Smart connector and method of manufacturing the same that use application-specific electronics packaging manufacturing process

Abstract

To provide a smart connector and a method of manufacturing the same.SOLUTION: An ASEP manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate 338 having a plurality of openings to expose a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component 386 to the traces to form a plurality of ASEP devices 310.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] Related Applications This application claims priority to U.S. Provisional Patent Application No. 62 / 795,299, filed on January 22, 2019, the content of which is hereby incorporated by reference in its entirety.

[0002] This disclosure relates to smart connectors and methods of manufacturing the same. More specifically, this disclosure relates to smart connectors and methods of manufacturing the same, which partially use an application-specific electronics packaging (「ASEP」) manufacturing process to form the smart connector.

Background Art

[0003] Application-specific electronics packaging (「ASEP」) devices and manufacturing processes were developed by the applicant and are useful for creating electronics modules that integrate the functions of printed circuit boards, heat sinks, connectors, high-current conductors, and thermal management features into a single electronics module. The advantage of the ASEP manufacturing process is that it enables manufacturers to integrate connector functions into electronics modules that are much larger and more expensive when the connector functions are discrete components. Furthermore, the metal contacts integrated into the ASEP device have high conductivity, whereby the metal contacts provide an optimal path for carrying high currents and for very efficiently removing heat.

[0004] The ASEP manufacturing process utilizes many of the same manufacturing processes used to manufacture connectors, but adds significantly more functionality with minimal additional cost. The ASEP manufacturing process was previously described and illustrated in international application PCT / US2016 / 039860, filed on 28 June 2016, published as international publication 2017 / 004064 on 5 January 2017, and in international application PCT / US2017 / 040736, filed on 5 July 2017, and published as international publication 2018 / 009554 on 11 January 2018, the disclosures of which are incorporated herein by reference.

[0005] One industry where ASEP devices and ASEP manufacturing processes have proven to offer significant value is the power electronics industry. The increasing demand for electrification and higher power levels across various industries is exponentially increasing the need for better methods of manufacturing high-power electronics.

[0006] Today, power electronics are still assembled on “thick Cu PCBs” that can have 3-5 ounce Cu traces (110-185 micron thick). However, these types of PCBs are not only expensive, but also not very good at carrying the very high currents (100-500 amps) required in the industry. Techniques such as the use of thermal tubing have been considered to help dissipate the heat generated, but these approaches are often bulky and expensive to implement.

[0007] The ASEP manufacturing process for forming power electronics allows designers to dramatically reduce electrical resistance within systems, thereby reducing the amount of heat generated. Furthermore, by directly mounting the power devices that generate some of the heat onto highly thermally conductive metals, ASEP devices enable the removal of the heat that is still generated in an even more efficient manner.

[0008] While ASEP manufacturing devices and processes offer several significant advantages in the design and manufacture of power electronics capable of handling currents of several hundred amperes, one challenge associated with modifying the characteristics and / or performance requirements of ASEP devices is that different applications may require entirely new stamping dies and / or molds. This can lead to difficulties in justifying the costs associated with new stamping dies and / or molds, as well as the time associated with manufacturing and certifying them.

[0009] Therefore, improved ASEP devices and improved manufacturing processes are needed. [Overview of the Initiative]

[0010] In one embodiment, the smart connector includes an application-specific electronic packaging (ASEP) device formed by an ASEP manufacturing process, and a separate printed circuit board electrically connected to the electrical components of the ASEP device. The ASEP manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings exposing portions of the fingers, electroplating traces, and electrically mounting at least one electrical component to the traces to form a plurality of ASEP devices. In some embodiments, the printed circuit board has electrical components configured to control the function of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify the characteristics of the smart connector.

