COPPER FOIL, ELECTRODES COVERING THEM, SECONDARY BATTERIES COVERING THEM, AND METHODS OF MANUFACTURING THERE

Abstract

One embodiment of the present invention provides a copper foil comprising a copper layer having a dull surface and a shiny surface, and a protective layer disposed on said copper layer, wherein, when the boundaries having an orientation difference between adjacent pixels of 5° or more are considered as grain boundaries, then the ratio of the area of ​​crystal grains (including twin grains) having a high temperature GOS value in the range of 0° or more to less than 2° is 45% to 93% of the total cross-sectional area. Said high temperature GOS value is measured on the cross-section of the copper foil using an electron backscatter diffraction (EBSD) pattern analyzer after the copper foil has been heat treated at 190°C for one hour.