

[0039] According to an optional feature of the invention, the second insulating means extends on both sides of the protrusion of the heat exchange wall.

[0040] The second insulating means can thus consist of two or more plates placed on either side of the protrusion. More particularly, in the case where there are two or more plates, these are placed on the sides of the protrusion where the leakage and clearance distances must be increased.

[0041] The second insulating means may also consist of a single plate completely surrounding the protrusion. In this case, the second insulating means includes an opening allowing at least the passage of the protrusion. When this opening is complementary to the shape of the protrusion, the second insulating means is in contact with the protrusion and must be assembled in the electronic system before the electronic module is assembled onto the protrusion. When the opening has dimensions larger than those of the protrusion, the second insulating means is not in contact with the protrusion.

[0042] According to an optional feature of the invention, the first insulating means and the second insulating means ensure a clearance distance of at least 10 mm between at least one of the connection pins of the electronic module and the heat exchange wall.

[0043] In this way, the clearance distance is extended to correspond to the standards governing this distance, such as ISO 60664. For example, for an 800 V power module, the clearance distance must be greater than 5.6 mm, which is achieved by means of managing leakage and clearance distances according to the invention.

[0044] According to an optional feature of the invention, the first insulating means and the second insulating means ensure a leakage distance of at least 10 mm between one of the connection pins of the electronic module and the heat exchange wall.

[0045] In this way, the leakage distance is lengthened to correspond to the standards governing this distance, such as ISO 60664. For example, for a 1250 V power module, the leakage distance must be 9 mm, which is achieved by means of the leakage and clearance distance management means according to the invention.

[0046] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and examples of embodiments on the other. given for illustrative purposes only and not as an exhaustive list, with reference to the attached drawings, on which:

[0047] [Fig.1] is a perspective view of an electronic system according to a first embodiment of the invention;

[0048] [Fig.2] is a close-up view of a cross-section of the electronic system of the first method of embodiment in a longitudinal and vertical cross-section;

[0049] [Fig.3] is a close-up view of a cross-section of the electronic system of a second embodiment in a longitudinal and vertical section plane similar to that of [Fig.2];

[0050] [Fig.4] is a close-up view of a cross-section of the electronic system of a third embodiment in a longitudinal and vertical cross-section similar to that of [Fig.2]; and

[0051] [Fig.5] is a close-up view of a cross-section of the electronic system of a fourth embodiment in a longitudinal and vertical section plane similar to that of [Fig.2],

[0052] The features and variants of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of the features described below, isolated from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0053] In the figures, the elements common to several figures retain the same reference.

[0054] Fig. 1 is a perspective view of an electronic system 1 according to a first embodiment of the invention.

[0055] The electronic system 1, for example a charging device on board an electric vehicle without this application example being limiting of the invention, includes a housing, not visible here, dimensioned to receive a plurality of electronic components among which there may be coils, transistors or, without limitation, at least one printed circuit board, and among which there are in particular one or more electronic modules 6.

[0056] The electronic system 1 is equipped with a cooling device 10 by circulating coolant, in particular intended for the thermal management of the power modules, which are particularly prone to overheating during their operation.

[0057] The cooling device 10 includes, in particular, a heat exchange wall 12, shown here in [Fig. 1], which helps to define a duct of circulation of heat transfer fluid, and which has a fixing zone for the electronic module 6. This fixing zone also consists of a heat exchange zone, since it is at the level of this exchange zone that heat passes from the electronic module to the heat transfer fluid via the heat exchange wall 12.

[0058] The electronic module 6 includes a protective housing 18 fixed to the cooling device 10. Screws 20 are intended to cooperate with holes formed on the protective housing 18 of the electronic module 6 so as to maintain said electronic module 6 fixed to the cooling device 10.

[0059] The protective housing 18 is also thermally connected to the cooling device 10 via a thermal interface material 16B, also called a thermally conductive interface (TIM), which may be, for example, a gap filler, a gap pad, or a conductive carbon sheet. The cooling device 10 is thus at least partially made of a thermally conductive material, which is often also a thermally conductive material, in order to ensure heat exchange between the protective housing 18 and the cooling device 10.

[0060] The electronic module 6 also includes at least one pin 22, or here a plurality of pins 22, which serve to connect said electronic module 6 to elements external to the electronic system 1, for example a printed circuit board. The pins 22 are therefore made of electrically conductive materials.

[0061] In this context, electrical interference is possible between the pins 22 of the electronic module 6 and the cooling device 10. Indeed, at certain places, the leakage distance and the clearance distance, which correspond respectively to the shortest distance measured along an electrically insulating surface between the pins 22 and the cooling device 10, and the shortest distance in air between the pins 22 and the cooling device 10, may be too short and cause this electrical interference.

