SOLDER ALLOYS, SOLDER PASTE, SOLDER BALLS, PREFORMED SOLDER, SOLDER JOINTS, VEHICLE-MOUNTED ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, VEHICLE-MOUNTED ELECTRONIC CIRCUIT DEVICES, AND ECU ELECTRONIC CIRCUIT DEVICES

Abstract

Provided are a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device, each of which has a low melting point, high shear strength, and a suitable fracture mode. A solder alloy has an alloy composition comprising, by mass %, Ag: 2.0 to 3.6%, In: 1.0 to 5.0%, Sb: 3.0 to 5.0%, Fe: 0.001 to 0.030%, and Co: 0.0000% or more and 0.0500% or less, with the remainder being Sn. Preferably, the alloy composition further contains, on a mass % basis, at least one of Zr, Ge, Ga, P, As, Pb, Zn, Mg, Cr, Ti, Mo, Pt, Pd, Au, Al, and Si: 0.100% or less in total.