Climate control system

Abstract

A climate control board comprises an insulating board 910 and water proofing 920. The insulating board includes at least one channel 155 to retain at least one pipe. The climate control board is to be positioned on an external wall or roof of a building. In use, a working fluid can be heated or cooled, ideally by a heat pump, and passed through the board to heat / cool the external wall or roof of the building and so heat / cool the interior of the building. A method of heating / cooling a building using a radiant heating / cooling system positioned externally on an external wall or roof of the building, and an insulating board, are also claimed.

Description

TECHNOLOGICAL FIELD Examples of the disclosure relate to a climate control system. Some relate to climate control boards which may be positioned on the exterior of a building to heat or cool the building. BACKGROUND Climate control systems control the indoor climate of a building. Radiant heating and cooling is a form of central heating and cooling that achieves indoor climate control for thermal comfort. This can be achieved by the use of pipes embedded in a floor or wall where the pipes contain a heated or cooled liquid, such as water. Radiant heating and cooling is sometimes called underfloor heating and cooling. Despite the name, in radiant heating and cooling, heat transfer is achieved by conduction, radiation and convection. In some instance pipes are clipped to a surface, screed is then pored over the pipes and it is left to cure to form the room’s floor. This can lead to a very slow installation process. Additionally screed cannot be used for walls or for certain types of floors. In some instances boards, such as floor boards or wall panels, are used which contain channels for the pipes of the underfloor heating and cooling system. Board of the same design are used by tessellating the board across the desired area. These boards allow only a limited number of layout of pipes to be used, which potentially leads to less efficient heating and cooling. Radiant heating and cooling can be particularly suited for heat pump systems due to the lower maximum water temperatures outputted by heat pump systems. Radiant heating and cooling may take up a significant amount of heat on the inside of buildings. BRIEF SUMMARY According to various, but not necessarily all, examples there is provided a climate control board comprising an insulating board and water proofing. The insulating board comprises at least one channel for at least one heating and / or cooling pipe. The climate control board is for radiant heating and / or cooling and is configured to be positioned on an external wall or roof of a building in order to heat and / or cool the building. The climate control board may further comprise the at least one pipe. The at least one pipe may be for a liquid to heat or cool the building. The at least one pipe may be positioned within the at least one channel. The waterproofing may comprise a waterproof layer, coating, trim or seal. The climate control board may have a first side configured to substantially face towards the building when the board is positioned on the building, and a second side configured to substantially face away from building when the board is positioned on the building. The insulating board might not cover the channel on the first side. The insulating board might not be positioned between the channel and the building. The climate control board may further comprise a conductive material. The conductive material may be positioned at least partially between the channel and the building. The conductive material may be configured to contact the building when the board is positioned on the building. The conductive material may at least partially surround the at least one pipe. The conductive material may be a liquid conductive material which is applied to the board. The liquid conductive material may be initially liquid and then may solidify to form a solid conductive material. The conductive material may comprise latex or cement, or metal foil. The at least one channel for the at least one pipe may comprise at least one recess for the conductive material. The at least one channel for the at least one pipe may comprise serrations for the conductive material. The insulation board may comprise at least one additional channel which does not comprise a pipe. The at least one additional channel may be for the conductive material. The at least one additional channel may be contiguous with the at least one channel. The at least one recess, serrations and / or at least one additional channel may comprise conductive material. The climate control board may comprise a groove at least partially around the perimeter of the board. The climate control board may form at least part of the external cladding of the building. The climate control board may further comprise a C section support comprising spikes positioned on the rear side of the C section support. The spikes may be for connecting the C section support and insulating board. The at least one pipe may form at least part of a pipe layout comprising one or more flow circuits for a radiant heating and cooling system According to various, but not necessarily all, examples there is provided a radiant heating and cooling system comprising at least two climate control boards. The radiant heating and cooling system may be prefabricated, with the at least two boards being joined together prior to installation on the building. According to various, but not necessarily all, examples there is provided a radiant heating and cooling system positioned externally to the building on at least one external wall or roof of the building, and configured to heat and / or cool the building by heat passing through the wall or roof of the building. The radiant heating and cooling system may comprise at least one climate control board. According to various, but not necessarily all, examples there is provided a method comprising: heating or cooling a building from outside using a radiant heating and cooling system positioned externally to the building on at least one external wall or roof of the building, wherein the radiant heating and cooling system is configured to heat and / or cool the building by heat passing through the wall or roof of the building. According to various, but not necessarily all, examples there is provided an insulating board comprising: a first layer comprising an insulating material; and a second layer comprising foam, sponge, rubber or other soft material. The second layer is lower density than the first layer. The insulating board is configured to be positioned on a wall or roof of a building in order to insulate the building. According to various, but not necessarily all, examples there is provided a method for manufacturing underfloor heating boards. The method comprises: determining room information of a room of a building; determining a pipe layout of underfloor heating pipes for the room, based at least in part on the determined room information; determining a board layout of underfloor heating boards for the room, based at least in parton the pipe layout, where the underfloor heating boards comprise channels for the underfloor heating pipes; and determining a plurality of underfloor heating board designs based at least in part on the board layout. The pipe layout may comprise a layout of pipes for an underfloor heating system. The board layout may comprise a layout of boards and channels within the boards. The channels may be for the pipes. The pipe layout may comprise one or more flow circuits for an underfloor heating system. The pipes may be heating and / or cooling pipes fora liquid, and the underfloor heating system may comprise a heat pump for heating or cooling the liquid. The room information may comprise at least one of: room layout, dimensions of the room, insulation of the room, wall information, furniture information, floor information, heat requirement information, and window information. Determining the room information of a room of a building may comprise receiving at least part of the room information from a database, receiving at least part of the room information from user input, determining at least part of the room information from a floor plan, determining at least part of the room information using a laser distance measurer, and / or determining at least part of the room information using computer vision. Determining a pipe layout may be further based on at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature, desired separation from walls, and desired separation from furniture. Determining a pipe layout may comprise determining at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature, desired separation from walls, and desired separation from furniture. Determining a pipe layout may comprise determining that some regions of the pipe layout are to have a different pipe spacing, pipe type, pipe diameter, and / or pipe material than others. Determining a pipe layout may comprise determining a pipe layout with a pipe spacing of less than 150 mm. Determining a pipe layout may comprise determining a pipe layout in which the turning radius of the pipes is greater than a threshold. The threshold may be based at least in part on a pipe type, pipe material and / or pipe diameter. Determining a pipe layout may comprise determining areas where the pipes are not allowed to go. Determining a pipe layout may comprise determining a pipe layout which provides a heat level above a threshold. The room may be divided into regions and determining a pipe layout may comprise determining a pipe layout which provides each region of the room with a heat level above a threshold. Determining a pipe layout may comprises determining the exit and entry points for a pipe circuit. Determining a board layout may comprise determining a board layout in which the edges of the boards only cross the pipes when the edges are substantially perpendicular to the pipes. Determining a board layout may comprise determining a board layout in which, outside of places where the edges cross the pipes, the edges of the boards have a separation of at least 10 mm from pipes. Determining a board layout may comprise determining a board layout in which over 50% of the edges of the boards are substantially parallel to the closest pipe. Determining a board layout may comprise aligning the longest edge of more than 50% of the boards with the longest wall of the room. Determining a pipe layout, determining a board layout and / or determining a plurality of underfloor heating board designs may comprise the use of machine learning. The method may further comprise: initiating manufacture of a plurality of underfloor heating boards based at least in part on the plurality of underfloor heating board designs. Initiating manufacture of a plurality of underfloor heating boards may comprise sending the plurality of underfloor heating board designs to a CNC machine. Initiating manufacture of a plurality of underfloor heating boards may comprise using computer numerical control (CNC) to cut, machine and / or mill the plurality of underfloor heating boards, based at least in part on the plurality of underfloor heating board designs. The method may further comprise: determining a plurality of pipe layouts of underfloor heating pipes for the room, based at least in part on the determined room information; presenting the plurality of pipe layouts to a user; receiving user input selecting a pipe layout of the plurality of pipe layouts; and determining the board layout of underfloor heating boards for the room, based at least in part on the selected pipe layout. According to various, but not necessarily all, examples there is provided computer program instructions for causing an apparatus to perform at least the following or for performing at least the following: determining room information of a room of a building; determining a pipe layout of underfloor heating pipes for the room, based at least in part on the determined room information; determining a board layout of underfloor heating boards for the room, based at least in part on the pipe layout, where the underfloor heating boards comprise channels for the underfloor heating pipes; and determining a plurality of underfloor heating board designs based at least in part on the board layout. According to various, but not necessarily all, embodiments there is provided an apparatus comprising at least one processor; and at least one memory including computer program code; the at least one memory storing instructions that, when executed by the at least one processor, cause the apparatus to perform at least a part of one or more methods described herein. According to various, but not necessarily all, embodiments there is provided an apparatus comprising means for performing at least part of one or more methods described herein. The description of a function and / or action should additionally be considered to also disclose any means suitable for performing that function and / or action. Functions and / or actions described herein can be performed in any suitable way using any suitable method. According to various, but not necessarily all, embodiments there is provided examples as claimed in the appended claims. While the above examples of the disclosure and optional features are described separately, it is to be understood that their provision in all possible combinations and permutations is contained within the disclosure. It is to be understood that various examples of the disclosure can comprise any or all the features described in respect of other examples of the disclosure, and vice versa. Also, it is to