Probe pin for integrated circuits testing
JP1821878SActive Publication Date: 2026-03-17HICON CO LTD +2
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2024-05-03
- Publication Date
- 2026-03-17
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Abstract
The material of this design is metal. This design is a probe pin that contacts electrodes, terminals, pads, etc., and is used for inspecting electronic components such as semiconductor devices, semiconductor packages, integrated circuits, and printed circuit boards. Our novel design has the shape of an integrated compression-recovery coil spring. Crown-shaped contact terminals are formed on both sides. The inside of the integrated coil spring body is a mixture of electrically conductive powder and stretchable material with elasticity. The main feature of this design is the shape of an "integrated circuit inspection probe pin". 1.1) Perspective view; 1.2) Front view; 1.3) Rear view; 1.4) Left side view; 1.5) Right side view; 1.6) Top view; 1.7) Bottom view
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