[0011] In one embodiment, a method for forming a smart connector includes forming a continuous carrier web having a plurality of lead frames, each lead frame having a plurality of fingers defining an opening and extending within the opening; overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings through which a portion of the fingers is exposed to form an exposed portion; electrically connecting electrical components to the exposed portion of the fingers of each lead frame to form a plurality of devices, each device having at least one electrical component; and electrically mounting a printed circuit board to the exposed portion of one of the fingers of the devices, the printed circuit board having an electrical component configured to control the function of at least one electrical component of one of the devices. [Brief explanation of the drawing]

[0012] This application is illustrated as an example, but is not limited to the attached drawings, and similar reference numerals in the drawings refer to similar elements. [Figure 1] A perspective view of the smart connector is shown. [Figure 2] This shows a perspective view of an embodiment of an application-specific electronics packaging ("ASEP") device mated with a printed circuit board that forms part of a smart connector. [Figure 3] This shows a perspective view of an embodiment of an application-specific electronics packaging ("ASEP") device mated with a printed circuit board that forms part of a smart connector. [Figure 4] This shows the process used to form the ASEP device on a carrier at various stages of manufacturing. [Figure 5] This shows the process used to form the ASEP device on a carrier at various stages of manufacturing. [Figure 6] A plan view of an embodiment of a printed circuit board is shown. [Figure 7] An exploded perspective view of an embodiment of the smart connector is shown. [Figure 8] A perspective view of a connector assembly including smart connectors and mating connectors in an unmated configuration is shown. [Figure 9] This diagram shows a schematic representation of multiple ASEP devices connected to a single printed circuit board. [Modes for carrying out the invention]

[0013] The following detailed description illustrates exemplary embodiments, and the features disclosed are not intended to be limited to the expressly disclosed combinations. Therefore, unless otherwise specified, the features disclosed herein may be combined to form additional combinations not shown otherwise for the sake of brevity. The terms “front” and “rear” are used for illustrative purposes only and do not indicate orientation as required in use.

[0014] This disclosure aims to improve the design and manufacture of smart connectors 360 that are partially formed using an application-specific electronics packaging ("ASEP") manufacturing process 320. In some embodiments, the smart connector 360 includes an application-specific electronics packaging ("ASEP") device 310 formed using the ASEP manufacturing process 320, and a separate printed circuit board 200 mounted on the ASEP device 310 to control the operation of the ASEP device 310 in various ways. In some embodiments, the smart connector 360 includes an application-specific electronics packaging ("ASEP") device 310 formed using the ASEP manufacturing process 320, and a separate printed circuit board 200 mounted on the ASEP device 310 to modify the characteristics of the resulting smart connector 360 in various ways. In one embodiment, the ASEP device 310 and the printed circuit board 200 are assembled / connected to a housing 375 to form the smart connector 360. In some embodiments, as schematically shown in Figure 9, multiple ASEP devices 310 are connected to a printed circuit board 200, and the printed circuit board 200 interacts with all of the ASEP devices 310.

[0015] The ASEP device 310 includes basic electrical components 386 commonly used in various applications to meet customer needs. The basic electrical components 386 may include, but are not limited to, microprocessor units (MPUs) / microcontroller units (MCUs), field-programmable gate arrays (FPGAs), field-effect transistors (FETs) which may have associated gate drivers, insulated-gate bipolar transistors (IGBTs), motor drivers, electronic components for performing communication front-ends (such as RJ45 connectors), sensors (such as current sensors), diodes, capacitors, and resistors. Current sensors may be used to monitor FETs. The ASEP manufacturing process 320 offers several significant advantages to the design and manufacture of high-power electronics—an industry that will grow exponentially over the next decade due to the electrification of transportation and other industries. Due to the advantages offered by the ASEP device 310 manufactured by the ASEP manufacturing process 320, the FETs may be field-effect transistors of 40 amperes or more.

[0016] A separate printed circuit board 200 can have its characteristics / parameters modified and includes electrical components 202 that interact with the basic electrical components 386 on the ASEP device 310. Examples of electrical components 202 on the separate printed circuit board 200 include, but are not limited to, a microprocessor unit (MPU) / microcontroller unit (MCU) / central processing unit (CPU), electronic components for executing communication protocols, memory, and a field-programmable gate array (FPGA). Examples of communication protocols include Controller Area Network (CAN), Local Interconnect Network (LIN), FlexRay, ControlNet, DirectNet, Modbus, Profibus, and any two-wire or radio frequency (RF) communication protocol. Previously, these electrical components 202 provided on the separate printed circuit board 200 were integrated into the ASEP device.

