Pressure sensitive adhesive sheet

Abstract

To provide a pressure sensitive adhesive sheet.SOLUTION: The pressure sensitive adhesive sheet includes a substrate layer and an adhesive layer disposed on one side of the substrate layer. In a peel test with a peel rate of 300 mm / min, peeling electrification voltage generated when peeling the pressure sensitive adhesive sheet from a release film is 500 V or lower. The pressure sensitive adhesive sheet is capable of sufficiently suppressing peeling electrification generated in peeling and has excellent anti-static properties and temporal stability of the peeling electrification voltage, therefore capable of avoiding or reducing a damage to an adherend (for instance, having excellent electrostatic breakdown prevention capacity), and capable of being easily peeled after use without causing an adhesive residue contamination.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an adhesive sheet, and more particularly to an adhesive sheet that has excellent antistatic properties and adhesive properties, and can be easily peeled off after use without leaving any adhesive residue or contamination. [Background technology]

[0002] In the manufacturing process of components such as optical and electronic components, adhesive sheets (surface protection films) are generally applied to the exposed surfaces of these components to prevent damage during processing, assembly, inspection, and transportation. These adhesive sheets are removed from the components when surface protection is no longer needed. Surface protection films, optical components, and electronic components have high electrical insulation properties and generate static electricity through friction and peeling. Therefore, static electricity is easily generated when peeling surface protection films from components such as optical and electronic components. In such cases, the components such as optical and electronic components are more likely to be damaged, and the presence of static electricity can also cause dust to adhere and reduce work efficiency.

[0003] It is known that adhesive sheets are treated with antistatic agents to prevent static electricity. For example, antistatic functionality is provided by forming an antistatic layer or applying an antistatic coating to the surface layer (top coat layer, back layer) of the adhesive sheet. However, when an adhesive sheet with an antistatic layer is attached to the exposed side of a component such as an optical component or electronic component, peeling off the release film can cause static charge buildup, damaging the optical component or electronic component. Furthermore, over time, problems such as an increase in surface resistivity and peel voltage may occur. If surface resistivity increases (deteriorates), static electricity is generated when the adhesive sheet is peeled from the adherend, and the static electricity that charges the adherend (e.g., an electronic component) may degrade and destroy the internal electronic component. [Overview of the project] [Problems that the invention aims to solve]

[0004] The present invention was made to solve the above-mentioned conventional problems, and aims to provide an adhesive sheet that is provided with antistatic properties (antistatic properties when peeled off), has excellent re-peelability and adhesiveness, and can be easily peeled off after use without causing adhesive residue contamination. [Means for solving the problem]

[0005] The inventors of the present invention conducted intensive studies to solve the above problems and found that the above problems can be solved by controlling the peeling band voltage generated when peeling the adhesive sheet from the release film within a specific range in a peeling test at a peeling speed of 300 mm / min, thereby completing the present invention.

[0006] In other words, the present invention is as follows. [1] An adhesive sheet comprising a base layer and an adhesive layer provided on one side of the base layer, An adhesive sheet characterized in that, in a peel test at a peeling speed of 300 mm / min, the peeling voltage generated when peeling the adhesive sheet from the release film is 500V or less. [2]. In a peel test with a peeling speed of 30 m / min, the peeling voltage generated when peeling the adhesive sheet from the release film is 200 V or less. Preferably, in a peel test with a peeling speed of 30 m / min, the peeling voltage generated when peeling the adhesive sheet from the release film is 100 V or less. Preferably, the surface resistivity of at least one surface of the adhesive sheet is 1.0 × 10 5 ~1.0×10 11 Ω / □, Preferably, after stretching the adhesive sheet 1 to 1.5 times in the 360° direction, the surface resistivity of the base layer is 1.0 × 10 5 ~1.0×10 11 The ratio is Ω / □, and the surface resistivity of the adhesive sheet is 1.0 × 10⁻⁶. 11 The adhesive sheet described in [1] is less than or equal to Ω / □. [3] The adhesive sheet according to [1] or [2], wherein the adhesive layer comprises a base polymer, a polyfunctional oligomer, and an antistatic agent. [4] The base polymer includes an acrylic polymer, Preferably, the base polymer contains 0.5 to 30 parts by weight, preferably 1 to 20 parts by weight, more preferably 3 to 15 parts by weight of functional monomers, based on 100 parts by weight of the total monomer components of the base polymer. Preferably, the adhesive sheet according to [3] comprises at least one selected from the group consisting of hydroxyl group-containing monomers, carboxyl group-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, epoxy group-containing monomers, isocyanate group-containing monomers, amide group-containing monomers, monomers having a nitrogen atom-containing ring, monomers having a succinimide skeleton, maleimide monomers, itaconiaimide monomers, aminoalkyl (meth)acrylate monomers, alkoxyalkyl (meth)acrylate monomers, vinyl ether monomers, and olefin monomers. [5] The functionality of the polyfunctional oligomer is 2 or more, preferably 3 or more, more preferably 5 or more. Preferably, the polyfunctional oligomer comprises at least one selected from the group consisting of acrylic-modified resins, polyurethane-modified resins, epoxy-modified resins, phenol-modified resins, polyether-modified resins, and silicone-modified resins. Preferably, the polyfunctional oligomer comprises at least one of polyurethane-modified acrylic resin, acrylic-modified polyurethane resin, epoxy-modified acrylic resin, epoxy-modified polyurethane resin, o-cresol-modified resin, phenol-modified acrylic resin, phenol-modified polyurethane resin, phenol-modified epoxy resin, polyether-modified acrylate resin, and silicone-modified acrylate resin. Preferably, the polyfunctional oligomer comprises at least one selected from the group consisting of polyurethane-modified acrylate, epoxy-modified acrylate, polyether-modified acrylate, and silicone-modified acrylate. Preferably, the content of the polyfunctional oligomer is 20 to 200 parts by weight, preferably 30 to 150 parts by weight, more preferably 40 to 120 parts by weight, per 100 parts by weight of the base polymer, in the adhesive sheet according to [3]. [6] The antistatic agent comprises at least one selected from the group consisting of conductive polymers, conductive inorganic fine particles, metal fine particles or fibers, ionic compounds and ionic surfactants, Preferably, the conductive polymer comprises at least one selected from the group consisting of polyaniline, polypyrrole, polythiophene, polyquinoxaline, polyacetylene, polyethyleneimine, and allylamine polymers. Preferably, the conductive inorganic fine particles include at least one selected from the group consisting of conductive metal oxides, carbon nanotubes, graphene, fullerene, acetylene black, Ketjen black, natural graphite, artificial graphite, and titanium black. Preferably, the metal fine particles or fibers include fine particles or nanowires made of gold, silver, copper, aluminum, nickel, or alloys thereof. Preferably, the ionic compound comprises an alkali metal salt and / or an organic cation-anion salt. Preferably, the ionic surfactant includes at least one selected from the group consisting of cationic surfactants, anionic surfactants, amphoteric surfactants, and nonionic surfactants. Preferably, the content of the antistatic agent is 0.0001 to 20 parts by weight, preferably 0.0002 to 10 parts by weight, per 100 parts by weight of the base polymer, in the adhesive sheet according to [3]. [7] The adhesive layer further comprises a photoinitiator and / or a crosslinking agent, Preferably, the content of the photoinitiator is 0.5 to 10 parts by weight, preferably 0.5 to 5 parts by weight, per 100 parts by weight of the base polymer. Preferably, the content of the crosslinking agent is 0.1 to 10 parts by weight, preferably 0.1 to 5 parts by weight, per 100 parts by weight of the base polymer, in the adhesive sheet according to any one of [1] to [6]. [8]. The following characteristics: (a) The adhesive strength reduction rate of the adhesive sheet calculated by the following formula (1) is 80% or more. Adhesive strength reduction rate (%)=[(N1-N2) / N1]×100 ···(1) (Here, N1 represents the adhesive strength of the adhesive sheet before UV irradiation.) N2 is an integrated light intensity of 300 mJ / cm² applied to the adhesive sheet. 2 (This shows the adhesive strength after irradiation with ultraviolet light.) (b) The adhesive sheet has an integrated light intensity of 300 mJ / cm². 2 The adhesive strength N2 after irradiation with ultraviolet light must be 1N / 20mm or less. (c) The adhesive strength N1 of the adhesive sheet before UV irradiation is 0.5 to 40 N / 20 mm. (d) The ratio of the tensile breaking strength in the longitudinal direction (MD direction) to the tensile breaking strength in the width direction (TD direction) of the adhesive sheet (tensile breaking strength in the MD direction / tensile breaking strength in the TD direction) is 0.8 to 1.2. An adhesive sheet as described in any one of the following [1] to [7], satisfying at least one of the conditions. [9] The thickness of the substrate layer is 10 to 300 μm, preferably 30 to 200 μm, more preferably 50 to 150 μm. Preferably, the base layer comprises at least one selected from the group consisting of thermoplastic polyurethane, polyethylene, polypropylene, polybutene, ethylene-vinyl acetate copolymer, and polyvinyl chloride. Preferably, the adhesive sheet according to any one of [1] to [8] comprises an antistatic agent inside and / or on the surface of the base layer.

[10] The adhesive sheet further comprises an undercoat layer and / or a backcoat layer, The back coat layer is provided on the side of the substrate layer opposite to the adhesive layer, The undercoat layer is provided on the side of the substrate layer opposite to the backcoat layer, Preferably, the undercoat layer comprises at least one selected from the group consisting of thermosetting acrylic, polyurethane, and epoxy resins. Preferably, the back coat layer comprises at least one selected from the group consisting of thermosetting acrylic, polyurethane, and epoxy resins, as described in any one of [1] to [9]. [Effects of the Invention]

[0007] The present invention provides an adhesive sheet that is excellent in antistatic properties (antistatic properties when peeled), re-peelability, and tackiness, and can be easily peeled off without leaving any adhesive residue after use. The adhesive sheet of the present invention can sufficiently suppress peeling charge that occurs during peeling, and can achieve excellent antistatic properties and stability of the peeling voltage over time, thereby avoiding or reducing damage to the adherend (for example, it has excellent electrostatic discharge prevention ability). [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic cross-sectional view showing the structure of an adhesive sheet according to one embodiment of the present invention. [Figure 2] Figure 2 is a schematic cross-sectional view showing the configuration of an adhesive sheet according to another embodiment of the present invention. [Figure 3] Figure 3 is a schematic cross-sectional view showing the configuration of an adhesive sheet according to yet another embodiment of the present invention. [Modes for carrying out the invention]

[0009] Preferred embodiments of the present invention are described below. Matters other than those specifically mentioned herein that are necessary for carrying out the present invention can be understood by those skilled in the art based on the teachings on carrying out the invention described herein and the common technical knowledge at the time of filing. The present invention can be carried out based on the contents disclosed herein and the common technical knowledge in the art. Furthermore, in the following drawings, components and parts that perform the same function may be denoted by the same reference numeral and described accordingly, and redundant explanations may be omitted or simplified. Also, the embodiments shown in the drawings are schematic for the purpose of clearly illustrating the present invention and do not necessarily accurately represent the size or scale of the actual product provided.

[0010] <Adhesive sheet> The adhesive sheet of the present invention comprises a base layer and an adhesive layer provided on one side of the base layer, and in a peel test with a peeling speed of 300 mm / min, the peeling voltage generated when the adhesive sheet is peeled from the release film is 500V or less.

[0011] Figure 1 is a schematic cross-sectional view showing the structure of an adhesive sheet according to one embodiment of the present invention. As shown in Figure 1, the adhesive sheet 1 includes a base layer 10 and an adhesive layer 20 provided on one side of the base layer 10, wherein the adhesive layer 20 is preferably provided over the entire surface of the base layer 10.

[0012] Figure 2 is a schematic cross-sectional view showing the configuration of an adhesive sheet according to another embodiment of the present invention. This adhesive sheet 2 further comprises a back coat layer 30. As shown in Figure 2, the back coat layer 30 is provided on the side of the base layer 10 opposite to the adhesive layer 20.

[0013] Figure 3 is a schematic cross-sectional view showing the structure of an adhesive sheet according to yet another embodiment of the present invention. This adhesive sheet 3 further comprises an undercoat layer 40. As shown in Figure 3, the undercoat layer 40 is located on the side of the base material layer 10 opposite to the backcoat layer 30 and is provided between the base material layer 10 and the adhesive layer 20.

[0014] Although not shown in the figures, the adhesive sheet of the present invention may also be provided with a release liner on the outside of the adhesive layer for the purpose of protecting the adhesive surface until it is put into use.

[0015] The concept of the adhesive sheet in this specification may include those referred to as adhesive tapes, adhesive labels, adhesive films, etc. Note that the adhesive sheet disclosed herein may be in a single sheet form, or may be an adhesive sheet in a form processed into various shapes. In some preferred embodiments, the adhesive sheet of the present invention may be provided in a long shape.

[0016] The adhesive sheet of the present invention is characterized in that, in a peeling test with a peeling speed of 300 mm / min, the peeling charging voltage generated when peeling the adhesive sheet from the release film is 500 V or less, preferably 200 V or less, more preferably 150 V or less, and even more preferably 100 V or less.

[0017] In a peeling test with a peeling speed of 30 m / min, the peeling charging voltage generated when peeling the adhesive sheet from the release film is 200 V or less, preferably 100 V or less.

[0018] In the present invention, by setting the peeling charging voltage generated when peeling the adhesive sheet from the release film within the above range, the peeling charging that may occur when peeling the adhesive sheet can be suppressed, the adhesive sheet has excellent antistatic properties (peeling charging prevention properties), the adherend is not damaged during peeling, and the occurrence of problems such as electrostatic breakdown can be effectively prevented.

[0019] When the peeling charging voltage exceeds 500 V, a large amount of peeling charging may occur during peeling, and adverse effects such as electrostatic breakdown may occur. The above peeling charging voltage can be measured, for example, by the method described in the examples below.

