Diffusion-welded heat exchanger and design method therefor
The diffusion bonding heat exchanger addresses the challenge of compactness and strength in conventional designs by using engagement grooves and plates to increase contact area and welding strength, resulting in improved flow channel density and efficiency.
Patent Information
- Authority / Receiving Office
- GB · GB
- Patent Type
- Applications
- Current Assignee / Owner
- NUCLEAR POWER INSTITUTE OF CHINA
- Filing Date
- 2024-10-11
- Publication Date
- 2026-06-03
AI Technical Summary
Conventional heat exchangers face limitations in achieving high compactness and welding strength due to the requirement for a minimum contact area between heat exchange plates, restricting the arrangement of flow channels.
A diffusion bonding heat exchanger design featuring engagement grooves and plates that enhance the contact area and welding strength between adjacent plates, allowing for a more compact arrangement of flow channels.
The design improves welding strength and compactness, increasing the number of flow channels and enhancing heat exchange efficiency while maintaining structural stability and reliability.
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Abstract
Description
[0002] This application relates to the technical field of forging processing, and in particular, to a diffusion bonding heat exchanger and a design method therefor. BACKGROUND
[0003] At present, the heat exchanger used in the conventional industrial field mainly includes a shell-and-tube heat exchanger, a jacketed heat exchanger, a plate heat exchanger, a plate-fin heat exchanger, etc., which cannot meet the requirements of large heat exchange specific surface area, high welding strength and compact size at the same time. In recent years, with advancements in industrial manufacturing, micro-channel heat exchangers with high-precision chemical etching and vacuum diffusion welding as a process core are increasingly being adopted, and has significant advantages due to its small micro-channel size, high compactness, slag-free welding, strength at a joint close to a base material.
[0004] However, in the welding process of the heat exchanger, in order to ensure the welding quality and the strength of the heat exchanger, the contact area between the heat exchange plates cannot be too small, which limits the arrangement compactness of the flow channels on the heat exchange plate, failing in further improvements in the compactness of the heat exchanger. SUMMARY
[0005] The main objective of the present application is to provide a diffusion bonding heat exchanger and a design method therefor, which aim to solve the defect of low compactness in the prior art.
[0006] The present application achieves the above object through the following technical solutions.
[0007] A diffusion bonding heat exchanger, comprising: a plurality of heat exchange plates, each of the heat exchange plates being provided with a heat exchange flow channel, and the heat exchange plates are arranged in a stacked configuration; an engagement groove, the engagement groove comprising two engagement cavities in communication with each other, and the two engagement cavities being respectively disposed on two adjacent heat exchange plates; and an engagement plate inserted into the engagement groove, and an inner wall of the engagement groove and an outer wall of the engagement plate abut against each other along a stacking direction of the heat exchange plates.
[0008] Optionally, the two engagement cavities are simultaneously disposed on a top surface or a bottom surface of the heat exchange plates.
[0009] Optionally, the two engagement cavities are respectively disposed on a top surface and a bottom surface of the heat exchange plates.
[0010] Optionally, the engagement groove is U-shaped, S-shaped, or Z-shaped.
[0011] Optionally, the heat exchange flow channel includes a plurality of first heat exchange flow channels and / or a plurality of second heat exchange flow channels, and a flow area of the first heat exchange flow channel is different from a flow area of the second heat exchange flow channel.
[0012] Optionally, a temperature measurement hole is further formed in the engagement groove along the length direction of the engagement groove, and a temperature sensor is disposed inside the temperature measurement hole.
[0013] Correspondingly, the present application further discloses a design method for the above diffusion bonding heat exchanger, including the following steps: determining a size parameter of each of the plurality of heat exchange flow channel, and calculating an inherent welding area between two adjacent heat exchange plates according to the size parameters; determining a total welding area ratio, and calculating a total welding area according to the total welding area ratio; calculating an extended welding area according to the total welding area and the inherent welding area; obtaining a contour structure and a size parameter set of the engagement plate according to the extended welding area; and selecting a size parameter from the size parameter set as a size parameter of the engagement plate.
[0014] Optionally, the inherent welding area satisfies the following calculation formula: So=A-amL; wherein A represents a surface area of the heat exchange plate; a represents a cross-sectional width of the heat exchange flow channel; L represents a length of the heat exchange flow channel, and m represents a number of heat exchange flow channels.
