Epoxy resin pouring sealant and preparation method thereof

By employing a multi-component system and meticulous preparation steps, the strength, lifespan, and production efficiency of epoxy resin potting compounds have been improved. This solves the problem of insufficient strength and lifespan of epoxy resin potting compounds in existing technologies, achieving highly efficient and reliable potting compound performance and production efficiency.

CN121628544APending Publication Date: 2026-03-10KOMAX NEW MATERIAL TECHNOLOGY (ANHUI) CO LTD
View PDF 0 Cites 1 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-11-21
Publication Date
2026-03-10

AI Technical Summary

Technical Problem

Existing epoxy resin potting compounds cannot be further improved in terms of strength and lifespan, and their production efficiency is also low.

Method used

A multi-component system is adopted, including bisphenol A type epoxy resin as the matrix, silica powder as the filler, combined with diluents such as phenyl glycidyl ether, glycidyl acrylate and dibutyl phthalate, carboxyl-terminated liquid nitrile rubber, polysulfide rubber and long-chain fatty acid modified epoxy resin as toughening agents, phosphate esters, ammonium polyphosphate and antimony trioxide as flame retardants, fumed silica, organobentonite and hydrogenated castor oil as thixotropic agents, aromatic amines, alicyclic amines and methyltetrahydrophthalic anhydride as curing agents, metal carboxylates, phenol and nonylphenol as accelerators, and isopropyltrisyl and KH-560 as coupling agents. Through the preparation steps of feeding and premixing, filler sorting and mixing, degassing and refining, the uniform dispersion and full reaction of each component are ensured.

Benefits of technology

It improves the bonding strength, flexibility, and fire safety of potting compounds, extends the service life of electronic components, optimizes production process performance, enhances environmental adaptability, and improves production efficiency and product quality stability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121628544A_ABST
    Figure CN121628544A_ABST
Patent Text Reader

Abstract

The invention discloses an epoxy resin pouring sealant and a preparation method thereof, and the epoxy resin pouring sealant comprises the following raw materials: 60-90 parts of a matrix, 10-20 parts of a filler, 1-15 parts of a diluent, 1-15 parts of a flexibilizer, 1-15 parts of a flame retardant, 1-15 parts of a thixotropic agent, 1-15 parts of a curing agent, 1-15 parts of an accelerant and 1-15 parts of a coupling agent. Through a multi-component system comprising the matrix, the filler, the diluent, the flexibilizer, the flame retardant, the thixotropic agent, the curing agent, the accelerant and the coupling agent, the bonding strength, the flexibility and the fireproof safety of the pouring sealant are comprehensively improved, the packaging requirements of various electronic elements are met, the service life of a product is prolonged, the stability of the product is improved, the process performance is optimized, and the production cost is reduced. Through the preparation steps of feeding and premixing, filler sorting and mixing, defoaming and refining, uniform dispersion and full reaction of all the components are ensured, the consistency and quality stability of the pouring sealant are improved, the production process is simplified, the production efficiency is improved, and the energy consumption and the cost are reduced.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of epoxy resin potting compound technology, and more particularly to an epoxy resin potting compound and its preparation method. Background Technology

[0002] Epoxy resin potting compound is a thermosetting polymer encapsulation material made with epoxy resin as the base and the addition of curing agents, fillers, and functional additives. It is available in two systems: two-component room-temperature curing and one-component high-temperature curing. The cured product has a hardness of Shore D 85, a smooth surface with excellent gloss, and a dielectric strength ≥18 kV / mm. It possesses properties such as insulation, water resistance, oil resistance, dust resistance, chemical corrosion resistance, aging resistance, and resistance to thermal shock.

[0003] Existing epoxy resin potting compounds cannot be further improved in terms of strength and lifespan, and their production efficiency is also low. Therefore, this invention proposes an epoxy resin potting compound and its preparation method to solve the above problems. Summary of the Invention

[0004] Based on the technical problems in the background that epoxy resin potting compounds cannot be further improved in terms of strength and lifespan, and have low production efficiency, this invention proposes an epoxy resin potting compound and its preparation method.

[0005] The present invention proposes an epoxy resin potting compound comprising the following raw materials in parts: 60-90 parts matrix, 10-20 parts filler, 1-15 parts diluent, 1-15 parts toughening agent, 1-15 parts flame retardant, 1-15 parts thixotropic agent, 1-15 parts curing agent, 1-15 parts accelerator, and 1-15 parts coupling agent.

