Cooling device

Abstract

To efficiently cool a component by enabling the component whose temperature is to be high to be arranged under a magnetic field environment in a medical diagnostic device to be used in an environment with existence of a magnetic field.SOLUTION: A cooling device cools a component stored inside a housing of a unit placed under influence where a magnetic field is generated. The cooling device includes a water-cooling mechanism and at least one air-cooling mechanism. The water-cooling mechanism cools the component by cooling a cooling plate by a water flow flowing through a pipe passing in the cooling plate arranged inside the housing. The air-cooling mechanism is arranged on a flow-out side where the water flow flowing through the pipe flows out of the housing, so as to cool the component by discharging air inside the housing together with the water flow in response to the water flow.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The embodiments disclosed in this specification and drawings relate to a cooling device. [Background technology]

[0002] Conventionally, magnetic resonance imaging (MRI) devices have been used as medical diagnostic devices that perform diagnosis using images. Magnetic resonance imaging devices (hereinafter referred to as "MRI devices") are devices that capture cross-sectional images of a subject by receiving MR signals excited by RF (Radio Frequency) pulses irradiated in a strong magnetic field using an RF coil.

[0003] Incidentally, some of the components (internal units) included in the gantry constituting the MRI apparatus become hot due to the temperature rise during operation. For this reason, in the MRI apparatus, it is necessary to cool the internal units that become hot. As a cooling mechanism for cooling the internal units that become hot, for example, an air-cooling mechanism or a water-cooling mechanism can be considered. The air-cooling mechanism is a mechanism that cools the components in the internal unit by, for example, rotating a fan with a motor to discharge air heated in the internal unit to the outside. The water-cooling mechanism is a mechanism that cools the components arranged around the cooling plate in the internal unit by, for example, circulating cooling water through pipes arranged in the cooling plate to cool the cooling plate.

[0004] However, an internal unit configured to cool the internal parts by an air-cooling mechanism using a fan cannot be installed near the gantry constituting the MRI apparatus or in the same room as the imaging room in which the gantry is installed. In other words, an air-cooling mechanism using a fan cannot be installed in an environment where a magnetic field exists. This is because the motor for rotating the fan in the air-cooling mechanism uses, for example, a permanent magnet or an electromagnet, and therefore if the internal unit is installed near the gantry or in the imaging room in which the gantry is installed, it may be affected by the magnetic field generated by the MRI apparatus for imaging and may not be able to perform sufficiently.

[0005] For this reason, in the conventional MRI apparatus, when the internal parts of the internal unit are cooled by the air-cooling mechanism, the air-cooling mechanism is installed in a room different from the imaging room where the gantry device that generates the magnetic field is installed, such as a machine room that is not affected by the magnetic field. In the conventional MRI apparatus, an air passage for guiding the air heated in the internal unit into the machine room, such as an exhaust duct, is laid between the imaging room and the machine room, and the air-cooling mechanism installed in the machine room sucks in the air in the internal unit through the exhaust duct and exhausts it to the machine room. In such a configuration in which the internal parts are cooled by sucking in the air in the internal unit through the exhaust duct, the air flow path becomes long, so it is considered that the efficiency of the air-cooling function of the air-cooling mechanism is reduced. Furthermore, when the MRI apparatus is introduced, the exhaust duct needs to be laid between the imaging room and the machine room, but since the construction is very large-scale, the construction cost is also considered to be high. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Utility Model Registration No. 3178147 Summary of the Invention [Problem to be solved by the invention]

[0007] The problem to be solved by the embodiments disclosed in this specification and the drawings is to enable components that become hot to be placed in a magnetic field environment in a medical diagnostic device used in an environment where a magnetic field is present, and to efficiently cool these components. However, the problem to be solved by the embodiments disclosed in this specification and the drawings is not limited to the above problem. Problems corresponding to the effects of each configuration shown in the embodiments described below can also be positioned as other problems. [Means for solving the problem]

[0008] The cooling device of the embodiment is for cooling components housed in a housing of a unit that is subjected to the effect of a magnetic field, and includes a water-cooling mechanism and at least one air-cooling mechanism. The water-cooling mechanism cools the components by cooling a cooling plate arranged in the housing with a water flow flowing in a pipe passing through the cooling plate. The air-cooling mechanism is arranged on the outlet side where the water flow flowing through the pipe flows out of the housing, and cools the components by discharging air from the housing together with the water flow in response to the water flow. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing an example of an installation state of a medical diagnostic apparatus that employs a cooling device according to an embodiment. [Diagram 2] FIG. 2 is a diagram illustrating an example of an installation state of components cooled by a cooling device according to an embodiment. [Diagram 3] FIG. 2 is a diagram illustrating an example of a configuration of an internal unit that employs a cooling device according to an embodiment. [Figure 4] FIG. 2 is a diagram illustrating components for air cooling in the cooling device according to the embodiment and an example of the operation of the components; [Diagram 5] FIG. 13 is a diagram illustrating an example of another configuration of the internal unit that employs the cooling device according to the embodiment. [Figure 6] FIG. 13 is a diagram illustrating an example of a configuration of a modified internal unit that employs the cooling device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a cooling device according to an embodiment will be described with reference to the drawings. In the following description, it is assumed that a medical diagnostic device employing a cooling device according to an embodiment is a magnetic resonance imaging (MRI) device (hereinafter, referred to as an "MRI device").

