Electroplated part, electroplated part manufacturing method and connector

Abstract

The invention discloses an electroplated part, an electroplated part manufacturing method and a connector. The electroplated part comprises a base material; a nickel plating layer formed on the surface of the base material; the tin-graphite composite plating layer is formed on the nickel plating layer; the nickel plating layer is formed on the base material, the tin-graphite composite plating layer is formed on the nickel plating layer, the tin plating layer is formed on the tin-graphite composite plating layer, the nickel plating layer serves as a bottom plating layer of the base material, the tin plating layer serves as an outer plating layer of the base material, and the tin-graphite composite plating layer serves as a middle plating layer of the base material. According to the invention, the graphite particles exposed from the tin-graphite composite coating are partially or completely wrapped by the outermost tin coating, so that the graphite particles are not easy to fall off, the wear resistance and corrosion resistance of the electroplated part are improved, and the service life of the electroplated part is prolonged. In addition, the plating layer structure also has a relatively low friction coefficient, so that the insertion and extraction force of the electroplated part in the use process can be greatly reduced.

Description

Technical Field

[0001] This invention relates to an electroplated part and a method for manufacturing the electroplated part, and also to a connector including the electroplated part. Background Technology

[0002] In existing technologies, the plating structure on connector terminals typically includes a nickel plating layer and a tin plating layer formed on top of the nickel plating layer. The tin plating layer has low contact resistance and serves as the outermost contact layer of the connector terminal. However, the tin plating layer has a high coefficient of friction, resulting in high insertion or mating forces and poor wear resistance. With increasing application demands, various industries are placing higher requirements on the high wear resistance and low insertion / extraction forces of terminals or connectors. Existing terminal plating structures can no longer meet these requirements.

[0003] German company Siemens and Japanese company Dowa have successively developed tin-graphite composite coatings and used them as the outermost layer of connector terminals. However, due to the large particle size of graphite, many graphite particles are exposed to the air to varying degrees from the tin-graphite composite coating, especially the surface graphite particles, which are mostly exposed outside the coating. This leads to two problems. The first problem is that the corrosion resistance of tin-graphite is greatly reduced. Because there is a large potential difference between tin and graphite, galvanic corrosion can occur. At the same time, the surface area and roughness of the tin-graphite composite coating are greatly increased, making it more susceptible to electrolyte adsorption and corrosion. The second problem is that when the tin-graphite composite coating is subjected to external force, graphite particles can easily detach from the coating, resulting in a significant reduction in the amount of graphite in the composite coating. This greatly reduces the lubrication and friction-reducing effect of graphite, failing to achieve the expected goal of reducing the coefficient of friction. Summary of the Invention

[0004] The purpose of this invention is to solve at least one aspect of the aforementioned problems and defects existing in the prior art.

[0005] According to one aspect of the present invention, an electroplated part is provided. The electroplated part includes: a substrate; a nickel plating layer formed on the surface of the substrate; a tin-graphite composite plating layer formed on the nickel plating layer; and a tin plating layer formed on the tin-graphite composite plating layer, wherein the nickel plating layer serves as a bottom plating layer of the substrate, the tin plating layer serves as an outer plating layer of the substrate, and the tin-graphite composite plating layer serves as an intermediate plating layer of the substrate.

[0006] According to an exemplary embodiment of the present invention, a portion of the graphite particles in the tin-graphite composite coating are exposed from the surface of the tin-graphite composite coating, and the graphite particles exposed from the surface of the tin-graphite composite coating are partially or completely encapsulated by the tin coating.

[0007] According to another exemplary embodiment of the present invention, the thickness of the tin plating layer is less than the maximum diameter of the graphite particles in the tin-graphite composite plating layer, such that the tin plating layer can only partially enclose the graphite particles exposed from the tin-graphite composite plating layer.

[0008] According to another exemplary embodiment of the present invention, the thickness of the tin plating layer is equal to or greater than the maximum diameter of the graphite particles in the tin-graphite composite plating layer, such that the tin plating layer can completely enclose the graphite particles exposed from the tin-graphite composite plating layer.

