Temperature measurement device

Abstract

To provide a temperature measurement device capable of performing highly accurate measurement of a temperature in comparison with conventional temperature measurement devices while having high assembly efficiency.SOLUTION: A temperature measurement device 1 comprises: a distance sensor 40; a first waveguide 10 guiding light received by the distance sensor 40; a temperature sensor 50; a second waveguide 20 guiding light received by the temperature sensor 50; and a plate-shaped fitting member 30 attached to a body case 70 integrally with the first waveguide 10 and the second waveguide 20. A depth of the first waveguide 10 in an axis direction is set smaller than a depth of the second waveguide 20 in an axis direction. In the plate-shaped fitting member 30, the first waveguide 10 and the second waveguide 20 are formed integrally with the plate-shaped fitting member 30 in such a manner that a first hollow portion 13 and a second hollow portion 23 penetrate the plate-shaped fitting member 30, and positions of a front surface 31 and a rear surface 32 of the plate-shaped fitting member 30 are disposed so as to be located closer to a second front end opening 21.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a temperature measuring device. [Background technology]

[0002] A known temperature measurement device for non-contact measurement of the temperature of an object to be measured includes a temperature sensor (including an infrared detection element) that detects infrared rays emitted from the object to be measured, and also includes a distance sensor (including a light emitting element and a light receiving element) to perform more accurate and precise temperature measurement. The distance sensor measures the distance between the object to be measured and the temperature measurement device, and the temperature is measured at an appropriate distance within a predetermined range (see, for example, Patent Document 1).

[0003] Also known is a configuration in which a waveguide is introduced into a temperature measuring device, infrared rays incident from the outside are converged on a substantially parabolic inner wall surface, and the infrared rays for temperature measurement are guided to a temperature sensor placed near the base end opening of the waveguide (near the opening at the back) (see, for example, Patent Document 2). With this configuration, the infrared rays emitted from the measurement object can be efficiently guided to the temperature sensor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2022-99646 [Patent Document 2] Patent Publication No. 2017-176560 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in conventional temperature measuring devices, components such as the temperature sensor, distance sensor, and waveguide are handled separately, so the temperature measuring device as a whole has a complicated structure, and many assembly steps are required for manufacturing the device. Also, a step of aligning the relative positions of the above components is required to match the direction of the optical axis sensed by the temperature sensor with the direction of the optical axis sensed by the distance sensor.

[0006] In addition, since the assembly of the individual components described above is inevitably involved, there is still a possibility of variation in the relative positional relationship between the temperature sensor and the distance sensor, no matter how carefully they are assembled. This problem of variation in the relative positional relationship is one of the factors that hinders improvements in measurement accuracy.

[0007] The present invention has been made in consideration of the above-mentioned circumstances, and has an object to provide a temperature measuring device that can perform highly accurate temperature measurement while being more efficient to assemble than conventional temperature measuring devices. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a temperature measurement device that measures the temperature of an object to be measured non-contact using a distance sensor that measures the distance to the object to be measured and a temperature sensor that detects infrared rays emitted from the object to be measured.

[0009] The temperature measuring device is provided with a first waveguide that guides light received by the distance sensor through a first inner wall that constitutes a first hollow portion formed from the first front end opening to the first base end opening and has a substantially cylindrical shape, a first front end opening that opens to the outside, and a first base end opening that opens into the temperature measuring device on the opposite side to the first front end opening. The temperature measuring device is provided with a second waveguide that guides light received by the temperature sensor through a second inner wall that constitutes a second hollow portion formed from the second front end opening to the second base end opening and has a substantially cylindrical shape, a second front end opening that opens to the outside, and a second base end opening that opens into the temperature measuring device on the opposite side to the second front end opening. The temperature measuring device is provided with a distance sensor that has a light emitting element and a light receiving element and is disposed opposite the first base end opening in a positional relationship such that the light emitting surface of the light emitting element and the light receiving surface of the light receiving element face the outside. The temperature sensor is provided with an infrared detecting element and is disposed opposite the second base end opening in a positional relationship such that the light receiving surface of the infrared detecting element faces the outside. The plate-shaped mounting member is also generally plate-shaped and is attached to the main case such that at least a portion of the front or back surface of the plate-shaped mounting member abuts against the main case.