[0062] In order to counter this problem, the electronic system 1 includes a means 24 for managing escape and clearance distances.

[0063] The material(s) of the control means 24 are chosen to exhibit a current resistance coefficient that exceeds a given threshold to provide insulation performance allowing for extended creepage and clearance distances. Further details on this control means 24 will be given in the description of the following figures.

[0064] Figure 2 is a close-up view of a cross-section of the electronic system 1 according to the first embodiment in a longitudinal and vertical LV section plane. This LV section plane, shown in Figure 1, extends parallel to a plane in which extends mainly over the protective housing 18 of the electronic module 6, and perpendicularly in a direction extending from one screw 20 to the other.

[0065] The cross-sectional view of [Fig. 2] makes the cooling device 10 particularly visible, as well as its heat exchange wall 12 delimiting the heat transfer fluid circulation duct 32. The heat exchange wall 12 is configured to have a base 14 and a protrusion 16, the protrusion 16 being the part of the heat exchange wall 12 by which the electronic module 6 is thermally connected to the heat exchange wall 12. It is thus understood that the protrusion 16 corresponds here to the heat exchange area described above, and therefore to the area for attaching the electronic module 6 to the heat exchange wall 12.

[0066] The heat exchange wall 12 thus has, in the area where the electronic module covers it, a stepped structure in a vertical direction V perpendicular to a plane in which the base 14 of the heat exchange wall 12 extends. The base 14 is located at a first stage, while the protrusion 16 is located at a second stage in contact with the electronic module 6.

[0067] In other words, since the electronic module 6 is fixed to the protrusion 16, it is understood that the electronic module 6 is disposed at a distance from the base 14 in the vertical direction V.

[0068] In this embodiment, an opening is formed in the heat exchange wall 12, and the cooling device 10 includes an insert 34 configured to close the opening. The insert 34 thus contributes to forming the heat exchange wall 12 by closing the opening. The presence of this insert 34 allows, for example, the use of a material with higher heat exchange properties in the local area.

[0069] It should be noted that what will be described in relation to an insert 34 could be applied to a heat exchange wall 12 of different configuration, without insert 34, provided that the management means 24 as described in the present application is interposed between the pins 22 and the heat exchange wall 12.

[0070] In the illustrated example, since the cooling device 10 includes an insert 34, the base 14 is here partly formed by the insert 34, and it is this insert 34 which includes the protrusion 16. More particularly, at the opening, the heat exchange wall 12 includes a shoulder 40 allowing the insert 34 to be positioned so as to obstruct the circulation duct 32 at the level of the thermal exchange zone formed between the electronic module 6 and the heat exchange wall 12. The insert 34 includes a support portion 42, which is the part of said part bearing on the shoulder 40.

[0071] In this way, when the support part 42 of the insert 34 is positioned on the shoulder 40, the outer face of the heat exchange wall 12 is flush with the external face of the support part 42, so that the assembly of the insert 34 in the opening formed in the heat exchange wall 12 forms a continuous surface corresponding to the base 14 of the heat exchange wall 12.

[0072] In this embodiment, since the insert 34 includes the protrusion 16 and the support part 42 intended to form the base 14, it is understood that this insert 34 also includes a stepped structure, with the support part 42 on the first stage and the protrusion 16 on the second stage, which finally gives its stepped structure to the heat exchange wall 12.

[0073] The protective housing 18 of the electronic module 6 is made of an electrically insulating material. As previously described, the protective housing 18 may include, on a lower face 19 facing the heat exchange wall, a thermal interface material 16B, which protects the electronic chips 54 housed within the housing while providing a heat transfer interface with the transfer zone of the heat exchange wall 12. The electronic chips are electrically connected to pins 22. It should be noted that each electronic chip 54 is the heat-emitting element of the electronic module 6, so it is desirable, as shown in [Fig. 2], that the electronic chips be positioned directly over the flow of the heat transfer fluid within the cooling device 10.

[0074] The protrusion 16 is made of a thermally conductive material. It is in contact with the underside 19 of the housing 18 of the electronic module and, here via the thermal interface material 16B, with the electronic chip 54 by one of its surfaces, and in contact with the heat transfer fluid of the circulation duct 32 by another of its surfaces. In this way, the protrusion 16 allows heat exchange between the electronic chip 54 and the fluid circulating in the circulation duct 32 via the thermal interface material 16B, which makes it possible to dissipate the heat produced by the operation of said electronic chip 54 and thus to efficiently cool the latter.