[0011] The MRI apparatus is a medical diagnostic apparatus that irradiates a subject (e.g., a human body) with high-frequency RF (Radio Frequency) pulses while applying a strong magnetic field, receives electromagnetic waves generated from hydrogen nuclei in the subject's body by the nuclear magnetic resonance phenomenon using an RF coil, and captures a tomographic image (hereinafter referred to as an "MR image") of the subject based on a nuclear magnetic resonance signal (hereinafter referred to as an "MR signal") based on the received electromagnetic waves. The MRI apparatus may capture an MR image of the subject based on an MR signal based on the electromagnetic waves received by an RF coil attached to the subject. The MRI apparatus displays an MR image of the subject, allowing a person performing the MRI examination (such as a doctor or technician) to visually check whether or not the subject has a lesion.

[0012] FIG. 1 is a diagram showing an example of the installation state of a medical diagnostic apparatus (MRI apparatus) employing a cooling device according to an embodiment. In the example shown in FIG. 1, for example, a bed apparatus BE having a bed top on which a subject P to be examined is placed, and a gantry apparatus TE that generates a magnetic field to image the subject P, irradiates the subject P with RF pulses, and receives MR signals are installed in an imaging room PR. Furthermore, in the example shown in FIG. 1, for example, a console apparatus OE that a person who performs an MRI examination (such as a doctor or a technician) operates to give instructions when imaging the subject P is installed in an operation room OR, and devices such as a control device CE that controls the operation of the gantry apparatus TE and the bed apparatus BE according to instructions from the console apparatus OE are installed in a machine room MR. In FIG. 1, the imaging room PR is a shielded room so that the magnetic field generated by the gantry apparatus TE does not leak into the operation room OR or the machine room MR. As a result, in the example shown in FIG. 1, only the imaging room PR becomes an environment (magnetic field environment) in which the magnetic field generated by the gantry apparatus TE exists. The devices constituting the MRI apparatus installed in each room are electrically connected to each other, for example, by cables.

[0013] In an MRI apparatus, there are some components (hereinafter referred to as "internal units") whose temperatures rise and become high as the gantry device TE operates. Examples of internal units that become high temperature include a magnetic field power supply device for generating a strong magnetic field and a high frequency amplifier device for irradiating high frequency RF pulses. For this reason, each internal unit that becomes high temperature is equipped with a cooling mechanism, such as an air-cooling mechanism or a water-cooling mechanism, to cool the internal parts. In the following description, the internal unit that becomes high temperature is assumed to be a high frequency amplifier device (hereinafter referred to as a "high frequency amplifier unit").

[0014] The high frequency amplification unit is a device (internal unit) for amplifying a high frequency signal output by the control device CE in response to an imaging instruction from the console device OE, for irradiating an RF coil equipped in the gantry device TE with an RF pulse. The high frequency amplification unit has built-in, for example, a semiconductor integrated circuit such as an LSI (Large Scale Integration) for generating a high frequency signal, and a circuit board (hereinafter referred to as an "amplification circuit board") on which an amplification circuit for amplifying the generated high frequency signal is mounted. In the amplification circuit board, for example, components that mainly constitute the amplification circuit, such as a power amplifier, a coil, and a transformer, are the cause of the high temperature caused by the operation of the high frequency amplification unit. The high frequency amplification unit is an example of a "unit placed under the influence of a magnetic field generated", and the components that constitute the amplification circuit are an example of a "component contained in a housing of a unit placed under the influence of a magnetic field generated".

[0015] Next, a cooling mechanism for cooling a radio-frequency amplification unit connected to a gantry device TE constituting an MRI apparatus will be described. The radio-frequency amplification unit includes both an air-cooling mechanism and a water-cooling mechanism as a cooling mechanism. Fig. 2 is a diagram showing a schematic example of an installation state of a component (radio-frequency amplification unit) cooled by a cooling device according to an embodiment.

[0016] 2, the radio frequency amplifier unit 1 is installed adjacent to the pedestal device TE. A cooling water pipe 10 for a water-cooling mechanism is connected (piped) to the radio frequency amplifier unit 1, and the cooling water pipe 10 is connected to a cooling water circulator WC installed in the machine room MR.