[0009] According to another exemplary embodiment of the present invention, the thickness of the nickel plating layer is 0.5-2.5 μm, the thickness of the tin-graphite composite plating layer is 0.5-15 μm, the thickness of the tin plating layer is 0.5-5 μm, and the diameter of the graphite particles in the tin-graphite composite plating layer is 0.5-5 μm.

[0010] According to another exemplary embodiment of the present invention, the substrate is a conductive substrate or a non-conductive substrate.

[0011] According to another exemplary embodiment of the present invention, the substrate is a metal substrate or a non-metal substrate.

[0012] According to another exemplary embodiment of the present invention, the electroplated part is a connector terminal, and the substrate is a copper substrate or a copper alloy substrate.

[0013] According to another exemplary embodiment of the present invention, the nickel plating, the tin-graphite composite plating, and the tin plating are selectively electroplated on a local area of ​​the substrate or electroplated on the entire surface of the substrate.

[0014] According to another aspect of the present invention, a method for manufacturing an electroplated part is provided. The method for manufacturing an electroplated part includes the following steps:

[0015] S10: Provides substrate;

[0016] S20: A nickel plating layer is formed on the substrate;

[0017] S30: A tin-graphite composite coating is formed on the nickel plating layer; and

[0018] S40: A tin plating layer is formed on the tin-graphite composite plating layer.

[0019] The nickel plating layer serves as the bottom plating layer of the substrate, the tin plating layer serves as the outer plating layer of the substrate, and the tin-graphite composite plating layer serves as the intermediate plating layer of the substrate.

[0020] According to an exemplary embodiment of the present invention,

[0021] Step S10 includes:

[0022] S11: Remove dirt and grease from the surface of the substrate; and

[0023] S12: The substrate is acid-washed and activated.

[0024] According to another exemplary embodiment of the present invention, in step S11, a current density of 2A / dm is used. 2 The substrate is subjected to cathodic electrodegreasing for 1 minute using direct current to remove dirt and grease from the surface of the substrate; and in step S12, the substrate is acid-washed and activated in 5% dilute sulfuric acid.

[0025] According to another exemplary embodiment of the present invention, step S20 includes:

[0026] S21: Prepare a nickel aminosulfonate electroplating solution and heat the prepared nickel aminosulfonate electroplating solution to 60°C;

[0027] S22: Immerse the substrate in the nickel sulfamate electroplating solution and apply a current density of 2A / dm. 2 The substrate is electroplated using direct current; and

[0028] S23: Remove the substrate from the nickel sulfamate electroplating solution and clean the substrate with deionized water.

[0029] According to another exemplary embodiment of the present invention, step S30 includes:

[0030] S31: Prepare a tin methanesulfonate-graphite electroplating solution, wherein the graphite is flake-shaped, the average particle size of the graphite is 3-5 μm, and the graphite content is 20 g / L;

[0031] S32: Mechanically stir the tin methanesulfonate-graphite electroplating solution until the graphite is uniformly dispersed in the tin methanesulfonate-graphite electroplating solution;

[0032] S33: Heat the tin methanesulfonate-graphite electroplating solution to 55°C and immerse the substrate with the nickel plating layer in the tin methanesulfonate-graphite electroplating solution;

[0033] S34: Tin-graphite composite electroplating is performed on the substrate using pulsed current, wherein the peak current density of the pulsed current is 5-40 A / dm³. 2 Pulse width 10ms, duty cycle 2%;

[0034] S35: Remove the substrate from the tin methanesulfonate-graphite electroplating solution and clean the substrate with deionized water.

[0035] According to another exemplary embodiment of the present invention, step S40 includes:

[0036] S41: Prepare a tin methanesulfonate electroplating solution and heat the prepared tin methanesulfonate electroplating solution to 55°C;

[0037] S42: Place the substrate already coated with the nickel plating layer and the tin-graphite composite plating layer into the tin methanesulfonate electroplating solution;

[0038] S43: Uses a current density of 2A / dm 2 The substrate is electroplated with DC for 60–120 seconds; and

[0039] S44: Remove the substrate from the tin methanesulfonate plating solution, clean the substrate with deionized water, and air dry the substrate using an air-drying device.

