Atomizer cores and methods of manufacturing the same

Abstract

To provide an atomizer core, an atomizer core substrate and a method of manufacturing the atomizer core substrate as well as an aerosol generating device incorporating the same.SOLUTION: An atomizer core 10 has a core body 212 having a first surface 214 and a second surface 216. The core body 212 includes a substrate 12 and a heater with a plurality of channels extending between the first surface 214 and the second surface 216 for transferring an aerosol precursor from the first surface 214 through the substrate 12 and the heater to the second surface 216, the heater configured to heat the aerosol precursor to form an aerosol on the second surface 216. In other embodiments, an insulator is disposed between the substrate 12 and the heater, and configured to insulate the substrate 12 at least partially from heat generated by the heater.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates generally to atomization applications, and more particularly to an atomizer core for an aerosol generating device and a method for manufacturing the atomizer core. [Background technology]

[0002] Aerosol generating devices, also called aerosol inhalers or vaporizers, contain components for heating aerosol precursor materials to generate an aerosol for inhalation by a user. The problem with such components is that they may generate harmful or potentially harmful components (HPHCs). Also, known devices do not allow for the desired level of control over the dosage of the aerosol.

[0003] There is a need for improved components for aerosol generating devices that address one or more of the problems of known devices such as those described above. Summary of the Invention

[0004] In one embodiment, an atomizer core is provided, the atomizer core comprising: a core body having a first surface and a second surface, the core body including a substrate, a heater, and an insulating material disposed between the first surface and the second surface, the insulating material disposed between the substrate and the heater; and a plurality of flow paths extending between the first surface and the second surface for transporting an aerosol precursor from the first surface through the substrate, the insulating material, and the heater to the second surface, the heater adapted to heat the aerosol precursor to form an aerosol at the second surface, and the insulating material adapted to at least partially insulate the substrate from heat generated by the heater.

[0005] In another aspect, an atomizer core is provided, the atomizer core comprising a core body having a first surface and a second surface, the core body including a substrate formed from a conductive material, and a plurality of flow paths extending between the first surface and the second surface for transporting an aerosol precursor from the first surface through the substrate to the second surface, the conductive material of the substrate adapted to heat the aerosol precursor to form an aerosol at the second surface.

[0006] In another aspect, an atomizer core is provided, the atomizer core comprising a core body having a first surface and a second surface, the core body including a substrate formed from silicon, and a plurality of flow paths extending between the first surface and the second surface for transporting an aerosol precursor from the first surface through the substrate to the second surface, the conductive material of the substrate being adapted to heat the aerosol precursor to form an aerosol at the second surface, and the substrate being treated with diffusion or ion implementation to conduct electricity and generate heat for heating the aerosol source.

[0007] In another aspect, a method of manufacturing a substrate for an atomizer core is provided, the method including providing a glass substrate, treating the glass substrate with a laser at selected locations to modify properties of the glass substrate at the selected locations, and etching the glass substrate to form a plurality of perforations at the selected locations.

[0008] In another aspect, a method for manufacturing a substrate for an atomizer core is provided, the method including providing a silicon substrate, patterning a photoresist on a surface of the silicon substrate at selected locations, and etching the silicon substrate to form a plurality of holes at the selected locations.

[0009] In another aspect, a method for manufacturing a substrate for an atomizer core is provided, the method including providing a substrate to a negative pole of an electrolytic cell in a chemical solution, providing an electrode pin array as an anode of the electrolytic cell, applying a voltage between the perforation probe array and the negative pole to corrode the substrate in the chemical solution, and generating perforations at selected points of the substrate.

[0010] In another embodiment, the method is a porous anodic oxidation (PAO) method and the substrate is made of aluminum.

[0011] In another aspect, a substrate for an atomizer core is provided, the substrate comprising a first region having a plurality of perforations passing through a bottom surface and a top surface of the substrate, where an aerosol source flows through the perforations from the bottom surface to the top surface during use of the atomizer core, and one or more second regions adjacent the first region, the one or more second regions having a plurality of blind perforations, each of the blind perforations passing through the bottom surface of the substrate, extending to a depth toward the top surface and terminating at a near end of the top surface, or the blind perforations are open at the top surface but terminate at a near end of the bottom surface.

[0012] In another aspect, a substrate for an atomizer core is provided, the substrate comprising a first region having a plurality of perforations passing through a bottom surface and a top surface of the substrate, where an aerosol source flows through the perforations from the bottom surface to the top surface during use of the atomizer core, and one or more second regions adjacent the first region, the one or more second regions having one or more blind lines, each of the blind lines passing through the bottom surface of the substrate, extending to a depth toward the top surface, and terminating at a near edge of the top surface, or alternatively, the blind lines are open at the top surface but terminate at a near edge of the bottom surface.

[0013] In another aspect, a substrate for an atomizer core is provided, the substrate including a first substrate portion and a second substrate portion, each of the first substrate portion and the second substrate portion having a plurality of through holes, and a gap may or may not be formed between the first substrate portion and the second substrate portion.

[0014] Reference will now be made, by way of example, to the accompanying drawings which illustrate exemplary embodiments of the present application. [Brief description of the drawings]

[0015] [Figure 1] 1 is a schematic diagram of an aerosol generating device having an atomizer core according to an embodiment of the present invention. [Diagram 2] FIG. 2 is an exploded view of the atomizer core of FIG. 1. [Diagram 3] FIG. 2 is an exploded view of an atomizer core according to another embodiment of the present application. [Figure 4] FIG. 2 is a cross-sectional view of an atomizer core according to another embodiment of the present application. [Diagram 5] FIG. 2 is an exploded view of an atomizer core according to another embodiment of the present application. [Figure 6A] FIG. 13 is a top view of a substrate for an atomizer core according to another embodiment of the present application. [Figure 6B] 6B is a cross-sectional view of the substrate of FIG. 6A taken along line AA. [Figure 7A] FIG. 13 is a top view of a substrate for an atomizer core according to another embodiment of the present application. [Figure 7B] 7B is a cross-sectional view of the substrate of FIG. 7A taken along line BB. [Figure 8A] FIG. 2 is a perspective view of a substrate for an atomizer core according to another embodiment of the present application. [Figure 8B] 8B is a cross-sectional view of the substrate shown in FIG. 8A taken along line AA. [Figure 8C] FIG. 8B is a perspective view of a pad for use with the substrate shown in FIG. 8A. [Figure 9] FIG. 2 is a schematic diagram of an atomizer core according to another embodiment of the present application. [Figure 10A]FIG. 2 is a schematic diagram of two atomizer cores according to another embodiment of the present application. [Figure 10B] FIG. 2 is a schematic diagram of two atomizer cores according to another embodiment of the present application. [Figure 11A] FIG. 2 is a schematic diagram of two atomizer cores according to another embodiment of the present application. [Figure 11B] FIG. 2 is a schematic diagram of two atomizer cores according to another embodiment of the present application. [Figure 12] FIG. 2 is a schematic diagram of an atomizer core according to another embodiment of the present application. [Figure 13] FIG. 2 is a schematic diagram of an atomizer core according to another embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] In the different drawings, like reference symbols are used to denote like elements.