[0020] In some preferred embodiments, the adhesive sheet of the present invention has a surface resistivity of 1.0×10 5 ~1.0×10 11 Ω / □, preferably 1.0×10 6 ~1.0×10 9The resistance is Ω / □. Within this range, the antistatic function can be satisfied, and damage to electronic component materials can be prevented when bonded to such materials. Surface resistivity can be measured in accordance with JIS K 6911 (23℃ / 50% atmosphere, electrode area: 20cm²). 2 Applied voltage: 500V, application time: 30 seconds, using concentric electrodes (probes).

[0021] In some preferred embodiments, the adhesive sheet of the present invention is stretched 1 to 1.5 times in the 360° direction, and then the surface resistivity of the substrate layer is 1.0 × 10⁻⁶. 5 ~1.0×10 11 Ω / □, preferably 1.0 × 10 6 ~1.0×10 9 The ratio is Ω / □, and the surface resistivity of the adhesive sheet is 1.0 × 10⁻⁶. 11 It is less than or equal to Ω / □.

[0022] In some preferred embodiments, the adhesive sheet of the present invention further possesses the following characteristics: (a) The adhesive strength reduction rate of the adhesive sheet calculated by the following formula (1) is 80% or more. Adhesive strength reduction rate (%)=[(N1-N2) / N1]×100 ···(1) (Here, N1 represents the adhesive strength of the adhesive sheet before UV irradiation.) N2 is an integrated light intensity of 300 mJ / cm² applied to the adhesive sheet. 2 (This shows the adhesive strength after irradiation with ultraviolet light.) (b) The adhesive sheet has an integrated light intensity of 300 mJ / cm². 2 The adhesive strength N2 after irradiation with ultraviolet light must be 1N / 20mm or less. (c) The adhesive strength N1 of the adhesive sheet before UV irradiation is 0.5 to 40 N / 20 mm. (d) The ratio of the tensile breaking strength in the longitudinal direction (MD direction) to the tensile breaking strength in the width direction (TD direction) of the adhesive sheet (tensile breaking strength in the MD direction / tensile breaking strength in the TD direction) is 0.8 to 1.2. It is preferable that at least one of the following conditions is met.

[0023] In the above characteristic (a), the adhesive strength reduction rate of the adhesive sheet calculated by the above formula (1) is more preferably 85% or more. When the adhesion reduction rate is within the above range, the necessary adhesive effect is fully exerted during use, excellent adhesion is achieved, and it can be easily peeled off after use without damaging the adherend or causing adhesive residue contamination. If the adhesion reduction rate is less than 80%, the peeling workability deteriorates, and adhesive residue contamination is more likely to occur. The above adhesion N1 and N2 can be measured, for example, by the method described in the examples below.

[0024] In the above characteristic (b), the cumulative light intensity on the adhesive sheet is 300 mJ / cm². 2 The adhesive strength N2 after irradiation with ultraviolet light is more preferably 0.9 N / 20 mm or less, and even more preferably 0.8 N / 20 mm or less. When the adhesive strength N2 is within the above range, it can have excellent adhesion, can be easily peeled off after use, and does not damage the substrate or cause adhesive residue contamination. If the adhesive strength N2 exceeds 1 N / 20 mm, the peeling workability deteriorates and adhesive residue contamination is more likely to occur. (Integrated light intensity of 300 mJ / cm² on the adhesive sheet) 2 The adhesive strength N2 after irradiation with ultraviolet light is preferably 0.01 N / 20 mm or more, as this indicates excellent adhesion.

[0025] In this invention, ultraviolet irradiation of the adhesive sheet refers to ultraviolet irradiation of the adhesive layer in the adhesive sheet via the substrate layer (irradiation from the side of the substrate layer). 300 mJ / cm 2 For example, UV irradiation at an illuminance of 150 mW / cm² 2 This can be achieved by irradiating with ultraviolet light for 2 seconds.

[0026] In the above characteristic (c), the adhesive strength N1 of the adhesive sheet before UV irradiation is more preferably 1 to 30 N / 20 mm, and even more preferably 2 to 25 N / 20 mm. When the adhesive strength N1 is within the above range, excellent adhesion is achieved. If the adhesive strength N1 is less than 0.5 N / 20 mm, the adhesive sheet is prone to peeling due to insufficient adhesion. If the adhesive strength N1 exceeds 40 N / 20 mm, it becomes difficult to peel off the substrate, the peeling process becomes difficult, and adhesive residue contamination is more likely to occur.

[0027] In the above characteristic (d), the ratio of the tensile breaking strength in the longitudinal direction (MD direction) to the tensile breaking strength in the width direction (TD direction) of the adhesive sheet (tensile breaking strength in the MD direction / tensile breaking strength in the TD direction) is more preferably 0.9 to 1.1. If the tensile strength in the MD direction and the tensile strength in the TD direction of the adhesive sheet are within the above range, the adhesive sheet will have excellent peelability, be able to follow uneven surfaces and steps of the adherend well, and the expansion of the adhesive sheet will be uniform in all directions, resulting in uniform gaps between processed electronic components, which will facilitate automatic identification and pickup by downstream equipment. If the tensile strength in the MD direction and the tensile strength in the TD direction of the adhesive sheet are less than 0.8 or greater than 1.2, the flexibility of the adhesive sheet will decrease, making it difficult to obtain good rebound resistance, and the differences in mechanical properties such as elongation, rebound, and followability in each direction of the adhesive sheet will become larger, resulting in uneven expansion, variations in the spacing of processed parts, which will be detrimental to automatic identification and pickup by downstream equipment.

[0028] In some preferred embodiments, the tensile breaking strength of the adhesive sheet is preferably 10 to 60 MPa, and more preferably 15 to 50 MPa. When the tensile breaking strength in the longitudinal direction (MD direction) of the adhesive sheet is within the above range, expansion can be achieved relatively easily, and damage or tearing of the adhesive sheet can be appropriately suppressed, preventing the adhesive sheet from collapsing due to excessive rebound after tension, which would further affect subsequent processing steps. The above tensile breaking strength can be measured, for example, by the method described in the embodiments below.

[0029] [Adhesive layer] In the present invention, the adhesive layer is a layer formed from an adhesive composition. In one preferred embodiment, the adhesive layer is preferably a layer formed from an adhesive composition comprising a base polymer, a polyfunctional oligomer, and an antistatic agent. The form of the adhesive composition is not particularly limited and may be various forms such as water-dispersible, solvent-based, hot-melt, or active-energy ray-curable (e.g., photocurable).

[0030] The following describes in detail each component of the adhesive composition of the present invention.

[0031] (Base polymer) The adhesive composition of the present invention contains a base polymer. Examples of base polymers include acrylic polymers, rubber polymers, polyester polymers, urethane polymers, polyether polymers, silicone polymers, polyamide polymers, and fluorine polymers. Preferably, the adhesive composition contains an acrylic polymer as the base polymer.

[0032] The base polymer content is not particularly limited, but from the viewpoint of obtaining sufficient adhesive reliability, it is preferably 30 to 90% by mass, and more preferably 40 to 80% by mass, based on the total weight (100% by mass) of the adhesive composition. By adjusting the base polymer content in the adhesive composition to the above range, it is possible to provide an adhesive composition with better system compatibility, stronger cohesive force, and excellent adhesion to the adherend.

[0033] The base polymer in the technology disclosed herein is preferably a polymer of monomer components that includes a soft monomer (viscous monomer) and a hard monomer (elastic monomer) as main monomers, and a functional monomer (copolymerizable monomer) copolymerizable with the main monomers. Here, the main monomer refers to the main component in the monomer components constituting the base polymer, that is, the component that is present in more than 70% by weight of the monomer components.

[0034] In a preferred embodiment, the soft monomer (viscous monomer) comprises an alkyl (meth)acrylate. In this specification, the term "alkyl (meth)acrylate" means alkyl acrylate and / or alkyl methacrylate.

[0035] Preferably, the alkyl (meth)acrylate is an alkyl (meth)acrylate having 1 to 20 carbon atoms in the alkyl group. Specific examples of alkyl (meth)acrylates having 1 to 20 carbon atoms in the alkyl group are not particularly limited, but include, for example, n-butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate Examples include (meth)acrylate nonyl, (meth)acrylate isononyl, (meth)acrylate decyl, (meth)acrylate isodecyl, (meth)acrylate undecyl, (meth)acrylate dodecyl, (meth)acrylate tridecyl, (meth)acrylate tetradecyl, (meth)acrylate pentadecyl, (meth)acrylate hexadecyl, (meth)acrylate heptadecyl, (meth)acrylate octadecyl, (meth)acrylate nonadecyl, and (meth)acrylate eicosyl. Among these, n-butyl acrylate (BA), 2-ethylhexyl acrylate (2EHA), and ethyl acrylate (EA) are preferred. Alkyl (meth)acrylates can be used individually or in combination of two or more.

[0036] The content of soft monomers (viscous monomers) is preferably 10 to 90 parts by weight, and more preferably 15 to 80 parts by weight, per 100 parts by weight of the total monomer components of the base polymer. When the content of soft monomers is within the above range, the adhesive has good fluidity and initial tack, can wet the adherend surface better, and can obtain excellent adhesion.

[0037] As the hard monomer, a hard monomer capable of forming a hard polymer with a relatively high glass transition temperature can be suitably used. The hard monomer is useful for increasing the cohesive strength of the adhesive layer. The hard monomer can be used alone or in combination of two or more types.

[0038] Non-specific examples of hard monomers include, for example, acrylonitrile (AN), methyl methacrylate (MMA), methyl acrylate (MA), vinyl acetate (VAC), and styrene.

[0039] The hard monomer content is preferably 5 to 80 parts by weight, and more preferably 10 to 75 parts by weight, per 100 parts by weight of the total monomer components of the base polymer. When the hard monomer content is within the above range, it can provide support to the adhesive system, further improve the elastic modulus, cohesive strength and heat resistance of the adhesive, and effectively avoid phenomena such as sticking to the cutting blade and adhesive residue in some dicing processes.

[0040] As functional monomers (copolymerizable monomers), monomers having polar groups can be suitably used. Monomers having polar groups are useful for introducing crosslinking points into the base polymer or for increasing the cohesive strength of the base polymer. Functional monomers can be used individually or in combination of two or more.

[0041] Non-limiting specific examples of functional monomers include, for example, hydroxyl group-containing monomers, carboxyl group-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, epoxy group-containing monomers, isocyanate group-containing monomers, amide group-containing monomers, monomers having a nitrogen atom-containing ring, monomers having a succinimide skeleton, maleimide monomers, itacolinimide monomers, (meth)acrylate aminoalkyl monomers, (meth)acrylate alkoxyalkyl monomers, vinyl ether monomers, olefin monomers, and the like. Among these, at least one selected from hydroxyl group-containing monomers and carboxyl group-containing monomers is preferred.

[0042] The functional monomer content is preferably 0.5 to 30 parts by weight, more preferably 1 to 20 parts by weight, and even more preferably 3 to 15 parts by weight, based on 100 parts by weight of the total monomer components of the base polymer. When the functional monomer content is within the above range, the crosslinking agent can be used to easily adjust the properties of the adhesive, such as the crosslinking density, loss modulus, storage modulus, and cohesive force, and the tackiness can be optimized for different bonding surfaces.

[0043] A hydroxyl group-containing monomer refers to a monomer that has at least one hydroxyl group in its molecule. When the monomer components constituting the base polymer include a hydroxyl group-containing monomer, that is, when the base polymer includes monomer units derived from a hydroxyl group-containing monomer, secondary bonds such as hydrogen bonds are formed with the adherend, thereby increasing the cohesive force of the base polymer (preferably an acrylic polymer), which can more effectively suppress changes in adhesive strength over time, and also results in less adhesive residue on the adherend after peeling and higher cohesiveness. Furthermore, by including a hydroxyl group-containing monomer in the raw material monomer of the base polymer, when a crosslinking agent is used, the crosslinking reaction with the crosslinking agent can be effectively generated, and the adhesive effect can be fully expressed. In addition, cracking of the adherend during peeling can be effectively prevented. The base polymer of this embodiment may use one type of hydroxyl group-containing monomer, or two or more types of hydroxyl group-containing monomers.

[0044] Specific examples of hydroxyl group-containing monomers include, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and hydroxyalkyl (meth)acrylates such as (4-hydroxymethylcyclohexyl)methyl(meth)acrylate.

[0045] The content of hydroxyl group-containing monomers is not particularly limited. For example, the content of hydroxyl group-containing monomers is 0.5 to 15 parts by weight, preferably 1 to 13 parts by weight, per 100 parts by weight of the total monomer components of the base polymer. When the content of hydroxyl group-containing monomers is within the above range, secondary bonds such as hydrogen bonds are formed with the adherend, increasing the cohesive force of the base polymer (preferably an acrylic polymer), which can more effectively suppress changes in adhesive strength over time, and also results in less adhesive residue on the adherend after peeling and higher cohesiveness. If the content of hydroxyl group-containing monomers is less than 0.5 parts by weight, sufficient adhesion cannot be obtained, and the crosslinking density of the adhesive is too low, resulting in low cohesive strength and a high risk of adhesive residue. If the content of hydroxyl group-containing monomers exceeds 15 parts by weight, the adhesive strength becomes too high, which may lead to blocking. Also, the adherend may crack more easily during peeling.

[0046] A carboxyl group-containing monomer refers to a monomer that has at least one carboxyl group in its molecule. By including a carboxyl group-containing monomer in the raw material monomer of the base polymer, secondary bonds such as hydrogen bonds are formed with the adherend, thereby increasing the cohesive force of the base polymer (preferably an acrylic polymer), which can more effectively suppress changes in adhesive strength over time, and also results in less adhesive residue on the adherend after peeling and higher cohesiveness. Furthermore, by including a carboxyl group-containing monomer in the raw material monomer of the base polymer, when a crosslinking agent is used, the crosslinking reaction with the crosslinking agent can be effectively generated, allowing the adhesive effect to be fully expressed, and also effectively preventing cracking of the adherend during peeling.