[0040] According to another exemplary embodiment of the present invention, the electroplated part is a connector terminal, and the substrate is a copper substrate or a copper alloy substrate.

[0041] According to another aspect of the present invention, a connector is provided. The connector includes: a housing; and the aforementioned electroplated part disposed in the housing and serving as a terminal of the connector.

[0042] In the foregoing exemplary embodiments of the present invention, the graphite particles exposed from the tin-graphite composite coating are partially or completely encased by the outermost tin coating, making the graphite particles less prone to detachment and improving the wear resistance, corrosion resistance, and service life of the electroplated parts. Furthermore, the coating structure of the present invention also has a low coefficient of friction, which can significantly reduce the insertion and extraction forces of the electroplated parts during use.

[0043] Other objects and advantages of the invention will become apparent from the following description of the invention with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the invention. Attached Figure Description

[0044] Figure 1 A schematic diagram of a substrate according to an exemplary embodiment of the present invention is shown;

[0045] Figure 2 Displayed Figure 1 The diagram shows a nickel plating layer formed on a substrate.

[0046] Figure 3 Displayed Figure 2 A schematic diagram showing the formation of a tin-graphite composite coating on a nickel-plated substrate.

[0047] Figure 4 Displayed Figure 3A schematic diagram showing the formation of a tin plating layer on a tin-graphite composite coating of a substrate. Detailed Implementation

[0048] The technical solution of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. In this specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as a limitation thereof.

[0049] Furthermore, in the following detailed description, numerous specific details are set forth for ease of explanation to provide a thorough understanding of the embodiments disclosed herein. However, it will be apparent that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and apparatuses are illustrated to simplify the figures.

[0050] According to a general technical concept of the present invention, an electroplated part is provided. The electroplated part includes: a substrate; a nickel plating layer formed on the surface of the substrate; a tin-graphite composite plating layer formed on the nickel plating layer; and a tin plating layer formed on the tin-graphite composite plating layer, wherein the nickel plating layer serves as a bottom plating layer of the substrate, the tin plating layer serves as an outer plating layer of the substrate, and the tin-graphite composite plating layer serves as an intermediate plating layer of the substrate.

[0051] According to another general technical concept of the present invention, a method for manufacturing an electroplated part is provided. The method includes the following steps: providing a substrate; forming a nickel plating layer on the substrate; forming a tin-graphite composite plating layer on the nickel plating layer; and forming a tin plating layer on the tin-graphite composite plating layer. The nickel plating layer serves as a bottom plating layer on the substrate, the tin plating layer serves as an outer plating layer on the substrate, and the tin-graphite composite plating layer serves as an intermediate plating layer on the substrate.

[0052] According to another general technical concept of the present invention, a connector is provided. The connector includes: a housing; and the aforementioned electroplated part disposed in the housing and serving as a terminal of the connector.

[0053] Figure 1 A schematic diagram of a substrate 1 according to an exemplary embodiment of the present invention is shown;

[0054] Figure 2 Displayed Figure 1 A schematic diagram showing the formation of a nickel plating layer 1a on substrate 1; Figure 3 Displayed Figure 2 A schematic diagram showing the formation of a tin-graphite composite coating 1b on a nickel plating layer 1a of substrate 1;

[0055] Figure 4 Displayed Figure 3A schematic diagram showing the formation of a tin plating layer 1c on a tin-graphite composite plating layer 1b of substrate 1.

[0056] like Figures 1 to 3 As shown, in an exemplary embodiment of the present invention, an electroplated part is disclosed. The electroplated part includes: a substrate 1, a nickel plating layer 1a, a tin-graphite composite plating layer 1b, and a tin plating layer 1c. The nickel plating layer 1a is formed on the surface of the substrate 1. The tin-graphite composite plating layer 1b is formed on the nickel plating layer 1a. The tin plating layer 1c is formed on the tin-graphite composite plating layer 1b. The nickel plating layer 1a serves as the bottom plating layer of the substrate 1, the tin plating layer 1c serves as the outer plating layer of the substrate 1, and the tin-graphite composite plating layer 1b serves as the intermediate plating layer of the substrate 1.