[0017] 1 is a schematic diagram of an aerosol generating device 200 according to an embodiment of the present invention. The aerosol generating device 200 includes a housing 202, a mouthpiece 204, a reservoir 206 for containing an aerosol precursor material 208 (also referred to herein as an aerosol precursor or an aerosol source), a power supply 210, and an atomizer core 10. The atomizer core 10 includes a core body 212 having a first surface 214 and a second surface 216. The first surface 214 and the second surface 216 are opposite and parallel to each other. The first surface 214 is disposed proximate to the reservoir 206 for receiving the aerosol precursor 208. The second surface 216 is where the aerosol is generated from the aerosol precursor 208. The first surface 214 is also referred to herein as a bottom surface, with reference to the atomizer core 10 or components thereof (such as a substrate) and alternative embodiments. Similarly, the second surface 216 is also referred to herein as the top surface, with reference to the atomizer core 10 or components thereof (such as the substrate) and alternative embodiments.

[0018] Referring to FIG. 2, the core body 212 includes the substrate 12, the insulation 14, and the heater 16. A plurality of perforations 18 (also referred to herein as channels or microchannels) are defined through the core body 212 from the first surface 214 to the second surface 216 for transporting the aerosol precursors 208 from the first surface 214 through the substrate 12, the insulation 14, and the heater 16 to the second surface 216. As shown in FIG. 2 and other figures, the plurality of perforations 18 preferably have a uniform diameter and a uniform distribution or spacing from adjacent perforations. Each perforation 18 includes a first opening 18a at the first surface 214 and a second opening 18b at the second surface 216. The perforations 18 are in fluid communication with the aerosol precursors 208 entering each perforation through the first opening 18a and the aerosol precursors 208 exiting each perforation 18 through the second opening 18b to be transformed into an aerosol. In this embodiment, the first surface 214 and the second surface 216 are each planar. The first surface 214 has a first area A1 and the second surface 216 has a second area A2. In this embodiment, the core body 212 is box-shaped having a length L, a width W and a uniform thickness T. The core body 212 may have other shapes as shown in other embodiments.

[0019] The perforations 18 may be formed at selected locations through the core body 212 in a single operation, for example by a laser.

[0020] Perforations 18 may be formed in substrate 12 first. Insulation 14 may then be formed on substrate 12, heater 16 may then be formed on insulation 14, and passive layer 19 or other layers may then be formed on heater 16, all using thin film deposition processes. -10 The perforations 18 on the substrate 12 form a film on an atomic level, such as a film on the order of 10 -7Since the insulating material 14, the heater 16, and the passive layer 19 formed by the respective films have a much larger size, such as a level of 100 mm or more, the insulating material 14, the heater 16, and the passive layer 19 formed by the respective films have substantially the same perforation size 18 as the substrate 12. The perforations 18 may alternatively be formed in the insulating material 14, the heater 16, and the passive layer 19 by screen printing on the substrate 12, with substantially the same perforation size 18 throughout all layers. The perforations 18 may be formed by other applicable techniques. The perforations 18 formed in each of the substrate 12, the insulating material 14, the heater 16, and the passive layer 19 collectively form the perforations 18 extending between the first surface 214 and the second surface 216 of the core body 212.

[0021] The diameter of the perforations 18 may be from 15 nm to 250 microns, preferably from 100 nm to 50 microns. In some examples, the diameters of the perforations in the substrate 12, the insulation 14, the heater 16, and the passive layer 19 may be different. For example, the diameter of the perforations 18 in the first surface 214 may be larger than the perforations 18 in the second surface 216, and may be 500 microns (μm) or more larger than the perforations 18 in the second surface 216 (in other words, the perforations may taper from a larger diameter to a smaller diameter between the first surface 214 and the second surface 216).

[0022] The cross-sectional shape of the perforations 18 may be circular, oval, square, triangular, rectangular, or any other desired shape. Preferably, the cross-sectional shape of all of the perforations 18 is uniform in the core body 212 for better dosage control.

[0023] The insulation 14 is disposed between the substrate 12 and the heater 16. The insulation 14 may have a layer or a film deposited on the substrate 12. The insulation 14 preferably has the same length L and width W as the core body 212, and preferably has a uniform thickness that can be varied for different insulating materials and vaporization requirements. In one example, the insulation 14 may be formed from a low thermal conductivity material, such as Al2O3, SiO2, ZrO2, HfO2, ZnO, TiO2, etc.

[0024] The heater 16 may have a layer or film deposited on the insulation 14. The heater 12 preferably has the same length L and width W as the core body 212, and preferably has a uniform thickness, for example in the range of less than 20 microns. The heater 16 is configured to generate a desired amount of heat to heat or vaporize the aerosol precursor 208 to generate the aerosol.

[0025] In some examples, after the substrate 12 with perforations 18 is formed, the insulation 14 and heater 16 may be formed, for example, with a metal or alloy thin film, a conductive low-oxygen thin film or coating, or direct metal foil bonding. The heating performance of the heater 16 may be different by using materials with different resistivity characteristics. In one example, the heater 16 is made from a biocompatible metal, or an alloy based on a biocompatible metal, or an alloy based on Ni-Cr. The biocompatible metal may include Al, Ti, Ta, Zr, Pt, Au, Ag, Pd, Re, Yb, Y, Ce, La, Hf, Si, and alloys thereof, as well as medical stainless steel.

[0026] In this manner, the insulation 14 reduces or eliminates heat loss due to heat transfer from the heater 16 to the substrate 12. Therefore, the insulation 14 allows the atomizer core 10 to efficiently and quickly heat the aerosol source to a desired temperature by the heater 16 of the atomizer core 10. This improves the aerosol volume of the first puff and enhances the user experience. Thus, the insulation 14 improves the vaping performance of the atomizer core 10, such as safety, taste, capacity, and vapor generation rate. By reducing heat loss, the insulation 14 also saves the power required by the heater 16 to heat the aerosol source, especially when the thermal conductivity of the substrate 12 is high.

[0027] In one example, the insulation 14 is a buffer layer between the substrate 12 and the heater 16 and can enhance the mechanical and thermal performance of the atomizer core 10 during vaping.