[0017] The cooling water circulator WC circulates cooling water between the cooling water circulator WC and a water-cooling mechanism included in the high frequency amplifier unit 1. Fig. 2 shows cooling water pipes 10: a cooling water pipe 10-I for allowing the cooling water sent out from the cooling water circulator WC to flow into the high frequency amplifier unit 1, and a cooling water pipe 10-O for sending the cooling water that has passed through the inside of the high frequency amplifier unit 1 and then flowed out of the high frequency amplifier unit 1 to the cooling water circulator WC.

[0018] The configuration of the water-cooling mechanism in the radio frequency amplifier unit 1, that is, the configuration of the water-cooling mechanism in which the radio frequency amplifier unit 1 and the cooling water circulator WC are connected by a cooling water pipe 10, is equivalent to the configuration of the water-cooling mechanism of an internal unit in a conventional MRI apparatus.

[0019] On the other hand, the configuration of the air-cooling mechanism in the high frequency amplifier unit 1 is different from the configuration of the air-cooling mechanism of the internal unit in the conventional MRI apparatus. More specifically, in the configuration of the air-cooling mechanism of the internal unit in the conventional MRI apparatus, for example, a motor using a permanent magnet or an electromagnet rotates a fan to discharge the air heated in the internal unit to the outside. For this reason, in the conventional MRI apparatus, when the internal unit is arranged in the imaging room PR as shown in FIG. 2, it is necessary to install an air-cooling mechanism using a fan in the machine room MR, connect the internal unit and the air-cooling mechanism with, for example, an exhaust duct, and guide the air heated in the internal unit to the air-cooling mechanism. On the other hand, in the configuration of the air-cooling mechanism in the high frequency amplifier unit 1, the air heated by the components constituting the amplifier circuit mounted on the amplifier circuit board built in the high frequency amplifier unit 1 is discharged to the outside of the high frequency amplifier unit 1 without using a fan.

[0020] [An example of the cooling mechanism of the internal unit] Next, an example of the configuration of a cooling mechanism provided in the high frequency amplification unit 1 will be described. Fig. 3 is a diagram showing a schematic configuration of an internal unit (high frequency amplification unit 1) employing a cooling device according to an embodiment. Fig. 3(a) shows an example of the arrangement of components when the high frequency amplification unit 1 is viewed from the top, Fig. 3(b) shows an example of the arrangement of components when the high frequency amplification unit 1 is viewed from the right side, Fig. 3(c) shows an example of the arrangement of components when viewed from the front side where the cooling water pipe 10 is connected to the high frequency amplification unit 1, and Fig. 3(d) shows a rear view of the high frequency amplification unit 1 when viewed from the rear side.

[0021] The high frequency amplifier unit 1 has an amplifier circuit board CB mounted with various components for amplifying a high frequency signal inside a housing 1E. Fig. 3 shows an example of an amplifier circuit board CB having a semiconductor integrated circuit mounting area AL on which semiconductor components such as LSIs are mounted, and an amplifier circuit mounting area AA on which components constituting an amplifier circuit (e.g., a power amplifier, a coil, a transformer, etc.) are mounted.

[0022] In the housing 1E of the high frequency amplifier unit 1, a water-cooling mechanism is disposed below the amplifier circuit board CB, which cools the components mounted on the amplifier circuit board CB with flowing cooling water. FIG. 3 shows an example of the water-cooling mechanism in which a cooling water pipe 10 bent into a U-shape passes through a cooling plate 11. In the water-cooling mechanism, the cooling plate 11 is formed of a metal such as aluminum, and the cooling water pipe 10 is formed of a metal such as copper. In the water-cooling mechanism, the cooling water flowing from the cooling water circulator WC through the cooling water pipe 10-I flows into the water-cooling mechanism from the inlet 10a of the cooling water pipe 10, passes through the U-shaped bent portion, and flows out from the outlet 10b of the cooling water pipe 10 through the cooling water pipe 10-O into the cooling water circulator WC (see FIG. 2). FIG. 3(a), FIG. 3(b), and FIG. 3(c) show an example of the flow of the cooling water in the water-cooling mechanism. In the water-cooling mechanism provided in the high-frequency amplifier unit 1, the cooling water flowing in the cooling water pipes 10 cools the cooling plate 11, thereby cooling the components mounted on the amplifier circuit board CB arranged above. In the example shown in (a) of Fig. 3, mainly the semiconductor components mounted in the semiconductor integrated circuit mounting area AL are cooled.

[0023] In the water-cooling mechanism, the path along which the cooling water pipe 10 passes through the cooling plate 11, i.e., the path along which the cooling water circulates within the cooling plate 11, is not limited to the U-shape shown in FIG. 3, and may be any path that provides a path for the cooling water that can cool the components to be cooled.

[0024] The configuration of the cooling water pipe 10 and the cooling plate 11 is an example of a "water-cooling mechanism".