[0015] Optionally, the total welding area ratio satisfies an expression n>n0, and the total welding area is calculated from a formula S=n*A; wherein n represents the total welding area ratio, A represents a surface area of the heat exchange plate, SO represents the inherent welding area, and nO represents a safety threshold for the total welding area ratio; and the extended welding area is calculated from a formula: AS=S-S0.
[0016] Optionally, the obtaining a contour structure and a size parameter set of the engagement plate according to the extended welding area includes: determining the contour structure of the engagement plate; determining a first constraint condition according to the extended welding area and the contour structure; determining a second constraint condition according to the contour structure and strength requirements of the engagement plate; determining a third constraint condition according to the size parameters of the heat exchange plate and the heat exchange flow channel; and determining the size parameter set according to the first constraint condition, the second constraint condition, and the third constraint condition.
[0017] Compared with the prior art, the present application has the following beneficial effects.
[0018] The present application includes a plurality of heat exchange plates, each of the heat exchange plates is provided with a heat exchange flow channel, and the heat exchange plates are arranged in a stacked configuration. Each of the heat exchange plates is further provided with an engagement cavity, and the engagement cavities on the two adjacent heat exchange plates are spliced together to define an engagement groove. The heat exchanger further comprises an engagement plate, the engagement plate is inserted into the engagement groove. Along the stacking direction of the heat exchange plates, the inner wall of the engagement groove and the outer wall of the engagement plate abut against each other.
[0019] Correspondingly, the present application further discloses a design method for the heat exchanger. A size parameter of each heat exchange flow channel is determined first, an inherent welding area between two adjacent heat exchange plates is calculated according to the size parameters, a total welding area ratio is determined, and a total welding area is calculated according to the total welding area ratio, an extended welding area is calculated according to the total welding area and the inherent welding area, and finally the contour and a size parameter of the engagement plate are designed according to the extended welding area.
[0020] Compared with the prior art, the arrangement of the engagement groove and the engagement plate can effectively improve the connection tightness between two adjacent heat exchange plates, thereby improving the connection strength.
[0021] Secondly, the contact area between two adjacent heat exchange plates is effectively improved in the stacking direction due to the cooperation between the engagement groove and the engagement plate, so that the contact area between two adjacent heat exchange plates is larger, resulting in improved welding strength between adjacent heat exchange plates, even under the limitation of the size and the structure of the heat exchange plate.
[0022] The improvement in the welding strength ensures that the spacing between two adjacent heat exchange flow channels on the same heat exchange plate can be further reduced, thereby improving the compactness of the entire heat exchange plate.
[0023] Due to the improvement in the compactness of the heat exchange flow channels on the heat exchange plate, the number of the heat exchange flow channels is improved, so that the contact area of the heat exchange medium is effectively improved, which is beneficial to further improvement in the heat exchange efficiency of the heat exchanger.
[0024] Finally, compared with the prior art, the above objects can be achieved simply by using the engagement plate, resulting in a simple overall structure. Moreover, after the diffusion bonding process is completed, the engagement plate forms an integral structure with two adjacent heat exchange plates, which effectively ensures the stability and reliability of the whole heat exchanger. BRIEF DESCRIPTION OF DRAWINGS
[0025] FIG. 1 is a schematic structural diagram of a diffusion bonding heat exchanger according to Embodiment 1 of the present application;
[0026] FIG. 2 is a side view of the diffusion bonding heat exchanger according to Embodiment 1 of the present application;
[0027] FIG. 3 is a schematic structural diagram of another alternative embodiment of the diffusion bonding heat exchanger according to the present application;
[0028] FIG. 4 is a schematic structural diagram of yet another alternative embodiment of the diffusion bonding heat exchanger according to the present application;
[0029] FIG. 5 is a schematic assembly diagram of a diffusion bonding heat exchanger and a welding fixture;
[0030] FIG. 6 is a flowchart of a design method for a diffusion bonding heat exchanger according to Embodiment 2 of the present application,
[0031] FIG. 7 is a diagram identifying an area of each part of a U-shaped engagement plate used in the design method;
[0032] FIG. 8 is a schematic diagram illustrating the principle of calculating an extended welded area; and
[0033] FIG. 9 is a diagram identifying an area of each part of a Z-shaped engagement plate used in the design method;
[0034] Reference numerals: 1 - heat exchange plate, 2 - heat exchange flow channel, 3 - engagement groove, 4 -engagement plate, 5 - temperature measurement hole, 6 - temperature sensor, 7 -compression plate, 8 - compression screw, 9 - compression hole, 10 - compression nut, 201 - first heat exchange flow channel, 202 - second heat exchange flow channel, 301 - engagement cavity.