[0028] In some examples, the atomizer core 10 may further include a passive layer 19 deposited on the exposed surface of the heater 16. The passive layer 19 protects the heater 16 from oxidation. In some examples, the passive layer 19 may be omitted if the heater 16 is made from a material that is resistant to oxidation, such as a Pd-Ag alloy, or Pt, Au, Pd, Re, metals, alloys based thereon, medical grade stainless steel, or alloys based on Ni-Cr. In some examples, a heater 16 made from a metal or alloy film may include an additional passive layer 19 to protect the heater 16 from oxidation during aerosol generation.

[0029] In one example, the atomizer core 10 may further include a pair of electrodes 17a and 17b for supplying power to the heater 16 from a power source 210 such as a battery. The electrodes 17a and 17b are made of a biocompatible material with good electrical conductivity, such as silver. The electrodes 17a and 17b are preferably in physical contact with the heater 16. The atomizer core 10 can generate an aerosol at the second surface 216 of the atomizer core 10 by heating the aerosol source 208 with the heater 16. In one example, if the heater 16 is made of a conductive material such as Ti, or Ta, or an alloy foil of Ti or Ta, and the conductive material has a sufficient thickness such as more than 20 μm, the pair of electrodes 17a and 17b may be omitted from the atomizer core 10. If a passive layer 19 is included, the passive layer 19 is made of a conductive material such as gold or an Au-Ag alloy.

[0030] FIG. 3 illustrates another embodiment of the atomizer core 20. Similar reference numbers are used to indicate similar elements of the embodiments described herein. The atomizer core 20 includes a core body 212 having a first surface (or bottom surface) 214 and a second surface (or top surface) 216. The core body 212 includes a substrate 22 formed of a conductive material. The substrate 22 has a plurality of micro-channels formed by a plurality of perforations 22a. The plurality of perforations 22a allows the aerosol source to flow from the first surface 214 to the second surface 216 of the substrate 22. The substrate 22 is configured to generate heat for heating or vaporizing the aerosol source to generate an aerosol. The substrate 22 is preferably made of SiC, metal or carbon-based ceramics, conductive silicon single crystal or polycrystal. For conductive materials, the substrate 22 may generate heat when power is supplied to the substrate 22 from a power supply source 210, such as a battery. In this manner, the substrate 22 can function as both a substrate and a heater. Therefore, the atomizer core 20 has a simpler structure than existing atomizer cores.

[0031] In one example, the substrate 22 may be fabricated by a metal foil bonding process that forms both the substrate and the heater. For example, Ti, Ta, or other biometals or their alloys may be directly bonded to a glass, crystalline, or ceramic substrate to form both the substrate and the conductive layer as a heater. In another example, a Ti foil may be directly bonded to a sapphire surface, quartz glass, or other substrate. The perforations 22a may be formed in a manner similar to the perforations 18 of the atomizer core 10 described above.

[0032] In some examples, the atomizer core 20 may further include a passive layer 24 disposed on an upper surface of the substrate 22. The passive layer 24 protects the substrate 22 from oxidation. The passive layer 24 may be made of an oxidation-resistant material, such as Al2O3, SiO2, ZrO2, HfO2, TiO2, or ZnO. In some examples, if the material of the substrate 22 is also oxidation-resistant, the passive layer 24 can be omitted from the atomizer core 20.

[0033] In one example, the atomizer core 20 may further include a pair of electrodes 26a and 26b disposed on the upper surface of the substrate 22 or on the passive layer 24 to supply power from a power source to the substrate 22 to generate heat. In either case, the electrodes 26a and 26b may be made of a material with good electrical conductivity, such as silver. The electrodes 26a and 26b are in electrical communication with the substrate 22. If the passive layer 24 is also electrically conductive, the pair of electrodes 26a and 26b may be omitted.

[0034] 3, the passive layer 24 has the same perforation pattern as the substrate 22 and may be formed by thin film deposition or other processes as previously described. The passive layer 24 does not block the perforations 22a or the microchannels of the substrate 22 and allows the aerosol source to flow to the top surface of the substrate 22.

[0035] 4 shows an atomizer core 30 according to another embodiment. The atomizer core 30 includes a core body 212 having a first surface 214 and a second surface 216. The core body 212 includes a substrate 32 formed of silicon. The core body 212 includes a plurality of microchannels formed by a plurality of perforations 32a. The plurality of perforations 32a allow the aerosol source to flow from the first surface 214 to the second surface 216 of the core body 212. The perforations 32a may be formed in a manner similar to the perforations 18 of the atomizer core 10 described above.

[0036] In the example of FIG. 4, the silicon substrate 32 may be treated to make it suitable for conducting electricity. For example, the silicon substrate 32 may be treated with diffusion or ion implantation to form a top layer 34. For example, the depth of the diffusion or ion implantation may be less than 10 μm. Ion implantation is a low-temperature process that involves accelerating ions of a particular element towards the silicon substrate 32 to change the chemical and physical properties of the silicon substrate 32. Ion implantation is isotropic and directional. Diffusion is used to introduce impurities into the silicon substrate 32. Diffusion is isotropic and involves lateral diffusion. By treating the layer 34 with diffusion or ion implantation, the layer 34 becomes, for example, 10 μm deep. -1 ~10-5 The treated layer 34 provides a low resistivity, such as an electrical resistance of Ω / m. The low resistivity of the treated layer 34 allows the layer 34 to conduct electricity. Thus, the treated layer 34 can function as a heater. When power is applied to the layer 34, the treated layer 34 can generate heat to generate an aerosol from an aerosol source dispensed on the surface 34. In an alternative embodiment, the silicon substrate 32 may be further subjected to a diffusion or ion mounting process to form a SiO2 insulator layer between the substrate 32 and the top layer 34.

[0037] Figure 5 shows an atomizer core 40 according to another embodiment of the present application. In the example of Figure 5, the atomizer core 40 comprises a core body 212 having a first surface 214 and a second surface 216. The core body 212 includes a tubular substrate 44 and a tubular heater 42 for covering the inner surface of the tubular substrate 44. An insulator may be added between the substrate 44 and the heater 42. A passive layer may be added to the heater 42.

[0038] The core body 212 includes a plurality of micro-channels formed by a plurality of perforations 44a. The perforations 44a allow the aerosol source to flow from the outer surface of the tubular substrate 44 to the tubular heater 42 at the inner surface of the tubular substrate 44 to generate an aerosol. The perforations 44a may be formed in a manner similar to the perforations 18 of the atomizer core 10 described above.

[0039] In one example, when the aerosol source is located on the outer surface of the tubular substrate 44, the plurality of perforations 44a allows the aerosol source to flow from the outer surface to the heater 42 at the inner surface of the tubular substrate 44 to generate an aerosol. In one example, when the aerosol source is located on the inner surface of the tubular substrate 44, the plurality of perforations 44a allows the aerosol source to flow from the inner surface to the heater 42 at the outer surface of the tubular substrate 44 to generate an aerosol.