be appreciated that any one or more or all the features, in any combination, may be implemented by / comprised in / performable by an apparatus, a method, and / or computer program instructions as desired, and as appropriate. The description of a function should additionally be considered to also disclose any means suitable for performing that function. According to various, but not necessarily all, embodiments there is provided an apparatus comprising at least one processor; and at least one memory including computer program code; the at least one memory storing instructions that, when executed by the at least one processor, cause the apparatus to perform at least a part of one or more methods described herein. According to various, but not necessarily all, embodiments there is provided an apparatus comprising means for performing at least part of one or more methods described herein. The description of a function and / or action should additionally be considered to also disclose any means suitable for performing that function and / or action. Functions and / or actions described herein can be performed in any suitable way using any suitable method. According to various, but not necessarily all, embodiments there is provided examples as claimed in the appended claims. While the above examples of the disclosure and optional features are described separately, it is to be understood that their provision in all possible combinations and permutations is contained within the disclosure. It is to be understood that various examples of the disclosure can comprise any or all the features described in respect of other examples of the disclosure, and vice versa. Also, it is to be appreciated that any one or more or all the features, in any combination, may be implemented by / comprised in / performable by an apparatus, a method, and / or computer program instructions as desired, and as appropriate. The description of a function should additionally be considered to also disclose any means suitable for performing that function. BRIEF DESCRIPTION Some examples will now be described with reference to the accompanying drawings in which: Fig. 1 shows a first example of a pipe layout and a first example of a board layout for an underfloor heating system; Fig. 2 shows a second example of a pipe layout and a second example of a board layout for an underfloor heating system; Fig. 3 shows an example of a room; Fig. 4 shows examples of board designs; Fig. 5 shows a first example of a method; Fig. 6 shows a second example of a method; Fig. 7 shows an example of a controller; Fig. 8 shows an example of a delivery mechanism; Figs 9a and 9b show an example of a climate control board; Fig. 10 shows an example of a radiant heating and cooling system; Fig. 11 shows a further example of a radiant heating and cooling system; Fig. 12 shows another example of a radiant heating and cooling system; Fig. 13 shows another example of a radiant heating and cooling system; Fig. 14 shows an example of a climate control board coupled to a wall of a building; Fig. 15 shows a further example of a climate control board coupled to a wall of a building; Fig. 16 shows another example of a climate control board coupled to a wall of a building; Figs 17 and 18 show further examples of a climate control board; Fig. 19 shows another example of a climate control board; Fig. 20 shows another example of a climate control board; Fig. 21 shows an example of a C section support; Fig. 22 shows an example of a climate control system comprising climate control boards and C section supports; Fig. 23 shows another example of a climate control board coupled to a wall of a building; Fig. 24 shows an alternative example of a climate control board coupled to a wall of a building; and Fig. 25 shows an example of an insulation board coupled to a wall of a building. The figures are not necessarily to scale. Certain features and views of the figures can be shown schematically or exaggerated in scale in the interest of clarity and conciseness. For example, the dimensions of some elements in the figures can be exaggerated relative to other elements to aid explication. Similar reference numerals are used in the figures to designate similar features. For clarity, all reference numerals are not necessarily displayed in all figures. DETAILED DESCRIPTION Boards for an underfloor heating system Fig. 1 shows a first example of a pipe layout 100 and a first example of a board layout 150 for an underfloor heating system, according to embodiments of the disclosure. Fig. 2 shows a second example of a pipe layout 200 and a second example of a board layout 250 for an underfloor heating system, according to embodiments of the disclosure. For each figure, the pipe layout 100, 200 and board layout 150, 250 are for pipes 105 and boards I panels 152 for a room. The pipe layout 100, 200 may be considered to be overlaid on the board layout 150, 250. The board layout 150, 250 may be considered to comprise the pipe layout 100, 200. Fig. 3 shows an example of a room 50 according to embodiments of the disclosure. On the floor of the room 50 are a plurality of boards 152 which together produce a board layout 350. The boards 152 comprise channels 155 which define a pipe layout 300, however pipes 105 are not currently present within the channels 155. In some examples the board layout 150, 250, 350 and the pipe layout 100, 200, 300 may be for multiple rooms 50, such as a series of rooms 50 of a building. The underfloor heating system may a heating system, a cooling system or a heating and cooling system. Despite the name, an underfloor heating system may be for a floor, a wall and / or a roof. A floor may be the ground. The underfloor heating system may be considered to be a building fabric based heating and / or cooling system, where building fabric includes floors, walls or roofs. As such the term underfloor heating system may be replaced throughout the specification by the above term. The underfloor heating system supplies a liquid to the pipes 105. The liquid may comprise water and may also comprise an antifreeze additive such as propylene glycol. As such the underfloor heating system may be a hydronic system. The liquid can be considered to be a heat transfer fluid. The underfloor heating system comprises a heater and / or cooler for heating or cooling the liquid. In some examples underfloor heating system comprises a heat pump for heating or cooling the liquid. The liquid travels in a closed-loop between the heater / cooler and the pipes 105. The pipes 105 are heating and / or cooling pipes 105 for the liquid. When used for heating, heat from liquid within the pipes 105 escapes into the room 50, thus heating the room 50. When used for cooling, heat from the room 50 is captured by the liquid within the pipes 105, thus cooling the room 50. The underfloor heating system may comprise the pipes 105. The pipes 105 may any suitable type and may be comprised of any suitable material, for example a plastic, such as polyethylene, a metal, such as steel, or a rubber such as a synthetic rubber. The pipes 105 may be any suitable diameter, such as 25 mm. The pipes 105 may be considered to be multiple pipes 105 or multiple sections 105 of a single pipe. The boards 152 may be considered to be underfloor heating boards 152. In some examples the boards 152 are insulating boards 152. The boards 152 may be comprised of an engineered wood such as chip board, plywood, or medium-density fibreboard. In some examples, the boards 152 comprise another type of wood or polystyrene. The boards 152 are substantially flat. A board 152 may be defined by its edges 154. Ina board layout 150, 250, 350, boards 152 are adjacent to neighbouring boards 152 and edges 154 may be between neighbouring boards 152. The boards 152 comprise channels 155 for pipes 105. The channels 155 are for holding I suspending pipe 105. In some examples a channel 155 is for a single pipe 105 and the channel 155 has a width slightly larger than the diameter of the pipe 105. As can be seen in Figs 1 and 2, in some examples not all boards 152 comprise channels 155. This could be useful for boards 152 in a kitchen on which kitchen appliances such a refrigerator may be placed. In some examples, at least some of the boards 152 comprise multiple channels 155 and so can host multiple pipes 105 or sections of pipe 105. In some examples the boards 152 may comprise multiple layers. A board 152 may comprise one or more layer which covers the channel 155. In such examples the top layer may comprise channel markings which indicate the location of channels 155 and pipes 105 underneath the top layer. The channel markings may be printed. The top layer may comprise plywood. The pipe layout 100, 200, 300 comprises the layout of pipes 105, including the location and orientation of pipes 105. The pipe layout 100, 200, 300 comprises the pathways of pipes 105. The pipe layout 100, 200, 300 may also comprise other details of the pipes 105 such as pipe spacing, pipe type, pipe diameter and / or pipe material. Pipe spacing is the distance between a pipe 105 and neighbouring pipes 105. The pipe layout 100, 200, 300 comprises a layout of pipes 105 for an underfloor heating system. The pipe layout 100, 200, 300 comprises one or more flow circuits for an underfloor heating system. In some examples, a pipe layout 100, 200, 300 comprises multiple flow circuits. In some examples, the multiple flow circuits are for different rooms 50 or for different areas I regions of a room 50. The pipe layouts 100, 200, 300 of Figs 1,2 and 3 comprise a counterflow spiral pattern of pipes 105. In other examples different patterns may be used such as serpentine or double serpentine. In the examples of Figs 1 and 2, the pipe layout 100, 200 comprises the entry point 110 and exit point 112 where the pipes 105 will connect to a heater and / or cooler. In the illustrated examples, the pipe layout 100, 200, 300 comprises a central ornament 108, after which the liquid is closer to the exit point 112 than the entry point 110. The board layout 150, 250, 350 comprises a layout of boards 152 and channels 155 within the boards 152. The board layout 150, 250, 350 may be considered to comprise a layout of the edges 154 of boards 152 and a layout of channels 155 within the boards 152. Fig. 4 shows examples of board designs 160 according to embodiments of the disclosure. A plurality of underfloor heating board designs 160 are determined based at least in part on the board layout 150, 250, 350. The illustrated underfloor heating board designs 160 comprise channels 155 for pipes 105 from the pipe layout 100, 200, 300 and are defined by edges 154 from the board layout 150, 250, 350. The board designs 160 are designs for individual boards 152. The individual board designs 160 may form part of a larger sheet of board designs 160. In the illustrated example, the middle board design 160 shows a cut line 162. Boards 152 produced from the board designs 160 are bespoke to a room. Fig. 5 shows a first example of a method 500 according to embodiments of the disclosure. The method 500 is a method 500 for manufacturing underfloor heating boards 152. The method 500 may be computer implemented. At block 502, the method 500 comprises: determining room information of a room 50 of a building. In some but not necessarily all examples, the room information comprises at least one of: room 50 layout, dimensions of the room 50, insulation of the room 50, wall information, furniture information, floor information, heat requirement information, and window information. The window information may comprise information about window position, window size, and / or window type. In some examples, determining the room information of a room 50 comprises receiving at least part of the room information such as receiving at least part of the room information from a database and / or receiving at least part of the room information from user input. In some examples, determining the room information comprises determining at least part of the room information from a floor plan or other image, determining at least part of the room information using a laser distance measurer and / or determining at least part of the room information using computer vision. At least part of the room information may be determined from a photograph and / or a video of the room 50. At block 504, the method 500 comprises: determining a pipe layout 100, 200, 300 of underfloor heating pipes 105 for the room 50, based at least in part on the determined room information. Determining a pipe layout 100, 200, 300 may be creating a pipe layout 100, 200, 300. In some but not necessarily all examples, determining a pipe layout 100, 200, 300 is further based on at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature (such as the maximum temperature of the heater), desired separation from walls, and desired separation from furniture. This additional information may be received, such as from a database or from user input. In some examples, determining a pipe layout 100, 200, 300 comprises determining at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature, desired separation from walls, and desired separation from furniture. In some examples this additional information is determined and then it is used in determining a pipe layout 100, 200, 300. In some examples, determining a pipe layout 100, 200, 300 comprises determining a pipe layout 100, 200, 300 with a pipe spacing of less than 150 mm, such as less than 120 mm, less than 100 mm, or less than 80 mm. The bespoke design and machining of boards 152 permits closer spacing of pipes 105, which can lead to more efficient heating and cooling, as well as more uniform heating and cooling for a room 