[0057] like Figures 1 to 3 As shown in the illustrated embodiment, a portion of the graphite particles in the tin-graphite composite coating 1b are exposed from the surface of the tin-graphite composite coating 1b, and the graphite particles exposed from the surface of the tin-graphite composite coating 1b are partially or completely encapsulated by the tin coating 1c.

[0058] like Figures 1 to 3 As shown, in an exemplary embodiment of the present invention, the thickness of the tin plating layer 1c is less than the maximum diameter of the graphite particles in the tin-graphite composite plating layer 1b, such that the tin plating layer 1c can only partially enclose the graphite particles exposed in the tin-graphite composite plating layer 1b.

[0059] like Figures 1 to 3 As shown, in another exemplary embodiment of the present invention, the thickness of the tin plating layer 1c is equal to or greater than the maximum diameter of the graphite particles in the tin-graphite composite plating layer 1b, such that the tin plating layer 1c can completely enclose the graphite particles exposed from the tin-graphite composite plating layer 1b.

[0060] like Figures 1 to 3 As shown in the illustrated embodiment, the thickness of the nickel plating layer 1a is 0.5-2.5 μm, the thickness of the tin-graphite composite plating layer 1b is 0.5-15 μm, the thickness of the tin plating layer 1c is 0.5-5 μm, and the diameter of the graphite particles in the tin-graphite composite plating layer 1b is 0.5-5 μm.

[0061] like Figures 1 to 3 As shown in the illustrated embodiment, the substrate 1 can be a conductive substrate or a non-conductive substrate.

[0062] like Figures 1 to 3 As shown in the illustrated embodiment, the substrate 1 can be a metal substrate 1 or a non-metal substrate 1.

[0063] like Figures 1 to 3 As shown in the illustrated embodiment, the electroplated part can be a connector terminal, and the substrate 1 can be a copper substrate or a copper alloy substrate.

[0064] like Figures 1 to 3 As shown in the illustrated embodiment, the nickel plating layer 1a, the tin-graphite composite plating layer 1b, and the tin plating layer 1c can be selectively electroplated on a local area of ​​the substrate 1 or can be electroplated on the entire surface of the substrate 1.

[0065] like Figures 1 to 3 As shown, in another exemplary embodiment of the present invention, a method for manufacturing an electroplated part is also disclosed. This method includes the following steps:

[0066] S10: Provide substrate 1;

[0067] S20: A nickel plating layer 1a is formed on the substrate 1;

[0068] S30: A tin-graphite composite coating 1b is formed on the nickel coating 1a; and

[0069] S40: A tin plating layer 1c is formed on the tin-graphite composite plating layer 1b.

[0070] Nickel plating layer 1a serves as the bottom plating layer of substrate 1, tin plating layer 1c serves as the outer plating layer of substrate 1, and tin-graphite composite plating layer 1b serves as the intermediate plating layer of substrate 1.

[0071] like Figures 1 to 3 As shown in the illustrated embodiment,

[0072] The aforementioned step S10 includes:

[0073] S11: Remove dirt and grease from the surface of substrate 1; and

[0074] S12: Acid pickling and activation of substrate 1.

[0075] like Figures 1 to 3 As shown in the illustrated embodiment, in step S11, a current density of 2 A / dm is used. 2 The substrate 1 is subjected to cathodic electrolytic degreasing with direct current for 1 minute to remove dirt and grease from its surface. In step S12, the substrate 1 is acid-washed and activated in 5% dilute sulfuric acid.

[0076] like Figures 1 to 3 As shown in the illustrated embodiment,

[0077] The aforementioned step S20 includes:

[0078] S21: Prepare a nickel aminosulfonate electroplating solution and heat the prepared nickel aminosulfonate electroplating solution to 60°C;

[0079] S22: Place substrate 1 into a nickel sulfamate electroplating solution and apply a current density of 2A / dm. 2 DC electroplating of substrate 1 for 90 seconds; and

[0080] S23: Remove substrate 1 from the nickel sulfamate plating solution and clean substrate 1 with deionized water.

