Light-emitting device, manufacturing method for the same, imaging apparatus, electronic device, and mobile body

Abstract

To provide a light-emitting device having a structure advantageous to improving reliability.SOLUTION: A display device relates to a light-emitting device. The light-emitting device includes a structure having a first surface and a second surface on opposite sides of each other, a light-emitting unit arranged on the first surface, and a protective layer covering the light-emitting unit and the first surface. The structure includes a conductive member to which a signal or potential is given to operate the light-emitting unit and an opening part from the conductive member to a virtual surface including the second surface.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a light-emitting device, a method for manufacturing a light-emitting device, an imaging device, an electronic device, and a moving body.

Background Art

[0002] In Patent Document 1, after forming a plurality of films such as a gas barrier layer, an underlayer, a color filter, and a protective layer on a light-emitting element and a terminal portion, the plurality of films on the terminal portion are removed by etching to form a contact hole for exposing the terminal portion. When the contact hole is formed as described above, there is a possibility that moisture may enter the light-emitting element through the contact hole, and the reliability of the device may be reduced.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide a light-emitting device having a structure advantageous for improving reliability.

Means for Solving the Problems

[0005] One aspect of the present invention relates to a light-emitting device including a structure having first and second surfaces on opposite sides, a light-emitting portion disposed on the first surface, and a protective layer covering the light-emitting portion and the first surface, wherein the structure includes a conductive member to which a signal or potential for operating the light-emitting portion is applied, and an opening extending from the conductive member to a virtual surface including the second surface.

Effects of the Invention

[0006] The present invention provides a light-emitting device having a structure advantageous for improving reliability. [Brief explanation of the drawing]

[0007] [Figure 1] A schematic and illustrative cross-sectional view showing the configuration of a display device or light-emitting device according to the first embodiment. [Figure 2] A diagram schematically and illustratively showing the configuration of a display device or light-emitting device according to the first embodiment. [Figure 3] A diagram schematically and illustratively showing the configuration of a display device or light-emitting device according to the second embodiment. [Figure 4] A diagram schematically and illustratively showing the configuration of a display device or light-emitting device according to the third embodiment. [Figure 5] A diagram schematically and illustratively showing the configuration of a display device or light-emitting device according to the fourth embodiment. [Figure 6] A diagram schematically and illustratively showing the configuration of a display device or light-emitting device according to the fifth embodiment. [Figure 7] A diagram schematically and illustratively showing the configuration of a display device or light-emitting device according to the sixth embodiment. [Figure 8A] A schematic and illustrative cross-sectional view showing a method for manufacturing a display device or light-emitting device according to the first embodiment. [Figure 8B] A schematic and illustrative cross-sectional view showing a method for manufacturing a display device or light-emitting device according to the first embodiment. [Figure 8C] A schematic and illustrative cross-sectional view showing a method for manufacturing a display device or light-emitting device according to the first embodiment. [Figure 8D] A schematic and illustrative cross-sectional view showing a method for manufacturing a display device or light-emitting device according to the first embodiment. [Figure 8E] A schematic and illustrative cross-sectional view showing a method for manufacturing a display device or light-emitting device according to the first embodiment. [Figure 8F] A schematic and illustrative cross-sectional view showing a method for manufacturing a display device or light-emitting device according to the first embodiment. [Figure 8G] A schematic and illustrative cross-sectional view showing a method for manufacturing a display device or light-emitting device according to the first embodiment. [Figure 8H]A cross-sectional view schematically and exemplarily showing a method for manufacturing a display device or a light-emitting device according to the first embodiment. [Figure 8I] A cross-sectional view schematically and exemplarily showing a method for manufacturing a display device or a light-emitting device according to the first embodiment. [Figure 8J] A cross-sectional view schematically and exemplarily showing a method for manufacturing a display device or a light-emitting device according to the first embodiment. [Figure 9] A diagram showing application examples of a display device represented by the first to sixth embodiments. [Figure 10] A diagram showing application examples of a display device represented by the first to sixth embodiments. [Figure 11] A diagram showing application examples of a display device represented by the first to sixth embodiments. [Figure 12] A diagram showing application examples of a display device represented by the first to sixth embodiments. [Figure 13] A diagram showing application examples of a display device represented by the first to sixth embodiments.

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and duplicate descriptions are omitted.

[0009] Hereinafter, an example in which the light-emitting device according to the present invention is embodied as a display device will be described. The following display device 1 may be read as a light-emitting device. FIG. 1 schematically and exemplarily shows a cross-sectional structure of the display device 1 according to the first embodiment. In one aspect, the display device 1 may include a plurality of pixels 10 constituting the light-emitting portion 12 and an electrode portion 30. In FIG. 1, only one representative pixel 10 is shown. In one example, the pixel 10 may be composed of three sub-pixels, namely, sub-pixel 10a, sub-pixel 10b, and sub-pixel 10c. In another aspect, the light-emitting device 1 may include a structure ST having first and second surfaces S1 and S2 on opposite sides, a light-emitting portion 12 disposed on the first surface S1, and a protective layer 124 covering the light-emitting portion 12 and the first surface S1. The structure ST may include a conductive member 110 to which a signal or potential for operating the light-emitting portion 12 is applied, and an opening OP extending from the conductive member 110 to a virtual surface including the second surface S2. The entire area of the light-emitting portion 12 may be covered by the protective layer 124. Note that the opening OP may be understood as a component extending from the conductive member 110 to the second surface S2. However, strictly speaking, the second surface S2 does not exist in the opening OP. Therefore, here, the opening OP is described as a component extending from the conductive member 110 to a virtual surface including the second surface S2. The virtual surface may be understood as a plane or an envelope surface including the second surface S2.

