A template component that is attached to a retainer ring for polishing semiconductor substrates.

Abstract

The semiconductor substrate polishing retainer ring is used in the substrate polishing process during semiconductor manufacturing, etc., and is attached to the head of a polishing device to hold the outside of the substrate to prevent it from detaching during polishing. This item is used integrally with the semiconductor substrate polishing retainer ring and is for holding non-circular (square) substrates during polishing. A storage pocket 10 for accommodating a non-circular (square) substrate is provided in the center of the front of the template 20 (see the reference diagram showing the state of use (bottom side perspective view)), and one side of the substrate is polished while the substrate is contained in this storage pocket 10. Multiple of these items are incorporated into the retainer ring 100 to form the template 20 and perform the function of surrounding and holding the substrate. Furthermore, when incorporated into the retainer ring 100, the shape of both sides of this item is formed to create recesses 21 and gaps 22 between adjacent items to allow slurry to escape and be discharged, in order to suppress the effect of slurry accumulation on the substrate polishing process.

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