Composition

JP2023542127A5Active Publication Date: 2025-10-31MEXICHEM FLUOR S A DE CV
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Patent Information

Application Number
JP2023517261
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-09-17
Filing Date
2021-09-09
Publication Date
2025-10-31
Estimated Expiration
2041-09-09

AI Technical Summary

Technical Problem

Traditional air cooling systems for computing facilities and electric vehicles are inefficient, requiring significant power consumption and specialized building designs, while aqueous thermal management systems are not compatible with electrical components and limit rapid charging capabilities.

Method used

A cooling liquid comprising fluorinated ethers and/or fluorinated ketones, which are non-flammable, have high heat capacity, and low viscosity, used for direct immersion cooling, eliminating the need for water and providing efficient thermal management.

Benefits of technology

The cooling liquid enhances thermal management by reducing mass flow rates, increasing heat transfer coefficients, and lowering pressure drops, thereby optimizing performance and reducing energy consumption in computing facilities and electric vehicles.

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Abstract

1. A cooling liquid for cooling electrical / electronic components by direct immersion cooling, comprising: (Compound 1) structure (wherein R 1 , R 2 , R 3 , R 4 are independently selected from the group consisting of H, F, Cl, Br, I, CF3, alkyl, fluoroalkyl, haloalkyl, and R5 is independently selected from the group consisting of CF3, alkyl, fluoroalkyl, perfluoroalkyl, haloalkylperfluorohaloalkyl. [Formula 1] TIFF2023542127000014.tif61162
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Description

[Technical Field]

[0001] The present invention relates to coolant fluids for cooling electrical / electronic components by direct immersion cooling, comprising partially fluorinated ethers. [Background technology]

[0002] The listing or discussion of a prior-published document or any background art in this specification should not necessarily be taken as an acknowledgement that the document or background art is part of the state of the art or is common general knowledge.

[0003] There are many issues associated with large-scale computing facilities related to the efficient use of power. Typically, these computing facilities have high power densities. These issues include the requirement for specialized buildings to provide a temperature-controlled environment. It has also been found that the practicality associated with the power density of installed equipment influences the size of such buildings, or is conversely limited by the available size of the buildings. These factors have had a detrimental effect on determining (limiting) the performance of computing facilities.

[0004] Typically, conventional air-cooling systems are used to cool computing facilities such as data centers. Unfortunately, the use of air as a refrigerant not only has a low heat transfer coefficient, but also requires special flow regimes that may necessitate certain building designs. It has been observed that in data centers, approximately 45% of the total data center power is consumed for cooling. Therefore, there is a great demand to reduce power consumption by improving cooling efficiency. There is also a demand for improved refrigerants.

[0005] Additionally, in recent years, there has been an increasing shift from traditional fossil fuel and other vehicles to vehicles that are at least partially, and in some cases completely, powered by electricity. These "electric" vehicles typically include an electrical storage system (such as a battery) and electric drivetrain elements (including power electronics and one or more electric motors). These elements typically require thermal management during use to avoid damage and operate most efficiently.

[0006] Indeed, there is a drive to charge the batteries of these vehicles ever more rapidly without causing damage: such rapid charging has so far been limited by the inability of conventional battery cooling and / or heating systems to provide sufficient thermal management. Some of these thermal management systems have had to be based on aqueous / water-based systems (such as water or water / glycol) due to their high heat capacity. However, such aqueous compositions are obviously incompatible with electrical components (due to their high dielectric constant), necessitating complex and inefficient isolation and thermal management interfaces. DISCLOSURE OF THE INVENTION

[0007] The object of the present invention is to address the above mentioned drawbacks.

[0008] According to a first aspect of the present invention, there is provided a cooling liquid for cooling electrical / electronic components by direct immersion cooling, the cooling liquid having the structure (compound 1) [ka] (In the formula, R 1 , R 2 , R 3 , R 4 is independently selected from the group consisting of H, F, Cl, Br, I, CF3, alkyl, fluoroalkyl, haloalkyl; R 5are independently selected from the group of CF3, alkyl, fluoroalkyl, perfluoroalkyl, haloalkylperfluorohaloalkyl.