[0010] In one aspect, the display device 1 may have a structure in which a first substrate 100, a second substrate 200, pixels 10 as the light-emitting portion 12, and a protective layer 124 are laminated. The first substrate 100 may include a drive circuit for driving the light-emitting portion 12, and the second substrate 200 may include a control circuit for controlling the drive circuit. The drive circuit may include a plurality of pixel circuits. The first substrate 100 may include a first semiconductor substrate 101 and a first wiring structure 11. The first wiring structure 11 may be disposed between the light-emitting portion 12 and the first semiconductor substrate 101. A plurality of first transistors 103 (only gates are shown) and element isolation 102 may be provided on the first semiconductor substrate 101. The first semiconductor substrate 101 may further include a capacitor. The first semiconductor substrate 101 may be, for example, a silicon substrate.

[0011] The first wiring structure 11 may include conductive paths 105 arranged to constitute one or more layers, and an interlayer insulating film 104 supporting and surrounding the conductive paths 105. The conductive paths 105 may include a metallic pattern or a metallized pattern. The conductive paths 105 may also include contact plugs and / or via plugs. The first wiring structure 11 may further include a light-shielding layer 106. A conductive member 110 to which a signal or potential for operating the light-emitting unit 12 may be placed in the first wiring structure 11. The conductive member 110 may be electrically connected to the light-emitting unit 12 via a conductive path 107. The conductive member 110 and the conductive path 107 may be formed in the process of forming the conductive paths 105. The conductive paths 105, the interlayer insulating film 104, and the conductive paths 107 may be made of conductive materials, such as copper, aluminum, or tungsten. Furthermore, the light-shielding layer 106 may be composed of a material having light-shielding properties, such as copper, aluminum, or tungsten.

[0012] The light-emitting section 12 may be arranged on the wiring structure 11. The light-emitting section 12 may include a first electrode (e.g., an anode electrode) 121, a light-emitting layer 122, and a second electrode (e.g., a cathode electrode) 123. In other words, the light-emitting section 12 may include a plurality of pixels or a plurality of sub-pixels, and each pixel or sub-pixel may include a light-emitting element such as an organic light-emitting element. Each pixel or sub-pixel may also include a first electrode (e.g., an anode electrode) 121, a light-emitting layer 122, and a second electrode (e.g., a cathode electrode) 123. The light-emitting layer 122 may be arranged between the first electrode 121 and the second electrode 123. The light-emitting layer 122 may be an organic layer. The first electrode 121 may be electrically connected to the conductive path 105. The first electrode 121 may be formed of, for example, AlCu to reflect light from the light-emitting layer 122. In one respect, the light-emitting section 12 includes a plurality of first electrodes 121, a light-emitting layer 122 covering the plurality of first electrodes 121, and a second electrode 123 covering the plurality of first electrodes 121 via the light-emitting layer 122, and the conductive member 110 may be electrically connected to the second electrode 123.

[0013] Between the first electrode 121 and the first electrode 123, in addition to the light-emitting layer 122, one or more layers such as a hole injection layer, a hole transport layer, an electron injection layer, or an electron transport layer may be arranged. The hole injection layer, hole transport layer, electron injection layer, electron transport layer, etc., may be composed of organic layers. The second electrode 123 is preferably formed of a thin transparent material so as to emit light generated in the light-emitting layer 122 upwards without obstruction, and can be formed of a thin film of gold, platinum, silver, aluminum, chromium, magnesium, or an alloy thereof, for example. The protective layer 124 may be a SiN film deposited by plasma CVD, for example, to prevent moisture from entering the light-emitting layer 122.

[0014] A color filter layer may be placed on top of the protective layer 124. The color filter layer may include color filter 11a, color filter 11b, and color filter 11c for each sub-pixel. Color filters 11a, 11b, and 11c may be, for example, red, blue, and green filters, respectively.

[0015] The second substrate 200 may include a second semiconductor substrate 201 and a second wiring structure 21. The second wiring structure 21 may be placed between the first substrate 100 and the second semiconductor substrate 201. The second semiconductor substrate 201 may be provided with a plurality of second transistors 203 (gates only shown) and element isolates 202. The second semiconductor substrate 201 may be, for example, a silicon substrate. The second wiring structure 21 may include conductive paths 205 arranged to constitute one or more layers and an interlayer insulating film 204 that supports and surrounds the conductive paths 205. The conductive paths 205 may include metallic patterns or metallized patterns. The conductive paths 205 may also include contact plugs and / or via plugs. Conductive members 110 to which signals or potentials for operating the light-emitting unit 12 may be placed in the second wiring structure 21. The conductive path 205 and the interlayer insulating film 204 may be composed of a conductive material, such as copper, aluminum, or tungsten.

[0016] The first substrate 100 and the second substrate 200 can be joined together, for example, via an insulating film of the same type provided on each, such as silicon oxide (SiO2).

[0017] As described above, the structure ST or display device 1 may include a conductive member 110 to which a signal or potential is applied for operating the light-emitting unit 12, and an opening OP extending from the conductive member 110 to a virtual surface including the second surface S2. The display device 1 may also include an electrode 303 and a conductive plug 302 positioned at the opening OP to electrically connect the electrode 303 and the conductive member 110. The electrode 303 may be formed of, for example, solder, aluminum, or copper. The electrode 303 may also be an electrode pad. The conductive plug 302 may include, for example, a barrier metal such as titanium (Ti) or tantalum (Ta) and a conductor such as copper (Cu) or tungsten (W). An external power supply or external circuit may be electrically connected to the electrode 303, although this is not shown.

[0018] Here, the display device 1 may include a plurality of conductive members 110, in which case a plurality of openings OP, a plurality of conductive plugs 302, and a plurality of electrodes 303 are provided to correspond to the plurality of conductive members 110. The plurality of conductive members 110 may include, for example, a conductive member 110 electrically connected to the second electrode 123, a conductive member 110 electrically connected to a drive circuit arranged on the first substrate 100, and a conductive member 110 electrically connected to a control circuit arranged on the second substrate 200. The plurality of openings OP are not provided in the protective layer 124, and no other openings are provided in the protective layer 124. Therefore, compared to the case in which openings are provided in the protective layer 124, it is possible to prevent or reduce the intrusion of moisture into the light-emitting layer 122, etc.