[0017] Using this disclosure, certain features previously provided on prior art ASEP devices are provided here on a separate printed circuit board 200 and not on the ASEP device 310, so that many of the electronics and components of the smart connector 360 can be easily changed or upgraded by the manufacturer by replacing the separate printed circuit board 200 without requiring retooling to manufacture the more expensive ASEP device 310. This makes it possible to use the same ASEP device 310 with multiple printed circuit boards 200, thereby allowing the manufacturer to cost-effectively meet the requirements of the same or multiple customers using the same basic ASEP device 310, and only changing the printed circuit board 200. Although the printed circuit board 200 is not optimal for use in high-current routing and does not have good thermal management characteristics, the printed circuit board 200 provides the smart connector 360 with the advantages of high-density circuitry and multilayering, and can be manufactured very quickly and cost-effectively. As a result, the capital required to manufacture the basic ASEP device 310 may remain unchanged, with minimal capital required only to manufacture a new printed circuit board 200 for use with the same ASEP device 310. This also solves application-specific thermal challenges, as the ASEP device 310 solves thermal challenges (which the printed circuit board 200 does not), while allowing applications to be customized for each customer by modifying the printed circuit board 200, thereby significantly reducing the capital required for tools and manufacturing of high-power applications.

[0018] Some examples of applications using these electrical components 202, 386 are as follows. 1) A solid-state switch where the printed circuit board 200 is the master. In the solid-state switch application, the printed circuit board 200 includes an MCU and a communication protocol (e.g., CAN, LIN), and the ASEP device 310 includes a FET. 2) A computing module where the printed circuit board 200 is the slave. In the computing module application, the printed circuit board 200 includes memory, and the ASEP device 310 includes a CPU. 3) A communication module where the printed circuit board 200 is the master. In the communication module application, the printed circuit board 200 includes an MCU and a communication protocol, and the ASEP device 310 includes a communication front end (RJ45 connector). 4) A motor module where the printed circuit board 200 is the master. In the motor module application, the printed circuit board 200 includes an MCU and a communication protocol, and the ASEP device 310 includes a motor driver.

[0019] As an example of how the printed circuit board 200 controls the operation of the ASEP device 310, when the printed circuit board 200 includes an MCU and a communication protocol and the ASEP device 310 includes a FET, the MCU on the printed circuit board 200 commands the FET on the ASEP device 310 to turn on or off as needed. For example, depending on the communication protocol provided on the printed circuit board 200, the operation of the ASEP device 310 is controlled differently while using the same FET on the ASEP device 310.

[0020] As an example of how the printed circuit board 200 modifies the characteristics of the resulting smart connector 360, when the printed circuit board 200 includes memory and the ASEP device 310 includes a CPU, the characteristics of the resulting smart connector 360 are changed according to the code stored in the memory provided on the printed circuit board 200.

[0021] The smart connector 360 is partially formed using the ASEP manufacturing process 320, as known in the prior art, but the ASEP manufacturing process 320 is modified to form the smart connector 360 by accommodating electrical connections to the printed circuit board 200. Note Figure 4 illustrating the formation of the ASEP device 310 using the modified ASEP manufacturing process 320, the formed ASEP device 310 is then used as part of the smart connector 360.

[0022] As shown in FIG. 4, the ASEP manufacturing process 320 starts with step A. The ASEP manufacturing process 320 is preferably performed between a pair of reels (not shown). In step A, the central portion of the carrier web 322 is stamped (thus removing the undesirable portions of the central portion of the carrier web 322) to form the lead frame 328. The lead frame 328 is formed in a desired configuration suitable for the formation of the ASEP device 310. The lead frame 328 preferably includes end portions 324a, 324b (it is understood that the end portions 324a, 324b of one lead frame 328 are continuous with the end portions 324a, 324b of the adjacent lead frame 328), and a pair of stabilizing portions 330a, 330b (it is understood that the stabilizing portion 330a of one lead frame 328 also preferably acts as the stabilizing portion 330b of the adjacent lead frame 328). Each stabilizing portion 330a, 330b spans the distance between the opposing end portions 324a, 324b (the end portions 324a, 324b preferably do not receive the stamping of step A). Thus, the opposing end portions 324a, 324b and the stabilizing portions 330a, 330b generally form a rectangular frame defining an opening 332 therebetween. The lead frame 328 also preferably includes a plurality of fingers 334 connected to any one of the opposing end portions 324a, 324b and the stabilizing portions 330a, 330b and extending inwardly into the opening 332. In the formation of the ASEP device 310, it is understood that some of the fingers 334 form high-current contacts 341 and some of the fingers 334 form contact pins 342. The high-current contacts 341 and the contact pins 342 may have one or more openings 336 provided therethrough for the final connection to the printed circuit board 200.