[0025] The high frequency amplifier unit 1 includes an aspirator 20 and an intake pipe 21 as an air-cooling mechanism for cooling the components mounted on the amplifier circuit board CB. FIG. 3 shows an example of an air-cooling mechanism in which the aspirator 20 is disposed at the end of the cooling water pipe 10 on the outlet 10b side, one end of the intake pipe 21 is connected to an air intake 20c of the aspirator 20, and the other end of the intake pipe 21 is installed at an arbitrary position inside the housing 1E. In the air-cooling mechanism, the aspirator 20 draws in air from the intake 20c side by the Venturi effect using a fluid, and discharges it together with the fluid. More specifically, the aspirator 20 uses the cooling water flowing inside the cooling water pipe 10 as a fluid, draws in the air inside the housing 1E that has been warmed by the components mounted on the amplifier circuit board CB from the other end side of the intake pipe 21 (hereinafter referred to as "intake 21c"), and discharges it from the outlet 10b together with the cooling water. For this reason, the cooling water circulator WC, which circulates cooling water between the water-cooling mechanism equipped in the high-frequency amplifier unit 1, removes the air that has flowed in together with the cooling water from the outlet 10b of the high-frequency amplifier unit 1 through the cooling water pipe 10-O, and causes the air-free cooling water to flow out to the inlet 10a of the high-frequency amplifier unit 1 through the cooling water pipe 10-I (see FIG. 2).

[0026] Here, an example of the operation of the aspirator 20 will be described. FIG. 4 is a diagram showing a component (aspirator 20) for air cooling in the cooling device according to the embodiment and a schematic diagram showing an example of the operation of the component. The aspirator 20 sucks in air by utilizing the Venturi effect, in which the pressure of the part where the flow rate of the fluid is increased becomes lower than the pressure of the other parts when the flow rate of the fluid is increased by throttling the flow of the cooling water, which is a fluid. FIG. 4 shows an example of the case where the flow path diameter FP1 on the inlet 20a side is narrowed to the flow path diameter FP2 (the flow path diameter is narrowed) during the time when the cooling water flows in from the inlet 20a of the aspirator 20 and flows out from the outlet 20b. In the aspirator 20, the flow path diameter is narrowed to increase the flow rate of the cooling water in the part of the flow path diameter FP2. As a result, in the aspirator 20, the pressure in the part of the flow path diameter FP2 is lower than the pressure in the part of the flow path diameter FP1. Fig. 4 shows a schematic diagram of the relationship between the flow velocity and the pressure in each part of the aspirator 20. As a result, as shown in Fig. 4, in the aspirator 20, air is sucked in from the intake port 20c due to a drop in pressure at the part of the flow passage diameter FP2. Then, the aspirator 20 discharges the air sucked in from the intake port 20c together with the cooling water from the outlet port 20b.

[0027] The amount of air sucked in from the intake port 20c in the aspirator 20 (suction amount) can be adjusted by changing the amount of throttling of the cooling water flow, that is, by changing the difference between the flow path diameter FP1 and the flow path diameter FP2, thereby changing the increase in the flow rate of the fluid. Therefore, the difference between the flow path diameter FP1 and the flow path diameter FP2 in the aspirator 20 can be adjusted to the discharge amount required to discharge the air in the housing 1E that has been warmed by the components mounted on the amplifier circuit board CB in the high-frequency amplifier unit 1.

[0028] An example of the air flow by the air-cooling mechanism is shown in Fig. 3(a), Fig. 3(b), and Fig. 3(c) in schematic form. In the air-cooling mechanism, air in the housing 1E that has been warmed by the components mounted on the amplifier circuit board CB is sucked in through the intake port 21c of the intake pipe 21, and discharged together with cooling water from the outlet 20b of the aspirator 20, that is, the outlet 10b of the water-cooling mechanism provided in the high-frequency amplifier unit 1. For this reason, as shown in Fig. 3(d), the high-frequency amplifier unit 1 is provided with a slit SL on the back side thereof for taking in fresh air in the radiography room PR that has not been warmed by the components mounted on the amplifier circuit board CB.

[0029] The configuration of the aspirator 20 and the suction pipe 21 (which may include the slit SL) is an example of an “air-cooling mechanism.” The cooling water pipe 10 is an example of a “pipe passing through a cooling plate” and a “pipe.”

[0030] The shape of the intake port (slit SL in FIG. 3(d)) for taking in fresh air in the air-cooling mechanism and the position where the intake port is provided are not limited to the lower rear surface side of the high frequency amplifier unit 1 as shown in FIG. 3(d) as long as the intake port is provided so that the warmed air inside the housing 1E can be efficiently discharged (for example, evenly from inside the housing 1E). For example, the intake port for taking in fresh air in the air-cooling mechanism may be provided above the rear surface side of the high frequency amplifier unit 1 or on a side surface of the high frequency amplifier unit 1 (either or both of the right and left sides).