[0019] Figure 2 schematically and illustratively shows the arrangement of the components of the display device 1. Note that in Figure 2, the first substrate 100 and the second substrate 200 are shown separated for convenience. A light-emitting region 400, composed of an array of multiple pixels 10, may be arranged on the first substrate 100. The electrode portion 30 may include multiple conductive members 110, as described above. At least a portion of at least one of the multiple conductive members 110 may overlap with the light-emitting region 400 in a plan view (orthogonal projection onto the first surface S1). Such a configuration is advantageous for miniaturizing the display device 1.

[0020] Figure 3 schematically and illustratively shows the cross-sectional structure of the display device 1 according to the second embodiment. Matters not mentioned as being in the second embodiment may follow those of the first embodiment. In the second embodiment, the structure ST includes a first substrate 100 and a second substrate 200. The first substrate 100 may include a wiring structure 11a disposed between the first semiconductor substrate 101 and the second substrate 200. The structure ST may also include a wiring structure 11b disposed between the light-emitting part 12 and the first semiconductor substrate 101. The second substrate 200 may include a wiring structure 21.

[0021] The wiring structure 11a may include a conductive path 105 arranged to constitute one or more layers, and an interlayer insulating film 104 that supports and surrounds the conductive path 105. The wiring structure 11b may include a conductive path 109 arranged to constitute one or more layers, and an interlayer insulating film 108 that supports and surrounds the conductive path 109. The conductive path 109 may include, for example, a first conductive path electrically connected to a first electrode 121, and a second conductive path electrically connected to a second electrode 123. The second wiring structure 21 may be placed between the first substrate 100 and the second semiconductor substrate 201. The first substrate 100 and the second substrate 20 may be joined so that the wiring structure 11a and the wiring structure 21 are joined together.

[0022] A through electrode 306 may be provided on the semiconductor substrate 101. The through electrode 306 may be arranged to electrically connect the conductive path 105 of the wiring structure 11a and the conductive path 109 of the wiring structure 11b. The through electrode 306 may be made of, for example, tungsten. The conductive path 105 of the wiring structure 11a and the conductive path 205 of the wiring structure 21 may be electrically connected via a junction 111 provided on the first substrate 100 or the wiring structure 11a and a junction 206 provided on the second substrate 200 or the wiring structure 21. The junction 111 and the junction 206 may be made of metal and may be matched with each other. The interlayer insulating film 104 and the interlayer insulating film 204 may be matched with each other.

[0023] A conductive member 110 to which a signal or potential is supplied for operating the light-emitting unit 12 may be arranged in the wiring structure 11a. The conductive member 110 may be electrically connected to the second electrode 123 of the light-emitting unit 12 via a conductive path 107, a through electrode 306, and a conductive path 109. The display device 1 or structure ST may further include an opening OP extending from the conductive member 110 to a virtual plane including the second surface S2. The display device 1 may further include an electrode 303 and a conductive plug 302 arranged in the opening OP to electrically connect the electrode 303 to the conductive member 110.

[0024] Instead of providing the conductive member 110 in the wiring structure 11a and electrically connecting the conductive plug 302 to the conductive member 110, the through electrode 306 and the conductive plug 302 may be directly electrically connected. In this case, the through electrode 306 may be understood as a conductive member to which a signal or potential is supplied for operating the light-emitting unit 12. Alternatively, the conductive member 110 may be provided in the wiring structure 11b.

[0025] Here, the display device 1 may include a plurality of conductive members 110, in which case a plurality of openings OP, a plurality of conductive plugs 302, and a plurality of electrodes 303 are provided to correspond to the plurality of conductive members 110. The plurality of conductive members 110 may include, for example, a conductive member 110 electrically connected to the second electrode 123, a conductive member 110 electrically connected to a drive circuit arranged on the first substrate 100, and a conductive member 110 electrically connected to a control circuit arranged on the second substrate 200. The plurality of openings OP are not provided in the protective layer 124, and no other openings are provided in the protective layer 124. Therefore, compared to the case in which openings are provided in the protective layer 124, it is possible to prevent or reduce the intrusion of moisture into the light-emitting layer 122, etc.

[0026] Figure 4 schematically and illustratively shows the cross-sectional structure of the display device 1 according to the third embodiment. Matters not mentioned as the third embodiment may follow the first embodiment. In the third embodiment, the structure ST includes a first substrate 100 and a second substrate 200. The first substrate 100 may include a first semiconductor substrate 101 and a first wiring structure 11 disposed between the light-emitting part 12 and the first semiconductor substrate 101. The second substrate 200 may include a second wiring structure 21 and a second semiconductor substrate 201 disposed between the first substrate 10 and the second wiring structure 21.

[0027] The first semiconductor substrate 101 is provided with a through electrode 306, and the second semiconductor substrate 201 is provided with a through electrode 307, and the through electrode 306 and the through electrode 307 can be electrically joined. The first semiconductor substrate 101 and the second semiconductor substrate 201 can be made of silicon, and the first semiconductor substrate 101 and the second semiconductor substrate 201 can be silicon-bonded. Alternatively, a silicon oxide film may be provided on each of the first semiconductor substrate 101 and the second semiconductor substrate 201, and these silicon oxide films may be joined to each other. As described above, the first semiconductor substrate 101 and the second semiconductor substrate 201 can be joined directly or via a film.

[0028] A conductive member 110 to which a signal or potential is supplied for operating the light-emitting unit 12 may be located in the second wiring structure 21. The conductive member 110 may be electrically connected to the second electrode 123 of the light-emitting unit 12 via through electrodes 307, 306 and a conductive path 107. The display device 1 or structure ST may further include an opening OP extending from the conductive member 110 to a virtual plane including the second surface S2. The display device 1 may further include an electrode 303 and a conductive plug 302 located in the opening OP to electrically connect the electrode 303 to the conductive member 110.