[0010] In this case, the axial depth from the first front end opening to the first base end opening in the first waveguide is set to be smaller than the axial depth from the second front end opening to the second base end opening in the second waveguide.

[0011] In addition, in the plate-shaped mounting member, the first waveguide and the second waveguide are formed integrally with the plate-shaped mounting member such that the first hollow portion of the first waveguide penetrates between the front and back surfaces and the second hollow portion of the second waveguide penetrates between the front and back surfaces, and the plate-shaped mounting member is arranged with respect to the second waveguide such that the positions of the front and back surfaces are closer to the second front end opening than the second base end opening.

[0012] The temperature measuring device of the present invention can perform highly accurate temperature measurement while being highly efficient in assembly compared to conventional temperature measuring devices. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view for explaining the appearance of a temperature measuring device 1 according to an embodiment. [Diagram 2] FIG. 2 is a perspective view for explaining a sensor introduction unit 100 according to the embodiment. [Diagram 3] FIG. 2 is a cross-sectional view shown for explaining a sensor introduction unit 100 of the embodiment. [Figure 4] 1 is a cross-sectional view showing a state in which a distance sensor 40, a temperature sensor 50, a main body case 70, and the like mounted on a printed wiring board 75 are attached to the sensor introduction unit 100 of the embodiment. [Diagram 5] FIG. 2 is a cross-sectional view shown for explaining a sensor introduction unit 100 of the embodiment. [Figure 6] FIG. 11 is a cross-sectional view of a sensor introduction unit 100' according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The temperature measuring device according to the present invention will be described below with reference to the drawings. Note that the explanations of the symbols common to the various drawings will be omitted since the contents already explained for the symbols can also be used in the explanations of the other drawings. Note that in this specification, the "outside" refers to the outside as viewed from the temperature measuring device 1 (outside the outer surface of the main body case 70), and the "inside" refers to the inside of the inner surface of the main body case 70.

[0015] [Embodiment] 1. Configuration of the temperature measuring device 1 according to the embodiment (1) Overview of temperature measuring device 1 The temperature measuring device 1 of the embodiment is a temperature measuring device that measures the temperature of an object to be measured non-contact by using a distance sensor 40 that measures the distance to the object to be measured and a temperature sensor 50 that detects infrared rays emitted from the object to be measured.

[0016] Fig. 1 is a perspective view for explaining the appearance of a temperature measuring device 1 according to an embodiment. Fig. 1(a) is a perspective view showing the front side of the temperature measuring device 1, and Fig. 1(b) is a perspective view showing the rear side. Note that the plate-shaped mounting member 30 is shown by a virtual line (two-dot chain line) because it is hidden by the main body case 70 and cannot be seen from the outside.

[0017] As shown in FIG. 1, the temperature measuring device 1 includes a distance sensor 40, a temperature sensor 50, a first waveguide 10, a second waveguide 20, and a plate-like mounting member 30 (see FIG. 2 etc. for details). The first waveguide 10 and the second waveguide 20 are prepared corresponding to the distance sensor 40 and the temperature sensor 50, respectively, and the first waveguide 10 and the second waveguide 20 are integrally formed together with a plate-shaped mounting member 30 (see also Figure 4) which is attached to the main body case 70 (details will be described later).

[0018] The temperature measuring device 1 shown in Figure 1 has a human I / F (Interface) surface 81 on which an operation switch 88, a display 89, etc. are mounted, a sensing light input surface 82 which is the surface opposite to the human I / F surface 81, and a gripping part 83 to be held by an operator of the temperature measuring device 1. The temperature measuring device 1 is encased in a main body case 70. The main body case 70 has cutout holes corresponding to the shapes of a first front end opening and a second front end opening (described later) in a sensing light input surface 82 so that at least a first front end opening and a second front end opening are open to the outside. Thus, in the sensing light input surface 82, a part of the first waveguide 10 and the second waveguide 20 (a first inner wall 14 and a second inner wall 24 described later) and a part of the distance sensor 40 and the temperature sensor 50 arranged inside corresponding to them are exposed to the outside.