50. In some examples, determining a pipe layout 100, 200, 300 comprises determining a pipe layout 100,200, 300 in which the turning / bending radius of the pipes 105 is greater than a threshold. The threshold may be based at least in part on the pipe type, pipe material and / or pipe diameter. For example, the radius of turning / bending of the pipes 105 may be greater than 1 cm, such as greater than 2 cm, or greater than 3 cm. This avoid damage to the pipe 105. In some examples, determining a pipe layout 100,200, 300 comprises determining the friction of at least one pipe 105. This can be based at least in part on the pipe type, material and / or diameter. In some examples, determining a pipe layout 100, 200, 300 comprises determining the total length of the pipes 105, and / or the total length of pipes 105 within a flow circuit. In some examples, determining a pipe layout 100, 200, 300 comprises determining areas where the pipes 105 are not allowed to go, such as where there is furniture, kitchen islands, or where the floor is unsuitable. In some examples, determining a pipe layout 100, 200, 300 comprises determining the exit and entry points 112, 110 for a pipe flow circuit. In some examples, a pipe layout 100, 200, 300 comprises multiple flow circuits and determining a pipe layout 100, 200, 300 comprises dividing a room 50 into single circuit areas I regions. In some examples, determining a pipe layout 100, 200, 300 comprises determining a heat output. This may be the total heat output for a room 50 or flow circuit. Alternatively with may be the heat out per area of the room 50 or per length of pipe 105. Determining a pipe layout 100, 200, 300 may comprise determining a pipe layout 100, 200, 300 which provides a heat level above a threshold. In some examples, determining a pipe layout 100, 200, 300 comprises determining regions of a room 50 and corresponding regions of a pipe layout 100, 200, 300. This can involve dividing the room 50 into regions. For example, dividing a room 50 into 2 to 16 regions. Determining a pipe layout 100, 200, 300 may comprise determining that some regions of the pipe layout 100, 200, 300 are to have a different pipe spacing, pipe type, pipe diameter, and / or pipe material than others. For example it may be determined that pipe spacing should be larger nearer to the entry point 110 where the liquid will be warmer, and that pipe spacing should be smaller nearer to the exit point 112 where the liquid is cooler. In some examples, it may be determined that pipe spacing should be smaller near to windows or walls with poor insulation in order to compensate for the higher heat loss. These can lead to a more uniform heat distribution in the room 50. In some examples determining a pipe layout 100, 200, 300 comprises determining a pipe layout 100, 200, 300 which provides each region of the room 50 with a heat level above a threshold. In some examples determining a pipe layout 100, 200, 300 comprises determining a pipe layout 100,200, 300 which minimises the length of pipe 105 whilst meeting certain criteria. For example, determining a pipe layout 100, 200, 300 which minimises the length of pipe 105 whilst providing a heat level above a threshold and / or providing each region of the room 50 with a heat level above a threshold. In some examples determining a pipe layout 100,200, 300 comprises specifying pipes 105 based on where the pipes 105 are turning. At block 506, the method 500 comprises: determining a board layout 150, 250, 350 of underfloor heating boards 152 for the room 50, based at least in part on the pipe layout 100, 200, 300, where the underfloor heating boards 152 comprise channels 155 for the underfloor heating pipes 105. Determining a board layout 150, 250, 350 may be creating a board layout 150, 250, 350. In some but not necessarily all examples, determining a board layout 150, 250, 350 comprises determining a board layout 150, 250, 350 in which the edges 154 of the boards 152 will only cross the pipes 105 I channels 155 when the edges 154 are substantially perpendicular to the pipes 105 / channels 155. In some examples, determining a board layout 150, 250, 350 comprises determining a board layout 150, 250, 350 in which, outside of places where the edges 154 cross the pipes 105, the edges 154 of the boards 152 have a separation of at least 5 mm from pipes 105, such as least 10 mm, at least 20 mm or at least 30 mm. This helps to ensure that pipes 105 have sufficient support and insulation. In some examples, determining a board layout 150, 250, 350 comprises determining a board layout 150, 250, 350 in which, over 50% of the edges 154 of the boards 152 are substantially parallel to the closest pipe 105 / channel 155. In some examples, determining a board layout 150, 250, 350 comprises aligning the longest edge 154 of more than 50% of the boards 152 with the longest wall of the room 50. This may comprise determining the longest edge 154 for the boards 152 and determining the longest wall of the room 50. Determining a board layout 150, 250, 350 may comprise placing a first board 152 in the board layout 150, 250, 350 and iteratively placing subsequent boards 152 until the board layout 150,250, 350 covers the entire room 50 or the desired portion of the room 50. For example the first board 152 may be placed in a corner and subsequent boards 152 may be placed in a raster pattern, in rows, starting with the longest side of the room 50. For a subsequent row of boards 152, their short edges 154 may be may be offset from the short edges 154 of the previous row, such as being offset by 50% of the size of the long edge 154. In some examples, boards 152 are substantially rectangular. Rectangular includes square. In some examples more than 80% of boards 152 are substantially rectangular; for example substantially all of the boards 152 may be substantially rectangular. In other examples boards 152 may be different shapes. In rooms 50 with non-parrel walls some boards 152 may be rectangular whilst other boards 152 may be other forms of quadrilaterals and / or may be triangular. Determining a board layout 150,250, 350 may comprise determining a board layout 150, 250, 350 where the lateral dimensions of boards 152 are within a certain range. In some examples, determining a board layout 150,250, 350 comprises placing boards 152 such that their long edges 154 are substantially aligned with neighbouring boards 152 and their short edges 154 are offset from neighbouring boards 152. For a board 152 the short edge 154 may be perpendicular to long edge 154. At block 508, the method 500 comprises: determining a plurality of underfloor heating board designs 160 based at least in part on the board layout 150, 250, 350. Determining a plurality of underfloor heating board designs 160 may be creating a plurality of underfloor heating board designs 160. In some examples determining a pipe layout 100, 200, 300, determining a board layout 150, 250, 350 and / or determining a plurality of underfloor heating board designs 160 comprises the use of machine learning. The method 500 may optionally comprise, at block 510, initiating manufacture of a plurality of underfloor heating boards 152 based at least in part on the plurality of underfloor heating board designs 160. Initiating manufacture of a plurality of underfloor heating boards 152 can be performed automatically without any need for human input. In some examples, initiating manufacture of a plurality of underfloor heating boards 152 comprises sending the plurality of underfloor heating board designs 160 to a CNC machine. In some examples, initiating manufacture of a plurality of underfloor heating boards 152 comprises using computer numerical control (CNC) to cut, machine and / or mill the plurality of underfloor heating boards 154, based at least in part on the plurality of underfloor heating board designs 160. For example, initiating manufacture of a plurality of underfloor heating boards 152 may comprise cutting the boards 154 to have the designed edges 154 and creating channels 155 within the boards 152. In some examples, initiating manufacture of a plurality of underfloor heating boards 152 comprises the use of 3D printing to produce the plurality of underfloor heating boards 152, based at least in part on the plurality of underfloor heating board designs 160. In some but not necessarily all examples the method 500 further comprises installing the plurality of underfloor heating boards 152 in the room 50. The method 500 outputs scale models which, when manufactured, could feasibly fit pipes 105 into the channels 155 without damaging the pipes 105 and without adaptations needing to be made to the channels 155 in order to fit the pipes 105 in. Embodiments of the disclosure provide bespoke pipe layouts 100, 200, 300 and board layouts 150, 250, 350 for a room 50. This provides a number of advantages. The pipe layouts 100, 200, 300 are optimized for the room 50, leading to more efficient heating and cooling and more uniform heating and cooling. The method 500 allows for smaller pipe spacing which increases the efficiency of heating and cooling and is particular useful for heat pumps. Another benefit is speed and ease of installation as screed does not have to be set, and boards 152 do not have to be cut or adjusted not site. Fig. 6 shows a second example of a method 600 according to embodiments of the disclosure. The method 600 is a method 600 for manufacturing underfloor heating boards 152. The method 600 may be computer implemented. It will be apparent that methods 500 and 600 share a number of steps, are similar and may be combined. At block 502, the method 600 comprises determining room information of a room 50 of a building. At block 604, the method 600 comprises determining a plurality of pipe layouts 100, 200, 300 of underfloor heating pipes 105 for the room 50, based at least in part on the received room information. Block 604 of method 600 is similar to block 504 of method 500. In some examples the plurality of pipe layouts 100, 200, 300 have different pipe spacings; pipe type, pipe diameter, pipe material, pipe lengths and / or pipe patterns. For example, a plurality of pipe layouts 100, 200, 300 may be created for all 10 mm pipe spacings possibilities between 150 to 30 mm. At block 612, the method 600 comprises presenting the plurality of pipe layouts 100, 200, 300 to a user. At block 614 , the method 600 comprises receiving user input selecting a pipe layout 100, 200, 300 of the plurality of pipe layouts 100, 200, 300. The user can choose between the different pipe layouts 100, 200, 300 to decide what is best for the room 50. In some examples the plurality of pipe layouts 100, 200, 300 are presented to a user via a website or application. In some examples the user input is received via the website or application. At block 506, the method 600 comprises determining a board layout 150, 250, 350 of underfloor heating boards 152 for the room 600, based at least in part on the selected pipe layout 100,200, 300, where the underfloor heating boards 152 comprise channels 155 for the underfloor heating pipes 105. At block 508, the method 600 comprises determining a plurality of underfloor heating board designs 160 based at least in part on the board layout 150, 250, 350. The method 600 may optionally comprise, at block 510, initiating manufacture of a plurality of underfloor heating boards 152 based at least in part on the plurality of underfloor heating board designs 160. In some examples, an example method for determining a pipe layout 100, 200, 300 is as follows: 1. Room 50 shape and size are defined, such as using a scalable vector graphic. 2. Pipe spacing centres, pipe bend radius, margin or distance to wall are specified. 3. The system offsets all lines defining the perimeter of the shape by wall distance. This new line is referred to as the 'restriction line'. 4. Entry (flow) and exit (return) points are defined at the restriction line. The initial direction may be set as right clockwise 5. The system measures the width and length between restriction lines (restrictionjeft - restriction_right; restriction_bottom - restriction_top). If all distances are bigger than K * pipe radius: a pair of arcs are placed at the restriction line opposite the entry / exit points and in a clockwise direction. The flow arc leading edge is placed at the restriction line and the return arc is offset in relation to the flow arc by the value specified as pipe spacing centres. 6. Connect the flow arc with the flow entry point. Connect the return arc with the return exit point (flow return line). 7. Set new entry and exit points at the end points of the new arcs. 8. Change the direction by 90° clockwise. 9. Update the restriction line by offsetting pipe_dist from the newly built flow return line. 10. Repeat steps 5-9. 11. If distances measured in step 5 are less than K * radius: run the 'central ornament' 108. 12. Central ornament 108 code closes pipe 105 ends. An example central ornament procedure is as follows: 1. Pipe drawing algorithm stops when the space limit reaches a specified value. 2. Then control points for the Bezier curve are determined based on where there is the most space. 3. A cubic Bezier curve (similar to the letter s) is drawn. 4. Pipes are joined. An example central ornament quality control method is as follows: 1. Check segments are constructed representing a simplified circle. 2. Points are found to divide the Bezier curve into small segments. 