[0006] Preferably, the matrix is ​​made of bisphenol A epoxy resin and the filler is made of silica powder.

[0007] Furthermore, bisphenol A type epoxy resin is used as the matrix to provide excellent mechanical properties and chemical stability, while silica powder is used as a filler to enhance hardness and wear resistance, enabling the potting compound to maintain its performance in high temperature and high humidity environments, extending the durability of the encapsulated device, and improving thermal conductivity.

[0008] Preferably, the diluent is prepared by mixing phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate, with a formulation of 1-5:4-8:1-9; the toughening agent is prepared by mixing carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid modified epoxy resin, with a formulation of 1-5:4-8:1-5; the flame retardant is prepared by mixing phosphate esters, ammonium polyphosphate, and antimony trioxide, with a formulation of 1-8:2-8:3-7; and the thixotropic agent is prepared by mixing fumed silica, organobentonite, and hydrogenated castor oil, with a formulation of 2-3:1-7:2-6.

[0009] Furthermore, the fluidity and permeability are improved by a mixed diluent of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate; the toughening agent combination of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid modified epoxy resin enhances impact resistance; the flame retardant system of phosphate esters, ammonium polyphosphate, and antimony trioxide provides efficient fire protection; and the thixotropic agents of fumed silica, organobentonite, and hydrogenated castor oil ensure anti-sagging properties during construction, making the potting compound easy to apply and reliable in performance.

[0010] Preferably, the curing agent is prepared by mixing aromatic amines, alicyclic amines and methyltetrahydrophthalic anhydride, with a formulation of 1-7:2-9:2-8; the accelerator is prepared by mixing metal carboxylates, phenol and nonylphenol, with a formulation of 2-9:3-6:2-8; and the coupling agent is prepared by mixing isopropyltrisyl chloride and KH-560, with a formulation of 1-3:1-7.

[0011] Furthermore, a curing agent system consisting of aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride is used to achieve a rapid and uniform curing reaction. Accelerators such as metal carboxylates, phenol, and nonylphenol accelerate the curing process, while coupling agents such as isopropyltrisyl and KH-560 enhance interfacial adhesion, improve the adhesion of the potting compound to the substrate and its environmental adaptability, and ensure long-term reliability.

[0012] This invention also proposes a method for preparing epoxy resin potting compound, comprising the following steps: S1: Feeding and premixing; S2: Packing material sorting and mixing; S3: Defoaming and refining.

[0013] Preferably, in step S1, two planetary mixers are prepared. The matrix, diluent, and toughening agent are added to planetary mixer A and stirred at low speed under vacuum for 10-15 minutes to ensure thorough mixing. Then, the curing agent and accelerator are added to planetary mixer B and stirred at low speed for 5-10 minutes.

[0014] Furthermore, a planetary mixer is used for low-speed vacuum mixing to ensure that the matrix, diluent, and toughening agent are fully mixed and to avoid the formation of air bubbles. The curing agent and accelerator are pretreated in another mixer to ensure that the curing system is uniform, laying the foundation for subsequent steps and improving mixing efficiency.

[0015] Preferably, in step S2, silica powder and flame retardant are added sequentially to planetary mixer A, the vacuum is turned off, and the mixture is stirred at low speed to initially impregnate the filler. Then, the mixture is stirred at high speed for 30-45 minutes until the mixture is uniform and free of dry powder. Then, filler and coupling agent are added to planetary mixer B, and the mixture is stirred at low speed first and then at high speed for 30-40 minutes to make it uniformly mixed.

[0016] Furthermore, fillers and flame retardants are added sequentially, and the mixture is stirred from low speed to high speed to ensure that the fillers are fully impregnated and dispersed, and the flame retardants are evenly distributed, thereby enhancing the mechanical strength and fire resistance of the potting compound. At the same time, the addition of coupling agents improves the compatibility between the fillers and the matrix and optimizes the uniformity of the product.

[0017] Preferably, in step S3, fumed silica and color paste are added to planetary mixer A, the vacuum is turned back on, and the mixture is stirred and degassed at low speed for 40-60 minutes until the colloid is fine, uniform and free of visible bubbles. The vacuum is turned on in planetary mixer B, and the mixture is degassed at low speed for 30-40 minutes. Components A and B are then discharged separately.