[0023] As illustrated in Figure 4, the ASEP manufacturing process 320 continues to step B. In step B, the substrate 338 is overmolded onto the fingers 334 of the lead frame 328. The substrate 338 has an opening 340 provided through it, which exposes various portions 341a of a high-current contact 341 for connection to an electronic component 386, as described herein, and an opening 343 (see Figure 5) which exposes various portions of the high-current contact 341 and contact pins 342 for connection to an electronic component 202 on the printed circuit board 200. Only a portion of the opening 343 is shown in Figure 5 for illustrative purposes only, and the configuration of the opening 343 depends on the connection required between the ASEP device 310 and the printed circuit board 200. Although the opening 343 is shown on the opposite side of the substrate 338, the opening 343 may pass through the same side of the substrate 338 as the opening 340. The substrate 338 of the ASEP device 310 may be formed from acrylonitrile butadiene styrene (ABS), polyphenylene sulfide (PPS), syndiotactic polystyrene (SPS), polycarbonate, polycarbonate blend, polypropylene, or polypropylene blend. The substrate 338 of the ASEP device 310 may also, advantageously, be formed from a thermally conductive liquid crystal polymer (LCP). By making the substrate 338 from a thermally conductive LCP, the thermal load of the electronics in the ASEP device 310 can be significantly reduced.

[0024] The end portion of the contact pin 342 is not overmolded by the substrate 338. The overmolding in step B can be performed in one or two shot processes or any other conventional molding process.

[0025] The ASEP manufacturing process 320 proceeds to step C, in which patterning is performed on the substrate 338. Patterning provides one or more patterns 344 (which may be circuit patterns) formed on the surface of the substrate 338. The patterns 344 can be formed by any number of preferred processes, including laser processes, plasma processes (which may be vacuum or atmospheric processes), UV processes and / or fluorination processes. Depending on the process used (e.g., plasma, UV and / or fluorination), the patterning may include patterning (i.e., surface treatment) of most, if not all, of the surface of the substrate 338. Thus, patterns 344 can be formed on all or nearly all of the surface of the substrate 338.

[0026] The ASEP manufacturing process 320 follows step D. In step D, a metal layer (commonly called a seed layer) is deposited on all or part of the pattern 344 (typically all of it if the pattern 344 is formed by a laser process, and typically part of it if the pattern 344 is formed by a plasma, UV and / or fluorination process) and connected to the substrate 338, the metal layer providing a conductive pattern or trace 346. The trace 346 is also provided along the walls of the opening 340, and thus electrically connects the trace 346 to the finger 334 and, by extension, to the remainder of the lead frame 328. The deposition of the metal layer can be carried out by any preferred process, including an electroless plating process, an inkjet process, a screening process, or an aerosol process. Depending on the process used, the metal to be deposited may be in any preferred form, including an ink or a paste. The metal to be deposited preferably has high conductivity and a low binder content to enhance its conductivity. More preferably, the metal to be deposited has high chemical stability in the plating bath and viscosity suitable for the desired deposition process. Although not shown in the diagram, it should be understood that the portion of finger 334 can act as an internal bus electrically connected to trace 346 on the surface of substrate 338.

[0027] The ASEP manufacturing process 320 follows process E. In process E, trace 346 is made conductive (sintered), thereby forming a conductive trace 348. The sintering process can be carried out, for example, by a laser, by flash heat, or by any other desirable process that provides sufficient thermal energy to fuse particles (e.g., nano or micron size) in an ink or paste. Sintering helps to ensure that the deposited metal forming trace 346 adheres to the substrate 338 and that the deposited metal is conductive (since the applied deposited metal is often not sufficiently conductive to allow a potential to be applied to trace 346). As can be understood, if process D is carried out by an electroless plating process, then process E does not need to be performed because electroless plating does not need to be sintered.

[0028] If both steps C and E are performed using lasers, it should be further noted that the preferred process has multiple lasers integrated into a single station / position, thereby saving space in the ASEP manufacturing process 320 and helping to ensure that the lasers are properly aligned. In addition, the integration of multiple lasers in a single station / position allows for faster processing of materials.