[0031] The shape and configuration of the suction pipe 21, i.e., the path for guiding the air sucked from the suction port 21c to the suction port 20c of the aspirator 20 and the method for sucking the air, are not limited to the shape and configuration of the suction pipe 21 shown in Fig. 3, and may be any shape or configuration that efficiently guides the warmed air in the housing 1E to the suction port 20c. Furthermore, when the aspirator 20 sucks the air in the housing 1E directly from the suction port 20c, the suction pipe 21 may be omitted.

[0032] With this configuration, the air-cooling mechanism of the high frequency amplifier unit 1 takes in fresh air that has not been warmed by the components mounted on the amplifier circuit board CB from outside the high frequency amplifier unit 1 through the slit SL, and the aspirator 20 sucks in the air that has been warmed by the components mounted on the amplifier circuit board CB in the housing 1E through the intake port 21c, and discharges it from the outlet port 10b together with the cooling water, thereby cooling the components mounted on the amplifier circuit board CB. In other words, the air-cooling mechanism of the high frequency amplifier unit 1 cools the components mounted on the amplifier circuit board CB by sucking in the air in the housing 1E using the pressure difference between the pressure in the housing 1E and the pressure at the intake port 20c, which is reduced by narrowing the flow path diameter of the cooling water in the aspirator 20 to increase the flow rate. In the example shown in FIG. 3(a), the components constituting the amplifier circuit mounted in the amplifier circuit mounting area AA are mainly cooled.

[0033] In the example of the configuration of the high frequency amplifier unit 1 shown in Fig. 3, the configuration of the air-cooling mechanism is shown in which the aspirator 20 is disposed at the end of the cooling water pipe 10 on the outlet 10b side. This is because the aspirator 20 discharges the air sucked in from the intake port 20c together with the fluid. If the aspirator 20 is disposed, for example, at the end of the cooling water pipe 10 on the inlet 10a side, the air discharged by the aspirator 20 may be included in the cooling water that flows through the cooling water pipe 10 to cool the cooling plate 11 in the water-cooling mechanism, and the water-cooling function of the water-cooling mechanism may be deteriorated. Considering this, in order to avoid deterioration of the water-cooling function of the water-cooling mechanism, it is considered preferable to dispose the aspirator 20 in the high frequency amplifier unit 1 at the end of the cooling water pipe 10 on the outlet 10b side, as shown in Fig. 3.

[0034] In this way, the air-cooling mechanism of the high frequency amplifier unit 1 cools the inside of the high frequency amplifier unit 1 without using a fan that has been used as an air-cooling mechanism in conventional MRI apparatuses. Therefore, the high frequency amplifier unit 1 can be installed in the radiography room PR, which is in a magnetic field environment, or near the gantry TE installed in the radiography room PR (it may be inside the gantry TE). Moreover, the air-cooling mechanism of the high frequency amplifier unit 1 realizes the air-cooling function at the position where the high frequency amplifier unit 1 is installed, so there is no need to install an exhaust duct or the like that was necessary in conventional MRI apparatuses, and the air-cooling function can be realized more efficiently.

[0035] 3 shows a configuration in which one aspirator 20 is disposed on the outlet 10b side of the cooling water pipe 10 that circulates cooling water within the cooling plate 11 in the water-cooling mechanism of the high frequency amplification unit 1, but the number of aspirators 20 disposed to realize the air-cooling function in the high frequency amplification unit 1 may be more than one. For example, the air-cooling mechanism of the high frequency amplification unit 1 may include more than one (e.g., two) aspirators 20 disposed on the outlet 10b side of the cooling water pipe 10. Furthermore, when the water-cooling mechanism of the high frequency amplification unit 1 has more than one cooling water pipe 10 passing through the cooling plate 11, the air-cooling mechanism of the high frequency amplification unit 1 may include one aspirator 20 disposed on the outlet 10b side of each cooling water pipe 10.

[0036] [Another example of the configuration of the cooling mechanism provided in the internal unit] Incidentally, in the MRI apparatus, in addition to the water-cooling mechanism in the radio frequency amplifier unit 1, there are other components, including the water-cooling mechanisms of other internal units, that use fluid (normal water, cooling water, or a dedicated liquid) flowing in pipes. For this reason, the air-cooling mechanism of the radio frequency amplifier unit 1 may be configured by utilizing the flow rate of fluid flowing in pipes installed for other components of the MRI apparatus.

[0037] Fig. 5 is a diagram showing a schematic example of another configuration of an internal unit (high frequency amplification unit 1) employing a cooling device according to the embodiment. In the following description, in order to distinguish the high frequency amplification unit 1 shown in Fig. 3 from the high frequency amplification unit 1 having another configuration described below, the high frequency amplification unit 1 having another configuration will be referred to as a "high frequency amplification unit 2." Fig. 5(a) shows an example of an arrangement of components when the high frequency amplification unit 2 is viewed from above, and Fig. 5(b) shows an example of an arrangement of components when the high frequency amplification unit 2 is viewed from the right side.