[0035] The objectives, features, and advantages of this application are further described with reference to the accompanying drawings in combination with the embodiments. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0036] The following clearly and completely describes the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. It should be understood that the described embodiments are merely part of the embodiments of the present application, rather than all of them. All other embodiments obtained by any person of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the protection scope of this application.
[0037] It should be noted that all directional indications (such as upper, lower, left, right, front, and back) in the embodiments of this application are intended solely to describe the relative positional relationships and movement conditions among the components under a specific posture (as shown in the drawings). If the specific posture is changed, the corresponding directional indications shall also be changed accordingly.
[0038] In this application, unless otherwise specified and limited, the terms including "connected"," fixed ", and the like should be understood in a broad sense. For example, "fixed "may refer to a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, communication or interaction between two elements, unless expressly limited otherwise. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure may be understood according to context.
[0039] In addition, if descriptions of "first", "second", and the like are involved in the embodiments of this application, descriptions such as "first", "second", and the like are used for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the entire text includes three parallel solutions. For example, "A and / or B" covers three scenarios, including an A solution, or a solution B, or a solution simultaneously satisfied by A and B. In addition, the technical solutions between the embodiments may be combined with each other, provided that such combination is implemented by any person of ordinary skill in the art. When the combination of the technical solutions is contradictory or cannot be implemented, it should be considered that such combination of the technical solutions does not exist, and is not within the protection scope of the present application.
[0040] Embodiment 1
[0041] Referring to FIG. 1 to FIG. 2, the present embodiment, as an optional implementation of the present application, discloses a diffusion bonding heat exchanger, comprising a plurality of heat exchange plates 1, wherein the heat exchange plates 1 are stacked in their height direction.
[0042] A heat exchange flow channel 2 is arranged on the lock plate 4, wherein the heat exchange flow channel 2 comprises a plurality of first heat exchange flow channels 201 and / or a plurality of second heat exchange flow channels 202. The flow area of the first heat exchange flow channel 201 may be greater than the flow area of the second heat exchange flow channel 202, or may be less than the flow area of the second heat exchange flow channel 202, and the ratio of the flow area of the first heat exchange flow channel 201 to the flow area of the second heat exchange flow channel 202 is determined according to actual conditions.
[0043] If there are two types of heat exchange flow channels 2, the two different types of heat exchange flow channels 2 may be disposed on the two repetitive heat exchange plates 1, or may be disposed on the upper side and the lower side of the same heat exchange plate 1. During the stacking process ,the two types of heat exchange flow channels 2 are alternately stacked.
[0044] If there is only one type of heat exchange flow channel 2, a complete heat exchange flow channel 2 can be arranged on a single heat exchange plate 1, or may be split into two halves separately placed on two adjacent heat exchange plates 1. The two halves are then spliced into a complete heat exchange flow channel 2 after the heat exchange plates 1 are stacked, as shown in FIGS. 3 to 5.
[0045] It should be noted that various configurations of the heat exchange channels are possible, and all such configurations fall within the protection scope of the present disclosure.
[0046] The diffusion bonding heat exchanger further comprises an engagement groove 3. The engagement groove 3 comprises two engagement cavities 301. After the heat exchange plates 1 are stacked, the engagement cavities 301 on two adjacent heat exchange plates 1 are spliced and in communication.
[0047] In order to symmetrically fix the heat exchange plate 1, the two sides of the heat exchange plate 1 are both provided with the engagement cavities 301, between which the heat exchange flow channel 2 is arranged.
[0048] As shown in FIG. 1, the engagement cavities 301 located on two sides of the heat exchange plate 1 can be both arranged on the top surface or the bottom surface of the heat exchange plate 1. In such arrangement, after the heat exchange plates 1 are stacked, the two engagement grooves 3 that are spliced together can lie in the same plane.
[0049] As shown in FIG. 3, the engagement cavities 301 located on two sides of the heat exchange plate 1 may also be respectively disposed on the top surface and the bottom surface of the heat exchange plate 1. In such arrangement, after the heat exchange plates 1 are stacked, the two engagement grooves 3 that are spliced together can arranged on the upper side and the lower side of the heat exchange plate 1, respectively. Across the entire heat exchanger, the engagement groove 3 is distributed on an S-shaped trajectory.