3. If there is no intersection between the small segments between the points and the segments, then the minimum radius requirement is met. 4. It is checked the bend radius does not violate the minimum threshold. In some examples, a further example method for determining a pipe layout 100, 200, 300 is as follows: 1. Entry / exit points specified. Start point is defined as position 0 in relation to X and Y. 2. Construct several possible rays that can originate from this point 0 (for example, at 90 degrees possible bending of the pipe might be 90, 45, 0, -45, -90 degrees). 3. Select only those rays that can be drawn and exclude rays that are not possible, for example, outside the restriction line (now we have a list of possible rays). 4. Sort the available angles in relation to the direction / angle of the restriction line. Prioritising the angles / direction that closely match that of the restriction line. 5. Choose the ray with the smallest angle. This step favors the creation of lines following the restriction line / room shape. 6. Construct a line segment based on this ray and the boundary it leads to. 7. The end of this segment becomes the new starting point (step 1). 8. Repeat the steps until there is not enough space for the Bezier curve (the algorithm has reached Central Ornament). 9. In some examples, if an incorrect segment is chosen, the algorithm returns to the previous starting point. Fig 7 illustrates an example of a controller 700 suitable for use in an apparatus. Implementation of a controller 700 may be as controller circuitry. The controller 700 may be implemented in hardware alone, have certain aspects in software including firmware alone or can be a combination of hardware and software (including firmware). As illustrated in Fig 7 the controller 700 may be implemented using instructions that enable hardware functionality, for example, by using executable instructions 706 in a general-purpose or special-purpose processor 702 that may be stored on a machine readable storage medium (disk, memory etc.) to be executed by such a processor 702. The processor 702 is configured to read from and write to the memory 704. The processor 702 may also comprise an output interface via which data and / or commands are output by the processor 702 and an input interface via which data and / or commands are input to the processor 702. The memory 704 stores instructions, program, or code 706 that controls the operation of the apparatus when loaded into the processor 702. The computer program instructions, program or code am 706, provide the logic and routines that enables the apparatus to perform the methods illustrated in the accompanying FIGs. The processor 702 by reading the memory 704 is configured to load and execute the instructions, program, or code 706. The apparatus comprises: at least one processor 702; and at least one memory 704 storing instructions that, when executed by the at least one processor 702, cause the apparatus at least to: determine room information of a room 50 of a building; determine a pipe layout 100, 200, 300 of underfloor heating pipes 105 for the room 50, based at least in part on the determined room information; determine a board layout 150, 250, 350 of underfloor heating boards 152 for the room 50, based at least in part on the pipe layout 100, 200, 300, where the underfloor heating boards 152 comprise channels 155 for the underfloor heating pipes 105; and determine a plurality of underfloor heating board designs 160 based at least in part on the board layout 150, 250, 350. As illustrated in Fig 8, the instructions, program, or code 706 may arrive at the apparatus via any suitable delivery mechanism 708. The delivery mechanism 708 may be, for example, a machine readable medium, a computer-readable medium, a non-transitory computer-readable storage medium, a computer program product, a memory device, a record medium such as a Compact Disc Read-Only Memory (CD-ROM) or a Digital Versatile Disc (DVD) or a solid-state memory, an article of manufacture that comprises or tangibly embodies the computer program 706. The delivery mechanism may be a signal configured to reliably transfer the computer program 706. The apparatus may propagate or transmit the computer program 706 as a computer data signal. External climate control system Climate control systems control the indoor climate of a building and can heat and / or cool the building or parts of the building such as rooms 50. Underfloor heating systems, such as the examples of Figs 1 to 8, are examples of climate control systems. Figs 9a and 9b show an example of a climate control board 900 according to embodiments of the disclosure. Fig. 9a shows a top view of the climate control board and Fig. 9b shows a side view of the climate control board 900. The climate control board 900 may be a board I panel 152 as described in Figs 1 to 8 and the climate control board 900 may comprise any of the features described regarding Figs 1 to 8. For example the climate control board 900 may form part of a board layout 150, which may for a climate control system such as an underfloor system. The illustrated climate control board 900 comprises an insulating board 910 comprising at least one channel 155 and water proofing 920. The at least one channel 155 is for at least one heating and / or cooling pipe 105. The at least one channel 155 may be cut into the board 900. The insulating board 910 comprises insulating material. In some examples the insulating board 910 comprises foam insulation. In some examples the thermal conductivity of the insulating board 910 is less than 0.2 W / mK, such as less than 0.1 W / mK, or less than 0.05 W / mK. The climate control board 900 is for radiant heating and / or cooling and is configured to be positioned on an external wall or roof of a building in order to heat and / or cool the building. The heat passes through the wall or roof to heat or cool the building. In some examples the climate control board 900 is configured to use radiant or conductive heat energy to achieve indoor climate control for thermal comfort. The climate control board 900 may form at least part of the external cladding of the building. In the illustrated example the climate control board 900 does not comprise the at least one pipe 105. However, in other examples, such as in Fig. 14 to 19, the climate control board 900 comprises at least one pipe 105. The at least one pipe 105 is for a liquid to heat or cool the building and the at least one pipe 105 is positioned within the at least one channel 155. The waterproofing 920 protects the climate control board 900 from water, for example protecting the insulating board 910 from water which may damage the insulating board 910. In the illustrated example, the waterproofing 920 comprise a waterproof layer 920 which form a coating. In some examples the waterproofing 920 comprises a waterproof trim or seal. In some examples the waterproofing 920 comprises waterproof banding or sealing around exposed edges 154 of a board 900. The waterproofing 920 may be weatherproofing 920 to protect the climate control board 900 from rain or other weather. In some but not necessarily all examples, the climate control board 900 has a first side I face 901 configured to substantially face towards the building when the board 900 is positioned on the building, and a second side I face 902 configured to substantially face away from building when the board 900 is positioned on the building. The first side 901 may be considered an inner side 901 and the second side 902 may be considered an outer side 902 In some examples the insulating board 910 does not cover the channel 155 on the first side 910. For example the insulating board 910 might not be positioned between the channel 155 and the building. In some examples waterproofing 920 is positioned at least partially on the second side 902. In some examples waterproofing 920 is positioned on the external surface of the climate control board 900 when the board 900 is positioned on a building. Fig. 10 shows an example of a radiant heating and cooling system 1000 according to embodiments of the disclosure. The illustrated radiant heating and cooling system 1000 comprises three climate control boards 900. In other examples a radiant heating and cooling system comprises at least two climate control boards 900. The radiant heating and cooling system 1000 of Fig. 10 may comprise any of the features described regarding Figs 1 to 9. A radiant heating and cooling system 1000 may be known as a climate control system 1000 or a board system 1000. In this example, the climate control boards 900 have multiple channels 155, with different boards 900 having differing numbers of channels 155. In this example, the waterproofing 920 comprises a thin exterior coating. In some examples at least two climate control boards 900 are joined to one another using at least one joint 915. In the illustrated example, the three boards 900 are joined together using two joints 915. The illustrated joints 915 comprises a projection on one board 900 and a corresponding recess on a neighbouring board 900. In some examples housing joints 915 may be used. In some examples a housing joint 915 may have a double rebated male edge and a grooved female edge. In some examples the radiant heating and cooling system 1000 is prefabricated, with the at least two climate control boards 900 being joined together prior to installation on the building. In some examples the boards 900 are joined together in a factory prior to installation. The climate control boards 900 and radiant heating and cooling system 1000 may be prefabricated in a factory rather than being cut to size on-site. The prefabricated method of installation requires less user skill, is more accurate, is quicker and disturbs building occupants less whilst work is carried out. Fig. 11 shows a further example of a radiant heating and cooling system 1100 according to embodiments of the disclosure. The illustrated radiant heating and cooling system 1100 comprises three climate control boards 900 and may form part of a larger radiant heating and cooling system 1100. The radiant heating and cooling system 1100 of Fig. 11 may comprise any of the features described regarding Figs 1 to 10. The illustrated climate control boards 900 define a cutout 1160, which is a region where the boards 900 do not extend. The cutout 1160 may be for a window of a building. The climate control boards 900 in this example are thus non-rectangular. In other examples cutouts 1160 may be for different features of a building such as doors. The illustrated climate control boards 900 comprise a plurality of channels 155 which together form at least part of a pipe layout 100, 200, 300. Fig. 12 shows another example of a radiant heating and cooling system 1200 according to embodiments of the disclosure. Fig. 12 shows the radiant heating and cooling system 1200 attached to a building 1250. The radiant heating and cooling system 1200 of Fig. 12 comprises the radiant heating and cooling system 1100 of Fig. 11 which is present around the right window 1260 in Fig. 12. The radiant heating and cooling system 1200 of Fig. 12 may comprise any of the features described regarding Figs 1 to 11. The illustrated radiant heating and cooling system 1200 comprises a plurality of climate control boards 900 and channels 155 for pipes 105. The channels 155 form a pipe layout 100 which may comprise one or more flow circuits for a radiant heating and cooling system 1200. The pipes 105 and radiant heating and cooling system 1200 may be pressure tested, which may occur prior to installation. In some examples this is done by sealing a pipe 105 at one end, filling with compressed gas and placing a gauge at the other end of the pipe 105 in order to record the pipe pressure. In the event the pressure drops, the pipe 105 may be damaged, in which case the pipe 105 may be replaced. In this example the radiant heating and cooling system 1200 comprises a heat pump 1210 for heating and / or cooling the liquid of the pipes 105. The heat pump 1210 may be an air source heat pump 1210. In some examples, a radiant heating and cooling system 1200 is positioned externally to the building 1250 on at least one external wall or roof of the building 1250, and is configured to heat and / or cool the building 1250 by heat passing through the wall or roof of the building 1250. The radiant heating and cooling system 1200 can be positioned on an external surface of an external wall of the building 1250. By being positioned externally, the radiant heating and cooling system 1200 has the advantage of saving space within the building 1250. The radiant heating and cooling system 1200 also has the advantage of improving the insulation of the building 1250 which reduces heat loss and improves efficiency. By being positioned externally and the heat travelling through the walls and / or roof of a building 1250, the radiant heating and cooling system 1200 also leads to more uniform heating and cooling. If insulation boards without channels 155 for pipes 105 are attached a building 1250they slow the conduction of heat energy in or out of the building 1250 but do not heat or cool the building 1250. The methods of heating the building 1250 from the outside allows for the thermal mass of the building to conduct, store and emit heat energy into the building 1250. This is an effective method of maintaining the stable internal temperature of a building 1250. Additionally the radiant heating and cooling system 1200 is quick and easy to install on a building 1250, with limited user skill and expertise needed. Fig. 13 shows another example of a radiant heating and cooling system 1300 according to embodiments of the disclosure. The radiant heating and cooling system 1300 of Fig. 13 may comprise any of the features described regarding Figs 1 to 12. In this example the board layout 150, 250, 350 is shown but the channels 155 are not. In Fig. 13 the radiant heating and cooling