[0018] Furthermore, vacuum degassing effectively removes air bubbles from the colloid, resulting in a fine and uniform potting compound. The addition of colorant provides color consistency, ensuring that the final product has an attractive appearance and reliable performance, meeting the needs of high-end applications and enhancing market competitiveness.

[0019] The beneficial effects of this invention are: This invention utilizes a multi-component system comprising a matrix, filler, diluent, toughening agent, flame retardant, thixotropic agent, curing agent, accelerator, and coupling agent to comprehensively enhance the adhesive strength, flexibility, and fire safety of potting compounds. This meets the encapsulation requirements of various electronic components, improves product lifespan and stability, optimizes process performance, and enhances environmental adaptability. Through preparation steps including feeding and premixing, filler sorting and mixing, and degassing and refining, the invention ensures uniform dispersion and full reaction of each component, improving the consistency and quality stability of the potting compound, simplifying the production process, increasing production efficiency, and reducing energy consumption and costs. Attached Figure Description

[0020] Figure 1 This is a flowchart illustrating the workflow proposed in this invention. Detailed Implementation

[0021] The present invention will be further explained below with reference to specific embodiments.

[0022] Reference Figure 1 Example 1 This embodiment presents an epoxy resin potting compound comprising the following raw materials in parts: 65 parts matrix, 10 parts filler, 5 parts diluent, 2 parts toughening agent, 3 parts flame retardant, 4 parts thixotropic agent, 6 parts curing agent, 1 part accelerator, and 4 parts coupling agent. The matrix is ​​specifically bisphenol A epoxy resin, and the filler is specifically silica powder. Using bisphenol A epoxy resin as the matrix provides excellent mechanical properties and chemical stability, while silica powder as the filler enhances hardness and wear resistance, enabling the potting compound to maintain its performance under high temperature and high humidity environments and extending the durability of the encapsulated device. To improve thermal conductivity, the diluent is specifically prepared from a mixture of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate in a 3:3:2 ratio. The toughening agent is specifically prepared from a mixture of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid-modified epoxy resin in a 2:5:3 ratio. The flame retardant is specifically prepared from a mixture of phosphate esters, ammonium polyphosphate, and antimony trioxide in a 5:7:6 ratio. The thixotropic agent is specifically prepared from a mixture of fumed silica, organobentonite, and hydrogenated castor oil in a 2:3:6 ratio. A mixed diluent of glycidyl ether, glycidyl acrylate, and dibutyl phthalate improves flowability and permeability. A toughening agent combination of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid-modified epoxy resin enhances impact resistance. A flame retardant system of phosphate esters, ammonium polyphosphate, and antimony trioxide provides highly efficient fire protection. A thixotropic agent of fumed silica, organobentonite, and hydrogenated castor oil ensures anti-sagging properties during application, making the potting compound easy to apply and reliable. The curing agent is specifically prepared from a mixture of aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride. Its formulation is 3:8:2. The accelerator is a mixture of metal carboxylate, phenol, and nonylphenol, with a formulation of 2:3:2. The coupling agent is a mixture of isopropyltris and KH-560, with a formulation of 1:13. The curing agent system using aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride achieves a rapid and uniform curing reaction. The accelerators, metal carboxylate, phenol, and nonylphenol, accelerate the curing process, while the coupling agent, isopropyltris and KH-560, enhances interfacial adhesion, improves the adhesion between the potting compound and the substrate, and enhances environmental adaptability, ensuring long-term reliability.