[0029] The opening OP is not provided in the protective layer 124, and no other openings are provided in the protective layer 124. Therefore, compared to the case where an opening is provided in the protective layer 124, it is possible to prevent or reduce the intrusion of moisture into the light-emitting layer 122, etc.

[0030] Figure 5 schematically and illustratively shows a cross-sectional structure of the display device 1 according to the fourth embodiment. Matters not mentioned as the fourth embodiment may follow the first embodiment. In the fourth embodiment, the light-emitting device 1 may comprise a structure ST having a first surface S1 and a second surface S2 opposite to each other, a light-emitting unit 12 disposed on the first surface S1, and a protective layer 124 covering the light-emitting unit 12 and the first surface S1. The structure ST may include a conductive member 110 to which a signal or potential for operating the light-emitting unit 12 is applied, and an opening OP extending from the conductive member 110 to a virtual surface including the second surface S2.

[0031] The structure ST includes a semiconductor substrate 101 and a wiring structure 11b, and the conductive member 110 may be arranged in the wiring structure 11b. In other words, the structure ST includes a first wiring structure 11a arranged between the semiconductor substrate 101 and the second surface S2, and a second wiring structure 11b arranged between the light-emitting part 12 and the semiconductor substrate 101, and the conductive member 110 may be arranged in the second wiring structure 11b.

[0032] A through electrode 306 may be provided on the semiconductor substrate 101. The through electrode 306 may be arranged to electrically connect the conductive path 105 of the first wiring structure 11a and the conductive path 109 of the second wiring structure 11b. The through electrode 306 may be made of, for example, tungsten. A conductive member 110 to which a signal or potential for operating the light-emitting unit 12 is supplied may be arranged on the first wiring structure 11a. The conductive member 110 may be electrically connected to the second electrode 123 of the light-emitting unit 12 via a conductive path 107. An opening OP may be included from the conductive member 110 to a virtual plane including the second surface S2. The display device 1 or structure ST may further include an electrode 303 and a conductive plug 302 arranged in the opening OP to electrically connect the electrode 303 and the conductive member 110.

[0033] The opening OP is not provided in the protective layer 124, and no other openings are provided in the protective layer 124. Therefore, compared to the case where an opening is provided in the protective layer 124, it is possible to prevent or reduce the intrusion of moisture into the light-emitting layer 122, etc.

[0034] Figure 6 schematically and illustratively shows a cross-sectional structure of the display device 1 according to the fifth embodiment. Matters not mentioned as the fifth embodiment may conform to the first embodiment. In the fifth embodiment, the light-emitting device 1 may comprise a structure ST having a first surface S1 and a second surface S2 opposite to each other, a light-emitting unit 12 disposed on the first surface S1, and a protective layer 124 covering the light-emitting unit 12 and the first surface S1. The structure ST may include a conductive member 110 to which a signal or potential for operating the light-emitting unit 12 is applied, and an opening OP extending from the conductive member 110 to a virtual surface including the second surface S2.

[0035] The structure ST includes a semiconductor substrate 101 and a wiring structure 11 disposed between the light-emitting part 12 and the semiconductor substrate 101, and the conductive member 110 may be disposed on the wiring structure 11. The conductive member 110 may be electrically connected to the second electrode 123 of the light-emitting part 12 via a conductive path 107. The display device 1 or the structure ST may include an opening OP extending from the conductive member 110 to a virtual plane including the second surface S2. The display device 1 may further include an electrode 303 and a conductive plug 302 disposed on the opening OP to electrically connect the electrode 303 and the conductive member 110. The opening OP is not provided in the protective layer 124, and no other openings are provided in the protective layer 124. Therefore, compared to the case where an opening is provided in the protective layer 124, it is possible to prevent or reduce the intrusion of moisture into the light-emitting layer 122, etc.

[0036] Figure 7 schematically and illustratively shows the cross-sectional structure of the display device 1 according to the sixth embodiment. Matters not mentioned as the sixth embodiment may follow the fifth embodiment. In the sixth embodiment, the electrode 303 and the conductive plug 302, which is positioned in the opening OP to electrically connect the electrode 303 and the conductive member 110, are removed from the display device 1 of the fifth embodiment. For example, wire bonding (not shown) is formed in the opening OP, and a signal or potential for operating the light-emitting unit 12 can be supplied to the conductive member 110 via the wire bonding. The opening OP is not provided in the protective layer 124, and no other openings are provided in the protective layer 124. Therefore, compared to the case in which an opening is provided in the protective layer 124, it is possible to prevent or reduce the intrusion of moisture into the light-emitting layer 122, etc.

[0037] The manufacturing method of the display device 1 will be described illustratively below with reference to Figures 8A to 8J. First, as schematically shown in Figure 8A, a first substrate 100 may be prepared or manufactured. First, element isolation 102 and a plurality of transistors 103 may be formed on the first semiconductor substrate 101. Next, a wiring structure 11 including an interlayer insulating film 104, a conductive path 105, a light-shielding layer 106, and a conductive path 107 may be formed. Next, as schematically shown in Figure 8B, a support substrate 402 may be placed on the first substrate 100 via an adhesive layer 401. The adhesive layer 401 may be, for example, an ultraviolet-curing organic adhesive. The support substrate 402 may be, for example, a glass substrate or a silicon substrate.

[0038] Next, as schematically shown in Figure 8C, the first semiconductor substrate 101 may be thinned by backgrinding. Next, a silicon oxide film may be formed on the first semiconductor substrate 101 to facilitate bonding of the second substrate 20 beneath it. Also, through electrodes 306 may be formed on the first semiconductor substrate 101. Next, as schematically shown in Figure 8D, the first substrate 10 and the second substrate 20 may be bonded together. Here, the second substrate 20 may be formed by forming element separators 202 and a plurality of transistors 203 on the second semiconductor substrate 201, and further forming a second wiring structure 12 including an interlayer insulating film 204, a conductive path 205, and a junction 206. Except for the junction 206, the surface of the second substrate 20 may be covered with a silicon oxide film. Bonding of the first substrate 10 and the second substrate 20 may be achieved by bonding the silicon oxide film formed on the first substrate 10 to the silicon oxide film formed on the second substrate 20. Furthermore, the joining can be carried out in such a way that the through electrode 306 and the joining portion 206 do not become misaligned.

