Covers for electronic devices

JP1832216SActive Publication Date: 2026-07-24HYPER DIGITAL TWINS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
HYPER DIGITAL TWINS CO LTD
Filing Date
2025-12-26
Publication Date
2026-07-24

Smart Images

  • Figure 0001832216000001
    Figure 0001832216000001
  • Figure 0001832216000002
    Figure 0001832216000002
  • Figure 0001832216000003
    Figure 0001832216000003
Patent Text Reader

Abstract

This item is a cover for housing electronic equipment (e.g., computing units, power strips, converters, various cables) that is installed indoors or outdoors and connected to sensor devices such as LiDAR. As shown in the reference perspective view illustrating the internal structure, the interior is hollow. In addition, as shown in the right and left side views, multiple heat dissipation holes are provided to release heat from inside the cover to the outside. Furthermore, as shown in the perspective view and the right side view, a rectangular opening for inserting cables is formed in the right corner.
Need to check novelty before this filing date? Find Prior Art