[0023] This invention also proposes a method for preparing epoxy resin potting compound, comprising the following steps: S1: Feeding and premixing. Prepare two planetary mixers. Add the matrix, diluent, and toughening agent to planetary mixer A and mix for 12 minutes under low-speed vacuum conditions to ensure thorough and uniform mixing. Then add the curing agent and accelerator to planetary mixer B and mix at low speed for 8 minutes. Use planetary mixers for low-speed vacuum mixing to ensure thorough mixing of the matrix, diluent, and toughening agent, avoiding the generation of air bubbles. Pre-treat the curing agent and accelerator in another mixer to ensure a uniform curing system, laying the foundation for subsequent steps and improving mixing efficiency. S2: Filler sorting and mixing. In the planetary mixer of group A, add silica powder and flame retardant in sequence, close the vacuum, and stir at low speed to initially impregnate the filler. Then, stir at high speed for 30 minutes until the mixture is uniform and free of dry powder. Then, add filler and coupling agent in the planetary mixer of group B. Stir at low speed first and then at high speed for 35 minutes to make it uniform. Add filler and flame retardant in sequence. Through the transition from low speed to high speed, the filler is fully impregnated and dispersed, and the flame retardant is evenly distributed, which enhances the mechanical strength and fire resistance of the potting compound. At the same time, the addition of coupling agent improves the compatibility between the filler and the matrix and optimizes the uniformity of the product. S3: Degassing and refining. Add fumed silica and colorant to the planetary mixer in group A, restart the vacuum, and stir at low speed for 45 minutes to degas until the colloid is fine, uniform, and free of visible bubbles. In the planetary mixer in group B, turn on the vacuum and degas at low speed for 40 minutes. Discharge the materials separately to obtain components A and B. Vacuum degassing effectively removes bubbles from the colloid, resulting in a fine and uniform texture of the potting compound. The addition of colorant provides color consistency, ensuring that the final product has an attractive appearance and reliable performance, meeting the needs of high-end applications and enhancing market competitiveness.

[0024] Reference Figure 1 Example 2 This embodiment proposes an epoxy resin potting compound comprising the following raw materials in parts: 70 parts matrix, 10 parts filler, 6 parts diluent, 2 parts toughening agent, 3 parts flame retardant, 2 parts thixotropic agent, 2 parts curing agent, 2 parts accelerator, and 3 parts coupling agent. The matrix is ​​specifically bisphenol A epoxy resin, and the filler is specifically silica powder. Using bisphenol A epoxy resin as the matrix provides excellent mechanical properties and chemical stability, while silica powder as the filler enhances hardness and wear resistance, enabling the potting compound to maintain its performance under high temperature and high humidity environments and extending the durability of the encapsulated device. To improve thermal conductivity, the diluent is specifically prepared from a mixture of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate in a ratio of 5:8:1. The toughening agent is specifically prepared from a mixture of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid-modified epoxy resin in a ratio of 5:4:5. The flame retardant is specifically prepared from a mixture of phosphate esters, ammonium polyphosphate, and antimony trioxide in a ratio of 8:2:3. The thixotropic agent is specifically prepared from a mixture of fumed silica, organobentonite, and hydrogenated castor oil in a ratio of 3:1:6. A mixed diluent of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate improves flowability and permeability. A toughening agent combination of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid-modified epoxy resin enhances impact resistance. A flame retardant system of phosphate esters, ammonium polyphosphate, and antimony trioxide provides efficient fire protection. A thixotropic agent of fumed silica, organobentonite, and hydrogenated castor oil ensures anti-sagging properties during construction, making the potting compound easy to apply and reliable. The curing agent is specifically prepared by mixing aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride. Its formulation is 2:3:6. The accelerator is a mixture of metal carboxylate, phenol, and nonylphenol, with a formulation of 3:4:5. The coupling agent is a mixture of isopropyltris and KH-560, with a formulation of 2:3. The curing agent system using aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride achieves a rapid and uniform curing reaction. The accelerators, metal carboxylate, phenol, and nonylphenol, accelerate the curing process, while the coupling agent, isopropyltris and KH-560, enhances interfacial adhesion, improves the adhesion between the potting compound and the substrate, and enhances environmental adaptability, ensuring long-term reliability.

[0025] This invention also proposes a method for preparing epoxy resin potting compound, comprising the following steps: S1: Feeding and premixing. Prepare two planetary mixers. Add the matrix, diluent, and toughening agent to planetary mixer A and mix for 13 minutes under low-speed vacuum conditions to ensure thorough and uniform mixing. Then add the curing agent and accelerator to planetary mixer B and mix at low speed for 8 minutes. Use planetary mixers for low-speed vacuum mixing to ensure thorough mixing of the matrix, diluent, and toughening agent, avoiding the generation of air bubbles. Pre-treat the curing agent and accelerator in another mixer to ensure a uniform curing system, laying the foundation for subsequent steps and improving mixing efficiency. S2: Filler sorting and mixing. In the planetary mixer of group A, add silica powder and flame retardant in sequence, close the vacuum, and stir at low speed to initially impregnate the filler. Then, stir at high speed for 30 minutes until the mixture is uniform and free of dry powder. Then, add filler and coupling agent in the planetary mixer of group B. Stir at low speed first and then at high speed for 34 minutes to make it uniformly mixed. Add filler and flame retardant in sequence. Through the transition from low speed to high speed, the filler is fully impregnated and dispersed, and the flame retardant is evenly distributed, which enhances the mechanical strength and fire resistance of the potting compound. At the same time, the addition of coupling agent improves the compatibility between the filler and the matrix and optimizes the uniformity of the product. S3: Degassing and refining. Add fumed silica and colorant to the planetary mixer in group A, restart the vacuum, and stir at low speed for 55 minutes to degas until the colloid is fine, uniform, and free of visible bubbles. In the planetary mixer in group B, turn on the vacuum and degas at low speed for 35 minutes. Discharge the materials separately to obtain components A and B. Vacuum degassing effectively removes bubbles from the colloid, resulting in a fine and uniform texture of the potting compound. The addition of colorant provides color consistency, ensuring that the final product has an attractive appearance and reliable performance, meeting the needs of high-end applications and enhancing market competitiveness.