[0009] According to a second aspect of the present invention, the structure (of compound 1) is formed by at least partial direct immersion of an electrical / electronic element. [ka] (In the formula, R 1 , R 2 , R 3 , R 4 is independently selected from the group consisting of H, F, Cl, Br, I, CF3, alkyl, fluoroalkyl, haloalkyl; R 5 are independently selected from the group consisting of CF3, alkyl, fluoroalkyl, perfluoroalkyl, haloalkyl, perfluorohaloalkyl.

[0010] Preferably, the compositions of the first and second aspects are substantially free of water. By use of the term water-free, it is intended that the composition is completely free of water or has a low water content of less than about 1000 ppm, more preferably less than 500 ppm, more preferably less than 300 ppm, more preferably less than 200 ppm, and most preferably less than 100 ppm.

[0011] The compositions of the first and second aspects may include a desiccant. Alternatively, the element in which the composition is used may have a desiccant incorporated therein or be adapted to work in conjunction with it. By way of example, an electrical element may be configured or adapted to incorporate an optionally replaceable cartridge containing a desiccant.

[0012] In the compositions of the first and second aspects, preferably R 5 is methyl, preferably R 1 is CF3 and R 2 ~R4 are all H; alternatively, R 1 is CF3 and R 2 is H and R 3 and R 4 One of them is F and the other is R 3 and R 4 One of them is H.

[0013] The compositions of the first and second aspects preferably further comprise a non-flammable (partially or fully) fluorinated ether and / or a non-flammable (partially or fully) fluorinated ketone. Suitable fluorinated ethers include partially or fully fluorinated butyl alkyl ethers, such as C4F9OCH3 (1,1,1,2,2,3,3,4,4-nonafluoro-4-methoxybutane), commercially available as HFE7100 under the tradename "Novec 7100," and C4F9OC2H5 (1,1,1,2,2,3,3,4,4-nonafluoro-4-ethoxybutane), commercially available as HFE 7200 under the tradename "Novec 7200." A preferred example of the (partially or fully) fluorinated ketone 1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl)-3-pentanone and of the structural formula CFCFC(=O)CF(CF) is commercially available under the trade name "Novec 1230." Such fluids are commercially available from 3M.

[0014] It has now been found that the incorporation of such fluorinated ethers or ketones can significantly reduce the flammability of the composition or even render it non-flammable. Furthermore, it has been found that the partially fluorinated ethers of the composition have a higher specific heat capacity and a lower liquid viscosity than (partially or fully) fluorinated ethers and / or (partially or fully) fluorinated ketones (such as Novec 7100 or 7200). This means that mixtures comprising the partially fluorinated ethers of the present invention and (partially or fully) fluorinated ethers and / or (partially or fully) fluorinated ketones have been found to exhibit superior performance as heat transfer fluids. The higher heat capacity allows for a reduction in the mass flow rate required to achieve a given cooling load. This reduction in mass flow rate, combined with the (also observed) lower viscosity, improves local heat transfer rates, and in flow systems, also reduces the energy required to overcome the pressure drop of the pump coolant around the cooling circuit.

[0015] Preferably, the compositions of the first and second aspects contain 1 to 99% by weight of the partially fluorinated ether (of compound 1) and 1 to 99% by weight of the (partially or fully) fluorinated ether and / or (partially or fully) fluorinated ketone. More preferably, the compositions contain 10 to 80% by weight of the partially fluorinated ether (of compound 1) and 90 to 20% by weight of the (partially or fully) fluorinated ether and / or (partially or fully) fluorinated ketone. More preferably, the compositions contain 20 to 70% by weight of the partially fluorinated ether (of compound 1) and 80 to 30% by weight of the (partially or fully) fluorinated ether and / or (partially or fully) fluorinated ketone. More preferably, the compositions contain 30 to 60% by weight of the partially fluorinated ether (of compound 1) and 70 to 40% by weight of the (partially or fully) fluorinated ether and / or (partially or fully) fluorinated ketone. More preferably, the composition comprises 40 to 50% by weight of the partially fluorinated ether (of compound 1) and 60 to 50% by weight of the (partially or fully) fluorinated ether and / or the (partially or fully) fluorinated ketone.

