Photosensitive resin film, resist pattern forming method, and wiring pattern forming method

Abstract

To provide a photosensitive resin film having superior pattern formation capability, a resist pattern forming method using the same, and a wiring pattern forming method.SOLUTION: The present invention pertains to a photosensitive resin film that contains a binder polymer, a photo-polymerizable compound, a photoinitiator, and a polymerization inhibitor, and that has a thickness of 35-300 μm.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a photosensitive resin film, a method for forming a resist pattern, and a method for forming a wiring pattern. [Background technology]

[0002] In the field of manufacturing semiconductor integrated circuits (LSI) or wiring boards, photosensitive materials are used as resists for producing conductor patterns. For example, in the manufacture of wiring boards, a resist is formed using a photosensitive resin composition, and then a conductor pattern, metal posts, etc. are formed by plating. More specifically, a photosensitive layer is formed on a substrate using a photosensitive resin composition or the like, the photosensitive layer is exposed through a predetermined mask pattern, and then a development process is performed so that the parts where the conductor pattern, metal posts, etc. are to be formed can be selectively removed (peeled off), thereby forming a resist pattern (resist). Next, a conductor such as copper is formed on the removed parts by plating, and then the resist pattern is removed, thereby manufacturing a wiring board equipped with a conductor pattern, metal posts, etc. (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2000-356852 A [Patent Document 2] International Publication No. 2008 / 064803 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, in electronic components such as inductors, it has been considered to form wiring patterns with high aspect ratios by increasing the thickness of the conductor layer. However, in conventional thick-film photosensitive resists, light does not easily penetrate to the bottom of the photosensitive layer, and the pattern shape may deteriorate. Therefore, there is a demand for photosensitive resin films that have excellent pattern forming properties even when they are thick.

[0005] The present disclosure has been made in consideration of the above circumstances, and aims to provide a photosensitive resin film having excellent pattern formability, a method for forming a resist pattern using the same, and a method for forming a wiring pattern. [Means for solving the problem]

[0006] The photosensitive resin film according to the present disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a polymerization inhibitor, and has a thickness of 35 to 300 μm.

[0007] The polymerization inhibitor may include a catechol compound. The content of the polymerization inhibitor may be 0.01 to 0.3 parts by mass with respect to 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound.

[0008] The photosensitive resin film may further contain a pyrazoline compound as a photosensitizer.

[0009] The photopolymerizable compound may include a (meth)acrylate having a urethane bond, or may include a polyalkylene glycol di(meth)acrylate.

[0010] The method for forming a resist pattern according to the present disclosure includes the steps of providing a photosensitive layer on a substrate using the above-mentioned photosensitive resin film, irradiating at least a portion of the photosensitive layer with active light to form a photocured portion, and removing at least a portion of the photosensitive layer other than the photocured portion to form a resist pattern.

[0011] The method for forming a wiring pattern according to the present disclosure includes a step of plating a substrate on which a resist pattern has been formed by the method for forming a resist pattern described above to form a conductor pattern. The method for forming a wiring pattern may further include a step of removing a photocured portion after the plating process. Effect of the Invention

[0012] According to the present disclosure, it is possible to provide a photosensitive resin film having excellent pattern formability, a method for forming a resist pattern using the same, and a method for forming a wiring pattern. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic cross-sectional view showing one embodiment of a photosensitive resin film. [Diagram 2] 1A to 1C are diagrams illustrating an example of a process for forming a wiring pattern. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The present disclosure will be described in detail below. In this specification, a numerical range indicated using "~" indicates a range including the numerical values ​​before and after "~" as the minimum and maximum values, respectively. In addition, in a numerical range described in stages in this specification, the upper limit or lower limit of a numerical range of a certain stage may be replaced with the upper limit or lower limit of a numerical range of another stage. In a numerical range described in this specification, the upper limit or lower limit of the numerical range may be replaced with a value shown in an example.

[0015] In this specification, "(meth)acrylic acid" means at least one of "acrylic acid" and its corresponding "methacrylic acid", and the same applies to other similar expressions such as (meth)acrylate.

[0016] In this specification, the term "solid content" refers to the non-volatile content excluding volatile substances such as water and solvent contained in the photosensitive resin composition, and refers to components that do not volatilize and remain when the resin composition is dried, and also includes liquid, starch syrup, and wax-like substances at room temperature around 25°C.

[0017] [Photosensitive resin film] The photosensitive resin film according to this embodiment contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator and a polymerization inhibitor, and has a thickness of 35 to 300 μm. The photosensitive resin film can be produced using a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator and a polymerization inhibitor. Hereinafter, each component used in the photosensitive resin film and the photosensitive resin composition according to this embodiment will be described in detail.

[0018] ((A) Binder polymer) The (A) binder polymer (hereinafter also referred to as "component (A)") can be produced, for example, by radical polymerization of a polymerizable monomer. Examples of the polymerizable monomer include styrene or a styrene derivative, acrylamide such as diacetone acrylamide, acrylonitrile, ethers of vinyl alcohol such as vinyl-n-butyl ether, (meth)acrylic acid alkyl esters, (meth)acrylic acid benzyl ester, (meth)acrylic acid tetrahydrofurfuryl ester, (meth)acrylic acid dimethylaminoethyl ester, (meth)acrylic acid diethylaminoethyl ester, (meth)acrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, (meth)acrylic acid, α-bromoacrylic acid, α-chloroacrylic acid, β-furyl (meth)acrylic acid, β-styryl (meth)acrylic acid, maleic acid, maleic anhydride, maleic acid monoesters such as monomethyl maleate, monoethyl maleate, and monoisopropyl maleate, fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, and propiolic acid. The polymerizable monomers can be used alone or in combination of two or more.