[0039] Next, as schematically shown in Figure 8E, the second semiconductor substrate 201 may be thinned by backgrinding. Then, as schematically shown in Figure 8F, an opening OP may be formed in the space facing the second surface S1 to expose the conductive member 110. This may include a step of forming a resist pattern on the second semiconductor substrate 201 by photolithography, and using this as a mask to etch the second semiconductor substrate 201, the interlayer insulating film 204, the first semiconductor substrate 101, and the interlayer insulating film 104 until the conductive member 110 is exposed. As for the etching method, wet etching may be used, but dry etching is preferred, and reactive ion etching is preferred. Next, the opening OP is formed by removing the resist pattern using, for example, an ashing method. Here, instead of using only the resist pattern as a mask, silicon oxide (SiO2) or silicon nitride (SiN) may be used as part of the mask. Also, the opening OP may be positioned such that a part of the conductive path 205 and / or a part of the conductive path 105 are connected to a part of the opening OP.

[0040] Next, a conductive plug 302 may be formed to fill the opening OP, as schematically shown in Figure 8G. This may include the step of forming a barrier metal such as titanium (Ti) or tantalum (Ta) in the opening OP, and then filling the opening OP with a conductive material such as copper (Cu) or tungsten (W). Next, an electrode 303 may be formed to cover the conductive plug 302. The electrode 303 may be formed of, for example, aluminum, or an aluminum alloy mainly composed of aluminum. The aluminum alloy can be, for example, an alloy of aluminum and copper (AlCu), or an alloy of aluminum and silicon (AlSi). Since the light-emitting layer 122, which contains a heat-sensitive material described later, has not yet been formed, the processing temperature in the manufacturing method up to this point may be 200°C or higher.

[0041] Next, as schematically shown in Figure 8H, a support substrate 404 can be bonded to the semiconductor substrate 201 via an adhesive layer 403. The adhesive layer 403 may be, for example, an ultraviolet-curable organic adhesive. The support substrate 404 may be, for example, a glass substrate or a silicon substrate.

[0042] Next, as schematically shown in Figure 8I, the light-emitting section 12 may be formed. First, the adhesive layer 401 may be dissolved with a solvent or the like, and the support substrate 402 may be peeled off from the laminated structure of the first substrate 10 and the second substrate 20. Next, a first electrode (e.g., an anode electrode) 121 may be formed on the first substrate 10. The first electrode 121 may be formed of, for example, AlCu. Next, a light-emitting layer 122 may be formed. Here, at least one of the following may be formed together with the light-emitting layer 122: a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, etc. Next, a second electrode 123 may be formed. The second electrode 123 is preferably formed of a thin transparent material so as not to obstruct the light emitted by the light-emitting layer 122 and to emit light upwards, for example, it may be formed of a thin film of gold, platinum, silver, aluminum, chromium, magnesium, or an alloy thereof. Next, a protective layer 124 may be formed. The protective layer 124 may be formed by a SiN film deposited by plasma CVD to prevent moisture from entering the light-emitting layer 122. Furthermore, a color filter layer is formed on top of the protective layer 124. The color filter layer may consist of color filters 11a, 11b, and 11c for each sub-pixel. The color filters 11a, 11b, and 11c may be, for example, red, blue, and green color filters, respectively.

[0043] Next, as schematically shown in Figure 8J, the adhesive layer 403 can be dissolved with a solvent or the like, and the support substrate 404 can be peeled off from the structure including the first substrate 10, the second substrate 20, the light-emitting part 12, the protective layer 124, and the color filter layer. In this way, the display device 1 can be manufactured. Here, the light-emitting part 12 was formed after the conductive plug 302 was formed, but the reverse is also possible. In that case, a method that can be carried out at a low temperature of 100 to 150°C or less may be used to form the conductive plug 302.

[0044] Next, an example of the application of the display device according to this embodiment will be described with reference to the drawings. Figure 9 is a schematic diagram showing a display device 1000 as an example of an application of the light-emitting device 1 according to this embodiment. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits FPCs 1002 and 1004 are connected to the touch panel 1003 and the display panel 1005. Transistors are printed on the circuit board 1007. The battery 1008 does not need to be provided if the display device is not a portable device, or it may be provided in a different location even if it is a portable device.

[0045] The display device according to this embodiment may have a color filter having red, green, and blue colors. The color filter may have the red, green, and blue colors arranged in a delta array.

[0046] The display device according to this embodiment may be used in the display unit of a mobile terminal. In that case, it may have both display and operation functions. Examples of mobile terminals include smartphones and other mobile phones, tablets, and head-mounted displays.

[0047] The display device according to this embodiment may be used in the display unit of an imaging device having an optical unit with multiple lenses and an image sensor that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the image sensor. Furthermore, the display unit may be a display unit exposed to the outside of the imaging device or a display unit located inside the viewfinder. The imaging device may be a digital camera or a digital video camera.

[0048] Figure 10(a) is a schematic diagram showing an example of an imaging device according to this embodiment. The imaging device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 may have a display device according to this embodiment. In that case, the display device may display not only the image to be captured, but also environmental information, imaging instructions, etc. Environmental information may include the intensity of ambient light, the direction of ambient light, the speed at which the subject is moving, the possibility of the subject being obscured by an obstacle, etc.

[0049] Since the optimal timing for imaging is very short, it is best to display the information as quickly as possible. Therefore, it is preferable to use a display device using the organic light-emitting element of the present invention, because organic light-emitting elements have a fast response speed. Display devices using organic light-emitting elements can be used more suitably than liquid crystal display devices, which require a fast display speed.