[0019] In addition, symbols AX1 and AX2 indicate the optical axes of the first waveguide 10 and the second waveguide, respectively. In addition, the configuration of the temperature measuring device 1 shown in FIG. 1, such as the appearance and component arrangement, is merely an example, and the present embodiment is not limited to the configuration shown in FIG.

[0020] (2) Sensor introduction unit 100 The sensor introduction unit 100 comprises a first waveguide 10, a second waveguide 20, and a plate-shaped mounting member 30. Fig. 2 is a perspective view for explaining the sensor introduction unit 100 of the embodiment. Fig. 2 is an enlarged perspective view of the sensor introduction unit 100 of the area surrounded by dotted line A (see Fig. 1), and also shows the distance sensor 40 and the temperature sensor 50 using virtual lines to facilitate understanding. Fig. 3 is a cross-sectional view for explaining the sensor introduction unit 100 of the embodiment. Fig. 3 is a cross-sectional view when the sensor introduction unit 100 is cut by a virtual plane B (see Fig. 2) including the optical axis AX1 and the optical axis AX2 and viewed from the direction of the arrow C.

[0021] (3) First waveguide 10 The first waveguide 10 is a waveguide that guides the light received by the distance sensor 40 . The first waveguide 10 has a substantially cylindrical shape. In this specification, the term "substantially cylindrical shape" is not limited to a strict cylindrical shape based on a perfect circle, and may be a slightly distorted shape or a shape having slight irregularities on the outer circumferential surface as long as the effect of the present embodiment is achieved. The first waveguide 10 has a first front-end opening 11 that opens to the outside (opens so as to face the outside) and a first base-end opening 12 that is on the opposite side to the first front-end opening 11 and opens into the inside of the temperature measuring device 1. The vicinity of the first base end opening 12 becomes a distance sensor placement section 19 where a distance sensor 40 is to be placed. The first waveguide 10 guides the light received by the distance sensor 40 by a first inner wall 14 constituting a first hollow section 13 formed from the first front end opening 11 to the first base end opening 12.

[0022] As shown in the example, the first hollow portion 13 of the first waveguide 10 may be configured as a cylindrical space in which the inner diameter of the first inner wall 14 is approximately constant from the first base end opening 12 to the first front end opening 11.

[0023] It is preferable that the first inner wall 14 of the first waveguide 10 is mirror-finished.

[0024] (4) Second waveguide 20 The second waveguide 20 is a waveguide that guides the light received by the temperature sensor 50 . The second waveguide 20 has a substantially cylindrical shape. The second waveguide 20 has a second front-end opening 21 that opens to the outside (opens so as to face the outside) and a second base-end opening 22 that is on the opposite side to the second front-end opening 21 and opens into the inside of the temperature measuring device 1. The vicinity of the second base end opening 22 becomes a temperature sensor arrangement portion 29 where the temperature sensor 50 is to be arranged. The second waveguide 20 guides the light received by the temperature sensor 50 by a second inner wall 24 that constitutes a second hollow portion 23 formed from the second front end opening 21 to the second base end opening 22.

[0025] As shown in the example, the second inner wall 24 of the second waveguide 20 may be configured so that the inner diameter increases along the optical axis AX2 from the second base end opening 22 to the second front end opening 21. Furthermore, the second inner wall 24 of the second waveguide 20 may be configured to have a substantially parabolic surface.

[0026] The axial depth (depth in the direction of the optical axis AX1) D1 from the first front-end opening 11 to the first base-end opening 12 in the first waveguide 10 is set to be smaller than the axial depth (depth in the direction of the optical axis AX2) D2 from the second front-end opening 21 to the second base-end opening 22 in the second waveguide 20 (see Figure 3).