[0016] Advantageously, the composition contains sufficient (partially or fully) fluorinated ethers and / or (partially or fully) fluorinated ketones to render the composition non-flammable.

[0017] Particularly preferred compositions of the present invention are binary mixtures of either 1,1,1,3-tetrafluoro-2-methoxypropane ("Ether A") or 1,1,1,3,3-pentafluoro-2-methoxypropane ("Ether B") (both from Compound 1) with C4F9OCH3 (1,1,1,2,2,3,3,4,4-nonafluoro-4-methoxybutane). Both Ether A and Ether B form azeotropes or pseudo-azeotropes with C4F9OCH3 at temperatures within the expected operating range of immersion coolants. This means that the composition of the mixture does not change (or does not change to a significant extent) even when used as a two-phase coolant that undergoes evaporation and condensation processes.

[0018] Preferred examples of electrical / electronic elements include medium or high voltage power transmission elements, such as those used for / in the supply of electricity from power stations to domestic / commercial users. Thus, according to a third aspect of the invention, the structure (of compound 1) is formed by at least partial immersion of the element. [ka] (In the formula, R 1 , R 2 , R 3 , R 4 is independently selected from the group consisting of H, F, Cl, Br, I, CF3, alkyl, fluoroalkyl, haloalkyl; R 5 is independently selected from the group of CF3, alkyl, fluoroalkyl, perfluoroalkyl, haloalkylperfluorohaloalkyl.

[0019] The elements of the first and second aspects of the invention shall apply mutatis mutandis to the third aspect of the invention.

[0020] The composition of the third aspect of the present invention has been found to be beneficial in that it exhibits high dielectric strength properties and therefore functions as an effective insulator. The dielectric strength has been found to be greater than 1 kV, more preferably greater than 5 kV, more preferably greater than 10 kV, more preferably greater than 15 kV, for example, 18 kV or even 20 kV, when measured across a 0.1 inch (2.5 mm) gap. It has also been found to function as an effective inhibitor of electric arcs (and thus act as an arc quencher).

[0021] The compositions are further advantageous in that they are non-toxic and inert. Compared to typical compositions previously used for this purpose (sulfur hexafluoride, SF6), the compositions of the third aspect of the invention have a low Global Warming Potential (GWP). SF6 has been used historically and has a GWP of 23,500.

[0022] Preferred examples of medium or high voltage power transmission elements include MV / HV transformers, circuit breakers, switchgear and gas insulated lines.

[0023] Further preferred examples of electric / electronic components include components used in electric vehicles. Thus, according to a fourth aspect of the present invention, there is provided a coolant for cooling components of electric vehicles by direct immersion cooling, the coolant comprising (compound 1) of the structure [ka] (In the formula, R 1 , R 2 , R 3 , R 4 is independently selected from the group consisting of H, F, Cl, Br, I, CF3, alkyl, fluoroalkyl, haloalkyl; R 5 are independently selected from the group of CF3, alkyl, fluoroalkyl, perfluoroalkyl, haloalkylperfluorohaloalkyl.

[0024] The elements of the first and second aspects of the invention shall apply mutatis mutandis to the fourth aspect of the invention.

[0025] Unless otherwise specified, the term "electric vehicle" as used herein should be understood to refer to both purely electric vehicles and vehicles that use electricity as one of several means of propulsion, such as hybrid vehicles.

[0026] Preferred examples of electric vehicle elements include the battery, conductors (including any charging / discharging system components), and motor / gearbox. Further examples of electric vehicle elements include power electronics as well as any (external) charging system components such as external power regulators and charging cables.