[0050] The diffusion bonding heat exchanger further comprises an engagement plate 4, which is inserted into the engagement groove 3. The engagement plate is in interference fit with the engagement groove 3, so that the inner wall of the engagement groove 3 and the outer wall of the engagement plate 4 abut against each other along the stacking direction after the engagement plate 4 is inserted into the engagement groove 3, thereby ensuring that the engagement plate 4 is tightly attached to the two heat exchange plates 1 in the stacking direction.
[0051] As needed, the cross section of the engagement groove 3 is U-shaped, S-shaped or Z-shaped. It should be noted that the cross section of the engaging groove 3 may also be any other structure capable of improving the contact area between the engagement plate 4 and the engagement groove 3.
[0052] It should also be noted that, as shown in FIG. 3 and FIG. 4, the included angle between the adjacent engagement plates 4 may be 0°, that is, all the engagement plates 4 are arranged in the same direction. Alternatively, the included angle may also be 90°, that is, the engagement plates 4 are crisscrossed.
[0053] A temperature measurement hole 5 is further provided on the engagement plate 4, and is provided along the length direction of the engagement plate 4. A thermocouple or other temperature sensor 6 is inserted into the temperature measurement hole 5. The temperature between the two heat exchange plates 1 can be detected in real time by the temperature sensor 6, thereby enhancing temperature control during the diffusion bonding process, and contributing to improved welding quality.
[0054] The invention further discloses a welding fixture for the diffusion bonding heat exchanger. The welding fixture comprises two compression plates 7 and a plurality of compression screws 8. Each of the pressing plates 7 is provided with a plurality of compression holes 9. As shown in FIG. 5, during use, the two compression plates 7 are arranged on the front side and the rear side of the engagement plate 4 respectively. The compression screws 8 pass through the compression holes 9 to connect the compression plates 7 in series. The compression nuts 10 are threadedly connected to the two ends of the compression screw 8, and the clamping force between the compression plates 7 is adjusted through the compression nuts 10.
[0055] The above-mentioned welding fixture not only allows for rapid alignment of heat exchange plates 1, thereby improving the stacking efficiency of the heat exchange plate 1, but also facilitates one-time insertion of all the engagement plates 4, which maximizes the assembly efficiency of the entire heat exchanger. Further, the clamping force of the two compression plates 7 can ensure that the heat exchange plates 1 are tightly attached, contributing to the improvement of the diffusion bonding quality.
[0056] Compared with the prior art, in the present application, the engagement grooves and the engagement plates are provided between the two heat exchange plates. On the one hand, the connection tightness between two adjacent heat exchange plates can be effectively improved, thereby improving the connection strength. On the other hand, the contact area between two adjacent heat exchange plates is effectively improved in the stacking direction through the cooperation of the engagement groove and the engagement plate. Therefore, in the diffusion bonding process, the contact area between two adjacent heat exchange plates is larger, resulting in improved welding strength between the adjacent heat exchange plates, even under the limitation of the size and the structure of the heat exchange plate.
[0057] The improvement in the welding strength can ensure that any person skilled in the art can further reduce the spacing between two adjacent heat exchange flow channels on the same heat exchange plate, thereby improving the compactness of the entire heat exchange plate.
[0058] Meanwhile, due to the improvement in the compactness of the heat exchange flow channels on the heat exchange plate, the number of the heat exchange flow channels is improved, so that the contact area of the heat exchange medium is effectively improved, which is beneficial to further improvement in the heat exchange efficiency of the whole heat exchanger.
[0059] Finally, compared with the prior art, the above objects can be achieved simply by using the engagement plate, resulting in a simple overall structure. Moreover, after the diffusion bonding process is completed, the engagement plate forms an integral structure with two adjacent heat exchange plates, which effectively ensures the stability and reliability of the whole heat exchanger.
[0060] Embodiment 2
[0061] Referring to FIG. 6 to FIG. 9, this embodiment is another optional implementation of the present application, and discloses a design method of a diffusion bonding heat exchanger, including the following steps SI to S5.
[0062] In SI, a size parameter of each heat exchange flow channel is determined, and an inherent welding area between two adjacent heat exchange plates is calculated according to the size parameters.
[0063] Firstly, the size parameter of the heat exchange flow channel is determined according to the heat exchange fluid of the heat exchanger, including the number of types of heat exchange flow channels, the cross-sectional shape, and the cross-sectional width a of the heat exchange flow channel. If the cross section of the heat exchange flow channel is semicircular or circular, the cross-sectional width is a diameter. If the cross section is square, the cross-sectional width is the width of the cross section.
[0064] Then, two regions for forming the engagement cavity are reserved on two sides of the heat exchange plate, and the heat exchange flow channel is arranged between the two regions.