[0027] The outermost surface layer of the second inner wall 24 of the second waveguide 20 is preferably a metal plated layer. Furthermore, the metal plated layer is more preferably a gold plated layer.

[0028] (5) Distance sensor 40 and temperature sensor 50 Fig. 4 is a cross-sectional view showing a state in which the distance sensor 40, the temperature sensor 50, the main body case 70, etc., which are mounted on a printed wiring board 75, are attached to the sensor introduction unit 100 of the embodiment. Fig. 5 is a cross-sectional view shown for explaining the sensor introduction unit 100 of the embodiment. Fig. 5 is a cross-sectional view of the vicinity of the optical axis AX1 when the sensor introduction unit 100 is viewed from the direction of the arrow D (see Figs. 2 to 4).

[0029] (5-1) The distance sensor 40 is a sensor for measuring the distance between the object to be measured and the temperature measuring device 1. When measuring the temperature of the object to be measured, if the distance between the object to be measured and the temperature sensor 50 is inappropriate, the temperature may not be measured properly. For this reason, the distance sensor 40 is designed to enable proper temperature measurement of the object to be measured while measuring the distance.

[0030] 4 and 5, the distance sensor 40 has a light-emitting element 41 and a light-receiving element 42. The light-emitting element 41 outputs measurement light for distance measurement. The light-receiving element 42 has a light-receiving element that inputs reflected light generated when the measurement light is reflected by the measurement object. The distance sensor 40 measures the distance to the measurement object by measuring the reflected light input to the light-receiving element 42.

[0031] The distance sensor 40 is disposed facing the first base end opening 12 of the first waveguide 10 by some mounting method in a positional relationship such that the light emitting surface 41a of the light emitting element 41 and the light receiving surface 42a of the light receiving element 42 face the outside (see also FIG. 2). In other words, when the first base end opening 12 of the distance sensor 40 is treated as a window, the light emitting surface 41a of the light emitting element 41 and the light receiving surface 42a of the light receiving element 42 are disposed near the window, and when the first waveguide 10 is viewed from the outside, the light emitting surface 41a of the light emitting element 41 and the light receiving surface 42a of the light receiving element 42 are disposed so as to face the outside from the position of the window.

[0032] In the example shown in the figure, the distance sensor 40 is mounted on a printed wiring board 75, and the printed wiring board 75 is fixed to a plate-like mounting member 30 described below, so that the distance sensor 40 is disposed in a distance sensor mounting portion 19 near the first base end opening 12. Note that the distance sensor 40 may be disposed inside the first hollow portion 13 surrounded by the first inner wall 14 (see the figure), or may be disposed slightly outside.

[0033] (5-2) Temperature sensor 50 is a sensor that detects infrared rays radiated from an object to be measured using infrared detection element 51 to measure the temperature of the object to be measured. The temperature sensor 50 has an infrared detection element 51, and is disposed opposite the second base end opening 22 of the second waveguide 20 by some mounting method (for example, by fixing a lead terminal 58 of the temperature sensor 50 to a printed wiring board (not shown)) in a positional relationship such that the light receiving surface 51a of the infrared detection element 51 faces the outside (see also FIG. 2). In the example shown in the figure, the temperature sensor 50 is arranged in the temperature sensor arrangement portion 29 of the second waveguide 20 whose second inner wall 24 is an approximately parabolic surface, and the light receiving surface 51a of the infrared detection element 51 of the temperature sensor 50 is arranged at a position near the focus FC of the parabolic surface.