[0040] The tubular heater 42 may be made from the same material as the heater 16 in the example of Figures 2 and 3. The tubular substrate 44 may be made from the material of the substrate 22 in the example of Figure 4, or from the diffusion or ion implantation treated silicon substrate layer 34 in the example of Figure 4. In this case, the tubular heater 42 may be omitted. Upon supplying power to the tubular substrate 44, either the inner surface or the outer surface of the tubular substrate 44 may be selected to generate heat for generating an aerosol from the aerosol source in the tubular substrate 44.

[0041] In the above examples of atomizer cores 10, 20, 30, 40, the microchannels formed by perforations in the core body 212 may be substantially perpendicular to the first surface 214 and the second surface 216 of the core body 212, or may form any angle between the microchannels and the first and second surfaces of the core body 212.

[0042] 6A and 6B show a substrate 50 according to another embodiment of the present application. In the example of FIG. 6A and 6B, the substrate 50 may include a first region 52 and second regions 54, 56. Each second region may be adjacent to the first region 52.

[0043] As shown in the example of FIG. 6A, the first region 52 has a plurality of perforations 52a. As shown in FIG. 6B, each perforation 52a passes through the bottom surface 214 and the top surface 216 of the substrate 50 to form a microchannel. In the example of the substrate 50, the perforations 52a are substantially linear and substantially perpendicular to the top surface 214 and the bottom surface 216 of the substrate 50. Although the perforations 52a are substantially linear, they may be configured to form any angle with the top surface 216 or the bottom surface 214 of the substrate 50. When the substrate 50 is used as an atomizer core, the aerosol source is flowed from the bottom surface 214 to the top surface 216 through the perforations 52a.

[0044] The second regions 54, 56 each have a plurality of blind perforations 54a, 56a. As shown in FIG. 6B, each of the blind holes 54a, 56a passes through the bottom surface 214 of the substrate 50. Each of the blind holes 54a, 56a extends to a depth toward the top surface 216 and terminates at an end before the perforations reach the top surface 216. The depth is less than the thickness of the substrate 50. In this way, when the substrate 50 is used as an atomizer core, the aerosol source does not flow from the bottom surface 214 to the top surface 216 in the regions 54, 56, but stops at the end of the perforations 54a, 56a or at a point between the bottom surface 214 and the end of the perforations 54a, 56a. Thus, when an atomizer core having the substrate 50 is used, the aerosol source may be accommodated in the blind holes 54a, 56a during a puff. The blind holes 54a, 56a may also accommodate condensed residual aerosol after a puff. In contrast, the aerosol source in the first region 52 simply passes through a microchannel defined by the perforations 52a in the substrate 50 to the top surface 216 of the atomizer core for generating aerosol.

[0045] In another example, some or all of the blind holes 54a and 56a may pass through the top surface 216 of the substrate 50. The blind holes 54a, 56a extend to a depth toward the bottom surface 214 and terminate at an end before the blind holes reach the bottom surface 214. The depth is less than the thickness of the substrate 50.

[0046] The length of the second regions 54, 56 defined by the blind holes 54a, 56a may be the same as, shorter than, or longer than the length of the first region 52.

[0047] In one example, each of the blind holes 54a, 56a may have a depth of 700 μm from the bottom surface 214 and a diameter of 30 μm. Each of the perforations 52a may have a depth of 1 mm from the bottom surface 214 to the top surface 216. The total number of blind holes 54a, 56a may exceed hundreds or thousands, such as 396. The total area of ​​the second region is 700 μm. 2 The total area of ​​the substrate 50 may be about 28,000 μm 2 and the total volume of the substrate is 195 million μm3 It may be more than that.

[0048] The perforation array may have other shapes for different functions.

[0049] 6A, first region 52 is substantially rectangular, and thus has top, bottom, left and right sides. Substrate 50 includes second region 54 adjacent to the top side of first region 52 and second region 56 adjacent to the bottom side of first region 52. Substrate 50 may also include one or more additional second regions to the left and / or right of first region 52.

[0050] The first region 52 may have any desired shape, such as a circle or other polygon. The substrate 50 may include one or more second regions adjacent one or more sides of the first region 52. For example, if the first region 52 has a circular shape, the second region may have a plurality of blind holes 54a, 56a that form one or more arcs adjacent the circumference of the first region 52 or that form one or more complete rings that surround the first region 52.

[0051] 7A and 7B show another example of a substrate 60. The substrate 60 may include a first region 62 and one or more second regions 64, 66. Each second region may be adjacent to one side of the first region 62.

[0052] As shown in the example of Figure 7A, the first region 52 has a plurality of perforations 62a. The perforations 62a are the same as the perforations 52a described in Figures 6A and 6B.

[0053] Each of the second regions 64, 66 has one or more blind lines 64a, 66a. In the example of FIG. 7A and FIG. 7B, each of the second regions 64 and 66 has two blind lines. As shown in FIG. 7B, each of the blind lines 64a, 66a may be a substantially straight blind line adjacent to one side of the first region 62. Each of the blind lines 64a, 66a may have other desired shapes, such as a wavy line. Each of the blind lines may be formed on the bottom surface 214 of the substrate 60 and extend into the substrate 60 to a desired depth. The depth is less than the thickness of the substrate 60. Each of the blind lines 64a, 66a extends into the substrate to an end before reaching the top surface 216 of the substrate 60. In the example of FIG. 7B, the opening of the blind line at the bottom surface 214 may be wider than the end. In some examples, the opening of the blind line at the bottom surface 214 may be the same as or narrower than the end.

[0054] In other examples, one or more blind lines may be formed on the top surface 216 of the substrate 60 and extend into the substrate 60 toward the bottom surface 214 to a desired depth, the depth being less than the thickness of the substrate 60.

[0055] The length of the one or more second regions 64, 66 formed by the blind lines 64a, 66a may be the same as, shorter than, or longer than the length of the first region 62.

[0056] Similar to the blind holes 54a, 56a in Figures 6A and 6B, when the substrate 60 is used as an atomizer core, the aerosol source in the blind lines 64a, 66a does not flow from the bottom surface 214 to the top surface 216 of the substrate 60. The aerosol source stops at the end of the blind line 64a or the blind line 66a, or at a point between the bottom surface 214 and the end of the blind line 64a or the blind line 66a. Therefore, when using an atomizer core made of the substrate 60, the aerosol source may be contained in the blind lines 64a, 66a during puffing. The blind lines 54a, 56a may also contain condensed aerosol source after puffing.