system 1300 is comprised of three different radiant heating and cooling systems 1310 for ease of installation. The top radiant heating and cooling system 1310 is for a roof of the building 1250, whilst the lower two radiant heating and cooling systems 1310 are for walls of the building 1250. Multiple different radiant heating and cooling systems 1310 may be used to cover all or part of the exterior of a building 1250. In some instances radiant heating and cooling system 1300 may comprise multiple radiant heating and cooling systems 1310 stacked on top of one another, the radiant heating and cooling system 1300 may contain structure supports 1360 to transmit vertical loads down into a foundation system. In this example, two of the three radiant heating and cooling systems 1310 comprise structural elements 1350 to help support the radiant heating and cooling system 1310. The structural elements 1350 may, for example, be rods or beams. In some examples, a radiant heating and cooling system 1300, 1310 acts as a single structural unit and is capable of supporting all weight above. The radiant heating and cooling system 1300, 1310 may be fixed to the building 1250, and the building 1250 may provide lateral support to the radiant heating and cooling system 1300, 1310. In some instances the radiant heating and cooling system 1300 may have channels machined into it to contain and fasten guttering, downpipes and other forms of building pipe work. In the illustrated example, for the lower two radiant heating and cooling systems 1310 the boards 900 are an at angle to the walls of the building 1250. The illustrated boards 900 are not parallel or perpendicular to the walls of the building 1250. This can lead the radiant heating and cooling systems 1310 to have a stronger structure as it can mitigate against weakness caused by doors or windows. Fig. 14 shows an example of a climate control board 900 coupled to a wall 1255 of a building 1250 according to embodiments of the disclosure. On the left is shown a view of the first face 901 of the climate control board 900. On the right is shown a cross sectional view of the climate control board 900 and a building wall 1255. The climate control board 900 of Fig. 14 may comprise any of the features described regarding Figs 1 to 13. In this example the pipes 105 can be seen in the channels 155. For the lower two channels 155, the channel 155 is a similar size to the pipe 105. For the top channel 155, the channel 155 is substantially larger that the pipe 105. For the top channel 155, clips 1420 are used to hold the pipe 105 in place. In the illustrated example the climate control board 900 further comprises a conductive material 1450. The conductive material is positioned at least partially between the channel 155 and the building 1250. In some examples, the conductive material 1450 is configured to contact the building 1250 when the climate control board 900 is positioned on the building 1250. In the some examples, the conductive material 1450 is positioned at least partially between the pipe 105 and building 1250, and the conductive material 1450 at least partially surrounds the pipe 105. In the illustrated example the conductive material 1450 is positioned in one of the channels 155 and contacts one of the pipes 105, but is not in two of the channels 155 and does not contact two of the pipes 105. In some examples the conductive material 1450 may contact all the pipes 105 and channels 155 of a board 900. The conductive material 1450 improves the conduction of heat from the pipes 105 to the building 1250 and so reduces the heat lost, which improves the energy efficiency of a climate control board 900 or climate control system 1000. The conductive material 1450 promotes the conductivity of energy out of the pipes 105 and onto the surface of the building 1250. The conductive material 1450 may comprises a number of different materials. For examples metals such as steel or aluminium, or cement or latex. In some examples, the conductive material 1450 comprises a foil or layer such as a metal foil. In some examples, the conductive material 1450 comprises a metal mechanical fixing. In some examples the conductive material 1450 is a liquid conductive material 1450 which is applied to the climate control board 900. The liquid conductive material 1450 is initially liquid and then solidifies to form a solid conductive material 1450. In some examples the liquid conductive material 1450 sets or hardens to form a solid conductive material 1450. The liquid conductive material 1450 may flow into the channels 155 of the board 900. The conductive material 1450 may be screed and may comprise latex or cement. The liquid conductive material 1450 may be considered to be a formerly liquid conductive material 1450. In some examples, liquid conductive material 1450 may be used to cover the first surface 901 of a climate control board 900 or climate control system 1000 partially or entirely. In some examples the thermal conductivity of the conductive material 1450 is greater than 0.2 W / mK, such as greater than 0.5 W / mK, greater than 1 W / mK, greater than 2 W / mK, or greater than 10 W / mK. The thermal conductivity of the conductive material 1450 may be significantly greater than the thermal conductivity of the insulating boards 910. For example, greater than 10 times, greater than 20 times, or greater than 50 times. Fig. 15 shows a further example of a climate control board 900 coupled to a wall 1255 of a building 1250 according to embodiments of the disclosure. On the left is shown a view of the first face 901 of the climate control board 900. On the right is shown a cross sectional view of the climate control board 900 and a building wall 1255. The climate control board 900 of Fig. 15 may comprise any of the features described regarding Figs 1 to 14. The climate control board 900 of Fig. 15 is similar to the climate control board 900 of Fig. 14 with some differences. In some examples, the climate control board 900 comprises at least one recess 1525 for the conductive material 1450. In some examples, the climate control board 900 comprises at least one additional channel 1525 which does not comprise a pipe 105. In this example two additional channels 1525 are present. In other examples a different number of additional channels 1525 are present. The illustrated one additional channels 1525 are for the conductive material 1450. The additional channels 1525 increase the amount of conductive material 1450 in contact with the building 1250 and so improve heat flow to the building 1250, thus improving efficiency. In some examples, the additional channel(s) 1525 are contiguous with the channel(s) 155 and are at an angle to the channel(s) 155.1 n this example the additional channel(s) 1525 are substantially perpendicular to the channels 155 and are on the inner face 901 of the board 900. In other examples the additional channel(s) 1525 may be parallel to the channel(s) 155 and might not be contiguous with the channels 155. Additional channels 1525 may be used to direct the transfer of heat towards areas of the building facade that require it and away from areas where heat energy may be lost, such as foundations, windows 1260 or areas difficult to properly insulate. Similarly channels 155 may be wider and filled with conductive material 1450 in area where increased heat transfer is desirable. This improves energy efficiency. In some examples, the additional channels 1525 form a network for allowing the flow of liquid conductive material 1450. The network may span multiple climate control boards 900. A climate control system 1000 may comprises entry points for the liquid conductive material 1450. These may be positioned at the top of the climate control system 1000 when it is connected to a building 1250, allowing liquid conductive material 1450 to flow though the network to reach additional channels 1525 which may be positioned far from the entry points. In the illustrated example, the climate control board 900 comprises at least one mechanical fixing 1410 to attach the board 900 to the building 1250. In some examples the mechanical fixing 1410 is a pin, nail or screw. The mechanical fixing 1410 extends at least partially though the board 900 and the wall 1255 or roof. In some examples the mechanical fixing 1410 extends entirely through the wall 1255 or roof. In the illustrated example a baton 1515 is present to hold the mechanical fixing 1410 in place. The baton 1515 may be insulating and waterproof. The mechanical fixing 1410 may comprise a conductive material 1450 which can help to improve heat flow into the building 1250. In some examples the boards 900 may be held together using a temporary or permanent system such as timber, plastic or metal frame batons or bracing. Batons or bracing 1515 may be secured into machined channels on the rear side 902 of the boards 900 which can allow an external cladding system to be fixed flush to the rear of the climate control system 1000. Temporarily or permanently holding the boards 900 together can enable the pipes 105 to be installed into the channels 155 before the climate control system 1000 is installed on the building 1250. In some examples, the baton or bracing 1515 may be used to fasten fixings 1410 through and into the building 1250. The baton or bracing 1515 may be used to fasten a cladding system to the climate control system 1000. In some examples the boards 900 are held together in a permanent encasement representing the building’s 1250 external cladding. In some examples, the boards 900 are held together temporarily with the use of clamps applying inwards pressure. In some examples clamp heads are placed at the perimeter of the climate control system 1000 or into pre-machined pocket holes inside the perimeter of the climate control system 1000. After installation is completed, clamps may be removed, pocket holes may be filled with sections of pre-cut insulation, injected with liquid expanding foams or any other form of insulating material. In Fig. 15 the climate control board 900 also comprises a waterproof seal 1530. The waterproof seal 1530 may form part or all of the waterproofing 920. The illustrated waterproof seal 1530 is configured to contact the building 1250 and to be positioned below the channels 155 and the additional channels 1525. The waterproof seal 1530 is configured to prevent water from getting into the climate control board 900 and between the board 900 and the building 1250. The waterproof seal 1530 is configured to prevent liquid conductive material 1450 from leaking from the board 900 and the space between the board 900 and building 1250. The waterproof seal 1530 may comprise a gasket or seal, which may comprise rubber or foam. In some examples, a sealant or adhesive may be applied to the inner face 901 of a climate control board 900. This helps bond the board 900 to the building 1250 and prevent the leakage of liquid conductive material 1450. Fig. 16 shows another example of a climate control board 900 coupled to a wall 1255 of a building 1250 according to embodiments of the disclosure. On the top is shown a view of the first face 901 of the climate control board 900. On the bottom are shown two cross sectional views of the climate control board 900 and a building wall 1255. The climate control board 900 of Fig. 16 may comprise any of the features described regarding Figs 1 to 15. The climate control board 900 of Fig. 16 is similar to the climate control board 900 of Fig. 15 with some differences. The illustrated climate control board 900 comprises a plurality of additional channels 1525. The additional channels 1525 are different lengths, with some being longer whilst some are shorter. It can be seen from the cross section ‘A’ that additional channels 1525 may have different depths. In the additional channel 1525 as seen in ‘A’, regions near pipes 105 have a larger depth so that the conductive material 1450 can surround the pipe 105 and so improve heat transfer, whilst other regions have a lower depth to allow more insulating material 910 to be present, reducing heat loss. In this example, some but not all of the additional channels 1525 contain conductive material 1450. The illustrated climate control board 900 comprises a visible waterproof layer 920 on the exterior of the board 900. Figs 17 and 18 show further examples of a climate control board 900 according to embodiments of the disclosure. The climate control boards 900 of Fig. 17 and 18 may comprise any of the features described regarding Figs 1 to 16. In the examples of Figs 17 and 18, the additional channels 1525 are at different angles to each other and can change angle / direction. In the example of Fig. 17 the additional channels 1525 can be different shapes and sizes. Some of the additional channels 1525 can be considered to be serrations on the side of the channels 155 surrounding the pipes 105. Fig. 19 shows another example of a climate control board 900 according to embodiments of the disclosure. The climate control board 900 of Fig. 19 may comprise any of the features described regarding Figs 1 to 18. The illustrated channel 155 comprises regions of different depth and / or width, these may be considered to be serrations 156 for the conductive material 1450. Some of the illustrated serrations 156 are vertical and some are horizontal. The channel 155 for the pipe 105 may have serrations 156 machined into the sides and / or bottom of the channel 155. The serrations 156 can allow the pipe 105 to be held in place by board material. The gaps in the serrations 156 allow liquid conductive material 1450 to surround the pipe 105 and increase the surface area of heat transfer, promoting the conductivity of energy out of the