[0034] (6) Integration of the plate-shaped mounting member 30, the first waveguide 10, and the second waveguide 20 (6-1) The plate-shaped mounting member 30 is a member that is attached to the main body case 70 while structurally connecting the first waveguide 10 and the second waveguide 20. The plate-shaped mounting member 30 is substantially plate-shaped, and is attached to the main body case 70 such that at least a portion of the front surface 31 or the back surface 32 abuts against the main body case 70 (see FIG. 4). In the example shown in the figure, the plate-shaped mounting member 30 has a fixing screw hole 33, and the plate-shaped mounting member 30 is fixed to the main body case 70 by inserting a screw 78 through the fixing screw hole 33 (see Figure 4).

[0035] The thickness of the plate-shaped mounting member 30 (the dimension from position P1 on the front surface to position P2 on the back surface; see Figure 3) is set to be smaller than the axial depth D2 from the second front end opening 21 to the second base end opening 22 in the second waveguide 20. In the plate-like mounting member 30, the first hollow portion 13 of the first waveguide 10 penetrates between the front surface 31 and the back surface 32 of the plate-like mounting member 30, and the second hollow portion 23 of the second waveguide 20 penetrates between the front surface 31 and the back surface 32 of the plate-like mounting member 30, so that the first waveguide 10 and the second waveguide 20 are formed integrally with the plate-like mounting member 30. In other words, when the sensor introduction unit 100 is viewed from above, the first waveguide 10 and the second waveguide 20 penetrate at the first hollow portion 13 and the second hollow portion 23, and are integrated with the plate-like mounting member 30 while being spatially connected between the front surface 31 and the back surface 32 of the plate-like mounting member 30.

[0036] At this time, the plate-like mounting member 30 is disposed with respect to the second waveguide 20 such that a position P1 on the front surface 31 and a position P2 on the back surface 32 of the plate-like mounting member 30 are closer to the second front end opening 21 than the second base end opening 22. In other words, the second waveguide 20 is disposed so that the second front end opening 21 is located on the outer surface side of the main body case 70 (see FIG. 3).

[0037] Moreover, it is preferable that the first waveguide 10 and the second waveguide 20 are integrated together with the plate-shaped mounting member 30 such that the edge 11a of the first front end opening 11 of the first waveguide 10 and the edge 21a of the second front end opening 21 of the second waveguide 20 are arranged on substantially the same imaginary plane VS (see FIG. 3). Although the imaginary plane VS is a flat plane in the drawing, it is not limited thereto and may be a curved surface.

[0038] (6-2) In the example shown in the figures, the plate-shaped mounting member 30 has a notch 35 in the thickness direction for disposing the printed wiring board 75. By utilizing such a notch 35, as shown in Figures 4 and 5, the printed wiring board 75 on which the distance sensor 40 is mounted is disposed between the position of the first base end opening 12 of the first waveguide 10 and position P2 (Figure 3) on the back surface 32 of the plate-shaped mounting member 30, improving assembly and saving space.

[0039] (6-3) Any method may be used for integrating the first waveguide 10, the second waveguide 20, and the plate-like mounting member 30. For example, the first waveguide 10, the second waveguide 20, and the plate-like mounting member 30 may be integrally formed from resin.

[0040] Specifically, the first waveguide 10, the second waveguide 20, and the plate-like mounting member 30 may be integrally formed from, for example, so-called ABS resin, and then, as necessary, a base plating such as chrome plating may be applied, and further, a plating with high reflectivity such as gold plating may be applied to the outermost layer to form a gold plating layer. The outermost metal plating may be a plating other than gold, such as silver plating, aluminum, nickel-chrome, or rhodium, as long as it has a high reflectivity. The plating may be applied only to the first inner wall 14 of the first waveguide 10 and the second inner wall 24 of the second waveguide 20.

[0041] Alternatively, a configuration may be adopted in which a metal plating layer is formed on the entire surfaces of the integrated first waveguide 10, second waveguide 20 and plate-like mounting member 30.

[0042] 2. Effects of the Temperature Measuring Device 1 According to the Embodiment (1) In the temperature measuring device 1 of embodiment 1, the first waveguide 10 and the second waveguide 20 are formed integrally with the plate-shaped mounting member 30 such that the first hollow portion 13 of the first waveguide 10 penetrates between the front surface 31 and the back surface 32, and the second hollow portion 23 of the second waveguide 20 penetrates between the front surface 31 and the back surface 32.