[0038] The components built into the high frequency amplifier unit 2 and the cooling mechanisms (water-cooling mechanism and air-cooling mechanism) included in the high frequency amplifier unit 2 are similar to those in the high frequency amplifier unit 1, so they are given the same reference numerals and detailed description will not be repeated.

[0039] The high frequency amplification unit 2 is an internal unit that is equipped with an air-cooling mechanism that, in addition to the air-cooling mechanism equipped in the high frequency amplification unit 1, utilizes the flow rate of a fluid flowing in a pipe (hereinafter referred to as "fluid pipe 100") installed outside the high frequency amplification unit 2 to exhaust even more air from within the high frequency amplification unit 2.

[0040] In the high frequency amplification unit 2, an aspirator 200 is arranged in the fluid pipe 100 as an additional air-cooling mechanism for cooling the components mounted on the amplifier circuit board CB, and one end of an intake pipe 210 is connected to the air intake port 200c of the aspirator 200, and the other end of the intake pipe 210 (hereinafter referred to as "intake port 210c") is arranged to be installed at any position within the housing 2E of the high frequency amplification unit 2.

[0041] The aspirator 200 is similar to the aspirator 20. The aspirator 200 utilizes the fluid flowing in the fluid pipe 100 from the inlet 100a side to the outlet 100b side to suck in the air in the housing 2E that has been warmed by the components mounted on the amplifier circuit board CB from the inlet 210c of the inlet pipe 210, and flows it together with the fluid to the outlet 100b side (discharges the warmed air in the housing 2E).

[0042] The configuration of the aspirator 200 and the suction pipe 210 (which may include the slit SL) is an example of an "other air-cooling mechanism." The fluid pipe 100 is an example of an "other pipe."

[0043] The shape and configuration of the intake pipe 210, i.e., the path for guiding the air sucked in from the intake port 210c to the intake port 200c of the aspirator 200 and the method for sucking the air, are not limited to the shape and configuration of the intake pipe 210 shown in Figure 5, and may be any shape or configuration that efficiently guides the warmed air in the housing 2E to the intake port 200c.

[0044] With this configuration, in the air-cooling mechanism provided in the high frequency amplifier unit 2, the aspirator 20 and the aspirator 200 each suck in air that has been warmed by the components mounted on the amplifier circuit board CB inside the housing 2E and expels it to the outside of the high frequency amplifier unit 2, thereby further cooling the components mounted on the amplifier circuit board CB. Figures 5(a) and 5(b) also show a schematic example of an air flow when the air-cooling mechanism provided in the high frequency amplifier unit 2 mainly cools the components that constitute the amplifier circuit mounted in the amplifier circuit mounting area AA.

[0045] In the example of the configuration of the high frequency amplifier unit 2 shown in Fig. 5, the aspirator 200 is disposed midway through the fluid pipe 100. Therefore, after the fluid flowing through the fluid pipe 100 passes through the aspirator 200, the fluid contains air from within the housing 2E that the aspirator 200 sucks in through the intake port 200c. Therefore, in the air-cooling mechanism provided in the high frequency amplifier unit 2, it is considered preferable to dispose the aspirator 200 at a position in the fluid pipe 100 after the components that use the fluid flowing through the fluid pipe 100 have used the fluid. However, the aspirator 200 may be disposed at any position in the fluid pipe 100 as long as it does not affect the realization of the function of the components that use the fluid flowing through the fluid pipe 100.

[0046] In this way, like the air-cooling mechanism provided in the high frequency amplification unit 1, the air-cooling mechanism provided in the high frequency amplification unit 2 also cools the inside of the high frequency amplification unit 2 without using a fan used as an air-cooling mechanism in conventional MRI apparatuses and without the need to install an exhaust duct or the like. For this reason, like the high frequency amplification unit 1, the high frequency amplification unit 2 can also be installed in the radiography room PR, which is in a magnetic field environment, or near the gantry device TE installed in the radiography room PR (it may be inside the gantry device TE), and the air-cooling mechanism provided in the high frequency amplification unit 2 can achieve the air-cooling function more efficiently.

[0047] In the configuration of the air-cooling mechanism in the high frequency amplifier unit 2 shown in FIG. 5, one aspirator 20 is arranged in the cooling water pipe 10, and one aspirator 200 is arranged in the fluid pipe 100. However, based on the same concept as the air-cooling mechanism provided in the high frequency amplifier unit 1, a plurality of fluid pipes 100 and a plurality of aspirators 200 may be arranged.