[0019] From the viewpoint of alkaline developability, the component (A) may have a carboxy group. The component (A) having a carboxy group can be produced, for example, by radical polymerization of a polymerizable monomer having a carboxy group with another polymerizable monomer. The polymerizable monomer having a carboxy group may be (meth)acrylic acid or methacrylic acid.

[0020] From the viewpoint of improving the alkali developability and alkali resistance in a well-balanced manner, the content of the structural unit based on the polymerizable monomer having a carboxy group may be 10 to 50 mass%, 15 to 40 mass%, or 20 to 35 mass%, based on the total amount of component (A). When the carboxy group content is 10 mass% or more, the alkali developability tends to be improved, and when it is 50 mass% or less, the alkali resistance tends to be excellent.

[0021] The acid value of the component (A) having a carboxy group may be 50 to 250 mgKOH / g, 50 to 200 mgKOH / g, or 100 to 200 mgKOH / g.

[0022] From the viewpoint of adhesion and peeling properties, the component (A) may have a structural unit based on styrene or a styrene derivative. The styrene derivative is a polymerizable compound in which a hydrogen atom is substituted at the α-position or aromatic ring of styrene, such as vinyltoluene or α-methylstyrene. The content of the structural unit based on styrene or a styrene derivative in the component (A) may be 10 to 60 mass%, 15 to 50 mass%, 35 to 50 mass%, or 40 to 50 mass%. When this content is 10 mass% or more, adhesion tends to be improved, and when it is 60 mass% or less, it is possible to suppress the size of peeled pieces during development, and the time required for peeling tends to be suppressed from being long.

[0023] From the viewpoints of resolution and aspect ratio, the component (A) may have a structural unit based on a benzyl (meth)acrylic acid ester. From the viewpoints of improving the resolution and aspect ratio, the content of the structural unit derived from a benzyl (meth)acrylic acid ester in the component (A) may be 10 to 40 mass%, 15 to 35 mass%, or 20 to 30 mass%.

[0024] From the viewpoint of improving plasticity, the component (A) may have a structural unit based on a (meth)acrylic acid alkyl ester. Examples of the (meth)acrylic acid alkyl ester include (meth)acrylic acid methyl ester, (meth)acrylic acid ethyl ester, (meth)acrylic acid propyl ester, (meth)acrylic acid butyl ester, (meth)acrylic acid pentyl ester, (meth)acrylic acid hexyl ester, (meth)acrylic acid heptyl ester, (meth)acrylic acid octyl ester, (meth)acrylic acid 2-ethylhexyl ester, (meth)acrylic acid nonyl ester, (meth)acrylic acid decyl ester, (meth)acrylic acid undecyl ester, and (meth)acrylic acid dodecyl ester.

[0025] The weight average molecular weight (Mw) of the (A) component may be 10,000 to 300,000, 150,000 to 150,000, 200,000 to 100,000, or 25,000 to 80,000. When the (A) component has an Mw of 10,000 or more, it tends to have excellent developer resistance, and when it is 300,000 or less, it tends to prevent the development time from becoming long. The (A) component may have a dispersity (weight average molecular weight / number average molecular weight) of 1.0 to 3.0, or 1.0 to 2.0. When the dispersity is smaller, the resolution tends to improve.

[0026] The weight average molecular weight and number average molecular weight in this specification are values ​​measured by gel permeation chromatography (GPC) and converted using standard polystyrene as a standard sample.

[0027] The component (A) may be used alone or in combination of two or more. When two or more types of the component (A) are used in combination, examples of the component (A) include two or more binder polymers made of different polymerizable monomers, two or more binder polymers having different Mw, and two or more binder polymers having different dispersities.

[0028] The content of the component (A) may be 30 to 80 parts by mass, 40 to 75 parts by mass, 50 to 70 parts by mass, or 50 to 60 parts by mass, relative to 100 parts by mass of the total amount of the component (A) and the component (B) described below. When the content of the component (A) is within this range, the strength of the photocured part of the photosensitive resin film and the photosensitive layer is improved.

[0029] ((B) Photopolymerizable compound) As the (B) photopolymerizable compound (hereinafter also referred to as "(B) component"), a compound having at least one ethylenically unsaturated bond in the molecule can be used. The (B) component can be used alone or in combination of two or more.

[0030] The ethylenically unsaturated bond of the (B) component is not particularly limited as long as it is photopolymerizable. Examples of the ethylenically unsaturated bond include α,β-unsaturated carbonyl groups such as (meth)acryloyl groups. Examples of the photopolymerizable compound having an α,β-unsaturated carbonyl group include α,β-unsaturated carboxylic acid esters of polyhydric alcohols, bisphenol-type (meth)acrylates, α,β-unsaturated carboxylic acid adducts of glycidyl group-containing compounds, (meth)acrylates having urethane bonds, nonylphenoxypolyethyleneoxyacrylates, (meth)acrylates having a phthalic acid skeleton, and (meth)acrylic acid alkyl esters.

[0031] Examples of α,β-unsaturated carboxylic acid esters of polyhydric alcohols include polyethylene glycol di(meth)acrylates having 2 to 14 ethylene groups, polypropylene glycol di(meth)acrylates having 2 to 14 propylene groups, polyethylene-polypropylene glycol di(meth)acrylates having 2 to 14 ethylene groups and 2 to 14 propylene groups, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO,PO-modified trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, and (meth)acrylate compounds having a skeleton derived from dipentaerythritol or pentaerythritol. "EO modified" means that it has a block structure of ethylene oxide (EO) groups, and "PO modified" means that it has a block structure of propylene oxide (PO) groups.