[0043] Therefore, the first waveguide 10 and the second waveguide 20 can be handled as a single unit using the plate-shaped mounting member 30 as an intermediary, dramatically improving the ease of installation of the first waveguide 10 and the second waveguide 20 (and thus the distance sensor 40 and the temperature sensor 50) to the main body case 70.

[0044] As for optical alignment, since the positional relationship and distance between the first waveguide 10 and the second waveguide 20 are already fixed, it is necessary to manage only the mounting positions of the distance sensor 40 and the temperature sensor 50, improving assembly efficiency. Furthermore, the assembly accuracy is improved, which contributes to realizing highly accurate temperature measurement.

[0045] Furthermore, in the temperature measuring device 1, the first waveguide 10, the second waveguide 20, and the plate-like mounting member 30 are integrated, and the entire device can have a relatively large heat capacity. Therefore, even if heat is generated near the temperature sensor arrangement portion 29 (near the second base end opening portion 22) where infrared rays are converged to a considerable extent, it is possible to prevent heat from being trapped only in the vicinity of the temperature sensor arrangement portion 29.

[0046] Furthermore, since the first front end opening 11 and the adjacent first inner wall 14, the second front end opening 21 and the adjacent second inner wall 24, and the portion of the plate-shaped mounting member 30 facing the outside are in contact with the outside air, it is possible to dissipate the heat caused by the convergence of infrared rays described above over a relatively large surface area. Then, even if heat is generated near the temperature sensor arrangement portion 29 (near the second base end opening 22), the temperature of the temperature sensor 50 and the second waveguide 20 can be quickly brought close to the outside air temperature by dissipating the heat with this configuration, and even if the outside air temperature changes, the temperature sensor 50 and the second waveguide 20 can be quickly brought close to the outside air temperature by quickly dissipating or absorbing heat. This contributes to realizing highly accurate temperature measurement with small error.

[0047] In the temperature measuring device 1 according to the first embodiment, the axial depth D1 from the first front end opening 11 to the first base end opening 12 in the first waveguide 10 is set to be smaller than the axial depth D2 from the second front end opening 21 to the second base end opening 22 in the second waveguide 20. From another perspective, the axial length of the first inner wall 14 of the first waveguide 10 is set to be relatively small, and the distance sensor is disposed near the outer surface of the main body case. However, since the first waveguide 10 is a relatively short tube and the length of the first inner wall 14 is also short, the probability of diffuse reflection by the first inner wall 14 can be reduced. Therefore, the probability that the measurement light emitted from the light emitting element 41 of the distance sensor 40 is diffusely reflected by the inner wall and partly returned to the light receiving element 42 can be reduced, and as a result, the accuracy of the distance measurement can be improved. This can contribute to the realization of highly accurate temperature measurement.

[0048] From the above, the temperature measuring device 1 according to the first embodiment can perform highly accurate temperature measurement while being more efficient in assembly than conventional temperature measuring devices.

[0049] (2) In the temperature measuring device 1, the first waveguide 10, the second waveguide 20 and the plate-like mounting member 30 are integrally formed from resin, the first inner wall 14 of the first waveguide 10 is mirror-finished, and the outermost layer of the second inner wall 24 of the second waveguide 20 is a metal-plated layer.

[0050] By providing a mirror finish to the first inner wall 14 of the first waveguide 10, it is possible to suppress diffuse reflection (scattering of light) when the distance sensor 40 receives and emits light. In addition, by providing the outermost layer of the second inner wall 24 of the second waveguide 20 with a metal plating layer, it is possible to efficiently collect infrared rays near the temperature sensor arrangement portion 29. Since a metal having a higher thermal conductivity than resin is provided in the outermost layer and this outermost layer is configured to be in contact with the outside air, it is possible to efficiently dissipate heat generated near the temperature sensor arrangement portion 29 (near the second base end opening 22) to the outside via the metal plating layer.

