Lineup of radar sensors

Abstract

To provide a lineup of radar sensors that enables cost optimization.SOLUTION: A lineup of radar sensors in each of various embodiments (10) is a lineup of sensors in which each radar sensor includes: a housing (12) closed by a radome (14); a circuit board (18) mounted together with at least one high-frequency module (22) on the side opposite the radome (14); and an antenna structure on the side of the circuit board (18) facing the radome (14). The housing (12) is configured identically in all the embodiments (10), and the antenna structure has a planar antenna structure in at least one embodiment, and a waveguide structure (38) in at least one embodiment (10).SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a lineup of radar sensors in various embodiments, each radar sensor comprising: - a housing closed by a radome, - a circuit board mounted together with at least one high-frequency module on the side opposite to the radome, - an antenna structure on the side of the circuit board facing the radome. It relates to a lineup.

[0002] In particular, the present invention deals with a lineup of radar sensors used for detecting the traffic environment in a motor vehicle, for example, in the framework of a driver assistance system, a collision warning system, or for autonomous driving.

Background Art

[0003] Radar sensors are used in motor vehicles for various tasks with various performance profiles, for example, for monitoring the front of an individual vehicle in the framework of a vehicle distance control system, as a side radar for detecting objects in blind spots, or as a rear space radar in the framework of a lane change assistance function. In the case of radar sensors for autonomous driving, the performance requirements inevitably increase. Conventionally, by making radar sensors available in various embodiments, these various requirements are taken into account.

[0004] However, on the other hand, from the perspective of cost-effective manufacturing, it is desirable to have as few variants as possible.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The problem of the present invention is to provide a lineup of radar sensors that enables cost optimization.

Means for Solving the Problems

[0006] This problem is solved by the fact that, according to the present invention, the housing is configured identically in all embodiments, and the antenna structure comprises a planar antenna structure in at least one embodiment and a waveguide structure in at least one embodiment.

[0007] The unified housing configuration across all embodiments allows for cost-effective mass production of the housings. For example, embodiments with a cost-effective planar antenna structure using microstrip techniques are sufficient to meet most tasks in automobiles. Waveguide structures are used instead of planar antenna structures, particularly for applications requiring low energy loss and / or large bandwidth and / or larger lateral detection ranges at wider angles; however, waveguide structures incur higher costs and should therefore only be used when necessary. Both embodiments can be manufactured using a nearly unified manufacturing process, the only difference being that in one case the planar antenna structure is formed on a circuit board, while in the other case a waveguide structure is instead mounted on the circuit board.

[0008] Advantageous and advanced forms of the present invention are presented in the cited claims. The waveguide structure may be configured as a single-layer or multi-layer waveguide structure, and only a small distance is required between the circuit board and the radome.

[0009] Generally, radar sensors require an interface for data exchange with higher-level control equipment. This interface may be uniformly designed for all embodiments. The same applies to thermal diffusers for diffusing and dissipating heat losses from active electronic components.

[0010] The mounting of electronic elements onto the circuit board may also be largely the same for various embodiments. The circuit board may also be configured substantially the same in various embodiments, except for the modified high-frequency layout on the side of the circuit board facing the radome.

[0011] With a unified housing geometry and nearly uniform mounting, various embodiments may be manufactured on the same production line. Therefore, the subject of the present invention is also a method for manufacturing the above-mentioned lineup, in which various embodiments are manufactured on the same production line.

[0012] The exemplary embodiments will be described in more detail below with reference to the drawings. [Brief explanation of the drawing]

[0013] [Figure 1] This is a cross-sectional view of the entire radar sensor in the first embodiment. [Figure 2] This is a cross-sectional view of the entire radar sensor in the second embodiment. [Figure 3] This figure shows a modified form of the embodiment shown in Figure 2. [Figure 4] This figure shows a modified form of the embodiment shown in Figure 2. [Figure 5] This is a cross-sectional view of the entire radar sensor according to a further embodiment. [Figure 6] This is a cross-sectional view of the entire base module, unified across all radar sensors in the lineup. [Modes for carrying out the invention]

[0014] Figure 1 shows a schematic cross-sectional view of a first embodiment 10 of an automotive radar sensor. The radar sensor comprises a housing 12, which is closed on one upper side in Figure 1 by a radome 14. Inside the housing 12, a plurality of support domes 16 are formed to which a circuit board 18 is fixed. The circuit board 18 supports a microwave substrate 20 on its upper surface and further electronic components 24 are mounted on its lower surface, along with at least one high-frequency module 22 (MMIC). Electronic components that generate heat during operation are in thermal contact with a heat diffuser 28 via a heat conduction medium 26, and the heat diffuser 28 dissipates heat to the bottom of the housing 12, which forms a group of cooling fins 30.

[0015] The circuit board 18 and microwave substrate 20 are electrically, thermally, and mechanically connected to the housing 12 and heat diffuser plate 28 via press-fit pins 32 (right side in Figure 1). The housing 12 (excluding the radome 14) may be metallized, thereby forming a shield for the electronic components.