[0027] The composition of the fourth aspect of the invention, in which the composition is an azeotrope or near-azeotrope, has been found to be beneficial in that it provides a highly efficient non-conductive heat transfer fluid.

[0028] The composition of the fourth aspect of the invention is therefore preferably used as a "two-phase" system, which (in the context of the present invention) means that the coolant can be boiled before being returned to the component to be cooled (optionally via external cooling means such as a radiator). (In high ambient temperature environments (e.g., 40°C), a compressor may be required.) The composition of the fourth aspect of the invention is therefore advantageous in that its fixed boiling point provides a fixed upper operating temperature for the electric vehicle component to be cooled.

[0029] The compositions of the fourth aspect of the present invention have been found to be particularly advantageous in that they help maximize charge / discharge and long-term battery performance of battery elements in electric vehicles.

[0030] It also allows for high power transmission through drivetrain components such as motors and gearboxes.

[0031] By enabling electric vehicle batteries to operate at optimal temperatures, the problems of Li plating (observed at low temperatures) and SEI layer formation (observed at high temperatures) were reduced.

[0032] Optionally, the heat transferred by the composition of the fourth aspect of the invention may be used as heating, for example to heat the interior of an electric vehicle. Additionally and / or conversely, heat may be transferred from another source by the composition of the fourth aspect of the invention (i.e., to provide a heating mode), thereby preventing the temperature of the battery (or other components used in the electric vehicle) from falling below an optimal temperature range, such as in cooling conditions. This may be done by heat recovery from another source, electric heating, or a heat pump.

[0033] Further preferred examples of electric / electronic components include computer hardware components. Thus, according to a fifth aspect of the present invention, there is provided a cooling liquid for cooling computer hardware components by direct immersion cooling, the cooling liquid having the structure (of Compound 1) [ka] (In the formula, R 1 , R 2 , R 3 , R 4 is independently selected from the group consisting of H, F, Cl, Br, I, CF3, alkyl, fluoroalkyl, haloalkyl; R 5 are independently selected from the group of CF3, alkyl, fluoroalkyl, perfluoroalkyl, haloalkylperfluorohaloalkyl.

[0034] The elements of the first and second aspects of the invention shall apply mutatis mutandis to the fifth aspect of the invention.

[0035] Preferred examples of computer hardware elements include servers in a data center.

[0036] The composition of the fifth aspect of the invention, in which the composition is an azeotrope or near-azeotrope, has been found to be beneficial in that it provides a highly efficient non-conductive heat transfer fluid.

[0037] The composition of the fifth aspect of the invention can be used either as a single-phase coolant (no evaporation of the coolant occurs during heat transfer), but is also advantageously used as a "two-phase" system, which (in the context of the present invention) means that the coolant can be boiled before being returned to the component to be cooled (optionally via external cooling means such as a radiator). The composition of the fifth aspect of the invention is therefore advantageous in that its fixed boiling point provides a fixed upper operating temperature for the computer hardware component being cooled.

[0038] The composition of the fifth aspect of the present invention has been found to be particularly advantageous in that it aids in cooling computer hardware components. It can eliminate serious drawbacks previously observed in air-cooling computer hardware components, including restrictive building designs and the requirement for expensive, inefficient air conditioning systems. Eliminating these inefficient air conditioning systems (and their noisy cooling fans) means that the noise problems caused by the use of fans can be eliminated.

[0039] Furthermore, the composition of the fifth aspect of the present invention allows for improved cooling, which has the added benefit of increasing the power density of computing equipment, which is beneficial in reducing space requirements.

[0040] Preferably, the compositions of the third, fourth and fifth aspects are substantially free of water. By use of the term water-free, it is intended that the composition is completely free of water or has a low water content of less than about 1000 ppm, more preferably less than 500 ppm, more preferably less than 300 ppm, more preferably less than 200 ppm, and most preferably less than 100 ppm.