[0047] Specific examples of carboxyl group-containing monomers include, for example, acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, crotonic acid, isocrotonic acid, fumaric acid, itaconic acid, maleic acid, citraconic acid, maleic anhydride, and itaconic anhydride. Among these, acrylic acid and methacrylic acid are preferred. Any one of the above carboxyl group-containing monomers can be used alone or in combination of two or more.

[0048] The content of carboxyl group-containing monomers is not particularly limited. For example, the content of carboxyl group-containing monomers is preferably 0.5 to 15 parts by weight, more preferably 1 to 12 parts by weight, per 100 parts by weight of the total monomer components of the base polymer. When the content of carboxyl group-containing monomers is within the above range, secondary bonds such as hydrogen bonds are formed with the adherend, increasing the cohesive force of the base polymer (preferably an acrylic polymer), which can more effectively suppress changes in adhesive strength over time, and also results in less adhesive residue on the adherend after peeling and higher cohesiveness. If the content of carboxyl group-containing monomers exceeds 15 parts by weight, the adhesive strength becomes too high, and blocking may easily occur. Also, cracking of the adherend may easily occur during peeling. If the content of carboxyl group-containing monomers is less than 0.5 parts by weight, sufficient adhesion cannot be obtained.

[0049] Examples of monomers containing sulfonic acid groups include styrene sulfonic acid, allyl sulfonic acid, sodium vinyl sulfonate, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidepropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth)acryloyloxynaphthalenesulfonic acid.

[0050] Examples of phosphate group-containing monomers include 2-hydroxyethyl acryloyl phosphate.

[0051] Examples of epoxy group-containing monomers include epoxy group-containing acrylates such as glycidyl (meth)acrylate and 2-ethyl glycidyl ether (meth)acrylate, allyl glycidyl ether, and glycidyl (meth)acrylate.

[0052] Examples of isocyanate group-containing monomers include 2-isocyanate ethyl (meth)acrylate.

[0053] Examples of monomers containing an amide group include (meth)acrylamide; N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N,N-dipropyl(meth)acrylamide, N,N-diisopropyl(meth)acrylamide, N,N-di(n-butyl)(meth)acrylamide, N,N-di(t-butyl)(meth)acrylamide, and other N,N-dialkyl(meth)acrylamides; N-ethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, N-butyl(meth)acrylamide, Nn-butyl(meth)acrylamide. Examples include N-alkyl(meth)acrylamides such as lylamide; N-vinyl carboxylic acid amides such as N-vinylacetamide; and N,N-dimethylaminopropyl(meth)acrylamide, hydroxyethylacrylamide, N-methylolalkyl(meth)acrylamide, N-hydroxyethyl(meth)acrylamide, N-methylolpropane(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-methoxyethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, and N-(meth)acryloylmorpholine.

[0054] Examples of monomers having a nitrogen atom-containing ring include N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone, N-vinylpyrimidine, N-vinylpiperazine, N-vinylpyrazine, N-vinylpyrrole, N-vinylimidazole, N-vinyloxazole, N-(meth)acryloyl-2-pyrrolidone, N-(meth)acryloylpiperidine, N-(meth)acryloylpyrrolidine, N-vinylmorpholine, N-vinyl-3-morpholinone, N-vinyl-2-caprolactam, N-vinyl-1,3-oxazin-2-one, N-vinyl-3,5-morpholindione, N-vinylpyrazole, N-vinylisoxazole, N-vinylthiazole, N-vinylisothiazole, and N-vinylpyridazine.

[0055] Examples of monomers having a succinimide skeleton include N-(meth)acryloyloxymethylenesuccinimide, N-(meth)acryloyl-6-oxyhexamethylenesuccinimide, and N-(meth)acryloyl-8-oxyhexamethylenesuccinimide.

[0056] Examples of maleimide compounds include N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, and N-phenylmaleimide.

[0057] Examples of itaconimide derivatives include N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexylitaconimide, N-cyclohexylitaconimide, and N-laurylitaconimide.

[0058] Examples of aminoalkyl (meth)acrylates include aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-diethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate.

[0059] Examples of alkoxyalkyl (meth)acrylates include methoxyethyl (meth)acrylate, ethoxyethyl (meth)acrylate, propoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, and ethoxypropyl (meth)acrylate.

[0060] Examples of vinyl ethers include vinyl alkyl ethers such as methyl vinyl ether and ethyl vinyl ether.

[0061] Examples of olefin-based compounds include ethylene, butadiene, isoprene, and isobutylene.

[0062] The method for obtaining the base polymer is not particularly limited, and various known polymerization methods such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, and photopolymerization can be appropriately employed. For example, solution polymerization can be preferably employed. As for the monomer supply method when performing solution polymerization, a batch supply method in which all monomer raw materials are supplied at once, a continuous supply (dropping) method, a divided supply (dropping) method, etc., can be appropriately employed. The polymerization temperature when performing solution polymerization can be appropriately selected depending on the type of monomer and solvent used, the type of polymerization initiator, etc., and can be, for example, around 20°C to 170°C (typically around 40°C to 140°C).

[0063] The solvent used for solution polymerization (polymerization solvent) can be appropriately selected from conventionally known organic solvents. For example, one solvent or a mixture of two or more solvents can be used, selected from aromatic compounds such as toluene (typically aromatic hydrocarbons); acetic acid esters such as ethyl acetate; aliphatic or alicyclic hydrocarbons such as hexane, heptane, and cyclohexane; halogenated alkanes such as 1,2-dichloroethane; lower alcohols such as isopropyl alcohol (e.g., monohydric alcohols with 1 to 4 carbon atoms); ethers such as tert-butyl methyl ether; ketones such as methyl ethyl ketone; etc.

[0064] The initiator used for polymerization can be appropriately selected from conventionally known polymerization initiators depending on the type of polymerization method. For example, one or more azo polymerization initiators such as 2,2'-azobisisobutyronitrile (AIBN) can be preferably used. Other examples of polymerization initiators include persulfates such as potassium persulfate; peroxide initiators such as benzoyl peroxide and hydrogen peroxide; substituted ethane initiators such as phenyl-substituted ethane; aromatic carbonyl compounds; and so on. Another example of polymerization initiators is a redox initiator, which is a combination of a peroxide and a reducing agent. Such polymerization initiators can be used individually or in combination of two or more. The amount of polymerization initiator used can be the usual amount, for example, it can be selected from a range of approximately 0.005 parts by weight to 1 part by weight (typically approximately 0.01 parts by weight to 1 part by weight) per 100 parts by weight of the total monomer components.

[0065] The weight-average molecular weight (Mw) of the base polymer (preferably an acrylic polymer) in the technologies disclosed herein is not particularly limited and may be, for example, 2,000,000 or less, preferably 400,000 or more. Generally, when the weight-average molecular weight Mw exceeds 2,000,000, the cohesive force increases due to the effect of polymer entanglement, and fluidity tends to decrease, which may prevent a sufficient adhesive surface area from being obtained and may prevent the adherend from being fixed.

[0066] Here, weight-average molecular weight (Mw) refers to the value obtained by gel permeation chromatography (GPC) on a standard polystyrene basis. For GPC equipment, for example, model "HLC-8320GPC" (column: TSKgelGMH-H(S), manufactured by Tosoh Corporation) can be used.

[0067] (Multifunctional oligomers) In this invention, the term "polyfunctional" means having a functional degree of 2 or more. In some preferred embodiments, the functional degree of the polyfunctional oligomer is preferably 2 or more, more preferably 3 or more, and even more preferably 5 or more, from the viewpoint of balancing the adhesive reliability of the adhesive layer with the degree of decrease in adhesive strength after UV irradiation.

[0068] In some preferred embodiments, the polyfunctional oligomer comprises at least one selected from the group consisting of acrylic-modified resins, polyurethane-modified resins, epoxy-modified resins, phenol-modified resins, polyether-modified resins, polyester-modified resins, and silicone-modified resins.

[0069] In some preferred embodiments, the polyfunctional oligomer comprises at least one of the following: polyurethane-modified acrylic resin, acrylic-modified polyurethane resin, epoxy-modified acrylic resin, epoxy-modified polyurethane resin, o-cresol-modified resin, phenol-modified acrylic resin, phenol-modified polyurethane resin, phenol-modified epoxy resin, polyether-modified acrylate resin, polyester-modified acrylate resin, and silicone-modified acrylate resin.

[0070] In some preferred embodiments, the polyfunctional oligomer preferably comprises at least one selected from the group consisting of polyurethane-modified acrylates, epoxy-modified acrylates, polyether-modified acrylates, polyester-modified acrylates, and silicone-modified acrylates.

[0071] As polyurethane-modified acrylates, urethane (meth)acrylates in which two or more (meth)acryloyl groups are added as functional groups to the urethane skeleton can be used. Urethane (meth)acrylates can be obtained, for example, by reacting a polyhydric alcohol, an isocyanate, and a hydroxyl group (meth)acrylate (e.g., 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate). Examples of isocyanates include aromatic isocyanates and aliphatic isocyanates, specifically tolylene diisocyanate, isophorone diisocyanate, and hexamethylene diisocyanate. Examples of urethane (meth)acrylates include Art Resin UN series manufactured by Negami Kogyo Co., Ltd., NK Oligo U series manufactured by Shin Nakamura Chemical Co., Ltd., and Shiko UV series manufactured by Nippon Synthetic Chemical Industry Co., Ltd.

[0072] Epoxy-modified acrylates can be obtained by the reaction of epoxy groups of epoxy resins with carboxyl groups of acrylic acid monomers. For example, epoxy (meth)acrylates have two or more (meth)acryloyl groups added as functional groups to the epoxy skeleton. Epoxy (meth)acrylates can be obtained by reacting epoxy resins with hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl acrylate and 4-hydroxybutyl acrylate, or (meth)acrylic acid, to obtain bifunctional or more prepolymers. Theoretically, since most epoxy groups can be esterified with acrylic acid, epoxy resins can be of types such as bisphenol A type, phenol epoxy type, or acid and acid anhydride-modified epoxy. If necessary, flexible long chains are introduced to overcome the brittleness of the epoxy resin, unsaturated bonds are introduced to improve photocuring efficiency, and molecular weight is selected and adjusted to control practical effects such as resin compatibility and curing shrinkage rate. Specific examples of epoxy (meth)acrylates include Lipoxy SP and Lipoxy VR manufactured by Showa Polymer Co., Ltd., AgiSyn 3050, 2020, 9750, etc. manufactured by DSM, and the epoxy ester series manufactured by Kyoeisha Chemical Co., Ltd.

[0073] Polyether-modified acrylates can be obtained by anionic ring-opening polymerization of ethylene oxide or propylene oxide with a dihydric or polyhydric alcohol under strong alkali to obtain a terminal hydroxyl group polyether, which is then esterified with acrylic acid to obtain polyether acrylate. Although the esterification reaction must be carried out under acidic conditions, the ether bond is sensitive to acid and is destroyed, so polyether acrylates are usually prepared by transesterification. Generally, a terminal hydroxyl group polyether is mixed with excess ethyl acrylate and a polymerization inhibitor and heated to induce a transesterification reaction under the action of a catalyst (e.g., triisopropyl titanate). The resulting ethanol and ethyl acrylate form an azeotrope and are distilled. The ethyl acrylate fraction is returned to the reaction vessel via a fractional distillation column, and the ethanol is fractionally distilled to allow the transesterification reaction to proceed completely. Further excess ethyl acrylate is removed by vacuum distillation. Commercially available polyether-modified acrylates include, for example, AgiSyn 703 from DSM and high-performance CN550 from Kingchem Americas.

[0074] As the polyester-modified acrylate, an acid anhydride hemiadduct may be obtained by reacting a hydroxyacrylate with an acid anhydride, and then esterified with a polyester polyol. Alternatively, a polyester polyol may be obtained from a polyhydric acid and a polyhydric alcohol, and then esterified with acrylic acid. The polyester-modified acrylate has good flexibility and wettability. In addition, amine-based modified polyester acrylate can be used to suppress inhibition of oxygen polymerization and improve the UV reaction rate and the surface hardness of the post-UV adhesive layer. Examples of commercially available polyester-modified acrylates include 6312-100 and 6331 from Changxing Chemical Co., Ltd., and PE44F and PE56F from BASF.

[0075] Silicone-modified acrylates can be synthesized using hydrosilyl addition, esterification, hydrolysis, small molecule elimination by condensation, and urethane addition reactions. For example, dichlorodimethylsilane monomer and hydroxyethyl acrylate are hydrolyzed and condensed under an alkaline catalyst, and HEA is introduced as a terminal group to the polysiloxane chain to obtain a silicone-modified acrylic prepolymer. A commercially available silicone-modified acrylate is Bossin's B-818, for example.

[0076] In some preferred embodiments, the content of the polyfunctional oligomer is preferably 20 to 200 parts by weight, more preferably 30 to 150 parts by weight, and even more preferably 40 to 120 parts by weight, per 100 parts by weight of the base polymer. When the polyfunctional oligomer content is within the above range, sufficient adhesive reliability and workability can be obtained, as well as good compatibility, cohesive force, and efficient viscosity reduction effect after UV irradiation of the adhesive system.

[0077] (Antistatic agent) Examples of antistatic agents included in the above-mentioned adhesive layer-forming composition include conductive polymers, conductive inorganic fine particles, metal fine particles or fibers, ionic compounds, and ionic surfactants. These antistatic agents may be used individually or in combination of two or more.

