COPPER FOIL, ELECTRODES COVERING THEM, SECONDARY BATTERIES COVERING THEM, AND METHODS OF MANUFACTURING THERE
ID202606390APending Publication Date: 2026-08-05SK NEXILIS CO LTD
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Patent Information
- Application Number
- IDP00202515477
- Authority / Receiving Office
- ID · ID
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-30
- Filing Date
- 2025-12-29
- Publication Date
- 2026-08-05
Abstract
One embodiment of the present invention provides a copper foil comprising a copper layer having a dull surface and a shiny surface, and a protective layer disposed on said copper layer, wherein the copper foil has an indentation creep rate of 2.0 to 6.0%. Said indentation creep rate is measured using a nano-indenter.
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