[0050] The imaging device 1100 has an optical section (not shown). The optical section has multiple lenses that form an image on the image sensor housed in the housing 1104. The focus can be adjusted by adjusting the relative positions of the multiple lenses. This operation can also be performed automatically. The imaging device may also be called a photoelectric converter. The photoelectric converter may not capture images sequentially, but may include imaging methods such as detecting the difference from the previous image or extracting from an image that is always being recorded.

[0051] Figure 10(b) is a schematic diagram showing an example of an electronic device according to this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type response unit. The operation unit may also be a biometric recognition unit that recognizes fingerprints to unlock or otherwise perform actions. An electronic device having a communication unit can also be called a communication device. The electronic device may further have a camera function by including a lens and an image sensor. Images captured by the camera function are displayed on the display unit. Examples of electronic devices include smartphones and laptop computers.

[0052] Figure 11(a) is a schematic diagram showing an example of an application of the light-emitting device according to this embodiment. Figure 11(a) is a display device such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The light-emitting device according to this embodiment may be used for the display unit 1302. The frame 1301 has a base 1303 that supports the display unit 1302. The base 1303 is not limited to the form shown in Figure 11(a). The lower edge of the frame 1301 may also serve as the base. In addition, the frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0053] Figure 11(b) is a schematic diagram showing another example of an application example of the light-emitting device according to this embodiment. The display device 1310 in Figure 11(b) is configured to be foldable and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 may have the light-emitting device according to this embodiment. The first display unit 1311 and the second display unit 1312 may be a single display device without seams. The first display unit 1311 and the second display unit 1312 can be separated at a bending point. The first display unit 1311 and the second display unit 1312 may each display different images, or the first and second display units may together display a single image.

[0054] Figure 12(a) is a schematic diagram showing an example of a lighting device according to this embodiment. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusion unit 1405. The light source may be a light-emitting device according to this embodiment. The optical filter may be a filter that improves the color rendering of the light source. The light diffusion unit can effectively diffuse the light from the light source, such as for lighting up, and deliver light over a wide area. The optical filter and light diffusion unit may be provided on the light-emitting side of the lighting. A cover may be provided on the outermost part as needed.

[0055] The lighting device is, for example, a device for illuminating a room. The lighting device may emit white light, cool white light, or any other color from blue to red. It may have a dimming circuit to adjust the brightness of these lights. The lighting device may have the organic light-emitting element of the present invention and a power supply circuit connected thereto. The power supply circuit is a circuit that converts AC voltage to DC voltage. White light has a color temperature of 4200K, and cool white light has a color temperature of 5000K. The lighting device may have a color filter.

[0056] Furthermore, the lighting device according to this embodiment may have a heat dissipation section. The heat dissipation section releases heat from inside the device to the outside, and examples include metals with high specific heat, liquid silicon, etc.

[0057] Figure 12(b) is a schematic diagram of an automobile, which is an example of a mobile body according to this embodiment. The automobile has a taillight, which is an example of a lighting device. The automobile 1500 has a taillight 1501, and may be configured to illuminate when the brakes are applied or the like.

[0058] The tail lamp 1501 may have a light-emitting device according to this embodiment. The tail lamp may have a protective member to protect the organic EL element. The protective member has a reasonably high strength and can be made of any transparent material, but it is preferably made of polycarbonate or the like. A franciocarboxylic acid derivative, an acrylonitrile derivative, or the like may be mixed with the polycarbonate.

[0059] The automobile 1500 may have a body 1503 and windows 1502 attached thereto. The windows may be transparent displays, unless they are windows for checking the front and rear of the automobile. The transparent displays may have organic light-emitting elements according to this embodiment. In this case, the constituent materials such as electrodes of the organic light-emitting element are made of transparent members.

[0060] The mobile body according to this embodiment may be a ship, aircraft, drone, etc. The mobile body may have a body and a lighting device provided on the body. The lighting device may emit light to indicate the position of the body. The lighting device has an organic light-emitting element according to this embodiment.

[0061] Referencing Figure 13, examples of applications of the display devices of each embodiment described above will be explained. The display device can be applied to systems that can be worn as wearable devices such as smart glasses, HMDs, and smart contacts. The imaging display device used in such applications comprises an imaging device capable of photoelectric conversion of visible light and a display device capable of emitting visible light.

[0062] Figure 13(a) illustrates a pair of glasses 1600 (smart glasses) according to one application example. An imaging device 1602, such as a CMOS sensor or SPAD, is provided on the front surface of the lens 1601 of the glasses 1600. In addition, the display devices of each embodiment described above are provided on the back surface of the lens 1601.

[0063] The eyeglasses 1600 further include a control device 1603. The control device 1603 functions as a power supply that provides power to the imaging device 1602 and the display device according to each embodiment. The control device 1603 also controls the operation of the imaging device 1602 and the display device. The lens 1601 has an optical system formed therein for focusing light onto the imaging device 1602.

[0064] Figure 13(b) illustrates a pair of glasses 1610 (smart glasses) relating to one application example. The glasses 1610 have a control device 1612, which is equipped with an imaging device equivalent to an imaging device 1602 and a display device. The lens 1611 has an optical system formed therein for projecting light emitted from the imaging device and the display device within the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power supply to provide power to the imaging device and the display device, and also controls the operation of the imaging device and the display device. The control device may have a gaze detection unit that detects the wearer's gaze. Gaze detection may use infrared light. The infrared light emitter emits infrared light towards the eyeball of the user who is fixating on the displayed image. The imaging unit, which has a photodetector, detects the reflected light from the eyeball of the emitted infrared light, thereby obtaining an image of the eyeball. By having a reduction means that reduces the light from the infrared light emitter to the display unit in planar view, the degradation of image quality is reduced.

[0065] The user's gaze towards the displayed image is detected from an image of the eyeball obtained by imaging with infrared light. Any known method can be applied to gaze detection using an image of the eyeball. For example, a gaze detection method based on the Purkinje image obtained by the reflection of the irradiated light from the cornea can be used.