[0041] The compositions of the third, fourth, and fifth aspects may include a desiccant. Alternatively, the element in which the composition is used may have a desiccant incorporated therein or be adapted to work in conjunction with it. By way of example, the element may be configured or adapted to incorporate an optionally replaceable cartridge containing a desiccant. Experimental Examples

[0042] A series of experiments was conducted to determine the physical properties of 1,1,1,3-tetrafluoro-2-methoxypropane ("Ether A"), 1,1,1,3,3-pentafluoro-2-methoxypropane ("Ether B"), C4F9OCH3 (Novec 7100), and C4F9OC2H5 (Novec 7200).

[0043] Experiment 1: Determination of vapor pressure. The liquid to be measured was stored in a cylindrical test cell and the vapor pressure was determined. A magnetic stirrer was used to stir the liquid during the measurement, achieving rapid adjustment of the phase equilibrium in the measurement cell. The temperature of the test cell was regulated by a thermostatic bath. The temperature in the test cell was measured with a calibrated resistance thermometer (maximum error 0.05 K).

[0044] For pressure measurements, a Keller pressure transmitter (Serie 35 X HTC 30 absolute bar, error <±0.5% full scale error) was used.

number

[0045] The experimental vapor pressures are shown in Figure 1.

[0046] The vapor pressure curve for Novec 7100 was found to intersect with the vapor pressure curves for both Ether A and Ether B, indicating that binary mixtures of these ethers with Novec 7100 form azeotropic compositions.

[0047] Experiment 2: Determining liquid viscosity Dynamic viscosity was measured under static conditions using a Cambridge Viscosity flow-through viscometer. The measurement procedure is described in detail in ASTM D 7483-13a1. The viscometer was calibrated with a calibration liquid traceable to a national standard for viscosity (DKD or NIST calibration, respectively). Temperature was measured with a maximum deviation of 0.15 K. The maximum deviation in viscosity was 1% full scale or up to 5% of the measured value, depending on which value was lower.

[0048] The results for the four fluids are shown in Figure 2. It is clear that both Ether A and Ether B have lower viscosities than either Novec 7100 or Novec 7200.

[0049] Experiment 3: Determining liquid heat capacity Specific heat capacity measurements were performed using a Setaram μDSC VII differential scanning calorimeter. During the procedure, the heat applied to the reference material and the sample was measured over a range of temperatures. The sample was placed in a container and heated in 5 K steps at a temperature ramp rate of 0.2 K / min. At each 5 K temperature level, the temperature was held constant for 30 minutes, after which thermal equilibrium was reached. To compensate for the thermal influence of the container itself, a second empty container was heated in parallel in the DSC in the same order. The difference in the heat absorption behavior of the two empty containers was measured every 5 K using the same procedure and automatically subtracted. After the measurement and calibration run, the specific heat capacity was calculated as a function of temperature, the measured heat, and the sample weight. The measurements were verified with a fluid of known specific heat capacity. The uncertainty of the specific heat capacity measurement was less than 3%. The results are shown in Figure 3.

[0050] It is clear that both Ether A and Ether B have significantly higher heat capacities than either Novec 7100 or Novec 7200.

[0051] Experiment 4: Determining Liquid Density The liquid densities of each of Ether A, Ether B, Novec 7100, and Novec 7200 were measured at room temperature using a calibrated measuring cylinder and microbalance. The densities were found to be (kg / m 3 ): [Table 2]

[0052] The combination of the above properties indicates that both Ether A and Ether B require lower mass and volumetric flow rates of coolant to remove a given amount of heat from heat-generating electronic components or battery packs. This means that using these fluids as single-phase pump coolants results in a lower pressure drop through the cooling circuit, resulting in reduced pump power requirements compared to Novec fluids. Therefore, the combination of Ether A and Novec fluids improves the ability of the resulting liquid to remove heat when used as a single-phase coolant.

