Covers for electronic devices
JP1832216SActive Publication Date: 2026-07-24HYPER DIGITAL TWINS CO LTD
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- HYPER DIGITAL TWINS CO LTD
- Filing Date
- 2025-12-26
- Publication Date
- 2026-07-24
Smart Images

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Abstract
This item is a cover for housing electronic equipment (e.g., computing units, power strips, converters, various cables) that is installed indoors or outdoors and connected to sensor devices such as LiDAR. As shown in the reference perspective view illustrating the internal structure, the interior is hollow. In addition, as shown in the right and left side views, multiple heat dissipation holes are provided to release heat from inside the cover to the outside. Furthermore, as shown in the perspective view and the right side view, a rectangular opening for inserting cables is formed in the right corner.
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