[0081] like Figures 1 to 3 As shown in the illustrated embodiment,

[0082] The aforementioned step S30 includes:

[0083] S31: Prepare a tin methanesulfonate-graphite electroplating solution, wherein the graphite is flake-shaped, the average particle size of the graphite is 3-5 μm, and the graphite content is 20 g / L;

[0084] S32: Mechanically stir the tin methanesulfonate-graphite electroplating solution for 1 hour until the graphite is uniformly dispersed in the tin methanesulfonate-graphite electroplating solution;

[0085] S33: Heat the tin methanesulfonate-graphite electroplating solution to 55°C and immerse the substrate 1, which has been plated with nickel plating layer 1a, in the tin methanesulfonate-graphite electroplating solution;

[0086] S34: Tin-graphite composite electroplating is performed on substrate 1 using pulsed current, wherein the peak current density of the pulsed current is 5-40 A / dm³. 2 Pulse width 10ms, duty cycle 2%, electroplating time 60 seconds;

[0087] S35: Remove substrate 1 from the tin methanesulfonate-graphite electroplating solution and clean substrate 1 with deionized water.

[0088] like Figures 1 to 3 As shown in the illustrated embodiment,

[0089] The aforementioned step S40 includes:

[0090] S41: Prepare a tin methanesulfonate electroplating solution and heat the prepared tin methanesulfonate electroplating solution to 55°C;

[0091] S42: Immerse the substrate 1, which has been plated with nickel plating layer 1a and tin-graphite composite plating layer 1b, in tin methanesulfonate electroplating solution.

[0092] S43: Uses a current density of 2A / dm 2 DC electroplating of substrate 1 for 60–120 seconds; and

[0093] S44: Remove substrate 1 from the tin methanesulfonate plating solution, clean substrate 1 with deionized water, and air dry substrate 1 using an air drying device.

[0094] like Figures 1 to 3 As shown in the illustrated embodiment, the electroplated part is a connector terminal, and the substrate 1 is a copper substrate or a copper alloy substrate.

[0095] like Figures 1 to 3 As shown, in another exemplary embodiment of the present invention, a connector is also disclosed. The connector includes a housing and the aforementioned electroplated component. The electroplated component is disposed within the housing and serves as a connector terminal.

[0096] This invention relates to a multi-layered plating structure with a low coefficient of friction. It consists of a nickel plating layer as the base layer, a tin-graphite composite plating layer as the intermediate layer, and a tin plating layer as the outermost layer. This multi-layered structure exhibits a very low coefficient of friction, excellent wear resistance, and good corrosion resistance and structural stability. The invention aims to improve the overall performance of the plating structure, partially or completely replacing commonly used conventional processes such as tin electroplating and nickel-tin electroplating. Using this plating structure can significantly reduce the coefficient of friction of the plating, reducing the insertion and mating forces of connector terminals, while maintaining the conductivity and corrosion resistance of the plating. The overall performance of the plating structure is more stable. Furthermore, it makes the graphite within the plating structure more stable, less prone to repositioning or detachment due to external forces.

[0097] The electroplated parts of this invention can be used as connector terminals, and the plating structure of this invention can replace existing tin plating and nickel + tin plating layers. The plating structure of this invention can be plated on any metal and non-metal substrate and is suitable for any electroplating method (including commonly used barrel plating, rack plating, high-speed roll-to-roll electroplating, including full plating and selective plating, etc.).

[0098] This invention develops a multi-layer composite structure based on existing tin-graphite composite coatings, consisting of a nickel plating layer, a tin-graphite composite coating, and a tin plating layer. The nickel plating layer, acting as the underlayer, not only prevents the upward diffusion of atoms from the underlying layers, thus functioning as a barrier layer, but also serves as a hard support layer, exerting an anvil effect to further reduce the friction coefficient of the tin-graphite composite coating. The middle tin-graphite composite coating utilizes the lubricating effect of graphite to significantly reduce the material's friction coefficient, decrease the insertion force of the terminals, and increase the coating's wear resistance. The outermost tin plating layer can partially or completely encapsulate the graphite particles exposed from the tin-graphite composite coating, not only increasing the stability of the graphite particles in the coating structure and reducing the risk of graphite particle detachment, but also reducing surface roughness and the tendency for galvanic corrosion.