[0065] A distance between two adjacent heat exchange flow channels is determined based on the welding density and pressure of the heat exchange fluid, so as to determine the number m of heat exchange flow channels that can be distributed on the heat exchange plate.
[0066] Then, the shape of the heat exchange flow channel in the flow direction of the heat exchange fluid is designed as needed, such as S-shaped, linear or any other shape, and the length L of the heat exchange flow channel is calculated.
[0067] After the above parameters are obtained, the inherent welding area can be calculated according to the formula So=A-amL, where A represents the surface area of the heat exchange plate.
[0068] In S2, a total welding area ratio is determined, and a total welding area is calculated according to the total welding area ratio.
[0069] The total welding area ratio of the diffusion bonding has a certain safety threshold no, and the total welding area ratio n should satisfy n>no.
[0070] The total welding area ratio is determined according to actual conditions such as pressure borne by the heat exchanger, and then the total welding area is calculated according to a calculation formula S=n*A.
[0071] In S3, an extended welding area is calculated according to the total welding area and the inherent welding area.
[0072] Obtain the inherent welding area So calculated in step S1 and the total welding area obtained in step S2, and the extended welding area is calculated according to the formula AS=S-So.
[0073] In S4, a contour structure and a size parameter set of the engagement plate are obtained according to the extended welding area.
[0074] In S41, the contour structure of the engagement plate is determined.
[0075] It should be noted that this step will be described in detail in terms of U-shaped and Z-shaped engagement plates.
[0076] In S42, a first constraint condition is determined according to the extended welding area and the contour structure.
[0077] If the selected engagement plate is U-shaped, it can be seen in conjunction with FIG. 7 that the diffusion bonding only needs to consider the increased contact area in the vertical direction. As shown in FIG. 8, after an engagement plate is installed, the regions marked as a, b, c, and d in the figure represent the newly added contact areas. Therefore, the contact area between two adjacent heat exchange plates, due to the insertion of the engagement plate, is 2*(Ss + S2), where S2 represents the inner surface area of the suspended end of the engagement plate, and S3 represents the outer surface area of the suspended end of the engagement plate, as shown in Figure 7. However, after provided, the engagement cavity will form a notch on the surface of the heat exchange plate, the area of the notch needs to be deducted. The area of the notch is Si. After the engagement plate is provided, the newly added contact area in the vertical direction is 2 * (S3 + S2) - Si. As shown in FIG. 8, the suspended end on the upper side of the engagement plate is inserted into the upper heat exchange plate, and the suspended end on the lower side of the engagement plate is inserted into the lower heat exchange plate. Both the inner and outer surfaces of the two suspended ends can fit against the inner wall of the engagement cavity in the stacking direction. However, in the technical solution where no engagement plate is provided, the notch at the splice of the upper and lower engagement cavities is included the welding area (that is, Si in the figure). Therefore, compared with the technical solution in which no engagement plate is provided, the area of the notch needs to be deducted, and thus the newly added contact area is 2 * (S3 + S2) - Si.
[0078] Since two engagement plates are provided, the extended welding area between two adjacent heat exchange plates is: AS=2*2*(S3+S2)-2*Si. There is also the following relationship from the structure of the engagement plate: 83=82+81.
[0079] In combination with n>no, an expression of the first constraint condition is as follows.
[0080] It can be obtained from S3 the following expression: AS=S-So=n*A-(A-amL)=n*A-A+amL.
[0081] Meanwhile, since n>no, there is AS>no*A-A+amL.
[0082] Since AS=2*2*(S3+S2)-2*Si, there is S3=S2+Si.
[0083] Therefore, there is 2*2*(S3+S2)-2*Si>no*A-A+amL.
[0084] The expression of the first constraint condition is: 8S2+2Si>(no-l)A+amL.
[0085] If the selected engagement plate is Z-shaped in cross section, the extended welding area of the engagement plate satisfies the same calculation relationship.
[0086] In S43, a second constraint condition is determined according to the contour structure and the strength requirement of the engagement plate.
[0087] Since the engagement plate includes a vertically arranged connector, the structural strength of the above-mentioned area is weak. Therefore, in order to meet the strength requirement of the overall structure of the engagement plate, in combination with the material of the engagement plate, it is determined that the second constraint condition is: Si>S2 / 3.
[0088] The Z-shaped engagement plate also needs to satisfy the above constraint conditions.
[0089] In S44, a third constraint condition is determined according to the size parameters of the heat exchange plate and the heat exchange flow channel.