[0029] As shown in Figure 4, the ASEP manufacturing process 320 proceeds to step F. In step F, the trace 346 / conductive trace 348 is electroplated by applying a potential to the lead frame 328 (which is electrically connected to the trace 346 / conductive trace 348 via an internal bus, and then the lead frame 328, substrate 338 and trace 346 / conductive trace 348 are exposed to the electroplating bath). The electroplating process not only electroplats the trace 346 / conductive trace 348 to form the electronic circuit trace 350, but also electroplats the lead frame 328 to form an electroplated lead frame 354 having electroplated fingers 356 with electroplated high-current contacts 357, and electroplated contact pins 358 having a portion 357a exposed through an opening 340 in the substrate 338 and a portion exposed through an opening 343 in the substrate 338. Although the ASEP device 310 is illustrated with two electroplated high-current contacts 357, it should be further noted that the ASEP device 310 may have any number of electroplated high-current contacts 357 as needed. Process F may include a single-step plating process to build a single layer of a single material such as copper, or a multi-step plating process to build multiple layers of multiple materials such as a copper layer and a tin layer, and it is understood that other suitable materials may also be used. Increased thickness allows for increased current carrying capacity, and generally, electroplating processes tend to create materials with high conductivity so as to improve the performance of the resulting electronic circuit trace 350.

[0030] The connection of Trace 346 to the internal bus enables electroplating of all metals, including copper, nickel, gold, silver, tin, lead, palladium, and other materials. The process of forming Trace 346 connected to the internal bus and then electroplating allows for faster deposition of metal than known electroless plating processes. In addition, the plating process is smoother and less expensive when performed using reel-to-reel technology compared to more conventional batch processes.

[0031] In another embodiment, the entire thickness of copper (or other conductive material) can be deposited on the surface using techniques such as those included in the technology of Mesoscribe (MesoScribe Technologies). A picosecond laser can then be used to separate the desired conductive pattern within the conductive material. Such an approach can be used in place of, or in addition to, step F as described herein, when one or more plating materials are desired.

[0032] Steps C, D, E, and F may be performed on syndiotactic polystyrene (SPS) provided by XAREC, which provides good retention of the electronic circuit traces 350 on the surface of the substrate 338.

[0033] The ASEP manufacturing process 320 continues with steps G and H after step F, although these steps are not shown in Figure 4. In step G, a solder mask is applied that covers all or substantially all of the selected portions of the electronic circuit traces 350 and the exposed surfaces of the substrate 338. In step H, solder paste is stenciled onto the exposed portions of the electronic circuit traces 350 (i.e., these portions are not covered by the solder mask 352).

[0034] As illustrated in Figure 6, the ASEP manufacturing process 320 follows step I. In step I, the basic electrical component 386 is electrically connected to the exposed portion 357a of the electroplated high-current contact 357 and to the electronic circuit trace 350, which is preferably formed by soldering. Thus, the electrical component 386 is mounted directly to the contact 357 and the electronic circuit trace 350 such that the thermal and electrical paths have very low thermal resistance. In this way, the temperature can be controlled much better than on the printed circuit board 200. In one embodiment, the electrical component 386 includes at least a high-power FET, such as one manufactured and sold by Infineon Technologies. The FET may include reverse battery protection.

[0035] The ASEP manufacturing process 320 follows step J, which is not shown in Figure 4. In step J, most of the remaining exposed electroplated fingers 356 connected to the "frame" of the electroplated lead frame 354 are punched out / removed, leaving only the required amount of exposed electroplated fingers 356 still connected to the "frame" of the electroplated lead frame 354. At this point, the formed ASEP device 310 can be electrically tested as needed.

[0036] As shown in Figure 4, the ASEP manufacturing process 320 continues to step K. In step K, once the ASEP device 310 is formed, it is necessary to remove the ASEP device 310 from the carrier web 322 in order to separate it into individual pieces before using it.

[0037] Please understand that not all of steps A through K are necessary for a particular application. Furthermore, please understand that the order of steps A through K may be modified as appropriate for a particular application. Also, although the diagram only shows the ASEP manufacturing process 320 applied to substrate 338, please understand that the ASEP manufacturing process 320 can also be applied to internal layers.