[0099] In the multilayer composite structure of this invention, the thickness of the bottom nickel plating layer is 0.5-2.5 μm, the thickness of the middle tin-graphite composite plating layer is 0.5-15 μm, the graphite particle size in which is 0.5-5 μm, and the thickness of the outermost tin plating layer is 0.5-5 μm. The thickness of the outermost tin plating layer can be less than, equal to, or greater than the maximum diameter of the graphite particles, so that the exposed graphite particles on the surface of the tin-graphite composite plating layer can be partially or completely encapsulated by the outermost tin plating layer.

[0100] The nickel + tin graphite + tin multilayer structure of the present invention has a friction coefficient comparable to that of tin graphite composite coatings, excellent wear resistance, and graphite is stably encapsulated in the coating, making it less prone to detachment, resulting in more stable and durable performance, and its corrosion resistance is also greatly improved.

[0101] Those skilled in the art will understand that the embodiments described above are exemplary and can be improved upon. The structures described in the various embodiments can be freely combined without causing structural or principle conflicts, and these changes should fall within the protection scope of this invention.

[0102] Although the invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to illustrate preferred embodiments of the invention and should not be construed as limiting the invention.

[0103] While some embodiments of the general concept of the invention have been shown and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general concept of the invention, the scope of which is defined by the claims and their equivalents.

[0104] It should be noted that the word "comprising" does not exclude other elements or steps, and the words "a" or "an" do not exclude multiple elements. Furthermore, any reference numerals in the claims should not be construed as limiting the scope of the invention.

Claims

1. An electroplated part, characterized in that, include: Substrate (1); A nickel plating layer (1a) is formed on the surface of the substrate (1); A tin-graphite composite coating (1b) is formed on the nickel coating (1a); and A tin plating layer (1c) is formed on the tin-graphite composite plating layer (1b). The nickel plating layer (1a) serves as the bottom plating layer of the substrate (1), the tin plating layer (1c) serves as the outer plating layer of the substrate (1), and the tin-graphite composite plating layer (1b) serves as the intermediate plating layer of the substrate (1).

2. The electroplated part according to claim 1, characterized in that: A portion of the graphite particles in the tin-graphite composite coating (1b) are exposed from the surface of the tin-graphite composite coating (1b), and the graphite particles exposed from the surface of the tin-graphite composite coating (1b) are partially or completely encapsulated by the tin coating (1c).

3. The electroplated part according to claim 2, characterized in that: The thickness of the tin plating layer (1c) is less than the maximum diameter of the graphite particles in the tin-graphite composite plating layer (1b), such that the tin plating layer (1c) can only partially enclose the graphite particles exposed from the tin-graphite composite plating layer (1b).

4. The electroplated part according to claim 2, characterized in that: The thickness of the tin plating layer (1c) is equal to or greater than the maximum diameter of the graphite particles in the tin-graphite composite plating layer (1b), so that the tin plating layer (1c) can completely enclose the graphite particles exposed from the tin-graphite composite plating layer (1b).

5. The electroplated part according to claim 2, characterized in that: The thickness of the nickel plating layer (1a) is 0.5-2.5 μm, the thickness of the tin-graphite composite plating layer (1b) is 0.5-15 μm, the thickness of the tin plating layer (1c) is 0.5-5 μm, and the diameter of the graphite particles in the tin-graphite composite plating layer (1b) is 0.5-5 μm.

6. The electroplated part according to any one of claims 1-5, characterized in that: The substrate (1) is a conductive substrate or a non-conductive substrate.

7. The electroplated part according to claim 6, characterized in that: The substrate (1) is a metal substrate (1) or a non-metal substrate (1).

