Sensor module

JP1834425SActive Publication Date: 2026-08-26TAIWAN ASIA SEMICONDUCTOR CORPORATION
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Patent Information

Application Number
JP2026000722D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Priority Date
2025-09-25
Filing Date
2026-01-19
Publication Date
2026-08-26
Estimated Expiration
2051-01-19

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Abstract

This item is a sensor module used in wearable devices, comprising multiple arc-shaped photodiodes arranged in a ring, which are used to receive light and convert it into an electric current signal or a voltage signal.
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