pipes 105 and onto the surface of the building 1250. In some examples, liquid conductive material 1450 may be poured into serrations 156, channels 155 and additional channels 1525. Liquid conductive material 1450 may be poured or injected on site after the climate control system 1000 has been installed. This process can be important for buildings 1250 whose external surface is uneven. The liquid conductive material 1450 when applied after the climate control system 1000 has been installed may act as a means to fix the climate control system 1000 to the building 1250. Fig. 20 shows another example of a climate control board 900 according to embodiments of the disclosure. The climate control board 900 of Fig. 20 may comprise any of the features described regarding Figs 1 to 19. In this example, the climate control board 900 comprises a groove 1210 positioned at least partially around the perimeter of the board 900. The illustrated groove 1210 contains a cable or strap 2012, the cable or strap 2012 can be tightened to apply inward pressure holding the climate control system 1000 together. In the illustrated example, the groove 210 comprises a groove protection plate 2014 to prevent the cable or strap 2012 cutting into the board 900. The cable or strap 2012 may be used as a lifting mechanism during the installation of a climate control systems 1000. In some climate control systems 1000, outer boards 900 may have grooves 1210 whilst inner boards 900 do not. Fig. 21 shows an example of a C section support 2100 according to embodiments of the disclosure. Fig. 22 shows an example of a climate control system 2200 comprising climate control boards 900 and C section supports 2100. The climate control system 2200 of Fig. 22 may comprise any of the features described regarding Figs 1 to 21. In some examples a climate control system 2200 comprise at least one C section support 2100. A C section support 2100 can aid lifting rigidity and help to prevent lifting cables cutting into boards 900. A C section support 2100 can be used to attach other elements such as waterproof cladding 920, and can help in attaching the climate control system 2200 to a building 1250. The C section support 2100 has a substantially ‘C’ shape comprising a platform / base 2110 and walls 2112. A ‘C’ shape may be considered to be a ‘U’ shape. The illustrated C section support 2100 comprises a lip 2114 and an aperture 2116. In some examples the aperture is for a mechanical fixing 1410. The illustrated C section support 2100 comprises spikes 2150. The spikes 2150 are positioned on the rear side of the C section support 2100, the opposite side to the walls 2112. The spikes 2150 are for connecting the C section support 2100 and insulating board 910 and are configured to press into the insulating material 910 of the climate control board 900. A C section support 2100 with spikes 2150 may be considered to be a spiked C section support 2100. C section supports 2100 may be inserted in the climate control system 2200 prior to installation, such as in a factory. In some examples, C section supports 2100 may be inserted into horizontal or vertical channels machined into the backs of the climate control boards 900. In some examples the C section supports 2100 may also sit on the surface of the boards 900. When pressed into the boards 900 the spikes 2150 on the back of the C section 2100 pierces into the boards 900 and helps to keep the climate control system 2200 together. In some examples, wire, strapping or mesh components may be fixed to the lip 2114 of the C sections support 2100. These components may help press boards 900 not containing a C section into the building 1250, reducing the number of required C sections supports 2100. In some examples, inserts matching the internal shape of the C section 2100 can be slid into the C Sections 2100 at the edges of board systems 2200. The inserts slide into the neighboring C Section 2100 of neighboring boards 900 and strengthen the joints 915 of board systems 2200. In some examples a C section support 2100 comprises a stepped flange to allow the direct hanging of cladding 920. Fig. 23 shows another example of a climate control board 900 coupled to a wall 1255 of a building 1250 according to embodiments of the disclosure. The climate control board 900 of Fig. 23 may comprise any of the features described regarding Figs 1 to 22. In this example, the waterproofing 920 comprises waterproof cladding pieces 2300. The waterproof cladding pieces 2300 are configured to form a waterproof layer. The waterproof cladding pieces 2300 connect to the climate control board 900. In this example the waterproof cladding 2300 connects to a support layer 2100 using connectors 2102, 2302. In some examples the waterproof cladding 2300 connects to the support layer 2100 or insulating board 910 using snap fit connectors 2102, 2302. In this example the waterproof cladding pieces 2300 also connect to each other using connectors 2302, such as snap fit connectors 2302. Fig. 24 shows an alternative example of a climate control board 2400 coupled to a wall 1255 of a building 1250 according to embodiments of the disclosure. The climate control board 2400 of Fig. 24 may comprise any of the features described regarding Figs 1 to 23. In this example the climate control board 2400 does not comprises channels 155 for pipes 105. Instead pipes 105 are fixed to a building 1250 using connectors 1420, which may be mechanical connectors 1420 such as clips 1420. The cavity 1270 between the board 2400 and the building 1250 is filled at least partially with conductive material 1450. The mechanical connectors 1420 may be metal and may help to efficiently conduct heat from the pipe 105 deep into the building 1250. The mechanical connectors 1420 also act as a spacer to create the cavity and allowing radiant heating and cooling system 2400 to be placed up against the mechanical connectors 1420. In some examples, a method comprises: heating or cooling a building 1250 from outside using a radiant heating and cooling system 2400 positioned externally to the building 1250, on at least one external wall 1255 or roof of the building 1250, wherein the radiant heating and cooling system 2400 is configured to heat and / or cool the building 1250 by heat passing through the wall 1255 or roof of the building 1250. In some examples a heat emitter is placed on the exterior of the building 1250 and then covered with an insulating material to form a radiant heating and cooling system 2400. In some examples, the heat emitter comprises a pipe 105. In some examples the heat emitter comprises an electric heater, which may comprise electric wires or cables. The electric heater may comprise electric wires or cables in a mat. A radiant heating and cooling system 2400 can comprise an electric heater. In some examples a radiant heating and cooling system 2400 does not comprise a pipe 105. A radiant heating and cooling system 2400 comprising an electric heater may comprise conductive material 1450 and / or additional channels 1525. Fig. 25 shows an example of an insulation board 2500 coupled to a wall 1255 of a building 1250 according to embodiments of the disclosure. The insulation board 2500 of Fig. 25 may comprise any of the features described regarding Figs 1 to 24. In the illustrated example the insulating board 2500 comprises a first layer 911 comprising an insulating material; and a second layer 912. The second layer 911 has a lower density than the first layer 912. The insulating board 2500 is configured to be positioned on a wall 1255 or roof of a building 1250 in order to insulate the building. The first layer 911 may be rigid. The second layer 911 may comprise foam, sponge, rubber or other soft material. The second layer 912 may comprise an expandable material. The second layer 912 may comprise a flexible material. The insulating board 2500 may be positioned on the exterior or interior of a building 1255. The insulating board 2500 may be positioned so that the second layer 911 faces and contacts the building. In the illustrated example the insulating board 2500 39 comprises a waterproof layer 920. However, in other examples the insulating board 2500 does not comprise a waterproof layer 920. In some cases, as can be seen in the illustrated example, the wall 1255 or roof may be uneven and the second layer 912 helps to fill a gap that would have been formed between an uneven wall 1255 or roof and a rigid board 911. The second layer 912 can help to prevent the escape of liquid conductive material 1450, and can help prevent the movement of air beneath the surface of boards 2500. In some examples, the second layer 912 can be used on internal boards 2500 to stop a build-up of condensation behind internal boards 152. In the illustrated example the second layer 912 covers the entirety of one side of the first layer 911. In other examples the second layer 912 only partially covers one side of the first layer 911. In the illustrated example the insulating board 2500 does not comprises pipe channels 155. In some examples the insulating board 2500 may comprise pipe channels 155 and may form part of a climate control board 900. In some instances where a low temperature heating system is used such as a heat pump 1210, existing building radiators may be retained and the external climate control system / radiant heating and cooling system 1000 may be used in conjunction with radiators, helping to achieve a more efficient running of the heat pump 1210. Determining a pipe layout 100 may be based on at least one of, elevation information window size and location, door size and location, pipe entry and exit points, pipe air bleeding points, heat requirement information, heater output, desired separation from windows, doors and edges of elevation. Elevation information may comprise at least one of: window information, door information, the location and size of ducts, vents, pipes, cables, alarm units and external lighting. Determining elevation information may use traditional surveying methods, database information, scale elevation drawing, handheld, aviation drone mounted 3D laser scanning equipment and / or computer vision equipment. Determining a pipe layout 100 may comprise determining the location of additional building facade components such as downpipes and guttering. Determining a pipe layout 100 may comprise determining the location of fixing or drilling points used to fix the climate control system 1000 to the building 1250. Determining a pipe layout 100 may comprise determining the location of pocket holes, clamping points and lifting points. Determining a pipe layout may comprise determining the location of additional structural elements placed into the climate control system 1000. Determining fixing points may be based on at least one of: elevation information, structure soundness of the climate control system 1000, suitability of the building facade. A method of manufacture the boards 900 may comprise using CNC cutting / milling to cut joint profiles into the edges of the boards 900. The edges of the boards 900 may be machined so that the boards 900 can be joined together using a housing joint 915. Housing joints 915 or similar joints 915 may be machined into the boards 900 on the edges of elevations to allow other climate control systems 1000 to join perpendicular to the elevation. In some examples, the pipe channels 155 are machined into the inner face 901 of the boards 900. The boards 900 are layed facing upwards and in the determined board configuration. The boards 900 are held in the determined configuration by means of temporary or permanent fixings 1410 and may be bonded together using adhesive. In some examples, the pipe(s) 105 are inserted into the channel(s) 155 whilst in the factory. The inner face 901 of the climate control system 1000 may be covered with a conductive material 1450 such as aluminum film. In some examples the location of board drilling points may be marked on the reverse side of the boards 900. The location of the pipe layout 100 may be marked on the reverse side of the boards 900. The drilling points and / or pipe layout may be marked by human or CNC machine. Drill points enable the installer to know the exact location to drill and fix the climate control system 1000 to the building 1250 without damaging the pipes 105 within. Fixing points such a threaded bar or anchor bolts may be installed onto the existing building facade. The climate control system 1000 may be placed onto the fixing points and secured with washers and nuts or by other means. In some examples the climate control system 1000 is supported with external props with no drilling or fixing through the climate control system 1000 undertaken onside. A rebate shaped channel or pocket hole may be machined into the inner face 901 of the climate control system 1000. Fixings 1250 placed into the building facade may be aligned with such channels or holes. Once liquid conductive material 1450 is in poured into the climate control system 1000 the liquid conductive material 1450 fills the void in the channel or hole and hardens around the fixing 1250, creating a strong and permanent fixing to the building 1250. The climate control system 1000 may have pipe 105 entry and exit points in order to connect the pipe system to neighboring pipe systems or the building’s 1250 heating / cooling circulation. Pipe 105 entry and exit points may contain air bleeding fittings to allow air to be released from the board system 1000 when being filled with liquid. Pipe 105 entry and exit points may be covered with a pre-cut piece of insulation. Pipe 105 entry and exit points may be covered and placed in a service void that could be inspected by an engineer. In some examples, additional