[0075] The protective housing 18 of the electronic module 6 has a longitudinal dimension DL18, which corresponds to its dimension in a longitudinal direction L, this direction being parallel to the longitudinal plane L and perpendicular to the vertical direction V. The protrusion 16, for its part, has a longitudinal dimension DL16, corresponding to its dimension in the longitudinal direction L. Here, the longitudinal dimension DL18 of the protective housing 18 is greater than the longitudinal dimension DL16 of the protrusion 16. It should be noted that the base 14 also has a longitudinal dimension DL14, which is greater than the longitudinal dimension DL16 of the protrusion 16.

[0076] Due to these longitudinal dimensions DL18, DL16 and DL14 and the positioning of the electronic module 6 at a distance from the base 14 in the vertical direction V, a gap 100 is formed between the electronic module 6 and the base 14 of the heat exchange wall 12.

[0077] In this context, if the leakage and clearance distance management means 24 were not present, the leakage distance between the pins 22 and the protrusion 16 would correspond to the shortest distance between these two elements along an insulating surface of the protective housing 18 of the electronic module 6. The clearance distance would be the distance between the pins 22 and the base 14 of the heat exchange wall 12, passing through the air. These distances, denoted respectively DF1 for the leakage distance without management means 24 and DD1 for the clearance distance without management means 24, are shown in [Fig. 2] for clarity, although this figure shows an electronic system 1 including management means 24, which lengthens these leakage and clearance distances DF1 and DD1.

[0078] The means 24 for managing escape and clearance distances includes an insulation assembly consisting of two insulating means: a first insulating means 26 and a second insulating means 28.

[0079] The first insulating means 26 and the second insulating means 28 are positioned between the base 14 of the heat exchange wall 12 and the electronic module 6. More particularly, in this embodiment, the first insulating means 26 is interposed between the lower face 19 of the electronic module 6 and the second insulating means 28, while the second insulating means 28 is interposed between the first insulating means 26 and the base 14 of the heat exchange wall 12. It is therefore understood that the first insulating means 26 and the second insulating means 28 are arranged at the level of the void space 100 previously defined.

[0080] The first insulating means 26 and the second insulating means 28 have different rigidities. More specifically, the first insulating means 26 has a lower rigidity than the second insulating means 28. Indeed, in this embodiment, the first insulating means 26 has a sausage shape and is compressed between the electronic module 6 and the base 14 of the heat exchange wall 12 by means of the second insulating means 28; it must therefore have a sufficiently low rigidity to be compressed. By way of example, the first insulating means 26 can have a rigidity of between approximately 1 and 10 MPa.

[0081] The second insulating means 28 is a plate of constant thickness, extending perpendicularly to the vertical direction, here along the base 14 so as to cover it. The second insulating means 28 is designed not to deform during use and to maintain a substantially flat shape. By way of example, the second means Insulator 28 can have a stiffness of between 100 MPa and approximately 1 GPa when the material is a polymer, or have a stiffness greater than 1 GPa when it is an inorganic material deposited by solution-gelation process.

[0082] The first insulating means 26 and the second insulating means 28 are made of electrically insulating materials, such as polysiloxane or polyepoxide. An electrically insulating material is understood to mean that the materials of the first and second means have a resistance coefficient to path current beyond a given threshold, which allows for an extension of the leakage and clearance distances.

[0083] In this embodiment, the first insulating means 26 is, in addition to being compressed between the electronic module 6 and the base 14, in contact with the protrusion 16. Furthermore, the second insulating means 28 is also in contact with the protrusion 16. It is thus understood that the first insulating means 26 and the second insulating means 28 surround the protrusion 16, so that it is insulated from the rest of the empty space 100 previously defined.

[0084] In this embodiment, the second insulating means 28 is thus a plate comprising an orifice intended to surround the protrusion 16. The orifice therefore has a shape complementary to that of the protrusion 16, so that the second insulating means 28, at the level of this orifice, is in contact with the protrusion 16. It is understood that the second insulating means 28 is thus arranged on either side of the protrusion 16.

[0085] As an alternative, the second insulating means 28 can also be composed of several parts detachable from each other, allowing the second insulating means 28 to be arranged around the protrusion 16 when assembled.

[0086] It should be noted that the control means 24 can be fixed to the rest of the electronic system 1. More particularly, the second insulating means 28 can, for example, be glued to the base 14 of the heat exchange wall 12 and to the protrusion 16.