[0038] In one embodiment, the printed circuit board 200 is conventionally formed and includes an insulating substrate 204 having a circuit 206 formed thereon by a thin layer of conductive material deposited or "printed" on the surface of the substrate 204. Individual electronic components 202 are placed on the surface of the substrate 204 and soldered to the circuit 206. In one embodiment, the printed circuit board 200 has a plurality of contact pins 208 extending from the substrate, which provide connectors to the ASEP device 310. Some of the contact pins 208 are labeled as shown in Figure 6 for illustrative purposes only, and the configuration of the contact pins 208 depends on the connections required by the ASEP device 310.

[0039] Before or after the ASEP device 310 is pieced, the printed circuit board 200 is mated with the ASEP device 310. Contact pins 208 are electrically connected to the high-current contacts 341 and contact pins 342, as needed, to complete the mating between the printed circuit board 200 and the ASEP device 310. In some embodiments, the contact pins 208 extend through openings 343 and 336 to connect to the high-current contacts 341 and contact pins 342 by pressure fitting. In some embodiments, the contact pins 208 are surface-mounted to the high-current contacts 341 and contact pins 342 through opening 343, for example, by soldering. The mated printed circuit board 200 and ASEP device 310 are then assembled / connected within a housing 375 to form a smart connector 360. In one embodiment, multiple housings may be provided, with the printed circuit board 200 housed in one housing and each ASEP device 310 housed in its own housing. In one embodiment, multiple housings may be provided, with one housing containing a printed circuit board 200 and one or more ASEP devices 310, and other ASEP devices 310 provided in their own housings.

[0040] The substrate 338 has a front edge 390, a rear edge 392, and first and second side edges 394, 396. The housing 375 may include a first inner portion (not shown) into which the mated printed circuit board 200 and ASEP device 310 are inserted and housed. The side edges 394, 396 of the ASEP device 310 may be inserted into a track portion (not shown) defined by the housing 375 until the front edge 390 of the ASEP device 310 abuts against the inner wall (not shown) of the housing 375. The inner wall separates the housing 375 into a first inner portion (not shown) and a second inner portion 398, having a number of openings (not shown) extending through it, which allow electroplated high-current contacts 357 and electroplated contact pins 358 to extend into the second inner portion 398. The cover 400 is secured to the housing 375 by known means, closing off the first inner portion and essentially encapsulating the ASEP device 310 / printed circuit board 200 therein. The cover 400 and its inner wall may be configured to have track portions for receiving the side edges 394, 396 of the ASEP device 310, thereby stabilizing the ASEP device 310 / printed circuit board 200 in its position within the housing 375. A gasket 402 is provided between the cover 400 and the housing 375 to seal the ASEP device 310 / printed circuit board 200 from external elements.

[0041] With the smart connector 360 formed, it can be connected to a mating connector 500 (see Figure 8), which is configured to be electrically connected to the smart connector 360 via electroplated high-current contacts 357 and electroplated contact pins 358, thereby providing a connector assembly. The connector assembly can be mounted in a vehicle, typically on a panel, either via the smart connector 360 or via the mating connector 500 (or both, if desired), in a number of known ways.

[0042] This results in the formation of a small and lightweight smart connector 360.

[0043] The printed circuit board 200 may be directly mated to the side of a substrate 338 that does not have electrical components 386 on it. The side of the substrate 338 that does not have electrical components 386 on it may be planar and ideally suited for connection to the printed circuit board 200. The printed circuit board 200 may have an outer edge that defines a smaller perimeter than the perimeter defined by the edges 390, 392, 394, 396 of the substrate 338, so that the printed circuit board 200 does not extend beyond the edges 390, 392, 394, 396. This provides a compact assembly. Other orientations are also possible. For example, the printed circuit board 200 may be mounted on the same surface as the electrical components 386 and extend outward from one or more of the edges 390, 392, 394, 396, or, for example, the printed circuit board 200 may be above the electrical components 386 and electrically connected to the ASEP device 310.

[0044] Using the ASEP device 310 and the mated printed circuit board 200, a smart battery switch can be formed that can be used either to transport 400 amps or to provide secondary redundant protection in case of primary switch malfunction. Using the ASEP device 310 and the mated printed circuit board 200, a smart battery switch capable of switching 200 amps can also be formed. Each battery switch may have reverse battery protection.