[0048] [Example of the configuration of a modified example of the cooling mechanism included in the internal unit] In the radio frequency amplifier unit 1, fresh air from within the radiography room PR is taken in through the slit SL, and air from within the housing 1E that has been warmed by the components mounted on the amplifier circuit board CB is sucked in through the suction port 21c of the suction pipe 21, and is discharged together with cooling water from the outlet 20b of the aspirator 20. However, it is conceivable that there are components or areas that become hotter on the amplifier circuit board CB provided in the radio frequency amplifier unit 1. Therefore, the radio frequency amplifier unit 1 may be configured to focus on the components or areas that become hot and to cool these components or areas more efficiently.

[0049] 6 is a diagram showing a schematic diagram of an example of a configuration of a modified internal unit (high frequency amplifier unit 1) employing a cooling device according to the embodiment. In the following description, in order to distinguish between the high frequency amplifier unit 1 shown in FIG. 3 and the high frequency amplifier unit 1 having the configuration of the modified example described below, the high frequency amplifier unit 1 having the configuration of the modified example will be referred to as a "high frequency amplifier unit 3." FIG. 6(a) shows an example of an arrangement of components when the high frequency amplifier unit 3 is viewed from the top side, FIG. 6(b) shows an example of an arrangement of components when the high frequency amplifier unit 3 is viewed from the right side, FIG. 6(c) shows an example of an arrangement of components when viewed from the front side where the cooling water pipe 10 is connected to the high frequency amplifier unit 3, and FIG. 6(d) shows a rear view of the high frequency amplifier unit 3 when viewed from the rear side.

[0050] The components built into the high frequency amplifier unit 3 and the cooling mechanisms (water-cooling mechanism and air-cooling mechanism) included in the high frequency amplifier unit 3 include those similar to those in the high frequency amplifier unit 1. Therefore, in the following description, the same components and cooling mechanisms as those in the high frequency amplifier unit 1 are given the same reference numerals, and detailed description thereof will not be repeated.

[0051] The high frequency amplifier unit 3 has a configuration in which an induction plate 30 is added to the air-cooling mechanism of the high frequency amplifier unit 1. The induction plate 30 is for guiding the fresh air taken in through the slit SL to the parts or areas of the amplifier circuit board CB of the high frequency amplifier unit 3 that need to be cooled more. FIG. 6 shows an example of the shape of the induction plate 30 for passing more of the fresh air taken in through the slit SL to the upper side of the amplifier circuit mounting area AA of the amplifier circuit board CB in the housing 3E of the high frequency amplifier unit 3 in order to further cool the amplifier circuit mounted in the amplifier circuit mounting area AA, and then guiding the air heated by the amplifier circuit toward the intake port 21c of the intake pipe 21. FIG. 6(a), FIG. 6(b), and FIG. 6(c) are schematic diagrams showing an example of the air flow induced by the induction plate 30 in the air-cooling mechanism. As a result, in the high frequency amplifier unit 3, the amplifier circuit is efficiently cooled by the fresh air taken in, the air warmed by the amplifier circuit is efficiently guided to the inlet 21c, the guided air is sucked in from the inlet 20c side by the aspirator 20, and is discharged together with the cooling water from the outlet 20b. As a result, in the high frequency amplifier unit 3, the components constituting the amplifier circuit mounted in the amplifier circuit mounting area AA are more efficiently cooled.

[0052] The shape of guide plate 30 is not limited to the shape shown in Fig. 6. Guide plate 30 may have any shape as long as it can pass as much fresh air taken in through slits SL around the parts or areas in high-frequency amplifier unit 3 that are desired to be cooled as possible and can guide the air warmed by the parts or areas that are desired to be cooled to intake port 21c.

[0053] With this configuration, in the air-cooling mechanism of the high frequency amplifier unit 3, the guide plate 30 guides the fresh air taken in through the slits SL to the component or area of ​​interest for further cooling. In the air-cooling mechanism of the high frequency amplifier unit 3, the aspirator 20 sucks in the air warmed by the component or area of ​​interest in the housing 1E through the intake port 21c and discharges it together with cooling water through the outlet port 10b, thereby cooling the component or area of ​​interest as desired to be further cooled. Figures 6(a), 6(b), and 6(c) are schematic diagrams showing an example of the air flow when the air guided by the guide plate 30 is discharged in the air-cooling mechanism.

[0054] In this way, like the air-cooling mechanism provided in the high frequency amplification unit 1, the air-cooling mechanism provided in the high frequency amplification unit 3 also cools the inside of the high frequency amplification unit 3 without using a fan used as an air-cooling mechanism in conventional MRI apparatuses and without the need to install an exhaust duct or the like. For this reason, like the high frequency amplification unit 1, the high frequency amplification unit 3 can also be installed in the radiography room PR, which is in a magnetic field environment, or near the gantry device TE installed in the radiography room PR (it may be inside the gantry device TE), and the air-cooling mechanism provided in the high frequency amplification unit 3 can achieve the air-cooling function more efficiently.