[0078] <Conductive polymer> Examples of the conductive polymers mentioned above include polyaniline, polypyrrole, polythiophene, polyquinoxaline, polyacetylene, polyethyleneimine, and allylamine polymers. Among these, polyaniline and polythiophene, which readily form water-soluble conductive polymers or water-dispersible conductive polymers, are preferred. These conductive polymers may be used individually or in combination of two or more.

[0079] <Conductive inorganic particles> Examples of the above-mentioned conductive inorganic fine particles include conductive metal oxides, carbon nanotubes, graphene, fullerenes, acetylene black, Ketjenblack, natural graphite, artificial graphite, and titanium black. These conductive inorganic fine particles may be used individually or in mixtures of two or more types.

[0080] Examples of conductive metal oxides include tin oxide-based, antimony oxide-based, indium oxide-based, and zinc oxide-based metal oxides. Examples of tin oxide-based conductive fine particles include tin oxide, as well as antimony-doped tin oxide, indium-doped tin oxide, aluminum-doped tin oxide, tungsten-doped tin oxide, titanium oxide-cerium oxide-tin oxide composites, and titanium oxide-tin oxide composites. The average particle size of the fine particles is 1 to 100 nm, preferably 2 to 50 nm.

[0081] <Metal particles or fibers> Any suitable metal nanoparticles or fibers can be used as described above, as long as the effects of the present invention are obtained. Examples include nanoparticles, nanowires, etc., made of gold, silver, copper, aluminum, nickel, or alloys thereof. These metal nanoparticles or fibers may be used individually or in mixtures of two or more types.

[0082] <Ionic compounds> Examples of ionic compounds include alkali metal salts and / or organic cation-anionic salts. In this invention, "organic cation-anionic salt" refers to an organic salt in which the cation portion is composed of an organic substance, and the anion portion may be an organic substance or an inorganic substance. "Organic cation-anionic salts" are also called ionic liquids and ionic solids. These ionic compounds may be used individually or in mixtures of two or more types.

[0083] Alkali metal salts can be organic or inorganic salts of alkali metals.

[0084] Examples of alkali metal ions that constitute the cation portion of alkali metal salts include lithium, sodium, and potassium. Among these alkali metal ions, lithium ions are preferred.

[0085] The anionic portion of the alkali metal salt may be composed of organic or inorganic materials.

[0086] Examples of anionic groups that make up organic salts include CH3COO - CF3COO - CH3SO3 - CF3SO3 - , (CF3SO2)3C - , C4F9SO3 - C3F7COO - (CF3SO2)(CF3CO)N - , (FSO2)2N - , - O3S(CF2)3SO3 - PF6 - CO3 2- or the following general formulas (1) to (4), (1):(C n F 2n+1 SO2)2N - (where n is an integer between 1 and 10) (2):CF2(C m F 2m SO2)2N - (where m is an integer between 1 and 10) (3): - O3S(CF2) l SO3 - (where l is an integer between 1 and 10) (4):(C p F 2p+1 SO2)N - (C q F 2q+1 Examples include those represented as SO2) (where p and q are integers from 1 to 10). In particular, anion moieties containing fluorine atoms are preferably used because they yield ionic compounds with good ionic dissociation properties.

[0087] The anion portion that makes up the inorganic salt is Cl - , Br - , I - AlCl4 - Al2Cl7 - BF4 - PF6 - ClO4 - NO3 - AsF6 - SbF6 - , NbF6 - TaF6 - , (CN)2N - These are some examples of what is used.

[0088] As for the Anion Club, (CF3SO2)2N - , (C2F5SO2)2N - (Perfluoroalkylsulfonyl)imides represented by the above general formula (1), such as (CF3SO2)2N, are preferred. - Trifluoromethanesulfonyliimide represented by is particularly preferred.

[0089] Examples of alkali metal organic salts include sodium acetate, sodium alginate, sodium ligninsulfonate, sodium toluenesulfonate, LiCF3SO3, Li(CF3SO2)2N, Li(CF3SO2)2N, Li(C2F5SO2)2N, Li(C4F9SO2)2N, Li(CF3SO2)3C, KO3S(CF2)3SO3K, LiO3S(CF2)3SO3K, etc. Of these, LiCF3SO3, Li(CF3SO2)2N, Li(C2F5SO2)2N, Li(C4F9SO2)2N, Li(CF3SO2)3C, etc. are preferred, fluorine-containing imide lithium salts such as Li(CF3SO2)2N, Li(C2F5SO2)2N, and Li(C4F9SO2)2N are more preferred, and (perfluoroalkylsulfonyl)imide lithium salts are particularly preferred.

[0090] Examples of inorganic salts of alkali metals include lithium perchlorate and lithium iodide.

[0091] The organic cation-anion salt used in the present invention is composed of a cation component and an anion component, and the above cation component is composed of an organic substance. As the cation component, specifically, pyridinium cation, piperidinium cation, pyrrolidinium cation, cation having a pyrroline skeleton, cation having a pyrrole skeleton, imidazolium cation, tetrahydropyrimidinium cation, dihydropyrimidinium cation, pyrazolium cation, pyrazolinium cation, tetraalkylammonium cation, trialkylsulfonium cation, tetraalkylphosphonium cation, etc. can be mentioned.

[0092] As the anion component, for example, Cl - , Br - , I - , AlCl4 - , Al2Cl7 - , BF4<​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​(3): - O3S(CF2) l SO3 - (where l is an integer between 1 and 10) (4):(C p F 2p+1 SO2)N - (C q F 2q+1 Examples include those represented as SO2, (where p and q are integers from 1 to 10), etc. Among these, anionic components containing fluorine atoms are particularly preferred because they yield ionic compounds with good ionic dissociation properties.

[0093] In some preferred embodiments, the organic cation anion salt is preferably a nitrogen-containing onium salt, a sulfur-containing onium salt, or a phosphorus-containing onium salt, and more preferably a salt consisting of an organic cation component and an anion component represented by the following general formulas (A) to (E) is used because it exhibits excellent antistatic properties. [ka] In formula (A), Ra represents a hydrocarbon group having 4 to 20 carbon atoms, and Rb and Rc each independently represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms. Note that Ra, Rb, and Rc may contain heteroatoms. Furthermore, if the nitrogen atom is bonded by a double bond, Rc is absent. In formula (B), Rd represents a hydrocarbon group having 2 to 20 carbon atoms, and Re, Rf, and Rg each independently represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms. Rd, Re, Rf, and Rg may contain heteroatoms. In formula (C), Rh represents a hydrocarbon group having 2 to 20 carbon atoms, and Ri, Rj, and Rk each independently represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms. Rh, Ri, Rj, and Rk may also contain heteroatoms. In formula (D), Z represents a nitrogen, sulfur, or phosphorus atom, and Rl, Rm, Rn, and Ro each independently represent a hydrocarbon group having 1 to 20 carbon atoms, which may include heteroatoms. However, if Z is a sulfur atom, Ro is absent. In formula (E), Rp represents a hydrocarbon group having 1 to 18 carbon atoms, and may contain heteroatoms.

[0094] Examples of cations represented by formula (A) include pyridinium cations, piperidinium cations, pyrrolidinium cations, cations having a pyrroline skeleton, and cations having a pyrrole skeleton. Specific examples include pyridinium cations such as 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, and 1-butyl-3,4-dimethylpyridinium cation; 1-propylpiperidinium cation, 1-pentylpiperidinium cation, 1,1-dimethylpiperidinium cation, 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, and 1-methyl-1-butylpiperidinium cation. Piperidinium cations such as peridinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, 1,1-dipropylpiperidinium cation, 1-propyl-1-butylpiperidinium cation, 1,1-dibutylpiperidinium cation, etc.1,1-dimethylpyrrolidinium cation, 1-methyl-1-ethylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentyl Examples of pyrrolidinium cations include pyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation, 1,1-dipropylpyrrolidinium cation, 1-propyl-1-butylpyrrolidinium cation, and 1,1-dibutylpyrrolidinium cation; and 2-methyl-1-pyrroline cation, 1-ethyl-2-phenylindolinium cation, 1,2-dimethylindolinium cation, and 1-ethylcarbazolium cation.

[0095] Examples of cations represented by formula (B) include imidazolium cation, tetrahydropyrimidinium cation, and dihydropyrimidinium cation. Specific examples include imidazolium cations such as 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation, 1,2-dimethyl-3-propylimidazolium cation, 1-ethyl-2,3-dimethylimidazolium cation, 1-butyl-2,3-dimethylimidazolium cation, 1-hexyl-2,3-dimethylimidazolium cation, etc.; 1,3-dimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3-trimethyl-1,4 Examples include tetrahydropyrimidinium cations such as ,5,6-tetrahydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation, and 1,2,3,5-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation; dihydropyrimidinium cations such as 1,3-dimethyl-1,4-dihydropyrimidinium cation, 1,3-dimethyl-1,6-dihydropyrimidinium cation, 1,2,3-trimethyl-1,4-dihydropyrimidinium cation, 1,2,3-trimethyl-1,6-dihydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4-dihydropyrimidinium cation, and 1,2,3,4-tetramethyl-1,6-dihydropyrimidinium cation; and 1-butyl-3-methylpyrimidinium cations such as 1-butyl-3-methylpyrimidiniumbisimide.

[0096] Examples of cations represented by formula (C) include pyrazolium cations and dihydropyrazolium cations. Specific examples include 1-methylpyrazolium cations, 3-methylpyrazolium cations, and 1-ethyl-2-methyldihydropyrazolium cations.

[0097] Examples of cations represented by formula (D) include tetraalkylammonium cations, trialkylsulfonium cations, and tetraalkylphosphonium cations. Furthermore, cations in which part of the alkyl group is substituted with an alkenyl group, an alkoxyl group, or an epoxy group can also be used. Rl, Rm, Rn, and Ro are hydrocarbon groups having 1 to 20 carbon atoms, as described above, and are preferably alkyl groups having 1 to 20 carbon atoms. Rl, Rm, Rn, and Ro may also be aromatic ring groups or anticyclic ring groups. Specific examples of cationic cations represented by formula (D) include tetraalkylammonium cations, trialkylsulfonium cations, tetraalkylphosphonium cations, and those in which part of the alkyl group is substituted with an alkenyl group, an alkoxyl group, or an epoxy group. Specific examples include, for instance, N,N-dimethyl-N-ethyl-N-propylammonium cation, N,N-dimethyl-N-ethyl-N-butylammonium cation, N,N-dimethyl-N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl-N-ethyl-N-heptylammonium cation, N,N-dimethyl-N-ethyl-N-nonylammonium cation, N,N-dimethyl-N,N-dipropylammonium cation, N,N-dimethyl-N-propyl-N-butylammonium cation, N,N-dimethyl-N-propyl-N-pentylammonium cation, and N,N-dimethyl N,N-propyl-N-hexylammonium cation, N,N-dimethyl-N-propyl-N-heptylammonium cation, N,N-dimethyl-N-butyl-N-hexylammonium cation, N,N-dimethyl-N-butyl-N-heptylammonium cation, N,N-dimethyl-N-pentyl-N-hexylammonium cation, N,N-dimethyl-N,N-dihexylammonium cation, trimethylheptylammonium cation, N,N-diethyl-N-methyl-N-propylammonium cation, N,N-diethyl-N-methyl-N-pentylammonium cation, N,N-diethyl-N-methyl-N-heptylammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation, triethylmethylammonium cation, triethylpropylammonium cation, triethylpentylammonium cation, triethylheptylammonium cation, N,N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N-methyl-N-pentylammonium cation, N,N-dipropyl-N-butyl-N-hexylammonium cation, N,N-dipropyl-N,N-dihexylammonium cation, N,N-dibutyl-N-methyl-N-pentylammonium cation, N,N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, N-methyl-N-ethyl-N-propyl-N-pentylammonium cation, tetramethylammonium cation, tetraethylammonium cation, tetrabutylammonium cation, tetrahexylammonium cation, tributyl Examples include tetraalkylammonium cations such as ethylammonium cation, trimethyldecylammonium cation, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, glycidyltrimethylammonium cation, and diallyldimethylammonium cation; trialkylsulfonium cations such as trimethylsulfonium cation, triethylsulfonium cation, tributylsulfonium cation, trihexylsulfonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, and dimethyldecylsulfonium cation; and tetraalkylphosphonium cations such as tetramethylphosphonium cation, tetraethylphosphonium cation, tetrabutylphosphonium cation, tetrahexylphosphonium cation, phosphonium cation, triethylmethylphosphonium cation, tributylethylphosphonium cation, and trimethyldecylphosphonium cation.

[0098] In the present invention, among the above cationic components, cations represented by formula (A) (especially pyridinium cations such as 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, and 1-butyl-3,4-dimethylpyridinium cation) and cations represented by formula (D) (especially asymmetric tetraalkylammonium cations such as triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, dimethyldecylsulfonium cation, triethylmethylphosphonium cation, tributylethylphosphonium cation, trimethyldecylphosphonium cation, trialkylsulfonium cation, tetraalkylphosphonium cation, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, diallyldimethylammonium cation, and glycidyltrimethylammonium cation) are preferably used because they provide particularly excellent antistatic properties.

[0099] Specific cationic examples represented by formula (E) include, for example, sulfonium salts having an alkyl group with 1 to 18 carbon atoms as Rp, such as a methyl group, ethyl group, propyl group, butyl group, hexyl group, octyl group, nonyl group, decyl group, dodecyl group, tridecyl group, tetradecyl group, or octadecyl group.