insulation panels may be added to the climate control system 1000 where windows and doors occur. The additional panels insulate the building 1250 around windows and doors from ‘cold bridging’. Additional insulation panels may be joined to the climate control system 1000 by means of CNC housing joint, mechanical fixing 1250 or adhesive. In some examples climate control systems 1000 be covered onsite by an installer using cement based render covering, composite plastic panels, cement based panels, timber, plastic, copper, and / or zinc. In some examples climate control systems are prefabricated and delivered to site with an external cladding system already installed. The climate control systems 1000 heats and stores energy in the mass of the building 1250. A time lag / time delay can occur between a heat pump 1210 turning on and the heating or cooling effect on the building 1250. The time lag can be predicted or determined based on the thickness and material of the wall 1255 or roof of the building 1250. The time lag can be between a heat pump 1210 turning on and the requirement of heat being needed for building 1210. Heat pumps 1210 run most efficiently at certain temperatures, which are more likely to occur at certain times of day such as noon. So the climate control system 1000 could lead to improved efficiency by running when the heat pumps 1210 can run most efficiently. In some examples the climate control system 1000 may be configured to adjust its settings, such as to turn on or off, based on weather forecasting information. In some examples the climate control system 1000 comprises or is connected to a controller 700 to adjust the climate control system 1000. An internet connection can provide weather forecasting data to the computer controller 700. In some examples the computer controller 700 calls for heating or cooling in the climate control system 1000 based on a predicted the time lag between heat transfer into / out of the building 1250, current or future outside temperatures and when heating or cooling may be required in the building 1250. In some examples, the climate control boards 900 as described in Figs 9 to 23, may be used as underfloor heating boards 152 on or in the floor of a building 1250. For example, such an underfloor heating board 152 may comprise conductive material 1450, such as liquid conductive material 1450, and additional channels 1525 for the conductive material 1450. Computer program instructions for causing an apparatus to perform at least the following or for performing at least the following: determining room information of a room 50 of a building 1250; determining a pipe layout 100, 200, 300 of underfloor heating pipes 105 for the room 50, based at least in part on the determined room information; determining a board layout 150, 250,350 of underfloor heating boards 152, 900 for the room 50, based at least in part on the pipe layout 100, 200, 300, where the underfloor heating boards 152 comprise channels 155 for the underfloor heating pipes 105; and determining a plurality of underfloor heating board designs 160 based at least in part on the board layout 150, 250, 350. The computer program instructions may be comprised in a computer program, a non-transitory computer readable medium, a computer program product, a machine readable medium. In some but not necessarily all examples, the computer program instructions may be distributed over more than one computer program. Although the memory 704 is illustrated as a single component / circuitry it may be implemented as one or more separate components / circuitry some or all of which may be integrated / removable and / or may provide permanent / semi-permanent / dynamic / cached storage. Although the processor 702 is illustrated as a single component / circuitry it may be implemented as one or more separate components / circuitry some or all of which may be integrated / removable. The processor 702 may be a single core or multi-core processor. References to ‘computer-readable storage medium’, ‘computer program product’, ‘tangibly embodied computer program’etc. ora ‘controller’, ‘computer’, ‘processor’ etc. should be understood to encompass not only computers having different architectures such as single / multi- processor architectures and sequential (Von Neumann) / parallel architectures but also specialized circuits such as field-programmable gate arrays (FPGA), application specific circuits (ASIC), signal processing devices and other processing circuitry. References to computer program, instructions, code etc. should be understood to encompass software for a programmable processor or firmware such as, for example, the programmable content of a hardware device whether instructions for a processor, or configuration settings for a fixed-function device, gate array or programmable logic device etc. The blocks illustrated in the accompanying Figs may represent steps in a method and / or sections of code in the computer program 706. The illustration of a particular order to the blocks does not necessarily imply that there is a required or preferred order for the blocks and the order and arrangement of the block may be varied. Furthermore, it may be possible for some blocks to be omitted. Where a structural feature has been described, it may be replaced by means for performing one or more of the functions of the structural feature whether that function or those functions are explicitly or implicitly described. The systems, apparatus, methods, and computer programs may use machine learning which can include statistical learning. Machine learning is a field of computer science that gives computers the ability to learn without being explicitly programmed. The computer learns from experience E with respect to some class of tasks T and performance measure P if its performance at tasks in T, as measured by P, improves with experience E. The computer can often learn from prior training data to make predictions on future data. Machine learning includes wholly or partially supervised learning and wholly or partially unsupervised learning. It may enable discrete outputs (for example classification, clustering) and continuous outputs (for example regression). Machine learning may for example be implemented using different approaches such as cost function minimization, artificial neural networks, support vector machines and Bayesian networks for example. Cost function minimization may, for example, be used in linear and polynomial regression and K-means clustering. Artificial neural networks, for example with one or more hidden layers, model complex relationship between input vectors and output vectors. Support vector machines may be used for supervised learning. A Bayesian network is a directed acyclic graph that represents the conditional independence of a number of random variables. The methods 500, 600 may assign the execution of data-intensive training of a machine-learning algorithm to clients and preparatory steps to a server to take advantage of a server-client architecture. The training data and the training of the reduced machine learning model is technical in that there is distributed training across multiple clients and the training data at each client is secured and remains private. The apparatus can be provided in an electronic device, for example, a mobile terminal, according to an example of the present disclosure. It should be understood, however, that a mobile terminal is merely illustrative of an electronic device that would benefit from examples of implementations of the present disclosure. The term ‘comprise’ is used in this document with an inclusive not an exclusive meaning. That is any reference to X comprising Y indicates that X may comprise only one Y or may comprise more than one Y. If it is intended to use ‘comprise’ with an exclusive meaning then it will be made clear in the context by referring to ‘comprising only one...’ or by using ‘consisting.’ In this description, the wording ‘connect’, ‘couple’ and ‘communication’ and their derivatives mean operationally connected / coupled / in communication. It should be appreciated that any number or combination of intervening components can exist (including no intervening components), i.e., to provide direct or indirect connection / coupling / communication. Any such intervening components can include hardware and / or software components. As used herein, the term "determine / determining" (and grammatical variants thereof) can include, not least: calculating, computing, processing, deriving, measuring, investigating, identifying, looking up (for example, looking up in a table, a database, or another data structure), ascertaining and the like. Also, "determining" can include receiving (for example, receiving information), accessing (for example, accessing data in a memory), obtaining and the like. Also, "determine / determining" can include resolving, selecting, choosing, establishing, and the like. In this description, reference has been made to various examples. The description of features or functions in relation to an example indicates that those features or functions are present in that example. The use of the term ‘example’ or ‘for example’ or ‘can’ or ‘may’ in the text denotes, whether explicitly stated or not, that such features or functions are present in at least the described example, whether described as an example or not, and that they can be, but are not necessarily, present in some of or all other examples. Thus ‘example’, ‘for example’, ‘can’, or ‘may’ refers to a particular instance in a class of examples. A property of the instance can be a property of only that instance or a property of the class or a property of a sub-class of the class that includes some but not all the instances in the class. It is therefore implicitly disclosed that a feature described with reference to one example but not with reference to another example, can where possible be used in that other example as part of a working combination but does not necessarily have to be used in that other example. Although examples have been described in the preceding paragraphs with reference to various examples, it should be appreciated that modifications to the examples given can be made without departing from the scope of the claims. Features described in the preceding description may be used in combinations other than the combinations explicitly described above. Although functions have been described with reference to certain features, those functions may be performable by other features whether described or not. The description of a feature, such as an apparatus or a component of an apparatus, configured to perform a function, or for performing a function, should additionally be considered to also disclose a method of performing that function. For example, description of an apparatus configured to perform one or more actions, or for performing one or more actions, should additionally be considered to disclose a method of performing those one or more actions with or without the apparatus. Although features have been described with reference to certain examples, those features may also be present in other examples whether described or not. The term ‘a’, ‘an’ or ‘the’ is used in this document with an inclusive not an exclusive meaning. That is any reference to X comprising a / an / the Y indicates that X may comprise only one Y or may comprise more than one Y unless the context clearly indicates the contrary. If it is intended to use ‘a’, ‘an’ or ‘the’ with an exclusive meaning then it will be made clear in the context. In some circumstances the use of ‘at least one’ or ‘one or more’ may be used to emphasis an inclusive meaning but the absence of these terms should not be taken to infer any exclusive meaning. The presence of a feature (or combination of features) in a claim is a reference to that feature or (combination of features) itself and to features that achieve substantially the same technical effect (equivalent features). The equivalent features include, for example, features that are variants and achieve substantially the same result in substantially the same way. The equivalent features include, for example, features that perform substantially the same function, in substantially the same way to achieve substantially the same result. In this description, reference has been made to various examples using adjectives or adjectival phrases to describe characteristics of the examples. Such a description of a characteristic in relation to an example indicates that the characteristic is present in some examples exactly as described and is present in other examples substantially as described. The above description describes some examples of the present disclosure however those of ordinary skill in the art will be aware of possible alternative structures and method features which offer equivalent functionality to the specific examples of such structures and features described herein above and which for the sake of brevity and clarity have been omitted from the above description. Nonetheless, the above description should be read as implicitly including reference to such alternative structures and method features which provide equivalent functionality unless such alternative structures or method features are explicitly excluded in the above description of the examples of the present disclosure. Whilst endeavoring in the foregoing specification to draw attention to those features believed to be of importance the Applicant may seek protection via the claims in respect of any patentable feature or combination of features hereinbefore referred to and / or shown in the drawings whether or not emphasis has been placed thereon. l / we claim:

Claims

1. A climate control board comprising:an insulating board comprising at least one channel for at least one heating and / or cooling pipe; andwater proofing;wherein the climate control board is for radiant heating and / or cooling and is configured to be positioned on an external wall or roof of a building in order to heat and / or cool the building.

2. The climate control board of claim 1, further comprising the at least one pipe, wherein the at least one pipe is for a liquid to heat or cool the building, and wherein the at least one pipe is positioned within the at least one channel.

3. The climate control board of claim 1 or 2, wherein the waterproofing comprises a waterproof layer, coating, trim or seal.

4. The climate control board of claim 1, 2 or 3, wherein the climate control board has a first side configured to substantially face towards the building when the board is positioned on the building, and a second side configured to substantially face away from building when the board is positioned on the building, wherein the insulating board does not cover the channel on the first side.

5. The climate control board of any of the preceding claims, wherein the insulating board is not positioned between the channel and the building.

6. The climate control board of any of the preceding claims, further comprising a conductive material, wherein the conductive material is positioned at least partially between the channel and the building.

7. The climate control board of claim 6, wherein the conductive material is configured to contact the building when the board is positioned on the building.

8. The climate control board of claim 6 or 7, wherein the conductive material at least partially surrounds the at least one pipe.

9. The climate control board of claim 6, 7 or 8, wherein the conductive material is a liquid conductive material which is applied to the board, where the liquid conductive material is initially liquid and then solidifies to form a solid conductive material.

10. The climate control board of any of claims 6 to 9, wherein the conductive material comprises latex or cement, or metal foil.

11. The climate control board of any of claims 6 to 10, wherein the at least one channel for the at least one pipe comprises at least one recess for the conductive material.

12. The climate control board of any of claims 6 to 11 wherein the at least one channel for the at least one pipe comprises serrations for the conductive material.

13. The climate control board of any of claims 6 to 12, wherein the insulation board comprises at least one additional channel which does not comprise a pipe, wherein the at least one additional channel is for the conductive material.

14. The climate control board of claim 13, wherein the at least one additional channel is contiguous with the at least one channel.

15. The climate control board of any of claims 11 to 14, wherein the at least one recess, serrations and / or at least one additional channel comprise conductive material.

16. The climate control board of any of the preceding claims, wherein the climate control board comprises a groove at least partially around the perimeter of the board.

17. The climate control board of any of the preceding claims, wherein the climate control board forms at least part of the external cladding of the building.

18. The climate control board of any of the preceding claims, further comprising a C section support comprising spikes positioned on the rear side of the C section support, wherein the spikes are for connecting the C section support and insulating board.

19. The climate control board of any of the preceding claims, wherein the at least one pipe forms at least part of a pipe layout comprising one or more flow circuits for a radiant heating and cooling system20. A radiant heating and cooling system comprising at least two climate control boards according to any of claims 1 to 1921. The radiant heating and cooling system of claim 20, wherein the radiant heating and cooling system is prefabricated, with the at least two boards being joined together prior to installation on the building.

22. A radiant heating and cooling system positioned externally to the building on at least one external wall or roof of the building, and configured to heat and / or cool the building by heat passing through the wall or roof of the building.

23. The radiant heating and cooling system of claim 22, wherein the radiant heating and cooling system comprises at least one climate control boards according to any of claims 1 to 19.

24. A method comprising:heating or cooling a building from outside using a radiant heating and cooling system positioned externally to the building on at least one external wall or roof of the building, wherein the radiant heating and cooling system is configured to heat and / or cool the building by heat passing through the wall or roof of the building.

25. An insulating board comprising:a first layer comprising an insulating material; anda second layer comprising foam, sponge, rubber or other soft material, wherein the second layer is lower density than the first layer;wherein the insulating board is configured to be positioned on a wall or roof of a building in order to insulate the building.

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