[0032] From the viewpoint of improving the flexibility of the resist pattern, the component (B) may contain a polyalkylene glycol di(meth)acrylate. The polyalkylene glycol di(meth)acrylate may have at least one of an EO group and a PO group, or may have both an EO group and a PO group. In the polyalkylene glycol di(meth)acrylate having both an EO group and a PO group, the EO group and the PO group may each be present in a continuous block form or may be present randomly. In addition, the PO group may be either an oxy-n-propylene group or an oxyisopropylene group. In the (poly)oxyisopropylene group, the secondary carbon of the propylene group may be bonded to an oxygen atom, and the primary carbon may be bonded to an oxygen atom.

[0033] Commercially available polyalkylene glycol di(meth)acrylates include, for example, FA-023M (manufactured by Hitachi Chemical Co., Ltd.), FA-024M (manufactured by Hitachi Chemical Co., Ltd.), and NK Ester HEMA-9P (manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0034] From the viewpoint of improving the flexibility of the resist pattern, the component (B) may contain a (meth)acrylate having a urethane bond. Examples of the (meth)acrylate having a urethane bond include an addition reaction product of a (meth)acrylic monomer having an OH group at the β-position with a diisocyanate (isophorone diisocyanate, 2,6-toluene diisocyanate, 2,4-toluene diisocyanate, 1,6-hexamethylene diisocyanate, etc.), tris((meth)acryloxytetraethylene glycol isocyanate)hexamethylene isocyanurate, EO-modified urethane di(meth)acrylate, and EO,PO-modified urethane di(meth)acrylate.

[0035] Commercially available EO-modified urethane di(meth)acrylate products include, for example, "UA-11" and "UA-21EB" (manufactured by Shin-Nakamura Chemical Co., Ltd.). Commercially available EO,PO-modified urethane di(meth)acrylate products include, for example, "UA-13" (manufactured by Shin-Nakamura Chemical Co., Ltd.).

[0036] From the viewpoint of facilitating the formation of a thick resist pattern and improving resolution and adhesion in a well-balanced manner, the component (B) may contain a (meth)acrylate compound having a skeleton derived from dipentaerythritol or pentaerythritol. The (meth)acrylate compound having a skeleton derived from dipentaerythritol preferably has four or more (meth)acryloyl groups, and may be dipentaerythritol penta(meth)acrylate or dipentaerythritol hexa(meth)acrylate.

[0037] The component (B) may contain a polyfunctional (meth)acrylate compound obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid. The polyfunctional (meth)acrylate compound may have at least one of an EO group and a PO group, or may have both an EO group and a PO group. As such a compound, dipentaerythritol (meth)acrylate having an EO group can be used. As a commercially available product of dipentaerythritol (meth)acrylate having an EO group, for example, DPEA-12 (manufactured by Nippon Kayaku Co., Ltd.) can be mentioned.

[0038] From the viewpoint of improving the resolution and release properties after curing, the (B) component may contain a bisphenol type (meth)acrylate, and among the bisphenol type (meth)acrylates, it may contain a bisphenol A type (meth)acrylate. Examples of the bisphenol A type (meth)acrylate include 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolybutoxy)phenyl)propane, and 2,2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane. Among them, from the viewpoint of further improving the resolution and pattern formability, 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane is preferred.

[0039] Commercially available examples include 2,2-bis(4-((meth)acryloxydipropoxy)phenyl)propane, BPE-200 (Shin-Nakamura Chemical Co., Ltd.), and 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane, BPE-500 (Shin-Nakamura Chemical Co., Ltd.), and FA-321M (Hitachi Chemical Co., Ltd.).

[0040] Examples of nonylphenoxy polyethyleneoxyacrylates include nonylphenoxytetraethyleneoxyacrylate, nonylphenoxypentaethyleneoxyacrylate, nonylphenoxyhexaethyleneoxyacrylate, nonylphenoxyheptaethyleneoxyacrylate, nonylphenoxyoctaethyleneoxyacrylate, nonylphenoxynonaethyleneoxyacrylate, nonylphenoxydecaethyleneoxyacrylate, and nonylphenoxyundecaethyleneoxyacrylate.

[0041] Examples of (meth)acrylates having a phthalic acid skeleton include γ-chloro-β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β'-(meth)acryloyloxyethyl-o-phthalate, and β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate. γ-Chloro-β-hydroxypropyl-β'-methacryloyloxyethyl-o-phthalate is commercially available as FA-MECH (Hitachi Chemical Co., Ltd.).

[0042] ((C) Photopolymerization initiator) The (C) photopolymerization initiator (hereinafter also referred to as "(C) component") is not particularly limited as long as it can polymerize the (B) component, and can be appropriately selected from commonly used photopolymerization initiators. The (C) component may contain a hexaarylbiimidazole derivative or an acridine compound having one or more acridinyl groups in order to improve the sensitivity and resolution in a well-balanced manner. The (C) component may be used alone or in combination of two or more.

[0043] Examples of the hexaarylbiimidazole derivatives include 2-(o-chlorophenyl)-4,5-diphenylbiimidazole, 2,2',5-tris-(o-chlorophenyl)-4-(3,4-dimethoxyphenyl)-4',5'-diphenylbiimidazole, 2,4-bis-(o-chlorophenyl)-5-(3,4-dimethoxyphenyl)-diphenylbiimidazole, 2,4,5-tris-(o-chlorophenyl)-diphenylbiimidazole, 2-(o-chlorophenyl)-bis-4,5-(3,4-dimethoxyphenyl)-biimidazole, 2, 2'-bis-(2-fluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3-difluoromethylphenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,4-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, and 2,2'-bis-(2,5-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole.