[0100] Any suitable anionic component can be used as the above-mentioned anionic component, as long as it can form an ionic liquid together with the above-mentioned cationic component. For example, Cl - , Br - , I - AlCl4 - Al2Cl7 - BF4 - PF6 - ClO4 - NO3 - CH3COO- CF3COO - CH3SO3 - CF3SO3 - , (CF3SO2)2N - , (CF3SO2)3C - AsF6 - SbF6 - , NbF6 - TaF6 - , F(HF) n - , (CN)2N - , C4F9SO3 - , (C2F5SO2)2N - C3F7COO - Examples include (CF3SO2)(CF3CO)N. Hydrophobic anionic components tend not to bleed out to the adhesive surface and are therefore preferred from the viewpoint of low contamination. Furthermore, anionic components containing fluorine atoms are particularly preferred because they yield ionic compounds with low melting points.

[0101] The organic cation-anion salt in the present invention can be appropriately selected from the above combinations of cationic and anionic components, for example, 1-butylpyridinium tetrafluoroborate, 1-butylpyridinium hexafluorophosphate, 1-butyl-3-methylpyridinium tetrafluoroborate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, 1-butyl-3-methylpyridinium bis(pentaful Oroethanesulfonyl)imide, 1-Hexylpyridinium tetrafluoroborate, 1,1-Dimethylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-ethylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-pentylpyrrolidinium bis(trifluoromethanesulfonyl)imide , 1-methyl-1-hexylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-heptylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-pentylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-hexylpyrrolidinium bis(trifluoromethanesulfonyl)imide Ruhonyl)imide, 1-ethyl-1-heptylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1,1-dipropylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-propyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1,1-dibutylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-Dimethylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-ethylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-hexylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-Methyl-1-heptylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-Ethyl-1-propylpiperidinium bis (Trifluoromethanesulfonyl)imide, 1-ethyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-hexylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-heptylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dipropylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-propyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-Dimethylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-ethylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-propylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-butylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-pentylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-hexylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-heptylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-Ethyl-1-propylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-Ethyl-1-butylpyrrolidinium Umbis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-pentylpyrrolidiniumbis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-hexylpyrrolidiniumbis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-heptylpyrrolidiniumbis(pentafluoroethanesulfonyl)imide, 1,1-dipropylpyrrolidiniumbis(pentafluoroethanesulfonyl)imide, 1-propyl-1-butylpyrrolidiniumbis(pentafluoroethanesulfonyl)imide, 1,1-dibutylpyrrolidiniumbis(pentafluoroethanesulfonyl)imide, 1-propylpiperidiniumbis(pentafluoroethanesulfonyl)imide, 1-pentylpiperidiniumbis(pentafluoroethanesulfonyl)imide, 1,1-Dimethylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-ethylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-propylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-pentylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-hexylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Methyl-1-heptylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-Ethyl-1 -Butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-pentylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-hexylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-heptylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dipropylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-propyl-1-butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dibutylpiperidinium bis(pentafluoroethanesulfonyl)imide, 2-methyl-1-pyrroline tetrafluoroborate, 1-ethyl-2-phenylindrolium tetrafluoroborate, 1,2-dimethylindolinium tetrafluoroborate, 1-ethylcarbazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium acetate, 1-ethyl-3-methylimidazolium trifluoroacetate, 1-ethyl-3-methylimidazolium heptafluorobutanoate, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium perfluorobutanesulfonate, 1-ethyl-3-methylimidazolium di Cyanidiamidate, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-3-methylimidazolium tri(trifluoromethanesulfonyl)methylated, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-3-methylimidazolium trifluoroacetate, 1-butyl-3-methylimidazolium heptafluorobutate 1-Butyl-3-methylimidazolium trifluoromethanesulfonate, 1-Butyl-3-methylimidazolium perfluorobutanesulfonate, 1-Butyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-Hexyl-3-methylimidazolium bromide, 1-Hexyl-3-methylimidazolium chloride, 1-Hexyl-3-methylimidazolium tetrafluoroborate, 1-Hexyl-3-methylimidazolium hexafluorophosphate, 1-Hexyl-3-methylimidazolium trifluoro Methanesulfonate, 1-octyl-3-methylimidazolium tetrafluoroborate, 1-octyl-3-methylimidazolium hexafluorophosphate, 1-hexyl-2,3-dimethylimidazolium tetrafluoroborate, 1,2-dimethyl-3-propylimidazolium bis(trifluoromethanesulfonyl)imide, 1-methylpyrazolium tetrafluoroborate, 3-methylpyrazolium tetrafluoroborate, N,N-dimethyl-N-ethyl-N-propylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-butylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-heptylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-nonylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N,N-dipropylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-propyl-N-butylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-propyl-N-hexylammonium bis(trifluoromethanesulfonyl) Mid, N,N-dimethyl-N-propyl-N-heptylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-butyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-butyl-N-heptylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-pentyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N,N-dihexylammonium bis(trifluoromethanesulfonyl)imide, trimethylheptylammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N-propylammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N-heptylammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, triethylpropylammonium bis(trifluoromethanesulfonyl)imide, triethylpentylammonium bis(trifluoromethanesulfonyl)imide, triethylheptylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-N-methyl-N-ethylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-N-butyl-N-hexylammonium bis(trifluoromethanesulfonyl), Imides, N,N-dibutyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-dibutyl-N-methyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, trioctylmethylammonium bis(trifluoromethanesulfonyl)imide, N-methyl-N-ethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, 1-butylpyridinium(trifluoromethanesulfonyl)trifluoroacetamide salt, 1-butyl-3-methylpyridinium(trifluoromethanesulfonyl)trifluoroacetamide salt, 1-ethyl-3-methylimidazolium(trifluoromethanesulfonyl)trifluoroacetamide salt, tetrahexylammonium bis(trifluoromethanesulfonyl)imide, diallyldimethylammonium tetrafluoroborate, diallyldimethylammonium trifluoromethanesulfonate, diallyldi Examples include methylammonium bis(trifluoromethanesulfonyl)imide, diallyldimethylammonium bis(pentafluoroethanesulfonyl)imide, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium tetrafluoroborate, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium trifluoromethanesulfonate, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium bis(pentafluoroethanesulfonyl)imide, glycidyltrimethylammonium trifluoromethanesulfonate, glycidyltrimethylammonium bis(trifluoromethanesulfonyl)imide, glycidyltrimethylammonium bis(pentafluoroethanesulfonyl)imide, and diallyldimethylbis(pentafluoroethanesulfonyl)imide.

[0102] The method for synthesizing organic cation anion salts is not particularly limited as long as the desired organic cation anion salt can be obtained. However, generally, methods such as the halide method, hydroxide method, acid ester method, complex formation method, or neutralization method are used, as described in the literature "Ionic Liquids - The Forefront and Future of Development" [published by CMC Publishing Co., Ltd.]. Commercially available organic cation anion salts can also be used.

[0103] <Ionic surfactants> Examples of the ionic surfactants mentioned above include cationic surfactants (e.g., quaternary ammonium salt type, phosphonium salt type, sulfonium salt type, etc.), anionic surfactants (e.g., carboxylic acid type, sulfonate type, sulfate type, phosphate type, phosphite type, etc.), amphoteric surfactants (e.g., sulfobetaine type, alkylbetaine type, alkylimidazolium betaine type, etc.), and nonionic surfactants (e.g., polyhydric alcohol derivatives, β-cyclodextrin inclusion complexes, sorbitan fatty acid monoesters / diesters, polyalkylene oxide derivatives, oxidized amines, etc.). These ionic surfactants may be used individually or in combination of two or more types.

[0104] In some preferred embodiments, the content of the antistatic agent is preferably 0.0001 to 20 parts by weight, more preferably 0.0002 to 10 parts by weight, per 100 parts by weight of the base polymer. When the antistatic agent content is within this range, a sufficient antistatic effect is obtained, effectively suppressing the peeling charge that occurs during peeling, and effectively preventing phenomena such as electrostatic discharge, thereby avoiding or reducing damage to the adherend.

[0105] The adhesive composition of the present invention may contain any other suitable components, provided that they do not impair the effects of the present invention. Examples of such other components include crosslinking agents and photoinitiators (photopolymerization initiators).

[0106] (Crosslinking agent) In the present invention, to adjust the cohesive force, it is preferable that the adhesive composition contains a crosslinking agent. A commonly used crosslinking agent can be used, such as epoxy crosslinking agents, isocyanate crosslinking agents, melamine crosslinking agents, aziridine crosslinking agents, or metal chelate crosslinking agents. By using these crosslinking agents, an appropriate crosslinking reaction can be generated, the cohesive force can be sufficiently improved, good adhesiveness can be ensured, and cracking of the adherend during peeling can be effectively prevented. These crosslinking agents may be used individually or in mixtures of two or more.

[0107] As an epoxy crosslinking agent, any compound having two or more epoxy groups in one molecule can be used without particular limitation. Epoxy crosslinking agents having three to five epoxy groups in one molecule are preferred. Epoxy crosslinking agents can be used individually or in combination of two or more.

[0108] Specific examples of epoxy crosslinking agents are not particularly limited, but include, for example, bisphenol A, epichlorohydrin-type epoxy resins, ethylene glycidyl ether, N,N,N',N'-tetraglycidyl-m-xylylenediamine, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol glycidyl ether, polyethylene glycol diglycidyl ether, and polyglycerin polyglycidyl ether. Commercially available epoxy crosslinking agents include "TETRAD-C" and "TETRAD-X" from Mitsubishi Gas Chemical Company, "EPICLON CR-5L" from DIC Corporation, "DENACOL EX-512" from Nagase ChemteX Corporation, and "TEPIC-G" from Nissan Chemical Industries, Ltd.

[0109] The amount of epoxy crosslinking agent used is not particularly limited, but for example, it is preferably 0.01 to 3 parts by weight, more preferably 0.05 to 2 parts by weight, per 100 parts by weight of the base polymer.

[0110] In embodiments containing an epoxy crosslinking agent, the epoxy equivalent of the epoxy crosslinking agent is preferably 80 to 120 g / eq.

[0111] As isocyanate-based crosslinking agents, polyfunctional isocyanates (compounds having two or more isocyanate groups per molecule, including those having an isocyanurate structure) can be preferably used. Isocyanate-based crosslinking agents can be used individually or in combination of two or more.

[0112] Examples of polyfunctional isocyanates include aliphatic polyisocyanates, alicyclic polyisocyanates, and aromatic polyisocyanates.

[0113] Specific examples of aliphatic polyisocyanates include 1,2-ethylene diisocyanate; butylene diisocyanates such as 1,2-butylene diisocyanate, 1,3-butylene diisocyanate, and 1,4-butylene diisocyanate; hexylene diisocyanates such as 1,2-hexylene diisocyanate, 1,3-hexylene diisocyanate, 1,4-hexylene diisocyanate, 1,5-hexylene diisocyanate, 1,6-hexylene diisocyanate, and 2,5-hexylene diisocyanate; and 2-methyl-1,5-pentamethylene diisocyanate, 3-methyl-1,5-pentamethylene diisocyanate, and lysine diisocyanate.

[0114] Specific examples of alicyclic polyisocyanates include isophorone diisocyanate; cyclohexylene diisocyanates such as 1,2-cyclohexylene diisocyanate, 1,3-cyclohexylene diisocyanate, and 1,4-cyclohexylene diisocyanate; cyclopentylene diisocyanates such as 1,2-cyclopentylene diisocyanate and 1,3-cyclopentylene diisocyanate; hydrogenated xylylene diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated tetramethylxylylene diisocyanate, and 4,4'-dicyclohexylmethane diisocyanate.

[0115] Specific examples of aromatic polyisocyanates include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, 2,2'-diphenylmethane diisocyanate, 4,4'-diphenyl ether diisocyanate, 2-nitrobiphenyl-4,4'-diisocyanate, 2,2'-diphenylpropane-4,4'-diisocyanate, and 3 Examples include 3'-dimethyldiphenylmethane-4,4'-diisocyanate, 4,4'-diphenylpropanediisocyanate, m-phenylenediisocyanate, p-phenylenediisocyanate, naphthalene-1,4-diisocyanate, naphthalene-1,5-diisocyanate, 3,3'-dimethoxybiphenyl-4,4'-diisocyanate, xylylene-1,4-diisocyanate, and xylylene-1,3-diisocyanate.

[0116] Examples of preferred polyfunctional isocyanates include those having three or more isocyanate groups per molecule. The three- or more functional isocyanates may be macromers (typically dimers or trimers) of bifunctional or three- or more functional isocyanates, derivatives (e.g., addition reaction products of a polyhydric alcohol and two or more polyfunctional isocyanates), polymers, etc. Examples of polyfunctional isocyanates include dimers or trimers of diphenylmethane diisocyanate, isocyanurates of hexylene diisocyanate (trimeric adducts of isocyanurate structures), reaction products of trimethylolpropane and tolylene diisocyanate, reaction products of trimethylolpropane and hexylene diisocyanate, polymethylene polyphenyl isocyanate, polyether polyisocyanate, polyester polyisocyanate, and other polyfunctional isocyanates. Examples of commercially available polyfunctional isocyanates include "DURANATE TPA-100" manufactured by Asahi Kasei Chemical Co., Ltd., "Coronate L" manufactured by Nippon Polyurethane Industrial Co., Ltd., "Coronate HL" manufactured by Nippon Polyurethane Industrial Co., Ltd., "Coronate HK" manufactured by Nippon Polyurethane Industrial Co., Ltd., "Coronate HX" manufactured by Nippon Polyurethane Industrial Co., Ltd., and "Coronate 2096" manufactured by Nippon Polyurethane Industrial Co., Ltd.

[0117] In embodiments containing an isocyanate-based crosslinking agent, the isocyanate group content (NCO content) in the isocyanate-based crosslinking agent is preferably 7 to 15%.

[0118] The amount of isocyanate-based crosslinking agent used is not particularly limited, but is preferably 0.1 to 6 parts by weight, and more preferably 0.5 to 5 parts by weight, per 100 parts by weight of the base polymer.