[0045] All references cited herein, including publications, patent applications, and patents, are incorporated herein by reference, and their entirety is described herein, to the same extent that each reference is individually and specifically indicated as being incorporated by reference.

[0046] In the context describing the present invention (particularly in the context of the following claims), the use of the terms “a,” “an,” and “the,” as well as “at least one,” and similar referents, should be interpreted as encompassing both singular and plural, unless otherwise stated herein or unless there is a clear inconsistency in the context. The use of the term “at least one,” followed by a list of one or more items (e.g., “at least one of A and B”), should be interpreted as meaning one item selected from the enumerated items (A or B) or any combination of two or more enumerated items (A and B), unless otherwise stated herein or unless there is a clear inconsistency in the context. The terms “comprising,” “having,” “including,” and “containing” should be interpreted as open-ended terms (i.e., “including,” but not limited to. The descriptions of value ranges in this specification are intended, unless otherwise stated herein, merely to serve as a simplified method of referring individually to each distinct value within the range, and each distinct value is incorporated into the specification as if it were individually described herein. All processes described herein may be performed in any preferred order unless otherwise stated herein or unless there is a clear inconsistency in the context. Any and all examples or exemplary language (e.g., "etc.") provided herein are intended merely to better illuminate the invention and do not impose limitations on the scope of the invention unless otherwise claimed. The language herein should not be construed as indicating that any unclaimed element is essential to the practice of the invention.

[0047] Preferred embodiments of the present invention are described herein, including the best modes known to the inventors for carrying out the invention. Modifications of these preferred embodiments may become apparent to those skilled in the art by reading the preceding description. The inventors expect that those skilled in the art will adopt such modifications as needed, and the inventors intend that the invention may be carried out in ways other than those specifically described herein. Accordingly, the invention includes all modifications and equivalents of the subject matter described in the claims appended herein, as permitted by applicable law. Furthermore, any combination of the elements described above in all possible modifications thereof is encompassed by the invention unless otherwise stated herein or unless there is an obvious inconsistency in the context. As can be understood from the various embodiments shown herein, the different features of the different embodiments shown herein can be combined with each other to form additional combinations. As a result, the embodiments shown herein are particularly suited to providing a broad range of configurations, not all of which are shown individually, in order to avoid repetition and unnecessary duplication.

[0048] The disclosure provided herein is characterized in terms of its preferred and exemplary embodiments. Those skilled in the art will be able to recall numerous other embodiments, modifications, and variations within the scope and spirit of the appended claims by examining this disclosure.

Claims

1. 1. A smart connector, comprising: an application specific electronics packaging device comprising: a lead frame having a plurality of fingers defining openings and extending into the openings; a substrate overmolded onto the fingers of the lead frame, the substrate having a plurality of openings formed therethrough exposing portions of the fingers to form exposed portions; and traces formed on the substrate, the traces being electroplated; and at least one electrical component for forming the application specific electronics packaging device, the electrical component electrically attached to the traces; a separate printed circuit board electrically connected to an exposed portion of a finger of the application specific electronics packaging device, the separate printed circuit board having electrical components configured to control a function of at least one electrical component of the application specific electronics packaging device.

2. A smart connector as described in claim 1, wherein in a first case, a first printed circuit board is electrically connected to at least one electrical component of the application-specific electronics packaging device to control a function of the at least one electrical component of the application-specific electronics packaging device in a first manner, and in a second case, a second printed circuit board is electrically connected to at least one electrical component of the application-specific electronics packaging device to control a function of the at least one electrical component of the application-specific electronics packaging device in a second manner different from the first manner.

3. 10. The smart connector of claim 1, wherein the at least one electrical component of the application specific electronics packaging device includes a field effect transistor and the electrical components of the separate printed circuit board include a microcontroller unit and a communication protocol.

4. The smart connector of claim 1 , wherein the at least one electrical component of the application specific electronics packaging device includes a communications front end and the electrical component of the separate printed circuit board includes a microcontroller unit.

5. 10. The smart connector of claim 1, wherein the at least one electrical component of the application specific electronics packaging device includes a motor driver and the electrical components of the separate printed circuit board include a microcontroller unit and a communication protocol.