[0044] Examples of the acridine compound include 9-phenylacridine, 9-(p-methylphenyl)acridine, 9-(m-methylphenyl)acridine, 9-(p-chlorophenyl)acridine, 9-(m-chlorophenyl)acridine, 9-aminoacridine, 9-dimethylaminoacridine, 9-diethylaminoacridine, 9-pentylaminoacridine, 1,2-bis(9-acridinyl)ethane, 1,4-bis(9-acridinyl)butane, 1,6-bis(9-acridinyl)hexane, 1,8-bis(9-acridinyl)octane, Examples of the bis(9-acridinyl)alkanes include 1,10-bis(9-acridinyl)decane, 1,12-bis(9-acridinyl)dodecane, 1,14-bis(9-acridinyl)tetradecane, 1,16-bis(9-acridinyl)hexadecane, 1,18-bis(9-acridinyl)octadecane, and 1,20-bis(9-acridinyl)eicosane, 1,3-bis(9-acridinyl)-2-oxapropane, 1,3-bis(9-acridinyl)-2-thiapropane, and 1,5-bis(9-acridinyl)-3-thiapentane.

[0045] The content of component (C) may be 0.1 to 10 parts by mass, 1 to 5 parts by mass, or 2 to 4.5 parts by mass, relative to 100 parts by mass of the total amount of components (A) and (B). When the content of component (C) is 0.1 part by mass or more, photosensitivity, resolution, and adhesion tend to be improved, and when it is 10 parts by mass or less, resist pattern formability tends to be better.

[0046] (D) Polymerization inhibitor The photosensitive resin film according to the present embodiment can improve pattern formability by containing (D) a polymerization inhibitor (hereinafter also referred to as "component (D)"). The component (D) can be used alone or in combination of two or more.

[0047] From the standpoint of further improving pattern formability, the component (D) may contain a compound represented by the following formula (I). [ka]

[0048] In formula (I), R 5 represents a halogen atom, a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an amino group, an aryl group, a mercapto group, an alkylmercapto group having 1 to 10 carbon atoms, a carboxylalkyl group having 1 to 10 carbon atoms in the alkyl group, an alkoxy group or a heterocyclic group having 1 to 20 carbon atoms; m and n are integers selected such that m is an integer of 2 or more and n is an integer of 0 or more and m+n=6; when n is an integer of 2 or more, R 5 may be the same or different. The aryl group may be substituted with an alkyl group having 1 to 20 carbon atoms.

[0049] R 5 From the viewpoint of further improving the compatibility with the component (A), R may be a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. 5 The alkyl group having 1 to 20 carbon atoms represented by the formula (I) may be an alkyl group having 1 to 4 carbon atoms. m may be 2 or 3, or may be 2, from the viewpoint of further improving the resolution.

[0050] Examples of the compound represented by the above general formula (I) include catechol compounds such as catechol, 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol, 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-tert-butylcatechol, 3-tert-butylcatechol, 4-tert-butylcatechol, and 3,5-di-tert-butylcatechol; resorcinol (resorcin), 2-methylresorcinol, 4-methylresorcinol, and the like. resorcinol compounds such as orcinol, 5-methylresorcinol (orcin), 2-ethylresorcinol, 4-ethylresorcinol, 2-propylresorcinol, 4-propylresorcinol, 2-n-butylresorcinol, 4-n-butylresorcinol, 2-tert-butylresorcinol, and 4-tert-butylresorcinol; hydroquinone compounds such as 1,4-hydroquinone, methylhydroquinone, ethylhydroquinone, propylhydroquinone, tert-butylhydroquinone, and 2,5-di-tert-butylhydroquinone; and trihydric phenol compounds such as pyrogallol and phloroglucinol.

[0051] In order to improve the resolution, the component (D) may contain a catechol compound. As the catechol compound, 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol, 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-tert-butylcatechol, 3-tert-butylcatechol, 4-tert-butylcatechol, 3,5-di-tert-butylcatechol and other alkylcatechols are preferred, and 3-tert-butylcatechol, 4-tert-butylcatechol, or 3,5-di-tert-butylcatechol is more preferred.

[0052] The content of the (D) component may be 0.01 to 0.3 parts by mass, 0.02 to 0.2 parts by mass, 0.025 to 0.15 parts by mass, or 0.03 to 0.1 parts by mass, based on 100 parts by mass of the total amount of the (A) and (B) components. By setting the content of the (D) component to 0.3 parts by mass or less, the exposure time can be shortened. By setting the content of the (D) component to 0.01 parts by mass or more, the photoreaction of the photocured portion can be sufficiently advanced, and pattern formability can be further improved.

[0053] (Component (E): Photosensitizer) The photosensitive resin film and photosensitive resin composition according to the present embodiment may further contain (E) a photosensitizer (hereinafter also referred to as "component (E)"). By containing component (E), it is possible to effectively utilize the absorption wavelength of the actinic ray used for exposure. The component (E) may be used alone or in combination of two or more.

[0054] Examples of the component (E) include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds. The component (E) may contain a pyrazoline compound from the viewpoint of further improving the resolution.