[0016] On the left side of Figure 1, the circuit board is in contact with press-fit pins 34, which also form the contacts of a plug that forms an interface 36 for data exchange with control equipment (not shown).

[0017] A single-layer waveguide structure 38 is positioned on the microwave substrate 20 located on the upper surface of the circuit board 18, within the flat space between the circuit board 18 and the radome 14. This waveguide structure forms a plurality of waveguides 40 at the same height, which are connected to the signal inputs and outputs of the high-frequency module 22 via high-frequency connectors (not shown), forming a radiation window on the upper side, and are emitted through the radome via the microwave output 42. The waveguide structure 38 may be formed, for example, by a metallized plastic block soldered to a ground electrode 44 covering the microwave substrate 20. This ground electrode is connected to the corresponding contact of the high-frequency module 22 via a via 46, and simultaneously forms the lower end of the waveguide 40.

[0018] Figure 2 shows a cross-sectional view of the entire radar sensor in the second embodiment 50. The housing 12, the heat diffusion plate 28, the press-fit pins 32, 34, and the interface 36 as a whole are structurally identical to the corresponding components in FIG. 1, that is, they have the same shape and material. The circuit board 18, the high-frequency module 22, and the other electronic components 24 may also be at least substantially the same as the corresponding components in FIG. 1. However, instead of the waveguide antenna formed by the waveguide structure 38 in FIG. 1, the radar sensor in the embodiment 50 includes a planar antenna structure 52, which is formed by microstrip conductors 54, 56 on the high-frequency substrate 20. The microstrip conductors 54, 56 are connected to the corresponding contacts of the high-frequency module 22 via vias in a known manner.

[0019] The manufacturing processes for the embodiments 10 and 50 are essentially different only in that in one case the waveguide structure 38 is mounted on the circuit board and in the other case the planar antenna structure 52 is formed on the circuit board by the microstrip technique. Further differences may lie in the use of different materials for the circuit board 18 and the high-frequency substrate 20. Furthermore, there may also be some differences in the mounting of the electronic components.

[0020] Components that are the same in both embodiments, such as the housing 12, can be manufactured in large quantities and thus can be efficiently manufactured for the entire lineup. The steps required to assemble the components are also almost the same except for some differences in the mounting of the circuit board 18, so both embodiments can be manufactured on the same production line.

[0021] Figure 3 shows a variant 50' of the second embodiment 50 according to FIG. 2. In this variant, the flat hollow space between the circuit board 18 and the radome 14 is used to accommodate an absorber structure 58 used to suppress interfering radiation. Here, the absorber structure 58 is fixed to the lower surface of the radome 14, for example, by adhesion.

[0022] Figure 4 shows a further modified form 50'' in which the absorber or shielding structure 58' is fixed to the upper surface of the circuit board 18, for example, by soldering. Figure 5 shows a third embodiment 60 having a hybrid antenna structure in which part is formed by a planar antenna element 52' and part is formed by a waveguide structure 38'. For example, in the case of a bistatic radar sensor, the transmitting antenna may be configured as a planar antenna and the receiving antenna as a waveguide antenna, or vice versa.

[0023] Figure 6 shows the base module 70 again, which includes all the radar sensor components that are identical in all the embodiments described above. [Explanation of symbols]

[0024] 10, 50, 60 Embodiments 12 Housing 14 Radome 16 Support domes 18 circuit board 20 Microwave substrates 22 High-Frequency Modules 24 Electronic Components 26 Thermal Conducting Medium 28 Heat Diffuser 30 cooling fins 32, 34 Press-fit pins 36 Interfaces 38, 38' waveguide structure 40 Waveguides 42 Microwave power 44 Ground electrode 46 Bya 50', 50'' transformed form 52 Planar Antenna Structure 52' Planar antenna element 54, 56 Microstrip Conductors 58 Absorber structure 58' shielding structure 70 Base Module

Claims

1. A lineup of radar sensors in various embodiments (10, 50, 60), each of which comprises: a housing (12) enclosed by a radome (14); a circuit board (18) mounted with at least one radio frequency module (22) on an opposite side of the radome (14); an antenna structure on a side of the circuit board (18) facing the radome (14); In our radar sensor lineup, The housing (12) is configured identically in all embodiments (10, 50, 60), and the antenna structure comprises a planar antenna structure (52) in at least one embodiment (50) and a waveguide structure (38) in at least one embodiment (10). A lineup that features:

2. 2. The lineup according to claim 1, wherein the radar sensors in all embodiments (10, 50, 60) are provided with an identically configured interface (36) for data exchange with a control device.

3. 2. The lineup of claim 1, wherein the radar sensors in all embodiments (10, 50, 60) are provided with an identically configured heat spreader (28) inside the housing (12).

4. The lineup of claim 1 , wherein the waveguide structure (38) is a single layer waveguide structure.

5. 2. The lineup of claim 1, wherein in at least one embodiment (50', 50'') having a planar antenna structure (52), an absorber or shielding structure (58, 58') is disposed in the space between the circuit board (18) and the radome (14) within the housing (12).

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