[0090] According to step SI, it can be seen that the area for placing the engagement cavity is provided on both sides of the heat exchange plate, thus the width of the engagement cavity cannot be greater than the width of the above-mentioned area. Since the length of the above-mentioned area is the same as the length of the engagement cavity, the expression of the third constraint condition is: S4>S2+Si.
[0091] If the selected engagement plate is Z-shaped, based on the same principle, the expression of the third constraint condition is: S4>2S2+Si.
[0092] In S45, the size parameter set is determined according to the first constraint condition, the second constraint condition, and the third constraint condition.
[0093] In combination with the first constraint condition, the second constraint condition and the third constraint condition, all (Si, S2) meeting the constraint condition are valid size parameters, and the parameters are collected to obtain the size parameter set,
[0094] In S5, a size parameter is selected from the size parameter set, as the size parameter for the engagement plate.
[0095] The above are only preferred embodiments of the present application, and are not therefore intended to limit the patent scope of the present application, and any equivalent structure or equivalent process modifications made based on the description and drawings of the present application, or direct or indirect applications in other related technical fields, are all included in the patent protection scope of the present application.
Claims
1. A diffusion bonding heat exchanger, comprising:a plurality of heat exchange plates (1), each of the heat exchange plates (1) being provided with a heat exchange flow channel (2), and the heat exchange plates (1) are arranged in a stacked configuration;an engagement groove (3), the engagement groove (3) comprising two engagement cavities (301) in communication with each other, and the two engagement cavities (301) being respectively disposed on two adjacent heat exchange plates (1); andan engagement plate (4) inserted into the engagement groove (3), and an inner wall of the engagement groove (3) and an outer wall of the engagement plate (4) abut against each other along a stacking direction of the heat exchange plates (1).
2. The diffusion bonding heat exchanger according to claim 1, wherein the two engagement cavities (301) are simultaneously disposed on a top surface or a bottom surface of the heat exchange plates (1).
3. The diffusion bonding heat exchanger according to claim 1, wherein the two engagement cavities (301) are respectively disposed on a top surface and a bottom surface of the heat exchange plates (1).
4. The diffusion bonding heat exchanger according to claim 2, wherein the engagement groove (3) is U-shaped, S-shaped or Z-shaped.
5. The diffusion bonding heat exchanger according to claim 1, wherein the heat exchange flow channel (2) comprises several first heat exchange flow channels (201) and / or several second heat exchange flow channels (202), and a flow area of the first heat exchange flow channel (201) is different from a flow area of the second heat exchange flow channel (202).
6. The diffusion bonding heat exchanger according to claim 1, wherein a temperature measurement hole (5) is further provided on the engagement plate (4) along a length direction of the engagement plate (4), and a temperature sensor (6) is provided inside the temperature measurement hole (5).
7. A design method for the diffusion bonding heat exchanger according to any one of claims 1 to 6, comprising:determining a size parameter of each of the plurality of heat exchange flow channel, and calculating an inherent welding area between two adjacent heat exchange plates according to the size parameters;determining a total welding area ratio, and calculating a total welding area according to the total welding area ratio;calculating an extended welding area according to the total welding area and the inherent welding area;obtaining a contour structure and a size parameter set of the engagement plate according to the extended welding area; andselecting a size parameter from the size parameter set as a size parameter of the engagement plate.
8. The design method according to claim 7, wherein the inherent welding area satisfies the following calculation formula: So=A-amL; wherein A represents a surface area of the heat exchange plate; a represents a cross-sectional width of the heat exchange flow channel; L represents a length of the heat exchange flow channel, and m represents a number of heat exchange flow channels.
9. The design method according to claim 7, wherein the total welding area ratio satisfies an expression n>nO, and the total welding area is calculated from a formula S=n* A; wherein n represents the total welding area ratio, A represents a surface area of the heat exchange plate, So represents the inherent welding area, and no represents a safety threshold for the total welding area ratio; and the extended welding area is calculated from a formula: AS=S-So.
10. The design method according to claim 7, wherein the obtaining a contour structure and a size parameter set of the engagement plate according to the extended welding area comprises:determining the contour structure of the engagement plate;determining a first constraint condition according to the extended welding area and the contour structure;determining a second constraint condition according to the contour structure and strength requirements of the engagement plate;determining a third constraint condition according to the size parameters of the heat exchange plate and the heat exchange flow channel; anddetermining the size parameter set according to the first constraint condition, the second constraint condition, and the third constraint condition.