[0051] (3) By using gold as the metal plating layer, it is possible to provide high light reflectance and high thermal conductivity, resulting in high heat dissipation efficiency, and also to create a robust temperature measurement device that is resistant to corrosion and erosion by air.

[0052] (4) By forming a metal plating layer on the entire surfaces of the integrated first waveguide 10, second waveguide 20, and plate-like mounting member 30, the process for mirror finishing the first waveguide 10 and the process for increasing the reflectance of the second waveguide can be performed in a single common plating process without complex partial plating, thereby further improving manufacturing efficiency (assembly efficiency).

[0053] (5) By configuring the second inner wall 24 of the second waveguide 20 so that the inner diameter increases from the second base end opening 22 to the second front end opening 21 along the optical axis AX2, it is possible to efficiently focus the infrared rays near the temperature sensor arrangement portion 29. Furthermore, by configuring the second inner wall 24 of the second waveguide 20 to have a substantially parabolic surface, it is possible to more efficiently focus the infrared rays near the temperature sensor arrangement portion 29.

[0054] (6) In the temperature measuring device 1, the first waveguide 10 and the second waveguide 20 are integrated together with the plate-shaped mounting member 30 such that the edge 11a of the first front-end opening 11 of the first waveguide 10 and the edge 21a of the second front-end opening 21 of the second waveguide 20 are arranged on approximately the same imaginary plane. By configuring it in this manner, the edge 11a of the first front-end opening 11 and the edge 21a of the second front-end opening 21 are aligned on the same imaginary plane, improving assembly and allowing for a smooth exterior design when the temperature measuring device 1 is assembled.

[0055] Although the present invention has been described based on the above embodiment, the present invention is not limited to the above embodiment. It can be embodied in various forms without departing from the spirit of the present invention, and for example, the following modifications are also possible.

[0056] (1) In the description of the embodiment, the substantially cylindrical second waveguide 20 has an internal space surrounding the infrared detection element 51 of the temperature sensor 50 in addition to the second hollow portion 23 that essentially constitutes a waveguide, and the vicinity of the infrared detection element 51 is also accommodated in the internal space (see FIG. 4). However, the present invention is not limited to this. For example, the temperature measuring device may be configured in such a manner that the temperature sensor 50 (infrared detection element 51) is disposed outside the second base end opening 22 as shown in FIG. 6. 6 is a cross-sectional view of a modified sensor introduction unit 100'. Although Fig. 6 is a cross-sectional view corresponding to Fig. 3, a temperature sensor 50 is also shown to facilitate understanding.

[0057] (2) In Figures 2 to 5, the distance sensor 40 is illustrated on the assumption that the light-emitting element 41 and the light-receiving element 42 are integrated into one unit component. However, the present invention is not limited to this. The light-emitting element 41 and the light-receiving element 42 may be prepared as independent components.

[0058] (3) The first inner wall 14 of the first waveguide 10 may be mirror-finished, for example, by mounting a pipe (not shown) having a plated inner surface on the plate-shaped mounting member 30. Alternatively, for example, an optical fiber having an outer diameter corresponding to the inner diameter of the first waveguide 10 may be embedded in the first hollow portion 13 coaxially with the first waveguide 10, and the measurement light may be reflected by the inner surface of the optical fiber, thereby substantially achieving the function of mirror-finishing the first inner wall 14.