[0053] Example 6: Estimation of azeotrope formation Using the vapor pressure data determined in Experiment 1, a thermodynamic model was constructed based on the Peng-Robinson equation of state, allowing the prediction of the behavior of binary mixtures of Ether A and Ether B with Novec fluid. The necessary critical point parameters are given in the reference text, "The Properties of Gases and Liquids, 5 thThe vapor pressures were estimated using the Joback method described in the "Essays on Vapor Pressures in Fluids and Fluids" (pub. McGraw-Hill, 2000), edited by BE Poling, JM Prausnitz, and JP O'Connell. The Mathias Copeman temperature function described in Mathias PM and Copeman TW, "Extension of the Peng-Robinson Equation of State to Complex Mixtures: Evaluation of the Various Forms of the Local Composition Concept," Fluid Phase Equilib., 13, 91-108, 1983, was used to ensure that the model could accurately represent the vapor pressure of each fluid over the range for which experimental data were available.

[0054] Using this model, the formation of the binary minimum azeotrope between Novec 7100 and Ether A and Ether B was confirmed in the temperature range of 20–100 °C, which coincides with the typical operating temperature range of immersion coolants. [Brief explanation of the drawings]

[0055] [Figure 1] FIG. 1 shows the vapor pressure of ether. [Figure 2] FIG. 1 shows the viscosity of fluorinated ethers. [Figure 3] FIG. 1 shows the experimental heat capacity of ether.

Claims

1. A cooling liquid for cooling electrical / electronic components by direct immersion cooling, comprising the structure (of Compound 1) 【Chemistry 1】 (In the formula, R 1 is CF 3 , and R 2 is H and R 3 , R 4 However, independently, H, F, CF 3 , alkyl, fluoroalkyl; R 5 But independently, CF 3 1. A coolant comprising a partially fluorinated ether having a alkyl group selected from the group consisting of alkyl, fluoroalkyl, perfluoroalkyl, haloalkyl, and perfluorohaloalkyl.

2. The coolant of claim 1 , wherein the coolant is water-free.

3. a) R 5 is methyl, and R3 to R 4 are all H; or b) R 5 is methyl, and R 3 and R 4 One of the is F and R 3 and R 4 3. The coolant of claim 1, wherein one of

4. 4. The coolant of claim 1, 2 or 3, further comprising a non-flammable (partially or fully) fluorinated ether and / or a non-flammable (partially or fully) fluorinated ketone.

5. 5. The coolant of claim 4, comprising 1 to 99 wt. % of the partially fluorinated ether of Compound 1 and 1 to 99 wt. % of a non-flammable (partially or fully) fluorinated ether and / or a non-flammable (partially or fully) fluorinated ketone.

6. A cooling fluid for cooling high voltage power transmission components by direct immersion cooling, comprising: (Compound 1) of the structure 【Chemistry 2】 (In the formula, R 1 is CF 3 , and R 2 is H and R 3 , R 4 However, independently, H, F, CF 3 , alkyl, fluoroalkyl; R 5 But independently, CF 3 1. A coolant comprising a partially fluorinated ether having a alkyl group selected from the group consisting of alkyl, fluoroalkyl, perfluoroalkyl, haloalkyl, and perfluorohaloalkyl.

7. The coolant of claim 6 , wherein the coolant is water-free.

8. The coolant according to claim 6 or 7, wherein the high voltage power transmission elements include MV / HV transformers, circuit breakers, and switchgear.

9. a) R 5 is methyl, and R3 to R 4 are all H; or b) R 5 is methyl, and R 3 and R 4 One of the is F and R 3 and R 4 9. The coolant of claim 6, 7 or 8, wherein one of

10. The coolant according to any one of claims 6 to 9, further comprising a non-flammable (partially or fully) fluorinated ether and / or a non-flammable (partially or fully) fluorinated ketone.

11. 11. The coolant of claim 10, comprising 1 to 99 wt. % of the partially fluorinated ether of Compound 1 and 1 to 99 wt. % of a non-flammable (partially or fully) fluorinated ether and / or a non-flammable (partially or fully) fluorinated ketone.