[0119] Examples of melamine-based crosslinking agents include hexamethyl melamine and butylated melamine resin (for example, the product name "SUPER BECKAMINE J-820-60N" available from DIC Corporation).

[0120] The amount of melamine-based crosslinking agent used is not particularly limited, but for example, it is preferably 0.5 to 12 parts by weight, and preferably 1 to 8 parts by weight, per 100 parts by weight of the base polymer.

[0121] Examples of aziridine crosslinking agents include: trimethylolpropanetri[3-(1-aziridinyl)propionate], trimethylolpropanetri[3-(1-(2-methyl)aziridinylpropionate)]. Commercially available aziridine crosslinking agents may also be used. For example, the Chemitite series (manufactured by Nippon Shokubai Co., Ltd.), such as Chemitite PZ-33 and Chemitite DZ-22E, may be used.

[0122] Examples of metal chelating crosslinking agents include, for example, aluminum chelating compounds, titanium chelating compounds, zinc chelating compounds, zirconium chelating compounds, iron chelating compounds, cobalt chelating compounds, nickel chelating compounds, tin chelating compounds, manganese chelating compounds, and chromium chelating compounds.

[0123] The amount of crosslinking agent used is preferably 0.01 to 15 parts by weight per 100 parts by weight of the base polymer. By using the crosslinking agent within this range, the cohesive force of the adhesive can be improved, preventing the occurrence of adhesive residue on the adherend, and it tends to have appropriate fluidity, resulting in good wettability and, consequently, good adhesion to the adherend. In some embodiments, from the viewpoint of avoiding a decrease in tack due to excessive improvement in cohesive force, the amount of crosslinking agent used per 100 parts by weight of the base polymer is more preferably 10 parts by weight or less.

[0124] To more effectively advance the crosslinking reaction described above, a crosslinking catalyst may be used. Examples of crosslinking catalysts include tin-based catalysts (e.g., dioctyl tin dilaurate). The amount of crosslinking catalyst used is not particularly limited, but is preferably 0.0001 to 1 part by weight per 100 parts by weight of the base polymer.

[0125] (Photoinitiator) Examples of photoinitiators include benzoin ether-based photopolymerization initiators, acetophenone-based photopolymerization initiators, α-ketol-based photopolymerization initiators, aromatic sulfonyl chloride-based photopolymerization initiators, photoactive oxime-based photopolymerization initiators, benzoin-based photopolymerization initiators, benzyl-based photopolymerization initiators, benzophenone-based photopolymerization initiators, ketal-based photopolymerization initiators, thioxanthone-based photopolymerization initiators, and the like.

[0126] Examples of benzoin ether-based photopolymerization initiators include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethane-1-one, and anisole methyl ether. Examples of acetophenone-based photopolymerization initiators include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, 4-phenoxydichloroacetophenone, and 4-(t-butyl)dichloroacetophenone. Examples of α-ketol-based photopolymerization initiators include 2-methyl-2-hydroxypropiophenone and 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one. Examples of aromatic sulfonyl chloride-based photopolymerization initiators include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime-based photopolymerization initiators include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime. Examples of benzoin-based photopolymerization initiators include benzoin. Examples of benzyl-based photopolymerization initiators include benzyl. Examples of benzophenone-based photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, and α-hydroxycyclohexylphenyl ketone. Examples of ketal-based photopolymerization initiators include benzyldimethylketal. Examples of thioxanthone-based photopolymerization initiators include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, and dodecylthioxanthone.

[0127] In some preferred embodiments, the content of the photoinitiator is preferably 0.5 to 10 parts by weight, more preferably 0.5 to 5 parts by weight, per 100 parts by weight of the base polymer. By using the amount of photoinitiator within the above range, the tackiness can be improved. If the photoinitiator content is less than 0.5 parts by weight, the adhesive may not be sufficiently cured by irradiation with active energy rays. If the photoinitiator content exceeds 10 parts by weight, the storage stability of the adhesive decreases. Also, if the initiator content is too high, the surface of the adhesive sheet may become too hard after UV irradiation, making it difficult to peel off from the adherend.

[0128] In addition to the components described above, the adhesive composition of the present invention may optionally contain various additives common in the field of adhesives, such as plasticizers, softeners, anti-aging agents, and antioxidants, as long as they do not impair the effects of the present invention. Such additives can be conventionally known and used by conventional methods.

[0129] (Formation of the adhesive layer) The adhesive layer disclosed herein can be formed by conventionally known methods. For example, a direct method can be employed in which the adhesive layer is formed by directly applying (typically coating) the adhesive composition to the substrate layer and drying it. Alternatively, a transfer method can be employed in which the adhesive layer is formed on a peelable surface (release surface) by applying the adhesive composition to the surface and drying it, and then the adhesive layer is transferred to the substrate layer. From the viewpoint of productivity, the transfer method is preferred. As the release surface, the surface of a release liner or the back surface of a peeled substrate layer can be used. Although the adhesive layer disclosed herein is typically formed continuously, it is not limited to this form, and may be formed in a regular or random pattern such as dots or stripes.

[0130] The adhesive composition can be applied using conventionally known coaters, such as gravure roll coaters, die coaters, or bar coaters. Alternatively, the adhesive composition may be applied by impregnation or curtain coating methods.

[0131] From the viewpoint of promoting the crosslinking reaction and improving manufacturing efficiency, it is preferable to dry the adhesive composition under heating. The drying temperature can be, for example, around 40 to 150°C, and is usually preferably around 60 to 130°C. After drying the adhesive composition, aging may be performed for purposes such as adjusting the migration of components within the adhesive layer, promoting the crosslinking reaction, and alleviating any strain that may exist within the substrate film or adhesive layer.

[0132] The thickness of the adhesive layer is not particularly limited, but considering the balance between adhesion to the adherend and cohesiveness, the thickness of the adhesive layer is preferably 1 to 100 μm, and more preferably 3 to 50 μm. By setting the thickness of the adhesive layer within the above range, good adhesion can be achieved.

[0133] [Base material layer] The material of the base layer constituting the adhesive sheet disclosed herein is not particularly limited and can be appropriately selected depending on the purpose and manner of use of the adhesive sheet. Non-limiting examples of usable base materials include: polyolefin films mainly composed of polyolefins such as polyethylene, polypropylene, polybutene, and ethylene-propylene copolymer; polyester films mainly composed of polyesters such as polyethylene terephthalate and polybutylene terephthalate; polyvinyl chloride films mainly composed of polyvinyl chloride; films mainly composed of cast polypropylene; and thermoplastic polyurethane films; foam sheets made of foams such as polyurethane foam, polyethylene foam, and polychloroprene foam; woven and nonwoven fabrics made of various fibrous materials (which may be natural fibers such as hemp and cotton, synthetic fibers such as polyester and vinylon, semi-synthetic fibers such as acetate, etc.) alone or in blends; papers such as Japanese paper, fine paper, kraft paper, and crepe paper; and metal foils such as aluminum foil and copper foil. In particular, the base layer preferably contains at least one selected from the group consisting of thermoplastic polyurethane, polyethylene, polypropylene, polybutene, ethylene-vinyl acetate copolymer, and polyvinyl chloride. The base material may also be a composite of these. Examples of such composite base materials include, for example, a base material with a structure in which metal foil and the above-mentioned plastic film are laminated, and a plastic base material reinforced with inorganic fibers such as glass cloth.

[0134] The surface of the substrate layer of the present invention may be subjected to any surface treatment in order to improve adhesion to adjacent layers and retention properties. Examples of such surface treatments include chemical or physical treatments such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionization radiation treatment, as well as coating treatments.

[0135] The thickness of the base material layer of the present invention can be set to any appropriate thickness depending on the desired strength or flexibility, as well as the intended use. The thickness of the base material layer is preferably 10 to 300 μm, more preferably 30 to 200 μm, and even more preferably 50 to 150 μm.

[0136] In one embodiment, the interior and / or surface of the substrate layer may contain an antistatic agent. As the substrate layer containing the antistatic agent, for example, a resin sheet into which the antistatic agent has been kneaded may be used. Such a resin sheet may be formed from a substrate-forming composition containing a resin and an antistatic agent.

[0137] Examples of resins include thermoplastic polyurethane, polyethylene, polypropylene, polybutene, ethylene-vinyl acetate copolymer, and polyvinyl chloride.

[0138] Any suitable antistatic agent can be used as the antistatic agent contained inside and / or on the surface of the base layer, as long as the effects of the present invention are obtained. For example, the antistatic agent described above for the adhesive layer can be used.

[0139] The method for incorporating the antistatic agent into the base material is not particularly limited as long as the antistatic agent can be uniformly mixed into the resin used for the base material. For example, this could involve incorporating the agent into the base material using a heated roll, a Banbury mixer, a pressure kneader, a twin-screw kneader, or the like.

[0140] [Backcoat layer] As shown in Figure 2, the adhesive sheet of the present invention may further include a back treatment layer 30, or so-called back coat layer 30, provided on the side of the base layer 10 opposite to the adhesive layer 20.

[0141] The backcoat layer forming material is not particularly limited, and one or more types of polyurethane resins, epoxy resins, polyester resins, acrylic resins, polyamide resins, melamine resins, olefin resins, polystyrene resins, phenolic resins, isocyanurate resins, polyvinyl acetate resins, etc., can be used. When an adhesive layer such as an acrylic is provided on the resin film substrate layer, polyurethane, epoxy, polyester, or acrylic backcoat layers are preferred.

[0142] In some preferred embodiments, the backcoat layer preferably comprises at least one selected from the group consisting of thermosetting acrylic, polyurethane, and epoxy resins.

[0143] In some preferred embodiments, the backcoat layer preferably contains an antistatic agent. This improves the antistatic properties of the adhesive sheet and sufficiently suppresses the peel voltage. The backcoat layer may be a single layer or a multilayer structure of two or more layers. In embodiments where a multilayer backcoat layer is arranged, it is preferable that at least one of the layers (typically at least one layer including the layer in contact with the substrate layer) is a backcoat layer containing an antistatic agent.

[0144] As an antistatic agent, for example, the antistatic agents described in the above-mentioned adhesive layer can be used. For example, conductive polymers such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine polymers; conductive inorganic fine particles such as conductive metal oxides, carbon nanotubes, graphene, fullerene, acetylene black, Ketjenblack, natural graphite, artificial graphite, and titanium black; and metal fine particles or fibers can be used. These can be used individually or in combination of two or more.

[0145] In embodiments where a backcoat layer is provided, examples of conductive polymers that may be included in the backcoat layer include polythiophene and polyaniline. For polythiophene, the Mw equivalent to polystyrene is 40 × 10 4 Preferably, the following: 30 × 10 4 The following is more preferable: For polyaniline, Mw is 50 × 10 4 Preferably, the following: 30 × 10 4 The following are more preferable. Also, the Mw of these conductive polymers is typically 0.1 × 10⁻⁶. 4 Preferably, it is 0.5 × 10 4That concludes the explanation. In this specification, polythiophene refers to polymers of unsubstituted or substituted thiophenes. A preferred example of a substituted thiophene polymer in the technology disclosed herein is poly(3,4-ethylenedioxythiophene).

[0146] In some preferred embodiments, the backcoat layer may contain polystyrene sulfonate (PSS) as a dopant (e.g., a thiophene polymer dopant). In some embodiments, the backcoat layer is formed using a backcoat layer forming composition containing an aqueous solution of polythiophene containing PSS (which may be in the form of polythiophene to which PSS has been added as a dopant). Such an aqueous solution may contain polythiophene:PSS in a weight ratio of 1:1 to 1:10. The total content of polythiophene and PSS in the aqueous solution may be, for example, about 1 to 5% by weight.

[0147] From the viewpoint of improving conductivity, the amount of conductive polymer used can be approximately 10 parts by weight or more per 100 parts by weight of resin contained in the back coat layer, and is usually appropriate to be 25 parts by weight or more, preferably 40 parts by weight or more. Considering the compatibility of the conductive polymer in the back coat layer, the amount of conductive polymer used should be 200 parts by weight or less (for example, 150 parts by weight or less) per 100 parts by weight of resin, and is preferably 120 parts by weight or less (for example, 100 parts by weight or less). It is also possible to use 80 parts by weight or less (for example, 60 parts by weight or less) per 100 parts by weight of resin.

[0148] The total amount of antistatic agent in the backcoat layer (total amount of all antistatic agents including conductive polymers, conductive inorganic fine particles, etc.) can be approximately 5% by weight (for example, approximately 10% by weight or more), and it is appropriate to have approximately 30% by weight or more, and may exceed 50% by weight, for example. The upper limit of the total amount of antistatic agent in the backcoat layer is not particularly limited, and it is appropriate to have approximately 90% by weight or less (for example, 80% by weight or less), and considering adhesion to the substrate layer, it may be approximately 40% by weight or less (for example, approximately 30% by weight or less).

[0149] The backcoat layer may contain a binder in addition to the conductive agent described above. The binder that can be included in the backcoat layer can be any of the backcoat layer forming materials described above without particular limitation. Among these, the use of thermosetting polyurethane and / or epoxy resins is preferred. The proportion of the binder in the entire backcoat layer can be, for example, approximately 30% by weight or more, and is preferably approximately 40% by weight or more (for example, approximately 50% by weight or more). Furthermore, considering antistatic properties, the proportion of the binder should preferably be less than 90% by weight (less than 80% by weight).

[0150] Furthermore, in some embodiments, the backcoat layer contains a crosslinking agent. As the crosslinking agent, melamine-based, isocyanate-based, epoxy-based, and other crosslinking agents commonly used for crosslinking resins can be appropriately selected and used. This allows for a desirable balance between anchoring properties to the substrate layer and other properties.

[0151] The backcoat layer may contain additives such as antioxidants, colorants, flow modifiers, film-forming aids, surfactants, and corrosion inhibitors, as needed.