[0057] 7A, first region 62 is substantially rectangular, and thus has top, bottom, left and right sides. Substrate 60 includes second region 64 adjacent to the top side of first region 62 and second region 66 adjacent to the bottom side of first region 62. Substrate 60 may also include one or more additional second regions to the left and / or right of first region 62.

[0058] The first region 62 may have any desired shape, such as a circle or other polygon. The substrate 60 may include one or more second regions adjacent one or more sides of the first region 62. For example, if the first region 62 has a circular shape, the second region may have one or more arcs adjacent the circumference of the first region 62, or one or more complete circles surrounding the first region 62.

[0059] In one example, each of the blind lines 64a, 66a may have a depth of 700 μm from the bottom surface 214. The depth of the through hole 62a is about 1 mm. Each of the blind lines 64a, 66a may be a straight line with a length of more than 5000 μm, and the total number of the blind lines 64a, 66a may be two, one on the upper side and one on the lower side of the first region 62. The width of the opening at the bottom surface may be about 30 μm. The total area of ​​the blind lines may be 150,000 μm2 or more. The total area of ​​the substrate 60 may be about 630,000 μm2, and the total volume of the substrate may be 400 million μm3 or more.

[0060] As mentioned above, when the atomizer core is powered on, the heater is heated to vaporize the aerosol source. The heat transfer from the heated area to the edge of the substrate is reduced. Therefore, more energy is available to vaporize the aerosol source and generate more aerosol with the same amount of power.

[0061] Less heat is transferred to the ends of the substrate 50 in the second regions 54, 56 and to the ends of the substrate 60 in the second regions 64, 66, and the heat generated by the heater of the atomizer core is concentrated in the first regions 52, 62. Therefore, each of the first regions 52, 62 has a higher concentrated energy. Therefore, when the substrate 50 or the substrate 60 is used, the aerosol source is vaporized faster and more easily. Also, in the aerosol generating device comprising the substrate 50 or the substrate 60, less power is consumed to reach the desired temperature in the first region 52 or the first region 62, which allows for power saving.

[0062] The lower temperature at the top surface 216 of the second regions 54, 56 or 64, 66 improves the seal between the atomizer core that constitutes the substrate 50 or 60 and the material surrounding the atomizer core, e.g., plastic. For example, high temperatures in the first region of the substrate 50 or 60 are less likely to damage or degrade the physical properties or mechanical strength of the surrounding material.

[0063] The substrate 50, 60 may be the substrate of the above-mentioned atomizer cores 10, 20, 30, 40. The substrate 50, 60 may be the substrate of any atomizer core for generating an aerosol from an aerosol source.

[0064] 8A-8C show a substrate 70 according to another embodiment. The substrate 70 has a first substrate portion 70a, a second substrate portion 70b, and a layer 70c between the first substrate portion 70a and the second substrate portion 70b. The layer 70c forms an aerosol source film between the first substrate portion 70a and the second substrate portion 70b.

[0065] The first substrate portion 70a has a plurality of through-holes 74. The second substrate portion 70b has a plurality of through-holes 78. Each of the through-holes 74, 78 forms a microchannel. The microchannel formed by the through-holes 78 allows the aerosol source to flow from the bottom surface 214 of the second substrate portion 70b to the top surface 215 of the second substrate portion 70b. The aerosol source may then reach the layer 70c. The microchannel formed by the through-holes 74 allows the aerosol source to flow from the layer 70c to the bottom surface 217 of the first substrate portion 70a and then to the top surface 219 of the first substrate portion 70a to generate an aerosol at the top surface of the atomizer core when the atomizer core is being used for vaping.

[0066] 8A-8C, the through-perforations 78 are generally aligned with the through-perforations 74. In some examples, the through-perforations 78 may be offset from the through-perforations 74. In either case, the aerosol source from the through-perforations 78 may first flow into the layer 70c to form an aerosol source film in the layer 70c between the first substrate portion 70a and the second substrate portion 70b. The aerosol source may then flow from the layer 70c into the through-perforations 74 to generate an aerosol at the top surface of the atomizer core that constitutes the substrate 70.

[0067] For example, the atomizer core may be the atomizer cores 10 , 20 , 30 , 40 described above, or any atomizer core having a substrate 70 .

[0068] In one example, layer 70c may be a material such as cotton or linen that absorbs the aerosol source. In one example, layer 70c may be a free air space defined between first substrate portion 70a and second substrate portion 70b. For example, the air space may be formed by pads 70d on each of the left and right ends of second substrate portion 70b. Pads 70d may be formed of alumina foil or other suitable material.

[0069] Layer 70c substantially increases the temperature difference between top surface 219 of substrate 70 (top surface 219 of first substrate portion 70a) and bottom surface 214 of substrate 70 (bottom surface 214 of second substrate portion 70b). In one example, each of first substrate portion 70a and second substrate portion 70b is 0.5 mm sapphire, and layer 70c is a 0.1 mm aerosol source layer. The temperature difference between top surface 219 and bottom surface 214 of substrate 70 is about 72 K. In comparison, the temperature difference between top surface 219 and bottom surface 214 of substrate 70 using 1 mm sapphire is on the order of 8 K, and the temperature difference between top surface 219 and bottom surface 214 of substrate 70 using 0.5 mm sapphire is on the order of 4 K.

[0070] Therefore, the layer 70c, which substantially increases the temperature difference between the top surface 219 of the substrate 70 and the bottom surface 214 of the substrate 70, significantly reduces the heat transfer from the top surface 219 of the substrate 70 to the bottom surface 214 of the substrate 70. In other words, the heat loss of the substrate 70 is greatly reduced. Therefore, due to the reduced heat loss, the atomizer core with the substrate 70 has better vaporization performance, saves more battery power of the aerosol generating device using the atomizer core, and reduces the risk of leakage or clogging of the aerosol source in the microchannel. In addition, the reduced temperature can also improve the uniformity of the vapor, thus reducing the initial vaporization of the components with a lower boiling temperature. Therefore, the atomizer core with the substrate 70 has improved puffing performance.

[0071] In the embodiments of the atomizer core 10, 20, 30, 40, the vaping performance of the atomizer core may be further improved by modifying the surface properties of the second surface 216 of the atomizer core. For example, the surfaces of e-cigarettes, WO3 / ZrO2, WO3 / TiO2, SiO2 / Al2O3, TiO2 may act as catalysts to promote the reaction of vegetable glycerin (VG) to acrylaldehyde or allyl alcohol. To avoid such chemical reactions, the second surface 216 may be modified to raise the reaction energy barrier and make vaping a purely physical phenomenon, rather than a chemical phenomenon. For example, a carbon layer may be used as a vaping interface to raise the reaction energy barrier. The modified surface properties of the second surface 216 may improve the flow of liquid in the microchannels and the distribution or spreading of liquid on the second surface 216 of the atomizer core. As mentioned above, the second surface 216 of the core body 212 may be the top surface of a heater, or if the atomizer core includes a passive layer, the top surface of the passive layer, or one or more other functional layers on the passive layer. Surface modification can control the wetting performance between the aerosol source and the second surface 216, and between the aerosol source and the microchannel surface.

