Ceiling molding

JP1811959SActive Publication Date: 2025-10-31FUKUBI KAGAKU IND
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Patent Information

Application Number
JP2025004878D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-03-12
Publication Date
2025-10-31
Estimated Expiration
2050-03-12

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Abstract

This article is a synthetic resin molding that is installed around the boundary between the ceiling material and the wall, and the receiving portion of the ceiling material and the condensation water receiving portion that receives condensation water flowing over the surface of the ceiling material are connected by soft resin.
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