Probe pin for integrated circuits testing
JP1821892SActive Publication Date: 2026-03-17HICON CO LTD +2
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2024-05-03
- Publication Date
- 2026-03-17
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Abstract
The design is made of metal and features probe pins that connect electrodes, terminals, pads, and other components under test. It is used to inspect electronic components such as semiconductor devices, semiconductor packages, integrated circuits, and printed circuit boards. When the new integrated circuit inspection probe pin is compressed, the tip of the top of the probe contacts the component under test. 1.1) Perspective view; 1.2) Front view; 1.3) Rear view; 1.4) Left side view; 1.5) Right side view; 1.6) Top view; 1.7) Bottom view; 1.8) Reference drawing
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