[0072] For example, the second surface 216 of the core body of the atomizer core can be formed of a thin film of gold or silver, which can be easily wetted by THC oil, which means that the THC oil can be distributed evenly on the second surface 216. If the contact angle is less than 90 degrees, the liquid wets the surface. Wetting is the ability of a liquid to maintain contact with a solid surface, which occurs due to intermolecular interactions when the two are brought into contact. The degree of wetting (wettability) is determined by the balance of adhesive and cohesive forces. Wetting deals with three phases: gas, liquid, and solid. The second surface 216 of the atomizer core can be a small silicone molecular top surface that can easily unwet the e-juice, and an ion-treated or plasma-treated top surface can also change the wetting performance of the atomizer core. The degree of wetting can be controlled by the time and power strength of treating the top surface. For example, a plasma-treated TiO2 surface can have a continuous wetting performance from completely not wetted to completely wetted by water, depending on the time and strength of the plasma.

[0073] In one example, the second surface 216 of the atomizer core 10, 20, 30, 40 can have an anti-catalytic layer by increasing the energy barrier of the pyrolysis reaction. For example, in FIG. 4, an anti-catalytic layer 36 is formed on the second surface 216. This provides a stable aerosol generation performance, similar to physical aerosol generation. The energy barrier can be increased to a certain level for pyrolysis or pyrolysis reaction control. The harmful and potentially harmful components (HPHCs) in the aerosol result from pyrolysis or pyrolysis reactions of organic components or other chemical reactions between components of the aerosol source. The activation energy of pyrolysis varies with different aerosol generation interfaces. The pyrolysis of organic components can be prevented by increasing the energy barrier for chemical reactions. For example, the energy barrier can be increased by using a gold surface. For example, when the second surface 216 of the atomizer core is a WO3 / ZrO2, WO3 / TiO2, SiO2 / Al2O3, TiO2 surface, vegetable glycerin (VG) can easily form acrylaldehyde or allyl alcohol during vaping. A carbon layer may be used for this purpose.

[0074] The atomizer core may have different aerosol generation performance with different orientations of the second surface 216. The atomizer core may be mounted in the aerosol device such that the second surface 216 faces upward toward the outlet of the aerosol device. The aerosol generated at the second surface 216 of the atomizer core moves up along the tube flow path in a first pass toward the outlet of the atomizer core and is discharged.

[0075] The atomizer core may be mounted in the aerosol device such that the second surface 216 faces downward, away from the outlet of the aerosol device. Aerosol generated at the second surface 216 of the atomizer core is passed up and out the side of the atomizer core by an additional second pass around the atomizer core from the second surface 216, as a heated surface, on the first pass upward along the tube flow path towards the outlet of the aerosol device.

[0076] Thus, the total aerosol path of the first pass, in which the second surface 216 faces away from the outlet of the aerosol device, is longer than that of the first pass, in which the second surface 216 faces toward the outlet of the aerosol device. The additional second pass results in additional aerosol heat loss. Thus, the temperature of the aerosol at the outlet of the aerosol generating device is higher than the temperature of the aerosol at the outlet of the aerosol generating device, in which the second surface 216 faces away from the outlet of the aerosol generating device, due to the short distance between the second surface 216 of the atomizer core and the outlet when the second surface 216 faces toward the outlet of the aerosol generating device. Users can select an aerosol generating device with the second surface 216 of the atomizer core facing toward or away from the outlet according to personal preference, and a higher aerosol temperature may result in a better taste and feel of the aerosol.

[0077] In addition to providing a microchannel for the aerosol source to flow in the aerosol generation process of the atomizer core, the substrate of the present application thermally insulates the aerosol source from the heater of the atomizer core. The atomizer core only heats the aerosol source that flows from the aerosol source container to the second surface 216 of the atomizer core, but does not heat the aerosol source in the container. Thus, the atomizer core keeps the taste of the aerosol consistent from the first puff to the last puff, and keeps the aerosol composition substantially the same during each puff.

[0078] In the aerosol generation process, the atomizer core may be composed of one or more layers, similar to the atomizer cores 10, 20, 30, 40. If the substrate is in fluid communication with the aerosol source, the aerosol source may saturate the microchannel before the second surface 216 of the atomizer core is heated. In one example, the passive layer covering the heater may have a set wetting amount so that the aerosol source on the second surface 216 of the passive layer can be controlled to have a desired spreading pattern. When power is supplied to the heater to heat the atomizer core, the heated atomizer core reduces the viscosity of the aerosol source in the microchannel and increases the flow-through rate of the aerosol source in the microchannel. The aerosol is generated from the second surface 216 of the atomizer core, such as the passive layer, and is carried to the user by the airflow. Due to the low thermal conductivity of the insulation, both the heated atomizer core and the aerosol source contained in the aerosol generating device are cooled down as soon as the power supply is turned off. This reduces the exit rate of the aerosol source within the microchannel, reducing the chance of the aerosol source leaking.

[0079] 9 shows an atomizer core 90 having a substantially rectangular shape. The atomizer core 90 may be attached to the aerosol device with the second surface 216 of the atomizer core 90 facing upward (in other words, facing towards the outlet or mouthpiece). The atomizer core 90 may be attached to the aerosol device with the second surface 216 of the atomizer core 90 facing downward (in other words, facing away from the outlet or mouthpiece).

[0080] 10A-10B are two exemplary embodiments of the atomizer core 100A (FIG. 10A) and the atomizer core 100B (FIG. 10B) in a substantially circular shape. The second surface 216 of the atomizer core may have a different pattern, as illustrated in the atomizer core 100A shown in FIGS. 10A and 10B.

[0081] 11A and 11B show two atomizer cores 110A (FIG. 11A) with two electrodes 112a, 112b and a HOB (FIG. 11B) with two electrodes 114a, 114b. The electrodes 114a, 114b of the atomizer core HOB in FIG. 11B have a larger area than the electrodes 112a, 112b of the atomizer core 110A in FIG. 11A.

[0082] Figure 12 shows an atomizer core 120 having a substantially rectangular body and two arcuate ends. Figure 13 shows an atomizer core 130 having a substantially rectangular shape.

[0083] The atomizer core described above may have other shapes or configurations for generating an aerosol.

[0084] The atomizing cores 10, 20, 30, 40 and substrates 50, 60, 70 described above may be manufactured by any of the methods described below.