[0026] Reference Figure 1 Example 3 This embodiment proposes an epoxy resin potting compound comprising the following raw materials in parts: 70 parts matrix, 15 parts filler, 2 parts diluent, 3 parts toughening agent, 1 part flame retardant, 3 parts thixotropic agent, 2 parts curing agent, 2 parts accelerator, and 2 parts coupling agent. The matrix is ​​specifically bisphenol A epoxy resin, and the filler is specifically silica powder. Using bisphenol A epoxy resin as the matrix provides excellent mechanical properties and chemical stability, while silica powder as the filler enhances hardness and wear resistance, enabling the potting compound to maintain its performance under high temperature and high humidity environments and extending the durability of the encapsulated device. To improve thermal conductivity, the diluent is specifically prepared from a mixture of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate in a ratio of 3:6:2. The toughening agent is specifically prepared from a mixture of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid-modified epoxy resin in a ratio of 2:5:3. The flame retardant is specifically prepared from a mixture of phosphate esters, ammonium polyphosphate, and antimony trioxide in a ratio of 3:6:4. The thixotropic agent is specifically prepared from a mixture of fumed silica, organobentonite, and hydrogenated castor oil in a ratio of 3:5:3. A mixed diluent of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate improves flowability and permeability. A toughening agent combination of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid-modified epoxy resin enhances impact resistance. A flame retardant system of phosphate esters, ammonium polyphosphate, and antimony trioxide provides efficient fire protection. A thixotropic agent of fumed silica, organobentonite, and hydrogenated castor oil ensures anti-sagging properties during construction, making the potting compound easy to apply and reliable. The curing agent is specifically prepared by mixing aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride. Its formulation is 3:8:3. The accelerator is a mixture of metal carboxylate, phenol, and nonylphenol, with a formulation of 3:5:3. The coupling agent is a mixture of isopropyltris and KH-560, with a formulation of 2:6. The curing agent system using aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride achieves a rapid and uniform curing reaction. The accelerators of metal carboxylate, phenol, and nonylphenol accelerate the curing process, while the coupling agent of isopropyltris and KH-560 enhances interfacial adhesion, improves the adhesion between the potting compound and the substrate, and enhances environmental adaptability, ensuring long-term reliability.

[0027] This invention also proposes a method for preparing epoxy resin potting compound, comprising the following steps: S1: Feeding and premixing. Prepare two planetary mixers. Add the matrix, diluent, and toughening agent to planetary mixer A and mix for 12 minutes under low-speed vacuum conditions to ensure thorough and uniform mixing. Then add the curing agent and accelerator to planetary mixer B and mix at low speed for 8 minutes. Use planetary mixers for low-speed vacuum mixing to ensure thorough mixing of the matrix, diluent, and toughening agent, avoiding the generation of air bubbles. Pre-treat the curing agent and accelerator in another mixer to ensure a uniform curing system, laying the foundation for subsequent steps and improving mixing efficiency. S2: Filler sorting and mixing. In the planetary mixer of group A, add silica powder and flame retardant in sequence, close the vacuum, and stir at low speed to initially impregnate the filler. Then, stir at high speed for 42 minutes until the mixture is uniform and free of dry powder. Then, add filler and coupling agent in the planetary mixer of group B. Stir at low speed first and then at high speed for 18 minutes to make it uniform. Add filler and flame retardant in sequence. Through the transition from low speed to high speed, the filler is fully impregnated and dispersed, and the flame retardant is evenly distributed, which enhances the mechanical strength and fire resistance of the potting compound. At the same time, the addition of coupling agent improves the compatibility between the filler and the matrix and optimizes the uniformity of the product. S3: Degassing and refining. Fumed silica and colorant are added to the planetary mixer in group A. The vacuum is restarted, and the mixture is stirred and degassed at low speed for 50 minutes until the colloid is fine, uniform, and free of visible bubbles. The vacuum is then turned on in the planetary mixer in group B, and the mixture is degassed at low speed for 38 minutes. The A and B components are then discharged separately. Vacuum degassing effectively removes air bubbles from the colloid, resulting in a fine and uniform texture of the potting compound. The addition of colorant provides color consistency, ensuring that the final product has an attractive appearance and reliable performance, meeting the needs of high-end applications and enhancing market competitiveness.