[0152] In some preferred embodiments, the backcoat layer is preferably formed by a back treatment agent. The back treatment agent that can be used to form the backcoat layer is not particularly limited, and known or conventional treatment agents such as silicone-based back treatment agents, fluorine-based back treatment agents, and long-chain alkyl-based back treatment agents can be used depending on the purpose and application. The back treatment agent can be used alone or in combination of two or more types.

[0153] The backcoat layer can be suitably formed by applying a liquid composition (coating material for backcoat layer formation), in which the above-mentioned resin components and additives used as needed are dispersed or dissolved in a suitable solvent, to the substrate layer using a known or conventional coater such as a gravure roll coater or a reverse roll coater, and by a method including drying and curing treatment as needed. From the viewpoint of forming a thin and uniform layer, the NV (non-volatile content) of the coating material can be, for example, 5% by weight or less (typically 0.05 to 5% by weight). Any of the solvents that can constitute the coating material can be an organic solvent, water, or a mixture thereof, and water or a mixture solvent mainly composed of water (for example, a mixture of water and ethanol) is preferred.

[0154] The thickness of the backcoat layer in the technology disclosed herein is not particularly limited, and is usually 0.01 μm or more. From the viewpoint of suitably exhibiting the function of the backcoat layer, it is appropriate to have a thickness of 0.05 μm or more, and preferably 0.1 μm or more (for example, 0.2 μm or more). The upper limit of the backcoat layer thickness can be 50 μm or less (for example, 10 μm or less), and from the viewpoint of transparency and coating properties, it is appropriate to have a thickness of 3 μm or less, and preferably 1 μm or less (for example, 0.6 μm or less).

[0155] [Undercoat layer] As shown in Figure 3, the adhesive sheet of the present invention may further include a primer treatment layer 40 (also referred to as the "undercoat layer 40") provided on the side of the base layer 10 opposite to the back treatment layer 30.

[0156] The undercoat layer forming material is not particularly limited, and one or more types of polyurethane resins, epoxy resins, polyester resins, acrylic resins, polyamide resins, melamine resins, olefin resins, polystyrene resins, phenolic resins, isocyanurate resins, polyvinyl acetate resins, etc., can be used. When an adhesive layer such as an acrylic is provided on the resin film substrate layer, polyurethane, epoxy, polyester, or acrylic undercoat layers are preferred.

[0157] In some preferred embodiments, the undercoat layer preferably comprises at least one selected from the group consisting of thermosetting acrylic, polyurethane, and epoxy resins.

[0158] In some preferred embodiments of the undercoat layer, the undercoat layer preferably contains an antistatic agent. This improves the antistatic properties of the adhesive sheet and sufficiently suppresses the peel voltage. The undercoat layer may be a single layer or a multilayer structure of two or more layers. In embodiments where a multilayer undercoat layer is arranged, it is preferable that at least one of the layers (typically at least one layer including the layer in contact with the substrate layer) is an undercoat layer containing an antistatic agent.

[0159] As an antistatic agent, for example, the antistatic agents described in the above-mentioned adhesive layer can be used. For example, conductive polymers such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine polymers; conductive inorganic fine particles such as conductive metal oxides, carbon nanotubes, graphene, fullerene, acetylene black, Ketjenblack, natural graphite, artificial graphite, and titanium black; and metal fine particles or fibers can be used. These can be used individually or in combination of two or more.

[0160] The undercoat layer may further contain any suitable additives. Examples of such additives include UV absorbers, anti-aging agents, light stabilizers such as hindered amine light stabilizers, leveling agents, low molecular weight polymers, preservatives, polymerization inhibitors, silane coupling agents, inorganic and organic fillers (e.g., calcium oxide, magnesium oxide, silicon oxide, zinc oxide, titanium oxide, etc.), metal powders, colorants, pigments, and heat stabilizers.

[0161] In some preferred embodiments, the undercoat layer is preferably formed by a primer. The primer that can be used to form the undercoat layer is not particularly limited, and any primer that facilitates uniform and strong formation and effectively improves adhesive anchoring performance can be used depending on the purpose and application. The primer surface treatment agent can be used alone or in combination of two or more types.

[0162] The thickness of the undercoat layer is not particularly limited, but is preferably 0.05 to 2 μm, and more preferably 0.1 to 1.5 μm. By setting the thickness of the undercoat layer within the above range, the effects of the present invention can be more favorably achieved.

[0163] (Method of manufacturing adhesive sheets) The adhesive sheet of the present invention can be manufactured by any suitable method. For example, this could involve coating an adhesive composition onto a substrate layer, or coating an adhesive composition onto any suitable substrate and transferring the resulting coating layer to the substrate layer.

[0164] Any suitable coating method can be used to coat the above adhesive composition. For example, the coating can be dried after application to form each layer. Examples of coating methods include coating using a multi-coater, die coater, gravure coater, applicator, bar coater, air knife, reverse roll, lip, dip, offset printing, flexographic printing, screen printing, etc. Examples of drying methods include natural drying and heat drying. When heat drying is used, the heating temperature can be set to any suitable temperature depending on the properties of the substance to be dried.

[0165] (Application) The adhesive sheet of the present invention can be attached to various components and devices such as optical components and electronic components, and can sufficiently suppress the electrostatic charge generated during peeling, achieving excellent antistatic properties and long-term stability of the peeling band voltage. Therefore, it is used to prevent damage to the surface of components such as optical components and electronic components during processing, assembly, inspection, and transportation (for example, it has excellent electrostatic discharge prevention capabilities). [Examples]

[0166] The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. The evaluation methods in the examples are as follows. In the examples, unless otherwise specified, "parts" and "%" are based on weight. In the examples, unless specific conditions are specified, the process is carried out under normal conditions or conditions recommended by the manufacturer. Unless otherwise specified, commercially available general products can be used as materials or equipment.

[0167] (Preparation of acrylic polymer A1) In a reaction vessel equipped with a stirrer, thermometer, nitrogen gas inlet tube, and reflux condenser, 5 parts n-butyl acrylate (BA) (manufactured by Zhejiang Satellite), 62 parts 2-ethylhexyl acrylate (2EHA), 30 parts vinyl acetate (VAC), 3 parts 4-hydroxybutyl acrylate (HBA), and 200-300 parts ethyl acetate as polymerization solvent were charged. The mixture was stirred at 65°C under a nitrogen atmosphere for 1-1.5 hours. Then, 0.1 parts 2,2'-azobisisobutyronitrile (AIBN) was added as a thermal polymerization initiator, and the reaction was carried out at 65°C for 6-8 hours. The internal bath temperature was then raised to 70-90°C and the mixture was aged for 2 hours. A solution of acrylic polymer A1 was obtained. The weight-average molecular weight Mw of the soluble portion of this acrylic polymer A1 was 1.2 million.

[0168] (Preparation of acrylic polymers A2-A5) Acrylic polymers A1 to A5 were prepared in the same manner as acrylic polymer A1, except that the types and amounts of monomer components used were changed as shown in Table 1.

[0169] [Table 1]

[0170] <Making adhesive sheets> Example 1 To a solution of the acrylic polymer A1 described above, 80 parts of polyurethane-modified acrylic resin A (functionality 10) as a polyfunctional oligomer, 2 parts of silver nanowire as an antistatic agent, 5 parts of isocyanate crosslinking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., product number: Coronate L), 1 part of modified melamine crosslinking agent (manufactured by DIC, product number: NDS), and 3 parts of photoinitiator (manufactured by BASF, product number: IRGACURE 651) were added to 100 parts of the acrylic polymer A1 contained in the solution, and the mixture was uniformly mixed and diluted appropriately with ethyl acetate to prepare adhesive composition D1. Backcoat layer adhesive E1 (carbon nanotube dispersant, manufactured by XFNANO, item number: 101371) was diluted to an appropriate concentration in a mixed solution of deionized water and isopropanol, applied to one side of a 150 μm thick polyolefin film (PO film), and then dried in an air-floating oven at 80°C for 1 minute to form a backcoat layer with a thickness of 1 μm or less. Subsequently, by applying undercoat adhesive F1 (polythiophene dispersion, manufactured by Ouyi Organic Optoelectronics Co., Ltd., item number: Polyelec OE-001) to the other side of the substrate with the backcoat layer in the same manner as the backcoat layer, an undercoat layer is formed, and in several multi-functional coating lines, the undercoat layer and the backcoat layer can be completed simultaneously. Next, the adhesive composition D1 was applied to a polyethylene terephthalate (PET) release layer with a thickness of 50 μm, heated at 130°C for 3 minutes, and then transferred to the undercoat surface of the substrate to complete the preparation of the adhesive sheet. If necessary, the adhesive sheet can also be aged at an appropriate temperature. The evaluation results are shown in Table 2.

[0171] Examples 2-6 An adhesive sheet was obtained in the same manner as in Example 1, except that the type of acrylic polymer, the type and amount of polyfunctional oligomer used, the type and amount of antistatic agent used, the amount of crosslinking agent used, the type and amount of photoinitiator used, the thickness of the adhesive layer, the composition of the backcoat layer, and the composition of the undercoat layer were changed as shown in Table 2. The evaluation results are shown in Table 2.

[0172] Comparative Examples 1-4 An adhesive sheet was obtained in the same manner as in Example 1, except that the type of acrylic polymer, the type and amount of polyfunctional oligomer used, the type and amount of antistatic agent used, the amount of crosslinking agent used, the type and amount of photoinitiator used, and the thickness of the adhesive layer were changed as shown in Table 2, and a backcoat layer and undercoat layer were omitted. The evaluation results are shown in Table 3.

[0173] [Table 2-1] [Table 2-2]

[0174] PO: Polyolefin film PET: Polyethylene terephthalate film PVC: Polyvinyl chloride film Antistatic PO: Manufacturer: MATAI DC-VS Polyurethane-modified acrylic resin A: Functionality 10, manufactured by Jun'oku Kako, product number: FSP8531 Aliphatic epoxy-modified acrylic resin B: Functionality 5, manufactured by Vitus Electronic Materials Co., Ltd., Part Number: WDS-5709 Lithium salt: LiTFsl, CAS number: 90076-65-6, manufactured by Shanghai Moyi Technology. Isocyanate crosslinking agent: Product number: Coronate L, manufactured by Nippon Polyurethane Industry Co., Ltd. Modified melamine crosslinking agent: Manufactured by DIC Corporation, Part Number: NDS Epoxy crosslinking agent: Product number: TETRAD C, manufactured by Mitsubishi Gas Chemical Company. UV initiator: BASF, part number: IRGACURE 651 UV photosensitizer: Manufactured by Hubei Gurun Technology Co., Ltd., Part Number: GR-PS-1 The "-" indicates that the PET substrate cannot be expanded.

[0175] [Table 3-1] [Table 3-2]

[0176] PO: Polyolefin film PVC: Polyvinyl chloride film PI: Polyimide film Polyurethane-modified acrylic resin A: Functionality 10, manufactured by Jun'oku Kako, product number: FSP8531 Aliphatic epoxy-modified acrylic resin B: Functionality 5, manufactured by Vitus Electronic Materials Co., Ltd., Part Number: WDS-5709 Polyurethane-modified acrylic resin C: Functionality level 2, manufactured by Jun'oku Chemical Co., Ltd., Part number: LuCure 8706 Carbon nanotubes: Manufactured by Jiangsu XFNANO Materials Tech Co., Ltd., Part Number: XFS28 Isocyanate crosslinking agent: Product number: Coronate L, manufactured by Nippon Polyurethane Industry Co., Ltd. Modified melamine crosslinking agent: Manufactured by DIC Corporation, Part Number: NDS Epoxy crosslinking agent: Product number: TETRAD C, manufactured by Mitsubishi Gas Chemical Company. UV initiator: BASF, part number: IRGACURE 651

[0177] <Evaluation Test> (1) Stripping voltage Evaluation samples were prepared by laminating the silicone-treated side of a static-discharged release film (silicone-treated PET film, manufactured by Toray Industries, Ltd., product name "Therapiel", thickness: 38 μm) onto the adhesive side of an adhesive sheet (width: 70 mm x length: 130 mm). Furthermore, the release film was designed so that 30 mm of its longitudinal edge extended beyond the adhesive sheet. The adhesive sheet and release film were bonded together using a hand roller under conditions compliant with JIS Z 0237 (2000) (temperature: 23°C, humidity: 50% RH). After leaving the evaluation sample in an environment of 23°C and 50%RH for one day, the protruding portion of the release film was grasped, and the release film was peeled longitudinally at a peeling angle of 150° and a peeling speed of 300 mm / min (or 30 m / min). The voltage on the surface of the adhesive layer generated during peeling was measured at a position 100 mm perpendicular to the adhesive surface from the point where the release film and adhesive sheet separated, and the maximum value was defined as the peeling voltage. A potential meter (manufactured by Kasuga Electric Co., Ltd., product name "KSD-0103") was used as the measuring instrument. The measurement environment was 23°C and 50%RH.

[0178] (2)Surface resistivity Under conditions of 23°C and 50% RH, the electrical resistivity of the topcoat layer surface is measured using a commercially available resistivity meter under the conditions of 23°C, 50% RH, applied voltage of 100V, and application time of 30 seconds. The resistivity meter used is the "Highresta UP MCP-HT450" model manufactured by Mitsubishi Chemical Analytical Corporation, or an equivalent product. Surface resistivity is measured immediately after application of the topcoat layer (initial surface resistivity) and after UV irradiation in a 23°C × 50% RH environment, followed by standing. The initial surface resistivity [Ω / □] and the surface resistivity after UV irradiation [Ω / □] are defined as these values. UV irradiation conditions are: metal halide lamp, illuminance 90 mW / cm². 2 , cumulative light intensity 3000 mJ / cm 2 The illuminance and integrated light intensity are measured using an ultraviolet illuminometer (EYE UVMETER UVPF-A1, manufactured by iGraphics Co., Ltd., with Headsensor "PD-365"). The surface resistivity of the adhesive surface represents the surface resistivity of the adhesive layer. In measuring the surface resistivity of the adhesive surface, the probe is in contact with the surface of the adhesive layer. Back surface resistivity represents the surface resistivity of the back surface of the substrate layer. In measuring back surface resistivity, the probe contacts the back surface of the substrate layer, that is, the surface opposite to the adhesive layer of the substrate layer. Resistivity of the back surface and the resistivity of the adhesive surface (after 1.5x expansion) After expanding the adhesive sheet obtained in the example to 1.5 times its original size using an expander, the surface resistivity of the adhesive sheet surface is measured using the method described above for pre-expansion.