[0055] Examples of pyrazoline compounds include 1-(4-methoxyphenyl)-3-styryl-5-phenyl-pyrazoline, 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1,5-bis-(4-methoxyphenyl)-3-(4-methoxystyryl)-pyrazoline, 1-(4-isopropylphenyl)-3-styryl-5-phenyl-pyrazoline, 1-phenyl-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline, 1,5-bis-(4-isopropylphenyl)-3-(4- isopropylstyryl)-pyrazoline, 1-(4-methoxyphenyl)-3-(4-tert-butyl-styryl)-5-(4-tert-butyl-phenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1-(4-isopropyl-phenyl)-3-(4-tert-butyl-styryl)-5-(4-tert-butyl-phenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(4-isopropyl-styryl)-5-(4-isopropyl 1-(4-methoxyphenyl)-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline, 1-(4-isopropyl-phenyl)-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1-phenyl-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,6-dimethoxystyryl)-5 -(2,6-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,5-dimethoxystyryl)-5-(2,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(2,6-dimethoxystyryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(2,5-dimethoxystyryl)-5-(2,5-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(2,4-dimethoxystyryl)-5-(2 ,4-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(2,6-dimethoxystyryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(2,5-dimethoxystyryl)-5 -(2,5-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl)-pyrazoline, 1-(4-isopropyl-phenyl)-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-(4-isopropyl-phenyl)-3-(3,4-dimethoxystyryl)-5- (3,4-dimethoxyphenyl)-pyrazoline, 1-(4-isopropyl-phenyl)-3-(2,6-dimethoxystyryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-(4-isopropyl-phenyl)-3-(2,5-dimethoxystyryl)-5-(2,5-dimethoxyphenyl)-pyrazoline, 1-(4-isopropyl-phenyl)-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, and 1-(4-isopropyl-phenyl)-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl)-pyrazoline.

[0056] From the viewpoints of ease of synthesis and improving sensitivity, 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline is preferred, and from the viewpoints of ease of synthesis and improving solubility, 1-phenyl-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline is preferred.

[0057] From the viewpoint of improving photosensitivity and resolution, the content of the component (E) may be 0.01 to 5 parts by mass, 0.01 to 1 part by mass, or 0.01 to 0.2 parts by mass relative to 100 parts by mass of the total amount of the components (A) and (B).

[0058] (Other Ingredients) The photosensitive resin film and photosensitive resin composition according to the present embodiment may further contain leuco crystal violet in addition to the above-mentioned components. This can improve the photosensitivity and resolution of the photosensitive resin film in a more balanced manner. Leuco crystal violet has properties as a photocoloring agent that absorbs light and develops a specific color, and it is believed that the above-mentioned effects are achieved due to these properties.

[0059] The content of leuco crystal violet may be 0.01 to 10 parts by mass, 0.05 to 5 parts by mass, or 0.1 to 3 parts by mass relative to 100 parts by mass of the total amount of the components (A) and (B).

[0060] The photosensitive resin film and photosensitive resin composition of the present embodiment may further contain, as necessary, a dye such as malachite green, a photocoloring agent other than tribromophenyl sulfone and leuco crystal violet, a thermal coloring inhibitor, a plasticizer such as p-toluenesulfonamide, a pigment, a filler, a defoamer, a flame retardant, a stabilizer, an adhesion imparting agent, a leveling agent, a peeling promoter, an antioxidant, a fragrance, an imaging agent, a thermal crosslinking agent, and the like.

[0061] Fig. 1 is a schematic cross-sectional view showing one embodiment of a photosensitive resin film. The photosensitive resin film 1 according to this embodiment may be formed on a support film 2 using the above-mentioned photosensitive resin composition. The photosensitive resin film according to this embodiment can be used in the form of a photosensitive element including the support film 2 and the photosensitive resin film 1 provided on the support film 2 as shown in Fig. 1.

[0062] The thickness of the photosensitive resin film 1 is 35 to 300 μm. From the viewpoint of formability of a wiring pattern with a high aspect ratio, the thickness of the photosensitive resin film 1 may be 40 μm or more, 45 μm or more, or 50 μm or more. From the viewpoint of peelability of the photosensitive resin film, the thickness of the photosensitive resin film 1 may be 250 μm or less, 200 μm or less, or 150 μm or less.

[0063] Examples of the support film include polyester films such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene-2,6-naphthalate (PEN), and polyolefin films such as polypropylene and polyethylene.

[0064] The haze of the support film may be 0.01 to 5.0%, 0.01 to 1.5%, 0.01 to 1.0%, or 0.01 to 0.5%. Haze refers to a value measured using a commercially available haze meter (turbidity meter) in accordance with the method specified in JIS K7105. Haze can be measured, for example, using a commercially available turbidity meter such as NDH-5000 (product name, manufactured by Nippon Denshoku Industries Co., Ltd.).

[0065] The thickness of the support film may be 1 to 200 μm, 1 to 100 μm, 1 to 60 μm, 5 to 60 μm, 10 to 60 μm, 10 to 50 μm, 10 to 40 μm, 10 to 30 μm, or 10 to 25 μm. When the thickness of the support film is 1 μm or more, the support film tends to be prevented from being torn when peeled off. In addition, when the thickness of the support film is 200 μm or less, economic benefits tend to be easily obtained.

[0066] A protective film may be laminated on the surface of the photosensitive resin film 1 opposite to the support film 2. As the protective film, a polymer film such as polyethylene or polypropylene may be used. The same polymer film as the support film may be used, or a different polymer film may be used. It is preferable that the adhesive strength between the protective film and the photosensitive resin film 1 is smaller than the adhesive strength between the support film 2 and the photosensitive resin film 1.

[0067] The photosensitive resin film 1 can be formed, for example, by applying a photosensitive resin composition onto a support film 2 and then drying the composition. The application can be carried out by using a known method such as roll coating, comma coating, gravure coating, air knife coating, die coating, bar coating, etc. Drying can be carried out at 70 to 150° C. for about 5 to 30 minutes.