[0028] Reference Figure 1 Example 4 This embodiment presents an epoxy resin potting compound comprising the following raw materials in parts: 70 parts matrix, 10 parts filler, 5 parts diluent, 3 parts toughening agent, 2 parts flame retardant, 1 part thixotropic agent, 3 parts curing agent, 2 parts accelerator, and 4 parts coupling agent. The matrix is ​​specifically bisphenol A epoxy resin, and the filler is specifically silica powder. Using bisphenol A epoxy resin as the matrix provides excellent mechanical properties and chemical stability, while silica powder as the filler enhances hardness and wear resistance, enabling the potting compound to maintain its performance under high temperature and high humidity environments and extending the durability of the encapsulated device. To improve thermal conductivity, the diluent is specifically prepared from a mixture of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate in a ratio of 3:5:2. The toughening agent is specifically prepared from a mixture of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid-modified epoxy resin in a ratio of 5:6:3. The flame retardant is specifically prepared from a mixture of phosphate esters, ammonium polyphosphate, and antimony trioxide in a ratio of 2:6:6. The thixotropic agent is specifically prepared from a mixture of fumed silica, organobentonite, and hydrogenated castor oil in a ratio of 3:6:4. A mixed diluent of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate improves flowability and permeability. A toughening agent combination of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid-modified epoxy resin enhances impact resistance. A flame retardant system of phosphate esters, ammonium polyphosphate, and antimony trioxide provides efficient fire protection. A thixotropic agent of fumed silica, organobentonite, and hydrogenated castor oil ensures anti-sagging properties during construction, making the potting compound easy to apply and reliable. The curing agent is specifically prepared by mixing aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride. The formulation is 3:8:4. The accelerator is a mixture of metal carboxylate, phenol, and nonylphenol with a formulation of 2:3:7. The coupling agent is a mixture of isopropyltris and KH-560 with a formulation of 2:3. The curing agent system using aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride achieves a rapid and uniform curing reaction. The accelerators, metal carboxylate, phenol, and nonylphenol, accelerate the curing process, while the coupling agent, isopropyltris and KH-560, enhances interfacial adhesion, improves the adhesion between the potting compound and the substrate, and enhances environmental adaptability, ensuring long-term reliability.

[0029] This invention also proposes a method for preparing epoxy resin potting compound, comprising the following steps: S1: Feeding and premixing. Prepare two planetary mixers. Add the matrix, diluent, and toughening agent to planetary mixer A and mix for 13 minutes under low-speed vacuum conditions to ensure thorough and uniform mixing. Then add the curing agent and accelerator to planetary mixer B and mix at low speed for 10 minutes. Use planetary mixers for low-speed vacuum mixing to ensure thorough mixing of the matrix, diluent, and toughening agent, avoiding the formation of air bubbles. Pre-treat the curing agent and accelerator in another mixer to ensure a uniform curing system, laying the foundation for subsequent steps and improving mixing efficiency. S2: Filler sorting and mixing. In the planetary mixer of group A, add silica powder and flame retardant in sequence, close the vacuum, and stir at low speed to initially impregnate the filler. Then, stir at high speed for 45 minutes until the mixture is uniform and free of dry powder. Then, add filler and coupling agent in the planetary mixer of group B. Stir at low speed first and then at high speed for 30 minutes to make it uniform. Add filler and flame retardant in sequence. Through the transition from low speed to high speed, the filler is fully impregnated and dispersed, and the flame retardant is evenly distributed, which enhances the mechanical strength and fire resistance of the potting compound. At the same time, the addition of coupling agent improves the compatibility between the filler and the matrix and optimizes the uniformity of the product. S3: Degassing and refining. Add fumed silica and colorant to the planetary mixer in group A, restart the vacuum, and stir at low speed for 50 minutes to degas until the colloid is fine, uniform, and free of visible bubbles. In the planetary mixer in group B, turn on the vacuum and degas at low speed for 35 minutes. Discharge the materials separately to obtain components A and B. Vacuum degassing effectively removes bubbles from the colloid, resulting in a fine and uniform texture of the potting compound. The addition of colorant provides color consistency, ensuring that the final product has an attractive appearance and reliable performance, meeting the needs of high-end applications and enhancing market competitiveness.