[0179] (3) Adhesive strength before ultraviolet (UV) irradiation Under UV-blocked conditions of 23℃ / 50%RH, the adhesive layer side of an adhesive sheet cut to a width of 20mm was bonded to a SUS430BA plate (bonding conditions: 2kg roller, one pass). After 20-40 minutes, the adhesive sheet was peeled off the SUS430BA plate, and the peel strength (peeling speed: 300mm / min, peeling angle: 90°) was measured.

[0180] (4) Adhesive strength after UV irradiation (at room temperature, 23℃) Similar to (3) above, the adhesive sheet was attached to the SUS430BA plate and left to stand for 20 to 40 minutes in an environment shielded from ultraviolet light. Subsequently, a high-pressure mercury lamp (UM-810 (Nikki)) is used to expose the laminate to ultraviolet light (28 mW / cm²) from the adhesive sheet side. 2 , 10 seconds, 280mJ / cm 2 ) was irradiated. Next, the adhesive sheet was peeled off the SUS430BA plate, and the peel strength (peeling speed: 300 mm / min, peeling angle: 90°) was measured.

[0181] (5) Tensile breaking strength The tensile breaking strength of the adhesive sheet was measured in accordance with the method specified in JIS K6251:2010. More specifically, a desktop precision universal testing machine, Autograph AG-5KNX (manufactured by Shimadzu Corporation), was used as the tensile testing machine. Tensile tests were performed in the longitudinal direction (MD direction) or the width direction (TD direction) of a dumbbell-shaped or dumbbell-shaped (parallel section width 10 mm) test specimen under measurement conditions of a measurement temperature of 25°C, a tensile speed of 200 mm / min, and an initial jig distance of 40 mm or 20 mm. The maximum tensile force recorded before the test specimen broke was determined and defined as the tensile breaking strength of the test specimen (unit: MPa).

[0182] (6) Regularity of the chip arrangement after expansion Chips were arranged on the adhesive surface of an adhesive sheet with the same pitch both vertically and horizontally. After expanding the adhesive sheet to 1.5 times its original size using an expander, the rate of change in the vertical and horizontal pitch of the chips was measured. A ratio of MD / TD change rate between 0.8 and 1.2 was marked with [◎], a ratio exceeding 1.2 times but without film tearing was marked with [○], and cases where expansion was not possible or tearing occurred were marked with [×].

[0183] (7) Cohesive modulus of the adhesive layer G' (MPa) (23℃ - before UV) Using a TA Corporation ARES G2 rotary rheometer, the adhesive layer before UV irradiation was temperature-scanned in vibration mode with a frequency of 1 Hz and a temperature range of -70°C to 100°C. The storage modulus at 23°C was defined as G'.

[0184] (8) Loss modulus of elasticity of the adhesive layer G'' (MPa) (23℃ - before UV) Using a TA Corporation ARES G2 rotary rheometer, the adhesive layer before UV irradiation was temperature-scanned in vibration mode with a frequency of 1 Hz and a temperature range of -70°C to 100°C. The loss modulus at 23°C was defined as G''.

[0185] (9) Elongation at break For each example and comparative example, the adhesive sheets obtained were cut to a size of 20 mm in width and 150 mm in length to prepare test specimens. Then, the length of the test specimens was set to 50 mm, and a tensile test was performed at a tensile speed of 300 mm / min using a universal material testing machine (manufactured by Shimadzu Corporation, product name "AG-X plus Electronic Universal Testing Machine") under measurement conditions of 23°C and 50% relative humidity. The elongation at break (%) of the specimens was measured. The results are shown in Tables 2 and 3.

[0186] (10) Adhesion to UV-prepared substrate The adhesive sheets were attached to the package substrate using a 5kg roller, and observed after 1 hour. A "◎" rating indicated good adhesion between the adhesive sheet and the package substrate with no air bubbles, while a "○" rating indicated the presence of air bubbles between the adhesive sheet and the package substrate.

[0187] (11) Pickup rate of chips after UV treatment 300 mJ / cm² applied to the processed adhesive sheet. 2 Ultraviolet energy is irradiated, and an automatic pickup device is used to pick up electronic components on an adhesive sheet. A score of "◎" indicates that 99% or more of the electronic components were automatically picked, "○" indicates that 95% to less than 99% were automatically picked, and "×" indicates that 90% or less were automatically picked.

[0188] (12) Expandability (MD / TD) A 3x3cm grid was drawn on an adhesive sheet, and the sheet was uniformly expanded 360° to 1.5 times its original size using an automatic expander (WE-4U (Bishou Precision Electromechanical) test conditions: 1.5x expansion, lifting speed: 5mm / s; lifting height: 56mm; heated upper plate: 50℃; heated lower plate: 170℃). After removing the sheet and leaving it for 1 hour, it was observed and the change in grid point spacing was measured. Sheets that did not collapse or tear and whose grid point spacing difference was 5% or less were marked "◎", sheets that were perfect and whose grid point spacing difference exceeded 5% were marked "○", and sheets that collapsed or tore were marked "×".

[0189] (13) Chip dent A 1 mm × 1 mm silicon chip was placed on the adhesive surface of the adhesive sheet, and after laminating the release film, it was pressure-bonded 5 times back and forth with a 5 kg roller, placed in an environmental chamber at 50 °C, taken out after 24 hours, and irradiated with ultraviolet rays of 300 mJ / cm 2 . After taking out the chip, the dent depth of the chip was measured with a laser microscope. Those with a chip dent depth of 1 / 3 or less of the adhesive layer thickness of the adhesive sheet were rated as "◎", those with a chip dent depth of more than 1 / 3 and 2 / 3 or less were rated as "○", and those with a chip dent depth of more than 2 / 3 were rated as "×".

[0190] (14) Adhesive residue In the measurement of the adhesive force before and after UV, it was observed whether there was adhesive residue on the SUS430BA plate. Those without adhesive residue were rated as "◎", and those with adhesive residue were rated as "×".

[0191] (15) Comprehensive judgment When all of the above measurement values are excellent and all of the evaluation results are "◎", it is rated as "◎". When all of the above measurement values are excellent but there is at least one "○" in the evaluation results, it is rated as "○". When the above measurement values are poor and there is at least one "×" in the evaluation results, it is rated as "×".

[0192] As shown in Table 2, in Examples 1 to 6, the peeling charge generated during peeling can be sufficiently suppressed, and it has excellent antistatic properties, and can avoid or reduce damage to the adherend (for example, it has excellent electrostatic breakdown prevention ability), and can be easily peeled off without causing adhesive residue contamination after use. On the other hand, as shown in Table 3, in Comparative Examples 1 to 4, static electricity is generated when the adhesive sheet is peeled from the adherend, and the static electricity that causes the adherend to be charged may deteriorate and damage the built-in electronic components, and adhesive residue contamination occurred after use.

Industrial applicability

[0193] The adhesive sheet of the present invention can sufficiently suppress the electrostatic charge generated during peeling, and has excellent antistatic properties and stability of the peeling band voltage over time, thereby avoiding or reducing damage to the adherend (for example, it has excellent antistatic discharge ability), and can be easily peeled off after use without causing adhesive residue contamination. [Explanation of Symbols]

[0194] 1, 2, 3 Adhesive sheets 10 Base material layer 20 Adhesive layer 30 backcourt layers 40 Undercoat Layer

Claims

1. A pressure-sensitive adhesive sheet comprising a base layer and a pressure-sensitive adhesive layer provided on one side of the base layer, A pressure-sensitive adhesive sheet characterized in that, in a peel test at a peel speed of 300 mm / min, a peel electrification voltage generated when the pressure-sensitive adhesive sheet is peeled from a release film is 500 V or less.

2. In a peel test at a peel speed of 30 m / min, the peel electrification voltage generated when the pressure-sensitive adhesive sheet is peeled from the release film is 200 V or less, The surface resistivity of at least one surface of the pressure-sensitive adhesive sheet is 1.0×10 ５ ~1.0 x 10 １１ Ω / □, After the pressure-sensitive adhesive sheet is stretched 1 to 1.5 times in a 360° direction, the surface resistivity of the base layer is 1.0×10 ５ ~1.0 x 10 １１ Ω / □, and the surface resistivity of the pressure-sensitive adhesive sheet is 1.0×10 １１ 2. The pressure-sensitive adhesive sheet according to claim 1, wherein the surface roughness is Ω / □ or less.

3. 3. The pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive layer comprises a base polymer, a polyfunctional oligomer, and an antistatic agent.

4. the base polymer comprises an acrylic polymer; the base polymer contains 0.5 to 30 parts by weight of a functional monomer relative to 100 parts by weight of the total monomer components of the base polymer; 4. The pressure-sensitive adhesive sheet according to claim 3, wherein the functional monomer comprises at least one selected from the group consisting of hydroxyl group-containing monomers, carboxyl group-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, epoxy group-containing monomers, isocyanate group-containing monomers, amide group-containing monomers, monomers having a nitrogen atom-containing ring, monomers having a succinimide skeleton, maleimide-based monomers, itaconimide-based monomers, aminoalkyl (meth)acrylate-based monomers, alkoxyalkyl (meth)acrylate-based monomers, vinyl ether-based monomers, and olefin-based monomers.

5. The functionality of the polyfunctional oligomer is 2 or more, the polyfunctional oligomer comprises at least one selected from the group consisting of an acrylic-modified resin, a polyurethane-modified resin, an epoxy-modified resin, a phenol-modified resin, a polyether-modified resin, a polyester-modified resin, and a silicone-modified resin; 4. The pressure-sensitive adhesive sheet according to claim 3, wherein the content of the polyfunctional oligomer is 20 to 200 parts by weight per 100 parts by weight of the base polymer.

6. the antistatic agent comprises at least one selected from the group consisting of a conductive polymer, a conductive inorganic fine particle, a metal fine particle or fiber, an ionic compound, and an ionic surfactant; the conductive polymer comprises at least one selected from the group consisting of polyaniline, polypyrrole, polythiophene, polyquinoxaline, polyacetylene, polyethyleneimine, and an allylamine-based polymer; the conductive inorganic fine particles contain at least one selected from the group consisting of conductive metal oxides, carbon nanotubes, graphene, fullerenes, acetylene black, ketjen black, natural graphite, artificial graphite, and titanium black; the metal particles or fibers include particles or nanowires made of gold, silver, copper, aluminum, nickel, or an alloy thereof; the ionic compound comprises an alkali metal salt and / or an organic cation-anion salt; the ionic surfactant comprises at least one selected from the group consisting of a cationic surfactant, an anionic surfactant, a zwitterionic surfactant, and a nonionic surfactant; 4. The pressure-sensitive adhesive sheet according to claim 3, wherein the content of the antistatic agent is 0.0001 to 20 parts by weight per 100 parts by weight of the base polymer.

7. the pressure-sensitive adhesive layer further contains a photoinitiator and / or a crosslinking agent, the content of the photoinitiator is 0.5 to 10 parts by weight based on 100 parts by weight of the base polymer; 4. The pressure-sensitive adhesive sheet according to claim 3, wherein the content of the crosslinking agent is 0.1 to 10 parts by weight per 100 parts by weight of the base polymer.

8. The following characteristics: (a) The adhesive strength reduction rate of the PSA sheet calculated by the following formula (1) is 80% or more; Adhesive strength reduction rate (%) = [(N1-N2) / N1] x 100...(1) (where N1 represents the adhesive strength of the pressure-sensitive adhesive sheet before ultraviolet irradiation, N2 is applied to the adhesive sheet with an integrated light intensity of 300 mJ / cm ２ This indicates the adhesive strength after exposure to ultraviolet light.) (b) The pressure-sensitive adhesive sheet is exposed to an integrated light dose of 300 mJ / cm ２ The adhesive strength N2 after irradiation with ultraviolet light is 1N / 20mm or less, (c) the adhesive strength N1 of the pressure-sensitive adhesive sheet before ultraviolet irradiation is 0.5 to 40 N / 20 mm; (d) the ratio of the tensile breaking strength in the longitudinal direction (MD) to the tensile breaking strength in the width direction (TD) of the PSA sheet (tensile breaking strength in MD / tensile breaking strength in TD) is 0.8 to 1.2; 3. The pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive sheet satisfies at least one of the following conditions:

9. The thickness of the substrate layer is 10 to 300 μm, the base layer comprises at least one selected from the group consisting of thermoplastic polyurethane, polyethylene, polypropylene, polybutene, ethylene-vinyl acetate copolymer, and polyvinyl chloride; 3. The pressure-sensitive adhesive sheet according to claim 1, wherein the base layer contains an antistatic agent inside and / or on the surface thereof.

10. the pressure-sensitive adhesive sheet further comprises an undercoat layer and / or a backcoat layer, the backcoat layer is provided on the substrate layer on the opposite side to the pressure-sensitive adhesive layer, the undercoat layer is provided on the substrate layer on the opposite side to the backcoat layer, the undercoat layer contains at least one selected from the group consisting of thermosetting acrylic, polyurethane, and epoxy resins, 3. The pressure-sensitive adhesive sheet according to claim 1, wherein the backcoat layer contains at least one selected from the group consisting of thermosetting acrylic, polyurethane, and epoxy resins.

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