[0068] When applying the photosensitive resin composition onto the support film 2, a solvent may be added to the photosensitive resin composition to use a solution having a solid content of about 30 to 60% by mass, if necessary. Examples of the solvent include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, and propylene glycol monomethyl ether. The solvent may be used alone or in combination of two or more. In this case, the amount of the remaining solvent in the photosensitive resin film is preferably 2% by mass or less in order to prevent the diffusion of the solvent in the subsequent steps.

[0069] The form of the photosensitive element is not particularly limited. For example, it may be in the form of a sheet, or may be wound in the form of a roll around a core. When wound in the form of a roll, it may be wound so that the support film is on the outside. Examples of the core include plastics such as polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, and ABS resin (acrylonitrile-butadiene-styrene copolymer).

[0070] An end separator may be provided on the end surface of the roll-shaped photosensitive element for end surface protection, or a moisture-proof end surface separator may be provided for edge fusion resistance. The photosensitive element may be wrapped in a black sheet with low moisture permeability for packaging.

[0071] The photosensitive resin film according to this embodiment has excellent pattern formability, and therefore a resist pattern with a high aspect ratio can be formed.

[0072] [Method of forming resist pattern] The method for forming a resist pattern according to this embodiment includes a step of providing a photosensitive layer on a substrate using the above-mentioned photosensitive resin film (hereinafter also referred to as a "photosensitive forming step"); a step of irradiating at least a part of the photosensitive layer with active light rays to form a photocured portion (hereinafter also referred to as an "exposure step"); and a step of removing at least a part of the photosensitive layer other than the photocured portion to form a resist pattern (hereinafter also referred to as a "development step"). The resist pattern can be said to be a photocured product pattern of the photosensitive resin film or a relief pattern. The method for forming a resist pattern can also be said to be a method for manufacturing a substrate with a resist pattern.

[0073] In the photosensitive layer forming step, when the photosensitive element is used, if the photosensitive element has a protective film, this is removed, and then the photosensitive resin film is heated to about 70 to 130° C. while applying a pressure of about 0.1 to 1 MPa (1 to 10 kgf / cm ) to the substrate under reduced pressure or normal pressure. 2 The photosensitive layer is formed on the substrate by laminating the layers under pressure (approximately 1000 MPa). As the substrate, for example, a copper-clad laminate having copper foil on one or both sides of a layer made of an insulating material such as glass fiber reinforced epoxy resin is used.

[0074] In the exposure step, the support film is removed or the photosensitive layer is exposed to active light rays through the support film. Examples of the exposure method include a method of irradiating the active light rays imagewise through a negative or positive mask pattern called artwork (mask exposure method), a method of irradiating the active light rays imagewise by a projection exposure method, and a method of irradiating the active light rays imagewise by a direct writing exposure method such as an LDI (Laser Direct Imaging) exposure method or a DLP (Digital Light Processing) exposure method.

[0075] As the light source of the actinic rays, a known light source can be used, for example, a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, a xenon lamp, a gas laser such as an argon laser, a solid-state laser such as a YAG laser, a semiconductor laser, etc., which effectively radiate ultraviolet rays and visible light, can be used.

[0076] From the viewpoint of improving adhesion, post-exposure bake (PEB) may be performed after exposure and before development. The temperature when performing PEB may be 50 to 100° C. As the heater, a hot plate, a box-type dryer, a heating roll, or the like may be used.

[0077] In the developing step, at least a portion of the photosensitive layer other than the photocured portion is removed from the substrate, thereby forming a resist pattern on the substrate.

[0078] When a support film is present on the photosensitive layer, the support film is removed, and then the areas other than the photocured areas (which can also be called unexposed areas) are removed (developed). There are two development methods, wet development and dry development, but wet development is widely used.

[0079] In the case of wet development, a developer corresponding to the photosensitive resin composition is used, and development is performed by a known development method. Examples of the development method include a dip method, a paddle method, a spray method, a brushing method, a slapping method, a scrubbing method, a swinging immersion method, etc., and from the viewpoint of improving the resolution, a high-pressure spray method may be used. Development may be performed by combining two or more of these methods.

[0080] The composition of the developer is appropriately selected depending on the composition of the photosensitive resin composition. Examples of the developer include an alkaline aqueous solution and an organic solvent developer.

[0081] From the viewpoint of safety, stability, and good operability, an alkaline aqueous solution may be used as the developer. Examples of the base of the alkaline aqueous solution include alkali hydroxides such as lithium, sodium, or potassium hydroxide; alkali carbonates such as lithium, sodium, potassium, or ammonium carbonates or bicarbonates; alkali metal phosphates such as potassium phosphate and sodium phosphate; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; borax, sodium metasilicate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethylenetriamine, 2-amino-2-hydroxymethyl-1,3-propanediol, 1,3-diaminopropanol-2, and morpholine.

[0082] Examples of the alkaline aqueous solution used for development include a 0.1 to 5% by mass aqueous sodium carbonate solution, a 0.1 to 5% by mass aqueous potassium carbonate solution, and a 0.1 to 5% by mass aqueous sodium hydroxide solution. The pH of the alkaline aqueous solution may be in the range of 9 to 11, and the temperature of the alkaline aqueous solution can be adjusted according to the developability of the photosensitive layer.

[0083] In the alkaline aqueous solution, for example, a surfactant, an antifoaming agent, a small amount of an organic solvent for promoting development, etc. may be mixed. Examples of organic solvents used in the alkaline aqueous solution include acetone, ethyl acetate, an alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether. Examples of organic solvents used in the organic solvent developer include 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and γ-butyrolactone. To prevent ignition, water may be added to the organic solvent to make the organic solvent developer in a range of 1 to 20% by mass.