[0059] (4) Although the temperature measuring device 1 shown in Fig. 1 is described as a portable temperature measuring device, the present invention is not limited to this. For example, the present invention can be applied to a fixed, installed temperature measuring device, etc. [Explanation of symbols]

[0060] 1...temperature measuring device, 10...first waveguide, 11...first front end opening, 11a...edge of first front end opening, 12...first base end opening, 13...first hollow portion, 14...first inner wall, 19...distance sensor arrangement portion, 20...second waveguide, 21...second front end opening, 21a...edge of second front end opening, 22...second base end opening, 23...second hollow portion, 24...second inner wall, 29...temperature sensor arrangement portion, 30...plate-shaped mounting member, 31...surface of plate-shaped mounting member, 32...back side of plate-shaped mounting member, 33...fixing screw hole, 35 ...thickness direction notch, 40...distance sensor, 41...light emitting element, 41a...light emitting surface, 42...light receiving element, 42a...light receiving surface of light receiving element, 50...temperature sensor, 51...infrared detection element, 51a...light receiving surface of infrared detection element, 58...lead terminal of temperature sensor, 70...main body case, 75...printed wiring board, 78...screw, 81...human I / F surface, 82...sensing light input surface, 83...grip, 88...operation switch, 89...display, 100,100'...sensor introduction unit,

Claims

1. A temperature measurement device that measures the temperature of an object to be measured in a non-contact manner using a distance sensor that measures the distance to the object to be measured and a temperature sensor that detects infrared rays radiated from the object to be measured, a first waveguide having a substantially cylindrical shape, the first waveguide having a first front-end opening that opens to the outside and a first base-end opening that is opposite the first front-end opening and opens into the inside of the temperature measuring device, the first waveguide guiding light received by the distance sensor via a first inner wall that defines a first hollow portion formed from the first front-end opening to the first base-end opening; a second waveguide having a substantially cylindrical shape, the second waveguide having a second front-end opening that opens to the outside and a second base-end opening that opens to the inside of the temperature measuring device on the opposite side of the second front-end opening, the second waveguide guiding light received by the temperature sensor via a second inner wall that defines a second hollow portion formed from the second front-end opening to the second base-end opening; the distance sensor having a light emitting element and a light receiving element, the distance sensor being disposed opposite the first base end opening in a positional relationship such that a light emitting surface of the light emitting element and a light receiving surface of the light receiving element face outward; the temperature sensor having an infrared detection element and disposed opposite the second base end opening in a positional relationship such that a light receiving surface of the infrared detection element faces outward; a plate-shaped mounting member that is substantially plate-shaped and is attached to the main body case so that at least a portion of the front or back surface thereof abuts against the main body case; a depth in the axial direction from the first front-end opening to the first base-end opening in the first waveguide is set to be smaller than a depth in the axial direction from the second front-end opening to the second base-end opening in the second waveguide, the first and second waveguides are formed integrally with the plate-like mounting member such that the first hollow portion of the first waveguide penetrates between the front surface and the back surface, and the second hollow portion of the second waveguide penetrates between the front surface and the back surface, and the plate-like mounting member is disposed relative to the second waveguide such that the front surface and the back surface are closer to the second front end opening than the second base end opening. A temperature measuring device characterized by:

2. 2. The temperature measuring device according to claim 1, the first waveguide, the second waveguide, and the plate-like mounting portion are integrally formed from resin, the first inner wall of the first waveguide is mirror-finished; the outermost surface layer of the second inner wall of the second waveguide is a metal plating layer; A temperature measuring device characterized by:

3. 3. The temperature measuring device according to claim 2, wherein the metal plating layer is a gold plating layer.

4. 4. The temperature measuring device according to claim 2, wherein a plating layer of the metal is formed on all surfaces of the integrated first waveguide, second waveguide and plate-like mounting portion.

5. 2. The temperature measuring device according to claim 1, a second inner wall of the second waveguide configured to have an inner diameter that increases along an optical axis from the second base end opening toward the second front end opening;

6. 6. The temperature measuring device according to claim 5, the second inner wall of the second waveguide is a substantially parabolic surface, A temperature measuring device, characterized in that the light receiving surface of the infrared detection element of the temperature sensor is arranged at a position near the focus of the paraboloid.

7. 2. The temperature measuring device according to claim 1, the first waveguide and the second waveguide are integrated together such that an edge of the first front-end opening of the first waveguide and an edge of the second front-end opening of the second waveguide are positioned on substantially the same imaginary plane.

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