[0055] 6, a single aspirator 20 is arranged in the cooling water pipe 10, but a plurality of fluid pipes 100 may be arranged based on the same concept as the air-cooling mechanism of the high frequency amplifier unit 1. Furthermore, in the configuration of the air-cooling mechanism of the high frequency amplifier unit 3 shown in FIG. 6, ... flow rate of a fluid flowing through a pipe installed for another component of the MRI apparatus may be used to configure the air-cooling mechanism based on the same concept as the air-cooling mechanism of the high frequency amplifier unit 1.

[0056] As described above, in the internal unit employing the cooling device of each embodiment, the air-cooling mechanism uses the flow of cooling water in the cooling water pipe used in the water-cooling mechanism to discharge the air warmed in the housing to the outside of the cooling device. As a result, in the MRI apparatus, which is a medical diagnostic apparatus equipped with the internal unit employing the cooling device of each embodiment, the internal unit, which becomes hot, can be placed in a magnetic field environment, and the internal unit can be efficiently cooled.

[0057] In each of the above-mentioned embodiments, the configuration for sucking in and discharging the air heated inside the housing, which is provided as the air-cooling mechanism, is an aspirator. However, the configuration for sucking in and discharging the air heated inside the housing is not limited to the aspirator as long as it does not use a motor, that is, is not affected by the magnetic field environment. For example, the air-cooling mechanism may be realized using a configuration other than the aspirator that sucks in and discharging the air inside the housing using the Venturi effect (pressure difference), or a configuration that sucks in and discharging the air inside the housing using a technology other than the Venturi effect.

[0058] According to at least one of the embodiments described above, a cooling device for cooling a component (CB) housed in a housing (1E) of a unit (1) that is subject to the effect of a magnetic field is provided with a water-cooling mechanism that cools the component (CB) by cooling a cooling plate (11) arranged in the housing (1E) with a water flow flowing in a pipe (10) passing through the cooling plate (11), and at least one air-cooling mechanism that is arranged on the outlet side (10b) where the water flow flowing through the pipe (10) flows out of the housing (1E) and cools the component (CB) by discharging the air inside the housing (1E) together with the water flow in response to the water flow. This makes it possible to place the component (CB) that becomes hot in a magnetic field environment in a medical diagnostic device (MRI device) used in an environment where a magnetic field is present, and to efficiently cool the component (CB).

[0059] Although some embodiments have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope of the invention and its equivalents as described in the claims, as well as in the scope and spirit of the invention. [Explanation of symbols]

[0060] 1, 2, 3...high frequency amplifier unit, 1E, 2E, 3E...housing, 10...cooling water pipe, 10a...inlet, 10b...outlet, 11...cooling plate, 20...aspirator, 20a...inlet, 20b...outlet, 20c...suction port, 21...suction pipe, 21c...suction port, 30...guiding plate, 100...fluid pipe, 100a...inlet, 100b...outlet, 200...aspirator, 200a...inlet, 200b...outlet, 200c...suction port, 210...suction pipe, 210c...suction port, SL...slit, CB...amplifier circuit board, AL...semiconductor integrated circuit mounting area, AA...amplifier circuit mounting area

Claims

1. 1. A cooling device for cooling components contained within an enclosure of a unit that is subject to the influence of a generated magnetic field, comprising: a water-cooling mechanism that cools the components by cooling a cooling plate disposed in the housing with water flowing through a pipe passing through the cooling plate; at least one air-cooling mechanism that is arranged on an outlet side where the water flowing through the pipe flows out of the housing and that cools the components by discharging air within the housing together with the water flow in response to the water flow; Equipped with The air-cooling mechanism draws in air from within the housing by utilizing a pressure difference between the air pressure within the housing and the pressure that decreases with the increased flow rate due to the narrowing of the water flow path. Cooling device.

2. The water-cooling mechanism includes a plurality of the pipes disposed within the cooling plate, The air-cooling mechanism is disposed on the outlet side of the water flow in each of the pipes. The cooling device of claim 1 .

3. A plurality of the air-cooling mechanisms are arranged on the outflow side of the water flow in one of the pipes. The cooling device of claim 1 .

4. and further comprising at least one other air-cooling mechanism that cools the components by sucking in air within the housing in response to a water flow through another pipe passing outside the housing and discharging the air together with the water flow. The cooling device of claim 1 .

5. The air-cooling mechanism further includes a guide plate that guides the air inside the housing toward an intake port that draws in the air. The cooling device of claim 1 .

6. The air cooling mechanism is an aspirator. The cooling device according to any one of claims 1 to 5.

7. The components realize the functions of a magnetic resonance imaging device, The unit in which the components are housed in the housing is placed near a gantry that generates the magnetic field in the magnetic resonance imaging apparatus, or in the same room as the gantry. The cooling device according to claim 6.

8. The component realizes the function of a high frequency amplifier that amplifies RF pulses to be irradiated onto a subject placed on a table top in the magnetic resonance imaging apparatus. The cooling device according to claim 7.

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