Dynamic vacuum seal system for physical vapor deposition sputter applications
The sputtering target and isolation ring configuration addresses the vacuum seal integrity issues in PVD apparatuses by eliminating grooves and scallops, resulting in a robust and durable seal that enhances chamber performance.
Patent Information
- Authority / Receiving Office
- HK · HK
- Patent Type
- Applications
- Current Assignee / Owner
- TOSOH SMD INC
- Filing Date
- 2026-05-29
- Publication Date
- 2026-07-17
AI Technical Summary
Existing vacuum sealing systems in physical vapor deposition (PVD) apparatuses face challenges in maintaining effective seals due to grooves, vent slots, and scallops, which compromise the integrity and longevity of the vacuum environment.
A sputtering target with a flat first surface and an isolation ring with a stepped portion configured to interface with a sealing ring, eliminating grooves and scallops, thereby enhancing the vacuum seal integrity.
The solution provides a robust and durable vacuum seal that maintains the integrity of the PVD chamber, reducing leakage and improving the operational efficiency and longevity of the apparatus.
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Abstract
Description
(12) UK Patent Application (19)GB (11) 2700927 (13) A (43) Date of A Publication 25.03.2026 (30) Priority Data: YES (31) 63367914 (32) 08.07.2022 (33) US (62) Divided from Application No:Y GB2500054.8 under Section 15(9) of the Patents Act 1977 (71) Applicant(s): TOSOH SMD, INC. 3600 Gantz Rd., Grove City, Ohio 43123 (72) Inventor(s): Joseph Buckfeller Rick Eller John Rizer Lora Thrun Gary Offord (74) Agent and / or Address for Service: Barker Brettell LLP 100 Hagley Road, Edgbaston, BIRMINGHAM, B16 8QQ (21) Application No: 2513666.4 (22) Date of Filing: 10.07.2023 Date Lodged: 20.08.2025 (51) INT CL: C23C14 / 35 (2006.01) (56) Documents Cited: US 9476122 B2 (58) Field of Search: INT CL: C23C Other: SEARCH-PATENT (54) Title of the Invention: Dynamic vacuum seal system for physical vapor deposition sputter applications Abstract Title: Components of a physical vapour deposition apparatus (57) A sputtering target 255 comprises a first surface configured to selectively interface to a sealing ring 100 on a PVD vacuum chamber, wherein the first surface is devoid of any grooves, vent slots and scallops and is configured to contact the sealing ring with a flat surface. An isolation ring 210 comprises a first surface configured to selectively interface with a compressible portion 110 and a rigid portion 130 of a sealing ring when installed in a PVD vacuum chamber, wherein the first surface is generally flat, and a step-out portion 213 configured to selectively interface with a rim of the sealing ring. The step-out portion preferably has a cut out of approximately 90 degrees.[Figure 3B] Search report under Section 17 of the Patents Act 1977 Application No.: GB2513666.4 Claims searched: 1, 2 Date search completed: 22 December 2025 International classification Subclass and subgroup Valid from C23C14 / 35 01 / 01 / 2006 Field of search Worldwide search of patent documents classified in the following areas of the IPC: C23C Databases used in the preparation of this search report: SEARCH-PATENT Documents considered to be relevant Patent literature Category Relevant to claims Document of relevance X 1, 2 US 9476122 B2 (APPLIED MATERIALS INC) – See column 5 and figure 1. 38 Categories Letter or symbol Description X Document indicating lack of novelty or inventive step. Y Document indicating lack of inventive step, if combined with another document of the same category. & Member of the same patent family. A Document indicating technological background. P Document published on or after the priority date but before the filing date of the present application.E Earlier application published on or after the filing date of the present application. 39 HKP2620592 Invention Title: Dynamic Vacuum Sealing System for Physical Vapor Deposition Sputtering Applications Abstract: Sputtering target 255 includes: a first surface configured to selectively engage with a sealing ring 100 on a PVD vacuum chamber, wherein the first surface has no grooves, vents, or fan-shaped slots and is configured to contact the sealing ring with a flat surface. The isolation ring 210 includes a first surface and a stepped portion 213. When mounted in a PVD vacuum chamber, the first surface is configured to selectively engage with a compressible portion 110 and a rigid portion 130 of the sealing ring, wherein the first surface is generally flat. The stepped portion 213 is configured to selectively engage with an edge of the sealing ring. The stepped portion preferably has a cut of approximately 90 degrees. [Figure 3B] Abstract.
Claims
1. A sputtering target, comprising:a first surface configured to selectively interface to a sealing ring on a PVD vacuum chamber, wherein the first surface is devoid of any grooves, vent slots, and scallops and is configured to contact the sealing ring with a flat surface.
2. The sputtering target of claim 1, wherein the first surface is configured to be isolated from an isolation ring and wherein the isolation ring is configured to selectively interface with an opposite side of the sealing ring on the vacuum chamber, when installed in the PVD vacuum chamber.
3. An isolation ring, comprising:a first surface configured to selectively interface with a compressible portion and rigid portion of a sealing ring when installed in a PVD vacuum chamber, wherein the first surface is generally flat;a step-out portion configured to selectively interface with a rim of the sealing ring when installed in a PVD vacuum chamber.
4. The isolation ring of claim 3, wherein the step-out portion has a cut out of approximately 90 degrees.