[0087] Thanks to this management means 24, formed jointly by the first insulating means 26 and the second insulating means 28, the leakage and clearance distances are deflected and lengthened. The leakage distance, denoted DF2, is then formed by a path running from pin 22 along a surface of the housing 18, and in particular the lower face 19 of the housing 18 which helps to define the gap 100, then along a surface of the first insulating means 26, namely the convex shape of the first insulating means 26 which remains unobstructed, i.e. in contact neither with the housing 18, nor with the protrusion 16, nor with the support portion 42 intended to form the base 14. This leakage distance DF2 then runs along a surface of the second insulating means 28, towards a free end edge opposite the protrusion 16, the latter being covered by the first insulating means 26, before reaching the heat exchange wall thermal 12 bypasses this free end edge. The clearance distance, denoted DD2, is formed by a path passing through the air between the pin 22 and the heat exchange wall 12, this path being lengthened to bypass the second insulating element 28 and its free end edge. It is understood that this clearance distance DD2, as well as the leakage distance DF2, is further lengthened if the second insulating element 28 has a free end edge that extends beyond the base 14 of the heat exchange wall 12.

[0088] It is thus observed that the management means 24, thanks to its first insulating means 26 and its second insulating means 28, considerably lengthens the leakage and clearance distances between electrical components that can interfere within the electronic system 1, so as to comply with the standards defining these distances.

[0089] Fig. 3 is a close-up view of a section of an electronic system 1 according to a second embodiment in a longitudinal and vertical LV section plane.

[0090] The electronic system of this second embodiment differs from that which has just been previously described in that the first insulating means 26 is not interposed between the second insulating means 28 and the electronic module 6.

[0091] Indeed, here, the first insulating means 26 is compressed directly between the electronic module 6, and in particular the lower face 19 of the housing 18 of this electronic module, and the base 14 of the heat exchange wall 12. The first insulating means 26 is also in contact with the protrusion 16. It is thus understood that the first insulating means 26 is in direct contact with the electronic module 6, the base 14 and the protrusion 16.

[0092] The second insulating means 28, for its part, is arranged to surround the first insulating means 26. More particularly, the second insulating means 28 is in contact with the first insulating means 26 in such a way that, when an electric current runs along the first insulating means 26, it then runs along the second insulating means 28 without having the opportunity to reach the base 14 of the heat exchange wall 12. The leakage and clearance distances corresponding to this embodiment are represented in [Fig.3] by the references DF3 and DD3.

[0093] Fig. 4 is a close-up view of a section of an electronic system 1 according to a third embodiment in a longitudinal and vertical LV section plane.

[0094] In this third embodiment, and in accordance with what has been described for the second embodiment, the second insulating means 28 is not interposed between the first insulating means 26 and the base 14, so that the first insulating means 26 is compressed directly between the electronic module 6 and the base 14 of the heat exchange wall 12. The electronic system according to the third embodiment differs from the above in that the first insulating means 26 is not in contact with the protrusion 16 and is disposed at a distance from it. The second insulating means 28 is arranged around the first insulating means 26 and is in contact with it, in a manner similar to the second embodiment.

[0095] It is thus understood that, in this configuration, the electric current cannot pass inside the previously defined empty space 100, since it is blocked by the first insulating means 26, provided that this first insulating means 26 is well compressed between the lower face 19 of the housing 18 of the electronic module 6 and the base 14, and the second insulating means 28. The leakage and clearance distances corresponding to this third embodiment are represented in [Fig. 4] by the references DF4 and DD4, and are lengthened and deflected in accordance with the above, so that the electric currents must bypass the free end of the second insulating means 28 to reach the heat exchange wall 12.

[0096] In each of the first three embodiments illustrated and described, the first insulating means 26 and the second insulating means 28 can form a single unit, suitable for assembly in a single operation during the assembly of the electronic system. In this context, the first insulating means 26 can be bonded to the second insulating means 28 so that the resulting unit can be easily handled and positioned around the protrusion in the desired position according to the embodiment implemented. In addition to the resulting simplification of the process, it should be noted that this ensures a seal between the insulating means, preventing the passage of electrical current between them once assembled.

[0097] Alternatively, it can be envisaged that the insulating means are arranged one after the other in the desired position, and that it is the fixing of the electronic module 6 on the protrusion 16, tending to compress the first insulating means 26 and to spread it out, which ensures the good connection between the two insulating means and their cooperation in the sense of the invention to deflect and lengthen the leakage and clearance distances.

[0098] Fig. 5 is a close-up view of a section of an electronic system 1 according to a fourth embodiment in a longitudinal and vertical LV section plane.