[0066] More specifically, gaze detection processing is performed based on the pupil-corneal reflection method. Using the pupil-corneal reflection method, a gaze vector representing the orientation (rotation angle) of the eyeball is calculated based on the pupil image and Purkinje image contained in the captured image of the eyeball, thereby detecting the user's gaze.

[0067] A display device according to one embodiment of the present invention includes an imaging device having a light-receiving element, and may control the display image of the display device based on the user's gaze information from the imaging device.

[0068] Specifically, the display device determines a first field of view that the user is fixated on, and a second field of view other than the first field of view, based on gaze information. The first and second field of view may be determined by the control device of the display device, or they may be determined by an external control device and received by the display device. Within the display area of ​​the display device, the display resolution of the first field of view may be controlled to be higher than the display resolution of the second field of view. In other words, the resolution of the second field of view may be lower than that of the first field of view.

[0069] Furthermore, the display area has a first display area and a second display area different from the first display area, and based on gaze information, the area with higher priority is determined from the first display area and the second display area. The first and second view areas may be determined by the control device of the display device, or they may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of the areas other than the high-priority area. In other words, the resolution of areas with relatively lower priority may be lowered.

[0070] AI may be used to determine the primary field of view and high-priority areas. The AI ​​may be a model configured to estimate the angle of gaze and the distance to the target object at the end of the line of sight from the image of the eye, using the image of the eye and the direction the eye was actually looking in that image as training data. The AI ​​program may be installed in the display device, the imaging device, or an external device. If installed in an external device, it will be transmitted to the display device via communication.

[0071] When display control is based on visual detection, this method is preferably applicable to smart glasses that further include an imaging device for capturing images of the surrounding environment. The smart glasses can display the captured external information in real time.

[0072] This specification includes disclosures relating to the following light-emitting devices, imaging devices, electronic devices, and mobile devices. (Item 1) A light-emitting device comprising a structure having a first surface and a second surface opposite to each other, a light-emitting part disposed on the first surface, and a protective layer covering the light-emitting part and the first surface, The structure includes a conductive member to which a signal or potential is applied for operating the light-emitting part, and an opening extending from the conductive member to a virtual surface including the second surface. A light-emitting device characterized by the following: (Item 2) The entire area of ​​the light-emitting portion is covered by the protective layer. The light-emitting device according to item 1, characterized in that it is a light-emitting device. (Item 3) The light-emitting section includes a first electrode and a second electrode, and a light-emitting layer disposed between the first electrode and the second electrode. The conductive member is electrically connected to the second electrode. The light-emitting device according to item 1, characterized in that it is a light-emitting device. (Item 4) The light-emitting portion includes a plurality of first electrodes, a light-emitting layer covering the plurality of first electrodes, and a second electrode covering the plurality of first electrodes via the light-emitting layer. The conductive member is electrically connected to the second electrode. The light-emitting device according to item 1, characterized in that it is a light-emitting device. (Item 5) Electrodes and, The system further comprises a conductive plug positioned in the opening to electrically connect the electrode and the conductive member, A light-emitting device according to any one of items 1 to 4, characterized in that it is a light-emitting device. (Item 6) The structure includes a first substrate having a first semiconductor substrate and a second substrate having a second semiconductor substrate. A light-emitting device according to any one of items 1 to 5, characterized in that it is a light-emitting device. (Item 7) The first substrate includes a drive circuit for driving the light-emitting section, and the second substrate includes a control circuit for controlling the drive circuit. The light-emitting device according to item 6, characterized by the features described therein. (Item 8) The first substrate is positioned between the light-emitting portion and the second substrate. The light-emitting device according to item 7, characterized by the features described herein. (Item 9) The first substrate further includes a first wiring structure, The first wiring structure is arranged between the light-emitting portion and the first semiconductor substrate. The light-emitting device described in item 8, characterized by the features described above. (Item 10) The second substrate further includes a second wiring structure, The second wiring structure is located between the first substrate and the second semiconductor substrate. The light-emitting device according to item 9, characterized in that it is a light-emitting device. (Item 11) The first substrate includes a wiring structure disposed between the first semiconductor substrate and the second substrate, and a wiring structure disposed between the light-emitting portion and the first semiconductor substrate. The light-emitting device described in item 8, characterized by the features described above. (Item 12) The second substrate further includes a second wiring structure, The second wiring structure is located between the first substrate and the second semiconductor substrate. The light-emitting device according to item 11, characterized in that it is a light-emitting device. (Item 13) The first substrate further includes a first wiring structure, The second substrate further includes a second wiring structure, The first semiconductor substrate is placed between the first wiring structure and the second substrate. The second semiconductor substrate is positioned between the first substrate and the second wiring structure. The light-emitting device according to item 7, characterized by the features described herein. (Item 14) The first semiconductor substrate and the second semiconductor substrate are joined directly or via a film. The light-emitting device according to item 13, characterized in that it is a light-emitting device. (Item 15) The conductive member is disposed on the first substrate. A light-emitting device according to any one of items 6 to 14, characterized in that it is a light-emitting device. (Item 16) The conductive member is disposed on the second substrate. A light-emitting device according to any one of items 6 to 14, characterized in that it is a light-emitting device. (Item 17) The aforementioned structure includes a semiconductor substrate and a wiring structure. The conductive member is arranged in the wiring structure. A light-emitting device according to any one of items 1 to 5, characterized in that it is a light-emitting device. (Item 18) The wiring structure includes a first wiring structure disposed between the semiconductor substrate and the second surface, and a second wiring structure disposed between the light-emitting portion and the semiconductor substrate. The conductive member is arranged in the second wiring structure. A light-emitting device as described in item 17, characterized by the features described herein. (Item 19) The aforementioned wiring structure is arranged between the light-emitting part and the semiconductor substrate. A light-emitting device as described in item 17, characterized by the features described herein. (Item 20) The light-emitting part includes an organic light-emitting element. A light-emitting device according to any one of items 1 to 19, characterized in that it is a light-emitting device. (Item 21) An optical unit having multiple lenses, an image sensor that receives light that has passed through the optical unit, and a light-emitting device according to any one of items 1 to 20 configured to display an image captured by the image sensor, An imaging device characterized by including (Item 22) An electronic device comprising a light-emitting device described in any one of items 1 to 20, a housing on which the light-emitting device is provided, and a communication unit provided in the housing for communicating with the outside. (Item 23) A mobile body characterized by comprising a light-emitting device as described in any one of items 1 to 20. (Item 24) A step of forming an opening from a virtual surface including the second surface to the conductive member in a structure having a first surface and a second surface opposite to each other and having a conductive member, A step of forming a light-emitting portion on the first surface, A step of forming a protective layer that covers the light-emitting portion and the first surface, A method for manufacturing a light-emitting device, characterized by including the following: (Item 25) The process further includes filling the opening with a conductive material. A method for manufacturing a light-emitting device as described in item 24, characterized by the following: (Item 26) The process further includes performing wire bonding to the conductive member through the aforementioned opening. A method for manufacturing a light-emitting device as described in item 24, characterized by the following:

[0073] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0074] S1: First surface, S2: Second surface, ST: Structure, 12: Light-emitting part, 124: Protective layer, 110: Conductive member, OP: Opening

Claims

1. A light-emitting device comprising a structure having a first surface and a second surface on opposite sides of each other, a light-emitting portion disposed on the first surface, and a protective layer covering the light-emitting portion and the first surface, wherein the structure includes a first substrate having a first semiconductor substrate and a second substrate having a second semiconductor substrate, the structure includes a conductive member to which a signal or potential for operating the light-emitting portion is applied, and an opening extending from the conductive member to a virtual surface including the second surface, characterized by the above.

2. The entire area of the light-emitting portion is covered by the protective layer, characterized by the above, the light-emitting device according to Claim 1.

3. The light-emitting portion includes a first electrode and a second electrode, and a light-emitting layer disposed between the first electrode and the second electrode, the conductive member is electrically connected to the second electrode, characterized by the above, the light-emitting device according to Claim 1.

4. The light-emitting portion includes a plurality of first electrodes, a light-emitting layer covering the plurality of first electrodes, and a second electrode covering the plurality of first electrodes via the light-emitting layer, the conductive member is electrically connected to the second electrode, characterized by the above, the light-emitting device according to Claim 1.

5. An electrode, further comprising a conductive plug disposed in the opening so as to electrically connect the electrode and the conductive member, characterized by the above, the light-emitting device according to Claim 1.

6. The first substrate includes a drive circuit for driving the light-emitting portion, and the second substrate includes a control circuit for controlling the drive circuit, characterized by the above, the light-emitting device according to Claim 1.

7. The first substrate is disposed between the light-emitting portion and the second substrate, characterized by the above, the light-emitting device according to Claim 6.

8. The first substrate further includes a first wiring structure, the first wiring structure is disposed between the light-emitting portion and the first semiconductor substrate, characterized by the above, the light-emitting device according to Claim 7.

9. The second substrate further includes a second wiring structure, the second wiring structure is disposed between the first substrate and the second semiconductor substrate, characterized by the above, the light-emitting device according to Claim 8.

10. The first substrate includes a wiring structure disposed between the first semiconductor substrate and the second substrate, and a wiring structure disposed between the light-emitting portion and the first semiconductor substrate, characterized by the above, the light-emitting device according to Claim 7.

11. The second substrate further includes a second wiring structure, wherein the second wiring structure is disposed between the first substrate and the second semiconductor substrate, The light-emitting device according to claim 10, characterized in that.

12. The first substrate further includes a first wiring structure, The second substrate further includes a second wiring structure, The first semiconductor substrate is disposed between the first wiring structure and the second substrate, The second semiconductor substrate is disposed between the first substrate and the second wiring structure, The light-emitting device according to claim 6, characterized in that.

13. The first semiconductor substrate and the second semiconductor substrate are joined directly or via a film, The light-emitting device according to claim 12, characterized in that.

14. The conductive member is disposed on the first substrate, The light-emitting device according to claim 1, characterized in that.

15. The conductive member is disposed on the second substrate, The light-emitting device according to claim 1, characterized in that.

16. The structure includes a wiring structure, The conductive member is disposed in the wiring structure, The light-emitting device according to claim 1, characterized in that.

17. The wiring structure includes a first wiring structure disposed between the light-emitting portion and the first semiconductor substrate and a second wiring structure disposed between the second semiconductor substrate and the second surface, The conductive member is disposed in the second wiring structure, The light-emitting device according to claim 16, characterized in that.

18. The light-emitting portion includes an organic light-emitting element, The light-emitting device according to claim 1, characterized in that.

19. An optical unit having a plurality of lenses, an imaging element that receives light that has passed through the optical unit, and the light-emitting device according to any one of claims 1 to 18 configured to display an image captured by the imaging element, An imaging device, characterized by including.

20. An electronic device, characterized by including the light-emitting device according to any one of claims 1 to 18, a housing in which the light-emitting device is provided, and a communication unit provided in the housing and communicating with the outside.

21. A moving body, characterized by including the light-emitting device according to any one of claims 1 to 18.

22. A step of forming an opening from a virtual surface including the second surface to the conductive member in a structure having a first surface and a second surface on opposite sides and having a conductive member, A step of forming a light-emitting portion on the first surface, A step of forming a protective layer covering the light-emitting part and the first surface; A method for manufacturing a light-emitting device, comprising the above.

23. Further comprising a step of filling the opening with a conductive material; The method for manufacturing a light-emitting device according to claim 22, characterized in that.

24. Further comprising a step of performing wire bonding on the conductive member through the opening; The method for manufacturing a light-emitting device according to claim 22, characterized in that.

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