[0030] Reference Figure 1 Example 5 This embodiment presents an epoxy resin potting compound comprising the following raw materials in parts: 65 parts matrix, 10 parts filler, 10 parts diluent, 5 parts toughening agent, 2 parts flame retardant, 2 parts thixotropic agent, 3 parts curing agent, 1 part accelerator, and 2 parts coupling agent. The matrix is ​​specifically bisphenol A epoxy resin, and the filler is specifically silica powder. Using bisphenol A epoxy resin as the matrix provides excellent mechanical properties and chemical stability, while silica powder as the filler enhances hardness and wear resistance, enabling the potting compound to maintain its performance under high temperature and high humidity conditions and extending the durability of the encapsulated device. To improve thermal conductivity, the diluent is specifically prepared from a mixture of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate in a ratio of 1:8:1. The toughening agent is specifically prepared from a mixture of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid modified epoxy resin in a ratio of 5:8:1. The flame retardant is specifically prepared from a mixture of phosphate esters, ammonium polyphosphate, and antimony trioxide in a ratio of 1:8:3. The thixotropic agent is specifically prepared from a mixture of fumed silica, organobentonite, and hydrogenated castor oil in a ratio of 3:1:2. The fluidity and permeability are improved by a mixed diluent of phenyl glycidyl ether, glycidyl acrylate, and dibutyl phthalate. A toughening agent combination of carboxyl-terminated liquid nitrile rubber, polysulfide rubber, and long-chain fatty acid-modified epoxy resin enhances impact resistance. A flame retardant system of phosphate esters, ammonium polyphosphate, and antimony trioxide provides highly efficient fire protection. A thixotropic agent of fumed silica, organobentonite, and hydrogenated castor oil ensures anti-sagging properties during application, making the potting compound easy to apply and reliable. The curing agent is specifically a mixture of aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride. The formulation is 7:9:8. The accelerator is a mixture of metal carboxylate, phenol, and nonylphenol, with a formulation of 9:3:8. The coupling agent is a mixture of isopropyltris and KH-560, with a formulation of 1:7. The curing agent system using aromatic amines, alicyclic amines, and methyltetrahydrophthalic anhydride achieves a rapid and uniform curing reaction. The accelerators, metal carboxylate, phenol, and nonylphenol, accelerate the curing process. The coupling agent, isopropyltris and KH-560, enhances interfacial adhesion, improves the adhesion between the potting compound and the substrate, and enhances environmental adaptability, ensuring long-term reliability.

[0031] This invention also proposes a method for preparing epoxy resin potting compound, comprising the following steps: S1: Feeding and premixing. Prepare two planetary mixers. Add the matrix, diluent, and toughening agent to planetary mixer A and mix for 15 minutes under low-speed vacuum conditions to ensure thorough and uniform mixing. Then add the curing agent and accelerator to planetary mixer B and mix at low speed for 10 minutes. Use planetary mixers for low-speed vacuum mixing to ensure thorough mixing of the matrix, diluent, and toughening agent, avoiding the generation of air bubbles. Pre-treat the curing agent and accelerator in another mixer to ensure a uniform curing system, laying the foundation for subsequent steps and improving mixing efficiency. S2: Filler sorting and mixing. In the planetary mixer of group A, add silica powder and flame retardant in sequence, close the vacuum, and stir at low speed to initially impregnate the filler. Then, stir at high speed for 40 minutes until the mixture is uniform and free of dry powder. Then, add filler and coupling agent in the planetary mixer of group B. Stir at low speed first and then at high speed for 35 minutes to make it uniform. Add filler and flame retardant in sequence. Through the transition from low speed to high speed, the filler is fully impregnated and dispersed, and the flame retardant is evenly distributed, which enhances the mechanical strength and fire resistance of the potting compound. At the same time, the addition of coupling agent improves the compatibility between the filler and the matrix and optimizes the uniformity of the product. S3: Degassing and refining. Add fumed silica and colorant to the planetary mixer in group A, restart the vacuum, and stir at low speed for 50 minutes to degas until the colloid is fine, uniform, and free of visible bubbles. In the planetary mixer in group B, turn on the vacuum and degas at low speed for 35 minutes. Discharge the materials separately to obtain components A and B. Vacuum degassing effectively removes bubbles from the colloid, resulting in a fine and uniform texture of the potting compound. The addition of colorant provides color consistency, ensuring that the final product has an attractive appearance and reliable performance, meeting the needs of high-end applications and enhancing market competitiveness.