6. The smart connector of claim 1 , wherein at least one electrical component of the application specific electronics packaging device comprises a field effect transistor.

7. The smart connector of claim 6 , wherein at least one electrical component of the application specific electronics packaging device further comprises a current sensor.

8. 10. The smart connector of claim 1, further comprising a housing in which said application specific electronics packaging device and said printed circuit board are mounted.

9. 10. The smart connector of claim 1, further comprising a plurality of application specific electronics packaging devices electrically connected to the printed circuit board.

10. The smart connector of claim 1 , wherein the application specific electronics packaging device is singulated from the remainder of a carrier.

11. 1. A smart connector, comprising: an application specific electronics packaging device comprising: a lead frame having a plurality of fingers defining openings and extending into the openings; a substrate overmolded onto the fingers of the lead frame, the substrate having a plurality of openings formed therethrough exposing portions of the fingers to form exposed portions; and traces formed on the substrate, the traces being electroplated; and at least one electrical component for forming the application specific electronics packaging device, the electrical component electrically attached to the traces; a separate printed circuit board electrically connected to an exposed portion of a finger of the application specific electronics packaging device, the separate printed circuit board having electrical components configured to modify a characteristic of the smart connector.

12. A smart connector as described in claim 11, wherein in a first case, a first printed circuit board is electrically connected to at least one electrical component of the application-specific electronics packaging device to modify a characteristic of the smart connector in a first manner, and in a second case, a second printed circuit board is electrically connected to at least one electrical component of the application-specific electronics packaging device to modify a characteristic of the smart connector in a second manner different from the first manner.

13. The smart connector of claim 11 , wherein at least one electrical component of the application specific electronics packaging device includes a central processing unit and the electrical components of the separate printed circuit board include a memory.

14. The smart connector of claim 11 further comprising a housing in which said application specific electronics packaging device and said printed circuit board are mounted.

15. The smart connector of claim 11 further comprising a plurality of application specific electronics packaging devices electrically connected to the printed circuit board.

16. The smart connector of claim 11 , wherein the application specific electronics packaging device is singulated from the remainder of a carrier.

17. 1. A method of forming a smart connector, comprising: forming a continuous carrier web having a plurality of lead frames, each lead frame defining an opening and having a plurality of fingers extending into the opening; overmolding a substrate onto the fingers of each leadframe, each substrate having a plurality of openings provided therethrough exposing portions of the fingers to form exposed portions; electrically connecting electrical components to the exposed portions of some of the fingers of each leadframe to form a plurality of devices, each device having at least one electrical component; and electrically attaching a printed circuit board to the exposed portions of some of the fingers of one of the devices, the printed circuit board having electrical components configured to control a function of at least one electrical component of the one device.

18. singulating the one device from the continuous carrier web; and The method of claim 17 , further comprising packaging the singulated device and the printed circuit board in a housing.

19. The method described in claim 17, wherein in a first case, a first printed circuit board is electrically connected to at least one electrical component of a device and controls the function of the at least one electrical component of the one device in a first manner, and in a second case, a second printed circuit board is electrically connected to at least one electrical component of a device and controls the function of the at least one electrical component of the one device in a second manner different from the first manner.

20. 1. A method of forming a smart connector, comprising: forming a continuous carrier web having a plurality of lead frames, each lead frame defining an opening and having a plurality of fingers extending into the opening; overmolding a substrate onto the fingers of each leadframe, each substrate having a plurality of openings provided therethrough exposing portions of the fingers to form exposed portions; electrically connecting electrical components to the exposed portions of some of the fingers of each leadframe to form a plurality of devices, each device having at least one electrical component; and electrically attaching a printed circuit board to the exposed portions of some of the fingers of one of the devices, the printed circuit board having electrical components configured to modify a characteristic of the smart connector.

21. singulating a device from the continuous carrier web; 21. The method of claim 20, further comprising packaging the singulated device and the printed circuit board in a housing.

22. The method of claim 20, wherein in a first case, a first printed circuit board is electrically connected to at least one electrical component of a device to modify a characteristic of the smart connector in a first manner, and in a second case, a second printed circuit board is electrically connected to at least one electrical component of a device to modify a characteristic of the smart connector in a second manner different from the first manner.

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