[0085] Through Glass Via (TGV) Technology In some examples, the substrate may be a glass substrate, such as glass or single crystal silicon, or polycrystalline silicon. A method of manufacturing a substrate for an aerosol core includes providing a glass substrate, treating the glass substrate with a laser at selected locations to modify a structure of the glass substrate at the selected locations, and etching the glass substrate to form a plurality of perforations at the selected locations.

[0086] Dense glasses with high thermal shock properties, such as quartz, borosilicate glass, and aluminosilicate glass, can be drilled using high aspect ratio smooth through glass vias (TGVs) (Micromachines 2017, 8, 53; doi:10.3380 / mi8020053). TGVs may be used to generate desired perforation arrays in glass substrates with the methods described above.

[0087] The TGV includes a laser illumination process and a chemical etching process. The laser illumination process may use ultrashort laser pulses to modify the structure of the substrate. The pattern of the perforations in the glass substrate, such as the spacing between adjacent perforations, can be controlled by the laser illumination process. For example, the laser illumination process can be configured with a desired laser spot shape and size. The shape and size of the laser spot controls the size and shape of the perforations formed in the glass substrate. In the laser illumination process, an ultrashort pulsed laser may be used to treat one or more surfaces of the glass substrate at selected locations. For example, one or more selected points may be irradiated with ultrashort laser pulses at two surfaces, one side and the other side of the glass substrate. The ultrashort pulsed laser changes the internal structure of the glass substrate at the selected points. A chemical etching process may then be applied to the structurally modified glass substrate at the selected points, generating perforations that pass through both the one side and the other side surfaces of the glass substrate at the selected points to form microchannels.

[0088] The chemical etching process can be a wet or dry etching process. Both wet and dry etching can be used to prepare the holes in the glass substrate.

[0089] The quality of the perforations, such as the size and / or shape of the perforations, and the wall surface of the perforations can be controlled by the chemical etching process. For example, by precisely controlling the etching time, the dimensions of the perforations can be precisely controlled. The perforation size can be controlled from the sub-micron level to hundreds of microns.

[0090] The chemical etching process also allows the perforation shape to be precisely customized to a desired shape, such as a perfect circle, a horizontally elongated oval, a through-hole with a constant diameter, a through-hole tapered at both ends with a waist in the middle, or a vertical cone. The perforation shape may be selected based on the aerosol source, such as e-juice, THC / CBD, or other drugs, and the vape performance. The shape of the perforations in the glass substrate can be further tailored to other vape requirements, such as locking in the aerosol source.

[0091] In some examples, the glass substrate may have various thicknesses, such as less than 2 mm, 2 mm or more, etc. In some cases, the thickness of the glass substrate may be 1.2 mm, 1 mm, 0.8 mm, 0.6 mm, 0.5 mm, 0.2 mm, or less than 0.2 mm. In some cases, for better thermal management, the thickness of the glass substrate may be about 500 μm, or less, such as 50 μm.

[0092] Through chemical etching processes, the size of the holes in the glass substrate can be controlled from sub-micron levels down to 150μm for vape applications. In some cases, the hole diameter is controlled to 70um or less. In some instances, the diameter can be less than 50μm, 30μm, 20μm, 10μm, 5μm, or 1μm.

[0093] The TGV is also convenient for scaling up substrate preparation. The TGV can be applied to wafers to generate multiple substrates or samples simultaneously. Laser illumination processes can process glass substrates quickly, for example, from 200 holes per second to over 10,000 holes per second. In comparison, in the laser drilling process for producing glass substrates, a single laser can perform drilling at 20 holes per second. Also, chemical etching processes, such as wet chemical etching processes, can be performed in batches.

[0094] Since the TGV process is a cold treatment process that does not heat the glass substrate, the physical properties of the glass substrate are not changed. Also, the TGV does not damage the mechanical properties of the glass substrate. For example, the TGV does not cause microcracks in the glass substrate.

[0095] Glass tube TGV As shown in Figure 5, the substrate may have a tubular shape. In one example, similar to the ceramic atomizer core, the TGV technology can be applied to the tubular glass substrate to form micro-channels with desired perforation arrangements to perform different vapes. Unlike the ceramic atomizer core, the glass substrate does not generate ceramic grain particles or heavy metals during the ceramic manufacturing process. Also, the glass substrate has improved performance in coking, HPHC control, taste stability, etc.

[0096] As noted in Figure 5, the aerosol source and the aerosol are separated by a tubular substrate, such as a glass substrate. The aerosol source may be housed inside or outside the tubular substrate, and the aerosol may be generated on the opposite side of the substrate.

[0097] To form patterned through-holes in a tubular substrate with a TGV, the tubular substrate or the laser head continues to rotate to treat selected locations in the tubular substrate to form patterned holes. A wet or dry chemical etching process can then be applied to the treatment locations to generate through-holes or perforations at the treatment locations.

[0098] In some examples, before processing the glass substrate or after etching the glass substrate, a glass annealing process or tempering process may be applied to the glass substrate to improve the mechanical and thermal performance of the glass substrate, or to form a tubular glass substrate by softening rolls.

[0099] In some examples, after etching the glass substrate, the glass substrate with perforations can be further machined or processed into different shapes at the softening point of the glass in a glass annealing or tempering process. For example, the glass substrate in the annealing process can be curved as described above to form a tubular glass substrate. In this case, the pattern arrangement of the perforations is substantially maintained after the curling process, and the perforation shape may be slightly changed.

[0100] TSV (Through Silicon Via) for Silicon Substrates TSVs may be used to create perforations in a substrate (silicon substrate) of monocrystalline or polycrystalline silicon. TSVs are vertical connections (vias) that run completely through a silicon wafer or die. In some examples, the substrate of the atomizer core may be monocrystalline silicon or polycrystalline silicon. Both monocrystalline and polycrystalline silicon with microchannels formed by patterned perforations can also be used in general quantum vape devices or aerosol generators.

[0101] For example, a TSV process may include providing a silicon substrate, patterning the silicon substrate with photoresist at selected locations on a surface of the silicon substrate, and etching the silicon substrate to form a plurality of holes through both the top and bottom surfaces of the silicon substrate.

[0102] The etching process may be a wet chemical etching process or a dry chemical etching process to form the multiple perforations. In the wet chemical etching process, different crystal planes have different etching rates. The wet chemical etching process is easy to set up and has high selectivity.

[0103] In a TSV process, in one example, the perforations forming the microchannels in the silicon substrate may have a diameter of submicron to 200 μm, for example, the perforations forming the microchannels in the silicon substrate may have a diameter of less than 100 nm.