12. A coolant for cooling electric vehicle components by direct immersion cooling, comprising: (Compound 1) of the structure 【Transformation 3】 (In the formula, R 1 is CF 3 , and R 2 is H and R 3 , R 4 However, independently, H, F, CF 3 , alkyl, fluoroalkyl; R 5 But independently, CF 3 1. A coolant comprising a partially fluorinated ether having a alkyl group selected from the group consisting of alkyl, fluoroalkyl, perfluoroalkyl, haloalkyl, and perfluorohaloalkyl.

13. The coolant of claim 12 , wherein the coolant is water-free.

14. 14. The coolant of claim 12 or 13, wherein the electric vehicle components include a battery, conductors (including any charge / discharge system components), a motor, and / or a gearbox.

15. a) R 5 is methyl, and R3 to R 4 are all H; or b) R 5 is methyl, and R 3 and R 4 One of the is F and R 3 and R 4 15. The coolant of claim 12, 13 or 14, wherein one of

16. The coolant according to any one of claims 12 to 15, further comprising a non-flammable (partially or fully) fluorinated ether and / or a non-flammable (partially or fully) fluorinated ketone.

17. 17. The coolant of claim 16, wherein the coolant comprises 1 to 99 wt. % of the partially fluorinated ether of Compound 1 and 1 to 99 wt. % of a non-flammable (partially or fully) fluorinated ether and / or a non-flammable (partially or fully) fluorinated ketone.

18. A coolant for cooling computer hardware components by direct immersion cooling, comprising the structure (of Compound 1): 【Chemistry 4】 (In the formula, R 1 is CF 3 , and R 2 is H and R 3 , R 4 However, independently, H, F, CF 3 , alkyl, fluoroalkyl; R 5 But independently, CF 3 1. A coolant comprising a partially fluorinated ether having a alkyl group selected from the group consisting of alkyl, fluoroalkyl, perfluoroalkyl, haloalkyl, and perfluorohaloalkyl.

19. 20. The coolant of claim 18, wherein the coolant is water-free.

20. 20. The cooling fluid of claim 18 or 19, wherein the computer hardware elements include servers in a data center.

21. a) R 5 is methyl, and R3 to R 4 are all H; or b) R 5 is methyl, and R 3 and R 4 One of the is F and R 3 and R 4 21. The coolant of claim 18, 19, or 20, wherein one of

22. The coolant according to any one of claims 18 to 21, further comprising a non-flammable (partially or fully) fluorinated ether and / or a non-flammable (partially or fully) fluorinated ketone.

23. 22. The coolant of claim 21, wherein the coolant comprises 1 to 99 wt. % of the partially fluorinated ether of Compound 1 and 1 to 99 wt. % of a non-flammable (partially or fully) fluorinated ether and / or a non-flammable (partially or fully) fluorinated ketone.

24. 24. A cooling liquid according to claim 4, 5, 10, 11, 16, 17, 22 or 23, which forms an azeotrope or a near-azeotrope.

25. 1,1,1,3-tetrafluoro-2-methoxypropane ("Ether A") or 1,1,1,3,3-pentafluoro-2-methoxypropane ("Ether B") (both of Compound 1) and C 4 F 9 OCH 3 25. The coolant of claim 24, comprising:

26. 10 to 90% by weight of C 4 F 9 OCH 3 and 10 to 90 wt. % 1,1,1,3-tetrafluoro-2-methoxypropane ("Ether A"), forming an azeotrope or near-azeotrope with 1,1,1,3-tetrafluoro-2-methoxypropane ("Ether A").

27. 5 to 70% by weight of C 4 F 9 OCH 3 and 30 to 95 wt. % 1,1,1,3,3-pentafluoro-2-methoxypropane ("Ether B").

28. Use of a cooling liquid according to any one of claims 1 to 27 for use in cooling electrical components by immersion cooling.

29. Use of a cooling liquid according to any one of claims 6 to 11 for use in cooling high voltage power transmission elements by immersion cooling.

30. Use of a coolant according to any one of claims 12 to 17 for use in cooling electric vehicle components.

31. Use of a cooling liquid according to any one of claims 18 to 23 for use in cooling computer hardware elements immersion cooling.