[0084] In the method for forming a resist pattern in this embodiment, after removing the uncured portion in the development step, heating at about 60 to 250° C. or applying 0.2 to 10 J / cm 2 is performed as necessary. 2 The method may further include a step of hardening the resist pattern by exposure to light of about 1000 nm.

[0085] [Wiring pattern formation method] The method for forming a wiring pattern according to the present embodiment includes a step of forming a conductor pattern by plating a substrate on which a resist pattern has been formed by the method for forming a resist pattern described above. The method for forming a wiring pattern may further include a step of removing the photocured portion after the plating process.

[0086] In the plating process, the resist pattern formed on the substrate having the conductor layer is used as a mask to plate copper, solder, etc. on the conductor layer of the substrate that is not covered with the resist. After the plating process, the resist is removed by removing the resist pattern as described below, and the conductor layer that was covered with the resist is further etched to form the conductor pattern.

[0087] The plating method may be either electrolytic plating or electroless plating, and more preferably electroless plating. Examples of electroless plating include copper plating such as copper sulfate plating and copper pyrophosphate plating, solder plating such as high-throw solder plating, nickel plating such as Watts bath (nickel sulfate-nickel chloride) plating and nickel sulfamate plating, and gold plating such as hard gold plating and soft gold plating.

[0088] After the plating process, the resist pattern on the substrate is removed. The resist pattern can be removed, for example, by stripping with an aqueous solution that is more strongly alkaline than the aqueous solution used in the development process. As the aqueous solution of the strong alkali, for example, an aqueous solution of 1 to 10% by mass of sodium hydroxide, an aqueous solution of 1 to 10% by mass of potassium hydroxide, etc. can be used. Among these, an aqueous solution of 1 to 5% by mass of sodium hydroxide or an aqueous solution of potassium hydroxide can be used.

[0089] When the resist pattern is removed after the plating process, the conductor layer covered with the resist is etched by an etching process to form a conductor pattern, thereby manufacturing a desired printed wiring board. The method of the etching process is appropriately selected depending on the conductor layer to be removed. For example, the above-mentioned etching solution can be used.

[0090] Methods for removing the resist pattern include, for example, a dipping method and a spray method, which may be used alone or in combination.

[0091] FIG. 2 shows one embodiment of a process for forming a wiring pattern using the photosensitive resin film according to this embodiment.

[0092] In (a) of FIG. 2, a photosensitive resin film 1 is laminated on a substrate 10 on which a conductor layer is formed on an insulating layer in the photosensitive layer forming step to form a photosensitive layer 20. In (b) of FIG. 2, an active light ray 30 is irradiated onto the photosensitive layer 20 in the exposure step to form a photocured portion in the photosensitive layer 20. In (c) of FIG. 2, a resist pattern 22, which is a photocured portion, is formed on the substrate 10 in the development step by removing the region from the substrate other than the photocured portion formed in the exposure step. In (d) of FIG. 2, a plating layer 40 is formed on the substrate 10 that is not covered with resist by plating using the resist pattern 22 as a mask. In (e) of FIG. 2, a conductor pattern 42 is formed by peeling off the resist pattern 22, which is a photocured portion, with a strong alkaline aqueous solution.

[0093] The photosensitive resin film according to this embodiment has excellent pattern formability even when it is a thick film, and therefore can be suitably used for producing electronic circuit boards such as inductors. EXAMPLES

[0094] Hereinafter, the objects and advantages of the present embodiment will be described more specifically based on examples and comparative examples, but the present embodiment is not limited to the following examples.

[0095] [Preparation of photosensitive resin film] (Examples 1 to 5 and Comparative Example 1) The components shown in Table 1 were mixed in the amounts shown in the table (the units of values ​​in the table are parts by mass, and in the case of a solution, the amounts are converted to solid content) to prepare a solution of a photosensitive resin composition.

[0096] The solution of the photosensitive resin composition was uniformly applied onto a 16 μm-thick polyethylene terephthalate (PET) film (manufactured by Toray Industries, Inc., product name: FB-40) and dried at 70° C. for 10 minutes and at 100° C. for 10 minutes using a hot air convection dryer, thereby forming a photosensitive resin film consisting of the above-mentioned photosensitive resin composition on one side of the PET film as a support film.

[0097] Details of each component shown in Table 1 are as follows.

[0098] (Component (A)) A-1: Ethylene glycol monomethyl ether / toluene solution (solid content: 47% by mass) of a copolymer of methacrylic acid / styrene / benzyl methacrylate (mass ratio: 32 / 45 / 23, Mw: 51000)

[0099] ((B) component) FA-321M: 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane (Hitachi Chemical Co., Ltd., number of EO groups: 10 (average value)) FA-024M: Polyalkylene glycol dimethacrylate (Hitachi Chemical Co., Ltd., number of EO groups: 12 (average value), number of PO groups: 4 (average value)) DPEA-12: Dipentaerythritol hexaacrylate having an EO group (Nippon Kayaku Co., Ltd., number of EO groups: 12 (average value)) UA-21EB: Triacrylate with urethane bond (Shin-Nakamura Chemical Co., Ltd.)

[0100] (Component (C): Photopolymerization initiator) B-CIM: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (Changzhou Strong Electronic New Materials Co., Ltd.)

[0101] (Component (D): Polymerization inhibitor) TBC: 4-tert-butylcatechol (DIC Corporation)

[0102] (Component (E): Photosensitizer) PZ-501D: 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)pyrazoline (Nippon Chemical Industry Co., Ltd.)