[0099] In this fourth embodiment, the first insulating means 26 and the second insulating means 28 are arranged similarly to the first embodiment, with the first insulating means 26 interposed, along the protrusion 16, between the electronic module 6 and the second insulating means 28.

[0100] The electronic system according to this fourth embodiment differs from that previously described in that the first insulating means 26 is here an adhesive that has been arranged as a seal around the protrusion 16 so as to be in contact with the protrusion 16, the electronic module 6, and the second insulating means 28. The leakage and clearance distances corresponding to this fourth embodiment are represented in [Fig. 5] by the reference numerals DF5 and DD5 and may to be considered as the leakage and clearance distances DF2 and DD2 of the first embodiment.

[0101] In this embodiment, unlike previous embodiments, the first insulating means 26 is formed after the second insulating means 28 and the electronic module 6 are already positioned. This ensures that the adhesive is properly injected into the bottom of the gap 100, against the protrusion 16, and fills the gap 100 completely.

[0102] As described above, the present invention achieves its intended purpose by providing an electronic system comprising, in particular, an electronic module, a cooling device, and a means for managing leakage distances equipped with a first insulating means and a second cooperating insulating means to extend the leakage and clearance distances between this electronic module and the cooling device. Thanks to these features, it is thus possible to use an electronic module in the electronic system without risking electrical / electronic interference problems between said module and the cooling device.

[0103] The present invention is not limited to the means and configurations described and illustrated herein and also extends to any equivalent means and configuration as well as to any technically operative combination of such means.

Claims

Demands

1. Electronic system (1) comprising a housing and an electronic module (6) and a cooling device (10) for said electronic module (6) which are housed in said housing, the electronic module (6) having electronic chips (54) housed in a protective housing (18) and connection pins (22) connected to said chips (54) and passing through the protective housing (18), the cooling device (10) comprising a fluid circulation conduit (32) delimited at least by a heat exchange wall (12) against which the electronic module (6) is attached, the heat exchange wall (12) having a base (14) and a protrusion (16) thermally connected to the electronic module (6) via a thermal interface material (16B) and allowing the electronic module (6) to be positioned at a distance from the base (14) in a vertical direction (V),the electronic system (1) being provided with a means (24) for managing leakage and clearance distances between at least one connection pin (22) of the electronic module (6) and the heat exchange wall (12), characterized in that the management means (24) comprises an insulation assembly composed of at least two insulating means of different rigidities, among which a first insulating means (26) is compressed between the base (14) of the heat exchange wall (12) and the electronic module (6), and a second insulating means (28) extends perpendicularly to the vertical direction (V).

2. Electronic system (1) according to claim 1, wherein the second insulating means (28) is in contact with the first insulating means (26) and with the base (14) of the heat exchange wall (12).

3. Electronic system (1) according to claim 2, wherein the first insulating means (26) is interposed between the second insulating means (28) and the electronic module (6).

4. Electronic system (1) according to any one of claims 2 or 3, wherein the first insulating means (26) and the second insulating means (28) are fixed to each other.

5. Electronic system (1) according to any one of claims 1 to 4, wherein the second insulating means (28) is a plate, a sheet or a film.

6. Electronic system (1) according to any one of claims 1 to 4, wherein the second insulating means (28) is one or more layers of organic polymers deposited as insulating paint.

7. Electronic system (1) according to any one of claims 1 to 4, wherein the second insulating means (28) is one or more layers of inorganic insulating material deposited by solution-gelation processes.

8. Electronic system (1) according to any one of claims 1 to 7, wherein the first insulating means (26) is in contact with the protrusion (16) of the heat exchange wall (12).

9. Electronic system (1) according to any one of claims 1 to 8, wherein the first insulating means (26) is in contact with the protrusion (16) of the heat exchange wall (12) so as to ensure the water tightness of the thermal interface material (16b) of the electronic module (6).

10. Electronic system (1) according to any one of claims 1 to 9, wherein the second insulating means (28) is in contact with the protrusion (16) of the heat exchange wall (12).

11. Electronic system (1) according to any one of claims 1 to 10, wherein the second insulating means (28) extends on either side of the protrusion (16) of the heat exchange wall (12).

12. Electronic system (1) according to any one of claims 1 to 11, wherein the first insulating means (26) and the second insulating means (28) ensure a clearance distance of at least 10 mm between at least one of the connection pins (22) of the electronic module (6) and the heat exchange wall (12).

13. Electronic system (1) according to any one of claims 1 to 12, wherein the first insulating means (26) and the second insulating means (28) ensure a leakage distance of at least 10 mm between one of the connection pins (22) of the electronic module (6) and the heat exchange wall (12).

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