[0104] In the example of the atomizer core 20 of Fig. 3, the substrate mix 22 may be a silicon substrate. The TSV process may be used to create microchannels in the substrate mix 22 by forming a plurality of perforations at selected locations in the substrate 22. The passive layer 24 and the electrodes 26a, 26b may then be formed. In this example, the TSV process has the advantages of the TGV as described in the TGV process.

[0105] In the example of the atomizer core 30 of FIG. 4, the silicon substrate 32 may also be formed by a TSV process. The TSV process may generate microchannels in the silicon substrate 32 by forming a plurality of perforations at selected locations in the silicon substrate 32. Then, as described in FIG. 4, either diffusion or ion implantation may be used to treat the surface of the silicon substrate 32 to obtain a low resistivity surface layer 34 as a heater for heating the aerosol source. In some examples, the passive layer and / or electrode may not be necessary since the surface layer 34 can serve both functions. In the TSV method, the atomizer core 30 has a simpler structure with fewer layers compared to conventional atomizer cores.

[0106] In one example, anodizing may be used to fabricate alumina, titanium, zirconia, or tantalum oxide substrates, which allows for large scale manufacturing of substrates for atomizer cores.

[0107] For example, the anodization can be Porous Anodic Alumina (PAA), which is a two-step anodization to prepare a perforation-arranged alumina substrate. PAA is a self-organized form of aluminum oxide with a honeycomb-like structure formed by a dense array of uniform and parallel perforations. Phosphoric acid or other acid treatment in the anodization can conveniently adjust the perforation size of the PAA substrate for vape performance.

[0108] For example, the perforations may be formed by wet chemical etching in 0.3 M oxalic acid at 40 V. The diameter of the perforations may be controlled by the time of the etch.

[0109] In some examples, a pre-texturing technique or an imprinting technique may be used in preparing the substrate. For example, a SiC mold with a convex nipple may be used to prepare the substrate. Anodization may be used to form a regular array of perforations in the alumina substrate of the atomizer core. The size of the perforations in the substrate may range from the μm level to the submicron level. The small size of the perforations generally improves the oil locking performance and reduces the oil leakage problem of the vape device.

[0110] Anodization can be employed to prepare regulated titanium, zirconium, or tantalum substrates, porous anodized TiO2 tubes (PATTs), zirconia substrates, tantalum oxide substrates, and other biocompatible substrates for the atomizer core.

[0111] The use of porous anodic oxide (PAO) allows the pore size to be controlled to the submicron level, and the distance between the pore walls is uniform. As a result, both the in-situ vapor and oil lock performance of the substrate are improved. For example, the substrate can be aluminum, and the pore size can be 100 nm or less.

[0112] Electrochemical Corrosion Drilling Technology (ECPT) In one example, the substrate of the atomizer core may be fabricated by electronically drilling holes in the substrate using a microelectrode array. The substrate may be a silicon wafer, glass, dense ceramic, etc.

[0113] ECPT allows convenient control of the pore size and the rate at which the pores are created, for example the etch rate can be controlled by the current.

[0114] For example, a silicon wafer or glass may be placed in a 20% sodium bicarbonate solution in an electrolytic cell. The substrate may be placed at the negative electrode of the electrolytic cell. A perforation probe array, such as a tungsten perforation probe array, is used as the anode of the electrolytic cell. The anode may be an electrode pin array. The perforation probe is connected in series with a current-limiting resistor. A pulsating DC voltage, for example in the range of 40-100V, is applied between the perforation probe array and the negative electrode to generate perforations at selected points on the substrate.

[0115] The electrochemical process can quickly and effectively etch away the substrate and then form the array of perforations without damaging the substrate.

[0116] This microelectrode has the advantages of the TGV and TSV mentioned above, and by using microelectrodes, the hole size and drilling speed can be very well controlled by copying them to the microelectrode array.

[0117] Compared with the existing substrate manufacturing process, the drilling process of the substrate of the atomizer core using the TGV, TSV, anodization, or CEPT process has better drilling quality control and can avoid damage to the substrate in the drilling process. The mechanical and thermal performance of the substrate can be substantially the same as the bulk material of the substrate before the drilling process. And the perforation size can be customized according to the vapor performance requirements, for example, from 200 μm diameter to sub-micron level. By selecting the appropriate perforation size, the balance between springing out and leakage of the aerosol source can be conveniently adjusted. The TGV, TSV, anodization, and CEPT processes enable high-volume, high-yield manufacturing at low cost by manufacturing on a large scale.

[0118] Certain adaptations and modifications can be made to the described embodiments and, accordingly, the above described embodiments are considered to be illustrative and not restrictive.

Claims

1. A method for manufacturing a substrate of an atomizer core, comprising the steps of: providing a substrate; treating the substrate at selected locations with a laser to modify a structure of the substrate at the selected locations; and etching the substrate to form a plurality of perforations at the selected locations; The method, wherein the plurality of perforations allows an aerosol source to flow from a first surface of the substrate to a second surface of the substrate.

2. The method of claim 1 , wherein etching the substrate comprises wet etching or dry etching.

3. The method of claim 1 , wherein processing the substrate further comprises processing the substrate to form a selected size and shape.

4. The method of claim 1 , wherein the substrate has a thickness of 5 mm or less.

5. The method of claim 1 , wherein the substrate has a thickness of 0.5 mm or less.

6. The method of claim 1 , further comprising the step of tempering or annealing the substrate before the step of treating the substrate or after the step of etching the substrate.

7. 10. The method of claim 1, further comprising, after the step of etching the substrate, forming the substrate into a desired shape in an annealing process at a softening point of the substrate.

8. The method of claim 1 , wherein the substrate comprises glass, single crystal silicon, or polycrystalline silicon.

9. A method for manufacturing an atomizer core, comprising the steps of: a) manufacturing a substrate by a method according to any one of claims 1 to 7; b) depositing a heating layer on the second surface of the substrate.

10. The method of claim 9, wherein the heating layer comprises a biocompatible metal, or an alloy based on a biocompatible metal, or an alloy based on Ni--Cr.

11. The method of claim 10, wherein the biocompatible metal includes Al, Ti, Ta, Zr, Pt, Au, Ag, Pd, Re, Yb, Y, Ce, La, Hf, Si, alloys based thereon, Ni-Cr alloys, or medical grade stainless steel.

12. The method of claim 9, wherein the heating layer comprises Zr or an alloy based on a biocompatible metal containing Zr.

13. The method of claim 12, wherein the biocompatible metal-based alloy further comprises Ti.

14. The method of claim 9, further comprising depositing a passive layer on the heater to prevent oxidation.

15. The method of claim 14, wherein the passive layer comprises Au, an Au--Ag alloy, Pt, or a Pd--Ag alloy.

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