[0032] The epoxy resin potting compounds prepared in Examples 1 to 5 are compared with conventional epoxy resin potting compounds, as shown in the table below:

[0033] As can be seen from the table above, the epoxy resin potting compound and its preparation method proposed in this invention have significant improvements, and embodiment two is the best embodiment.

[0034] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An epoxy resin potting compound, characterized by, The raw materials include the following parts: 60-90 parts of matrix, 10-20 parts of filler, 1-15 parts of diluent, 1-15 parts of toughening agent, 1-15 parts of flame retardant, 1-15 parts of thixotropic agent, 1-15 parts of curing agent, 1-15 parts of accelerator and 1-15 parts of coupling agent.

2. The epoxy potting compound according to claim 1, characterized in that, The specific material of the matrix is bisphenol A type epoxy resin, and the specific material of the filler is silicon powder.

3. The epoxy potting compound of claim 1, wherein, The specific material of the diluent is a mixture of phenyl glycidyl ether, glycidyl acrylate and dibutyl phthalate, and the formula is 1-5:4-8:1-9; the specific material of the toughening agent is a mixture of carboxyl-terminated liquid nitrile rubber, polysulfide rubber and long-chain fatty acid modified epoxy resin, and the formula is 1-5:4-8:1-5; the specific material of the flame retardant is a mixture of phosphate ester, ammonium polyphosphate and antimony trioxide, and the formula is 1-8:2-8:3-7; the specific material of the thixotropic agent is a mixture of fumed silica, organic bentonite and hydrogenated castor oil, and the formula is 2-3:1-7:2-6.

4. The epoxy potting compound of claim 1, wherein, The specific material of the curing agent is a mixture of aromatic amine, alicyclic amine and methyl tetrahydrophthalic anhydride, and the formula is 1-7:2-9:2-8; the specific material of the accelerator is a mixture of metal carboxylate, phenol and nonyl phenol, and the formula is 2-9:3-6:2-8; the specific material of the coupling agent is a mixture of isopropyl tri and KH-560, and the formula is 1-3:1-7.

5. A method for preparing an epoxy resin potting compound, characterized by, The method comprises the following steps: S1: feeding and premixing; S2: filler sorting and mixing; S3: defoaming and refining.

6. The method for preparing an epoxy resin potting compound according to claim 5, characterized in that, In the S1 step, two planetary mixers are prepared, the matrix, diluent and toughening agent are added to the A group planetary mixer, stirred under low speed vacuum condition for 10-15 minutes to make them fully mixed and uniform, then the curing agent and accelerator are added to the B group planetary mixer, stirred under low speed for 5-10 minutes.

7. The method for preparing an epoxy resin potting compound according to claim 5, characterized in that, In the S2 step, the silicon powder and flame retardant are sequentially added to the A group planetary mixer, the vacuum is closed, and the filler is preliminarily infiltrated by stirring under low speed, and then the speed is changed to high speed and stirred for 30-45 minutes until the mixture is uniform and there is no dry powder, then the filler and coupling agent are added to the B group planetary mixer, and stirred under low speed and then high speed for 30-40 minutes to make them uniformly mixed.

8. The method for preparing an epoxy resin potting compound according to claim 5, characterized in that, In the S3 step, fumed silica and color paste are added to the A group planetary mixer, the vacuum is reopened, and the mixture is defoamed under low speed for 40-60 minutes until the colloid is fine, uniform and free of visible bubbles, and the B group planetary mixer is opened under vacuum and defoamed under low speed for 30-40 minutes, and then the A group and B group are discharged respectively.

Citation Information

Cited By

  • An ultra-long storage shelf-life ntc temperature sensor encapsulation material

    CN122234565A