[0103] (Color former) LCV: Leuco Crystal Violet (Yamada Chemical Industry Co., Ltd.) (dye) MKG: Malachite Green (Osaka Organic Chemical Industry Ltd.) (Adhesion promoter) SF-808H: A mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol (Sanwa Chemical Co., Ltd.)

[0104] [resolution] A copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., product name "MCL-E-67") in which copper foil (thickness: 12 μm) was laminated on both sides of a glass fiber reinforced epoxy resin layer was washed with water, pickled, and washed with water, and then dried with an air flow. Next, the copper-clad laminate was heated to 80°C, and a photosensitive resin film was laminated on the copper surface of the copper-clad laminate. The lamination was performed using a heat roll at 110°C, with a pressure of 0.4 MPa and a roll speed of 1.0 m / min. In this way, a laminate in which the copper-clad laminate, the photosensitive layer, and the PET film were laminated in this order was obtained.

[0105] A phototool having a 41-step tablet with a density range of 0.00 to 2.00, density step of 0.05, tablet size of 20 mm x 187 mm, and each step size of 3 mm x 12 mm was placed on the PET film of the laminate as a negative mask. Next, the photosensitive layer was exposed to a predetermined amount of energy using a parallel light exposure device (manufactured by Oak Manufacturing Co., Ltd., product name "EXM-1201") with a high-pressure mercury lamp as a light source.

[0106] On the PET film of the laminate, photomask Hitachi test pattern No. G2 (negative for resolution evaluation: has a wiring pattern with line width / space width of x / x (x: 30-200, unit: μm)) and No. 3 (negative for resolution evaluation: has a wiring pattern with line width / space width of x / x (x: 6-47, unit: μm)) were used as negatives for resolution evaluation, and exposure was performed with an energy amount that resulted in 14.0 remaining steps after development of the Hitachi 41-step step tablet. After exposure, the PET film was peeled off, and a 1% by mass sodium carbonate aqueous solution at 30°C was sprayed for twice the shortest development time (the shortest time for the unexposed part to be removed) to remove the unexposed part.

[0107] After development, the space portion (unexposed portion) was completely removed, and the line portion (exposed portion) was formed without wobbling or chipping. The resolution was evaluated based on the smallest line width / space width value among the resist patterns. The resolution was evaluated based on the minimum space width. The smaller this value, the better the resolution.

[0108] [Flexibility] The copper-clad laminate was changed to an FPC board (manufactured by Nikkan Industries Co., Ltd., product name: F-30VC1, board thickness: 25 μm, copper thickness: 18 μm), and a laminate was obtained in which the FPC board, photosensitive layer, and PET film were laminated in this order.

[0109] The photosensitive layer was photocured by exposing the laminate from the PET film side using a parallel light exposure device (EXM-1201) with an energy amount that resulted in 14 remaining steps after development of a 41-step tablet. The PET film was then peeled off and developed to obtain a substrate for evaluating flexibility, with a 10 mm x 100 mm resist pattern formed on the FPC substrate.

[0110] The substrate for evaluating flexibility was rubbed back and forth at 180° five times against a cylindrical rod, and the smallest cylindrical diameter (mm) at which peeling did not occur between the FPC substrate and the resist pattern was determined. The diameters of the cylinder were evaluated at 2, 3, 4, 5, 6, 8, 9, 10, 11, 12, 13, 15, 20, 25, and 30 (unit: mm). The smaller the minimum diameter of the cylinder, the better the flexibility. When evaluating with a cylinder diameter of 30 mm, if peeling was confirmed between the FPC substrate and the resist layer, the evaluation result was ">30".

[0111] [Table 1] [Explanation of symbols]

[0112] Reference Signs List 1: photosensitive resin film, 2: support film, 10: substrate, 20: photosensitive layer, 22: resist pattern, 30: active light, 40: plating layer, 42: conductor pattern.

Claims

1. The composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, a polymerization inhibitor, and a photosensitizer, the photopolymerizable compound contains a (meth)acrylate having a urethane bond, The polymerization inhibitor comprises an alkylcatechol; A photosensitive resin film having a thickness of 35 to 300 μm.

2. A photosensitive resin film as described in claim 1, wherein the photopolymerizable compound includes a (meth)acrylate compound having a skeleton derived from dipentaerythritol or pentaerythritol.

3. 3. The photosensitive resin film according to claim 1, wherein the content of the polymerization inhibitor is 0.01 to 0.3 parts by mass per 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound.

4. The photosensitive resin film according to any one of claims 1 to 3, wherein the photosensitizer comprises a pyrazoline compound.

5. A photosensitive resin film described in any one of claims 1 to 4, wherein the content of the photosensitizer is 0.01 to 5 parts by mass per 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound.

6. The photosensitive resin film according to any one of claims 1 to 5, wherein the photopolymerizable compound comprises polyalkylene glycol di(meth)acrylate.

7. A photosensitive resin film described in any one of claims 1 to 6, wherein the binder polymer has a structural unit based on (meth)acrylic acid benzyl ester.

8. A photosensitive resin film described in any one of claims 1 to 7, having a thickness of 50 to 300 μm.

9. A step of providing a photosensitive layer on a substrate using the photosensitive resin film according to any one of claims 1 to 8; a step of irradiating at least a portion of the photosensitive layer with active light to form a photocured portion; removing at least a portion of the photosensitive layer other than the photocured portion to form a resist pattern; A method for forming a resist pattern comprising the steps of:

10. 10. A method for forming a wiring pattern, comprising the step of plating a substrate on which a resist pattern has been formed by the method for forming a resist pattern according to claim 9 to form a conductor pattern.

11. The method for forming a wiring pattern according to claim 10 , further comprising the step of removing the light-cured portion after the plating process.

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