8. The electroplated part according to any one of claims 1-5, characterized in that: The electroplated part is a connector terminal, and the substrate (1) is a copper substrate or a copper alloy substrate.

9. The electroplated part according to claim 1, characterized in that: The nickel plating (1a), the tin-graphite composite plating (1b), and the tin plating (1c) are selectively electroplated on local areas of the substrate (1) or on the entire surface of the substrate (1).

10. A method for manufacturing an electroplated part, characterized in that, Includes the following steps: S10: Provide substrate (1); S20: A nickel plating layer (1a) is formed on the substrate (1); S30: A tin-graphite composite coating (1b) is formed on the nickel plating layer (1a); and S40: A tin plating layer (1c) is formed on the tin-graphite composite plating layer (1b). The nickel plating layer (1a) serves as the bottom plating layer of the substrate (1), the tin plating layer (1c) serves as the outer plating layer of the substrate (1), and the tin-graphite composite plating layer (1b) serves as the intermediate plating layer of the substrate (1).

11. The method for manufacturing electroplated parts according to claim 10, characterized in that: Step S10 includes: S11: Remove dirt and grease from the surface of the substrate (1); and S12: The substrate (1) is acid-washed and activated.

12. The method for manufacturing electroplated parts according to claim 11, characterized in that: In step S11, a current density of 2A / dm is used. 2 The substrate (1) is subjected to cathodic electrodegreasing with direct current for 1 minute to remove dirt and grease from the surface of the substrate (1); and In step S12, the substrate (1) is acid-washed and activated in 5% dilute sulfuric acid.

13. The method for manufacturing electroplated parts according to claim 10, characterized in that: Step S20 includes: S21: Prepare a nickel aminosulfonate electroplating solution and heat the prepared nickel aminosulfonate electroplating solution to 60°C; S22: The substrate (1) is placed in the nickel sulfamate electroplating solution and a current density of 2A / dm is applied. 2 The substrate (1) is electroplated using direct current; and S23: Remove the substrate (1) from the nickel sulfamate electroplating solution and clean the substrate (1) with deionized water.

14. The method for manufacturing electroplated parts according to claim 10, characterized in that: Step S30 includes: S31: Prepare a tin methanesulfonate-graphite electroplating solution, wherein the graphite is flake-shaped, the average particle size of the graphite is 3-5 μm, and the graphite content is 20 g / L; S32: Mechanically stir the tin methanesulfonate-graphite electroplating solution until the graphite is uniformly dispersed in the tin methanesulfonate-graphite electroplating solution; S33: Heat the tin methanesulfonate-graphite electroplating solution to 55°C and place the substrate (1) with the nickel plating layer (1a) into the tin methanesulfonate-graphite electroplating solution; S34: Tin-graphite composite electroplating is performed on the substrate (1) using a pulsed current, wherein the peak current density of the pulsed current is 5-40 A / dm. 2 Pulse width 10ms, duty cycle 2%; S35: Remove the substrate (1) from the tin methanesulfonate-graphite electroplating solution and clean the substrate (1) with deionized water.

15. The method for manufacturing an electroplated part according to claim 10, characterized in that: Step S40 includes: S41: Prepare a tin methanesulfonate electroplating solution and heat the prepared tin methanesulfonate electroplating solution to 55°C; S42: The substrate (1) with the nickel plating layer (1a) and the tin-graphite composite plating layer (1b) is placed into the tin methanesulfonate electroplating solution; S43: Uses a current density of 2A / dm 2 The substrate (1) is electroplated with DC for 60-120 seconds; and S44: Remove the substrate (1) from the tin methanesulfonate plating solution and clean the substrate (1) with deionized water and air dry the substrate (1) using an air drying device.

16. The method for manufacturing an electroplated part according to any one of claims 10-15, characterized in that: The electroplated part is a connector terminal, and the substrate (1) is a copper substrate or a copper alloy substrate.

17. A connector, characterized in that, include: case; and The electroplated part according to any one of claims 1-9 is disposed in the housing and serves as a terminal of the connector.

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