Probe pin for integrated circuits testing

JP1821892SActive Publication Date: 2026-03-17HICON CO LTD +2
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-05-03
Publication Date
2026-03-17

Smart Images

  • Figure 0001821892000001
    Figure 0001821892000001
  • Figure 0001821892000002
    Figure 0001821892000002
  • Figure 0001821892000003
    Figure 0001821892000003
Patent Text Reader

Abstract

The design is made of metal and features probe pins that connect electrodes, terminals, pads, and other components under test. It is used to inspect electronic components such as semiconductor devices, semiconductor packages, integrated circuits, and printed circuit boards. When the new integrated circuit inspection probe pin is compressed, the tip of the top of the probe contacts the component under test. 1.1) Perspective view; 1.2) Front view; 1.3) Rear view; 1.4) Left side view; 1.5) Right side view; 1.6) Top view; 1.7) Bottom view; 1.8) Reference drawing
Need to check novelty before this filing date? Find Prior Art